JP2020094208A - Crystalline radical-polymerizable composition for electric and electronic components, molded body for electric and electronic components using the composition and method for producing the molded body - Google Patents

Abstract

To provide a crystalline radical-polymerizable composition having excellent flowability and good handleability.SOLUTION: The crystalline radical-polymerizable composition for electric and electronic components includes at least a crystalline radical-polymerizable compound having a glass transition point and a melting point, an inorganic filler, a silane coupling agent and a radical polymerization initiator in which the crystalline radical-polymerizable composition is solid at 23°C.SELECTED DRAWING: None

Description

The present invention relates to a crystalline radically polymerizable composition for electric and electronic parts, a molded body for electric and electronic parts molded by the composition, a granular material comprising the crystalline radically polymerizable composition for electric and electronic parts, and an electric and electronic part. The present invention relates to a method for manufacturing a molded body.

Electric and electronic parts used in automobiles and electric appliances are protected by metal and resin materials in order to protect them from external factors such as dust, water and shock. Since encapsulation of electric and electronic parts with metal has high reliability but is expensive, it has been replaced by an encapsulant made of a resin material which is inexpensive and has good productivity. In addition, by using a resin sealing material to seal the electric/electronic component with metal, it is possible to reduce the size of the sealed electric/electronic component because it has electrical insulation properties, and is mounted in automobiles and electric appliances. The degree of freedom in design is improved. Further, since electric/electronic parts are sometimes used under severe conditions under high temperature and high humidity environment, thermosetting resins having excellent heat resistance are often used when resin materials are used.

Recently, a liquid epoxy resin has been used, which has good adhesion to resin substrates and metals and has excellent mechanical strength and fluidity.

The use of semiconductors has greatly increased due to the spread of electronic control of automobiles and the spread of mobile devices and information appliances, and the importance of semiconductor encapsulation, which is one of the electrical and electronic component encapsulants, is increasing. Most of the semiconductor encapsulants used for semiconductor encapsulation are tablet-shaped epoxy molding compounds (EMC). EMC is used in the transfer molding method with high productivity and has established high reliability because it has excellent physical properties such as adhesion and linear expansion coefficient, but it requires frozen storage and post-curing steps. Therefore, there is a demand for simplification of usage.

From the above, a method for manufacturing an epoxy resin composition for encapsulation, an electronic device, an automobile, and an electronic device has been conventionally known (for example, Patent Document 1). Further, a method for manufacturing a semiconductor device and a semiconductor encapsulating acrylic resin composition used therefor are known (for example, Patent Document 2).

JP, 2014-148586, A JP, 2015-2204, A

Sealing molding using a liquid epoxy resin is manufactured by a method with relatively poor productivity such as compression molding and casting. Therefore, a manufacturing method with high productivity is expected.

In Patent Document 1, the epoxy resin composition for sealing is molded by a transfer molding method. For the epoxy resin composition used for transfer molding, it is necessary to return the frozen resin composition to room temperature. When the epoxy resin composition is stored at room temperature, there is a problem that the fluidity is greatly reduced and the epoxy resin composition does not completely cure during the molding time, so that the epoxy resin composition is post-cured for several hours in order to obtain necessary molded product characteristics.

Further, in Patent Document 1, there is a description of (meth)acrylate resin, unsaturated polyester resin and diallyl phthalate resin, which are radically polymerizable compounds as thermosetting resins, but specific methods of using these radically polymerizable compounds. , There is no detailed description of the examples. Further, since there is no description of a radical polymerization initiator as a curing agent, even if a (meth)acrylate resin, an unsaturated polyester resin or a diallyl phthalate resin is used, the radical polymerizable compound cannot be three-dimensionally crosslinked. Therefore, the curing agent described in Patent Document 1 is limited to those that can three-dimensionally crosslink the epoxy resin. Therefore, Patent Document 1 is, in fact, the content of the epoxy resin composition.

In Patent Document 2, the acrylic resin composition for semiconductor encapsulation is liquid at room temperature. Since it is liquid at room temperature, it has very good fluidity, but since the acrylic resin composition is liquid at room temperature, it is sticky, poor in workability and handleability, and used in solid pellets and tablets at room temperature. It cannot be handled with a general-purpose molding machine. Moreover, it is difficult to control the bubbles because bubbles are likely to remain in the resin composition during molding by casting. Further, the liquid resin composition has a problem that it is difficult to obtain a uniform molded product as compared with the solid resin composition when the inorganic filler is used, because the filler easily precipitates.

Therefore, the present invention is to provide a crystalline radically polymerizable composition having excellent fluidity and good handleability.

The present inventor has conducted a multifaceted study on a composition containing at least a crystalline radically polymerizable compound from various viewpoints, and as a result, has found a crystalline radically polymerizable composition for electric and electronic parts of the present invention.

That is, the crystalline radical-polymerizable composition for electric and electronic parts of the present invention is a crystalline radical-polymerizable compound having a glass transition point and a melting point, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. A crystalline radical-polymerizable composition for electrical and electronic parts, which comprises at least: wherein the crystalline radical-polymerizable composition is solid at 23°C.

In a preferred embodiment of the crystalline radically polymerizable composition for electric/electronic parts of the present invention, the crystalline radically polymerizable compound is a crystalline unsaturated polyester, a crystalline epoxy (meth)acrylate, a crystalline urethane (meth). ) An acrylate, a crystalline polyester (meth)acrylate, a crystalline polyether (meth)acrylate, a crystalline radical-polymerizable monomer, and a crystalline radical-polymerizable multimer are contained.

In a preferred embodiment of the crystalline radically polymerizable composition for electric/electronic parts of the present invention, the crystalline radically polymerizable compound has a melting point in the range of 30 to 150°C.

