JP7519168B2 - Manufacturing method of ceramic member - Google Patents

Description

The present invention relates to a method for manufacturing ceramic members.

In semiconductor manufacturing equipment, electrostatic chucks that hold substrates such as wafers on their surfaces, heaters that heat substrates placed on their surfaces, and susceptors are equipped with ceramic members that have electrodes built into the base material made of sintered ceramics.

As shown in Patent Document 1, for example, such ceramic members are often manufactured by forming ceramic bodies using cold isostatic pressing (CIP), placing electrodes in grooves formed in the ceramic bodies, stacking multiple ceramic bodies, and firing them while applying pressure in the stacking direction to obtain a fired ceramic body with an embedded electrode.

Patent No. 6148845

However, when ceramic parts are obtained in the conventional manner described above, there is a problem that color differences or color unevenness often occur on the surface.

The present invention was made in consideration of these circumstances, and aims to provide a method for manufacturing ceramic components that can suppress color differences or color unevenness on the surface.

The method for manufacturing a ceramic member of the present invention is characterized by comprising the steps of: forming a ceramic raw material powder using cold isostatic pressing to produce a plurality of plate-shaped ceramic molded bodies having a thickness of 2 mm to 6 mm and/or a ceramic calcined body by calcining the plurality of ceramic molded bodies; and stacking a plurality of the ceramic molded bodies or the ceramic calcined bodies and heating them while applying pressure in the stacking direction to form a ceramic sintered body.

The inventors have found that, as disclosed in the above Patent Document 1, when a ceramic molded body or a ceramic calcined body (hereinafter collectively referred to as a ceramic molded body, etc.) having a large thickness (15 mm or 25 mm thickness in the above Patent Document 1) is fired, it is not fired uniformly, and there is a high possibility that color differences will occur.

On the other hand, in the method for manufacturing a ceramic member of the present invention, the lamination interfaces of laminates such as ceramic molded bodies are easily affected by the furnace atmosphere during heating such as degreasing and firing, but since the ceramic molded bodies are thin, at 2 mm to 6 mm, the number of lamination interfaces formed when obtaining a ceramic sintered body of a specified thickness increases compared to when thicker ceramic molded bodies are used. This is thought to promote material transfer between multiple ceramic molded bodies during firing and degreasing of the ceramic molded bodies. As a result, each ceramic molded body is fired uniformly, making it possible to suppress the occurrence of color differences on the surface of the ceramic member.

If the thickness of the ceramic molded body is less than 2 mm, it is difficult to handle the ceramic molded body, and it is difficult to easily obtain a laminate of the ceramic molded body. If the thickness of the ceramic molded body exceeds 6 mm, the number of laminated ceramic molded bodies required to obtain a ceramic sintered body of a specified thickness is relatively small. As a result, gas emission from the laminated interface during heating such as degreasing and firing, and material transfer at the laminated interface are relatively suppressed, so the ceramic member is not fired uniformly, making it difficult to achieve a homogeneous ceramic member, and there is a risk of the surface color tone becoming uneven.

The inventors also discovered that when forming a ceramic sintered body by heating while applying pressure in the stacking direction, cracks are likely to occur in the internal ceramic molding during heating, and even if the cracked areas are integrated by subsequent heating, there is a high risk that color unevenness caused by the presence of the cracks will occur on the surface of the finished ceramic component.

On the other hand, in the method for manufacturing a ceramic member of the present invention, even if a crack occurs in a ceramic molded body when forming a ceramic sintered body, the crack remains in the ceramic molded body and does not affect other ceramic molded bodies. Furthermore, if the ceramic molded body in which the crack occurs is located inside the ceramic member after firing, it is possible to suppress the occurrence of color unevenness on the surface of the ceramic member.

The method for manufacturing a ceramic member of the present invention further comprises a step of arranging an electrode on at least one of the plurality of ceramic formed bodies or the plurality of ceramic calcined bodies.

This makes it possible to obtain a ceramic member having electrodes embedded therein. Furthermore, ceramic molded bodies with electrodes disposed therein are prone to cracking when heated while being pressurized in the stacking direction to form a ceramic sintered body. However, if such a ceramic molded body that is prone to cracking is present inside a stack of multiple ceramic molded bodies, color unevenness will not occur on the surface of the ceramic member, and it is possible to suppress color unevenness.

