JP7500822B2 - Laminated molding manufacturing system - Google Patents

Description

The present invention relates to a method for manufacturing laminated molded products and a system for manufacturing laminated molded products.

Lamination devices and methods have been developed to manufacture circuit boards, IC boards, etc. by laminating a lamination material, such as a resin film, onto a substrate with irregularities.

For example, the method disclosed in Patent Document 1 involves reducing the pressure in the upper and lower lamination molding spaces of a substrate that has been brought into a vacuum lamination device together with upper and lower carrier films, and pressurizing one space while continuing to reduce the pressure in the other space, thereby pressurizing the substrate with the carrier film.

The method disclosed in Patent Document 2 forms a chamber that can be suctioned by vacuum when the upper and lower plates are closed, and pressurizes the substrate by expanding an elastic membrane provided on at least one of the plates into the chamber.

The system disclosed in Patent Document 3 has a vacuum lamination device that pressurizes the base material with a pressurizing body in a decompressed chamber to form an intermediate laminate, and a flattening press device that is disposed downstream of the vacuum lamination device and pressurizes the intermediate laminate. The flattening press device of this system has a pressure mechanism in each tie bar portion, and the position of the pressure mechanism can be controlled individually.

JP 2004-058349 A JP 2013-237230 A JP 2021-100802 A

However, as typified by the manufacturing process of build-up boards, in the process of manufacturing multilayered laminated molded products by repeatedly laminating a laminated film such as a thermosetting resin film onto a substrate whose surface has been processed with fine irregularities, the shape factors such as the thickness of the substrate and distribution of irregularities, the physical properties such as the density and hardness of the laminated molded product, and defects such as warping and twisting of the laminated molded product vary for each stacking stage and lot, making it difficult to respond appropriately with the above-mentioned technology alone. In particular, in the manufacturing process of recent high-performance build-up boards, the unevenness patterns applied to the substrate tend to become finer, deeper, and more complexly distributed in three dimensions, and as a result, the above-mentioned elements act in an overlapping and uncertain manner, resulting in problems of large variations in the quality of laminated molded products. Therefore, from the perspective of improving the yield of laminated molded products, there is a strong demand for stabilization of the quality of laminated molded products for each stacking stage and lot.

This disclosure has been made to solve these problems, and provides a method and system for optimally manufacturing multi-layered laminated molded products.

The method for producing a laminated molded product according to the present disclosure includes a lamination step of pressurizing a substrate to which at least a portion of a laminate film is temporarily bonded or laminated, and by repeating the lamination step multiple times, a laminated molded product is produced in which a predetermined number of layers of laminate film are laminated, and includes the following steps:
In the step (a), a plurality of pressing plates each having a different predetermined structural component are prepared in advance. The pressing plates may include a heating element.
In step (b), when the number of layers of the laminated film pre-laminated on the substrate is at a predetermined stage, one pressing plate is selected from a plurality of pressing plates depending on the state of the substrate to which at least a portion of the laminated film has been newly temporarily bonded or laminated.
In step (c), a pressing portion is prepared by attaching a pressing plate to the main surface of each of the pair of disks having flat main surfaces.
Step (d) includes controlling the temperature of the pressing part so that the temperature of the pressing part is within a predetermined range.
In step (e), a pressing portion is pressed against the surface of the substrate to which at least a portion of the laminate film is temporarily adhered or laminated.

The manufacturing method of the laminated molded product according to the present disclosure has a lamination process in which a substrate to which at least a portion of the laminated film is temporarily bonded or laminated is pressed, and the lamination process is repeated multiple times to produce a laminated molded product in which a predetermined number of layers of laminated film are laminated, and has a container, a selector, a plate, a pressure plate, and a temperature control device. The container contains multiple pressure plates each having a different structural configuration. The selector selects one of the multiple pressure plates according to the state of the substrate to which at least a portion of the laminated film has been newly temporarily bonded or laminated at a stage in which the number of layers of the laminated film previously laminated on the substrate is predetermined. The plate constitutes a pressing section that presses the substrate to which at least a portion of the laminated film has been temporarily bonded or laminated by replacing one pressure plate on the flat main surface. The temperature control device controls the temperature of the pressing section so that the temperature of the pressing section is within a predetermined range.

This disclosure provides a method and system for optimally manufacturing multi-layered laminated molded products.

1 is a block diagram of a laminated molded product manufacturing system according to an embodiment. 4 is a flowchart showing a method for manufacturing a laminated molded product performed by the laminated molded product manufacturing system. FIG. 2 is a configuration diagram showing a specific example of a stacking process block. FIG. 1 is a configuration diagram showing a specific example of a planarization device. FIG. 2 is a configuration diagram showing a specific example of the configuration of a processing area in a planarization apparatus. 4 is a configuration diagram showing a specific example of a clamping portion. FIG. FIG. 2 is a configuration diagram showing a specific example of a laminated molded product. 11 is a table showing an example of a corresponding pattern between a pressing plate and a lamination process. FIG. 1 is a diagram showing a specific example of a laminated molded product manufacturing system. 11A and 11B are diagrams showing specific examples of containers and selectors. FIG. 11 is a first diagram showing the operation of the press plate supply block. FIG. 11 is a second diagram showing the operation of the pressure plate supply block.

The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems. For clarity of explanation, the following description and drawings have been omitted and simplified as appropriate. In addition, the same elements are given the same reference numerals in each drawing, and duplicate explanations have been omitted as necessary.

<Embodiment>
With reference to FIG. 1, a schematic configuration of a laminated molded product manufacturing system according to an embodiment will be described. FIG. 1 is a block diagram of a laminated molded product manufacturing system 1 according to an embodiment. The laminated molded product manufacturing system 1 has a function for manufacturing a laminated molded product in which a plurality of laminated films are laminated. A laminated molded product is a product in which a predetermined number of laminated films are laminated on a predetermined base material in which fine unevenness has been processed in advance. The laminated molded product manufacturing system 1 laminates a base material to which at least a part of the laminated film has been newly temporarily bonded at a stage in which the number of layers of the laminated film previously laminated on the base material is predetermined, and gradually flattens the surface of the laminated base material. The laminated molded product manufacturing system 1 has a control device 10, a pressure plate supply block 20, and a lamination process block 30 as main components.

