JP6630695B2 - Crystalline radical polymerizable composition for sealing electric and electronic parts, sealed body for electric and electronic parts using the composition, and method for producing the sealed body - Google Patents

Description

  The present invention relates to a crystalline radical polymerizable composition for sealing an electric / electronic component, an encapsulated electric / electronic component sealed with the composition, and a granular composition comprising the crystalline radical polymerizable composition for sealing an electric / electronic component. The present invention relates to a product and a method for manufacturing a sealed electrical and electronic component.

  Electrical and electronic components used in automobiles and electric appliances are protected by metal or resin materials in order to protect against external factors such as dust, moisture and impact. The sealing of electric and electronic components with metal has high reliability but is expensive. Therefore, sealing with a resin material that is inexpensive and has good productivity has been replaced by a sealing material. In addition, since the sealing of the electric and electronic parts by the metal is made of a resin sealing material, the sealed electric and electronic parts can be reduced in size because they have electrical insulation properties. The degree of freedom in designing is improved. In addition, since electric and electronic components are sometimes used under severe conditions in a high-temperature and high-humidity environment, when a resin material is used, a thermosetting resin having excellent heat resistance is often used.

  Recently, a liquid epoxy resin having good adhesion to a resin substrate or a metal, and excellent in mechanical strength and fluidity has been used.

  The use of semiconductors has greatly increased due to the electronic control of automobiles and the spread of mobile devices and home information appliances, and the importance of semiconductor encapsulation, which is one of the encapsulation bodies for electric and electronic parts, has been increasing. As a semiconductor encapsulant used for encapsulating semiconductors, a tablet-shaped epoxy molding compound (EMC) is predominant. EMC is used in transfer molding methods with high productivity and has established high reliability due to its excellent physical properties such as adhesion and linear expansion coefficient. Therefore, simplification of the method of use is required.

  For this reason, conventionally, a method for manufacturing an epoxy resin composition for sealing, an electronic device, an automobile, and an electronic device has been known (for example, Patent Document 1). Further, a method of manufacturing a semiconductor device and an acrylic resin composition for semiconductor encapsulation used therein are known (for example, Patent Document 2).

JP 2014-148586 A JP 2015-2204 A

  Seal molding using a liquid epoxy resin is manufactured by a method with relatively low productivity such as compression molding and casting. Therefore, a production method with high productivity is expected.

  In Patent Document 1, the sealing epoxy resin composition is molded by a transfer molding method. As for the epoxy resin composition used for transfer molding, it is necessary to return the frozen resin composition to room temperature. When the epoxy resin composition is stored at room temperature, the fluidity is greatly reduced, and the epoxy resin composition is not completely cured during the molding time. Therefore, there are problems such as performing post-curing for several hours to obtain necessary molded article characteristics.

  Furthermore, Patent Document 1 describes (meth) acrylate resins, unsaturated polyester resins, and diallyl phthalate resins, which are radically polymerizable compounds as thermosetting resins, and specific methods for using these radically polymerizable compounds. There is no detailed description of the embodiment or the like. Further, since the curing agent is not described as a radical polymerization initiator, the radical polymerizable compound cannot be three-dimensionally crosslinked even when a (meth) acrylate resin, an unsaturated polyester resin, or a diallyl phthalate resin is used. Therefore, the curing agent described in Patent Literature 1 is limited to those capable of three-dimensionally crosslinking an epoxy resin. Therefore, Patent Document 1 is, in effect, the content of the epoxy resin composition.

  In Patent Document 2, the acrylic resin composition for semiconductor encapsulation is liquid at normal temperature. Since it is liquid at room temperature, its fluidity is very good.However, since the acrylic resin composition is liquid at room temperature, it is not sticky, workability and handling are poor, and it is used in the form of pellets and tablets at room temperature solids. It cannot be handled with a general-purpose molding machine. Further, at the time of molding by casting, air bubbles are easily left in the resin composition, so that it is difficult to control the air bubbles. In addition, in the case of using an inorganic filler, a liquid resin composition is more likely to settle when using an inorganic filler than a solid resin composition, so that there is a problem that a uniform molded article is hardly obtained.

  Therefore, an object of the present invention is to provide a crystalline radically polymerizable composition having excellent fluidity and good handleability.

  The present inventors have conducted various studies from various viewpoints on compositions containing at least a crystalline radically polymerizable compound, and as a result, have found a crystalline radically polymerizable composition for sealing electric / electronic parts of the present invention. Was.

That is, the crystalline radical polymerizable composition for sealing an electric / electronic component of the present invention comprises a crystalline radical polymerizable compound having a glass transition point and a melting point , an inorganic filler, a silane coupling agent, and radical polymerization initiation. A radically polymerizable composition for sealing electric and electronic parts , which comprises at least an agent . 23. The crystalline radically polymerizable composition is solid at 23 ° C.

In a preferred embodiment of the crystalline radical polymerizable composition for encapsulating electric and electronic parts according to the present invention, the crystalline radical polymerizable compound is a crystalline unsaturated polyester, a crystalline epoxy (meth) acrylate, a crystalline urethane. It comprises one or more selected from (meth) acrylate, crystalline polyester (meth) acrylate, crystalline polyether (meth) acrylate, crystalline radical polymerizable monomer, and crystalline radical polymerizable multimer. I do.

  In a preferred embodiment of the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, the crystalline radical polymerizable compound has a melting point in the range of 30 to 150 ° C.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, the melt viscosity of the crystalline radical polymerizable composition by a Koka type flow tester is measured at a temperature of 90 ° C. It is characterized in that the diameter is 0.5 mm, the length is 1.0 mm, and the pressure is 7 to 1000 Pa · s at a pressure of 30 kgf / cm 2, or 1 to 7 Pa · s at a pressure of 1 kgf / cm 2.

