JP7514086B2 - Wiring Circuit Board Support Assembly - Google Patents

Description

The present invention relates to a printed circuit board support assembly.

Wired circuit boards are used in a variety of industrial products, such as electronic and electrical equipment. Known examples of such wired circuit boards include flexible printed wiring boards with reinforcing layers that have a metal support layer as a reinforcing layer, and circuit-equipped suspension boards that have a metal support layer as a suspension (spring) layer.

In the manufacturing process of such a wired circuit board, first, a wired circuit board support assembly is prepared in which the wired circuit board is supported by a frame, and then the wired circuit board is separated from the wired circuit board support assembly. In such a wired circuit board support assembly, the frame is usually made of the same metal as the metal support layer of the wired circuit board, and the frame and the metal support layer are integrally connected. Therefore, cutting the connection between the wired circuit board and the frame can be complicated.

Therefore, consideration is being given to connecting the wiring circuit board and the frame body with a material different from that of the metal support layer.

For example, a circuit-equipped suspension board assembly sheet has been proposed that includes a plurality of circuit-equipped suspension boards, a frame body that collectively supports the plurality of circuit-equipped suspension boards, and a connecting support portion that connects the plurality of circuit-equipped suspension boards and the frame body, the connecting support portion being formed from a resin material and having a rectangular shape in a plan view (see, for example, FIG. 4 of Patent Document 1).

JP 2019-79584 A

However, during transportation of the circuit-equipped suspension board assembly sheet described in Patent Document 1, a load stress acts on the circuit-equipped suspension board assembly sheet, and the connecting support portion may peel off from the metal support layer and/or the frame.

The present invention provides a wiring circuit board support assembly that can prevent a connection portion from peeling off from a first metal support layer and/or a second metal support layer.

The present invention [1] includes a wired circuit board support assembly including a wired circuit board extending in a predetermined direction, a frame supporting the wired circuit board, and a connection portion connecting the wired circuit board and the frame, the connection portion being formed of a resin material. The wired circuit board includes a first metal support layer, an insulating layer disposed on one side of the first metal support layer in the thickness direction, and a conductor layer disposed on one side of the insulating layer in the thickness direction. The frame includes a second metal support layer disposed at a distance from the first metal support layer. The connection portion includes a first portion disposed on one side of the thickness direction of the first metal support layer and extending in a width direction perpendicular to the longitudinal direction of the wired circuit board, a second portion disposed on one side of the thickness direction of the second metal support layer and extending in the width direction, the second portion being disposed at a distance from the first portion in the longitudinal direction, and a first connection portion connecting a portion of the first portion in the width direction and a portion of the second portion in the width direction.

According to this configuration, the connection portion includes a first portion disposed on one thickness-wise surface of the first metal support layer and extending in the width direction, a second portion disposed on one thickness-wise surface of the second metal support layer and extending in the width direction, and a first coupling portion coupling a portion of the first portion in the width direction and a portion of the second portion in the width direction. Therefore, the connection portion has an H-shape when viewed in the thickness direction.

As a result, compared to when the connection portion has a rectangular shape when viewed in the thickness direction, it is possible to suppress peeling of the connection portion from the first metal support layer and/or the second metal support layer when a load stress acts on the wired circuit board support assembly. This allows the frame body to stably support the wired circuit board.

The present invention [2] includes the printed circuit board support assembly described in [1] above, further comprising a first reinforcing part disposed on the surface of the first connecting part and reinforcing the first connecting part, the first reinforcing part including two or more resin layers stacked in the thickness direction and/or a metal member made of the same metal as the conductor layer.

According to this configuration, the first reinforcing portion is disposed on the surface of the first connecting portion. The first reinforcing portion includes two or more resin layers stacked in the thickness direction and/or a metal member made of the same metal as the conductor layer. This makes it possible to reinforce the first connecting portion. As a result, damage to the first connecting portion can be suppressed when a load stress acts on the wired circuit board support assembly.

The present invention [3] includes the printed circuit board support assembly described in [2] above, in which the first reinforcing portion is made of two or more resin layers laminated in the thickness direction.

With this configuration, since the first reinforcing portion is made of two or more resin layers, the first reinforcing portion and the first connecting portion can be cut more smoothly than when the first reinforcing portion includes a metal member, and the wiring circuit board can be separated more smoothly from the frame body.

The present invention [4] includes a wired circuit board support assembly according to any one of [1] to [3] above, comprising: a plurality of the wired circuit boards arranged at intervals from each other; a second connecting portion connecting a part of the insulating layer of one of the wired circuit boards to a part of the insulating layer of the other of the adjacent wired circuit boards among the plurality of wired circuit boards, the second connecting portion being formed from a resin material; and a second reinforcing portion reinforcing the second connecting portion, the second reinforcing portion being disposed on a surface of the second connecting portion and including two or more resin layers stacked in the thickness direction, and/or a metal member made of the same metal as the conductor layer.

According to this configuration, the second connecting portion connects adjacent wired circuit boards among the multiple wired circuit boards. Therefore, when a load stress acts on the wired circuit board support assembly, deformation of the wired circuit board support assembly can be suppressed, and thus peeling of the connection portion from the first metal support layer and/or the second metal support layer can be stably suppressed.