The control device 10 is a circuit including a calculation device such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit) or an MCU (Micro Controller Unit), and appropriately controls the pressure plate supply block 20 and the stacking process block 30. The control device 10 is communicatively connected to, for example, the drive units such as motors and sensors that the pressure plate supply block 20 and the stacking process block 30 each have.

The control device 10 also has a memory 11. The memory 11 includes a non-volatile memory such as a flash memory. This allows the control device 10 to execute the above-mentioned control by starting a predetermined program previously stored in the memory 11. The memory 11 also stores press plate data relating to the press plate 40 described below. The press plate data is data showing the correspondence between the multiple press plates 40 and the stacking state of the base material. This allows the laminated molded product manufacturing system 1 to select a press plate 40 according to the stacking state of the base material.

The pressure plate supply block 20 supplies or replaces pressure plates to the stacking process block 30. The pressure plate supply block 20 is controlled by the control device 10. The pressure plate supply block 20 mainly comprises a container 21, a selector 22, and an exchange device 23.

The container 21 stores a plurality of replaceable pressure plates 40. The pressure plates 40 are members used in the laminating device 31 or the flattening device 32 of the lamination process block 30. The pressure plate 40 has a pressure body 40' on the surface that contacts the laminated film. The pressure body 40' may have a heating body on the side facing the plate body. The pressure body 40' may also form various structural configurations.

For example, in a process in which the laminating device 31 laminates a substrate to which at least a portion of the laminated film is temporarily attached under reduced pressure, the pressing body 40' presses the substrate so that the temporarily attached laminated film accurately follows the unevenness of the substrate. That is, the pressing body 40' has a predetermined structural configuration according to the state of the substrate before pressing, so that, for example, after pressing, air bubbles are left between the unevenness of the substrate and the laminated film, a part of the molten laminated film flows outward from the edge of the substrate, wrinkles are generated in the laminated film on the surface of the substrate, and the positional relationship between the substrate and the laminated film does not shift from a predetermined position. In this case, the pressing body 40' includes at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as components that can form a structural configuration, as a selection criterion, and is selected based on this criterion. The pressing body 40' may also have a predetermined pattern structure in which those components are appropriately combined two-dimensionally and three-dimensionally.

The pressing body 40', for example, the flattening device 32, gradually presses the surface of the substrate laminated with the laminated film to evenly flatten the surface of the substrate. That is, the pressing body 40' has a predetermined structural configuration according to the state of the substrate before pressing, for example, so that the surface of the substrate has a predetermined flatness and smoothness after pressing. In this case, the pressing body 40' includes at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as components that can form a structural configuration, as a selection criterion, and is selected based on this criterion. The pressing body 40' may also have a predetermined pattern structure in which those components are appropriately combined two-dimensionally and three-dimensionally.

The above-mentioned "multiple types" may mean that the physical properties of each type are different. In other words, the multiple types may mean that the material has a different composition as a physical property. The multiple types may also mean that at least one of the physical properties expressed by the thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected contour shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption, reflectance, and glossiness is different as a physical property other than the composition.

For example, even in the case of a stainless steel plate of SUS304 composition, it may be interpreted as multiple different types, with one having a surface roughness of Ra0.4 and the other having a surface roughness of Ra1.6. In addition, the above-mentioned "two-dimensionally appropriately combined" may mean, for example, that in the structural component of the pressing body 40' used in the flattening device 32, a rigid body made of a stainless steel plate of SUS304 composition, the surface roughness near the center is Ra0.4 and near the periphery is Ra1.6, and the area ratio between them is, for example, 5:1 depending on the state of the conductor placed directly under the newly laminated laminate film.

"Appropriately combining three-dimensionally" may also mean, for example, adopting the following structure inside the stainless steel plate of the above-mentioned SUS304 composition. That is, near the center inside the stainless steel plate, concentric cavities are provided so as to be parallel to the surface of the substrate. Furthermore, radial cavities are provided so as to extend from near the center toward the periphery at an angle θ with respect to the surface of the substrate. In this case, the angle θ is set according to the state of the conductor placed directly under the laminated film, for example, so that θ = 0 degrees in the region near the center and θ = 0.2 degrees in the region near the periphery.

The above two-dimensional combination (predetermined pattern structure) can be produced, for example, by polishing using abrasive grains of appropriate size, and the above three-dimensional combination can be produced, for example, by a laser sintering 3D printer.

The pressing plates 40 contained in the container 21 have different predetermined structural components in the pressing bodies 40' contained in each pressing plate 40. Here, the structural components refer to those selected based on a selection criterion that includes at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids. The structural components may have a predetermined pattern structure in which the components are appropriately combined two-dimensionally and three-dimensionally. The type of component may include at least one of the chemical composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected contour shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption rate, reflectance, and glossiness of the material.

In other words, the presser plates 40 housed in the container 21 may have different chemical composition of the material or different thicknesses in the presser bodies 40' contained in each presser plate 40. The presser bodies 40' may have the same chemical composition of the material and thickness, but different hardness and elastic modulus. The presser plates 40 are selected according to the state of the base material and placed in the lamination process block 30. The presser plates 40 are selected by the selector 22 and are further removed by the selector 22. When the lamination process block 30 requires multiple presser plates 40 at once in the manufacturing process of the laminated molded product, the container 21 houses the corresponding multiple presser plates 40.

The selector 22 selects and removes at least one pressure plate 40 from the multiple pressure plates 40 contained in the container 21. The selector 22 selects at least one pressure plate 40 from the multiple pressure plates according to the state of the substrate to which the laminate film has been newly temporarily attached or laminated. The state of the substrate to which the laminate film has been newly temporarily attached or laminated is, for example, the number of layers of the laminate film previously laminated on the substrate. The state of the substrate to which the laminate film has been newly temporarily attached or laminated may be, for example, the material or thickness of the laminate film previously laminated on the substrate. The state of the substrate to which the laminate film has been newly temporarily attached or laminated may be the state of processing performed on the substrate including the previously laminated laminate film.