  In a preferred embodiment of the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, the inorganic filler is 50 to 95% by weight based on the total amount of the crystalline radical polymerizable composition. It is characterized by.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, the ratio of the crystalline radical polymerizable compound to the total amount of the crystalline radical polymerizable compound is 30 parts by weight or more. It is characterized by.

  In a preferred embodiment of the crystalline radically polymerizable composition for sealing electric / electronic parts of the present invention, the crystalline radically polymerizable compound has a weight average molecular weight of 100 to 100,000.

  Further, the sealed electrical and electronic component of the present invention is characterized by being sealed with the crystalline radical polymerizable composition for sealing an electrical and electronic component of the present invention.

  The granular material of the present invention is characterized by comprising the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention.

  Further, the method for producing a sealed electrical and electronic component of the present invention is characterized in that the granular material comprising the crystalline radically polymerizable composition for sealing an electrical and electronic component of the present invention is subjected to an injection molding method, an insert molding method by a transfer molding method. The method includes a step of sealing the electric / electronic component.

  ADVANTAGE OF THE INVENTION According to the crystalline radical polymerizable composition for electric / electronic component sealing of this invention, the effect excellent in handleability is exhibited. Furthermore, according to the method for manufacturing a sealed electrical and electronic component of the present invention, the crystalline radical polymerizable composition has an extremely low viscosity when heated and melted during injection molding and transfer molding. This has an advantageous effect that fluidity required for sealing can be secured.

  Further, according to the present invention, it is possible to provide a sealed electrical and electronic component sealed with the crystalline radical polymerizable composition for sealing an electrical and electronic component.

  Further, a method for manufacturing a sealed electrical and electronic component, which comprises a step of sealing the electrical and electronic component by insert molding a granular material, a powder, and a tablet comprising the crystalline radical polymerizable composition for sealing an electrical and electronic component according to the present invention. Can be provided.

  The crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention is characterized by containing at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. . This is because the use of the crystalline radically polymerizable composition makes it possible to realize a polymerizable composition having excellent fluidity and excellent handling as shown in Examples described later. In addition, in this specification, the crystalline radical polymerizable composition for sealing electric / electronic parts may be referred to as a crystalline radical polymerizable composition.

  In a preferred embodiment of the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention, the crystalline radical polymerizable compound is an unsaturated polyester, an epoxy (meth) acrylate, a urethane (meth) acrylate, a polyester. It is characterized by containing one or more selected from (meth) acrylate, polyether (meth) acrylate, radical polymerizable monomer, and radical polymerizable multimer.

  Although the crystallinity is omitted, specifically, the crystalline radical polymerizable compound is a crystalline unsaturated polyester, a crystalline epoxy (meth) acrylate, a crystalline urethane (meth) acrylate, a crystalline polyester (meth) ) One or more selected from acrylates, crystalline polyether (meth) acrylates, crystalline radically polymerizable monomers, and crystalline radically polymerizable multimers can be included. When these polymerizable compounds are used, the mechanical properties and handleability are improved (the crystallinity may be omitted in the following).

  In this specification, a crystalline compound can be a compound having a glass transition point and a melting point. These temperatures can be confirmed by a thermal analyzer such as DSC (differential scanning calorimeter) and TGDTA (differential thermogravimetric analyzer). The crystalline compound in the present invention can be a compound whose melting point can be confirmed by a thermal analyzer.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing an electric / electronic part of the present invention, the crystalline radical polymerizable compound is, from the viewpoint of workability and moldability, the crystalline radical polymerizable compound. It has a melting point of 30 to 150 ° C, more preferably 30 to 120 ° C, and still more preferably 30 to 100 ° C. A crystalline radical polymerizable compound having a melting point in the range of 30 to 150 ° C. as compared with a case where a crystalline radical polymerizable compound having a melting point of less than 30 ° C. or a crystalline radical polymerizable compound having a melting point higher than 150 ° C. is used. This is because better handling properties can be realized by using a compound. When the melting point of the crystalline radically polymerizable compound is lower than the above range, the crystalline radically polymerizable composition tends to be liquid at normal temperature, and thus the crystalline radically polymerizable composition may not be able to maintain a solid. If the melting point of the crystalline radical polymerizable compound is higher than the above range, the temperature is close to the molding temperature of the mold, so that the time from the start of the flow to the curing is short, and molding failure may occur.

  When only a crystalline radically polymerizable compound having a melting point of less than 30 ° C. is used, a solid crystalline radically polymerizable composition tends to hardly form at 23 ° C. On the other hand, when only the crystalline radical polymerizable compound having a melting point higher than 150 ° C. is used, when plasticizing the crystalline radical polymerizable composition in the cylinder in the injection molding method, the cylinder temperature and the mold temperature are reduced. Because of their close proximity, they tend to have poor stability in the cylinder.

  In a preferred embodiment of the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention, the crystalline radical polymerizable composition is heated at 23 ° C. from the viewpoint of handleability of the crystalline radical polymerizable compound. It is characterized by being solid. The above range is set because the shape of the crystalline radical polymerizable composition does not change under the production, molding, and transportation environment, and thus continuous production can be performed with general-purpose production equipment and conditions. In addition, a solid can be a material whose shape and volume are not easily changed by an external force.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention, from the viewpoint of fluidity, the melt viscosity of the crystalline radical polymerizable composition by a Koka type flow tester is measured at a temperature. 90 ° C., die diameter 0.5 mm, length 1.0 mm, pressure 30 kgf / cm 2 7 to 1000 Pa · s, or pressure 1 kgf / cm 2 1 to 7 Pa · s, more preferably 1 to 100 Pa · s In the range. If the melt viscosity of the crystalline radically polymerizable composition is lower than the above range, many thin burrs are generated and the burrs are difficult to peel off from the mold, and further, continuous molding is difficult because the composition enters the gaps of the mold. When the melt viscosity is higher than the above range, the filling property is poor at the time of molding, and a product may not be obtained.