The second reinforcing portion is disposed on the surface of the second connecting portion. The second connecting portion includes two or more resin layers and/or metal members stacked in the thickness direction. This allows the second connecting portion to be sufficiently reinforced. As a result, damage to the second connecting portion can be suppressed when a load stress acts on the wired circuit board support assembly.

The wiring circuit board support assembly of the present invention can prevent the connection portion from peeling off from the first metal support layer and/or the second metal support layer.

FIG. 1 shows a plan view of an assembly sheet as one embodiment of a printed circuit board support assembly of the present invention. FIG. 2 shows an enlarged view of the suspension board with circuit shown in FIG. FIG. 3 shows a cross-sectional view taken along line AA of the suspension board with circuit shown in FIG. FIG. 4 shows a cross-sectional view of the first connection portion shown in FIG. 2 taken along line BB. FIG. 5 shows a cross-sectional view of the second connection portion shown in FIG. 2 taken along the line CC. FIG. 6 shows a cross-sectional view of the second connecting portion shown in FIG. 2 taken along the line DD. Fig. 7A shows a plan view of a first modified example of the first reinforcing portion (an embodiment having a first reinforcing wire), Fig. 7B shows a cross-sectional view taken along line B-B of Fig. 7A, and Fig. 7C shows a cross-sectional view taken along line B-B of a second modified example of the first reinforcing portion (an embodiment having a first reinforcing wire and a second reinforcing resin layer). 8A shows a DD cross-sectional view of a first modified example of the second reinforcing portion (an embodiment including a second reinforcing wire) and FIG 8B shows a DD cross-sectional view of a second modified example of the second reinforcing portion (an embodiment including a second reinforcing wire and a fourth reinforcing resin layer).

The assembly sheet 1, which is one embodiment of the wiring circuit board support assembly of the present invention, will be described with reference to Figures 1 to 6.

As shown in FIG. 1, the assembly sheet 1 includes a plurality of circuit-equipped suspension boards 2 as an example of a wired circuit board, a frame 3, a plurality of connection portions 4, a plurality of first reinforcing portions 5, a plurality of second connecting portions 6, and a plurality of second reinforcing portions 7. Note that, for convenience, FIG. 1 shows three circuit-equipped suspension boards 2, but the number of circuit-equipped suspension boards 2 is not particularly limited.

1. Suspension Board With Circuit The suspension board with circuit 2 has a generally flat belt shape extending in a predetermined direction.

In FIG. 1, the thickness direction of the paper is the thickness direction (first direction) of the circuit-equipped suspension board 2, with the front side of the paper being one side of the thickness direction (one side of the first direction) and the back side of the paper being the other side of the thickness direction (the other side of the first direction).

In FIG. 1, the up-down direction on the paper surface is the longitudinal direction of the circuit-equipped suspension board 2 (a second direction perpendicular to the first direction), the upper side of the paper surface is one side of the longitudinal direction (one side of the second direction), and the lower side of the paper surface is the other side of the longitudinal direction (the other side of the second direction).

In FIG. 1, the left-right direction on the paper is the width direction of the circuit-equipped suspension board 2 (a third direction perpendicular to the first and second directions), the right side of the paper is one side in the width direction (one side in the third direction), and the left side of the paper is the other side in the width direction (the other side in the third direction). Specifically, the directions follow the directional arrows shown in each figure.

In the following, unless otherwise specified, the thickness direction of the suspension board with circuit 2 will be simply referred to as the thickness direction, the longitudinal direction of the suspension board with circuit 2 will be simply referred to as the longitudinal direction, and the width direction of the suspension board with circuit 2 will be simply referred to as the width direction. Note that the longitudinal direction is perpendicular to the thickness direction, and the width direction is perpendicular to both the longitudinal direction and the thickness direction.

The multiple circuit-equipped suspension boards 2 are arranged at intervals from each other in the width direction.

As shown in Figures 2 and 3, the circuitized suspension board 2 includes a first metal support layer 20, a base insulating layer 21 as an example of an insulating layer, a conductor layer 22, and a cover insulating layer 23 (see Figure 3), which are arranged in this order from the other side to one side in the thickness direction.

As shown in FIG. 2, the first metal support layer 20 is a metal support that supports the conductor layer 22 and extends in the longitudinal direction. For convenience, in FIG. 2, the first metal support layer 20 is shown by solid and dashed lines, the base insulating layer 21 is shown by solid lines, the conductor layer 22 is shown by thick lines, and the cover insulating layer 23 is omitted.

The first metal support layer 20 comprises a gimbal portion 24 and a main body portion 25.

The gimbal portion 24 is located at one end of the first metal support layer 20 in the longitudinal direction. The gimbal portion 24 includes a frame portion 26 and a stage 27.