In addition, the method for manufacturing a ceramic member of the present invention includes the steps of arranging the electrode and arranging a conductive lump- shaped connecting member in contact with the electrode on at least one of the plurality of ceramic molded bodies or the plurality of ceramic calcined bodies; forming a hole reaching the connecting member from one surface of the ceramic sintered body; and providing a connecting terminal that is electrically connected to the connecting member and has at least a portion located within the hole.

This makes it possible to obtain a ceramic member having an electrode and a connection member electrically connected to the electrode embedded therein. Furthermore, when a hole or recess for accommodating an electrode or a connection member is formed in a ceramic molded body or the like, cracks are likely to occur when the ceramic molded body or the like having such a hole or recess formed therein is heated while being pressurized in the stacking direction to form a ceramic sintered body. However, if the ceramic molded body or the like that is prone to cracking is present inside a stack of multiple ceramic molded bodies or the like, color unevenness will not occur on the surface of the ceramic member, and color unevenness can be suppressed.

In addition, in the manufacturing method of a ceramic member of the present invention, at least two of the ceramic molded bodies or the ceramic calcined bodies are stacked above and below at least one of the plurality of ceramic molded bodies or the plurality of ceramic calcined bodies on which the electrode is arranged in the thickness direction .

As a result , ceramic molded bodies, etc. on which electrodes are arranged are prone to cracking when they are heated while being pressurized in the stacking direction to form a ceramic sintered body, but since the ceramic molded bodies, etc. that are prone to cracking are present inside a stack of multiple ceramic molded bodies, etc., color unevenness does not occur on the surface of the ceramic component, and it is possible to suppress color unevenness.

In particular, cracks occurring during heating of ceramic formed bodies and the like often occur near the boundary between the ceramic formed body and other components such as electrodes. However, because the cracks do not propagate to the ceramic formed body and the like that is far from the electrode, color unevenness does not occur on the surface of the ceramic component, making it possible to suppress color unevenness.

The method for manufacturing a ceramic member of the present invention preferably further comprises the step of arranging the electrode in a recess or hole formed in at least one of the plurality of ceramic formed bodies or the plurality of ceramic calcined bodies.

In this case, holes or recesses are formed in the ceramic molded body etc. to accommodate the electrodes, and the ceramic molded body etc. with such holes or recesses formed therein is prone to cracking when heated while being pressurized in the stacking direction to form a ceramic sintered body. However, if this crack-prone ceramic molded body etc. is present inside a stack of multiple ceramic molded bodies etc., color unevenness does not occur on the surface of the ceramic member, and it is possible to suppress color unevenness.

In particular, when a ceramic molded body is heated while being pressurized, cracks in the ceramic molded body during heating often occur near the boundary between the ceramic molded body and other components such as the electrode. However, because the cracks do not propagate to the ceramic molded body away from the electrode, color unevenness does not occur on the surface of the ceramic component, making it possible to suppress color unevenness.

In addition, in the method for manufacturing a ceramic member of the present invention, it is preferable to further include a step of placing an electrode and a conductive connecting member in contact with the electrode in a recess or hole formed in at least one of the plurality of ceramic formed bodies or the plurality of ceramic calcined bodies.

In this case, holes or recesses are formed in the ceramic molded body etc. to accommodate the electrodes and connecting members, and the ceramic molded body etc. with such holes or recesses formed is prone to cracking when heated while being pressurized in the stacking direction to form a ceramic sintered body. However, if this crack-prone ceramic molded body etc. is present inside a stack of multiple ceramic molded bodies etc., color unevenness will not occur on the surface of the ceramic member, and it is possible to suppress color unevenness.

In addition, in the method for manufacturing a ceramic member of the present invention, it is preferable to stack at least two ceramic molded bodies or ceramic calcined bodies on top and bottom of at least one ceramic molded body or ceramic calcined body in the thickness direction in which the recess or hole is formed.

In this case, ceramic molded bodies etc. in which holes or recesses are formed to accommodate electrodes or connecting members are prone to cracking when they are heated while being pressurized in the stacking direction to form a ceramic sintered body. However, because these ceramic molded bodies etc. prone to cracking are present inside a stack of multiple ceramic molded bodies etc., color unevenness does not occur on the surface of the ceramic member, making it possible to suppress color unevenness.

In particular, cracks occurring during heating of ceramic formed bodies and the like often occur near recesses or holes. However, because the cracks do not propagate to the ceramic formed body and the like that are far from the recesses or holes, color unevenness does not occur on the surface of the ceramic component, making it possible to suppress color unevenness.