In a preferred embodiment of the crystalline radical-polymerizable composition for electric and electronic parts of the present invention, the melt viscosity of the crystalline radical-polymerizable composition measured by a high performance type flow tester is 90° C. at a measurement temperature and a die diameter of 0. It is characterized by having a length of 0.5 mm, a length of 1.0 mm, a pressure of 30 kgf/cm 2 and a pressure of 7 to 1000 Pa·s, or a pressure of 1 kgf/cm 2 and a pressure of 1 to 7 Pa·s.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric/electronic parts of the present invention, the inorganic filler is 50 to 95% by weight based on the total amount of the crystalline radically polymerizable composition. And

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, the ratio of the crystalline radically polymerizable compound to the total amount of the crystalline radically polymerizable compound is 30 parts by weight or more. And

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric/electronic parts of the present invention, the crystalline radically polymerizable compound has a weight average molecular weight of 100 to 100,000.

Further, the molded article of the electric/electronic component of the present invention is characterized by being molded from the crystalline radically polymerizable composition for electric/electronic component of the present invention.

The granular material of the present invention is characterized by comprising the crystalline radically polymerizable composition for electric and electronic parts of the present invention.

Further, the method for producing an electric/electronic molded article of the present invention is an injection molding method for the above-mentioned granular material comprising the crystalline radically polymerizable composition for electric/electronic parts of the present invention, and an electric/electronic part by an insert molding method by a transfer molding method. It is characterized by having a step of molding.

According to the crystalline radically polymerizable composition for electric/electronic parts of the present invention, an effect that is excellent in handleability is exhibited. Furthermore, according to the method for producing a molded body of an electric/electronic component of the present invention, a crystalline radical-polymerizable composition having an extremely low viscosity when heated and melted during injection molding and transfer molding is used, so that the molded body for electric/electronic component is molded. It has an advantageous effect that the fluidity required for sealing and molding the body can be secured.

Further, according to the present invention, it is possible to provide an electric/electronic component sealed body or a molded body, which is molded from the crystalline radically polymerizable composition for electric/electronic components.

Further, according to the present invention, there is provided a method for producing a molded body of an electric/electronic component having a step of molding an electric/electronic component by insert molding of a granular material, a powder or a tablet made of the crystalline radically polymerizable composition for the electric/electronic component. You can

The crystalline radically polymerizable composition for electric and electronic parts of the present invention is characterized by containing at least a crystalline radically polymerizable compound, an inorganic filler, a silane coupling agent and a radical polymerization initiator. This is because the use of the crystalline radically polymerizable composition makes it possible to realize a polymerizable composition which has excellent fluidity and is easy to handle, as shown in Examples described later. In addition, in this specification, the crystalline radically polymerizable composition for electric/electronic parts may be called a crystalline radically polymerizable composition.

In a preferred embodiment of the crystalline radical-polymerizable composition for electric/electronic parts of the present invention, the crystalline radical-polymerizable compound is an unsaturated polyester, an epoxy (meth)acrylate, a urethane (meth)acrylate, a polyester (meth). ) One or more selected from acrylates, polyether (meth)acrylates, radical-polymerizable monomers, and radical-polymerizable multimers.

Although the crystallinity is omitted, specifically, the crystalline radically polymerizable compound is a crystalline unsaturated polyester, a crystalline epoxy (meth)acrylate, a crystalline urethane (meth)acrylate, a crystalline polyester (meth). ) One or more selected from acrylates, crystalline polyether (meth)acrylates, crystalline radically polymerizable monomers, and crystalline radically polymerizable multimers may be included. When these polymerizable compounds are used, mechanical properties and handleability are improved (even in the following, the crystallinity may be omitted).

In addition, in this specification, the crystalline compound may be a compound having a glass transition point and a melting point. These temperatures can be confirmed by a thermal analyzer such as DSC (differential scanning calorimeter), TGDTA (differential thermogravimetric simultaneous measuring device). The crystalline compound in the present invention can be a compound whose melting point can be confirmed by a thermal analyzer.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, the crystalline radically polymerizable compound has a melting point of the crystalline radically polymerizable compound from the viewpoint of workability and moldability. The melting point is 30 to 150° C., more preferably 30 to 120° C., and further preferably 30 to 100° C. A crystalline radical polymerizable compound having a melting point in the range of 30 to 150° C. as compared with the case of using a crystalline radical polymerizable compound having a melting point of less than 30° C. or a melting point higher than 150° C. This is because when the compound is used, better handling property can be realized. If the melting point of the crystalline radical-polymerizable compound is lower than the above range, the crystalline radical-polymerizable composition tends to become a liquid at room temperature, which may make it difficult for the crystalline radical-polymerizable composition to maintain a solid state. If the melting point of the crystalline radically polymerizable compound is higher than the above range, the temperature is close to the molding temperature of the mold, so that the time from the start of flow to the curing is shortened, which may cause defective molding.

Moreover, when only a crystalline radically polymerizable compound having a melting point of less than 30° C. is used, it tends to be difficult to form a solid crystalline radically polymerizable composition at 23° C. On the other hand, when only the crystalline radically polymerizable compound having a melting point higher than 150° C. is used, the temperature of the cylinder and the temperature of the mold may be increased during plasticizing the crystalline radically polymerizable composition in the cylinder in the injection molding method. Due to their close proximity, they tend to be less stable in the cylinder.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, the crystalline radically polymerizable composition is a solid at 23° C. from the viewpoint of handleability of the crystalline radically polymerizable compound. It is characterized by being. The above range is set because the shape of the crystalline radical-polymerizable composition does not change under the manufacturing, molding, and transporting environment, and continuous production is possible with general-purpose manufacturing equipment and conditions. It should be noted that the solid may be one whose shape and volume are not easily changed by an external force.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, from the viewpoint of fluidity, the melt viscosity of the crystalline radically polymerizable composition measured by a high performance type flow tester has a measurement temperature of 90° C. , The diameter of the die is 0.5 mm, the length is 1.0 mm, the pressure is 30 kgf/cm 2, and the pressure is 7 to 1000 Pa·s, or the pressure is 1 kgf/cm 2, the pressure is 1 to 7 Pa·s, and more preferably 1 to 100 Pa·s. Can be When the melt viscosity of the crystalline radically polymerizable composition is lower than the above range, many thin burrs are generated and the burrs are difficult to peel off from the mold, and further the continuous molding is difficult because the composition enters the gap between the molds. Therefore, if the melt viscosity is higher than the above range, the filling property during molding may be poor and the product may not be obtained.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, the inorganic filler is 50 to 95% by weight based on the total amount of the crystalline radically polymerizable composition from the viewpoint of product quality. %, more preferably 55 to 93% by weight, and further preferably 60 to 90% by weight. The above range means that when the amount of the inorganic filler is less than the above range, the molded product has a large shrinkage, and when it is more than the above range, the melt viscosity at the time of molding is high and a load is applied to the insert. This is because the insert may be damaged.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, from the viewpoint of maintaining a solid, the ratio of the crystalline radically polymerizable compound to the total amount of the crystalline radically polymerizable compound is 30% by weight. The amount can be at least 40 parts by weight, more preferably at least 40 parts by weight, and even more preferably at least 50 parts by weight. The above range is set because when the ratio of the crystalline radically polymerizable compound is less than the above range, it may be difficult to become a solid.