  In a preferred embodiment of the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, from the viewpoint of product quality, the inorganic filler is 50 to 50% based on the total amount of the crystalline radical polymerizable composition. It is 95% by weight, more preferably 55 to 93% by weight, and still more preferably 60 to 90% by weight. When the amount of the inorganic filler is less than the above range, the molded product is deformed with a large shrinkage when the amount of the inorganic filler is less than the above range, and when the amount is larger than the above range, a load is applied to the insert having a high melt viscosity during molding, This is because the insert may be damaged.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic parts of the present invention, from the viewpoint of maintaining a solid, the ratio of the crystalline radical polymerizable compound to the total amount of the crystalline radical polymerizable compound, It is 30 parts by weight or more, more preferably 40 parts by weight or more, and still more preferably 50 parts by weight or more. The reason for setting the above range is that when the ratio of the crystalline radically polymerizable compound is smaller than the above range, there is a possibility that it is difficult to become a solid.

  Further, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic parts of the present invention, from the viewpoint of quality control of the crystalline radical polymerizable composition, the weight average molecular weight of the crystalline radical polymerizable compound is preferably , 100 to 100,000, more preferably 100 to 50,000, and still more preferably 150 to 30,000. When the weight average molecular weight of the crystalline radical polymerizable compound is smaller than the above range, the crystalline radical polymerizable composition is less likely to be solid, and when the weight average molecular weight is larger than the above range, the crystalline radical polymerizable compound is larger than the above range. This is because the molecular weight of the composition cannot be controlled with high accuracy, so that the compound characteristics and the composition characteristics may fluctuate.

  Further, the sealed electrical and electronic component of the present invention is characterized by being sealed with the crystalline radical polymerizable composition for sealing an electrical and electronic component of the present invention.

  The granular material of the present invention is characterized by comprising the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention. Although a granular material is used, the present invention may be a powder, a tablet, or the like, in addition to the granular material. That is, in the case other than the particulate matter, the powder, the tablet, and the like of the present invention can be composed of the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention.

  Further, the method for producing a sealed electrical and electronic component of the present invention is characterized in that the granular material comprising the crystalline radically polymerizable composition for sealing an electrical and electronic component of the present invention is subjected to an injection molding method, an insert molding method by a transfer molding method. The method includes a step of sealing the electric / electronic component.

  The sealed body for electric and electronic parts is a sealed body including an insert. The sealed body for electric and electronic parts is a molded body in which a capacitor, an integrated circuit, and the like are bonded to a substrate and covers them integrally. The electric / electronic component bonded to the substrate may be damaged by the flow pressure of injection molding or transfer molding using a high-viscosity molding material. In the present invention, the electric / electronic component can include a semiconductor and the like in addition to the so-called electric / electronic component. Therefore, these sealed bodies for electric / electronic parts can be used also for semiconductor sealed bodies. In short, the composition of the present invention can be widely applied to a sealed body requiring handleability, fluidity, and the like.

  A composition having a low melt viscosity and good flowability is soft even at room temperature, and thus may have a problem in handling properties. In addition, in the injection molding method, the composition fusing occurs in the hopper, and in the transfer molding method, the preformed tablet is fused, and further, the shape of the tablet changes in the transfer molding machine due to the soft composition becoming a lump. There is a possibility that a problem that the insertion hole cannot be inserted may occur. The present invention has an excellent effect of having high productivity by achieving both fluidity and handleability.

<Method for producing unsaturated polyester>
The unsaturated polyester used in the present invention is, for example, an unsaturated polybasic acid, a saturated polybasic acid and a glycol which are subjected to a known dehydration condensation reaction, and usually have an acid value of 2 to 40 mg-KOH / g. Can be provided. In the production of unsaturated polyesters, the unsaturated polybasic acids, the unsaturated polybasic acids, and the selection and combination of the acid components, and the selection and combination of the glycols, the unsaturated ratio having crystallinity by appropriately selecting the compounding ratio thereof, etc. It can be polyester.

  Unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, glutaconic acid and the like.

  Saturated polybasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, hed. Acid and tetrabromophthalic anhydride.

  Glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, propylene glycol, diethylene glycol, and triethylene glycol. , Dipropylene glycol, neopentyl glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexane dimethanol, dibromoneopentyl glycol, and the like.

  In the present invention, among the crystalline unsaturated polyesters, fumaric acid is used as an unsaturated polybasic acid, isophthalic acid or terephthalic acid is used as a saturated polybasic acid, and ethylene glycol and 1,3-propanediol are used as glycol as main components. Unsaturated polyesters using 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, and cyclohexanedimethanol are preferred.

<Production method of epoxy (meth) acrylate>
The epoxy (meth) acrylate used in the present invention can be produced by a method known per se. An epoxy resin having crystallinity by appropriately selecting an epoxy resin and an unsaturated monobasic acid in the presence or absence of a known inhibitor and a known esterification catalyst, in an inert gas stream or in an air atmosphere, (Meth) epoxy acrylate. If necessary, for the purpose of lowering the melt viscosity of the reaction system, the reaction can be carried out by adding another radical polymerizable monomer or an organic solvent.

  The epoxy (meth) acrylate in the present invention is, for example, an acrylate or methacrylate at the molecular terminal obtained by subjecting an epoxy resin having two or more glycidyl ether groups in one molecule to an addition reaction of acrylic acid or methacrylic acid. An epoxy (meth) acrylate having a double bond can be used. An epoxy (meth) acrylate resin in which epoxy (meth) acrylate is dissolved in a radical polymerizable monomer and / or a radical polymerizable polymer may be used. Examples of the epoxy resin having two or more glycidyl ether groups in one molecule include bisphenol A, bisphenol F, bisphenol S, and the like, or a bisphenol-type epoxy resin derived from these derivatives, bixylenol, and bixylenol from the derivatives thereof. Epoxy resins, biphenol-type epoxy resins from biphenol and its derivatives, or naphthalene-type epoxy resins from naphthalene and its derivatives, and epoxy resins such as novolak-type epoxy resins. These may be used alone or in combination of two or more. Can be used in combination. The epoxy equivalent which is a measure of the molecular weight of the epoxy resin is preferably 174 to 2000 eq / g.