3 is a flowchart showing a method for manufacturing a ceramic member according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a plurality of ceramic molded bodies and the like. FIG. 2 is a schematic cross-sectional view showing a ceramic laminate. FIG.

A method for manufacturing a ceramic member 100 according to an embodiment of the present invention will be described with reference to the drawings. Note that each drawing has been deformed to clarify the ceramic member 100 and its components, and does not represent the actual proportions. The directions such as up and down and the number of ceramic formed bodies 10 are merely examples.

As shown in FIG. 1, the method for manufacturing the ceramic member 100 according to the embodiment of the present invention includes a ceramic compact manufacturing process (STEP 1), an electrode arrangement process (STEP 2), a connection member arrangement process (STEP 3), a lamination process (STEP 4), a degreasing process (STEP 5), a firing process (STEP 6), a connection hole formation process (STEP 7), and a connection terminal installation process (STEP 8).

First, as shown in FIG. 2, in the ceramic molded body production process (STEP 1), ceramic raw materials are molded using cold isostatic pressing (CIP) to produce multiple plate-shaped ceramic molded bodies 10. Specifically, a binder, plasticizer, sintering aid, dispersant, etc. are added to ceramic powder such as aluminum nitride (AlN), mixed with a solvent, and then spray-dried to obtain ceramic granules. These ceramic granules are then molded using CIP to obtain an ingot, which is then machined to form into a desired shape to produce the ceramic molded body 10.

The ceramic molded body, etc., production process (STEP 1) may include a degreasing process in which the obtained ceramic molded body 10 is degreased to produce a ceramic calcined body. Hereinafter, the ceramic molded body or the ceramic calcined body produced in the ceramic molded body, etc., production process (STEP 1) will be collectively referred to as the ceramic molded body, etc. 10.

The thickness of the ceramic molded body 10 is preferably 2 mm or more and 6 mm or less, more preferably 2 mm or more and 5 mm or less, and is preferably constant throughout.

In the electrode placement process (STEP 2), an electrode 20 is placed on at least one of the ceramic molded bodies 10.

The electrode 20 is arranged by forming a recess 12 by machining on one surface (upper surface in FIG. 2) 11 of the ceramic molded body 10 in advance in the ceramic molded body manufacturing process (STEP 1), and accommodating an electrode 20 in the form of a foil, mesh, or the like, made of a conductive material such as molybdenum (Mo), tungsten (W), or an alloy thereof, in this recess 12. In addition, although not shown, an electrode may be formed by applying a conductive paste to one surface of the ceramic molded body 10 by printing, etc.

In addition, in the stacking step (STEP 4) described later, at least one layer, preferably two layers, of other ceramic molded bodies 10 may be arranged above and below the ceramic molded body 10 on which the electrode 20 is formed.

Furthermore, although not shown, a through hole may be formed in the ceramic molded body 10, and a foil, mesh, or other electrode 20 may be housed in the through hole when the ceramic molded bodies 10 are stacked to form the ceramic laminate 40 (see FIG. 3) in the stacking step (STEP 4) described below.

In the connection member placement process (STEP 3), a connection member 30 is placed on at least one of the ceramic molded bodies 10.

The connection member 30 is arranged in advance in the ceramic compact manufacturing process (STEP 1) by forming a recess 13 by machining on one surface 11 (the upper surface in FIG. 2) of the ceramic compact 10, and placing a lump-shaped connection member 30 made of a conductive material such as molybdenum (Mo), tungsten (W), or an alloy of these in this recess 13.

As shown in FIG. 2, a recess 13 may be formed in a ceramic molded body 10 having a recess 12 formed therein. In this case, the recesses 12 and 13 are integrated. Then, a connection member 30 is placed in the recess 13, and then an electrode 20 is placed in the recess 12, so that the electrode 20 and the connection member 30 are placed in contact with each other.

Although not shown, a through hole may be formed in the ceramic molded body 10, and a connection member may be accommodated in the through hole when the ceramic molded bodies 10 are stacked to form the ceramic laminate 40 (see FIG. 3) in the stacking step (STEP 4) described below. Also, a through hole may be formed in which a hole that accommodates the electrode 20 and a hole that accommodates the connection member 30 are integrated.

In the stacking step (STEP 4), multiple ceramic molded bodies 10 are stacked in the thickness direction (vertical direction) to obtain a ceramic laminate 40.