Further, in a preferred embodiment of the crystalline radically polymerizable composition for electric and electronic parts of the present invention, from the viewpoint of quality control of the crystalline radically polymerizable composition, the weight average molecular weight of the crystalline radically polymerizable compound is 100. To 100,000, more preferably 100 to 50,000, and still more preferably 150 to 30,000. The above range, the weight average molecular weight of the crystalline radically polymerizable compound is less than the above range, the crystalline radically polymerizable composition is less likely to be a solid, the crystalline radically polymerizable if greater than the above range This is because the molecular weight of the composition cannot be controlled with high precision, and thus compound characteristics and composition characteristics may change.

The electric/electronic component sealed body (molded body) of the present invention is characterized by being sealed and molded with the crystalline radically polymerizable composition for electric/electronic components of the present invention.

The granular material of the present invention is characterized by comprising the crystalline radically polymerizable composition for electric and electronic parts of the present invention. Although a granular material is used, the present invention may be a powder, a tablet or the like in addition to the granular material. That is, in addition to the granular material, the powder, tablet, etc. of the present invention can be composed of the crystalline radically polymerizable composition for electric/electronic parts of the present invention.

Further, the method for producing an electric/electronic component sealed body (molded body) of the present invention is an injection molding method using the crystalline radically polymerizable composition for an electric/electronic component of the present invention, an insert molding method by a transfer molding method. The method has a step of sealing and molding an electric/electronic component by a method.

The electrical/electronic component sealing body is a sealing body including an insert. The electric/electronic component sealing body is a molded body in which a capacitor, an integrated circuit, and the like are bonded to a substrate and integrally covers them. The electric/electronic component bonded to the substrate may be damaged by the flow pressure of injection molding or transfer molding using a highly viscous molding material. In the present invention, the electric/electronic components may include so-called electric/electronic components as well as semiconductors and the like. Therefore, the sealed body for electric/electronic parts and the molded body can be used as a semiconductor sealed body and a molded body. In short, the composition of the present invention can be widely applied to a sealed body and a molded body which are required to have handleability and fluidity.

A composition having a low melt viscosity and a good fluidity may be difficult to handle because the composition is soft even at room temperature. In addition, the soft composition becomes a lump, and the fusion of the composition occurs in the hopper in the injection molding method, the preformed tablet is fused in the transfer molding method, and further the shape change occurs and the tablet in the transfer molding machine is generated. There is a possibility that a problem may occur in which it will not fit into the insertion hole. The present invention has an excellent effect of having high productivity by achieving both fluidity and handleability.

<Method for producing unsaturated polyester>
The unsaturated polyester used in the present invention is, for example, obtained by subjecting an unsaturated polybasic acid, a saturated polybasic acid and glycols to a known dehydration condensation reaction, and usually has an acid value of 2 to 40 mg-KOH/g. Can have. In the production of unsaturated polyesters, unsaturated polybasic acids, unsaturated components having crystallinity by selecting and combining acid components of saturated polybasic acids, and selecting and combining glycols, their mixing ratio, etc. It can be polyester.

Examples of the unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride and glutaconic acid.

Saturated polybasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, and het. Examples thereof include acids and tetrabromophthalic anhydride.

The glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, propylene glycol, diethylene glycol, triethylene glycol. , Dipropylene glycol, neopentyl glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, dibromoneopentyl glycol and the like.

In the present invention, among the crystalline unsaturated polyesters, fumaric acid is used as the unsaturated polybasic acid, isophthalic acid or terephthalic acid is used as the saturated polybasic acid, and ethylene glycol or 1,3-propanediol is used as the main component as the glycol. Unsaturated polyesters using 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol and cyclohexanedimethanol are suitable.

<Method for producing epoxy (meth)acrylate>
The epoxy (meth)acrylate used in the present invention can be produced by a method known per se. Epoxy resin having a crystallinity by appropriately selecting an epoxy resin and an unsaturated monobasic acid in the presence or absence of a known inhibitor, a known esterification catalyst, in an inert gas stream or in an air atmosphere ( It can be a (meth)epoxy acrylate. If desired, other radically polymerizable monomers and organic solvents can be added and reacted for the purpose of lowering the melt viscosity of the reaction system.

The epoxy (meth)acrylate in the present invention is, for example, an epoxy resin having two or more glycidyl ether groups in one molecule, which is obtained by addition-reacting acrylic acid or methacrylic acid with acrylate or methacrylate at the molecular end. It can be an epoxy (meth)acrylate having a double bond. An epoxy (meth)acrylate resin obtained by dissolving an epoxy (meth)acrylate in a radical polymerizable monomer and/or a radical polymerizable multimer may be used. The above-mentioned epoxy resin having two or more glycidyl ether groups in one molecule is, for example, bisphenol A, bisphenol F, bisphenol S, or a bisphenol type epoxy resin derived from these derivatives, bixylenol and bixylenol derived from the derivative. -Type epoxy resin, biphenol-type epoxy resin from biphenol and its derivatives, or naphthalene-type epoxy resin from naphthalene and its derivatives, and epoxy resin such as novolac-type epoxy resin, and these may be used alone or in combination of two or more. Can be mixed and used. The epoxy equivalent, which is a measure of the molecular weight of the epoxy resin, is preferably 174 to 2000 eq/g.