The frame portion 26 has a rectangular frame shape when viewed from the thickness direction, and defines an opening 28. The frame portion 26 surrounds the stage 27. The frame portion 26 has one longitudinal end 26A, the other longitudinal end 26B, one widthwise end 26C, and the other widthwise end 26D. The one longitudinal end 26A is located on one side of the stage 27 in the longitudinal direction with a gap therebetween. The one longitudinal end 26A extends in the width direction. The other longitudinal end 26B is located on the other side of the stage 27 in the longitudinal direction with a gap therebetween. The other longitudinal end 26B extends in the width direction. The one widthwise end 26C is located on one side of the stage 27 in the width direction with a gap therebetween. The one widthwise end 26C extends in the longitudinal direction. One widthwise end 26C connects one widthwise end of one longitudinal end 26A to one widthwise end of the other longitudinal end 26B. The other widthwise end 26D is located on the other widthwise side of the stage 27 with a gap therebetween. The other widthwise end 26D extends in the longitudinal direction. The other widthwise end 26D connects the other widthwise end of one longitudinal end 26A to the other widthwise end of the other longitudinal end 26B.

The slider 11 can be mounted on the stage 27. The stage 27 is disposed in the opening 28 with a gap between it and the frame 26. The stage 27 has a rectangular shape when viewed in the thickness direction.

The main body portion 25 is a portion supported by a load beam (not shown). The main body portion 25 is located on the other side of the gimbal portion 24 in the longitudinal direction. The main body portion 25 has a flat belt shape extending in the longitudinal direction. The main body portion 25 is continuous with the other longitudinal end portion 26B of the frame portion 26.

Examples of the material for the first metal support layer 20 include metal materials such as stainless steel. The thickness of the first metal support layer 20 is not particularly limited, but is, for example, 10 μm or more and 35 μm or less.

As shown in FIG. 3, the base insulating layer 21 is disposed on one side of the first metal support layer 20 in the thickness direction, specifically, on one surface of the first metal support layer 20 in the thickness direction. The base insulating layer 21 has a predetermined pattern corresponding to the conductor layer 22. The base insulating layer 21 is located between the first metal support layer 20 and the conductor layer 22 in the thickness direction.

As shown in FIG. 2, the base insulating layer 21 includes a stage base 29, a frame base 30, a first main body base 31, and a second main body base 32.

The stage base 29 is located on the stage 27. The stage base 29 has a rectangular shape when viewed in the thickness direction.

The frame body base 30 is located on one side of the stage base 29 in the longitudinal direction. When viewed from the thickness direction, the frame body base 30 overlaps with one longitudinal end 26A of the frame portion 26 and one longitudinal end of the opening 28. One longitudinal end of the frame body base 30 is located on one longitudinal end 26A of the frame portion 26. The frame body base 30 has a rectangular shape extending in the width direction when viewed from the thickness direction. The dimension of the frame body base 30 in the width direction is larger than the dimension of the stage base 29 in the width direction. One end of the stage base 29 in the longitudinal direction is connected to the frame body base 30. One end of the frame body base 30 in the width direction is located on one side of the stage base 29 in the width direction. The other end of the frame body base 30 in the width direction is located on the other side of the stage base 29 in the width direction.

The first body base 31 and the second body base 32 are arranged with a gap between them in the width direction. The first body base 31 is located on one side of the stage base 29 in the width direction. The first body base 31 has a flat band shape extending in the longitudinal direction. The first body base 31 has a first unsupported portion 31A and a first supported portion 31B.

The first unsupported portion 31A is located at one end of the first main body base 31 in the longitudinal direction. When viewed from the thickness direction, the first unsupported portion 31A overlaps with the opening 28. Therefore, the first unsupported portion 31A is not supported by the first metal support layer 20. One end of the first unsupported portion 31A in the longitudinal direction is connected to one widthwise end of the other end of the frame body base 30 in the longitudinal direction.

The first supported portion 31B is located on the other side of the first unsupported portion 31A in the longitudinal direction. The first supported portion 31B is located on the main body portion 25. Therefore, the first supported portion 31B is supported by the main body portion 25. One end of the first supported portion 31B in the longitudinal direction is connected to the other end of the first unsupported portion 31A in the longitudinal direction.

The second main body base 32 is located on the other side in the width direction relative to the stage base 29. The second main body base 32 has a flat band shape extending in the longitudinal direction. The second main body base 32 has a second unsupported portion 32A and a second supported portion 32B.

The second unsupported portion 32A is located at one end of the second main body base 32 in the longitudinal direction. The second unsupported portion 32A overlaps with the opening 28 when viewed in the thickness direction. Therefore, the second unsupported portion 32A is not supported by the first metal support layer 20. One end of the second unsupported portion 32A in the longitudinal direction is connected to the other end in the width direction at the other end of the frame body base 30 in the longitudinal direction. The second unsupported portion 32A is located at a distance from the first unsupported portion 31A on the other side in the width direction.

The second supported portion 32B is located on the other side of the second unsupported portion 32A in the longitudinal direction. The second supported portion 32B is located on the main body portion 25. Therefore, the second supported portion 32B is supported by the main body portion 25. The second supported portion 32B is located on the other side of the first supported portion 31B in the width direction with a gap therebetween. One end of the second supported portion 32B in the longitudinal direction is connected to the other end of the second unsupported portion 32A in the longitudinal direction.