<Production method of urethane (meth) acrylate>
In addition, the urethane (meth) acrylate in the present invention is, for example, a molecular end obtained by reacting a polyalcohol and / or a polyester polyol and / or a polyether polyol having two or more hydroxyl groups in one molecule with a diisocyanate. Reacting isocyanate and / or one or more isocyanates in one molecule with a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups, or first reacting an alcoholic hydroxyl group with one or more acrylate or methacrylate groups A compound having a group and a diisocyanate are reacted so that the isocyanate group remains, and the remaining isocyanate group and a polyalcohol and / or polyester polyol having two or more hydroxyl groups in one molecule and / or A urethane acrylate having a double bond of acrylate or methacrylate at the molecular terminal obtained by reacting with polyether polyol can be used. In the production of urethane (meth) acrylate, a combination of an isocyanate, a polyalcohol and / or a polyester polyol and / or a polyether polyol, and a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups are appropriately selected. Thus, a urethane (meth) epoxy acrylate having crystallinity can be obtained. A urethane (meth) acrylate resin in which urethane acrylate or urethane methacrylate is dissolved in a radical polymerizable monomer such as styrene or diethylene glycol dimethacrylate and / or a radical polymerizable polymer may be used. These can be used alone or in a mixture of two or more.

  Compounds having the alcoholic hydroxyl group and one or more acrylate or methacrylate groups include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and phenoxyhydroxypropyl (meth). ) Acrylate, trimethylolpropane di (meth) acrylate, dipropylene glycol mono (meth) acrylate and the like can be used.

  Examples of the polyalcohol having two or more hydroxyl groups in one molecule include neopentyl glycol, ethylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, propylene Glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, etc., the polyester polyol having two or more hydroxyl groups in one molecule, Neopentyl glycol, d Polyalcohols such as lene glycol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, and adipic acid, (phthalic anhydride) phthalic acid, and isophthalic acid Acid, terephthalic acid, saturated polyester polyol having a molecular weight of 1,000 to 2,000 obtained from a dehydration condensation reaction with a polybasic acid such as trimellitic acid, and polyether polyols having two or more hydroxyl groups in one molecule include ethylene oxide Alternatively, polyethylene glycol having a molecular weight of 300 to 2,000 obtained by a ring-opening reaction of propylene oxide, polypropylene glycols or polycaprolact obtained by a ring-opening reaction of caprolactone Etc., can be used in combination alone, or two or more kinds.

  As the compound having two or more isocyanate groups in one molecule, an aromatic and / or aliphatic polyisocyanate compound is used. For example, tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,6-hexaene Examples include methylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, trifunctional isocyanate having an isocyanurate ring obtained by trimerizing a difunctional isocyanate compound, and a commercially available isocyanate prepolymer modified with a polyol. Can be. These can be used alone or in combination of two or more.

<Production method of polyester (meth) acrylate>
Further, the polyester (meth) acrylate in the present invention is, for example, at the molecular terminal obtained by esterification of polyester polyol with acrylic acid or methacrylic acid, or reaction of acid-terminated polyester with acrylate or methacrylate having a glycidyl group. It can be a polyester acrylate having an acrylate or methacrylate double bond, or a polyester methacrylate. In the production of polyester (meth) acrylate, a polyester (meth) acrylate having crystallinity can be obtained by appropriately selecting a polyester polyol and acrylic acid or methacrylic acid, or an acid-terminated polyester and an acrylate or methacrylate having a glycidyl group. . A polyester acrylate resin or a polyester methacrylate resin in which polyester acrylate or polyester methacrylate is dissolved in a radical polymerizable monomer such as styrene or diethylene glycol dimethacrylate and / or a radical polymerizable multimer may be used. These can be used alone or in a mixture of two or more.

<Method for producing polyether (meth) acrylate>
The polyether (meth) acrylate in the present invention is obtained by, for example, esterification of a polyether polyol with acrylic acid or methacrylic acid, or reaction of an acid-terminated polyether with an acrylate or methacrylate having a glycidyl group. It can be polyether acrylate or polyether methacrylate having an acrylate or methacrylate double bond at the end of the molecule. In the production of polyether (meth) acrylate, a polyester (meth) acrylate having crystallinity can be obtained by appropriately selecting polyether polyol and acrylic acid or methacrylic acid, or acid-terminated polyester and acrylate or methacrylate having a glycidyl group. Can be done. A polyether acrylate resin or a polyether methacrylate resin in which polyether acrylate or polyether methacrylate is dissolved in a radical polymerizable monomer such as styrene or diethylene glycol dimethacrylate and / or a radical polymerizable multimer may be used. These can be used alone or in a mixture of two or more.

  In a preferred embodiment, the crystalline radical polymerizable monomer that is solid at 30 to 150 ° C. in the present invention is ethoxylated isocyanuric acid triacrylate (melting point: about 50 ° C.), polyethylene glycol di (meth) acrylate (melting point: 35 to 53 ° C.), methoxypolyethylene glycol (meth) acrylate (melting point 33 to 40 ° C.), behenyl acrylate (melting point 46 ° C.), tetramethylpiperidinyl methacrylate (melting point 56 to 60 ° C.), trimethalyl isocyanurate (melting point 83 to 87 C), diacetone acrylamide (melting point about 56 ° C), dimethyl itaconate (melting point 36 ° C), vinyl stearate (melting point 36 ° C), N-vinyl carbazole (melting point 67 ° C), N-methylol acrylamide (melting point 71 to 75 ° C), acrylamide (melting point 84) ), Tolylene allyl carbamate (melting point 85 to 110 ° C.), maleimide (mp 93 ° C.), can comprise one or more selected from such acenaphthylene (melting point 95 ° C.). Use of these crystalline radically polymerizable compounds improves the handleability.

