JP7719339B2 - ガラス基板の製造方法及びガラス基板 - Google Patents

ガラス基板の製造方法及びガラス基板

Info

Publication number
JP7719339B2
JP7719339B2 JP2023512984A JP2023512984A JP7719339B2 JP 7719339 B2 JP7719339 B2 JP 7719339B2 JP 2023512984 A JP2023512984 A JP 2023512984A JP 2023512984 A JP2023512984 A JP 2023512984A JP 7719339 B2 JP7719339 B2 JP 7719339B2
Authority
JP
Japan
Prior art keywords
glass
glass substrate
thickness
polishing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023512984A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022215628A1 (https=
Inventor
悠波 小林
雄一 吉田
圭輔 花島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of JPWO2022215628A1 publication Critical patent/JPWO2022215628A1/ja
Priority to JP2025115296A priority Critical patent/JP2025133906A/ja
Application granted granted Critical
Publication of JP7719339B2 publication Critical patent/JP7719339B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2023512984A 2021-04-06 2022-03-30 ガラス基板の製造方法及びガラス基板 Active JP7719339B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025115296A JP2025133906A (ja) 2021-04-06 2025-07-08 ガラス基板の製造方法及びガラス基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021064972 2021-04-06
JP2021064972 2021-04-06
PCT/JP2022/016053 WO2022215628A1 (ja) 2021-04-06 2022-03-30 ガラス基板の製造方法及びガラス基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025115296A Division JP2025133906A (ja) 2021-04-06 2025-07-08 ガラス基板の製造方法及びガラス基板

Publications (2)

Publication Number Publication Date
JPWO2022215628A1 JPWO2022215628A1 (https=) 2022-10-13
JP7719339B2 true JP7719339B2 (ja) 2025-08-06

Family

ID=83546074

Family Applications (2)

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JP2023512984A Active JP7719339B2 (ja) 2021-04-06 2022-03-30 ガラス基板の製造方法及びガラス基板
JP2025115296A Pending JP2025133906A (ja) 2021-04-06 2025-07-08 ガラス基板の製造方法及びガラス基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025115296A Pending JP2025133906A (ja) 2021-04-06 2025-07-08 ガラス基板の製造方法及びガラス基板

Country Status (7)

Country Link
US (1) US12068181B2 (https=)
JP (2) JP7719339B2 (https=)
KR (1) KR20230167042A (https=)
CN (1) CN117099197A (https=)
DE (1) DE112022001325T5 (https=)
TW (1) TW202239725A (https=)
WO (1) WO2022215628A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026083979A1 (ja) * 2024-10-16 2026-04-23 Ａｇｃ株式会社 ガラス基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016124757A (ja) 2015-01-05 2016-07-11 日本電気硝子株式会社 ガラス板及びその製造方法
WO2016190303A1 (ja) 2015-05-28 2016-12-01 旭硝子株式会社 ガラス基板、および積層基板
WO2018207794A1 (ja) 2017-05-12 2018-11-15 Ａｇｃ株式会社 ガラス基板、およびガラス基板の製造方法
WO2021019654A1 (ja) 2019-07-29 2021-02-04 Ａｇｃ株式会社 支持ガラス基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6443668U (https=) 1987-09-10 1989-03-15
JP6443668B2 (ja) 2014-12-17 2018-12-26 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層体
JPWO2018150759A1 (ja) 2017-02-15 2019-12-12 Ａｇｃ株式会社 マークを有するガラス基板およびその製造方法
JP2020007184A (ja) * 2018-07-06 2020-01-16 Ａｇｃ株式会社 半導体用支持基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016124757A (ja) 2015-01-05 2016-07-11 日本電気硝子株式会社 ガラス板及びその製造方法
WO2016190303A1 (ja) 2015-05-28 2016-12-01 旭硝子株式会社 ガラス基板、および積層基板
WO2018207794A1 (ja) 2017-05-12 2018-11-15 Ａｇｃ株式会社 ガラス基板、およびガラス基板の製造方法
WO2021019654A1 (ja) 2019-07-29 2021-02-04 Ａｇｃ株式会社 支持ガラス基板

Also Published As

Publication number Publication date
KR20230167042A (ko) 2023-12-07
JP2025133906A (ja) 2025-09-11
CN117099197A (zh) 2023-11-21
TW202239725A (zh) 2022-10-16
US20240030051A1 (en) 2024-01-25
DE112022001325T5 (de) 2024-04-11
WO2022215628A1 (ja) 2022-10-13
US12068181B2 (en) 2024-08-20
JPWO2022215628A1 (https=) 2022-10-13

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