JP7546610B2 - 量子情報の光変換のための超伝導インターポーザ - Google Patents

量子情報の光変換のための超伝導インターポーザ Download PDF

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JP7546610B2
JP7546610B2 JP2021576724A JP2021576724A JP7546610B2 JP 7546610 B2 JP7546610 B2 JP 7546610B2 JP 2021576724 A JP2021576724 A JP 2021576724A JP 2021576724 A JP2021576724 A JP 2021576724A JP 7546610 B2 JP7546610 B2 JP 7546610B2
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microwave
chip
conversion
optical
optical frequency
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JPWO2020260251A5 (de
JP2022538247A5 (de
JP2022538247A (ja
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ブロン、ニコラス、トーレイフ
ボゴリン、ダニエラ、フロレンティーナ
グマン、パトリク
ハート、シーン
オリヴァデーセ、サルヴァトーレ、ベルナルド
オーカット、ジェイソン
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International Business Machines Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/70—Photonic quantum communication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computing Systems (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Evolutionary Computation (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Human Computer Interaction (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP2021576724A 2019-06-27 2020-06-23 量子情報の光変換のための超伝導インターポーザ Active JP7546610B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/455,043 2019-06-27
US16/455,043 US11005574B2 (en) 2019-06-27 2019-06-27 Superconducting interposer for optical transduction of quantum information
PCT/EP2020/067450 WO2020260251A1 (en) 2019-06-27 2020-06-23 Superconducting interposer for optical transduction of quantum information

Publications (4)

Publication Number Publication Date
JP2022538247A JP2022538247A (ja) 2022-09-01
JPWO2020260251A5 JPWO2020260251A5 (de) 2022-11-18
JP2022538247A5 JP2022538247A5 (de) 2022-11-18
JP7546610B2 true JP7546610B2 (ja) 2024-09-06

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JP2021576724A Active JP7546610B2 (ja) 2019-06-27 2020-06-23 量子情報の光変換のための超伝導インターポーザ

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US (1) US11005574B2 (de)
EP (1) EP3991107B1 (de)
JP (1) JP7546610B2 (de)
KR (1) KR102863891B1 (de)
CN (1) CN113841167B (de)
AU (1) AU2020304788B2 (de)
BR (1) BR112021026226A2 (de)
CA (1) CA3143377A1 (de)
ES (1) ES3040580T3 (de)
IL (1) IL288535B2 (de)
MX (1) MX2021015222A (de)
PL (1) PL3991107T3 (de)
SG (1) SG11202110214UA (de)
WO (1) WO2020260251A1 (de)

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* Cited by examiner, † Cited by third party
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EP3589581B1 (de) * 2017-02-28 2024-06-05 Yale University Techniken zur kopplung von qubits an akustische resonatoren sowie zugehörige systeme und verfahren
US12030085B2 (en) 2017-02-28 2024-07-09 Yale University Acousto-optic coupling techniques and related systems and methods
CN117063188A (zh) * 2021-04-28 2023-11-14 Iqm芬兰公司 用于量子位的光学驱动器
WO2023038767A2 (en) * 2021-08-16 2023-03-16 University Of Southern California Quantum chip optoelectronic interposer
US12393856B2 (en) * 2022-06-29 2025-08-19 Cisco Technology, Inc. Superconducting quantum architectures
US12197104B2 (en) 2022-12-07 2025-01-14 International Business Machines Corporation Electro-optic transducer with integrated optical delay line
SE547537C2 (en) * 2023-03-27 2025-10-14 Joey Frey A transducer arrangement and a method for fabricating said transducer arrangement
US12191051B2 (en) 2023-06-06 2025-01-07 International Business Machines Corporation Coherent interconnects between superconducting qubits and microwave-optical transducers
WO2025143502A1 (ko) * 2023-12-29 2025-07-03 (재)한국나노기술원 초전도 양자큐비트 소자 및 그 제조방법
JP2026029100A (ja) 2024-08-08 2026-02-20 富士通株式会社 量子変換器及び量子変換方法
JP2026029099A (ja) 2024-08-08 2026-02-20 富士通株式会社 量子変換器及び量子変換方法
KR102927108B1 (ko) * 2025-03-18 2026-02-12 더다인 주식회사 인공지능을 이용하는 하이브리드 양자계산시스템 및 양자계산시스템의 동작방법

Citations (5)