  As the radical polymerizable monomer in the present invention, a radical polymerizable monomer that is liquid at room temperature can be used as long as the object of the present invention is not impaired. For example, styrene monomers having a vinyl group, vinyl aromatic compounds such as α-methylstyrene, vinyltoluene and α-chlorostyrene; vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, and veova monomers (manufactured by Shell Chemical Co., Ltd.) Vinyl esters; (meth) acrylates such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, and n-butyl methacrylate;

  Bifunctional such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyl tetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate, diallyl phthalate having an allyl group, and triallyl isocyanurate. The above radical polymerizable monomers can be used. These radical polymerizable monomers may be used alone or in combination of two or more.

  As the radical polymerizable multimer in the present invention, a diallyl phthalate prepolymer, a tyke prepolymer, an epoxy prepolymer, a urethane prepolymer, or an acrylate prepolymer can be used. These radical polymerizable multimers may be used alone or in combination of two or more.

  In the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention, an inorganic filler can be blended. Examples of the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, magnesium oxide, alumina, silica, zinc oxide, mica, aluminum nitride, and boron nitride. Among them, silica is preferable from the viewpoint of fluidity. These may be used alone or in combination of two or more.

  As the inorganic filler, those having an average particle diameter of 100 μm or less, preferably 0.01 to 50 μm can be used. By using the inorganic filler having the above average particle diameter, it is possible to obtain a crystalline radical polymerizable composition for sealing electric and electronic parts, which has excellent fluidity and strength during molding.

  In the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, various additives that adhere to the inorganic filler and the reinforcing material, for example, a (meth) acrylate compound having a polar group and a coupling agent are blended. Can be done.

  The (meth) acrylate compound having a polar group is not particularly limited, and examples thereof include a (meth) acrylate compound in which a substituent containing an atom other than carbon and hydrogen is ester-bonded. Group, glycidyl ether group, tetrahydrofurfuryl group, isocyanate group, carboxyl group, alkoxysilyl group, phosphate group, lactone group, oxetane group, tetrahydropyranyl group, amino group and the like. The coupling agent is not particularly limited. For example, a silane coupling agent or a titanate coupling agent can be used. Examples of the silane coupling agent include epoxy silane, amino silane, and cationic silane. Systems, vinyl silane systems, acryl silane systems, mercapto silane systems, and composite systems thereof.

  Among these, an acrylic silane coupling agent is preferred from the viewpoint of improving strength. In addition, any additives can be used as long as the object of the present invention is not impaired.

  In the crystalline radical polymerizable composition for sealing electrical and electronic parts of the present invention, as a radical polymerization initiator, usually an unsaturated polyester resin composition, a heat-decomposable organic peroxide used in the radical polymerizable composition, A polymerization inhibitor can be used.

  Examples of the organic peroxide include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di (t-hexylperoxy) cyclohexane, and 1,1-di (t-butylperoxy) -3,3,3. Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctoate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used alone or in combination of two or more.

  Among these, from the viewpoints of molding conditions and storage stability, it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100 ° C. or more, and specifically, dicumyl peroxide can be suitably used.

  Examples of the polymerization inhibitor include quinones such as hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, parabenzoquinone, and pyrogallol, and 2,6-di-t-. Phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis- (4-methyl-6-t-butylphenol), and 1,1,3-tris (2-methyl-4-hydroxy-5-t-butylphenyl) butane; -Hydroxy-2,2,6,6-tetramethylpiperidine 1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6- Tetramethylpiperidine-1-oxyl, 4-carboxy-2, , Mention may be made of 6,6-tetramethylpiperidine-1-oxyl, a 1-oxyl such as 2,2,6,6-tetramethylpiperidine-1-oxyl. By using these, thickening during filling during molding can be suppressed, and a radically polymerizable composition having a low melt viscosity can be obtained. These may be used alone or in combination of two or more.

  In the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, a reinforcing material can be blended. By using the reinforcing material, a crystalline radical polymerizable composition for sealing electric and electronic parts having excellent strength properties and dimensional stability can be obtained.

  As the reinforcing material used in the present invention, glass fibers used for fiber reinforced plastics such as BMC (bulk molding compound) and SMC (sheet molding compound) are usually used, but are limited to glass fibers. Instead, other materials can be used.

  As glass fibers, silicate glass and borosilicate glass as raw materials, E glass (alkali-free glass for electric use), C glass (alkali-containing glass for chemical use), A glass (glass for acid resistance), S glass (high-strength glass) Glass fibers such as long fibers (roving), short fibers (chopped strands), and milled fibers can be used. Further, these glass fibers may be subjected to a surface treatment.

  In addition, in the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, other inorganic fillers are appropriately blended within a range that does not impair the fluidity of the composition and the characteristics as a sealing material. can do.

  These include oxides and hydrates thereof, inorganic expanded particles, hollow particles such as silica balloons, and the like.

  In the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention, a release agent can be used. As the release agent, waxes such as fatty acid type, fatty acid metal salt type, and mineral type generally used for thermosetting resins can be used. In particular, fatty acid type having excellent heat discoloration resistance, fatty acid metal salt type, And waxes can be suitably used.

  Specific examples of these release agents include stearic acid, zinc stearate, aluminum stearate, calcium stearate, and paraffin wax. These release agents may be used alone or in combination of two or more.

  As the release agent, an external release agent such as a mold release agent which is sprayed or applied to a mold as needed, or a molding material containing the release agent may be used.

