JP7547067B2 - Crystalline radically polymerizable composition for fixing electric/electronic components, vehicle-mounted rotor core, and method for manufacturing rotor core fixed body - Google Patents

Description

The present invention relates to a crystalline radically polymerizable composition for fixing electrical and electronic components, an in-vehicle rotor core fixed with the composition, and a method for manufacturing a rotor core fixed body.

Electrical and electronic components used in machine tools, work robots, vehicles, automobiles, electrical appliances, etc. are fixed to housings or component parts such as units, modules, devices, etc. to protect them from external factors such as dust, moisture, and shock. Fixing electrical and electronic components to housings or component parts such as units, modules, devices, etc. using metal is highly reliable but expensive, so fixing materials made of resin materials, which are inexpensive and have good productivity, are being used instead. In addition, by using resin fixing materials instead of metal fixing materials, it is possible to make the fixed electrical and electronic components smaller because of their electrical insulation properties, and this improves the design freedom of machine tools, work robots, vehicles, automobiles, electrical appliances, etc. in which they are installed. In addition, electrical and electronic components are sometimes used under harsh conditions such as high temperature and high humidity environments, so when using resin materials, thermosetting resins with excellent heat resistance are often used.

Recently, liquid epoxy resins have come into use, as they have good adhesion to resin substrates and metals, and have excellent mechanical strength and fluidity.

For these reasons, conventionally, epoxy resin compositions for fixing, and methods for manufacturing electronic devices, automobiles, and electronic devices using epoxy resin compositions for fixing are known (e.g., Patent Document 1). In addition, methods for manufacturing semiconductor devices and thermosetting resin compositions for semiconductor encapsulation used therein are known (e.g., Patent Documents 2 and 3).

JP 2014-148586 A JP 2005-146008 A JP 2020-23678 A

Tablet-type epoxy molding compound (EMC) is used in the highly productive transfer molding method, and has established a high level of reliability due to its excellent physical properties such as adhesion and linear expansion coefficient. However, since it requires frozen storage and a post-curing process, there is a demand for simplification of the method of use.

In the above Patent Document 1, the encapsulating epoxy resin composition is molded by transfer molding. The epoxy resin composition used in transfer molding needs to be stored frozen and then returned to room temperature. If the epoxy resin composition is stored at room temperature, there are problems such as a significant decrease in fluidity and the fact that it does not completely cure during the molding time, requiring post-curing for several hours to obtain the required molded product characteristics.

The above-mentioned Patent Document 2 proposes a thermosetting resin composition that improves the storage stability of an epoxy resin composition, and a thermosetting resin containing a polymerizable compound having a specific structure. However, the cited examples in the patent, the patent specification, and the descriptions in the examples suggest that the assumed temperature stability in the patent is in the room temperature or normal temperature range.

Patent Document 3 also proposes a sealant for electronic components made of a photocurable resin that is highly sensitive to light and hardens even with low-energy light, but does not disclose any description of storage stability or handling that accompanies the property of being highly sensitive to light and hardening even with low-energy light.

Therefore, the present invention aims to provide a crystalline radical polymerizable composition that has good stability in the plasticization temperature range, and therefore is easy to handle and has good curing moldability.

The inventors of the present invention have conducted extensive research from various perspectives on compositions containing at least a crystalline radically polymerizable compound, and as a result have discovered the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention.

That is, the vehicle-mounted rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention is a vehicle-mounted rotor core having a magnet fixed thereto using a radically polymerizable composition containing at least a crystalline radically polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator, characterized in that the radical polymerization initiator is a thermal polymerization initiator, and the 10-hour half-life temperature of the radical polymerization initiator is 60 to 170°C, and the melting point of the crystalline radically polymerizable compound is in the range of 30 to 150°C.

In addition, in a preferred embodiment of an in-vehicle rotor core having a magnet fixed using the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, the crystalline radically polymerizable compound is characterized by including one or more selected from crystalline unsaturated polyesters, crystalline epoxy (meth)acrylates, crystalline urethane (meth)acrylates, crystalline polyester (meth)acrylates, crystalline polyether (meth)acrylates, crystalline radically polymerizable monomers, and crystalline radically polymerizable multimers.

In a preferred embodiment of the in-vehicle rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, the crystalline radically polymerizable composition for fixing electrical and electronic components is characterized in that, when the radically polymerizable composition is placed in a cylinder sample insertion hole heated to 90°C and the melt viscosity is measured using a high-temperature flow tester, the melt viscosity retention rate before and after storage at 23°C for 7 days is 90 to 120%.

In a preferred embodiment of the in-vehicle rotor core having a magnet fixed thereto using the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention, the molded product of the crystalline radical polymerizable composition for fixing electric and electronic components has a bending strength retention rate of 90 to 150% before and after curing at 150° C. for 5 hours.

In a preferred embodiment of the in-vehicle rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, the crystalline radically polymerizable composition for fixing electric and electronic components is characterized in that, when the radically polymerizable composition is placed in a cylinder sample insertion hole heated to 90°C and the melt viscosity is measured using a high-temperature flow tester, the melt viscosity retention rate before and after storage at 90°C for 1 hour is 90 to 1000%.

In a preferred embodiment of the in-vehicle rotor core having a magnet fixed thereto using the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention, the crystalline radical polymerizable composition is characterized in that it is solid at 23°C.

In a preferred embodiment of the in-vehicle rotor core having a magnet fixed thereto using the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention, the inorganic filler is present in an amount of 50 to 95 mass % based on the total amount of the crystalline radical polymerizable composition.

In addition, in a preferred embodiment of an in-vehicle rotor core having a magnet fixed using the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, the ratio of the crystalline radically polymerizable compound to the total amount of the radically polymerizable compound is 30 parts by weight or more.