Examples of materials for the base insulating layer 21 include synthetic resins such as polyimide resins.

The thickness of the base insulating layer 21 is not particularly limited, but is, for example, 1 μm or more and 1000 μm or less.

As shown in FIG. 3, the conductor layer 22 is disposed on one side of the base insulating layer 21 in the thickness direction, specifically, on one surface of the base insulating layer 21 in the thickness direction.

As shown in FIG. 2, the conductor layer 22 includes a plurality of slider connection terminals 40, a plurality of external connection terminals 41, and a plurality of wirings 42.

The multiple slider connection terminals 40 are electrically connected to the slider 11 via a bonding material (e.g., solder) when the slider 11 is mounted on the circuit-equipped suspension board 2.

The multiple slider connection terminals 40 are located at one end of the circuit-equipped suspension board 2 in the longitudinal direction. The multiple slider connection terminals 40 are arranged on the stage base 29.

The multiple slider connection terminals 40 are positioned at intervals from each other in the width direction. The multiple slider connection terminals 40 are specifically four slider connection terminals 40. In this embodiment, the number of slider connection terminals 40 is four for convenience, but is not particularly limited. The multiple slider connection terminals 40 include multiple first slider connection terminals 40A and multiple second slider connection terminals 40B. The multiple first slider connection terminals 40A and the multiple second slider connection terminals 40B are positioned at intervals from each other in the width direction. The multiple first slider connection terminals 40A are specifically two first slider connection terminals 40A. The multiple second slider connection terminals 40B are specifically two second slider connection terminals 40B. In this embodiment, the number of each of the first slider connection terminals 40A and the second slider connection terminals 40B is two for convenience, but is not particularly limited. The multiple first slider connection terminals 40A are located on one side in the width direction, and the multiple second slider connection terminals 40B are located on the other side in the width direction.

The multiple external connection terminals 41 are electrically connected to an external board (not shown) when the main body 25 is supported by a load beam (not shown).

The external connection terminals 41 are located at the other end of the circuit-equipped suspension board 2 in the longitudinal direction. The external connection terminals 41 are provided in the same number as the slider connection terminals 40. The external connection terminals 41 include a plurality of first external connection terminals 41A and a plurality of second external connection terminals 41B. The first external connection terminals 41A and the second external connection terminals 41B are located at intervals from each other in the width direction. The first external connection terminals 41A are provided in the same number as the first slider connection terminals 40A. The second external connection terminals 41B are provided in the same number as the second slider connection terminals 40B. The first external connection terminals 41A are located on one side in the width direction, and the second external connection terminals 41B are located on the other side in the width direction. The first external connection terminals 41A are arranged on the other end of the first support portion 31B in the longitudinal direction. The multiple second external connection terminals 41B are arranged on the other end of the second support portion 32B in the longitudinal direction.

The multiple wirings 42 electrically connect the multiple slider connection terminals 40 and the multiple external connection terminals 41. The multiple wirings 42 include multiple first wirings 42A and multiple second wirings 42B. The multiple first wirings 42A and the multiple second wirings 42B are arranged at intervals from each other in the width direction. The multiple first wirings 42A are located on one side in the width direction, and the multiple second wirings 42B are located on the other side in the width direction.

The multiple first wirings 42A electrically connect the multiple first slider connection terminals 40A and the multiple first external connection terminals 41A. The first wirings 42A continue from the first slider connection terminals 40A, pass over the stage base 29 and the first main body base 31 in order, and are connected to the first external connection terminals 41A.

The multiple second wirings 42B electrically connect the multiple second slider connection terminals 40B and the multiple second external connection terminals 41B. The second wirings 42B continue from the second slider connection terminals 40B, pass over the stage base 29 and the second main body base 32 in order, and are connected to the second external connection terminals 41B.

The material of the conductor layer 22 may be, for example, a conductor material such as copper. The thickness of the conductor layer 22 is, for example, 1 μm or more, preferably 3 μm or more, for example, 20 μm or less, preferably 12 μm or less.

As shown in FIG. 3, the cover insulating layer 23 is disposed on one side in the thickness direction of the base insulating layer 21, specifically, on one surface in the thickness direction of the base insulating layer 21, so as to cover the conductor layer 22.

The cover insulating layer 23 has a pattern shape that exposes multiple slider connection terminals 40 and multiple external connection terminals 41 and covers multiple wirings 42.

Examples of the material for the cover insulating layer 23 include synthetic resins such as polyimide resins. The thickness of the cover insulating layer 23 is, for example, 1 μm or more, preferably 2 μm or more, for example, 10 μm or less, preferably 8 μm or less.

1, the frame 3 collectively supports a plurality of suspension boards with circuit 2. The frame 3 is made of a second metal supporting layer 50. The second metal supporting layer 50 is made of the same material as the first metal supporting layer 20 described above.

The second metal support layer 50 has a rectangular frame shape when viewed in the thickness direction, and surrounds the multiple circuitized suspension boards 2. The second metal support layer 50 is disposed at intervals relative to the multiple first metal support layers 20.

The second metal support layer 50 has two first bars 51 and two second bars 52.