  In the present invention, in addition to these components, a curing catalyst, a polymerization inhibitor, a colorant, a thickener, a wet dispersant, a surface dispersant, a surface modifier, a curing catalyst for adjusting the curing conditions of the crystalline radically polymerizable composition. A tackifier, a flow modifier, other organic additives, inorganic additives, and the like can be appropriately compounded as needed.

<Method for producing crystalline radical polymerizable composition>
The crystalline radical polymerizable composition for encapsulating electric and electronic parts of the present invention is prepared by blending the respective components and mixing them sufficiently uniformly using a mixer, a blender or the like, and then a kneading machine or an extruder capable of heating and pressing. And granulated.

  Further, the granules, powders and tablets of the present invention are characterized by comprising the crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention. The granular material comprising the crystalline radical polymerizable composition for sealing electric / electronic parts of the present invention may be in the form of pellets.

  Further, the sealed electrical and electronic component of the present invention is characterized in that a granular material, a powder, and a tablet comprising the crystalline radically polymerizable composition for sealing an electrical and electronic component of the present invention are molded and sealed. The sealed electric / electronic component can be molded by a conventional method using various thermosetting composition molding methods.

  The crystalline radically polymerizable composition for encapsulating electric and electronic parts of the present invention is dry and has good thermal stability upon melting. Therefore, the molding methods include injection molding, injection compression molding, and transfer molding. And a melt heat molding method such as a compression molding method.

  Of these, the injection molding method using an injection molding machine and the transfer molding method using a transfer molding machine are particularly suitable, and the molding time is shorter by the injection molding method, and the molded articles are molded at once by the transfer molding method. As a result, a sealed electrical and electronic component having a complicated shape can be manufactured.

<Electrical and electronic component sealed body and method for manufacturing electrical and electronic component sealed body>
The sealed electrical and electronic component of the present invention can be manufactured by sealing the electrical and electronic component by insert molding using the crystalline radical polymerizable composition for sealing an electrical and electronic component of the present invention. Here, the crystalline radical polymerizable composition for encapsulating electric and electronic parts of the present invention may be one of the constituent components even if all the components constituting the crystalline radical polymerizable composition are separately heated and kneaded in advance. A part or all of them may be mixed and heated and kneaded immediately before injection into the mold.

  The temperature and pressure of the crystalline radically polymerizable composition during mold injection are not particularly limited, but when an injection molding machine is used, the temperature of the crystalline radically polymerizable composition is 60 to 130 ° C, and the mold temperature is 130 to 190. C. and a pressure of the crystalline radical polymerizable composition of 0.1 to 10 MPa, and a mold temperature of 130 to 190 ° C. in the transfer molding machine and a pressure of the crystalline radical polymerizable composition of 0.1 to 10 MPa. It is preferable because damage is reduced.

  Hereinafter, one embodiment of the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

<Production example of radical polymerizable composition for sealing electric / electronic parts>
Examples 1 to 11, Reference Example 1, and Comparative Examples 1 and 2
The crystalline or amorphous radical polymerizable compositions of Examples 1 to 11, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 2 were added to the amounts shown in Tables 2 and 3 below. After the mixture was uniformly prepared using a kneader capable of heating and cooling under pressure, the preparation was put into an extruder and hot-cut to obtain granules. Some of the granular and bulk radical polymerizable compositions were made into powder using a pulverizer.

  The obtained radical polymerizable composition and the like were processed by a hydraulic molding machine (manufactured by Toho Press Co., Ltd.) until the mold temperature was 165 ° C. and the curing time was 180 seconds or a time when a test piece could be obtained, to produce a test piece. Physical properties of the molded test pieces were evaluated by the methods described below, and the results are shown in Tables 2 and 3, respectively.

The following ingredients were used.
(1) Polymerizable compound Crystalline radical polymerizable compound 1: phthalic acid-based unsaturated polyester (condensate of terephthalic acid, fumaric acid and 1,6-hexanediol)
2. Crystalline radical polymerizable compound 2: urethane methacrylate (2-hydroxyethyl methacrylate adduct of 1,6-hexamethylene diisocyanate)
3. Crystalline radical polymerizable compound 3: urethane acrylate (2-hydroxyethyl acrylate adduct of 1,6-hexamethylene diisocyanate)
4. Crystalline radical polymerizable monomer 1: ethoxylated isocyanuric acid triacrylate (A-9300, manufactured by Shin-Nakamura Chemical Co., Ltd.)
5. Amorphous radical polymerizable compound 1: phthalic acid-based unsaturated polyester (Yupika 8552H manufactured by Nippon Yupika Co., Ltd.)
6. Amorphous radically polymerizable compound 2: bisphenol A epoxy methacrylate (methacrylic acid adduct of bisphenol A epoxy resin)
7. Radical polymerizable monomer 1: diallyl phthalate monomer (Dye Sodap monomer manufactured by Osaka Soda Co., Ltd.)
8. Radical polymerizable monomer 2: diethylene glycol dimethacrylate (2G manufactured by Shin-Nakamura Chemical Co., Ltd.)

(2) Inorganic filler Inorganic filler 1: Fused silica (average particle diameter 24 μm, manufactured by Denka Corporation)
2. Inorganic filler 2: calcium carbonate (average particle size 2 μm, manufactured by Nitto Powder Co., Ltd.)

(3) Additives Silane coupling agent: methacrylic silane (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.)
2. Radical polymerization initiator: dicumyl peroxide (Park Mill D manufactured by NOF Corporation)
3. Release agent: zinc stearate (GF-200 manufactured by NOF Corporation)
4. Polymerization inhibitor: Perabenzoquinone (PBQ manufactured by Seiko Chemical Co., Ltd.)
5. Colorant: carbon black (CB40 manufactured by Mitsubishi Chemical Corporation)

<Polymerizable compound properties>
The melting point and weight average molecular weight of the crystalline or non-crystalline radical polymerizable compound and the radical polymerizable monomer were measured and are shown in Table 1.