The manufacturing method of the rotor core stator of the present invention is characterized by having a step of fixing a magnet by an insert molding method such as an injection molding method, a transfer molding method, or a casting method using the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention.

The crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention has the advantageous effect of excellent molding stability because it has excellent storage stability and little change in viscosity even at the plasticization temperature during injection molding and transfer molding. Furthermore, the crystalline radical polymerizable composition has the advantageous effect of ensuring sufficient mechanical strength without performing a post-curing process for large rotor cores because of its fast curing speed.

The present invention also has the advantageous effect of providing an in-vehicle rotor core that is fixed with a crystalline radically polymerizable composition for fixing electrical and electronic components.

Furthermore, the present invention has the advantageous effect of providing a method for manufacturing electric and electronic components, which includes a step of fixing a magnet to a granule, powder, or tablet made of a crystalline radically polymerizable composition for fixing electric and electronic components by injection molding, transfer molding, or insert molding using a casting method.

The crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention is a radical polymerizable composition containing at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator, and is characterized in that the radical polymerization initiator is a thermal polymerization initiator. This is because, as shown in the examples described below, the use of the radical polymerization initiator, which is a thermal polymerization initiator, provides a crystalline radical polymerizable composition that has excellent storage stability in the plasticization process temperature range of the crystalline radical polymerizable composition, has good production stability, can be stored at room temperature, has low storage costs, and can ensure sufficient physical properties without post-curing. In this specification, the crystalline radical polymerizable composition for fixing electrical and electronic components may be referred to as a crystalline radical polymerizable composition.

Fixing means preventing something from moving from one place, or not moving. Fixing includes adhesion and sealing, and fixing applications include adhesion and sealing. Fixing using the present crystalline radically polymerizable composition for fixing electrical and electronic components can fix part and/or all of the device and/or component to be fixed.

In a preferred embodiment of the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention, the crystalline radical polymerizable compound is characterized by including one or more selected from crystalline unsaturated polyester, crystalline epoxy (meth)acrylate, crystalline urethane (meth)acrylate, crystalline polyester (meth)acrylate, crystalline polyether (meth)acrylate, crystalline radical polymerizable monomer, and crystalline radical polymerizable multimer. The use of these polymerizable compounds improves mechanical properties and handling (hereinafter, crystallinity may be omitted).

In this specification, a crystalline compound is a compound that has a melting point, and may be a compound that has a glass transition point and a melting point. These temperatures can be confirmed by a thermal analysis device such as a DSC (differential scanning calorimeter) or a TGDTA (thermogravimetric differential thermal analyzer). The crystalline compound in the present invention may be a compound whose melting point can be confirmed by a thermal analysis device.

In a preferred embodiment of the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention, the radical polymerization initiator has a 10-hour half-life temperature of 60 to 170°C, more preferably 70 to 160°C, and even more preferably 80 to 150°C, from the viewpoint of stability and productivity of the crystalline radical polymerizable composition for fixing electric and electronic components. If the decomposition temperature is lower than the above range, there is a risk that a curing reaction will proceed during melt kneading, and if the decomposition temperature is higher than the above range, there is a risk that the molding time will be long and productivity will decrease. By setting the temperature within the above range, the viscosity change is minimal even when stored at the cylinder temperature during injection molding, improving production stability, and since it can be stored at room temperature, logistics costs can be reduced and it can be stored without freezing, making it easy to handle, and furthermore, since the curing speed is fast, there is a possibility that sufficient physical properties can be secured without post-curing.

In a preferred embodiment of the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, the crystalline radically polymerizable composition for fixing electric and electronic components has a melt viscosity retention rate of 90 to 120% before and after storage at 23°C for 7 days, more preferably 95 to 120%, and even more preferably 98 to 120%, from the viewpoint of production stability. By setting the melt viscosity in the above range, the flowability is stable, so that moldability is good and there is a possibility of improving the yield.

In a preferred embodiment of the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, the molded product of the crystalline radically polymerizable composition for fixing electrical and electronic components has a property retention rate of 90 to 150% before and after post-curing, more preferably 95 to 140%, and even more preferably 98 to 130%, from the viewpoint of shortening the process and stabilizing the quality. By setting the value in the above range, the post-curing process can be eliminated and the time can be shortened, which may improve productivity and stabilize the quality due to less variation in the physical properties of the molded product.

In a preferred embodiment of the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, the crystalline radically polymerizable composition for fixing electric and electronic components has a melt viscosity retention rate of 90 to 1000% before and after storage at 90°C for 1 hour, more preferably 95 to 900%, and even more preferably 98 to 800%, from the viewpoint of production stability and reliability. By setting the retention rate within the above range, damage and deformation of parts due to molding pressure caused by an increase in the melt viscosity of the crystalline radically polymerizable composition for fixing electric and electronic components may be suppressed. In addition, it may be possible to suppress unfilling of narrow parts.

In a preferred embodiment of the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention, the crystalline radical polymerizable compound is characterized in that, from the viewpoint of workability and moldability, the melting point of the crystalline radical polymerizable compound is 30 to 150°C, more preferably 30 to 120°C, and even more preferably 30 to 100°C. This is because, compared with the use of a crystalline radical polymerizable compound having a melting point of less than 30°C or a crystalline radical polymerizable compound having a melting point of more than 150°C, the use of a crystalline radical polymerizable compound having a melting point in the range of 30 to 150°C can achieve better handling. If the melting point of the crystalline radical polymerizable compound is lower than the above range, it is likely to become liquid at room temperature, and therefore the crystalline radical polymerizable composition may be difficult to maintain as a solid. If the melting point of the crystalline radical polymerizable compound is higher than the above range, it is close to the molding temperature of the mold, and therefore the time from the start of flow to hardening is shortened, and molding defects may occur.

