JP7511320B2 - Wiring Circuit Board - Google Patents

Description

The present invention relates to a wired circuit board.

Conventionally, electronic devices are composed of elements having multiple wired circuit boards, which are electrically connected. For example, an electronic device has a first wired circuit board that constitutes its main part and a second wired circuit board that constitutes a connection part and an accessory part, and the terminals of the first wired circuit board and the terminals of the second wired circuit board are electrically connected via solder.

Such an electronic device is described in Patent Document 1. Patent Document 1 describes a connection device that is composed of a first circuit board on which a connection land portion is formed, and a second circuit board on which a connection pattern portion is formed near the tip portion in correspondence with the connection land portion. The tip portion of this second circuit board is joined to the first circuit board in a state in which it is bent so as to be perpendicular to the base portion. In other words, the second circuit board has a right-angled shape.

JP 2000-165008 A

However, in recent years, the shapes of electronic devices have become increasingly complex, and the space for joining the first and second wired circuit boards may be limited. For example, as shown in FIG. 11A, a small opening 23 (insertion hole) may be formed on the side of the bottom 21 of the electronic element 20, and a terminal 24 of the first wired circuit board may be present on the bottom surface of the opening 23. In such a case, while inserting the tip 52 of the second wired circuit board 50 into the opening, the terminal of the tip 52 of the second wired circuit board 50 is pressed against the terminal 24 in the opening 23 via a bonding material 30 such as solder, to join these terminals.

However, even if one grasps the base 51 of the second wired circuit board 50 of Patent Document 1 and inserts it horizontally while pressing the tip 52 downward, as shown in FIG. 11B, the force is concentrated at the base 53 (bent portion) of the tip 52, which makes it difficult for the force to reach the entire tip 52 (particularly the terminal located at the tip edge). As a result, the connection between the terminal 24 in the opening 23 and the terminal of the second wired circuit board 50 becomes insufficient.

The present invention provides a wiring circuit board that is easy to join to the terminals of electronic elements.

The present invention [1] includes a wired circuit board comprising a connection part having a first surface extending in a first surface direction and a main body part having a second surface continuous with the connection part and extending in a second surface direction, the connection part comprising a terminal, the main body part comprising wiring, and the first surface and the second surface forming an obtuse angle.

With this wired circuit board, the first surface of the connection portion and the second surface of the main body portion form an obtuse angle. In other words, the main body portion extends in an oblique direction relative to the connection portion. Therefore, when joining the wired circuit board to an electronic element having a terminal in an opening, the main body portion is grasped and the connection portion is pressed in an oblique direction (particularly in a direction along the obtuse angle), so that the force applied to the connection portion can be distributed from the base of the connection portion (the main body portion side) to the tip of the connection portion. Therefore, the tip of the connection portion can be reliably pressed against the terminal in the opening of the electronic element.

In addition, by applying force to one side of the main body in the rotation direction using the connection point between the connection part and the main body as a fulcrum, the tip of the connection part can be pressed forcefully against the terminal inside the opening of the electronic element.

This allows the connection portion of the wiring circuit board to be reliably brought into contact with the terminal surface of the electronic element, facilitating electrical connection between the terminal of the wiring circuit board and the terminal of the electronic element.

The present invention [2] includes the wired circuit board according to [1], in which the main body comprises a first main body having the second surface, and a second main body having a third surface that is continuous with the first main body and extends in the direction of the third surface, the second main body being located on the opposite side of the first main body from the connection portion, and the second surface and the third surface being continuous and forming an obtuse angle.

According to this wired circuit board, the main body comprises a first main body and a second main body that is continuous with the opposite side of the connection, and the second surface of the first main body and the third surface of the second main body form an obtuse angle. That is, the main body comprises a first main body and a second main body that extends diagonally from the first main body. Therefore, the second main body can be set in a desired planar direction, and can be freely positioned on the second main body according to individual external elements. As a result, the degree of freedom in design can be improved.

The present invention [3] includes the wired circuit board described in [2], in which the first surface direction and the third surface direction are substantially parallel.

With this wired circuit board, the first surface direction and the third surface direction are substantially parallel. Therefore, the terminal surface of the electronic element and one surface of the second body portion can be substantially parallel, and an external element can be easily placed on the second body portion.

The present invention [4] includes the wired circuit board according to [1], in which the main body comprises a first main body having the second surface, and a second main body having a third surface that is continuous with the first main body and extends in the direction of the third surface, the second main body being located on the opposite side of the first main body from the connection portion, and the second surface and the third surface being continuous and flush with each other.

According to this wired circuit board, the main body portion includes a second main body portion that is continuous with the opposite side of the connection portion, and the second surface of the first main body portion and the third surface of the second main body portion are flush with each other. Therefore, the number of bending points in the wired circuit board during its manufacture can be reduced. Therefore, damage to the wiring of the wired circuit board caused by the bending process is suppressed.

The present invention [5] includes the wired circuit board according to any one of [1] to [4], in which the connection portion has an opening, and the opening overlaps with the terminal when projected in a direction perpendicular to the first surface direction.

With this wired circuit board, the opening of the connection portion overlaps with the terminal when projected in a direction perpendicular to the first surface direction. Therefore, the bonding material can be brought into contact with the terminal and filled into the opening of the connection portion. This improves the bonding strength between the electronic element and the wired circuit board. Furthermore, when excessive bonding material is placed on the terminal of the electronic element, the excess bonding material can be placed inside the opening. This prevents contamination caused by the excess bonding material.