<Compound characteristics, composition characteristics, physical property evaluation methods>

(1) Melting point 10 mg of a measurement sample was placed in an aluminum pan using a differential scanning calorimeter “DSC6220” (manufactured by Seiko Instruments Inc.), and the radical polymerizable compound shown in Table 1 was sealed by pressing a lid. The temperature was measured from -60 ° C to 200 ° C at a rate of 10 ° C / min. The endothermic peak of the obtained curve was defined as the melting point. Table 1 shows the results. Measurements were stopped for compounds that were liquid at 23 ° C.

(2) Weight average molecular weight The weight average molecular weight of the radical polymerizable compound shown in Table 1 was determined by dissolving the polymerizable compound in tetrahydrofuran (THF) at 1.0% by weight, and using polystyrene by GPC (gel permeation chromatography). It was measured by conversion. The measurement conditions are shown below. Table 1 shows the results. However, even if the strict standards are not cleared, the weight average molecular weight may be less than 100 or more than 100,000 depending on the desired application and required quality, etc. It is good.
Equipment: Showex GPC-101, Showa Denko KK
Column: KF-802, 803, 804, 805 manufactured by Showa Denko KK
Solvent, carrier liquid: THF
Flow rate: 1.0 ml / min Sample concentration: 1.0%
Temperature: 40 ° C
Sample injection volume: 200 μl
Detector: Differential refractive index detector

(3) Hardness The measuring method referred to JIS K7215. The hardness of the crystalline or amorphous radically polymerizable composition of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 3 was measured with a durometer (Nishi Tokyo Seimitsu Co., Ltd. WR- 105D). The radically polymerizable composition adjusted to 90 ° C. was formed into a flat plate of about 100 mm × 100 mm × 10 mm and solidified by cooling in a constant temperature room at 23 ° C. The uncured radically polymerizable composition adjusted to 23 ° C. was placed on a horizontal hard table. While keeping the durometer's pressure reference plane parallel to the radically polymerizable composition surface, without impact, press the durometer against the radically polymerizable composition surface as quickly as possible, and pressurize the pressure reference plane and the radically polymerizable composition. Well adhered. The maximum indicated value of the pointer of the indicating device was quickly read within one second. The results are shown in Tables 2 and 3. The target hardness was 10, 20 or more excellent, 10 or more good, and less than 10 acceptable.

(4) Melt Viscosity The crystalline or amorphous radical polymerizable compositions of Examples 1 to 11, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 2 were converted to a Koka type flow tester ((Co. ) The melt viscosity was measured by Shimadzu Corporation CFT-100EX). A die having a diameter of 0.5 mm and a length of 1 mm was placed in a cylinder sample insertion hole heated to 90 ° C., and the prepolymer was heated for 240 seconds. After preheating for 240 seconds, a piston was applied at a pressure of 30 kgf / cm 2 or 1 kgf / cm 2. Then, the radical polymerizable composition was caused to flow out of the nozzle of the die, and the melt viscosity was determined from a portion having good linearity. The results are shown in Tables 2 and 3. The target melt viscosity was 1 to 1000 Pa · s, and the composition which was 1 to 100 Pa · s was excellent, and 100 to 1000 Pa · s was good.

(5) Flow length The measurement method referred to EIMS T-901. Using the crystalline or amorphous radically polymerizable composition of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 3, an auxiliary ram equipped with a spiral flow mold The flow length was measured with a transfer molding machine. The spiral flow mold was heated to 165 ° C. The spiral flow mold used was a mold having a material injection port at the center and a semicircular spiral curve with a radius of 1.6 mm starting from the injection port. A predetermined amount of the radical polymerizable composition was weighed out so that the thickness of the cull was in the range of 1 to 10 mm. The plunger was raised, the radically polymerizable composition was charged into the pot, and a pressure of 3.2 MPa was immediately applied to start transfer molding. The movement of the plunger stopped, and after 180 seconds from the start of the measurement, the mold was opened and the molded product was taken out. The number was read by adding the length to the glossy portion at the tip of the molded product or the length of the glossy portion plus 1/2 of the length of the lower density portion. The results are shown in Tables 2 and 3. The target flow length was 50 cm, 100 cm or more was excellent, 50 cm or more was good, and less than 50 cm was acceptable. However, even if the strict standard is not satisfied, the condition may be satisfied even if less than 50 cm depending on a desired use, required quality, and the like. Therefore, it may be considered as one guide.

(6) Molding shrinkage The measuring method was based on JIS K 6911. Using the crystalline or amorphous radically polymerizable compositions of Examples 1 to 11, Reference Example 1, and Comparative Examples 1 and 2 shown in Table 2, compression using a mold for measuring shrinkage was performed. A test piece was prepared by molding. The radically polymerizable composition was placed in a mold controlled at 165 ° C., and heated under pressure for 3 minutes. The test piece was immediately taken out of the mold and stored at 23 ° C. and a constant humidity of 55% RH for 24 hours. The external shape of the annular band protruding from the front and back of the test piece was measured along two measurement lines perpendicular to each other, measuring two locations on the front surface and two locations on the back surface, for a total of four dimensions. The outer shape of the groove of the mold corresponding to the test piece was measured to 0.01 mm under the same conditions, and the molding shrinkage was calculated. The results are shown in Tables 2 and 3. The target molding shrinkage rate was 0.5%, and 0.2% or less was excellent, 0.2 to 0.5% or less was good, and the case where it exceeded 0.5% was acceptable. However, even if the above strict standards are not met, depending on the desired application, required quality, etc., the condition may be satisfied even if it exceeds 0.5%, so it should be considered as one guide. It is.