In addition, when only crystalline radical polymerizable compounds with a melting point of less than 30°C are used, it is difficult to obtain a crystalline radical polymerizable composition that is solid at 23°C. On the other hand, when only crystalline radical polymerizable compounds with a melting point of more than 150°C are used, the crystalline radical polymerizable composition tends to be less stable in the cylinder during plasticization in the cylinder in the injection molding method because the cylinder temperature and the mold temperature are close to each other.

In a preferred embodiment of the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention, the crystalline radical polymerizable composition is characterized by being solid at 23°C from the viewpoint of the ease of handling of the crystalline radical polymerizable compound. The reason for the above range is that the shape of the composition does not change under the manufacturing, molding, and transportation environment of the crystalline radical polymerizable composition, making continuous production possible using general-purpose manufacturing equipment and conditions. Note that a solid can be one whose shape and volume do not easily change due to an external force.

In a preferred embodiment of the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, the inorganic filler is 50 to 95% by mass, more preferably 55 to 93% by mass, and even more preferably 60 to 90% by mass, based on the total amount of the crystalline radically polymerizable composition, from the viewpoint of product quality. The reason for the above range is that if the amount of inorganic filler is less than the above range, the shrinkage rate is large and the molded product is deformed, and if the amount is more than the above range, the melt viscosity during molding is high and a load is applied to the insert, which may cause damage to the insert.

In addition, in a preferred embodiment of the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention, from the viewpoint of maintaining a solid state, the ratio of the crystalline radical polymerizable compound to the total amount (100 parts by weight) of the crystalline and amorphous radical polymerizable compounds can be 30 parts by weight or more, more preferably 40 parts by weight or more, and even more preferably 50 parts by weight or more. The reason for the above range is that if the ratio of the crystalline radical polymerizable compound is less than the above range, it may be difficult to form a solid.

The in-vehicle rotor core of the present invention is characterized in that a magnet is fixed using the crystalline radical polymerizable composition for fixing electrical and electronic components of the present invention.

The manufacturing method of the rotor core stator of the present invention is characterized by having a step of fixing a magnet by an insert molding method such as an injection molding method, a transfer molding method, or a casting method using the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention.

As an application example of the present invention, the electric/electronic device with fixed electric/electronic components of the present invention is characterized by comprising an electric/electronic device and an electric/electronic component fixed to the electric/electronic device by the crystalline radical polymerizable composition for fixing electric/electronic components of the present invention.

In a preferred embodiment of the electrical/electronic device with fixed electrical/electronic components of the present invention, the electrical/electronic device is a unit, a module, a device body, or a rotor core.

The electric/electronic component fixing unit, module, and device body are units, modules, and devices (electrical/electronic devices) that contain electric/electronic components. The electric/electronic components are fixed to a housing or to constituent parts such as a unit, module, or device. The fixed electric/electronic components may be damaged by the flow pressure of injection molding, transfer molding, and the like using a highly viscous molding material. In the present invention, the electric/electronic components may include so-called electric/electronic components such as semiconductors, capacitors, and integrated circuits, as well as broadly defined electric/electronic components such as sensors, switches, magnetic materials, and primary and secondary batteries. In short, the composition of the present invention can be widely applied to electric/electronic component fixing units, modules, devices, and the like that require ease of handling and flowability.

The machine of the present invention is characterized by having an electric/electronic device with fixed electric/electronic components of the present invention. There are no particular limitations on the type of machine, so long as it has the electric/electronic device with fixed electric/electronic components of the present invention. For example, examples of machines include general machines, electric machines, transport machines, precision machines, etc., and the electric/electronic device with fixed electric/electronic components of the present invention can be incorporated into these machines. Examples of general machines include agricultural machines, construction machines, boilers/motors, textile machines, machine tools, various industrial machines, office machines, sewing machines, etc., examples of electric machines include generators, consumer electrical appliances, communication machines, electronic application devices, electrical measuring instruments, etc., examples of transport machines include automobiles, railroad cars, ships, aircraft, etc., and examples of precision machines include optical instruments, watches, precision measuring instruments, etc.

In the present invention, a composition with low melt viscosity and good fluidity is soft even at room temperature, which may cause problems with handling. In addition, a soft composition may become lumpy, causing the composition to fuse in the hopper in the injection molding method, and causing problems with the transfer molding method in which pre-formed tablets fuse and even change shape so that they cannot be inserted into the tablet insertion holes in the transfer molding machine. The present invention has the excellent effects of providing good production stability because of excellent storage stability in the plasticization process temperature range of the crystalline radical polymerizable composition, low storage costs because it can be stored at room temperature, and ensuring sufficient physical properties without post-curing.

<Production method of unsaturated polyester>
The unsaturated polyester used in the present invention may be, for example, obtained by subjecting an unsaturated polybasic acid, a saturated polybasic acid, and glycols to a known dehydration condensation reaction, and may generally have an acid value of 2 to 40 mg-KOH/g. In producing the unsaturated polyester, an unsaturated polyester having crystallinity can be obtained by appropriately selecting and combining the acid components of the unsaturated polybasic acid and the saturated polybasic acid, and selecting and combining the glycols, and by appropriately selecting the blending ratio thereof, etc.

Examples of unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and glutaconic acid.

Examples of saturated polybasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, HET acid, and tetrabromophthalic anhydride.

Examples of glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neopentyl glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, and dibromo neopentyl glycol.