The processing performed on the substrate in advance includes cutting and drilling performed on the laminated film on the substrate surface. The processing performed on the substrate in advance also includes, for example, the state of the chemicals laid on the laminated film and the metal foil (plating) attached. The processing performed on the substrate in advance also includes, for example, heat treatment (curing treatment) in which the substrate is heated to a predetermined temperature. If the lamination process block 30 requires multiple pressure plates 40 at once in the manufacturing process of the laminated molded product, the selector 22 selects multiple pressure plates 40. The selector 22 transfers the removed pressure plates 40 to the exchange device 23.

The exchange device 23 exchanges the pressure plate 40 selected from the pressure plates 40 housed in the container 21 with the pressure plate 40 attached to the stacking process block 30. When the exchange device 23 receives the replacement pressure plate 40 removed by the selector 22, it exchanges the received pressure plate 40 with the pressure plate 40 already attached to the stacking process block 30. The exchange device 23 also hands over the pressure plate 40 removed from the stacking process block 30 by the exchange to the selector 22.

The lamination process block 30 laminates the substrate to which the laminated film has been newly temporarily attached, and flattens the surface of the laminated substrate. The lamination process block 30 is controlled by the control device 10. The lamination process block 30 mainly comprises a laminating device 31, a flattening device 32, and a temperature control device 33.

The laminating device 31 laminates the newly temporarily bonded laminated film to the substrate. The laminating device 31 performs this pressure bonding process (lamination) by contacting the surface of the substrate via the transport film and applying pressure. The laminating device 31 preferably performs lamination by pressing the laminated film by moving a platen up and down and releasing it from the pressed state. Specifically, the laminating device 31 preferably uses a rotation drive using a servo motor or torque motor as power and moves the platen up and down via a ball screw. In this case, it is even more preferable that the laminating device 31 uses a heat-resistant elastic material such as silicone rubber or fluororesin on the main surface facing the substrate among the components of the structural component of the pressing body 40'.

The laminating device 31 is not limited to the above-mentioned method, and may perform lamination by pressing the laminated film using a diaphragm made of plastic and heat-resistant resin. Alternatively, the laminating device 31 may have a roller, for example, and perform lamination by rolling the roller over the surface of the laminated molded product. The laminating device 31 may also perform lamination by a method different from the above-mentioned method.

The laminating device 31 has a clamping section 50. The clamping section 50 includes a pressure plate 40. The pressure plate 40 may include a heater 51 in the structural component. The laminating device 31 also holds the pressure plate 40 in an exchangeable manner. The pressure plate 40 held in an exchangeable manner in the laminating device 31 desirably has a bolt fastening section in a position and orientation accessible by a robot arm or the like to facilitate replacement. In addition to the bolt fastening means as described above, the pressure plate 40 may have a mechanical fastening means using a one-touch chuck using a hydraulic cylinder or an air cylinder, or a fastening means based on the principle of suction force using an electromagnet or a suction device, as a means for making it exchangeable.

The flattening device 32 flattens the surface of the substrate that has been laminated by the laminating device 31. The flattening device 32 mainly comprises a pressing section 50. The pressing section 50 flattens the surface of the substrate by applying a predetermined amount of heat and pressure to the surface of the newly laminated laminate film.

The pressing unit 50 includes a pressing plate 40. The pressing plate 40 may include a heating body 51 in the structural component. The heating body 51 includes a member whose temperature is controlled by the temperature control device 33. As a result, the pressing plate 40 transmits heat and pressure to the surface of the substrate. The flattening device 32 is preferably one that performs flattening processing by pressing the laminated film by moving the plate body up and down and releasing it from the pressed state. Specifically, the flattening device 32 is preferably one that uses a rotation drive using a servo motor or a torque motor as a power source and moves the plate body up and down via a ball screw. In that case, it is more preferable that the structural component of the pressing body 40' is a rigid body such as a stainless steel plate whose main surface facing the substrate has different surface roughness between the center and the peripheral portion.

The flattening device 32 also holds the pressure plate 40 in a replaceable manner. The pressure plate 40 held in the flattening device 32 in a replaceable manner desirably has a bolt fastening portion in a position and orientation accessible by a robot arm or the like to facilitate replacement. In addition to the bolt fastening means described above, the pressure plate 40 may have a mechanical fastening means such as a one-touch chuck using a hydraulic cylinder or an air cylinder, or a fastening means based on the principle of suction force using an electromagnet or a suction device, as a means for making it replaceable.

When a laminate film is multi-layered on a substrate, the structural components of the pressing body 40' suitable for laminating or flattening vary depending on the material and number of layers of the laminate film previously laminated on the substrate, the thickness, flatness, and cumulative tolerance for smoothness of the laminate film previously laminated on the substrate, or the processing state previously applied to the substrate or laminate film. Therefore, the laminated product manufacturing system 1 appropriately replaces the pressing plate 40' depending on the structural components of the pressing body 40'. This allows the laminated product manufacturing system 1 to perform lamination or flattening processing appropriately.

The temperature control device 33 controls the temperature of the heating element 51 of the flattening device 32. For example, the temperature control device 33 includes a thermistor and a heater, and controls the heater so that the heating element 51 is at a set temperature. In this way, the laminated molded product manufacturing system 1 controls the temperature of the pressing part 50 so that the temperature of the pressing part 50 when flattening the substrate is within a predetermined range. The temperature control device 33 is controlled by the control device 10.

Figure 2 is a flowchart showing a method for manufacturing a laminated molded product performed by the laminated molded product manufacturing system. The method for manufacturing a laminated molded product according to the present disclosure has a lamination process in which a base material to which at least a portion of a laminate film is temporarily bonded or laminated is pressurized, and the lamination process is repeated multiple times to produce a laminated molded product in which a predetermined number of layers of laminate film are laminated, and is executed by a user of the laminated molded product manufacturing system 1 described above using the laminated molded product manufacturing system 1.

First, in step (a), the user prepares a number of pressure plates 40 each having a different predetermined structural component (step S11).

The predetermined structural component in step (a) includes at least two components selected from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids in the pressing body 40' as selection criteria, and refers to a structural component selected based on this criterion. The structural component has a predetermined pattern structure in which these components are appropriately combined two-dimensionally and three-dimensionally. The type of component includes at least one of the chemical composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected contour shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption rate, reflectivity, and glossiness of the material. The user prepares an appropriate pressing plate 40 for each process of laminating the base material from the process of manufacturing the laminated molded product.