The present invention [6] includes the wired circuit board according to any one of [1] to [5], in which the connection portion includes a metal support layer, a first insulating layer, and a conductor layer forming the terminal, in that order in the thickness direction, and the main body portion includes a metal support layer, a first insulating layer, a conductor layer forming the wiring, and a second insulating layer, in that order in the thickness direction, and the metal support layer of the connection portion is continuous with the metal support layer of the main body portion.

According to this wired circuit board, the connection portion and the main body portion each include a metal support layer, and these metal support layers are continuous. Therefore, the connection portion and the main body portion have rigidity, and furthermore, the angle between the first surface direction of the connection portion and the second surface direction of the main body portion can be reliably maintained. Therefore, when the tip portion of the connection portion is pressed against the terminal inside the opening of the electronic element, deformation of the connection portion and the main body portion can be suppressed. As a result, the terminal of the wired circuit board can be reliably joined to the terminal of the electronic element.

The wired circuit board of the present invention makes it easy to join the wired circuit to the terminals of the electronic element.

FIG. 1 shows a perspective view of a first embodiment of a wired circuit board according to the present invention. FIG. 2 shows a cross-sectional view taken along line AA of FIG. 3A and 3B show the printed circuit board shown in FIG. 1, with FIG. 3A being a plan view and FIG. 3B being a bottom view. 4A-D are process diagrams for joining the wiring circuit board shown in FIG. 1 to an electronic element, in which FIG. 4A shows a process of placing a bonding material on the electronic element, FIG. 4B shows a process of inserting a connection portion of the wiring circuit board into an opening, FIG. 4C shows a process of joining the electronic element terminal and the connection terminal, and FIG. 4D shows a process of joining an external element and a main body terminal. 5A-5C are modified examples of process diagrams for bonding the wiring circuit board shown in FIG. 4 to an electronic element, in which FIG. 5A shows a process of pressing the wiring circuit board against a bonding material, FIG. 5B shows a process of contacting a first bent portion of the wiring circuit board with a bottom portion, and FIG. 5C shows a process of contacting the entire lower surface of the wiring circuit board with the bottom portion. 6A and 6B show a modified example (a form having no terminal opening) of the first embodiment shown in FIG. 1, where FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line AA. 7A and 7B show a modified example (without a through hole) of the first embodiment shown in FIG. 1, where FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line AA. FIG. 8 shows a modification (having a plurality of connection portions) of the first embodiment shown in FIG. FIG. 9 shows a modified example of the first embodiment shown in FIG. 1 (an embodiment in which connection portions are provided on the front and left sides of the second main body portion). 10A-B show a second embodiment of the wired circuit board of the present invention, where FIG. 10A is a perspective view and FIG. 10B is a cross-sectional view taken along line AA. 11A-B are process diagrams for bonding a conventional wiring circuit board to an electronic element, where FIG. 11A shows a process for placing a bonding material on the electronic element, and FIG. 11B shows a process for bonding a conventional wiring circuit board to the electronic element via the bonding material.

In FIG. 2, the left-right direction of the paper is the front-rear direction (first direction), with the right side of the paper being the front side (one side in the first direction) and the left side of the paper being the rear side (the other side in the first direction). The thickness direction of the paper is the left-right direction (width direction, second direction perpendicular to the first direction), with the front side of the paper being the left side (one side in the width direction, one side in the second direction) and the back side of the paper being the right side (the other side in the width direction, the other side in the second direction). The up-down direction of the paper is the up-down direction (thickness direction, third direction perpendicular to the first and second directions), with the top side of the paper being the top side (one side in the thickness direction, one side in the third direction) and the bottom side of the paper being the bottom side (the other side in the thickness direction, the other side in the third direction). Specifically, it follows the direction arrows in each figure.

First Embodiment
1. Wired Circuit Board A wired circuit board according to a first embodiment of the present invention will be described with reference to Figs. 1 to 3B.

The wired circuit board 1 shown in FIG. 1 has a connection portion 2 and a main body portion 3.

The connection part 2 has a first surface extending in the first surface direction. The first surface is a plane extending in both the front-rear direction and the width direction, and the first surface direction is a direction along the first surface. Specifically, the first surface is the upper surface of the connection part 2 (particularly the upper surface of the metal support layer 6 (support connection part 61) described below). The connection part 2 has a generally rectangular flat plate shape in a plan view. The connection part 2 is disposed on the front-most side of the wired circuit board 1.

As shown in FIG. 2, the connection part 2 includes a metal support layer 6, a base insulating layer 7 (an example of a first insulating layer), a plurality of connection terminals 81 (an example of terminals), a plurality of wirings 83, and a cover insulating layer 9 (an example of a second insulating layer). Specifically, the connection part 2 includes a support connection part 61, a base connection part 71, a plurality (two) of connection terminals 81, a plurality (two) of wirings 83, and a cover connection part 91. The connection part 2 also has a through hole 10.

The main body 3 comprises a first main body 4 and a second main body 5.