The two first bars 51 are arranged at a distance from each other in the width direction so as to sandwich the plurality of circuit-equipped suspension boards 2. The first bar 51 is arranged at a distance from the circuit-equipped suspension board 2 located at the end in the width direction among the plurality of circuit-equipped suspension boards 2. The first bar 51 has a rectangular shape extending in the longitudinal direction when viewed in the thickness direction.

The two second bars 52 are arranged at a distance from each other in the longitudinal direction so as to sandwich the plurality of circuit-equipped suspension boards 2. The second bars 52 are positioned at a distance from the plurality of circuit-equipped suspension boards 2 in the longitudinal direction. The ends of the second bars 52 in the width direction are connected to the first bars 51.

As shown in FIG. 2, of the two second crosspieces 52, the second crosspiece 52 located on one side in the longitudinal direction is referred to as one second crosspiece 52A, and the second crosspiece 52 located on the other side in the longitudinal direction is referred to as the other second crosspiece 52B. One second crosspiece 52A is positioned on one side of the frame portion 26 in the longitudinal direction with a gap therebetween. The other second crosspiece 52B is positioned on the other side of the main body portion 25 in the longitudinal direction with a gap therebetween.

3. Connection Part The connection part 4 connects the suspension board with circuit 2 and the frame body 3. A plurality of connection parts 4 are provided for one suspension board with circuit 2. In the present embodiment, the number of connection parts 4 for one suspension board with circuit 2 is four for convenience, but is not particularly limited. The connection part 4 is formed from a resin material. More specifically, the connection part 4 is formed from the same resin material as the above-mentioned base insulating layer 21.

The multiple connection parts 4 include multiple first connection parts 55 and multiple second connection parts 56.

The multiple first connection parts 55 connect the frame part 26 to one of the second bars 52A. The multiple first connection parts 55 are arranged at intervals in the width direction. Specifically, the multiple first connection parts 55 are two first connection parts 55.

The first connection portion 55 has an H-shape when viewed in the thickness direction. The first connection portion 55 has a first portion 55A, a second portion 55B, and a first connecting portion 55C.

The first portion 55A is disposed on one surface in the thickness direction of the first metal support layer 20. Specifically, the first portion 55A is disposed on one longitudinal end portion 26A of the frame portion 26. The first portion 55A is disposed with a gap in the width direction relative to the frame body base 30. The first portion 55A may be connected to the frame body base 30. When viewed in the thickness direction, the first portion 55A has a rectangular shape extending in the width direction.

The second portion 55B is disposed on one surface in the thickness direction of the second metal support layer 50. Specifically, the second portion 55B is disposed on one of the second bars 52A. The second portion 55B is disposed on one side in the longitudinal direction with a gap relative to the first portion 55A. When viewed in the thickness direction, the second portion 55B has a rectangular shape extending in the width direction.

The first connecting portion 55C connects a part of the first portion 55A in the width direction and a part of the second portion 55B in the width direction. More specifically, the first connecting portion 55C connects a central portion of the first portion 55A in the width direction and a central portion of the second portion 55B in the width direction. The first connecting portion 55C has a rectangular shape extending in the longitudinal direction when viewed in the thickness direction. The dimension of the first connecting portion 55C in the width direction is shorter than the respective dimensions of the first portion 55A and the second portion 55B in the width direction.

The multiple second connection parts 56 connect the main body part 25 and the other second crosspiece 52B. The multiple second connection parts 56 are arranged at intervals in the width direction. Specifically, the multiple second connection parts 56 are two second connection parts 56.

The second connection portion 56 has an H-shape when viewed in the thickness direction. The second connection portion 56 has a similar configuration to the first connection portion 55. In detail, the second connection portion 56 has a first portion 56A, a second portion 56B, and a first connecting portion 56C.

The first portion 56A is disposed on one surface in the thickness direction of the first metal support layer 20. Specifically, the first portion 56A is disposed on the other end of the main body portion 25 in the longitudinal direction.

Of the multiple first portions 56A, the first portion 56A on one side in the width direction is located on the other side in the longitudinal direction relative to the first main body base 31 and is connected to the first main body base 31. The first portion 56A may be disposed at a distance from the first main body base 31.

Of the multiple first portions 56A, the first portion 56A on the other widthwise side is located on the other longitudinal side relative to the second main body base 32 and is connected to the second main body base 32. The first portion 56A may be disposed at a distance from the second main body base 32.

The second portion 56B is disposed on one surface in the thickness direction of the second metal support layer 50. Specifically, the second portion 56B is disposed on the other second crosspiece 52B. The second portion 56B is disposed on the other side in the longitudinal direction with a gap relative to the first portion 56A. The second portion 55B has a rectangular shape extending in the width direction when viewed in the thickness direction.

The first connecting portion 56C connects a part of the first portion 56A in the width direction and a part of the second portion 56B in the width direction. More specifically, the first connecting portion 56C connects a central portion of the first portion 56A in the width direction and a central portion of the second portion 56B in the width direction. The first connecting portion 56C has a rectangular shape extending in the longitudinal direction when viewed in the thickness direction. The dimension of the first connecting portion 56C in the width direction is shorter than the respective dimensions of the first portion 56A and the second portion 56B in the width direction.

