JP7751916B2 - 積層構造体、電子デバイス、電子機器及びシステム - Google Patents

積層構造体、電子デバイス、電子機器及びシステム

Info

Publication number
JP7751916B2
JP7751916B2 JP2024544593A JP2024544593A JP7751916B2 JP 7751916 B2 JP7751916 B2 JP 7751916B2 JP 2024544593 A JP2024544593 A JP 2024544593A JP 2024544593 A JP2024544593 A JP 2024544593A JP 7751916 B2 JP7751916 B2 JP 7751916B2
Authority
JP
Japan
Prior art keywords
film
crystal
substrate
compound
crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024544593A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024048765A5 (https=
JPWO2024048765A1 (https=
Inventor
健 木島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaianixx Inc
Original Assignee
Gaianixx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gaianixx Inc filed Critical Gaianixx Inc
Publication of JPWO2024048765A1 publication Critical patent/JPWO2024048765A1/ja
Publication of JPWO2024048765A5 publication Critical patent/JPWO2024048765A5/ja
Application granted granted Critical
Publication of JP7751916B2 publication Critical patent/JP7751916B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2024544593A 2022-08-31 2023-08-31 積層構造体、電子デバイス、電子機器及びシステム Active JP7751916B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2022138854 2022-08-31
JP2022138854 2022-08-31
JP2022138853 2022-08-31
JP2022138855 2022-08-31
JP2022138853 2022-08-31
JP2022138855 2022-08-31
PCT/JP2023/032024 WO2024048765A1 (ja) 2022-08-31 2023-08-31 結晶、積層構造体、素子、電子デバイス、電子機器及びシステム

Publications (3)

Publication Number Publication Date
JPWO2024048765A1 JPWO2024048765A1 (https=) 2024-03-07
JPWO2024048765A5 JPWO2024048765A5 (https=) 2025-04-17
JP7751916B2 true JP7751916B2 (ja) 2025-10-09

Family

ID=90098005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024544593A Active JP7751916B2 (ja) 2022-08-31 2023-08-31 積層構造体、電子デバイス、電子機器及びシステム

Country Status (2)

Country Link
JP (1) JP7751916B2 (https=)
WO (1) WO2024048765A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006960A (ja) 2003-07-24 2004-01-08 Matsushita Electric Ind Co Ltd 誘電体膜の形成方法
JP2018070437A (ja) 2016-11-04 2018-05-10 株式会社Flosfia 結晶性ＺｒＯ２膜の製造方法および結晶性ＺｒＯ２膜
JP2019216181A (ja) 2018-06-13 2019-12-19 アドバンストマテリアルテクノロジーズ株式会社 膜構造体及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006960A (ja) 2003-07-24 2004-01-08 Matsushita Electric Ind Co Ltd 誘電体膜の形成方法
JP2018070437A (ja) 2016-11-04 2018-05-10 株式会社Flosfia 結晶性ＺｒＯ２膜の製造方法および結晶性ＺｒＯ２膜
JP2019216181A (ja) 2018-06-13 2019-12-19 アドバンストマテリアルテクノロジーズ株式会社 膜構造体及びその製造方法

Also Published As

Publication number Publication date
WO2024048765A1 (ja) 2024-03-07
JPWO2024048765A1 (https=) 2024-03-07

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