The first body part 4 has a second surface extending in the second surface direction. The second surface is a plane that is inclined along both the front-rear direction and the width direction, and the second surface direction is a direction along the second surface. The second surface is specifically the upper surface of the first body part 4 (particularly the upper surface of the metal support layer 6 (first support body part 62) described later). The first body part 4 is arranged so as to be continuous with the rear end edge of the connection part 2 on the rear side of the connection part 2. Specifically, the first body part 4 is arranged between the connection part 2 and the second body part 5 so as to be continuous with each of the rear end edge of the connection part 2 and the front end edge of the second body part 5. In other words, the first body part 4 is a connecting part that connects the connection part 2 and the second body part 5.

The first body portion 4 has a generally rectangular flat plate shape in a plan view. The left-right distance (width) of the first body portion 4 is generally the same as the left-right distance of the connection portion 2.

As shown in FIG. 2, the angle θ ₁ between the second surface and the first surface is an obtuse angle. That is, the second surface and the first surface form one angle θ ₁ that is less than 180° and the other angle θ′ ₁ that exceeds 180° (where θ ₁ + θ′ ₁ = 360°), and θ ₁ is defined as the one angle that is less than 180°. Specifically, the upper surface of the first support main body portion 62 (described later) of the first main body portion 4 and the upper surface of the support connection portion 61 (described later) of the connection portion 2 form an obtuse angle. The angle θ ₁ is, for example, more than 90°, preferably 100° or more, preferably 120° or more, and, for example, less than 180°, preferably 170° or less, more preferably 150° or less.

The first body portion 4 includes a metal support layer 6, a base insulating layer 7, a plurality of wirings 83, and a cover insulating layer 9. Specifically, the first body portion 4 includes a first support body portion 62, a first base body portion 72, a plurality (two) of wirings 83, and a first cover body portion 92.

The second body portion 5 has a third surface extending in the third surface direction. The third surface is a plane extending in both the front-rear direction and the width direction, and the third surface direction is a direction along the third surface. Specifically, the third surface is the upper surface of the second body portion 5 (particularly the upper surface of the metal support layer 6 (second support body portion 63) described later). The second body portion 5 is located on the opposite side of the first body portion 4 from the connection portion 2. In other words, the second body portion 5 is arranged so as to be continuous with the rear end edge of the first body portion 4 on the rear side of the first body portion 4.

The second body portion 5 has a generally rectangular flat plate shape in plan view. The left-right distance (width) of the second body portion 5 is longer than the left-right distance of the connection portion 2. The area of the second body portion 5 in plan view is larger than each of the areas of the connection portion 2 and the first body portion 4 in plan view. The area of the second body portion 5 in plan view is preferably at least twice, and preferably at least five times, the area of the connection portion 2 in plan view, and is, for example, no greater than 100 times. The area of each portion (connection portion 2, first body portion 4, second body portion 5) in plan view refers to the area when viewed from a direction perpendicular to the surface direction (first to third surface directions) of each portion.

The angle θ ₂ between the third surface and the second surface is an obtuse angle. That is, the third surface and the second surface form one angle θ ₂ that is less than 180° and the other angle θ' ₂ that exceeds 180° (where θ ₂ +θ _{' 2} =360°), and θ ₂ is defined as the one angle that is less than 180°. Specifically, the upper surface of the second support body portion 63 (described later) of the second body portion 5 and the upper surface of the first support body portion 62 (described later) of the first body portion 4 form an obtuse angle. The angle θ ₂ is, for example, more than 90°, preferably 100° or more, preferably 120° or more, and, for example, less than 180°, preferably 170° or less, more preferably 150° or less.

The third surface is approximately parallel to the first surface. In other words, the second body portion 5 is not inclined with respect to the connection portion 2. Specifically, the angle (acute angle) between the extension surface of the third surface and the extension surface of the first surface is, for example, 5° or less, preferably 3° or less, and more preferably 0°.

The second body portion 5 includes a metal support layer 6, a base insulating layer 7, a plurality of body terminals 82, a plurality of wirings 83, and a cover insulating layer 9. Specifically, it includes a second support body portion 63, a second base body portion 73, a plurality (two) of body terminals 82, a plurality (two) of wirings 83, and a second cover body portion 93.

Next, the layer structure of the wired circuit board 1 will be described. As shown in FIG. 2, the wired circuit board 1 includes, in order from the top, a metal support layer 6, a base insulating layer 7, a conductor layer 8, and a cover insulating layer 9.

The metal support layer 6 is disposed on the top layer of the wiring circuit board 1. The metal support layer 6 forms the outer shape of the wiring circuit board 1, and as shown in Figures 3A-B, has a generally rectangular shape in plan view with the left end on the leading side protruding in a convex shape.

As shown in Figures 2 and 3A, the metal support layer 6 is integrally provided with a support connection portion 61 corresponding to the connection portion 2, a first support body portion 62 corresponding to the first body portion 4, and a second support body portion 63 corresponding to the second body portion 5. The support connection portion 61, the first support body portion 62, and the second support body portion 63 are continuous in the front-rear direction.

The support connection portion 61 has a plurality (two) of front support openings 64 that penetrate the metal support layer 6 in the up-down direction. The front support openings 64 are formed at intervals in the left-right direction on the front side of the support connection portion 61. The front support openings 64 have a generally circular shape in a plan view. When projected in the up-down direction, the front support openings 64 overlap with the front base openings 74, terminal openings 84, and cover openings 94 described below. Specifically, when projected in the up-down direction, the front support openings 64 include the front base openings 74, terminal openings 84, and cover openings 94.