In the present invention, among the crystalline unsaturated polyesters, unsaturated polyesters using fumaric acid as the unsaturated polybasic acid, isophthalic acid or terephthalic acid as the saturated polybasic acid, and ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, or cyclohexanedimethanol as the main glycol component are preferred.

<Method for producing epoxy (meth)acrylate>
The epoxy (meth)acrylate used in the present invention can be produced by a method known per se. By appropriately selecting an epoxy resin and an unsaturated monobasic acid in the presence or absence of a known inhibitor and a known esterification catalyst, in an inert gas stream or in an air atmosphere, a crystalline epoxy (meth)epoxy acrylate can be obtained. If necessary, other radical polymerizable monomers or organic solvents can be added to the reaction system in order to reduce the melt viscosity of the reaction system.

The epoxy (meth)acrylate in the present invention can be, for example, an epoxy (meth)acrylate having an acrylate or methacrylate double bond at the molecular end obtained by addition reaction of acrylic acid or methacrylic acid with an epoxy resin having two or more glycidyl ether groups in one molecule. It may be an epoxy (meth)acrylate resin in which an epoxy (meth)acrylate is dissolved in a radical polymerizable monomer and/or a radical polymerizable polymer. The epoxy resin having two or more glycidyl ether groups in one molecule may be, for example, a bisphenol type epoxy resin from bisphenol A, bisphenol F, bisphenol S, etc., or their derivatives, a bixylenol type epoxy resin from bixylenol and its derivatives, a biphenol type epoxy resin from biphenol and its derivatives, a naphthalene type epoxy resin from naphthalene and its derivatives, or a novolac type epoxy resin, which can be used alone or in a mixture of two or more kinds. The epoxy equivalent, which is a measure of the molecular weight of the epoxy resin, is preferably 174 to 2000 eq/g.

<Method for producing urethane (meth)acrylate>
The urethane (meth)acrylate in the present invention can be, for example, a urethane acrylate having an acrylate or methacrylate double bond at a molecular end obtained by reacting a polyalcohol and/or polyester polyol and/or polyether polyol having two or more hydroxyl groups in one molecule with a diisocyanate to produce an isocyanate at a molecular end, and/or by reacting one or more isocyanates in one molecule with a compound having an alcoholic hydroxyl group and one or more acrylate groups or methacrylate groups, or by first reacting a compound having an alcoholic hydroxyl group and one or more acrylate groups or methacrylate groups with a diisocyanate so that an isocyanate group remains, and then reacting the remaining isocyanate group with a polyalcohol and/or polyester polyol and/or polyether polyol having two or more hydroxyl groups in one molecule. In the production of urethane (meth)acrylate, a combination of isocyanate and polyalcohol and/or polyester polyol and/or polyether polyol, and a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups are appropriately selected to produce a urethane (meth)epoxy acrylate having crystallinity. Urethane acrylate or urethane methacrylate may be dissolved in a radical polymerizable monomer and/or a radical polymerizable polymer such as styrene or diethylene glycol dimethacrylate to produce a urethane (meth)acrylate resin. These may be used alone or in a mixture of two or more kinds.

Examples of compounds having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups include hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, phenoxyhydroxypropyl (meth)acrylate, trimethylolpropane di(meth)acrylate, and dipropylene glycol mono(meth)acrylate.

In addition, examples of the polyalcohols having two or more hydroxyl groups in one molecule include, for example, neopentyl glycol, ethylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, etc., and examples of the polyester polyols having two or more hydroxyl groups in one molecule include, for example, neopentyl glycol, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, etc. Saturated polyester polyols having a molecular weight of 1000 to 2000 obtained by dehydration condensation reaction of polyalcohols such as bisphenol A adducts and bisphenol A propylene oxide adducts with polybasic acids such as adipic acid, (phthalic) acid (anhydride), isophthalic acid, terephthalic acid, trimellitic acid, etc., can be used alone or in combination of two or more kinds, and for the polyether polyols having two or more hydroxyl groups in one molecule, polyethylene glycols and polypropylene glycols having a molecular weight of 300 to 2000 obtained by ring-opening reaction of ethylene oxide or propylene oxide, or polycaprolactone obtained by ring-opening reaction of caprolactone, can be used alone or in combination of two or more kinds.

As the compound having two or more isocyanate groups in one molecule, aromatic and/or aliphatic polyisocyanate compounds are used, such as tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, trifunctional isocyanates having an isocyanurate ring obtained by trimerizing a bifunctional isocyanate compound, and commercially available isocyanate prepolymers modified with polyols. These can be used alone or in a mixture of two or more types.

<Method for producing polyester (meth)acrylate>
The polyester (meth)acrylate in the present invention may be, for example, a polyester acrylate or polyester methacrylate having an acrylate or methacrylate double bond at the molecular end obtained by esterification of a polyester polyol with acrylic acid or methacrylic acid, or by reaction of an acid-terminated polyester with an acrylate or methacrylate having a glycidyl group. In the production of a polyester (meth)acrylate, a polyester (meth)acrylate having crystallinity can be obtained by appropriately selecting a polyester polyol and an acrylic acid or methacrylic acid, or an acid-terminated polyester and an acrylate or methacrylate having a glycidyl group. A polyester acrylate resin or a polyester methacrylate resin may be prepared by dissolving a polyester acrylate or a polyester methacrylate in a radical polymerizable monomer and/or a radical polymerizable polymer, such as styrene or diethylene glycol dimethacrylate. These may be used alone or in a mixture of two or more kinds.