Next, in step (b), the laminated molding manufacturing system 1 selects at least one press plate 40 from the multiple press plates depending on the state of the substrate to which at least a portion of the laminated film has been newly temporarily bonded or laminated (step S12).

The state of the substrate in step (b) is, for example, the number of layers of the laminate film pre-laminated on the substrate. The state of the substrate in step (b) may also be, for example, the material or thickness of the laminate film pre-laminated on the substrate. The state of the substrate in step (b) may also be, for example, the state of processing applied to the substrate including the pre-laminated laminate film. The processing applied to the substrate in advance includes cutting and drilling applied to the laminate film on the substrate surface. The processing applied to the substrate in advance includes, for example, the state, cumulative thickness, and total area of the chemical agent or metal foil (plating) attached to the laminate film. The processing applied to the substrate in advance includes, for example, heat treatment (curing treatment) in which the substrate is heated at a predetermined temperature.

Next, in step (c), the laminated molding manufacturing system 1 prepares the clamping section 50 by attaching the above-mentioned pressing plate 40 to the main surface of the plate body (step S13).

In step (c), the laminated molded product manufacturing system 1 may prepare the pressing section 50 by attaching a pressing plate 40 including a pressing body 40' in which at least two components are selected from a group consisting of a plurality of types of elastic bodies, a plurality of types of rigid bodies, a plurality of types of fibrous bodies, a plurality of types of particulate bodies, and voids, and these components are appropriately combined two-dimensionally and three-dimensionally.

Next, in step (d), the laminated molded product manufacturing system 1 controls the temperature of the pressing unit 50 so that the temperature of the pressing unit 50 is within a predetermined range (step S14).

Next, in step (e), the laminated molding manufacturing system 1 presses the clamping unit 50 against the surface of the substrate to which the laminated film has been newly temporarily bonded or laminated (step S15).

Next, in step (f), the laminated product manufacturing system 1 executes the lamination process from step (b) to step (e) each time a new laminated film is temporarily attached or laminated to the substrate. That is, the laminated product manufacturing system 1 judges whether the lamination process is completed in the manufacturing process of the laminated product (step S16). If it is judged that the lamination process is completed (step S16: YES), the laminated product manufacturing system 1 ends the process. On the other hand, if it is not judged that the lamination process is completed (step S16: NO), the laminated product manufacturing system 1 returns to step (b) (step S12) and repeats the lamination process from step (b) to step (e). In addition, when repeating the lamination process, a predetermined processing may be performed on the substrate or the laminated film laminated on the substrate before step (b). Processing performed on the substrate or laminated film includes, for example, cutting processing or drilling processing performed on the laminated film on the substrate surface. Processing performed on the substrate or laminated film also includes, for example, laying a chemical agent or attaching a metal foil (plating) to the laminated film on the substrate surface. The processing applied to the substrate or laminated film includes, for example, a heat treatment (curing process) in which the substrate is heated to a predetermined temperature. If the lamination process block 30 requires multiple press plates 40 at once in the manufacturing process of the laminated molded product, the selector 22 selects multiple press plates 40.

Next, the laminated molded product manufacturing system 1 will be described with a specific example. Figure 3 is a configuration diagram showing a specific example of the lamination process block 30. The lamination process block 30 shown in Figure 3 shows an outline of the configuration as observed from the side.

For the sake of convenience in explaining the positional relationships of the components, FIG. 3 is illustrated using a right-handed Cartesian coordinate system. In addition, in FIG. 3 and subsequent figures where a Cartesian coordinate system is used, the X-axis, Y-axis, and Z-axis directions in FIG. 1 coincide with the X-axis, Y-axis, and Z-axis directions in these Cartesian coordinate systems, respectively.

The lamination process block 30 shown in FIG. 3 mainly comprises a laminating device 31, a flattening device 32, and a temperature control device 33. The lamination process block 30 presses the substrate A1, performs lamination processing, and then further presses the surface of the substrate A1 in stages to perform flattening processing in stages. The substrate A1 is transported from the right side to the left side of the figure while being sandwiched between a lower conveying sheet 36 that supports the lower part and an upper conveying sheet 35 that covers the upper part. The substrate A1 input into the lamination process block 30 is transported to the laminating device 31 located on the right side in FIG. 3.

The upper conveying sheet 35 and the lower conveying sheet 36 are formed, for example, by molding polyethylene terephthalate into a strip shape. The upper conveying sheet 35 and the lower conveying sheet 36 are wound up at the left and right ends of the stacking process block 30 shown in FIG. 3, and are wound up or unwound synchronously in the left and right directions, allowing them to be conveyed with the substrate A1 sandwiched between them.

When the laminating device 31 receives the substrate A1, it applies pressure in the vertical direction to laminate the laminated film that is temporarily attached. The laminating device 31 has, for example, an upper laminating processing section 311 and a lower laminating processing section 312. The laminating device 31 sandwiches the substrate A1 between the upper laminating processing section 311 and the lower laminating processing section 312, and performs lamination processing by applying pressure. The laminating device 31 may sandwich the substrate A1 between the upper laminating processing section 311 and the lower laminating processing section 312 to form a chamber that can be depressurized. When the laminating process is completed, the substrate A1 is transported to the flattening device 32 by upper and lower transport sheets.

The flattening device 32 shown in FIG. 3 includes a first flattening device 32A and a second flattening device 32B. The first flattening device 32A receives the substrate A1 laminated in the laminating device 31 and flattens the substrate A1. The substrate A1 flattened by the first flattening device 32A is transported to the second flattening device 32B by the upper conveying sheet 35 and the lower conveying sheet 36. The second flattening device 32B receives the substrate A1 flattened by the first flattening device 32A and further flattens the substrate A1. This step-by-step flattening process improves productivity in the manufacturing process of laminated molded products. The substrate A1 flattened by the second flattening device 32B is transported outside the flattening device 32 by the upper conveying sheet 35 and the lower conveying sheet 36.

In this disclosure, the term "planarization device 32" includes both the first planarization device 32A and the second planarization device 32B. The planarization device 32 shown in FIG. 3 is provided with two planarization devices so that the planarization process can be performed twice in stages to increase productivity, but the planarization device 32 may have one planarization device or three or more planarization devices.