The second support body 63 has a plurality (two) of rear support openings 65 formed therein, which penetrate the metal support layer 6 in the vertical direction. The rear support openings 65 are formed at intervals on the left and right edges of the rear side of the second support body 63. The rear support openings 65 have a generally circular shape in a plan view. When projected in the vertical direction, the rear support openings 65 overlap with the rear base openings 75 described below, and specifically include the rear base openings 75.

The material of the metal support layer 6 can be appropriately selected from known or commonly used metal materials. Specifically, the metal material can be a metal element classified in Groups 1 to 16 of the periodic table, or an alloy containing two or more of these metal elements (e.g., stainless steel). The metal material can be either a transition metal or a typical metal. More specifically, the metal material can be, for example, a Group 2 metal element such as calcium, a Group 4 metal element such as titanium or zirconium, a Group 5 metal element such as vanadium, a Group 6 metal element such as chromium, molybdenum, or tungsten, a Group 7 metal element such as manganese, a Group 8 metal element such as iron, a Group 9 metal element such as cobalt, a Group 10 metal element such as nickel or platinum, a Group 11 metal element such as copper, silver, or gold, a Group 12 metal element such as zinc, a Group 13 metal element such as aluminum or gallium, or a Group 14 metal element such as germanium or tin.

The thickness of the metal support layer 6 is, for example, 10 μm or more, preferably 30 μm or more, and, for example, 150 μm or less, preferably 100 μm or less.

The base insulating layer 7 is disposed on the underside (lower surface) of the metal support layer 6. The outline of the base insulating layer 7 coincides with the outline of the metal support layer 6 when projected in the vertical direction.

The base insulating layer 7 integrally comprises a base connection portion 71 corresponding to the connection portion 2, a first base body portion 72 corresponding to the first body portion 4, and a second base body portion 73 corresponding to the second body portion 5. The base connection portion 71, the first base body portion 72, and the second base body portion 73 are continuous in the front-to-rear direction.

The base connection portion 71 has a plurality (two) of front base openings 74 that penetrate the base insulating layer 7 in the up-down direction. The front base openings 74 are formed at intervals in the left-right direction on the front side of the base connection portion 71. The front base openings 74 have a generally circular shape in a plan view. The front base openings 74 are included in the front support opening 64 when projected in the up-down direction.

The second base body portion 73 has a plurality (two) rear base openings 75 that penetrate the base insulating layer 7 in the vertical direction. The rear base openings 75 are formed at intervals on the left and right rear edges of the second base body portion 73. The rear base openings 75 have a generally circular shape in a plan view. The rear base openings 75 are included in the rear support opening 65 when projected in the vertical direction.

The material of the base insulating layer 7 can be appropriately selected from known or commonly used insulating materials. Specific examples of insulating materials include synthetic resins such as polyimide resin, polyamideimide resin, acrylic resin, polyethernitrile resin, polyethersulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Preferably, the base insulating layer 7 is made of polyimide resin.

The thickness of the base insulating layer 7 is, for example, 1 μm or more, preferably 3 μm or more, and, for example, 30 μm or less, preferably 20 μm or less.

The conductor layer 8 is disposed on the lower surface of the base insulating layer 7. The conductor layer 8 is integrally provided with a plurality (two) of connection terminals 81, a plurality (two) of main body terminals 82, and a plurality of wirings 83. The connection terminals 81, the wirings 83, and the main body terminals 82 are continuous in the front-to-rear direction.

Multiple (two) connection terminals 81 (81a, 81b) are arranged at a distance from each other at the tip of the connection portion 2. The connection terminals 81 have a generally circular shape in a plan view. When projected in the up-down direction, the connection terminals 81 are included in the tip support opening 64. The underside of the central portion of the connection terminal 81 is exposed from the cover insulating layer 9.

The connection terminal 81 has a terminal opening 84 that penetrates the connection terminal 81 in the vertical direction. The terminal opening 84 has a generally circular shape in a plan view. The terminal opening 84 coincides with the tip base opening 74 when projected in the vertical direction.

The multiple (two) main body terminals 82 (82a, 82b) are arranged at intervals from each other at both widthwise ends (left end and right end) of the rear side of the main body portion 3. The main body terminals 82 have a generally circular shape in a plan view. When projected in the vertical direction, the main body terminals 82 overlap with the rear support opening 65 and the rear base opening 75, and specifically, are included in the rear support opening 65 and include the rear base opening 75. As a result, the upper surface of the center portion of the main body terminal 82 is exposed from the metal support layer 6 and the base insulating layer 7.

Multiple wirings 83 (83a, 83b) are arranged on the undersides of the base connection portion 71, the first base body portion 72, and the second base body portion 73 so as to connect the connection terminals 81 and the body terminals 82.

Specifically, the left wiring 83a extends rearward from the rear end edge of the left connection terminal 81a, and in the connection part 2, the first body part 4, and the second body part 5, extends rearward along the external shape of the wired circuit board 1, and reaches the tip edge of the left body terminal 82a. The right wiring 83b extends rearward from the rear end edge of the right connection terminal 81b, extends rearward along the external shape of the wired circuit board 1 in the connection part 2 and the first body part 4, bends to the right at the tip part of the second body part 5, and then extends rightward along the external shape of the wired circuit board 1, and at the right end part of the first body part 4, bends to the rear, and then extends rearward along the external shape of the wired circuit board 1, and reaches the tip edge of the right body terminal 82b.