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JP2005322756A (ja) 2004-05-07 2005-11-17 Kobe Steel Ltd 極低温装置
US20160133819A1 (en) 2013-12-23 2016-05-12 Intermolecular, Inc. Fluorine Containing Low Loss Dielectric Layers for Superconducting Circuits
US20180003753A1 (en) 2016-06-30 2018-01-04 International Business Machines Corporation Read out of quantum states of microwave frequency qubits with optical frequency photons
US20180102469A1 (en) 2016-10-11 2018-04-12 Massachusetts Institute Of Technology Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
WO2018160674A1 (en) 2017-02-28 2018-09-07 Yale University Techniques for coupling qubits to acoustic resonators and related systems and methods

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JP4029765B2 (ja) * 2003-01-30 2008-01-09 株式会社島津製作所 プラズマ処理装置
US8817254B2 (en) 2011-10-28 2014-08-26 Hewlett-Packard Development Company, L.P. Entanglement process
US9260289B2 (en) 2013-09-03 2016-02-16 Northrop Grumman Systems Corporation Optical-microwave-quantum transducer
US9296609B2 (en) 2013-09-03 2016-03-29 Northrop Grumman Systems Corporation Optical-microwave-quantum transducer
JP6947408B2 (ja) * 2015-12-04 2021-10-13 イェール ユニバーシティーＹａｌｅ Ｕｎｉｖｅｒｓｉｔｙ ボソンモードを使用した量子誤り訂正のための技術ならびに関連のある系および方法
US9454061B1 (en) * 2015-12-17 2016-09-27 International Business Machines Corporation Quantum coherent microwave to optical conversion scheme employing a mechanical element and a squid
US9885888B2 (en) * 2016-02-08 2018-02-06 International Business Machines Corporation Integrated microwave-to-optical single-photon transducer with strain-induced electro-optic material
CN108780129B (zh) * 2016-02-12 2021-03-23 耶鲁大学 用于控制量子系统的技术及相关系统和方法
US20170248832A1 (en) 2016-02-29 2017-08-31 Ecole Polytechnique Federale De Lausanne (Epfl) Microwave to Optical Conversion Device and Method for Converting a Microwave Photon to an Optical Photon
US10782590B2 (en) * 2016-10-26 2020-09-22 The Board Of Trustees Of The Leland Stanford Junior University Doubly-resonant electro-optic conversion using a superconducting microwave resonator
US10439735B2 (en) * 2017-03-07 2019-10-08 International Business Machines Corporation Quantum communication link robust against photon loss
US11177912B2 (en) * 2018-03-06 2021-11-16 Intel Corporation Quantum circuit assemblies with on-chip demultiplexers

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Publication number Priority date Publication date Assignee Title
JP2005322756A (ja) 2004-05-07 2005-11-17 Kobe Steel Ltd 極低温装置
US20160133819A1 (en) 2013-12-23 2016-05-12 Intermolecular, Inc. Fluorine Containing Low Loss Dielectric Layers for Superconducting Circuits
US20180003753A1 (en) 2016-06-30 2018-01-04 International Business Machines Corporation Read out of quantum states of microwave frequency qubits with optical frequency photons
US20180102469A1 (en) 2016-10-11 2018-04-12 Massachusetts Institute Of Technology Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
WO2018160674A1 (en) 2017-02-28 2018-09-07 Yale University Techniques for coupling qubits to acoustic resonators and related systems and methods

Also Published As

Publication number Publication date
IL288535A (en) 2022-01-01
WO2020260251A1 (en) 2020-12-30
PL3991107T3 (pl) 2025-10-13
KR20220004684A (ko) 2022-01-11
CA3143377A1 (en) 2020-12-30
CN113841167A (zh) 2021-12-24
CN113841167B (zh) 2024-04-26
SG11202110214UA (en) 2021-10-28
EP3991107A1 (de) 2022-05-04
KR102863891B1 (ko) 2025-09-23
BR112021026226A2 (pt) 2022-02-15
US20200412457A1 (en) 2020-12-31
IL288535B1 (en) 2024-02-01
MX2021015222A (es) 2022-01-18
JP2022538247A (ja) 2022-09-01
EP3991107B1 (de) 2025-08-13
US11005574B2 (en) 2021-05-11
AU2020304788A1 (en) 2021-10-14
ES3040580T3 (en) 2025-11-03
IL288535B2 (en) 2024-06-01
EP3991107C0 (de) 2025-08-13
AU2020304788B2 (en) 2023-03-30

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