<Method for producing polyether (meth)acrylate>
In addition, the polyether (meth)acrylate in the present invention can be, for example, a polyether acrylate or polyether methacrylate having an acrylate or methacrylate double bond at the molecular end obtained by esterification of a polyether polyol with acrylic acid or methacrylic acid, or by reaction of an acid-terminated polyether with an acrylate or methacrylate having a glycidyl group. In the production of a polyether (meth)acrylate, a polyester (meth)acrylate having crystallinity can be obtained by appropriately selecting a polyether polyol and acrylic acid or methacrylic acid, or an acid-terminated polyester and an acrylate or methacrylate having a glycidyl group. A polyether acrylate resin or polyether methacrylate resin in which a polyether acrylate or polyether methacrylate is dissolved in a radical polymerizable monomer and/or radical polymerizable polymer such as styrene or diethylene glycol dimethacrylate may also be used. These can be used alone or in a mixture of two or more kinds.

In a preferred embodiment, the crystalline radical polymerizable monomer that is solid at 30 to 150°C in the present invention is ethoxylated isocyanuric acid triacrylate (melting point: about 50°C), polyethylene glycol di(meth)acrylate (melting point: 35 to 53°C), methoxypolyethylene glycol (meth)acrylate (melting point: 33 to 40°C), behenyl acrylate (melting point: 46°C), tetramethylpiperidinyl methacrylate (melting point: 56 to 60°C), trimethallyl isocyanurate ... It can contain one or more selected from the group consisting of acetonitrile (melting point 83-87°C), diacetone acrylamide (melting point approximately 56°C), itaconic acid dimethyl ester (melting point 36°C), vinyl stearate (melting point 36°C), N-vinyl carbazole (melting point 67°C), N-methylolacrylamide (melting point 71-75°C), acrylamide (melting point 84°C), tolylenediallyl carbamate (melting point 85-110°C), maleimide (melting point 93°C), acenaphthylene (melting point 95°C), etc. Using these crystalline radical polymerizable compounds improves handling.

In the present invention, radical polymerizable monomers that are liquid at room temperature can be used as long as they do not impair the objective of the present invention. Examples of such monomers include vinyl aromatic compounds such as styrene monomer having a vinyl group, α-methylstyrene, vinyltoluene, and α-chlorostyrene; vinyl esters such as vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, and Veova Monomer (manufactured by Shell Chemical Co.); and (meth)acrylic esters such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, and n-butyl methacrylate.

In addition, radically polymerizable monomers having two or more functionalities, such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyl tetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate, diallyl phthalate having an allyl group, and triallyl isocyanurate, can be used. These radically polymerizable monomers may be used alone or in combination of two or more kinds.

The radical polymerizable polymer in the present invention may be a diallyl phthalate prepolymer, a tyrenic prepolymer, an epoxy prepolymer, a urethane prepolymer, or an acrylate prepolymer. These radical polymerizable polymers may be used alone or in combination of two or more kinds.

In the crystalline radically polymerizable composition for fixing electric/electronic components of the present invention, an inorganic filler can be blended. Examples of the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, magnesium oxide, alumina, silica, zinc oxide, mica, aluminum nitride, and boron nitride. Among these, silica is preferred from the viewpoint of fluidity. These may be used alone or in combination of two or more.

The inorganic filler may have an average particle size of 100 μm or less, preferably 0.01 to 50 μm. By using an inorganic filler having the above average particle size, a crystalline radically polymerizable composition for fixing electrical and electronic components that has excellent fluidity and strength during molding can be obtained.

In the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, various additives that adhere to inorganic fillers and reinforcing materials, such as (meth)acrylate compounds having polar groups and coupling agents, can be blended.

The (meth)acrylate compound having a polar group is not particularly limited, but may be, for example, a (meth)acrylate compound in which a substituent containing an atom other than carbon or hydrogen is ester-bonded. Examples of the substituent include a hydroxyl group, an epoxy group, a glycidyl ether group, a tetrahydrofurfuryl group, an isocyanate group, a carboxyl group, an alkoxysilyl group, a phosphate ester group, a lactone group, an oxetane group, a tetrahydropyranyl group, and an amino group. The coupling agent is not particularly limited, but may be, for example, a silane coupling agent or a titanate coupling agent. Examples of the silane coupling agent that may be used include, for example, an epoxy silane, an amino silane, a cationic silane, a vinyl silane, an acrylic silane, a mercapto silane, and a composite of these.

Of these, acrylic silane coupling agents are preferred from the viewpoint of improving strength. Any other additives can be used as long as they do not impair the objectives of the present invention.

In the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, the radical polymerization initiator can be a thermally decomposable organic peroxide or a polymerization inhibitor that is typically used in unsaturated polyester resin compositions and radically polymerizable compositions.

The thermal polymerization initiator is not particularly limited as long as it is a compound that generates radicals by heating and initiates a chain polymerization reaction, but examples thereof include organic peroxides, azo compounds, benzoin compounds, benzoin ether compounds, acetophenone compounds, benzopinacol, etc., and organic peroxides are preferably used. As the organic peroxide, thermal decomposition types such as hydroperoxides, dialkyl peroxides, peroxy esters, diacyl peroxides, peroxy dicarbonates, peroxy ketals, and ketone peroxides can be used, and examples thereof include dilauroyl peroxide, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, disuccinic acid peroxide, 2,5-dimethyl-2,5-di(ethylhexanoyl)hexane, t-hexylperoxy-2-ethylhexanoate, t-butyl Peroxy-2-ethylhexanoate, di(3-methylbenzoyl) peroxide, benzoyl(3-methylbenzoyl) peroxide & dibenzoyl peroxide, dibenzoyl peroxide, 1,1-di(t-hexyl peroxide)cyclohexane, 1,1-di(t-butyl peroxide)cyclohexane, 2,2-di(4,4-di(t-butyl peroxide)cyclohexyl)propane, t-hexyl peroxide isopropenyl monocarbonate, t-butylperoxy-3,5,5-trimethyl Hexanoate, t-butylperoxylaurate, t-butylperoxyisopropenyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butylperoxyacetate, 2,2-di(t-butylperoxy)butane, t-butylperoxybenzoate, n-butyl 4,4-di(t-butylperoxy)valerate, di(2-t-butylperoxyisopropyl)benzene Examples of such peroxides include benzene, dicumyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-butyl peroxide, p-methane hydroperoxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane-3, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide. These may be used alone or in combination of two or more.