At this time, if the ceramic formed body 10 with the electrode 20 arranged thereon and the ceramic formed body 10 with the connection member 30 arranged thereon are separate, the ceramic formed body 10 with the electrode 20 arranged thereon and the ceramic formed body 10 with the connection member 30 arranged thereon are stacked so that they are adjacent to each other and the electrodes 20 and the connection member 30 are in contact with each other. Furthermore, the ceramic formed bodies 10 are stacked so that there are at least two ceramic formed bodies 10 above and below the ceramic formed body 10 with the electrode 20 or the connection member 30 arranged thereon in the thickness direction.

In the degreasing step (STEP 5), the binder components are degreased from the ceramic laminate 40 to obtain a ceramic calcined body (not shown). Specifically, the ceramic laminate 40 is placed in a firing furnace and degreased by firing at normal pressure at a predetermined temperature with the furnace in an air atmosphere.

In addition, a degreasing step may be provided in STEP 1, and each ceramic molded body 10 may be degreased (calcined) in this degreasing step to obtain a ceramic calcined body. In this case, the ceramic molded bodies 10 in the steps from STEP 2 onwards become ceramic calcined bodies. Furthermore, in this case, STEP 5 may be omitted.

In the firing step (STEP 6), the ceramic calcined body obtained from the ceramic laminate 40 is fired by hot pressing. Specifically, the ceramic calcined body is placed in a hot press firing furnace, and the ceramic calcined body 40 is heated at a predetermined temperature for a predetermined time in an inert atmosphere or vacuum atmosphere while being pressurized at a predetermined pressure in the stacking direction (vertical direction). As a result, the ceramic calcined body is integrated into a ceramic sintered body 50 as shown in FIG. 4. The electrodes 20 and connecting members 30 connected to each other are embedded in this ceramic sintered body 50.

The degreasing step (STEP 5) and the firing step (STEP 6) may be performed consecutively by heating the ceramic laminate 40 in the same furnace. For example, the degreasing step (STEP 5) and the firing step (STEP 6) can be performed consecutively by degreasing in a wet hydrogen gas atmosphere and then firing at normal pressure in a reducing atmosphere.

In the connection hole forming process (STEP 7), a connection hole 52 is formed by machining from the surface 51 (the lower surface in FIG. 4) of the ceramic sintered body 50 on the connection member 30 side to the connection member 30. That is, by forming the connection hole 52, at least a part of the end surface of the connection member 30 is exposed. Note that machining may be performed to appropriately shape the outer shape of the ceramic sintered body 50 into a desired shape.

In the connection terminal installation process (STEP 8), a connection terminal 60 is provided that is electrically connected to the connection member 30 and at least a portion of which is located within the connection hole 52. The connection terminal 60 is made of a metal with excellent heat resistance, acid resistance, and electrical conductivity, such as titanium (Ti) or nickel (Ni), and in this embodiment, is in the shape of a round bar. The connection member 30 and the connection terminal 60 are connected by brazing, for example. Residual stress during brazing may also be alleviated by interposing a second connection member made of tungsten, molybdenum, or an alloy thereof between the connection member 30 and the connection terminal 60.

Although not shown, the exposed surface of the connection member 30 may be plated with nickel (Ni) or the like to provide a plating layer, and the connection terminal 60 may be connected to this plating layer by brazing or the like. Although not shown, a power source (not shown) is electrically connected to the lower end side of the connection terminal.

This completes the ceramic member 100 as shown in Figure 4.

The inventors discovered that, as disclosed in the above Patent Document 1, when firing a ceramic molded body with a large thickness (15 mm and 25 mm in the above Patent Document 1), it is not fired uniformly and there is a high possibility that color differences will occur.

On the other hand, in this embodiment, the ceramic molded body 10 is thin, at 2 mm or more and 6 mm or less, and is fired uniformly, making it possible to suppress the occurrence of color differences on the surface of the ceramic member 100.

The inventors have also found that cracks are likely to occur in the ceramic molded body 10 during the hot pressing in the firing process (STEP 6), and that even if the molded body is integrated in the subsequent firing process, there is a high possibility that uneven coloring due to the presence of the cracks will occur on the surface of the finished ceramic member 100.

On the other hand, in this embodiment, even if a crack occurs in the ceramic formed body 10 in which the recesses 12, 13 and holes for accommodating the electrodes 20 and the connecting members 30 are formed during the firing process (STEP 6), the crack remains in the ceramic formed body 10 and does not affect other ceramic formed bodies 10. Furthermore, the ceramic formed body 10 in which the crack occurs is located inside the ceramic member 100, not on its surface. This makes it possible to suppress the occurrence of color unevenness on the surface of the ceramic member 100.

