JP7572664B2 - 特異材料検出装置、制御方法、及びプログラム - Google Patents

特異材料検出装置、制御方法、及びプログラム Download PDF

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JP7572664B2
JP7572664B2 JP2023506875A JP2023506875A JP7572664B2 JP 7572664 B2 JP7572664 B2 JP 7572664B2 JP 2023506875 A JP2023506875 A JP 2023506875A JP 2023506875 A JP2023506875 A JP 2023506875A JP 7572664 B2 JP7572664 B2 JP 7572664B2
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JPWO2022196208A5 (ja
JPWO2022196208A1 (https=
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直樹 鍬守
昭裕 撫佐
陽平 瀧川
悠加 風間
佳彦 佐藤
広明 小林
豪太 菊川
朋永 岡部
一彦 小松
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Tohoku University NUC
NEC Corp
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NEC Corp
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    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
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    • G16C20/00—Chemoinformatics, i.e. ICT specially adapted for the handling of physicochemical or structural data of chemical particles, elements, compounds or mixtures
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    • G—PHYSICS
    • G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16C—COMPUTATIONAL CHEMISTRY; CHEMOINFORMATICS; COMPUTATIONAL MATERIALS SCIENCE
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JP2023506875A 2021-03-18 2022-02-14 特異材料検出装置、制御方法、及びプログラム Active JP7572664B2 (ja)

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JP2021044487 2021-03-18
JP2021044487 2021-03-18
PCT/JP2022/005625 WO2022196208A1 (ja) 2021-03-18 2022-02-14 特異材料検出装置、制御方法、及び非一時的なコンピュータ可読媒体

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JPWO2022196208A1 JPWO2022196208A1 (https=) 2022-09-22
JPWO2022196208A5 JPWO2022196208A5 (ja) 2023-12-07
JP7572664B2 true JP7572664B2 (ja) 2024-10-24

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US (1) US20240152664A1 (https=)
EP (1) EP4310718A4 (https=)
JP (1) JP7572664B2 (https=)
CN (1) CN117043781A (https=)
WO (1) WO2022196208A1 (https=)

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WO2024135553A1 (ja) * 2022-12-23 2024-06-27 株式会社レゾナック 設計評価装置、設計評価方法及びプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007087098A (ja) 2005-09-22 2007-04-05 Nissan Motor Co Ltd 最適化システム、最適化方法、最適化プログラム、及びプログラム媒体
JP2008293315A (ja) 2007-05-25 2008-12-04 Yokohama Rubber Co Ltd:The データ解析プログラム、データ解析装置、構造体の設計プログラム、および構造体の設計装置
JP2016099737A (ja) 2014-11-19 2016-05-30 横浜ゴム株式会社 データの分析方法およびデータの表示方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6589285B2 (ja) 2015-02-12 2019-10-16 横浜ゴム株式会社 データの分析方法およびデータの表示方法
JP2021044487A (ja) 2019-09-13 2021-03-18 シーアンドディー セミコンダクター サービシーズ，インコーポレイテッド スピンコーティング装置におけるクリーニングのための、基板材料の底部表面および／またはその縁部の最適露出

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007087098A (ja) 2005-09-22 2007-04-05 Nissan Motor Co Ltd 最適化システム、最適化方法、最適化プログラム、及びプログラム媒体
JP2008293315A (ja) 2007-05-25 2008-12-04 Yokohama Rubber Co Ltd:The データ解析プログラム、データ解析装置、構造体の設計プログラム、および構造体の設計装置
JP2016099737A (ja) 2014-11-19 2016-05-30 横浜ゴム株式会社 データの分析方法およびデータの表示方法

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CN117043781A (zh) 2023-11-10
EP4310718A4 (en) 2025-03-19
EP4310718A1 (en) 2024-01-24
JPWO2022196208A1 (https=) 2022-09-22
WO2022196208A1 (ja) 2022-09-22

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