<Method for producing urethane (meth)acrylate>
Further, the urethane (meth)acrylate in the present invention may be, for example, a poly(alcohol) and/or a polyester polyol and/or a polyether polyol having two or more hydroxyl groups in one molecule, and a polyisocyanate having a molecular terminal Isocyanate, and/or one or more isocyanates in one molecule are reacted with a compound having an alcoholic hydroxyl group and one or more acrylate or methacrylate groups, or first, an alcoholic hydroxyl group and one or more acrylate or methacrylate groups A compound having a group is reacted with diisocyanate so that an isocyanate group remains, and the remaining isocyanate group is reacted with a polyalcohol and/or polyester polyol and/or polyether polyol having two or more hydroxyl groups in one molecule. A urethane acrylate having an acrylate or methacrylate double bond at the molecular end can be obtained. In the production of urethane (meth) acrylate, a combination of isocyanate, polyalcohol and/or polyester polyol and/or polyether polyol, and a compound having an alcoholic hydroxyl group and at least one acrylate group or methacrylate group should be appropriately selected. As a result, a crystalline urethane (meth)epoxy acrylate can be obtained. A urethane (meth)acrylate resin obtained by dissolving urethane acrylate or urethane methacrylate in a radical-polymerizable monomer such as styrene or diethylene glycol dimethacrylate and/or a radical-polymerizable polymer may be used. These can be used alone or in a mixture of two or more kinds.

Examples of the compound having an alcoholic hydroxyl group and one or more acrylate groups or methacrylate groups include hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, phenoxyhydroxypropyl (meth ) Acrylate, trimethylolpropane di(meth)acrylate, dipropylene glycol mono(meth)acrylate and the like can be used.

Further, examples of the polyalcohol having two or more hydroxyl groups in one molecule include neopentyl glycol, ethylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1 ,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, propylene Polyester polyols having two or more hydroxyl groups in one molecule include glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, and bisphenol A propylene oxide adduct. Polyalcohols such as neopentyl glycol, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, trimethylene glycol, hydrogenated bisphenol A, bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, adipic acid, (anhydrous) A saturated polyester polyol having a molecular weight of 1,000 to 2,000 obtained by a dehydration condensation reaction with a polybasic acid such as phthalic acid, isophthalic acid, terephthalic acid and trimellitic acid is a polyether polyol having two or more hydroxyl groups in the above molecule. As the polyethylene glycol or polypropylene glycol having a molecular weight of 300 to 2000 obtained by the ring-opening reaction of ethylene oxide or propylene oxide, or polycaprolactone obtained by the ring-opening reaction of caprolactone, etc., alone or in combination of two or more kinds. can do.

An aromatic and/or aliphatic polyisocyanate compound is used as the compound having two or more isocyanate groups in one molecule, and examples thereof include tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, and 1,6-hexa. Examples include methylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, trifunctional isocyanate having an isocyanurate ring in which a bifunctional isocyanate compound is trimerized, and an isocyanate prepolymer modified with a commercially available polyol. You can These may be used alone or in combination of two or more.

<Method for producing polyester (meth)acrylate>
Further, the polyester (meth)acrylate in the present invention is, for example, at the molecular end obtained by esterification of polyester polyol with acrylic acid or methacrylic acid, or reaction with an acid-terminated polyester and an acrylate or methacrylate having a glycidyl group. It may be polyester acrylate having a double bond of acrylate or methacrylate, or polyester methacrylate. In the production of polyester (meth)acrylate, polyester (meth)acrylate having crystallinity can be obtained by appropriately selecting polyester polyol and acrylic acid or methacrylic acid, or acid-terminated polyester and acrylate or methacrylate having a glycidyl group. .. A polyester acrylate resin or a polyester methacrylate resin in which polyester acrylate or polyester methacrylate is dissolved in a radical polymerizable monomer such as styrene or diethylene glycol dimethacrylate and/or a radical polymerizable multimer may be used. These can be used alone or in a mixture of two or more kinds.

<Method for producing polyether (meth)acrylate>
In addition, the polyether (meth)acrylate in the present invention is obtained by, for example, esterification of a polyether polyol with acrylic acid or methacrylic acid, or reaction of an acid terminal polyether with an acrylate or methacrylate having a glycidyl group. It may be a polyether acrylate having a double bond of an acrylate or a methacrylate at the end of the molecule, or a polyether methacrylate. In the production of polyether (meth)acrylate, a polyester (meth)acrylate having crystallinity is obtained by appropriately selecting polyether polyol and acrylic acid or methacrylic acid, or acid-terminated polyester and acrylate or methacrylate having a glycidyl group. Can be done. It may be a polyether acrylate resin or a polyether methacrylate resin in which polyether acrylate or polyether methacrylate is dissolved in a radical polymerizable monomer and/or a radical polymerizable multimer such as styrene or diethylene glycol dimethacrylate. These can be used alone or in a mixture of two or more kinds.

In a preferred embodiment, the crystalline radically polymerizable monomer that is solid at 30 to 150°C in the present invention is ethoxylated isocyanuric acid triacrylate (melting point about 50°C), polyethylene glycol di(meth)acrylate (melting point 35 to 35°C). 53° C.), methoxypolyethylene glyco(meth)acrylate (melting point 33-40° C.), behenyl acrylate (melting point 46° C.), tetramethylpiperidinyl methacrylate (melting point 56-60° C.), trimethallyl isocyanurate (melting point 83-87). ℃), diacetone acrylamide (melting point about 56 ℃), itaconic acid dimethyl ester (melting point 36 ℃), vinyl stearate (melting point 36 ℃), N- vinyl carbazole (melting point 67 ℃), N- methylol acrylamide (melting point 71 ~ 75° C.), acrylamide (melting point 84° C.), tolylenediallyl carbamate (melting point 85 to 110° C.), maleimide (melting point 93° C.), acenaphthylene (melting point 95° C.) and the like can be included. Use of these crystalline radically polymerizable compounds improves the handleability.