The material of the conductor layer 8 can be appropriately selected from known or commonly used metal conductor materials. Specific examples of metal conductor materials include copper, nickel, gold, solder, and alloys thereof. Preferably, the conductor layer 8 is made of copper.

The thickness of the conductor layer 8 is, for example, 1 μm or more, preferably 3 μm or more, and, for example, 30 μm or less, preferably 20 μm or less.

The cover insulating layer 9 is disposed on the underside of the base insulating layer 7 and the multiple wirings 83. Specifically, the cover insulating layer 9 is disposed on the underside of the base insulating layer 7 so as to cover the underside and side surfaces of the multiple wirings 83. The outer shape of the cover insulating layer 9 coincides with the outer shape of the metal support layer 6 when projected in the vertical direction.

As shown in Figures 2 and 3B, the cover insulating layer 9 integrally includes a cover connection portion 91 corresponding to the connection portion 2, a first cover body portion 92 corresponding to the first body portion 4, and a second cover body portion 93 corresponding to the second body portion 5. The cover connection portion 91, the first cover body portion 92, and the second cover body portion 93 are continuous in the front-to-rear direction.

The cover connection portion 91 has a plurality (two) of cover openings 94 formed therein, which penetrate the cover insulating layer 9 in the vertical direction. The cover openings 94 are formed at intervals in the left-right direction at the tip side of the cover connection portion 91. The cover openings 94 have a generally circular shape in a plan view. When projected in the vertical direction, the cover openings 94 overlap with the connection terminals 81, and specifically, are included in the connection terminals 81. As a result, the cover openings 94 expose the underside of the central portion of the connection terminals 81.

The material of the cover insulating layer 9 can be appropriately selected from known or commonly used insulating materials. Specifically, the same insulating material as that of the base insulating layer 7 can be used. Preferably, the cover insulating layer 9 is made of a polyimide resin.

The thickness of the cover insulating layer 9 is, for example, 1 μm or more, preferably 3 μm or more, and, for example, 30 μm or less, preferably 20 μm or less.

In addition, in the connection part 2, the front support opening 64, the front base opening 74, the terminal opening 84, and the cover opening 94 are in communication with each other in the vertical direction and penetrate the connection part 2 in the vertical direction. The front support opening 64, the front base opening 74, the terminal opening 84, and the cover opening 94 form a through hole 10, which is an example of an opening. The through hole 10 overlaps with the connection terminal 81 when projected in the vertical direction.

2. Manufacturing Method of Wired Circuit Board Next, one embodiment of a manufacturing method of the wired circuit board 1 will be described.

In this method, first, a metal support layer 6 is prepared.

Specifically, a metal support plate made of a metal material is prepared. Preferably, a stainless steel plate is prepared.

Next, the base insulating layer 7 is formed on the underside of the metal support layer 6.

Specifically, a varnish of a photosensitive insulating material (e.g., photosensitive polyimide) is applied to the entire lower surface of the metal support layer 6 as the material for the base insulating layer 7, and then dried to form a base film. The base film is then exposed to light through a photomask having a pattern corresponding to the base openings (74, 75). The base film is then developed and, if necessary, heated and cured.

Next, the conductor layer 8 is formed on the underside of the base insulating layer 7.

Specifically, the conductor layer 8 is formed on the lower surface of the base insulating layer 7 by a pattern forming method such as an additive method or a subtractive method, preferably an additive method. At this time, patterning is performed so that a terminal opening 84 is formed in the connection terminal 81.

Next, the cover insulating layer 9 is formed on the underside of the wiring 83 and the base insulating layer 7.

Specifically, the cover insulating layer 9 is formed on the entire lower surface of the base insulating layer 7 so as to cover the lower and side surfaces of the multiple wirings 83. The method for forming the cover insulating layer 9 is the same as the method for forming the base insulating layer 7. At this time, the cover film is exposed and developed so that a cover opening 94 is formed in the cover insulating layer 9.

This results in a laminate having, in order, a metal support layer 6, a base insulating layer 7, a conductor layer 8 and a cover insulating layer 9.

Next, the exterior shape is processed and support openings (64, 65) are provided.

Specifically, the laminate is cut by etching or the like to correspond to the external shapes of the connection portion 2, the first body portion 4, and the second body portion 5.

In addition, a front support opening 64 and a rear support opening 65 are formed in the metal support layer 6 by etching or the like.

Next, the folding process is carried out.

Specifically, the laminate is folded so that the connection portion 2 and the first body portion 4 are folded at a first bent portion 11 (a joint between the connection portion 2 and the first body portion 4) such that the first surface and the second surface form an angle θ _1. Meanwhile, the laminate is folded so that the first body portion 4 and the second body portion 5 are folded at a second bent portion 12 (a joint between the first body portion 4 and the second body portion 5) such that the second surface and the third surface form an angle θ ₂ .

This results in a wired circuit board 1 as shown in Figure 1.

3. Bonding Between the Wired Circuit Board and the Electronic Element Next, one embodiment of a method for bonding to the electronic element 20 will be described with reference to Figures 4A to 5C.