(7) Glass transition point The measurement was based on JIS K 7224-4. The crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 3 were placed in a mold for a flat plate whose temperature was controlled at 165 ° C. Was. The mold was immediately closed and pressurized and heated. After curing, the mold was opened to obtain a flat molded piece. A test piece for measuring a glass transition point was obtained by cutting a flat shaped piece into a strip shape. Dynamic viscoelasticity (RSA-G2 manufactured by TA Instruments Co., Ltd.) was measured at a heating rate of 2 ° C./min, in the range of 30 to 250 ° C., and at a frequency of 10 Hz. The Tan δ peak temperature was taken as the glass transition point. The results are shown in Tables 2 and 3. The target glass transition point was set to 125 ° C., 125 ° C. or more was good, and less than 125 ° C. was acceptable. However, even if the strict standard is not satisfied, the condition may be satisfied even at less than 125 ° C. depending on a desired use, required quality, and the like.

<Evaluation results>
As shown in Tables 2 and 3, it was found that the crystalline radically polymerizable composition for sealing electric / electronic parts in the present invention was excellent in handleability. Further, in particular, Examples 1 to 8 and 11 of the crystalline radical polymerizable composition for sealing electric / electronic parts according to the present invention were excellent in handleability since they were solid at 23 ° C., and had a low melt viscosity. . It has been found that the crystalline radical polymerizable composition for sealing electric and electronic parts in the present invention shows excellent results overall.

  Example 9 is a crystalline radical polymerizable composition of Example 1 having a different blending amount of the inorganic filler. The composition had a hardness of 3 and was soft. Further, the composition had a melt viscosity of 0.5 Pa · s and a low viscosity. The composition had a large molding shrinkage, but had other good properties.

  Example 10 is a crystalline radical polymerizable composition obtained by changing the crystalline radical polymerizable compound of Example 5 to a room temperature liquid radical polymerizable compound and changing the mixing ratio of the radical polymerizable compound. Since the amount of the crystalline radical polymerizable compound was small, the hardness of the composition was 0 and soft, and the glass transition point was low. However, the other properties were good.

  Reference Example 1 is a crystalline radically polymerizable composition of Example 8 in which the amount of the inorganic filler was changed. The melting start temperature was not observed because the flow stopped during the measurement. In addition, the melt viscosity was high and the flow length was short, but other characteristics were good.

  Therefore, even in Examples 9 and 10 and Reference Example 1, conditions may be satisfied depending on a desired use, required quality, and the like. It turned out to be applicable to the required application.

  In addition, both Comparative Examples 1 and 2 had higher melt viscosities than Comparative Example 1 (Comparative Example 1 could be compared with Example 4), resulting in inferior handleability and the like.

  As described above, it has been found that the crystalline radically polymerizable composition for sealing electric and electronic parts containing at least the crystalline radically polymerizable compound has excellent handling properties and good fluidity.

  The crystalline radical polymerizable composition for sealing electric and electronic parts of the present invention and the sealed electric and electronic parts using the same have a high glass transition point and excellent heat resistance. It is possible to improve the durability of electrical and electronic components such as a connector, a harness, a sealed semiconductor or electronic component, a switch having a printed board, a sensor, and the like, and a sealed electrical and electronic component.

Claims (10)

A crystalline radical polymerizable composition for sealing electric and electronic parts, comprising at least a crystalline radical polymerizable compound having a glass transition point and a melting point , an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The crystalline radical polymerizable composition for sealing electric and electronic parts , wherein the crystalline radical polymerizable composition is solid at 23 ° C. The crystalline radically polymerizable compound includes a crystalline unsaturated polyester, a crystalline epoxy (meth) acrylate, a crystalline urethane (meth) acrylate, a crystalline polyester (meth) acrylate, a crystalline polyether (meth) acrylate, a crystalline radically polymerizable monomers, crystalline radical polymerizable claim 1 electrical and electronic components for encapsulating crystalline radically polymerizable composition, wherein it contains one or more selected from multimers.   3. The crystalline radical polymerizable composition for sealing electric and electronic parts according to claim 1, wherein the crystalline radical polymerizable compound has a melting point in a range of 30 to 150 ° C. 4. The melt viscosity of the crystalline radical polymerizable composition by a Koka type flow tester is measured at a temperature of 90 ° C., a die diameter of 0.5 mm and a length of 1.0 mm, and a pressure of 30 kgf / cm 2 at 7 to 1000 Pa · s, or The crystalline radical polymerizable composition for sealing electrical and electronic parts according to any one of claims 1 to 3 , wherein the pressure is 1 to 7 Pa · s at a pressure of 1 kgf / cm2. The said inorganic filler is 50 to 95 weight% with respect to the said crystalline radical polymerizable composition whole quantity, The crystal | crystallization for electric / electronic component sealing as described in any one of Claims 1-4 characterized by the above-mentioned. Radical polymerizable composition. The ratio of the crystalline radically polymerizable compound to the total amount of the crystalline radically polymerizable compound is 30 parts by weight or more, and the crystal for sealing electric and electronic parts according to any one of claims 1 to 5. Radical polymerizable composition. The weight average molecular weight of the said crystalline radically polymerizable compound is 100-100,000, The crystalline radically polymerizable composition for electric / electronic component sealing of any one of Claims 1-6 characterized by the above-mentioned. An encapsulated electrical and electronic component sealed with the crystalline radically polymerizable composition for sealing an electrical and electronic component according to claim 1 . A granular material comprising the crystalline radical polymerizable composition for sealing electric / electronic parts according to claim 1 . 10. An electric / electronic component encapsulating method comprising the steps of: encapsulating the electric / electronic component by insert molding by injection molding or transfer molding of the granular material comprising the crystalline radical polymerizable composition for electric / electronic component encapsulation according to claim 9. A method for manufacturing a stationary body.