The multiple first reinforcement parts 5 correspond to the multiple connection parts 4, and are provided in the same number as the multiple connection parts 4. The multiple first reinforcement parts 5 include multiple first connection reinforcement parts 57 and multiple second connection reinforcement parts 58.

The first connection reinforcement portion 57 reinforces the first linking portion 55C of the first connection portion 55. As shown in FIG. 4, the first connection reinforcement portion 57 is disposed on the surface of the first linking portion 55C. More specifically, the first connection reinforcement portion 57 is disposed on one side of the first linking portion 55C in the thickness direction.

In this embodiment, the first connection reinforcement part 57 is made of two or more resin layers laminated in the thickness direction. Specifically, the first connection reinforcement part 57 includes a first reinforcing resin layer 57A and a second reinforcing resin layer 57B.

The first reinforcing resin layer 57A is disposed on one side of the first connection portion 55 in the thickness direction. The first reinforcing resin layer 57A has the same outer shape as the first connection portion 55, and is H-shaped when viewed in the thickness direction. The first reinforcing resin layer 57A is formed from a resin material. More specifically, the first reinforcing resin layer 57A is formed from the same resin material as the cover insulating layer 23 described above.

The second reinforcing resin layer 57B is disposed on one side of the first reinforcing resin layer 57A in the thickness direction. When viewed in the thickness direction, the second reinforcing resin layer 57B has a rectangular shape extending in the longitudinal direction (see FIG. 2). When viewed in the thickness direction, the central portion of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the first connecting portion 55C. When viewed in the thickness direction, one end of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the second portion 55B. When viewed in the thickness direction, the other end of the second reinforcing resin layer 57B in the longitudinal direction overlaps with the first portion 55A. The second reinforcing resin layer 57B is formed from a resin material.

As shown in FIG. 2, the multiple second connection reinforcement parts 58 reinforce the first connecting part 56C of the second connecting part 56. The second connection reinforcement parts 58 are arranged on the surface of the first connecting part 56C. More specifically, the second connection reinforcement parts 58 are arranged on one side of the first connecting part 56C in the thickness direction.

As shown in FIG. 5, in this embodiment, the second connection reinforcement portion 58 is made of two or more resin layers stacked in the thickness direction. Specifically, the second connection reinforcement portion 58 includes a third reinforcing resin layer 58A and a fourth reinforcing resin layer 58B.

The third reinforcing resin layer 58A is disposed on one side of the second connection portion 56 in the thickness direction. The third reinforcing resin layer 58A has the same outer shape as the second connection portion 56, and is H-shaped when viewed in the thickness direction. The third reinforcing resin layer 58A is formed from a resin material. More specifically, the third reinforcing resin layer 58A is formed from the same resin material as the cover insulating layer 23 described above.

The fourth reinforcing resin layer 58B is disposed on one side of the third reinforcing resin layer 58A in the thickness direction. The fourth reinforcing resin layer 58B has a rectangular shape extending in the longitudinal direction when viewed in the thickness direction (see FIG. 2). The central portion of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the first connecting portion 56C when viewed in the thickness direction. One end of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the first portion 56A when viewed in the thickness direction. The other end of the fourth reinforcing resin layer 58B in the longitudinal direction overlaps with the second portion 56B when viewed in the thickness direction. The fourth reinforcing resin layer 58B is formed from a resin material. More specifically, the fourth reinforcing resin layer 58B is formed from the same resin material as the second reinforcing resin layer 57B described above.

1, the second connecting parts 6 are provided between adjacent suspension boards with circuit 2. Therefore, when the number of the suspension boards with circuit 2 is n, the number of the second connecting parts 6 is (n-1). The second connecting parts 6 are formed from a resin material. More specifically, the second connecting parts 6 are formed from the same resin material as the above-mentioned base insulating layer 21.

The second connecting portion 6 connects a part of the base insulating layer 21 of one circuit-equipped suspension board 2 to a part of the base insulating layer 21 of the other circuit-equipped suspension board 2 in adjacent circuit-equipped suspension boards 2 among the plurality of circuit-equipped suspension boards 2.

More specifically, the second connecting portion 6 connects, of the adjacent circuit-equipped suspension boards 2, a portion of the second support portion 32B of the circuit-equipped suspension board 2 on one widthwise side to a portion of the first support portion 31B of the circuit-equipped suspension board 2 on the other widthwise side.

When viewed in the thickness direction, the second connecting portion 6 has a rectangular shape extending in the width direction. When viewed in the thickness direction, the second connecting portion 6, the portion of the second supported portion 32B that is continuous with the second connecting portion 6, and the portion of the first supported portion 31B that is continuous with the second connecting portion 6 have an H shape.

6. Second Reinforcing Part The second reinforcing parts 7 reinforce the second connecting parts 6. The multiple second reinforcing parts 7 correspond to the multiple second connecting parts 6, and are provided in the same number as the number of the second connecting parts 6.

As shown in FIG. 6, in this embodiment, the second reinforcing portion 7 is made of two or more resin layers stacked in the thickness direction. Specifically, the second reinforcing portion 7 includes a fifth reinforcing resin layer 7A and a sixth reinforcing resin layer 7B.