As shown in FIG. 4A, a bonding material 30 is placed on the upper surface of the electronic element terminal 24 of the electronic element 20.

The electronic element 20 has a bottom 21 and a side 22. A side opening 23 is formed on the side of the side 22 so as to be recessed from the side toward the side. An electronic element terminal 24 is disposed at the bottom of the side opening 23 and is connected to wiring (not shown) within the electronic element 20.

Examples of the bonding material 30 include conductive materials such as solder and conductive adhesive (e.g., silver paste).

As shown in FIG. 4B, the connection portion 2 of the wiring circuit board 1 is inserted into the side opening 23. At this time, the wiring circuit board 1 is inserted so that the lower surface of the connection portion 2 and the bonding material 30 are arranged facing each other in the vertical direction with a gap between them.

As shown in Figure 4C, press the wired circuit board 1 downward.

Specifically, the lower surface of the connection portion 2 is brought into contact with the electronic element terminal 24 via the bonding material 30. At this time, the second body portion 5 is gripped and pressed in the direction of the angle θ ₁ (diagonal direction). This makes it easier for the force to be transmitted to the entire connection portion 2 (particularly the tip portion of the connection portion 2) via the first body portion 4, and the entire lower surface of the connection portion 2 is strongly pressed against the bonding material 30.

As a result, the bonding material 30 fills the through hole 10. That is, the bonding material 30 passes through the cover opening 94, the terminal opening 84, and the tip base opening 74, and reaches the tip support opening 64. Specifically, the bonding material 30 fills the entire interior of the cover opening 94, the terminal opening 84, and the tip base opening 74, and fills a part of the tip support opening 64. In the tip support opening 64, the bonding material 30 covers the upper surface of the base connection portion 71 around the terminal opening 84, but does not come into contact with the metal support layer 6.

At this time, if the bonding material 30 is heated, it will be solidified by cooling it to room temperature.

As a result, the connection terminals 81 of the wiring circuit board 1 are electrically connected to the electronic element terminals 24 via the bonding material 30, and the wiring circuit board 1 is fixed to the electronic element 20. In other words, the wiring circuit board 1 is bonded to the electronic element 20.

Depending on the fluidity of the bonding material 30 and the strength of the pressure, the bonding material 30 may remain between the underside of the connection portion 2 and the electronic element terminal 24, as shown in FIG. 5A. Specifically, due to the complex shape, heat is not easily transferred to the bonding material 30 inside the side opening 23, and the bonding material 30 may be highly viscous or hard.

In such a case, as shown in FIG. 5B, the lower surface of the first bent portion 11 is pressed against the bottom 21 of the electronic element 20, and a force is applied counterclockwise around the first bent portion 11 as a fulcrum. This makes it easier to apply a stronger counterclockwise (i.e., downward) force to the tip of the connection portion 2 with the first bent portion 11 as the center, so that the bonding material 30 can be easily moved into the through hole 10 as shown in FIG. 5C. As a result, the entire lower surface of the connection portion 2 comes into contact with the bottom 21 of the side opening 23, and the connection terminal 81 of the wiring circuit board 1 is electrically connected to the electronic element terminal 24 via the bonding material 30.

After that, as shown in FIG. 4D, the external element 35 is bonded to the main body terminal 82 as necessary. That is, the external element 35 is electrically connected to the main body terminal 82 via the bonding material 30.

This results in a substrate-bonded electronic device 40 that includes an electronic element 20, an external element 35, and a wiring circuit board 1 electrically connected to these.

4. Uses of the Wired Circuit Board The wired circuit board 1 is used for various purposes, such as a circuit board for electronic devices and a circuit board for electric devices. Examples of such electronic component circuit boards and electrical component circuit boards include circuit boards (sensor circuit boards) used in various sensors such as position information sensors, obstacle detection sensors, and temperature sensors; circuit boards (transport vehicle circuit boards) used in various transport vehicles such as automobiles, trains, aircraft, and work vehicles; circuit boards (video device circuit boards) used in various video devices such as flat panel displays, flexible displays, and projection-type video devices; circuit boards (video device circuit boards) used in various communication relay devices such as various network devices and large communication devices; circuit boards (information processing terminal circuit boards) used in information processing terminals such as computers, tablets, smartphones, and home video games; circuit boards (mobile device circuit boards) used in movable devices such as drones and robots; circuit boards (medical device circuit boards) used in various medical devices such as wearable medical devices and medical diagnostic devices; circuit boards (electrical device circuit boards) used in various electrical devices such as refrigerators, washing machines, vacuum cleaners, and air conditioners; and circuit boards (recording electronic device circuit boards) used in various recording electronic devices such as digital cameras and DVD recorders.

In this wired circuit board 1, the first surface of the connection portion 2 and the second surface of the first body portion 4 are continuous and form an obtuse angle θ _1. That is, the first body portion 4 extends in an oblique direction with respect to the connection portion 2. Therefore, when joining the wired circuit board 1 to the electronic element 20 having the electronic element terminal 24 in the side opening 23, the force applied to the connection portion 2 can be dispersed from the base of the connection portion 2 (the body portion 3 side) to the tip side of the connection portion 2 by gripping the body portion 3 and pushing it in an oblique direction (particularly, in the direction of the obtuse angle θ ₁ ). Therefore, the tip portion of the connection portion 2 can be reliably pressed against the electronic element terminal 24 in the side opening 23 of the electronic element 20.