The present invention will be explained below with specific examples and comparative examples, with reference to Figure 1, etc.

Example 1
First, as shown in Fig. 2, in the ceramic molded body production process (STEP 1), 5 mass% of yttrium oxide ( _Y2O3 ) as a sintering aid was added to 95 mass% of aluminum nitride ( _AlN ) powder, mixed using a solvent, and then spray-dried to obtain ceramic granules. The ceramic granules were then subjected to CIP molding at a pressure of 1 ton/ ^cm2 to obtain an ingot of a ceramic molded body. The ingot was then machined to obtain multiple disc-shaped ceramic molded bodies 10 with a diameter of 340 mm and a thickness of 5 mm.

A recess 12 with a diameter of 300 mm and a depth of 1 mm was formed by machining on one surface 11 of one ceramic molded body 10, centered on the center. Furthermore, a recess 13 with a diameter of 8 mm and a depth of 0.5 mm was formed by machining on the center of this recess 12.

Next, in the electrode placement step (STEP 2) and the connection member placement step (STEP 3), a connection member 30 consisting of a disk-shaped tungsten pellet with a diameter of 8 mm and a thickness of 0.5 mm was placed in the recess 13, and an electrode 20 consisting of a mesh made of plain-woven molybdenum wire with a wire diameter of 0.1 mm cut into a circle with a diameter of 294 mm was placed in the recess 12. The mesh size was #50.

Next, in the stacking step (STEP 4), a total of 10 ceramic molded bodies 10 were stacked in the thickness direction to obtain a ceramic laminate 40. Three ceramic molded bodies 10 were stacked on top of the ceramic molded body 10 on which the electrodes 20 and connection members 30 were arranged, and six ceramic molded bodies 10 were stacked on the bottom.

Next, in the degreasing step (STEP 5), the ceramic laminate 40 was placed in a degreasing furnace, and the temperature inside the furnace was maintained at 500°C in an air atmosphere for 1 hour to degrease the laminate, thereby obtaining a laminate of a ceramic calcined body.

Next, in the firing process (STEP 6), the ceramic calcined body stack was transferred into a carbon mold, which was then placed in a hot press furnace. The stack was pressed in the stacking direction at a pressure of 1 MPa or more while being fired in an argon atmosphere at a furnace temperature of 1800°C for 2 hours, yielding a ceramic sintered body 50.

Next, the entire outer surface of the ceramic sintered body 50 was ground and polished to form a disk shape with a diameter of 320 mm and a thickness of 25 mm. At this time, the distance from the upper surface of the electrode 20 to the upper surface of the ceramic sintered body 50 (insulator thickness) was 0.3 mm. The upper surface of the ceramic sintered body 50 was the wafer mounting surface, and its surface roughness Ra was 0.4 μm.

Next, in the connection hole forming process (STEP 7), a connection hole 52 with a circular cross section and a diameter of 5 mm was formed by machining from the surface 51 of the ceramic sintered body 50 facing the connection member 30 to the connection member 30.

Next, for the connection terminal installation process (STEP 8), a disk-shaped Kovar buffer member (not shown) with a diameter of 5 mm and a thickness of 2 mm and a cylindrical nickel connection terminal 60 with a diameter of 5 mm and a length of 30 mm were prepared.

Then, Au-Ni brazing material was placed between the connection member 30 and the buffer member, and between the buffer member and the connection terminal 60, and in this state, the assembly was placed in a vacuum furnace and heated to 1050°C. This connected the connection member 30, the buffer member, and the connection terminal 60, completing the ceramic member 100.

The color difference at 10 points on the top surface (wafer mounting surface) of the ceramic member 100 was 3.0. The color difference used here is the color difference ΔE* in the L*a*b* color space defined by the International Commission on Illumination (CIE), and the value was measured using the DE2000 color difference formula using a CM-700d manufactured by Konica Minolta.

In addition, when visually inspected by the experimenter, no color unevenness was observed on any of the surfaces of the ceramic member 100.

Example 2
The ceramic member 100 was produced in the same manner as in Example 1, except that in STEP 1, a degreasing step at 500° C. for 4 hours or more was added after machining, and the degreasing step in STEP 5 was omitted. The color difference at 10 points on the upper surface (wafer mounting surface) of the ceramic member 100 was 2.4. In addition, no color unevenness was confirmed on any surface of the ceramic member 100 by visual inspection by an experimenter.

