JP7598033B2 - ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置 - Google Patents

ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置 Download PDF

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JP7598033B2
JP7598033B2 JP2022104042A JP2022104042A JP7598033B2 JP 7598033 B2 JP7598033 B2 JP 7598033B2 JP 2022104042 A JP2022104042 A JP 2022104042A JP 2022104042 A JP2022104042 A JP 2022104042A JP 7598033 B2 JP7598033 B2 JP 7598033B2
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carbon atoms
compound
partial structure
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JP2024004392A (ja
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和賢 青山
慎太郎 橋本
竜也 岡本
智弘 下野
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DIC Corp
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DIC Corp
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Priority to JP2022104042A priority Critical patent/JP7598033B2/ja
Priority to KR1020230062159A priority patent/KR20240002167A/ko
Priority to TW112123115A priority patent/TWI858781B/zh
Priority to CN202310775262.4A priority patent/CN117304488A/zh
Publication of JP2024004392A publication Critical patent/JP2024004392A/ja
Priority to JP2024133217A priority patent/JP2024161436A/ja
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Publication of JP7598033B2 publication Critical patent/JP7598033B2/ja
Priority to KR1020250036486A priority patent/KR20250044232A/ko
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JP2022104042A 2022-06-28 2022-06-28 ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置 Active JP7598033B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022104042A JP7598033B2 (ja) 2022-06-28 2022-06-28 ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置
KR1020230062159A KR20240002167A (ko) 2022-06-28 2023-05-15 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치
TW112123115A TWI858781B (zh) 2022-06-28 2023-06-20 聚馬來醯亞胺樹脂、硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置
CN202310775262.4A CN117304488A (zh) 2022-06-28 2023-06-28 聚马来酰亚胺树脂、固化性组合物、固化物、预浸料、电路板、和积层薄膜
JP2024133217A JP2024161436A (ja) 2022-06-28 2024-08-08 ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置
KR1020250036486A KR20250044232A (ko) 2022-06-28 2025-03-21 폴리말레이미드 수지, 경화성 조성물, 경화물, 프리프레그, 회로 기판, 빌드업 필름, 반도체 봉지재 및 반도체 장치

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JP7598033B2 true JP7598033B2 (ja) 2024-12-11

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JP2024133217A Pending JP2024161436A (ja) 2022-06-28 2024-08-08 ポリマレイミド樹脂、硬化性組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材及び半導体装置

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WO2020004211A1 (ja) 2018-06-27 2020-01-02 三菱瓦斯化学株式会社 樹脂組成物およびその応用
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