JP7526371B2 - 導電ペースト及び接続構造体 - Google Patents

導電ペースト及び接続構造体 Download PDF

Info

Publication number
JP7526371B2
JP7526371B2 JP2023562725A JP2023562725A JP7526371B2 JP 7526371 B2 JP7526371 B2 JP 7526371B2 JP 2023562725 A JP2023562725 A JP 2023562725A JP 2023562725 A JP2023562725 A JP 2023562725A JP 7526371 B2 JP7526371 B2 JP 7526371B2
Authority
JP
Japan
Prior art keywords
weight
conductive paste
thixotropic agent
electrode
solder particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023562725A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024034516A5 (https=
JPWO2024034516A1 (https=
Inventor
雄太 山中
主 國澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2024034516A1 publication Critical patent/JPWO2024034516A1/ja
Publication of JPWO2024034516A5 publication Critical patent/JPWO2024034516A5/ja
Application granted granted Critical
Publication of JP7526371B2 publication Critical patent/JP7526371B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
JP2023562725A 2022-08-08 2023-08-03 導電ペースト及び接続構造体 Active JP7526371B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022126130 2022-08-08
JP2022126130 2022-08-08
PCT/JP2023/028427 WO2024034516A1 (ja) 2022-08-08 2023-08-03 導電ペースト及び接続構造体

Publications (3)

Publication Number Publication Date
JPWO2024034516A1 JPWO2024034516A1 (https=) 2024-02-15
JPWO2024034516A5 JPWO2024034516A5 (https=) 2024-07-17
JP7526371B2 true JP7526371B2 (ja) 2024-07-31

Family

ID=89851704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023562725A Active JP7526371B2 (ja) 2022-08-08 2023-08-03 導電ペースト及び接続構造体

Country Status (3)

Country Link
JP (1) JP7526371B2 (https=)
TW (1) TW202418301A (https=)
WO (1) WO2024034516A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7617347B1 (ja) * 2023-06-26 2025-01-17 積水化学工業株式会社 樹脂組成物及び接続構造体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255874A1 (ja) 2019-06-20 2020-12-24 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7014576B2 (ja) * 2017-11-27 2022-02-01 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020255874A1 (ja) 2019-06-20 2020-12-24 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
TW202418301A (zh) 2024-05-01
WO2024034516A1 (ja) 2024-02-15
JPWO2024034516A1 (https=) 2024-02-15

Similar Documents

Publication Publication Date Title
TWI809022B (zh) 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法
JP7730856B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
WO2015174299A1 (ja) 導電ペースト、導電ペーストの製造方法、接続構造体及び接続構造体の製造方法
TWI798321B (zh) 焊料粒子、導電材料、焊料粒子之保管方法、導電材料之保管方法、導電材料之製造方法、連接構造體及連接構造體之製造方法
JP2022100313A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7356217B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7526371B2 (ja) 導電ペースト及び接続構造体
JP2023138947A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7518602B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7497136B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP6767307B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
WO2019203053A1 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7698417B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7332458B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7421317B2 (ja) 導電フィルム及び接続構造体
JP7271312B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7316109B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7372745B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2024022788A (ja) 導電ペースト、導電ペーストの製造方法及び接続構造体
JP7617347B1 (ja) 樹脂組成物及び接続構造体の製造方法
JP2024022787A (ja) 導電ペースト及び接続構造体
JP2020170591A (ja) 導電材料及び接続構造体
JP7284699B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP7368947B2 (ja) 電子部品
JP2024010311A (ja) 導電材料、接続構造体及び接続構造体の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240404

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240404

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240404

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240625

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240719

R150 Certificate of patent or registration of utility model

Ref document number: 7526371

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150