JP7799074B2 - 熱電変換モジュール - Google Patents

熱電変換モジュール

Info

Publication number
JP7799074B2
JP7799074B2 JP2024545565A JP2024545565A JP7799074B2 JP 7799074 B2 JP7799074 B2 JP 7799074B2 JP 2024545565 A JP2024545565 A JP 2024545565A JP 2024545565 A JP2024545565 A JP 2024545565A JP 7799074 B2 JP7799074 B2 JP 7799074B2
Authority
JP
Japan
Prior art keywords
thermoelectric conversion
capacitor
thickness direction
heat
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024545565A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024053430A1 (https=
JPWO2024053430A5 (https=
Inventor
健志 浅見
亮太 丹羽
諒太 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2024053430A1 publication Critical patent/JPWO2024053430A1/ja
Publication of JPWO2024053430A5 publication Critical patent/JPWO2024053430A5/ja
Application granted granted Critical
Publication of JP7799074B2 publication Critical patent/JP7799074B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2024545565A 2022-09-09 2023-08-25 熱電変換モジュール Active JP7799074B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022143637 2022-09-09
JP2022143637 2022-09-09
PCT/JP2023/030750 WO2024053430A1 (ja) 2022-09-09 2023-08-25 熱電変換モジュール

Publications (3)

Publication Number Publication Date
JPWO2024053430A1 JPWO2024053430A1 (https=) 2024-03-14
JPWO2024053430A5 JPWO2024053430A5 (https=) 2025-04-25
JP7799074B2 true JP7799074B2 (ja) 2026-01-14

Family

ID=90191161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024545565A Active JP7799074B2 (ja) 2022-09-09 2023-08-25 熱電変換モジュール

Country Status (4)

Country Link
EP (1) EP4577027A1 (https=)
JP (1) JP7799074B2 (https=)
TW (1) TW202502187A (https=)
WO (1) WO2024053430A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120432453B (zh) * 2025-07-07 2025-09-05 上海新微技术研发中心有限公司 一种集成电路芯片的无源散热器件的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019327A (ja) 2005-07-08 2007-01-25 Kansai Electric Power Co Inc:The 高耐熱フィルムコンデンサ
JP2008078193A (ja) 2006-09-19 2008-04-03 Nippon Steel Corp 電力変換素子
JP2010016308A (ja) 2008-07-07 2010-01-21 Sumitomo Heavy Ind Ltd 蓄電装置及びその作製方法
JP2012196081A (ja) 2011-03-17 2012-10-11 Fujifilm Corp 熱電発電装置及び携帯型電子機器
WO2021025059A1 (ja) 2019-08-08 2021-02-11 デンカ株式会社 熱電変換素子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4895293B2 (ja) 2007-01-26 2012-03-14 新日鐵化学株式会社 フレキシブル熱電変換素子及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019327A (ja) 2005-07-08 2007-01-25 Kansai Electric Power Co Inc:The 高耐熱フィルムコンデンサ
JP2008078193A (ja) 2006-09-19 2008-04-03 Nippon Steel Corp 電力変換素子
JP2010016308A (ja) 2008-07-07 2010-01-21 Sumitomo Heavy Ind Ltd 蓄電装置及びその作製方法
JP2012196081A (ja) 2011-03-17 2012-10-11 Fujifilm Corp 熱電発電装置及び携帯型電子機器
WO2021025059A1 (ja) 2019-08-08 2021-02-11 デンカ株式会社 熱電変換素子

Also Published As

Publication number Publication date
JPWO2024053430A1 (https=) 2024-03-14
WO2024053430A1 (ja) 2024-03-14
TW202502187A (zh) 2025-01-01
EP4577027A1 (en) 2025-06-25

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