As the radical-polymerizable monomer in the present invention, a radical-polymerizable monomer that is liquid at room temperature can be used within a range that does not impair the object. For example, vinyl aromatic compounds such as a styrene monomer having a vinyl group, α-methylstyrene, vinyltoluene, and α-chlorostyrene; vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co.), etc. Vinyl ester; (meth)acrylic acid esters such as methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, and the like.

Further, bifunctional such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyl tetrabrom phthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate, diallyl phthalate having an allyl group and triallyl isocyanurate. The above radically polymerizable monomers can be used. These radically polymerizable monomers may be used alone or in combination of two or more.

As the radical-polymerizable multimer in the present invention, diallyl phthalate prepolymer, tie prepolymer, epoxy prepolymer, urethane prepolymer, acrylate prepolymer can be used. These radical-polymerizable multimers may be used alone or in combination of two or more.

In the crystalline radically polymerizable composition for electric and electronic parts of the present invention, an inorganic filler can be blended. Examples of the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium hydroxide, magnesium oxide, alumina, silica, zinc oxide, mica, aluminum nitride and boron nitride. Of these, silica is preferable from the viewpoint of fluidity. These may be used alone or in combination of two or more.

As the inorganic filler, one having an average particle diameter of 100 μm or less, preferably 0.01 to 50 μm can be used. By using the inorganic filler having the above average particle diameter, it is possible to obtain a crystalline radically polymerizable composition for electric and electronic parts which is excellent in fluidity and strength during molding.

In the crystalline radically polymerizable composition for electric and electronic parts of the present invention, various additives that adhere to the inorganic filler and the reinforcing material, for example, a (meth)acrylate compound having a polar group and a coupling agent can be blended. ..

The (meth)acrylate compound having a polar group is not particularly limited, and examples thereof include (meth)acrylate compounds in which a substituent containing an atom other than carbon and hydrogen is ester-bonded, and the substituent includes a hydroxyl group and an epoxy group. Group, glycidyl ether group, tetrahydrofurfuryl group, isocyanate group, carboxyl group, alkoxysilyl group, phosphoric acid ester group, lactone group, oxetane group, tetrahydropyranyl group, amino group and the like. The coupling agent is not particularly limited, and for example, a silane coupling agent or a titanate coupling agent can be used. Examples of the silane coupling agent include epoxysilane type, aminosilane type, and cationic silane. A system, a vinyl silane system, an acrylic silane system, a mercapto silane system, a composite system thereof, and the like can be used.

Of these, acrylic silane coupling agents are preferable from the viewpoint of improving strength. In addition, any additives can be used as long as they do not impair the object of the present invention.

In the crystalline radically polymerizable composition for electric and electronic parts of the present invention, a radical polymerization initiator is usually used as an unsaturated polyester resin composition, a heat-decomposable organic peroxide or a polymerization inhibitor used in the radically polymerizable composition. Agents can be used.

As the organic peroxide, t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di(t-hexylperoxy)cyclohexane, 1,1-di(t-butylperoxy)-3,3,3. Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctoate, benzoyl peroxide, methylethylketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate and dicumyl peroxide. These may be used alone or in combination of two or more.

Among these, from the viewpoints of molding conditions and storage stability, it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100° C. or higher, and specifically, dicumyl peroxide can be preferably used.

Examples of the polymerization inhibitor include quinones such as hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, parabenzoquinone and pyrogallol, 2,6-di-t-. Phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis-(4-methyl-6-t-butylphenol), 1,1,3-tris-(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 4 -Hydroxy-2,2,6,6-tetramethylpiperidine 1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6- Piperidine-1-oxyl such as tetramethylpiperidine-1-oxyl, 4-carboxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 2,2,6,6-tetramethylpiperidine-1-oxyl Can be mentioned. By using these, it is possible to suppress the increase in viscosity during filling during molding and to obtain a radically polymerizable composition having a low melt viscosity. These may be used alone or in combination of two or more.

The crystalline radically polymerizable composition for electric and electronic parts of the present invention may contain a reinforcing material. By using the reinforcing material, it is possible to obtain a crystalline radically polymerizable composition for electric and electronic parts, which has excellent strength characteristics and dimensional stability.

As the reinforcing material used in the present invention, glass fibers used in fiber reinforced plastics such as BMC (bulk molding compound) and SMC (sheet molding compound) are usually used, but are limited to glass fibers. However, other than that can also be used.

As glass fibers, silicate glass, E glass (non-alkali glass for electricity) made from borosilicate glass, C glass (alkali glass for chemicals), A glass (glass for acid resistance), S glass (high strength glass) Examples of such glass fibers include long fibers (roving), short fibers (chopped strands), and milled fibers. Further, these glass fibers may be surface-treated.

In addition, in the crystalline radically polymerizable composition for electric and electronic parts of the present invention, other inorganic fillers may be appropriately blended within a range that does not impair the fluidity of the composition and the properties of the composition as a sealing material. You can

Examples of these include oxides and hydrates thereof, inorganic expanded particles, hollow particles such as silica balloons, and the like.

A releasing agent can be used in the crystalline radically polymerizable composition for electric and electronic parts of the present invention. As the release agent, fatty acids generally used for thermosetting resins, waxes such as fatty acid metal salts, minerals, and the like can be used, and in particular, fatty acids excellent in heat discoloration resistance, fatty acid metal salts, And waxes can be preferably used.

Specific examples of these release agents include stearic acid, zinc stearate, aluminum stearate, calcium stearate, and paraffin wax. These release agents may be used alone or in combination of two or more kinds.