The fifth reinforcing resin layer 7A is disposed on one side of the second connecting portion 6 in the thickness direction. The fifth reinforcing resin layer 7A has the same outer shape as the second connecting portion 6, and has a rectangular shape extending in the width direction when viewed from the thickness direction. The fifth reinforcing resin layer 7A is formed from a resin material. More specifically, the fifth reinforcing resin layer 7A is formed from the same resin material as the cover insulating layer 23 described above.

The sixth reinforcing resin layer 7B is disposed on one side of the fifth reinforcing resin layer 7A in the thickness direction. When viewed in the thickness direction, the sixth reinforcing resin layer 7B has a rectangular shape extending in the width direction (see FIG. 1). When viewed in the thickness direction, the sixth reinforcing resin layer 7B overlaps with the second connecting portion 6. The sixth reinforcing resin layer 7B is formed from a resin material. In more detail, the sixth reinforcing resin layer 7B is formed from the same resin material as the second reinforcing resin layer 57B and the fourth reinforcing resin layer 58B described above.

As shown in FIG. 2, in the assembly sheet 1, the first connection portion 55 includes a first portion 55A, a second portion 55B, and a first linking portion 55C. The first portion 55A is disposed on one thickness-wise surface of the frame portion 26 and extends in the width direction. The second portion 55B is disposed on one thickness-wise surface of one of the second bars 52A and extends in the width direction. The first linking portion 55C links a portion of the first portion 55A in the width direction and a portion of the second portion 55B in the width direction. Therefore, the first connection portion 55 has an H-shape when viewed in the thickness direction.

As a result, compared to when the first connection portion 55 has a rectangular shape when viewed in the thickness direction, peeling of the first connection portion 55 from the first metal support layer 20 and/or the second metal support layer 50 can be suppressed when a load stress acts on the assembly sheet 1. This allows the frame body 3 to stably support the circuit-equipped suspension board 2.

As shown in FIG. 4, the first connection reinforcement portion 57 is disposed on the surface of the first connecting portion 55C. The first connection reinforcement portion 57 is made of two or more resin layers (first reinforcing resin layer 57A and second reinforcing resin layer 57B) stacked in the thickness direction. This reinforces the first connecting portion 55C. As a result, damage to the first connecting portion 55C can be suppressed when a load stress acts on the assembly sheet 1.

Furthermore, since the first connection reinforcement portion 57 is made of two or more resin layers, the first connection reinforcement portion 57 and the first connecting portion 55C can be smoothly cut during the manufacturing process of the suspension board with circuit 2, and the suspension board with circuit 2 can be smoothly separated from the frame body 3.

As shown in FIG. 1, the second connecting portion 6 connects adjacent circuit-equipped suspension boards 2 among the plurality of circuit-equipped suspension boards 2. Therefore, when a load stress acts on the assembly sheet 1, deformation of the assembly sheet 1 can be suppressed, and thus peeling of the connection portion 4 from the first metal support layer 20 and/or the second metal support layer 50 can be stably suppressed.

The second reinforcing portion 7 is disposed on the surface of the second connecting portion 6. The second reinforcing portion 7 is composed of two or more resin layers (a fifth reinforcing resin layer 7A and a sixth reinforcing resin layer 7B) that are laminated in the thickness direction. This allows the second connecting portion 6 to be sufficiently reinforced. As a result, damage to the second connecting portion 6 can be suppressed when a load stress acts on the assembly sheet 1.

Furthermore, since the second reinforcing portion 7 is made of two or more resin layers, the second reinforcing portion 7 and the second connecting portion 6 can be cut smoothly during the manufacturing process of the suspension board with circuit 2, and adjacent suspension boards with circuit 2 can be smoothly separated from each other.

<Modification>
In the above embodiment, the first reinforcing portion 5 is composed of two or more resin layers laminated in the thickness direction, but the first reinforcing portion is not limited thereto. As shown in Fig. 7A and Fig. 7B, the first reinforcing portion 8 includes a first reinforcing wire 8A as an example of a metal member and a first reinforcing resin layer 8B. Note that, for convenience, in Fig. 7A and Fig. 7B, the first reinforcing portion 8 reinforces the first linking portion 55C of the first connecting portion 55, but the first reinforcing portion 8 may reinforce the first linking portion 56C of the second connecting portion 56.

The first reinforcing wire 8A is disposed on one side of the first connecting portion 55C in the thickness direction. The first reinforcing wire 8A extends in the longitudinal direction. The first reinforcing wire 8A is made of the same metal as the conductor layer 22 described above. The first reinforcing resin layer 8B is disposed on one side of the first connecting portion 55 in the thickness direction so as to cover the first reinforcing wire 8A. The first reinforcing resin layer 8B has the same external shape as the first connecting portion 55, and is H-shaped when viewed in the thickness direction.