The temperature control device 33 is connected to the laminating device 31 and has the function of controlling the temperature of a specified portion of the laminating device 31. The temperature control device 33 is also connected to the first flattening device 32A and the second flattening device 32B and controls the temperature of the heater 51 that each of these devices has. This allows the laminating device 31, the first flattening device 32A, and the second flattening device 32B to apply a specified amount of heat and pressure to the substrate A1. The temperature control device 33 can control the laminating device 31, the first flattening device 32A, and the second flattening device 32B to different temperatures.

Next, the flattening device 32 will be further described with reference to FIG. 4. FIG. 4 is a configuration diagram showing a specific example of the flattening device 32. The flattening device 32 mainly includes a base 321, a pressure device 322, a fixed platen 323, a movable platen 324, a guide hole 325, and a guide shaft 326.

The base 321 supports a guide shaft 326 along which the pressure device 322 slides at the bottom of the flattening device 32. That is, the pressure device 322 is supported by the base 321 so that it can move up and down. The pressure device 322 has a predetermined drive device and engages with the bottom of the movable platen 324 to move the movable platen 324 up and down. The means for moving the movable platen 324 up and down is not particularly limited, but in order to accurately laminate and evenly flatten the substrate, it is preferable to use a rotational drive using a servo motor or torque motor as power and move the movable platen 324 up and down via a ball screw. The means for moving the movable platen 324 up and down is not limited to the above, and may also use a hydraulic cylinder or an air cylinder.

The fixed platen 323 is fixed to the upper end of the guide shaft 326 supported by the base 321, and holds the pressure plate 40 at its lower part. The movable platen 324 has a guide hole 325 through which the guide shaft 326 is inserted, and is supported by the guide shaft 326 so that it can move up and down. The movable platen 324 is also engaged with the pressure device 322 at its lower part. This allows the movable platen 324 to move up and down under the control of the pressure device 322. Furthermore, the movable platen 324 holds the pressure plate 40 on its upper surface.

The guide shaft 326 is a shaft extending upward from the base 321, supports the fixed platen 323 at its upper end, and supports the movable platen 324 between the base 321 and the fixed platen 323 so that the movable platen 324 can move up and down. The guide shaft 326 may include, for example, a ball spline shaft, which guides the movable platen 324 up and down. The guide shaft 326 may also be called a tie bar.

In the above-described configuration, the flattening device 32 receives the substrate A1 conveyed by the upper conveying sheet 35 and the lower conveying sheet 36 with the movable platen 324 positioned downward. Then, with the substrate A1 stopped at a predetermined position, the flattening device 32 drives the pressure device 322 to push the movable platen 324 upward. As a result, the flattening device 32 brings the pressure plate 40 of the fixed platen 323 into contact with the upper surface of the substrate A1, and brings the pressure plate 40 of the movable platen 324 into contact with the lower surface of the substrate A1. The flattening device 32 then clamps the upper and lower surfaces of the substrate A1 with the clamping section 50.

The flattening device 32 will be further described with reference to FIG. 5. FIG. 5 is a configuration diagram showing a specific example of the configuration of the processing area in the flattening device. The flattening device 32 shown in FIG. 5 shows the area where the substrate A1 is clamped.

The pressing plate 40 includes a heat insulating section 52, a heating body 51, and a pressing body 40'. The heat insulating section 52 is a member provided to suppress the transfer of heat between the heating body 51 and the fixed platen 323 or between the heating body 51 and the movable platen 324. The heating body 51 is, for example, a rectangular parallelepiped member, and is fixed to each of the fixed platen 323 and the movable platen 324. The heating body 51 also has a plurality of cartridge heaters 330. The cartridge heaters 330 have their output controlled by the temperature control device 33 based on temperature information measured by the temperature measuring means. The temperature measuring means may be a means for measuring by bringing a thermocouple into contact with the measurement object, or a means for measuring without contacting the measurement object using a radiation thermometer. The temperature measuring means may also be other means. It is preferable that the heating body 51 has a relatively high rigidity and a relatively high heat storage capacity. This allows the pressing section 50 to press the substrate A1 suitably.

The heating body 51 holds the pressing body 40' in an exchangeable manner on the main surface close to the substrate A1. The heating body 51 may have a rubber heater or a plate heater instead of the cartridge heater 330. Alternatively, the heating body 51 may have a flow path for passing a heat medium such as steam or oil instead of the cartridge heater 330. The heating body 51 may have a detachable current-cartridge heater 330. Similarly, when the heating body 51 has a rubber heater or a plate heater instead of the cartridge heater 330, the current-cartridge heater 330 may be detachable. When the heating body 51 has a flow path for passing a heat medium such as steam or oil instead of the cartridge heater 330, the supply port and the recovery port of the heat medium may be detachable from the supply source and the recovery source of the heat medium, for example, by using a joint with a valve.

The pressing body 40' is attached to the main surface of the heating body 51 in a replaceable manner. The heating body 51 and the pressing body 40' may be fixed at their ends, for example, by a clamper. The heating body 51 and the pressing body 40' may be screwed at their ends, for example, by a bolt.

Figure 6 is a structural diagram showing a specific example of the pressure plate 40. Figure 6 shows a cross section of the pressure plate 40 provided on the movable platen 324. The pressure plate 40 mainly comprises, in order from the side in contact with the movable platen 324, a heat insulating section 52, a heater 51, and a pressure body 40'.

Note that while the pressure plate 40 shown in FIG. 6 is provided on the movable platen 324, the pressure plate 40 provided on the fixed platen 323 has the same configuration. The pressure plate 40 on the fixed platen 323 may be referred to as the upper pressure plate, and the pressure plate 40 on the movable platen 324 may be referred to as the lower pressure plate. Similarly, the pressure body 40' included in the upper pressure plate may be referred to as the upper pressure body, and the pressure body 40' included in the lower pressure plate may be referred to as the lower pressure body.

In the above-described configuration, the heat insulating section 52 is interposed between the heating body 51 and the movable platen 324 to suppress heat exchange between the heating body 51 and the movable platen 324. This allows the flattening device 32 to efficiently heat the heating body 51. The heat insulating section 52 can be made of, for example, a resin, metal, ceramic, or fiber material that has a relatively low thermal conductivity.

