CN116544198B - 一种电力装置组件及其制造方法 - Google Patents

一种电力装置组件及其制造方法 Download PDF

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Publication number
CN116544198B
CN116544198B CN202310094982.4A CN202310094982A CN116544198B CN 116544198 B CN116544198 B CN 116544198B CN 202310094982 A CN202310094982 A CN 202310094982A CN 116544198 B CN116544198 B CN 116544198B
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CN
China
Prior art keywords
power device
power
assembly
cavity
substrate
Prior art date
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Active
Application number
CN202310094982.4A
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English (en)
Chinese (zh)
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CN116544198A (zh
Inventor
周锋
刘阳河
请川纮嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
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Publication of CN116544198A publication Critical patent/CN116544198A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
CN202310094982.4A 2022-02-01 2023-02-01 一种电力装置组件及其制造方法 Active CN116544198B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/590,232 2022-02-01
US17/590,232 US11997838B2 (en) 2022-02-01 2022-02-01 Power device assemblies and methods of fabricating the same

Publications (2)

Publication Number Publication Date
CN116544198A CN116544198A (zh) 2023-08-04
CN116544198B true CN116544198B (zh) 2025-05-20

Family

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CN202310094982.4A Active CN116544198B (zh) 2022-02-01 2023-02-01 一种电力装置组件及其制造方法

Country Status (3)

Country Link
US (1) US11997838B2 (https=)
JP (1) JP7564261B2 (https=)
CN (1) CN116544198B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022073780A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073781A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073784A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073783A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022073782A (ja) * 2020-11-02 2022-05-17 株式会社三洋物産 遊技機
JP2022094240A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094238A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094239A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094241A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP2022094242A (ja) * 2020-12-14 2022-06-24 株式会社三洋物産 遊技機
JP7367715B2 (ja) * 2021-03-02 2023-10-24 株式会社三洋物産 遊技機
US20230328933A1 (en) * 2022-04-11 2023-10-12 Honeywell International Inc. Integrated heat spreader
US12108563B2 (en) * 2022-07-27 2024-10-01 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having embedded power electronics devices
US11869760B1 (en) * 2022-07-27 2024-01-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating layer
US12165954B2 (en) * 2022-08-19 2024-12-10 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating S-cells
US12096596B2 (en) * 2022-10-18 2024-09-17 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005528A (ja) * 2003-06-12 2005-01-06 Hitachi Metals Ltd 半導体素子搭載用モジュール

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6865080B2 (en) * 2002-01-16 2005-03-08 Rockwell Automation Technologies, Inc. Compact fluid cooled power converter supporting multiple circuit boards
US6906404B2 (en) 2003-05-16 2005-06-14 Ballard Power Systems Corporation Power module with voltage overshoot limiting
US20050121180A1 (en) 2003-09-26 2005-06-09 Thermal Form & Function Llc Use of graphite foam materials in pumped liquid, two phase cooling, cold plates
KR101384426B1 (ko) * 2006-03-13 2014-04-10 쇼와 덴코 가부시키가이샤 파워 모듈용 베이스
KR20110014867A (ko) * 2009-08-06 2011-02-14 삼성전기주식회사 전력소자 패키지 및 그 제조방법
DE102010043445B3 (de) * 2010-11-05 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Kondensatoranordnung, leistungselektronisches Gerät damit undVerfahren zur Herstellung der Kondensatoranordnung
JP5675526B2 (ja) 2011-08-02 2015-02-25 トヨタ自動車株式会社 電力変換装置
TWI482244B (zh) * 2012-11-19 2015-04-21 財團法人工業技術研究院 熱交換器以及半導體模組
FI126026B (fi) * 2012-12-13 2016-05-31 Vacon Oy Tehoelektroniikkalaite ja sen jäähdytysjärjestely
US8872328B2 (en) * 2012-12-19 2014-10-28 General Electric Company Integrated power module package
DE102013109532B3 (de) 2013-09-02 2014-08-28 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
KR20170063817A (ko) 2014-10-02 2017-06-08 알파벳 에너지, 인코포레이티드 열전 발전 유닛 및 이것의 제조 및 사용 방법
WO2016103436A1 (ja) * 2014-12-26 2016-06-30 三菱電機株式会社 半導体モジュール
JP6920790B2 (ja) * 2016-05-24 2021-08-18 ローム株式会社 インテリジェントパワーモジュール、電気自動車またはハイブリッドカー、およびインテリジェントパワーモジュールの組み立て方法
CN106714514A (zh) 2016-12-15 2017-05-24 宁波央腾汽车电子有限公司 一种用于电动汽车的逆变器冷却系统
JP7164545B2 (ja) 2017-11-21 2022-11-01 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP7183594B2 (ja) 2018-07-04 2022-12-06 富士電機株式会社 半導体装置
CN208434206U (zh) * 2018-07-24 2019-01-25 甘旭 多层功率器件堆叠结构
CN109346448B (zh) 2018-09-30 2020-06-30 西安微电子技术研究所 一种石墨烯复合冷板及其制备方法
TWI698969B (zh) * 2019-08-14 2020-07-11 朋程科技股份有限公司 功率元件封裝結構
CN112366188B (zh) * 2020-08-24 2023-07-25 杰群电子科技（东莞）有限公司 一种具有散热齿片的半导体器件封装结构及封装方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005528A (ja) * 2003-06-12 2005-01-06 Hitachi Metals Ltd 半導体素子搭載用モジュール

Also Published As

Publication number Publication date
JP2023112686A (ja) 2023-08-14
US20230247807A1 (en) 2023-08-03
CN116544198A (zh) 2023-08-04
US11997838B2 (en) 2024-05-28
JP7564261B2 (ja) 2024-10-08

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Address after: Japan

Patentee after: Toyota Motor Corporation

Country or region after: Japan

Patentee after: Future Vision Technology Co.,Ltd.

Patentee after: DENSO Corp.

Address before: Texas in the United States

Patentee before: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, Inc.

Country or region before: U.S.A.

TR01 Transfer of patent right