As shown in FIG. 7C, the first reinforcing portion 8 may further include a second reinforcing resin layer 8C. The second reinforcing resin layer 8C is disposed on one side of the first reinforcing resin layer 8B in the thickness direction. When viewed from the thickness direction, the second reinforcing resin layer 8C has a rectangular shape extending in the longitudinal direction. When viewed from the thickness direction, the second reinforcing resin layer 8C overlaps with the first reinforcing wiring 8A. The second reinforcing resin layer 8C is formed from a resin material.

In the above embodiment, the second reinforcing portion 7 is made of two or more resin layers stacked in the thickness direction, but the second reinforcing portion is not limited to this. As shown in FIG. 8A, the second reinforcing portion 9 includes a second reinforcing wire 9A as an example of a metal member, and a third reinforcing resin layer 9B.

The second reinforcing wire 9A is arranged on one side of the second connecting portion 6 in the thickness direction. The second reinforcing wire 9A extends in the width direction. The second reinforcing wire 9A is made of the same metal as the conductor layer 22 described above. The third reinforcing resin layer 9B is arranged on one side of the second connecting portion 6 in the thickness direction so as to cover the second reinforcing wire 9A. The third reinforcing resin layer 9B has the same external shape as the second connecting portion 6, and has a rectangular shape extending in the width direction when viewed from the thickness direction.

As shown in FIG. 8B, the second reinforcing portion 9 may further include a fourth reinforcing resin layer 9C. The fourth reinforcing resin layer 9C is disposed on one side of the third reinforcing resin layer 9B in the thickness direction. When viewed from the thickness direction, the fourth reinforcing resin layer 9C has a rectangular shape extending in the width direction. When viewed from the thickness direction, the fourth reinforcing resin layer 9C overlaps with the second reinforcing wiring 9A. The fourth reinforcing resin layer 9C is formed from a resin material.

In the above embodiment, the assembly sheet 1 includes a plurality of circuit-equipped suspension boards 2, but the wired circuit board support assembly of the present invention is not limited to this. The wired circuit board support assembly may include one circuit-equipped suspension board 2, a frame 3 supporting one circuit-equipped suspension board 2, and a connection portion 4 connecting the circuit-equipped suspension board 2 and the frame 3.

In the above embodiment, the assembly sheet 1 includes the second connecting portion 6 and the second reinforcing portion 7, but the wired circuit board support assembly of the present invention is not limited to this. The wired circuit board support assembly does not have to include the second connecting portion 6 and the second reinforcing portion 7.

In the above embodiment, the circuitized suspension board 2 is given as an example of the wiring circuit board, but the wiring circuit board is not limited to the circuitized suspension board 2. The wiring circuit board may be a flexible printed wiring board with a reinforcing layer that includes the first metal support layer 20 as a reinforcing layer.

Even with such a modification, the same effect as the above-described embodiment can be achieved. Furthermore, the above-described embodiment and modification can be combined as appropriate.

REFERENCE SIGNS LIST 1 Assembly sheet 2 Suspension board with circuit 3 Frame 4 Connection portion 5 First reinforcement portion 6 Second coupling portion 7 Second reinforcement portion 20 First metal support layer 21 Base insulating layer 22 Conductive layer 50 Second metal support layer 55 First connection portion 55A First portion 55B Second portion 55C First coupling portion 56 Second connection portion 56A First portion 56B Second portion 56C First coupling portion 57 First connection reinforcement portion 58 Second connection reinforcement portion

Claims (4)

a printed circuit board extending in a predetermined direction;
A frame for supporting the printed circuit board;
a connection portion that connects the wired circuit board and the frame body, the connection portion being made of a resin material;
The printed circuit board is
a first metal support layer;
an insulating layer disposed on one side in a thickness direction of the first metal support layer;
a conductor layer disposed on one side of the insulating layer in the thickness direction,
the frame body is made of a second metal support layer disposed at a distance from the first metal support layer,
The connection portion is
a first portion disposed on one surface in a thickness direction of the first metal support layer and extending in a width direction perpendicular to a longitudinal direction of the wired circuit board;
a second portion disposed on one surface in a thickness direction of the second metal support layer, extending in the width direction, and spaced apart from the first portion in the longitudinal direction;
a first connecting portion connecting a portion of the first portion in the width direction and a portion of the second portion in the width direction. A first reinforcing portion is disposed on a surface of the first connecting portion and reinforces the first connecting portion.
The printed circuit board support assembly of claim 1 , characterized in that the first reinforcement portion includes two or more resin layers stacked in the thickness direction and/or a metal member made of the same metal as the conductor layer. The printed circuit board support assembly according to claim 2, characterized in that the first reinforcing part is made of two or more resin layers laminated in the thickness direction. A plurality of the printed circuit boards arranged at intervals from each other;
a second coupling portion that couples a portion of the insulating layer of one of the plurality of wired circuit boards to a portion of the insulating layer of the other of the adjacent wired circuit boards, the second coupling portion being made of a resin material;
A second reinforcing portion that reinforces the second connecting portion,
The second reinforcing portion is
A second connecting portion is disposed on a surface of the second connecting portion.
The printed circuit board support assembly according to any one of claims 1 to 3, characterized in that it includes two or more resin layers laminated in the thickness direction, and/or a metal member made of the same metal as the conductor layer.

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