JP7564261B2 - パワーデバイスアセンブリとその製造方法 - Google Patents

パワーデバイスアセンブリとその製造方法 Download PDF

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JP7564261B2
JP7564261B2 JP2023012781A JP2023012781A JP7564261B2 JP 7564261 B2 JP7564261 B2 JP 7564261B2 JP 2023012781 A JP2023012781 A JP 2023012781A JP 2023012781 A JP2023012781 A JP 2023012781A JP 7564261 B2 JP7564261 B2 JP 7564261B2
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Prior art keywords
power device
power
assembly
substrate
cavity
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Japanese (ja)
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JP2023112686A (ja
JP2023112686A5 (https=
Inventor
チョウ フォン
ヤンホー リョウ
紘嗣 請川
Original Assignee
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2023012781A 2022-02-01 2023-01-31 パワーデバイスアセンブリとその製造方法 Active JP7564261B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/590,232 2022-02-01
US17/590,232 US11997838B2 (en) 2022-02-01 2022-02-01 Power device assemblies and methods of fabricating the same

Publications (3)

Publication Number Publication Date
JP2023112686A JP2023112686A (ja) 2023-08-14
JP2023112686A5 JP2023112686A5 (https=) 2024-05-29
JP7564261B2 true JP7564261B2 (ja) 2024-10-08

Family

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JP2023012781A Active JP7564261B2 (ja) 2022-02-01 2023-01-31 パワーデバイスアセンブリとその製造方法

Country Status (3)

Country Link
US (1) US11997838B2 (https=)
JP (1) JP7564261B2 (https=)
CN (1) CN116544198B (https=)

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JP2022073780A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073781A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073784A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073783A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073782A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022094240A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094238A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094239A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094241A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094242A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP7367715B2 (ja) * 2021-03-02 2023-10-24 株式会社三洋物産 遊技機
US20230328933A1 (en) * 2022-04-11 2023-10-12 Honeywell International Inc. Integrated heat spreader
US12108563B2 (en) * 2022-07-27 2024-10-01 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having embedded power electronics devices
US11869760B1 (en) * 2022-07-27 2024-01-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating layer
US12165954B2 (en) * 2022-08-19 2024-12-10 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating S-cells
US12096596B2 (en) * 2022-10-18 2024-09-17 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

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JP2013034304A (ja) 2011-08-02 2013-02-14 Toyota Motor Corp 電力変換装置
WO2019102665A1 (ja) 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2020009834A (ja) 2018-07-04 2020-01-16 富士電機株式会社 半導体装置

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TWI482244B (zh) * 2012-11-19 2015-04-21 財團法人工業技術研究院 熱交換器以及半導體模組
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JP2013034304A (ja) 2011-08-02 2013-02-14 Toyota Motor Corp 電力変換装置
WO2019102665A1 (ja) 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2020009834A (ja) 2018-07-04 2020-01-16 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN116544198B (zh) 2025-05-20
JP2023112686A (ja) 2023-08-14
US20230247807A1 (en) 2023-08-03
CN116544198A (zh) 2023-08-04
US11997838B2 (en) 2024-05-28

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