In addition, by applying force to one side of the main body 3 in the rotation direction using the connection point (first bent portion 11) between the connection portion 2 and the first main body portion 4 as a fulcrum, the tip of the connection portion 2 can be forcefully pressed against the electronic element terminal 24 inside the side opening 23 via the bonding material 30.

Therefore, the connection portion 2 of the wiring circuit board 1 can be reliably brought into contact with the bottom portion 21 and the electronic element terminal 24, and the connection terminal 81 and the electronic element terminal 24 can be easily electrically connected via the bonding material 30.

In addition, in this wired circuit board 1, the main body portion 3 includes a first main body portion 4 having a second surface, and a second main body portion 5 having a third surface that is continuous with the first main body portion 4 and extends in the direction of the third surface. The second main body portion 5 is located on the opposite side of the first main body portion 4 from the connection portion 2. The second surface and the third surface are continuous with each other to form an obtuse angle _θ2 .

To this end, the main body 3 comprises a first main body 4 and a second main body 5 extending diagonally from the first main body 4. Therefore, the second main body 5 can be set in a desired planar direction, and can be freely arranged on the second main body 5 according to each external element 35. As a result, the degree of freedom in design can be improved.

In addition, in this wired circuit board 1, the first surface direction and the third surface direction are approximately parallel.

This allows the terminal surface of the electronic element 20 (the surface of the bottom 21) to be approximately parallel to the upper surface of the second body portion 5, making it easy to place the external element 35 on the second body portion 5.

In addition, in this wired circuit board 1, the connection portion 2 has a through hole 10, which overlaps with the connection terminal 81 when projected in the vertical direction.

As a result, the bonding material 30 can be brought into contact with the connection terminal 81 and can be filled into the through hole 10 of the connection portion 2. This improves the bonding strength between the electronic element 20 and the wired circuit board 1.

Furthermore, when an excess of bonding material 30 is placed on the electronic element terminal 24, the excess bonding material 30 can be filled inside the through hole 10. In particular, the excess bonding material 30 can be sufficiently released inside the tip support opening 64. Therefore, contamination of the periphery of the electronic element terminal 24 by the excess bonding material 30 can be suppressed.

In addition, in this wired circuit board 1, the connection portion 2 includes, in the vertical direction, a support connection portion 61, a base connection portion 71, and a conductor layer 8 that forms a connection terminal 81. The first body portion 4 includes, in the vertical direction, a first support body portion 62, a first base body portion 72, a conductor layer 8 that forms wiring 83, and a first cover body portion 92. The first support body portion 62 is continuous with the support connection portion 61.

Therefore, the connection portion 2 and the main body portion 3 have rigidity, and can reliably maintain the obtuse angle θ ₁ between the first surface direction of the connection portion 2 and the second surface direction of the second main body portion 5. Therefore, deformation of the connection portion 2 and the second main body portion 5 can be suppressed when the tip portion of the connection portion 2 is pressed against the electronic element terminal 24. As a result, the connection terminal 81 can be reliably joined to the electronic element terminal 24.

5. Modifications of the First Embodiment In the embodiment shown in FIGS. 1 to 3B, the connection terminal 81 has a terminal opening 84 in the through hole 10 of the connection portion 2. However, for example, as shown in FIGS. 6A and 6B, the connection terminal 81 does not have to have a terminal opening 84 in the through hole 10 of the connection portion 2.

In the embodiment shown in Figures 6A-B, the connection terminal 81 has a linear shape extending in the front-rear direction. The width (left-right distance) of the connection terminal 81 is the same as the width of the wiring 83 and is smaller than the diameter (width) of the front base opening 74. The cover opening 94 coincides with the front base opening 74 when projected in the up-down direction. As a result, the connection portion 2 forms a through hole that penetrates the connection portion 2 in the area within the front base opening 74 and other than the connection terminal 81.

The embodiment shown in Figures 6A-B also provides the same effects as the embodiment shown in Figure 1.

In the embodiment shown in Figures 1-3B, the opening of the connection part 2 is a through hole that penetrates the connection part 2, but for example, as shown in Figures 7A-B, the opening may be a recess 13 (an example of an opening) that does not penetrate the connection part 2.

In the embodiment shown in Figures 7A-B, the recess 13 penetrates the cover connection portion 91, but does not penetrate the metal support layer 6, the base insulating layer 7, or the connection terminal 81. That is, the recess 13 has only a cover opening 94. The cover opening 94 exposes the underside of the central portion of the connection terminal 81.

The embodiment shown in Figures 7A-B also provides the same effects as the embodiment shown in Figures 1-3B and 6A-B. The embodiments shown in Figures 1-3B and 6A-B are preferred. In these embodiments, when excess bonding material 30 is placed on the electronic element terminal 24, the excess bonding material 30 is discharged from the top of the through hole 10. This makes it possible to remove excess bonding material 30 between the lower surface of the connection portion 2 and the electronic element terminal 24, thereby suppressing contamination around the electronic element terminal 24.

Furthermore, the planar shape of the through hole 10 and the recess 13 is not limited, and can be, for example, rectangular or elliptical, although not shown.

The surfaces of the connection terminal 81 and the main body terminal 82 may be provided with a plating layer of Au, Ni, or the like.