Among these, from the viewpoint of material stability and productivity, it is preferable to use an organic peroxide with a 10-hour half-life temperature of 60 to 170°C, more preferably 70 to 160°C, and even more preferably 80 to 150°C. If the decomposition temperature is lower than the above range, there is a risk of a curing reaction progressing during kneading. If the decomposition temperature is higher than the above range, there is a risk of resin deterioration due to the high curing temperature, or productivity decreasing due to the long molding time. By setting the temperature within the above range, there is a risk of the viscosity changing only slightly even when stored at the cylinder temperature during injection molding, so production stability is improved, and since it can be stored at room temperature, logistics costs can be reduced and it can be stored without freezing, so it can be handled easily, and furthermore, since the curing speed is fast, sufficient physical properties can be secured without post-curing.

Polymerization inhibitors include hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, parabenzoquinone, pyrogallol and other quinones, 2,6-di-t-butyl-p-cresol, 2,2-methylene-bis-(4-methyl-6-t-butylphenol), 1,1,3-tris-(2-methyl-4-hydroxy-5-t-butylphenyl) Examples of suitable examples of the polymerizable composition include phenolic compounds such as 2,2,6,6-tetramethylpiperidine 1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine 1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine 1-oxyl, 4-methoxy-2,2,6,6-tetramethylpiperidine 1-oxyl, 4-carboxy-2,2,6,6-tetramethylpiperidine 1-oxyl, and 2,2,6,6-tetramethylpiperidine 1-oxyl. By using these, thickening during filling during molding can be suppressed, and a radical polymerizable composition with low melt viscosity can be obtained. These may be used alone, or two or more types may be used in combination.

The crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention can be blended with a reinforcing material. By using a reinforcing material, the crystalline radically polymerizable composition for fixing electrical and electronic components can be made to have excellent strength characteristics and dimensional stability.

The reinforcing material used in the present invention is usually glass fiber, which is used in fiber-reinforced plastics such as BMC (bulk molding compound) and SMC (sheet molding compound), but it is not limited to glass fiber and other materials can also be used.

Examples of glass fibers include E-glass (alkali-free glass for electrical use), C-glass (alkali-containing glass for chemical use), A-glass (acid-resistant glass), S-glass (high-strength glass), and other glass fibers made from silicate glass and borosilicate glass. These can be used in the form of long fibers (rovings), short fibers (chopped strands), or milled fibers. Furthermore, these glass fibers can also be used after being surface-treated.

In addition, in the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention, other inorganic fillers can be appropriately blended within a range that does not impair the fluidity of the composition or the properties when used as a fixing material.

These include oxides and their hydrates, inorganic foam particles, hollow particles such as silica balloons, etc.

In the crystalline radically polymerizable composition for fixing electric and electronic components of the present invention, a release agent can be used. As the release agent, waxes such as fatty acid-based, fatty acid metal salt-based, and mineral-based waxes generally used in thermosetting resins can be used, and in particular, fatty acid-based, fatty acid metal salt-based, and waxes with excellent resistance to heat discoloration can be preferably used.

Specific examples of these release agents include stearic acid, zinc stearate, aluminum stearate, calcium stearate, paraffin wax, etc. These release agents may be used alone or in combination of two or more.

If necessary, external release agents can be used, such as release agents that are sprayed or applied to the mold, or molding materials that contain release agents.

In the present invention, in addition to these blending components, curing catalysts, polymerization inhibitors, colorants, thickeners, wetting and dispersing agents, surface conditioners, viscosity reducers, flow modifiers, other organic additives, inorganic additives, etc., may be blended as necessary to adjust the curing conditions of the crystalline radically polymerizable composition.

<Method for producing crystalline radically polymerizable composition>
The crystalline radically polymerizable composition for fixing electric and electronic components of the present invention can be produced by blending each component, thoroughly and uniformly mixing them using a mixer, blender, or the like, and then preparing and granulating them using a kneader, extruder, or the like capable of heating and pressurizing.

The granules, powders, and tablets of the present invention are characterized in that they are made of the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention. The granules made of the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention may be in the form of pellets.

The electric/electronic component fixing body of the present invention is characterized by being formed by molding and fixing granules, powder, or tablets made of the crystalline radically polymerizable composition for fixing electric/electronic components of the present invention. The electric/electronic component fixing body can be molded by a conventional molding method for various thermosetting compositions.

In addition, the crystalline radically polymerizable composition for fixing electrical and electronic components of the present invention is dry and has good thermal stability when melted, so that melt-heat molding methods such as injection molding, injection compression molding, transfer molding, and compression molding can be suitably used as molding methods.

Among these, injection molding using an injection molding machine and transfer molding using a transfer molding machine are particularly suitable, as injection molding shortens the molding time, while transfer molding allows many molded bodies to be molded at once, making it possible to manufacture fixed bodies for electrical and electronic components with complex shapes.