As the mold release agent, an external mold release agent such as a mold release agent which is sprayed on a mold or applied, or a molding material containing a mold release agent can be used as required.

In the present invention, in addition to these blending components, a curing catalyst for adjusting the curing conditions of the crystalline radically polymerizable composition, a polymerization inhibitor, a colorant, a thickener, a wetting dispersant, a surface modifier, a reducing agent. A viscous agent, a flow modifier, other organic additives, inorganic additives and the like can be appropriately blended as necessary.

<Method for producing crystalline radically polymerizable composition>
The crystalline radically polymerizable composition for electric and electronic parts of the present invention is prepared by blending the components and mixing them sufficiently uniformly using a mixer, a blender, etc., and then using a kneader capable of heating and pressurizing, an extruder or the like. It can be prepared, granulated and manufactured.

Further, the granular material, powder and tablet of the present invention are characterized by comprising the crystalline radically polymerizable composition for electric and electronic parts of the present invention. The granular material comprising the crystalline radically polymerizable composition for electric and electronic parts of the present invention may be in the form of pellets.

Further, the electric/electronic component of the present invention is characterized by molding, sealing, and molding a granular material, a powder, or a tablet made of the crystalline radically polymerizable composition for electric/electronic parts of the present invention. The electric/electronic component sealed body and the molded body can be molded by a conventional method using various thermosetting composition molding methods.

Further, the crystalline radically polymerizable composition for electric and electronic parts of the present invention is a dry method and, since it has good thermal stability upon melting, as a molding method, an injection molding method, an injection compression molding method, a transfer molding method, A melt heat molding method such as a compression molding method can be preferably used.

Of these, the injection molding method using an injection molding machine and the transfer molding method using a transfer molding machine are particularly suitable. The molding time can be shortened by the injection molding method, and many moldings can be molded at a time by the transfer molding method. Thus, it is possible to manufacture an electric/electronic component sealed body or a molded body having a complicated shape.

<Electrical/Electronic Component Sealed Body, Molded Body and Electrical/Electronic Component Sealed Body, Method for Manufacturing Molded Body>
The electric/electronic component sealed body and the molded body of the present invention can be produced by sealing and molding the electric/electronic component by the insert molding method using the crystalline radically polymerizable composition for electric/electronic components of the present invention. it can. Here, the crystalline radical-polymerizable composition for electric and electronic parts of the present invention, even if all components constituting the crystalline radical-polymerizable composition are separately preheated and kneaded, a part of the components or The whole may be mixed and heated and kneaded immediately before injection into the mold.

The temperature and pressure of the crystalline radical-polymerizable composition at the time of mold injection are not particularly limited, but when an injection molding machine is used, the temperature of the crystalline radical-polymerizable composition is 60 to 130° C. and the mold temperature is 130 to 190. C, and the pressure of the crystalline radically polymerizable composition is 0.1 to 10 MPa, the mold temperature of the transfer molding machine is 130 to 190° C., and the pressure of the crystalline radically polymerizable composition is 0.1 to 10 MPa. This is preferable because it reduces damage.

Hereinafter, one embodiment of the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

<Production Example of Radical Polymerizable Composition for Electrical and Electronic Parts>
Examples 1-11, Reference Example 1, and Comparative Examples 1-2
The crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 to 2 shown in Table 3 have the compounding amounts shown in Tables 2 and 3 below. The ingredients were blended together and uniformly prepared using a kneader capable of heating and cooling under pressure, and then the preparation was put into an extruder and hot-cut into granules. A part of the granular or lumpy radically polymerizable composition was made into powder by using a grinder.

The obtained radically polymerizable composition and the like were processed by a hydraulic molding machine (manufactured by Toho Press Mfg. Co., Ltd.) at a mold temperature of 165° C. for a curing time of 180 seconds or until a test piece was obtained to prepare a test piece. Physical properties of the molded test pieces were evaluated by the methods described below, and are shown in Table 2 and Table 3, respectively.

The following were used as the compounding ingredients.
(1) Polymerizable compound 1. Crystalline radically polymerizable compound 1: phthalic acid unsaturated polyester (condensation product of terephthalic acid, fumaric acid and 1,6-hexanediol)
2. Crystalline radical polymerizable compound 2: urethane methacrylate (2-hydroxyethyl methacrylate adduct of 1,6-hexamethylene diisocyanate)
3. Crystalline radically polymerizable compound 3: urethane acrylate (2-hydroxyethyl acrylate adduct of 1,6-hexamethylene diisocyanate)
4. Crystalline radically polymerizable monomer 1: ethoxylated isocyanuric acid triacrylate (A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd.)
5. Amorphous radically polymerizable compound 1: phthalic acid-based unsaturated polyester (Yupica 8552H manufactured by Nippon Yupica Co., Ltd.)
6. Amorphous radically polymerizable compound 2: bisphenol A type epoxy methacrylate (methacrylic acid adduct of bisphenol A type epoxy resin)
7. Radical Polymerizable Monomer 1: Diallyl phthalate monomer (Daisoupup Monomer manufactured by Osaka Soda Co., Ltd.)
8. Radical polymerizable monomer 2: diethylene glycol dimethacrylate (2G manufactured by Shin-Nakamura Chemical Co., Ltd.)

(2) Inorganic filler 1. Inorganic filler 1: Fused silica (Denka Corporation average particle size 24 μm)
2. Inorganic filler 2: Calcium carbonate (manufactured by Nitto Koka Co., Ltd. average particle diameter 2 μm)

(3) Additive 1. Silane coupling agent: Methacrylic silane (KBM-503 manufactured by Shin-Etsu Chemical Co., Ltd.)
2. Radical polymerization initiator: Dicumyl peroxide (Parkmill D manufactured by NOF CORPORATION)
3. Release agent: Zinc stearate (GF-200 manufactured by NOF CORPORATION)
4. Polymerization inhibitor: Perabenzoquinone (PBQ manufactured by Seiko Chemical Co., Ltd.)
5. Coloring agent: carbon black (CB40 manufactured by Mitsubishi Chemical Corporation)

<Characteristics of polymerizable compound>
The melting points and weight average molecular weights of the crystalline or amorphous radically polymerizable compound and the radically polymerizable monomer were measured and shown in Table 1.