The heating element 51 is a rectangular metal member, and may be made of metal such as iron, aluminum, or brass. This provides the heating element 51 with sufficient rigidity to prevent distortion when the substrate A1 is pressed during lamination or flattening. The heating element 51 also has sufficient heat capacity to apply a predetermined amount of heat to the surface of the substrate A1 during lamination or flattening. The heating element 51 is controlled by the temperature control device 33 to be approximately 80 degrees Celsius to 200 degrees Celsius.

The pressing body 40' has at least a contact layer 42 as a structural component that contacts the substrate A1 or the conveying sheet that conveys the substrate A1, which is the subject of lamination or flattening. The contact layer 42 is an elastic body such as a heat-resistant resin in the laminating device 31, and is a rigid body such as a metal or ceramic, or an elastic body such as a heat-resistant resin in the flattening device 32. The pressing body 40' may also have a buffer layer 41 between the contact layer 42 and the heating body 51 as a structural component, which disperses the pressure when it contacts the substrate A1. The buffer layer 41 is an elastic body such as a heat-resistant resin. The buffer layer 41 and the contact layer 42 are not limited to the above, and may include at least two components selected from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as a selection criterion, and may have a predetermined pattern structure in which the components are appropriately combined two-dimensionally and three-dimensionally based on this criterion.

The buffer layer 41 appropriately distributes the pressure that the contact layer 42 receives during lamination and flattening. The buffer layer 41 may be made of, for example, resin, rubber, paper, fiber reinforced material, or nonwoven fabric. The buffer layer 41 may have a thickness of, for example, about 100 micrometers to 5 millimeters. In the lamination process, the contact layer 42 is a resin plate, and may be made of, for example, a silicone resin or a fluororesin having a thickness of about 100 micrometers to 5 millimeters. In the flattening process, the contact layer 42 is a metal plate, and may be made of, for example, a stainless steel plate having a thickness of about 100 micrometers to 5 millimeters. Even if a rigid body such as a metal plate is used for the contact layer 42, it is preferable that the rigidity is such that it is slightly elastically deformed against the load applied in the pressing process.

The distinction between elastic and rigid bodies may be based on, for example, the modulus of elasticity. That is, the modulus of elasticity may be set to 30 kilonewtons per millimeter squared (kN/mm ² ), and bodies with modulus of elasticity less than this value may be considered elastic, and bodies with modulus of elasticity greater than this value may be considered rigid. The magnitude of rigidity may also be expressed by the magnitude of modulus of elasticity. The contact layer 42 preferably has a small surface roughness. Therefore, when using metal or ceramics for the contact layer 42, it is preferable that the contact layer 42 is polished to a mirror finish. The contact layer 42 may have a coating on its surface, such as a ceramic coating of titanium nitride (TiN), plating of chromium or nickel, or a lubricating coating of diamond-like carbon (DLC).

The above describes the configuration of the pressing unit 50 of the laminating device 31 and the flattening device 32. In the case of the laminating device 31, the laminating device 31 has a vacuum chamber for performing the laminating process, and the pressing unit 50 is located within this vacuum chamber.

Next, the substrate A1 will be described with reference to FIG. 7. FIG. 7 is a structural diagram showing a specific example of the substrate. The substrate A1 shown in FIG. 7 is called a build-up substrate or a multi-layer substrate. A build-up substrate or a multi-layer substrate is one embodiment of a laminated molded product. The substrate A1 has laminated films A11 to A23 laminated on both sides of the substrate A10, and each layer is appropriately perforated, and conductive foil is further added. For the substrate A10, for example, an epoxy-based thermosetting resin, a composite material of an epoxy-based resin and glass fiber, or a resin such as polyethylene terephthalate is used. For the laminated film, for example, a resin such as polyethylene terephthalate or polyimide is used.

In the above-mentioned configuration, the substrate A1 is first formed as substrate A10, and the formed substrate A10 is subjected to the first lamination process, the second lamination process, and the third lamination process. The following provides an overview of these processes.

First, the sheet-like base material A10 is subjected to processes such as drilling holes, then copper plating is applied, and a wiring pattern is formed by etching. This forms, for example, via holes A30, and the processing of the base material A10 is completed.

Next, in the first lamination step, the laminate film A11 and the laminate film A21 are laminated onto the substrate A10. Here, the substrate A10 to which the laminate film A11 and the laminate film A21 are temporarily attached is fed into the laminated product manufacturing system 1. In the laminated product manufacturing system 1, the laminating device 31 performs lamination processing on the substrate A1 to which the laminate film A11 and the laminate film A21 are temporarily attached, and further, the flattening device 32 flattens the surfaces of the laminated laminate film A11 and the laminate film A21. The substrate A1 removed from the laminated product manufacturing system 1 is then copper-plated and etched to form the pattern A31, via holes A32, etc.

Next, in the second lamination process, the laminate film A12 and the laminate film A22 are temporarily attached, laminated, and flattened to the base material A1 in the same manner as in the first lamination process. Furthermore, the base material A1 is copper-plated and etched on the laminate film A12 and the laminate film A22.

Furthermore, in the third lamination process, similar to the first and second lamination processes described above, the laminate film A13 and the laminate film A23 are temporarily attached, laminated and flattened to the base material A1, and a copper foil pattern is formed by plating or the like.

The above describes the configuration of the substrate A1 and an overview of the lamination process. The substrate A1 shown here has three layers of laminated film laminated on each side of the substrate A10. Each laminated film of the substrate A1 also has an individual copper foil pattern and via holes. Therefore, when performing lamination processing or flattening processing, it is preferable that the structural components of the pressure plate 40 are set individually for each lamination process.

Next, the relationship between the lamination process and the pressure plate 40 will be described with reference to FIG. 8. FIG. 8 is a table showing an example of a corresponding pattern between the pressure plate and the lamination process. The table shown in FIG. 8 shows the configuration of the pressure plate attached to each of the first flattening device 32A and the second flattening device 32B for each lamination process.