<Fixed Electrical/Electronic Component Body and Method for Manufacturing the Fixed Electrical/Electronic Component Body>
The electric/electronic component fixing body of the present invention can be produced by fixing an electric/electronic component by insert molding using the crystalline radical polymerizable composition for fixing an electric/electronic component of the present invention. Here, the crystalline radical polymerizable composition for fixing an electric/electronic component of the present invention may be one in which all of the components constituting the crystalline radical polymerizable composition are separately heated and kneaded in advance, or one in which some or all of the components are mixed and heated and kneaded immediately before injection into a mold.

The temperature and pressure of the crystalline radical polymerizable composition when injected into the mold are not particularly limited, but when an injection molding machine is used, a crystalline radical polymerizable composition temperature of 60 to 130°C, a mold temperature of 130 to 190°C, and a crystalline radical polymerizable composition pressure of 0.1 to 10 MPa are preferable, while when a transfer molding machine is used, a mold temperature of 130 to 190°C, and a crystalline radical polymerizable composition pressure of 0.1 to 10 MPa are preferable, as they cause less damage to electrical and electronic components.

The following provides a more detailed explanation of one embodiment of the present invention using examples, but the present invention is not limited to these examples.

<Production Example of Radical Polymerizable Composition for Fixing Electrical/Electronic Components>
Examples 1 to 6 and Comparative Example 1
The crystalline or amorphous radically polymerizable compositions of Examples 1 to 6 shown in Table 2 and Comparative Example 1 shown in Table 3 were mixed in the amounts shown in Tables 2 and 3 below and homogeneously mixed using a kneader capable of pressurizing, heating and cooling, and the mixture was then fed into an extruder and hot-cut into granules. Some of the granular and bulk radically polymerizable compositions were powdered using a pulverizer.

(1) Radical Polymerizable Compound 1. Crystalline Radical Polymerizable Compound 1: Urethane Methacrylate (2-Hydroxyethyl Methacrylate Adduct of 1,6-Hexamethylene Diisocyanate)
2. Crystalline radically polymerizable compound 2: Ethoxylated isocyanuric acid triacrylate (A-9300, manufactured by Shin-Nakamura Chemical Co., Ltd.)
3. Amorphous radically polymerizable compound 3: bisphenol A type epoxy methacrylate (methacrylic acid adduct of bisphenol A type epoxy resin)

(2) Inorganic filler 1. Inorganic filler 1: fused silica (manufactured by Denka Co., Ltd., average particle size 24 μm)
2. Inorganic filler 2: Magnesium oxide (Ube Material Industries, Ltd., average particle size 55 μm)

(3) Radical Polymerization Initiator 1. Thermal Polymerization Initiator 1: Dicumyl peroxide (manufactured by NOF Corporation, 10-hour half-life temperature: 116°C, dialkyl peroxide)
2. Thermal polymerization initiator 2: Perhexa C
(NOF Corporation, 10-hour half-life temperature: 91° C., peroxyketal)
3. Thermal polymerization initiator 3: Nyper FF
(NOF Corporation, 10-hour half-life temperature: 74°C, diacyl peroxide)
4. Photopolymerization initiator 1: Omnilat 184
(IGM Resins B.V., alkylphenone)

(4) Additives 1. Silane coupling agent: methacrylic silane (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.)
2. Release agent: zinc stearate (GF-200, manufactured by NOF Corporation)
3. Polymerization inhibitor: perabenzoquinone (PBQ, manufactured by Seiko Chemical Co., Ltd.)
4. Colorant: Carbon black (CB40, manufactured by Mitsubishi Chemical Corporation)

<Characteristics of radical polymerizable compound>
The melting points of the crystalline and amorphous radical polymerizable compounds were measured and are shown in Table 1.

＜化合物特性、組成物特性、物性評価方法＞

<Compound characteristics, composition characteristics, and physical property evaluation methods>

(1) Melting point The radical polymerizable compounds shown in Table 1 were measured using a differential scanning calorimeter "DSC6220" (manufactured by Seiko Instruments Inc.) by placing 10 mg of a measurement sample in an aluminum pan, sealing it with a lid, and measuring it from -60°C to 200°C at a heating rate of 10°C/min. The endothermic peak of the obtained curve was taken as the melting point. The results are shown in Table 1.

(2) Curing moldability The evaluation method was judged based on whether bending test pieces according to JIS K 6911 could be prepared. Using the crystalline or amorphous radical polymerizable compositions of Examples 1 to 6 shown in Table 2 and Comparative Example 1 shown in Table 3, evaluation was performed using an auxiliary ram-type transfer molding machine equipped with a mold for preparing bending test pieces. Molding was performed under the molding conditions of a mold temperature of 165°C, a pressure of 3.2 MPa, and a curing time of 180 seconds, and a bent molded piece having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm was obtained. Those which gave a molded piece were marked ◯, and those which were not cured and did not give a molded piece were marked x.

(3) Viscosity Retention at 23°C The melt viscosity of the crystalline or amorphous radical polymerizable compositions of Examples 1 to 6 shown in Table 2 and Comparative Example 1 shown in Table 3 was measured using a high-performance flow tester (CFT-100EX, manufactured by Shimadzu Corporation). The radical polymerizable composition was placed in a cylinder sample insertion hole equipped with a die having a diameter of 2 mm and a length of 10 mm and heated to 90°C, and after preheating for 240 seconds, the piston was pressurized at a pressure of 5 kgf/cm2 to cause the radical polymerizable composition to flow out of the nozzle of the die, and the melt viscosity was determined from the point where linearity was good. The retention rate was calculated as B/A, where A is the initial melt viscosity and B is the melt viscosity stored at 23°C for 7 days. The results are shown in Tables 2 and 3. The target viscosity retention rate was set to 100 to 120%, with 100 to 120% being good and 90 to 120% being acceptable. However, even if the strict standards are not met, depending on the desired application, required quality, etc., the conditions may be met even if the range is outside of 90 to 120%, so this should be considered as a guideline.