In the embodiment shown in Figures 1 to 3B, the first surface direction and the third surface direction are approximately parallel, but for example, although not shown, the angle between the first surface (or a surface extending from it) and the third surface (or a surface extending from it) may be an obtuse angle. The obtuse angle is, for example, greater than 90°, preferably 100° or more, preferably 120° or more, and for example, less than 180°, preferably 170° or less, more preferably 150° or less. From the viewpoint of being able to easily place the external element 35 on the second body portion 5, the embodiment shown in Figures 1 to 3B is preferably used.

In the embodiment shown in Figures 1 to 3B, the metal support layer 6 is disposed on the top surface, but for example, although not shown, the metal support layer 6 may be disposed on the bottom surface. That is, in the layer configuration, the wired circuit board 1 may have, in order from the top, a base insulating layer 7, a conductor layer 8, a cover insulating layer 9, and a metal support layer 6.

In the embodiment shown in FIG. 1, the wired circuit board 1 has one connection portion 2 and one first body portion 4, but the number of connection portions 2 and first body portions 4 is not limited. For example, as shown in FIG. 8, it may have multiple (two or more) connection portions 2 and first body portions 4. In the embodiment shown in FIG. 8, one connection terminal 81 and wiring 83 are arranged in each connection portion 2.

In the embodiment shown in FIG. 8, the connecting portion 2 and the first body portion 4 are provided on the front side of the second body portion 5, but the positions of the connecting portion 2 and the first body portion 4 are not limited. For example, as shown in FIG. 9, the connecting portion 2 and the first body portion 4 can be provided on the front side and the left side, respectively, of the second body portion 5. Also, although not shown, one or more connecting portions 2 and first body portions 4 can be provided on the front side and the rear side, respectively, of the second body portion 5.

Second Embodiment
10A-B, a second embodiment of the wired circuit board according to the present invention will be described. In the second embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

In the first embodiment, the second surface forms an obtuse angle with the third surface, but in the second embodiment, as shown in Figures 10A-B, the second surface direction does not intersect with the third surface direction. That is, the second surface and the third surface are flush. Specifically, the upper surface of the first support main body portion 62 and the upper surface of the second support main body portion 63 are flush. In the wired circuit board 1 of the second embodiment, the main body portion 3 does not have the second bent portion 12 and is not bent.

The second embodiment also provides the same effects as the first embodiment.

In the second embodiment, the number of bending points can be reduced. That is, the bending point can be limited to the first bending portion 11. Therefore, damage (breakage) of the wiring 83 near the second bending portion 12 caused by the bending process during the manufacture of the wired circuit board 1 can be prevented.

In the second embodiment, the same modifications as in the first embodiment, i.e., the embodiments in Figures 6A to 9, can be applied.

In the first and second embodiments, the electronic element 20 may be a device or component independent of the wiring circuit board 1, or may form a single device or component together with the wiring circuit board 1. In addition, the shape of the electronic element 20 is not particularly limited as long as it can be connected to the wiring circuit board 1.

REFERENCE SIGNS LIST 1 Wired circuit board 2 Connection portion 3 Body portion 4 First body portion 5 Second body portion 6 Metal support layer 7 Base insulating layer 8 Conductor layer 9 Cover insulating layer 10 Through hole 13 Recess 81 Connection terminal 83 Wiring

Claims (4)

A connection portion having a first surface extending in a first surface direction;
a main body portion having a second surface extending in a second surface direction and continuous with the connection portion,
The wired circuit board includes a metal support layer, a base insulating layer, a conductor layer, and a cover insulating layer in this order from one side to the other side in a thickness direction,
the first surface is a surface of the connection portion on one side in a thickness direction of the metal support layer,
The second surface is a surface on one side in a thickness direction of the metal support layer of the main body,
The connection portion includes a terminal on the conductor layer ,
The main body portion includes wiring,
the first surface and the second surface form an obtuse angle;
The obtuse angle is equal to or greater than 100° and equal to or less than 150°,
The connection portion has an opening,
The opening penetrates the connection portion in a direction perpendicular to the first surface direction,
the opening overlaps with the terminal when projected in a direction perpendicular to the first surface direction,
the opening includes, in order from one side to the other side in the thickness direction, a front support opening penetrating the metal support layer in a thickness direction, a front base opening penetrating the base insulating layer in a thickness direction, a terminal opening penetrating the terminal in the thickness direction, and a cover opening penetrating the cover insulating layer in the thickness direction;
a front support opening, when projected from one side in a thickness direction to the other side, including the front base opening, the terminal opening, and the cover opening, and the cover opening exposes the other side in the thickness direction of a central portion of the terminal . The main body portion is
a first body portion having the second surface;
a second body portion that is continuous with the first body portion and has a third surface that extends in a third surface direction;
the second body portion is located on an opposite side of the first body portion from the connection portion,
2. The wired circuit board according to claim 1, wherein said second surface and said third surface are continuous and form an obtuse angle. The printed circuit board according to claim 2, characterized in that the first surface direction and the third surface direction are substantially parallel. The main body portion is
a first body portion having the second surface;
a second body portion that is continuous with the first body portion and has a third surface that extends in a third surface direction;
the second body portion is located on an opposite side of the first body portion from the connection portion,
2. The wired circuit board according to claim 1, wherein the second surface and the third surface are continuous and flush with each other.

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