The upper pressure plate attached to the fixed platen 323 of the first flattening device 32A has the configuration No. 1-11 in the first lamination process. The lower pressure plate attached to the movable platen 324 of the first flattening device 32A has the configuration No. 1-12 in the first lamination process. Similarly, the upper pressure plate of the second flattening device 32B has the configuration No. 1-13 in the first lamination process. The lower pressure plate of the second flattening device 32B has the configuration No. 1-14 in the first lamination process.

Similarly, in the second lamination process, the upper pressure plate of the first flattening device 32A has structure No. 2-11, and the lower pressure plate has structure No. 2-12. The upper pressure plate of the second flattening device 32B has structure No. 2-13, and the lower pressure plate has structure No. 2-14.

In the third lamination step, the upper pressure plate of the first flattening device 32A has structure No. 3-11, and the lower pressure plate has structure No. 3-12. The upper pressure plate of the second flattening device 32B has structure No. 3-13, and the lower pressure plate has structure No. 3-14.

As described above, the structural components of the pressing plate 40 can be set separately according to the lamination process of each layer. The structural components of the pressing plate 40 can also be set according to the order and arrangement of pressing in the flattening device 32. Furthermore, the structural components of the pressing plate 40 are set according to the state of the substrate on which the laminated film is laminated on the pressing surface. Here, the state of the substrate on which the laminated film is laminated is, for example, the number of laminated films pre-laminated on the substrate. The state of the substrate on which the laminated film is laminated may be, for example, the material and thickness of the laminated film pre-laminated on the substrate. The state of the substrate on which the laminated film is laminated may be, for example, the state of processing performed on the substrate including the pre-laminated laminated film. The processing performed on the substrate in advance includes cutting and drilling performed on the laminated film on the substrate surface. The processing performed on the substrate in advance includes, for example, the state, cumulative thickness, and total laying area of the chemical agent laid on the laminated film and the attached metal foil (plating). The processing performed on the substrate in advance includes, for example, a heat treatment (curing treatment) in which the substrate is heated at a predetermined temperature. When manufacturing a laminated molded product, a user of the laminated molded product manufacturing system 1 considers the lamination process in advance and determines the structural configuration of the press plate 40 that corresponds to each process and the installation position shown in Figure 8.

In addition, in determining the above-mentioned configuration, the user refers to the components of the buffer layer 41 and the contact layer 42. The components of the buffer layer 41 and the contact layer 42 include at least two components from a group of components consisting of multiple types of elastic bodies, multiple types of rigid bodies, multiple types of fibrous bodies, multiple types of particulate bodies, and voids as selection criteria, and refer to those selected based on this criterion. In addition, those components may have a predetermined pattern structure that is appropriately combined two-dimensionally and three-dimensionally. The above-mentioned "multiple types" may mean that at least one of the physical property elements represented by the component composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected contour shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption rate, reflectance, and glossiness of the material is different. The combination of structural components is not limited to the above. The user determines a configuration suitable for each process from various combinations in consideration of such structural components.

When the user prepares each press plate 40 having a configuration corresponding to the information shown in FIG. 8, the user sets the prepared press plate 40 in the container 21 of the press plate supply block 20. Furthermore, the user stores the information shown in FIG. 8 in the memory 11 of the laminated molded product manufacturing system 1. This allows the laminated molded product manufacturing system 1 to attach the press plate 40 for each lamination process to the flattening device 32.

The configurations shown in FIG. 8 may each have the same configuration. That is, for example, the configuration No. 2-11 set on the upper pressure plate of the first flattening device 32A in the second stacking process may be the same as the configuration No. 3-11 set on the upper pressure plate of the first flattening device 32A in the third stacking process. Alternatively, the configuration No. 2-11 and the configuration No. 2-12 set on the first flattening device 32A in the second stacking process may be the same as the configuration No. 2-13 and the configuration No. 2-14 set on the second flattening device 32B in the second stacking process. Therefore, the container 21 may contain multiple pressure plates 40 of the same type.

Next, the specific configuration of the pressure plate supply block 20 will be described with reference to FIG. 9. FIG. 9 is a diagram showing a specific example of a laminated molded product manufacturing system. The pressure plate supply block 20 shown in FIG. 9 is installed next to the lamination process block 30, and replaces the pressure plate 40 for the flattening device 32.

The replacement device 23 replaces a selected pressure plate 40 from among the multiple pressure plates 40 housed in the container 21 with the pressure plate 40 attached to the clamping unit 50. The replacement device 23 of the pressure plate supply block 20 mainly comprises a conveying unit 230, a mounting unit 231, a rotating shaft 232, and a rail unit 233.

The transport unit 230 supports the mounting unit 231 and is supported on the rail portion 233 so that it can move horizontally. This allows the transport unit 230 to move the mounting unit 231 along the rail portion 233.

The mounting unit 231 is supported by the transport unit 230, and is configured to be movable linearly in the Y direction in FIG. 9 on the transport unit 230 and to be rotatable around the Z axis centered on the rotation axis 232. The mounting unit 231 is also capable of transferring the pressure plate 40 between the selector 22, and mounts the pressure plate 40 received from the selector 22 so that it can be transported. The mounting unit 231 attaches the transported pressure plate 40 to the clamping unit 50 of the flattening device 32. The mounting unit 231 also removes the pressure plate 40 attached to the clamping unit 50.

The rail section 233 supports the conveying section 230 so that it can move along a set rail. The rail section 233 shown in FIG. 9 has a rail extending parallel to the upper conveying sheet 35 of the stacking process block 30, and is set so that the conveying section 230 can move back and forth between the selector 22 and the flattening device 32.

The pressure plate supply block 20 will be further described with reference to FIG. 10. FIG. 10 shows a specific example of the container 21 and the selector 22.

The container 21 stores multiple pressure plates 40 in an exchangeable manner. The container 21 shown in FIG. 10 is configured so that multiple pressure plates 40 can be stacked vertically. The pressure plates 40 stored in the container 21 are stored according to the information described with reference to FIG. 8. The pressure plates 40 stored in the container 21 are removed by the selector 22. The pressure plates 40 removed by the selector 22 are stored by the selector 22.

The selector 22 selects and removes one pressure plate 40 from the multiple pressure plates 40 housed in the container 21. The selector 22 delivers the pressure plate 40 removed from the container 21 to the exchange device 23. The selector 22 also stores the pressure plate 40 received from the exchange device 23 in a specified location in the container 21. To achieve the above-mentioned functions, the selector 22 is configured so that the tray portion on which the pressure plate 40 is mounted can move in the vertical direction. Furthermore, the selector 22 has a mechanism for transferring the pressure plate 40.