<Compound property, composition property, physical property evaluation method>

(1) Melting point A radical polymerizable compound shown in Table 1 was placed in an aluminum pan with a differential scanning calorimeter "DSC6220" (manufactured by Seiko Instruments Inc.), and a measurement sample was placed in an aluminum pan. The measurement was performed from −60° C. to 200° C. at a heating rate of 10° C./min. The endothermic peak of the obtained curve was taken as the melting point. The results are shown in Table 1. The compound which was liquid at 23°C was discontinued.

(2) Weight average molecular weight The weight average molecular weight of the radically polymerizable compound shown in Table 1 is obtained by dissolving the polymerizable compound in tetrahydrofuran (THF) at 1.0% by weight and using polystyrene by GPC (gel permeation chromatography). It was measured by conversion. The measurement conditions are shown below. The results are shown in Table 1. However, even if the above-mentioned strict standards are not satisfied, there are cases where the weight average molecular weight is less than 100 or greater than 100000 depending on the desired application, required quality, etc., so it should be considered as a guideline. It’s good.
Equipment Equipment: Showex DPC Co., Ltd. Shodex GPC-101
Column: Showa Denko KF-802, 803, 804, 805
Solvent, carrier liquid: THF
Flow rate: 1.0 ml/min Sample concentration: 1.0%
Temperature: 40°C
Sample injection volume: 200 μl
Detector: Differential refractive index detector

(3) The hardness was measured according to JIS K7215. The hardness of the crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2 and Reference Example 1 and Comparative Examples 1 to 2 shown in Table 3 was measured by a durometer (Nishi Tokyo Seimitsu Co., Ltd. WR- 105D). The radically polymerizable composition whose temperature was adjusted to 90° C. was formed into a flat plate of about 100 mm×100 mm×10 mm and cooled and solidified in a constant temperature room of 23° C. The radical-polymerizable composition before curing, the temperature of which was adjusted to 23° C., was placed on a horizontal hard table. While keeping the pressure reference surface of the durometer parallel to the surface of the radically polymerizable composition, it is pressed against the surface of the radically polymerizable composition as quickly as possible without impact and the pressure reference surface and the radically polymerizable composition are pressed. Well adhered. The maximum indicator value of the pointer of the indicator was quickly read within 1 second. The results are shown in Tables 2 and 3. The target hardness is 10, 20 or more is excellent, 10 or more is good, and less than 10 is acceptable.

(4) Melt Viscosity The crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 and 2 shown in Table 3 were used as a high-performance flow tester ((shares ) The melt viscosity was measured by Shimadzu CFT-100EX). With a die having a diameter of 0.5 mm and a length of 1 mm, the radical polymerizable composition was put into a cylinder sample insertion hole heated to 90° C., and after preheating for 240 seconds, a piston was applied at a pressure of 30 kgf/cm 2 or 1 kgf/cm 2. By pressing, the radically polymerizable composition was allowed to flow out from the nozzle of the die, and the melt viscosity was determined from the location where the linearity was good. The results are shown in Tables 2 and 3. The target melt viscosity was 1 to 1000 Pa·s, the composition of 1 to 100 Pa·s was excellent, and the composition of 100 to 1000 Pa·s was good.

(5) Flow length The measuring method was based on EIMS T-901. Using the crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2, Reference Example 1 and Comparative Examples 1 to 2 shown in Table 3, an auxiliary ram type equipped with a spiral flow mold The flow length was measured with a transfer molding machine. The spiral flow mold was heated to 165°C. The spiral flow mold used was one in which the center portion was the material injection port, and a groove was provided in the shape of a semicircular spiral curve with a radius of 1.6 mm starting from the injection port. A predetermined amount of the radically polymerizable composition was weighed so that the thickness of the cull was in the range of 1 to 10 mm. The plunger was raised, the radically polymerizable composition was put into the pot, and immediately, a pressure of 3.2 MPa was applied to start transfer molding. The movement of the plunger stopped, and 180 seconds after the start of measurement, the mold was opened and the molded product was taken out. The length up to the glossy portion of the end of the molded article, or the length of the glossy portion, plus one-half the length of the low density portion ahead of that, was read. The results are shown in Tables 2 and 3. The target flow length was 50 cm, 100 cm or more was excellent, 50 cm or more was good, and less than 50 cm was acceptable. However, even if the strict criteria are not satisfied, the condition may be satisfied even if the length is less than 50 cm depending on the desired application, required quality, etc., and therefore, it may be considered as one guide.

(6) Molding shrinkage The measuring method was in accordance with JIS K 6911. Using the crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2 and Reference Example 1 and Comparative Examples 1 to 2 shown in Table 3, compression was performed using a mold for shrinkage measurement. A test piece was prepared by molding. The radical polymerizable composition was placed in a mold whose temperature was adjusted to 165° C., and heated under pressure for 3 minutes. The test piece was immediately taken out from the mold and stored for 24 hours under a constant temperature and humidity of 23° C. and a humidity of 55% RH. The outer dimensions of the annular strips protruding from the front and back of the test piece were measured along the measurement lines perpendicular to each other at two locations on the front surface and two locations on the back surface, for a total of four dimensions. The outer shape of the groove of the mold corresponding to the test piece was measured to 0.01 mm under the same conditions to calculate the molding shrinkage rate. The results are shown in Tables 2 and 3. The target molding shrinkage rate was 0.5%, 0.2% or less was excellent, 0.2 to 0.5% or less was good, and cases exceeding 0.5% were acceptable. However, even if the above-mentioned strict standards are not satisfied, the conditions may be met even if it exceeds 0.5% depending on the desired application, required quality, etc., so it should be considered as a guideline. Is.