Comparative Example
First, in the ceramic molded body production step (STEP 1), the same ceramic granules as in the example were used and subjected to CIP molding at a pressure of 1 ton/cm ² to obtain an ingot of a ceramic molded body. Then, this ingot was machined to obtain a first ceramic molded body in a disk shape with a diameter of 340 mm and a thickness of 15 mm, and a second ceramic molded body in a disk shape with a diameter of 340 mm and a thickness of 25 mm.

A first recess having a diameter of 300 mm and a depth of 1 mm was then formed by machining on one surface of the first ceramic molded body, centered on the center of the body. Furthermore, a second recess having a diameter of 8 mm and a depth of 0.5 mm was formed by machining, centered on the center of the first recess.

Next, in the electrode placement process (STEP 2) and the connection member placement process (STEP 3), the same connection member 30 as in Example 1 was placed in the second recess, and the same electrode 20 as in Example 1 was placed in the first recess.

Next, in the lamination process (STEP 4), the first and second ceramic compacts were laminated in the thickness direction to obtain a ceramic laminate.

Next, in the degreasing process (STEP 5) and the firing process (STEP 6), the ceramic laminate was heated at the same upper limit as in the example to obtain a ceramic sintered body.

Next, the entire outer surface of the ceramic sintered body was ground and polished to form a disk shape with a diameter of 320 mm and a thickness of 25 mm. At this time, the distance from the upper surface of the electrode 20 to the upper surface of the ceramic sintered body 50 (insulator thickness) was 0.3 mm. The upper surface of the ceramic sintered body 50 was the wafer mounting surface, and its surface roughness Ra was 0.4 μm.

Next, in the connection hole forming process (STEP 7), the same connection hole 52 as in the example was machined to form the ceramic sintered body. Furthermore, in the connection terminal installation process (STEP 8), the same buffer member and connection terminal 60 as in the example were provided in the ceramic sintered body 50 in the same manner as in the example, completing the ceramic member.

The color difference at 10 points on the top surface of the ceramic member was measured in the same manner as in the example, and was found to be 5.2, which was larger than in the example. In addition, when the experimenter visually inspected the ceramic member, linear color unevenness was confirmed on the top surface.

10...ceramic molded body, etc. (ceramic molded body, ceramic calcined body), 11...first surface, upper surface, 12, 13...recess, 20...electrode, 30...connecting member, 40...ceramic laminate, 50...ceramic sintered body, 51...connecting member side surface, lower surface, 52...connecting hole (hole), 60...connecting terminal, 100...ceramic member.

Claims (4)

A step of forming a ceramic raw material powder using a cold isostatic pressing method to prepare a plurality of plate-shaped ceramic molded bodies having a thickness of 2 mm to 6 mm and/or a ceramic calcined body obtained by calcining the plurality of ceramic molded bodies;
A step of disposing an electrode on at least one of the plurality of ceramic molded bodies or the plurality of ceramic calcined bodies;
a step of arranging the electrodes and arranging a conductive lump-shaped connecting member in contact with the electrodes on at least one of the plurality of ceramic molded bodies or the plurality of ceramic calcined bodies;
a step of forming a ceramic sintered body by heating a plurality of the ceramic compacts or the ceramic calcined bodies stacked together while applying pressure in the stacking direction;
forming a hole from one surface of the ceramic sintered body to the connecting member;
providing a connection terminal electrically connected to the connection member and at least a portion of which is located within the hole;
A method for manufacturing a ceramic member, characterized in that at least two of the ceramic molded bodies or the ceramic calcined bodies are stacked above and below in the thickness direction of at least one of the plurality of ceramic molded bodies or the plurality of ceramic calcined bodies on which the electrode is arranged. The method for manufacturing a ceramic member according to claim 1, further comprising a step of placing the electrode in a recess or hole formed in at least one of the plurality of ceramic compacts or the plurality of ceramic calcined bodies. The method for manufacturing a ceramic member according to claim 1, further comprising a step of arranging the electrode and a conductive connecting member in contact with the electrode in a recess or hole formed in at least one of the plurality of ceramic compacts or the plurality of ceramic calcined bodies in which the electrode is to be disposed. The method for manufacturing a ceramic member according to claim 2 or 3, characterized in that at least two of the ceramic molded bodies or the ceramic calcined bodies are stacked above and below in the thickness direction of at least one of the ceramic molded bodies or the ceramic calcined bodies in which the recess or hole is formed.