JP7806785B2 - 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス - Google Patents

樹脂組成物、シート硬化物、複合成形体及び半導体デバイス

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Publication number
JP7806785B2
JP7806785B2 JP2023511363A JP2023511363A JP7806785B2 JP 7806785 B2 JP7806785 B2 JP 7806785B2 JP 2023511363 A JP2023511363 A JP 2023511363A JP 2023511363 A JP2023511363 A JP 2023511363A JP 7806785 B2 JP7806785 B2 JP 7806785B2
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Prior art keywords
resin composition
resin
sheet
inorganic filler
epoxy
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JP2023511363A
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Japanese (ja)
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JPWO2022210686A1 (https=
Inventor
敏行 澤村
俊行 田中
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2023511363A 2021-03-29 2022-03-29 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス Active JP7806785B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021055114 2021-03-29
JP2021055114 2021-03-29
PCT/JP2022/015374 WO2022210686A1 (ja) 2021-03-29 2022-03-29 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス

Publications (2)

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JPWO2022210686A1 JPWO2022210686A1 (https=) 2022-10-06
JP7806785B2 true JP7806785B2 (ja) 2026-01-27

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JP2023511363A Active JP7806785B2 (ja) 2021-03-29 2022-03-29 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス

Country Status (5)

Country Link
US (1) US20240010814A1 (https=)
EP (1) EP4318574A4 (https=)
JP (1) JP7806785B2 (https=)
CN (1) CN116997607A (https=)
WO (1) WO2022210686A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025197972A1 (ja) * 2024-03-22 2025-09-25 三菱ケミカル株式会社 熱硬化性組成物、熱硬化性シートの製造方法、熱伝導性シート、放熱積層体、放熱性回路基板及びパワー半導体装置
WO2025225313A1 (ja) * 2024-04-26 2025-10-30 三菱電機株式会社 金属管及び金属管の接合方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119198A1 (ja) 2014-02-05 2015-08-13 三菱化学株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
JP2018188628A (ja) 2017-04-28 2018-11-29 積水化学工業株式会社 熱硬化性材料
WO2019189746A1 (ja) 2018-03-30 2019-10-03 三菱ケミカル株式会社 放熱シート、放熱部材及び半導体デバイス
WO2020075663A1 (ja) 2018-10-11 2020-04-16 三菱ケミカル株式会社 樹脂組成物、樹脂硬化物および複合成形体
WO2020175377A1 (ja) 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8652641B2 (en) * 2006-09-26 2014-02-18 Polytronics Technology Corp. Heat conductive dielectric polymer material and heat dissipation substrate containing the same
JP6088731B2 (ja) 2011-10-14 2017-03-01 日東シンコー株式会社 放熱用部材、及び半導体モジュールの製造方法
MY170639A (en) 2011-11-29 2019-08-21 Mitsubishi Chem Corp Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
JP6274014B2 (ja) * 2013-05-27 2018-02-07 三菱ケミカル株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
CN107108479B (zh) 2014-12-23 2020-07-24 加利福尼亚大学董事会 介晶配体-官能化的纳米粒的三维结构以及制备和使用它的方法
JP2016155946A (ja) * 2015-02-25 2016-09-01 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート、回路基板及びパワーモジュール
JP6786778B2 (ja) 2015-08-12 2020-11-18 三菱ケミカル株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP7188070B2 (ja) * 2018-01-05 2022-12-13 三菱ケミカル株式会社 放熱絶縁シートおよび該シート硬化物を絶縁層とする積層構造体
JP7383971B2 (ja) * 2018-10-11 2023-11-21 三菱ケミカル株式会社 樹脂組成物、樹脂硬化物および複合成形体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119198A1 (ja) 2014-02-05 2015-08-13 三菱化学株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
JP2018188628A (ja) 2017-04-28 2018-11-29 積水化学工業株式会社 熱硬化性材料
WO2019189746A1 (ja) 2018-03-30 2019-10-03 三菱ケミカル株式会社 放熱シート、放熱部材及び半導体デバイス
WO2020075663A1 (ja) 2018-10-11 2020-04-16 三菱ケミカル株式会社 樹脂組成物、樹脂硬化物および複合成形体
WO2020175377A1 (ja) 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス

Also Published As

Publication number Publication date
EP4318574A4 (en) 2024-09-04
US20240010814A1 (en) 2024-01-11
WO2022210686A1 (ja) 2022-10-06
EP4318574A1 (en) 2024-02-07
JPWO2022210686A1 (https=) 2022-10-06
CN116997607A (zh) 2023-11-03
TW202302740A (zh) 2023-01-16

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