(7) Glass transition point measurement was based on JIS K 7224-4. The crystalline or amorphous radically polymerizable compositions of Examples 1 to 11 shown in Table 2 and Reference Example 1 and Comparative Examples 1 to 2 shown in Table 3 were placed in a flat plate mold whose temperature was adjusted to 165°C. It was The mold was immediately closed to perform pressure heating and molding. After curing, the mold was opened to obtain a flat plate shaped piece. A plate-shaped molded piece was cut into a strip shape to obtain a glass transition point measuring test piece. The dynamic viscoelasticity (RSA-G2 manufactured by TA Instruments Co., Ltd.) was measured at a temperature rising rate of 2° C./min in a range of 30 to 250° C. and a frequency of 10 Hz. The Tanδ peak temperature was taken as the glass transition point. The results are shown in Tables 2 and 3. The target glass transition point was 125° C., 125° C. or higher was good, and less than 125° C. was good. However, even if the strict criteria are not satisfied, the conditions may be met even at a temperature of less than 125° C. depending on the desired application, the required quality, etc., and therefore it should be considered as a guideline.

<Evaluation result>
As shown in Tables 2 and 3, it was found that the crystalline radically polymerizable composition for electric and electronic parts of the present invention was excellent in handleability. Further, in particular, Examples 1 to 8 and 11 of the crystalline radically polymerizable composition for electric and electronic parts according to the present invention were excellent in handleability and low in melt viscosity because they were solid at 23°C. It has been found that the crystalline radically polymerizable composition for electric and electronic parts according to the present invention shows excellent results as a whole.

Example 9 is a crystalline radically polymerizable composition having different inorganic filler compounding amounts as in Example 1. The composition had a hardness of 3 and was soft. Further, the composition had a melt viscosity of 0.5 Pa·s and a low viscosity, and the molding shrinkage was large, but the other properties were good.

Example 10 is a crystalline radical-polymerizable composition in which the crystalline radical-polymerizable compound of Example 5 is changed to a radical-polymerizable compound that is liquid at room temperature, and the mixing ratio of the radical-polymerizable compound is changed. Since the amount of the crystalline radically polymerizable compound was small, the composition had a hardness of 0 and was soft, and the glass transition point was low, but other properties were good.

Reference Example 1 is a crystalline radically polymerizable composition in which the compounding amount of the inorganic filler of Example 8 was changed. The melting start temperature was not observed because the flow stopped during the measurement. The melt viscosity was high and the flow length was short, but other properties were good.

Therefore, even in Examples 9 and 10 and Reference Example 1, the conditions may be met depending on the desired application, the required quality, etc., so that it may be considered as one guideline and good characteristics are obtained. It has been found to be applicable to the required application.

Further, in both Comparative Examples 1 and 2, the melt viscosity was higher than that of the crystallinity (Comparative Example 1 can be compared with Example 4), and the handling property was poor.

As described above, it has been found that the crystalline radical-polymerizable composition for electric and electronic parts containing at least the crystalline radical-polymerizable compound has excellent handleability and good fluidity.

INDUSTRIAL APPLICABILITY The crystalline radical-polymerizable composition for electric/electronic parts of the present invention and the electric/electronic part encapsulant and molded body using the same have a high glass transition point and excellent heat resistance, and are therefore used for automobiles, communications, computers and home appliances. Improving the durability of various electronic components such as connectors, harnesses, semiconductor encapsulants or electronic component encapsulants and molded products, switches having printed circuit boards, sensors, etc. Is possible.

Claims (10)

A crystalline radically polymerizable composition for electric and electronic parts, comprising at least a crystalline radically polymerizable compound having a glass transition point and a melting point, an inorganic filler, a silane coupling agent, and a radical polymerization initiator, The crystalline radical-polymerizable composition is a solid at 23° C. A crystalline radical-polymerizable composition for electric and electronic parts. The crystalline radically polymerizable compound is a crystalline unsaturated polyester, crystalline epoxy (meth)acrylate, crystalline urethane (meth)acrylate, crystalline polyester (meth)acrylate, crystalline polyether (meth)acrylate, crystalline The crystalline radical-polymerizable composition for electric and electronic parts according to claim 1, comprising at least one selected from a radical-polymerizable monomer and a crystalline radical-polymerizable multimer. The crystalline radical-polymerizable composition for electric/electronic parts according to claim 1 or 2, wherein the crystalline radical-polymerizable compound has a melting point in the range of 30 to 150°C. The melt viscosity of the crystalline radically polymerizable composition measured by a high performance type flow tester is 7 to 1000 Pa·s at a measurement temperature of 90° C., a die diameter of 0.5 mm and a length of 1.0 mm, or a pressure of 30 kgf/cm 2, or The crystalline radically polymerizable composition for electric and electronic parts according to any one of claims 1 to 3, wherein the crystalline radically polymerizable composition is 1 to 7 Pa·s at a pressure of 1 kgf/cm2. The said inorganic filler is 50-95weight% with respect to the said crystalline radical polymerizable composition whole quantity, The crystalline radical for electric/electronic parts of any one of the Claims 1-4 characterized by the above-mentioned. Polymerizable composition. The ratio of the crystalline radical-polymerizable compound to the total amount of the crystalline radical-polymerizable compound is 30 parts by weight or more, and the crystalline radical for electric/electronic parts according to any one of claims 1 to 5. Polymerizable composition. The crystalline radically polymerizable composition for electric/electronic parts according to any one of claims 1 to 6, wherein the crystalline radically polymerizable compound has a weight average molecular weight of 100 to 100,000. An electric/electronic component molded body, which is molded from the crystalline radically polymerizable composition for electric/electronic components according to any one of claims 1 to 7. A granular material comprising the crystalline radically polymerizable composition for electric/electronic parts according to any one of claims 1 to 8. A method for producing a molded body of an electric/electronic component, comprising the step of molding the granular material comprising the crystalline radically polymerizable composition for electric/electronic component according to claim 9 by an insert molding method such as an injection molding method or a transfer molding method. Method.