JP7585969B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7585969B2
JP7585969B2 JP2021088991A JP2021088991A JP7585969B2 JP 7585969 B2 JP7585969 B2 JP 7585969B2 JP 2021088991 A JP2021088991 A JP 2021088991A JP 2021088991 A JP2021088991 A JP 2021088991A JP 7585969 B2 JP7585969 B2 JP 7585969B2
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Japan
Prior art keywords
wiring
substrate
metal body
semiconductor element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021088991A
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English (en)
Japanese (ja)
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JP2022181820A5 (enExample
JP2022181820A (ja
Inventor
素美 室▲崎▼
祥史 宗像
匡宏 本田
崇功 川島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021088991A priority Critical patent/JP7585969B2/ja
Priority to PCT/JP2022/018371 priority patent/WO2022249811A1/ja
Publication of JP2022181820A publication Critical patent/JP2022181820A/ja
Publication of JP2022181820A5 publication Critical patent/JP2022181820A5/ja
Priority to JP2024193985A priority patent/JP7736147B2/ja
Application granted granted Critical
Publication of JP7585969B2 publication Critical patent/JP7585969B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
JP2021088991A 2021-05-27 2021-05-27 半導体装置 Active JP7585969B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021088991A JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018371 WO2022249811A1 (ja) 2021-05-27 2022-04-21 半導体装置
JP2024193985A JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088991A JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024193985A Division JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181820A JP2022181820A (ja) 2022-12-08
JP2022181820A5 JP2022181820A5 (enExample) 2023-03-09
JP7585969B2 true JP7585969B2 (ja) 2024-11-19

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ID=84228689

Family Applications (2)

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JP2021088991A Active JP7585969B2 (ja) 2021-05-27 2021-05-27 半導体装置
JP2024193985A Active JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024193985A Active JP7736147B2 (ja) 2021-05-27 2024-11-05 半導体装置

Country Status (2)

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JP (2) JP7585969B2 (enExample)
WO (1) WO2022249811A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146760A (ja) 2011-01-11 2012-08-02 Calsonic Kansei Corp パワー半導体モジュール
JP2013219290A (ja) 2012-04-12 2013-10-24 Panasonic Corp 半導体装置
JP2016162777A (ja) 2015-02-26 2016-09-05 株式会社デンソー 半導体装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6908012B2 (ja) 2018-10-01 2021-07-21 株式会社デンソー 半導体モジュール
JP7248133B2 (ja) 2019-09-13 2023-03-29 株式会社デンソー 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146760A (ja) 2011-01-11 2012-08-02 Calsonic Kansei Corp パワー半導体モジュール
JP2013219290A (ja) 2012-04-12 2013-10-24 Panasonic Corp 半導体装置
JP2016162777A (ja) 2015-02-26 2016-09-05 株式会社デンソー 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP7736147B2 (ja) 2025-09-09
JP2025013508A (ja) 2025-01-24
WO2022249811A1 (ja) 2022-12-01
JP2022181820A (ja) 2022-12-08

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