(4) Viscosity Retention at 90°C The melt viscosity of the crystalline or amorphous radical polymerizable compositions of Examples 1 to 6 shown in Table 2 and Comparative Example 1 shown in Table 3 was measured using a high-performance flow tester (CFT-100EX, manufactured by Shimadzu Corporation). The radical polymerizable composition was placed in a cylinder sample insertion hole equipped with a die having a diameter of 2 mm and a length of 10 mm and heated to 90°C, and after preheating for 240 seconds, the piston was pressurized at a pressure of 5 kgf/cm2 to cause the radical polymerizable composition to flow out of the nozzle of the die, and the melt viscosity was determined from the point where linearity was good. The retention rate was calculated as C/A, with the initial melt viscosity being A and the melt viscosity stored at 90°C for 1 hour being C. The results are shown in Tables 2 and 3. The target viscosity retention rate was 90 to 1000%, with 100 to 500% being good and 90 to 1000% being acceptable. However, even if the strict standards are not met, depending on the desired application, the required quality, etc., the conditions may be met even if the range is beyond 90 to 1000%, so this should be considered as a guideline.

(5) Flexural Strength Retention Using the crystalline or amorphous radical polymerizable compositions of Examples 1 to 6 shown in Table 2 and Comparative Example 1 shown in Table 3, flexural test pieces were prepared using an auxiliary ram-type transfer molding machine equipped with a flexural test piece preparation mold. Molding was performed under the conditions of a mold temperature of 165°C, a pressure of 3.2 MPa, and a curing time of 180 seconds, and a bent molded piece having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm was obtained. The retention rate was calculated by β/α, where α is the initial flexural strength without post-curing, and β is the flexural strength after 5 hours of post-curing at 150°C. The results are shown in Tables 2 and 3. The target retention rate was set to 90 to 150%, with a range of 100 to 130% being good and 90 to 150% being acceptable. However, depending on the desired application, required quality, etc., even if the strict criteria are not cleared, the conditions may be met even if 90 to 150% is exceeded, so it may be considered as one guideline.

<Evaluation Results>
As shown in Tables 2 and 3, the crystalline or amorphous radical polymerizable composition for fixing electric and electronic components of the present invention was found to be excellent in handleability. In particular, Examples 1 to 6 of the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention were excellent in thermosetting property and also had good storage stability. It was found that the crystalline radical polymerizable composition for fixing electric and electronic components of the present invention showed excellent results overall.

Comparative Example 1 is an example of a composition that does not contain a crystalline radically polymerizable compound. No molded pieces could be obtained under the specified conditions, resulting in poor curing moldability. Viscosity retention showed sufficient results.

As described above, it has been found that a crystalline radically polymerizable composition for fixing electrical and electronic components, which contains at least a crystalline radically polymerizable compound, has excellent handling properties and good hardening formability.

Claims (9)

An on-vehicle rotor core having a magnet fixed thereto using a radical polymerizable composition containing at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator, wherein the radical polymerization initiator is a thermal polymerization initiator, and the 10-hour half-life temperature of the radical polymerization initiator is 60 to 170°C, and the melting point of the crystalline radical polymerizable compound is in the range of 30 to 150°C . An in-vehicle rotor core having a magnet fixed thereto using the crystalline radical polymerizable composition for fixing electrical and electronic components according to claim 1, characterized in that the crystalline radical polymerizable compound includes one or more selected from the group consisting of crystalline unsaturated polyester, crystalline epoxy (meth)acrylate, crystalline urethane (meth)acrylate, crystalline polyester (meth)acrylate, crystalline polyether (meth)acrylate, crystalline radical polymerizable monomer , and crystalline radical polymerizable polymer. 3. An in-vehicle rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electric and electronic components according to claim 1 or 2, characterized in that, when the radically polymerizable composition is placed in a cylinder sample insertion hole heated to 90° C. and the melt viscosity is measured using a high-temperature flow tester, the melt viscosity retention rate before and after storage at 23° C. for 7 days is 90 to 120%. A vehicle-mounted rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electric and electronic components according to any one of claims 1 to 3, characterized in that in a molded product of the crystalline radically polymerizable composition for fixing electric and electronic components, the bending strength retention rate before and after curing at 150°C for 5 hours is 90 to 150 %. 5. An in-vehicle rotor core having a magnet fixed thereto using the crystalline radical polymerizable composition for fixing electric and electronic components according to any one of claims 1 to 4, characterized in that, when the radical polymerizable composition is placed in a cylinder sample insertion hole heated to 90°C and the melt viscosity is measured using a high-temperature flow tester, the melt viscosity retention rate before and after storage at 90°C for 1 hour is 90 to 1000 %. 6. An in-vehicle rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electric/electronic components according to claim 1, wherein the crystalline radically polymerizable composition is a solid at 23° C. 7. A vehicle-mounted rotor core having a magnet fixed thereto using the crystalline radically polymerizable composition for fixing electrical and electronic components according to claim 1, characterized in that the inorganic filler is 50 to 95 mass % based on the total amount of the crystalline radically polymerizable composition. 8. An in-vehicle rotor core having a magnet fixed thereto using the radically polymerizable composition for fixing electric and electronic components according to claim 1, wherein a ratio of the crystalline radically polymerizable compound to the total amount of the radically polymerizable compounds is 30 parts by weight or more . A method for producing a rotor core stator, comprising a step of fixing a magnet by an insert molding method such as an injection molding method, a transfer molding method, or a casting method using the radical polymerizable composition for fixing electric/electronic components according to any one of claims 1 to 8.