Next, the operation of the pressure plate supply block 20 will be described with reference to Figures 11 and 12. Figure 11 is the first diagram showing the operation of the pressure plate supply block 20. The operation of the pressure plate supply block 20 shown here is an operation performed when the laminating device and flattening device 32 in the stacking process block 30 are not performing the laminating process and flattening process. As an example, the operation of replacing the pressure plate 40A held by the first flattening device 32A with the pressure plate 40S held by the container 21 will be described along the flow of time T.

First, at time T1, the selector 22 selects and removes a predetermined press plate 40S from the container 21. The selector 22 then transfers the removed press plate 40S to the replacement device 23. At this time, the control device 10 of the laminated molded product manufacturing system 1 refers to the memory 11 and selects a new press plate 40 to be attached to the first flattening device 32A. Once the replacement press plate 40S is loaded into the replacement device 23, the replacement device 23 starts moving along the rail portion 233.

Next, at time T2 after time T1, the exchange device 23, which has moved along the rail section 233 with the pressure plate 40S mounted thereon, stops near the first flattening device 32A. Furthermore, the mounting section 231 approaches the pressure plate 40A in order to remove the pressure plate 40A.

Next, at time T3 after time T2, the mounting unit 231 removes the pressure plate 40A, mounts the removed pressure plate 40A, and moves a predetermined distance in a direction away from the first flattening device 32A.

Next, at time T4 after time T3, the mounting portion 231 of the exchange device 23 rotates 180 degrees around the rotation axis 232 to exchange the pressure plate 40A for the pressure plate 40S.

The operation of the pressure plate supply block 20 will be further described with reference to FIG. 12. At time T5 after time T4, the mounting section 231 brings the replacement pressure plate 40S closer to the first flattening device 32A.

Next, at time T6 after time T5, the exchange device 23 attaches the pressure plate 40S to the clamping unit 50. After the pressure plate 40S is attached to the clamping unit 50, the mounting unit 231 then starts moving in a direction away from the first flattening device 32A.

Next, at time T7 after time T6, the exchange device 23 with the removed pressure plate 40A mounted thereon moves along the rail portion 233 toward the selector 22.

Next, at time T8 after time T7, the exchange device 23 hands over the pressure plate 40A to the selector 22. The selector 22 then stores the pressure plate 40A received from the exchange device 23 in the storage body 21.

The above describes the operation of the pressure plate supply block 20. With the above configuration, the laminated molded product manufacturing system 1 can replace the pressure plate 40 as appropriate depending on the lamination process for each layer of the base material. The above configuration or operation is an example of the pressure plate supply block 20, and the configuration or operation of the pressure plate supply block 20 is not limited to this. For example, the container 21 may move up and down instead of the selector 22. The mechanism of the pressure plate supply block 20 may use, for example, a multi-joint robot instead of the above configuration. For example, the exchange device 23 may transport the mounting part 231 by a robot arm instead of the rail part 233 and the transport part 230. In the laminated molded product manufacturing system 1, the lamination device 31 of the lamination process block 30 may be separate from the laminated molded product manufacturing system 1.

The exchange device 23 may include a preheating device that preheats the selected pressure plate 40 before attaching it to the clamping section 50. The container 21 may have a heat retention device that controls the pressure plate 40 to a predetermined temperature and keeps it warm. In particular, when the pressure plate 40 includes a heater 51 or a heat insulating section 52 with a large heat capacity, it is desirable to preheat it to a predetermined temperature in order to increase productivity.

At least some of the functions of the selector 22 and the exchange device 23 may be performed by the user of the laminated molded product manufacturing system 1. In other words, instead of being fully automatically controlled, the pressure plate supply block 20 may be partially operated manually.

In addition, in this embodiment, the pressure plate 40 has been described as including the buffer layer 41 and the contact layer 42, but the pressure plate 40 housed in the housing 21 and replaced by the replacement device 23 may be any one of these. Alternatively, the pressure plate 40 housed in the housing 21 and replaced by the replacement device 23 may include a heating element 51 and a heat insulating section 52.

As described above, according to the embodiments, the present disclosure can provide a method and system for suitably manufacturing a multi-layered laminated molded product. The above-mentioned laminated molded product is called a build-up board or a multi-layer board. Therefore, the technology of the present disclosure may be called a build-up board manufacturing method and a build-up board manufacturing system, or a multi-layer board manufacturing method and a multi-layer board manufacturing system.

The present invention is not limited to the above embodiment, and can be modified as appropriate without departing from the spirit and scope of the invention.

REFERENCE SIGNS LIST 1 Laminated product manufacturing system 10 Control device 11 Memory 20 Press plate supply block 21 Container 22 Selector 23 Exchange device 30 Lamination process block 31 Laminating device 32 Flattening device 33 Temperature control device 35 Upper conveying sheet 36 Lower conveying sheet 40 Press plate 40' Pressing body 41 Buffer layer 42 Contact layer 50 Clamping section 51 Heating body 52 Heat insulating section 230 Conveying section 231 Mounting section 232 Rotating shaft 233 Rail section 321 Base 322 Pressurizing device 323 Fixed plate body 324 Movable plate body 325 Guide hole 326 Guide shaft 330 Cartridge heater A1 Laminated product

Claims (14)

A laminated molded product manufacturing system having a lamination process in which a substrate to which at least a portion of a laminate film is temporarily bonded or laminated is pressed by a pressing body, and the lamination process is repeated a plurality of times to manufacture a laminated molded product in which a predetermined number of laminate films are laminated,
A container that contains a plurality of the pressing bodies, each of which has at least one structural component that constitutes the pressing body being different from the others;
An attachment portion for attaching at least one of the pressing bodies selected from the plurality of pressing bodies to a heating body according to the state of the substrate to which at least a portion of the laminated film has been temporarily bonded or laminated to form a pressing portion;
A temperature control device that controls the temperature of the heater so that the temperature of the clamping part is within a predetermined range.
Laminated molding manufacturing system. The plurality of pressing bodies are each composed of the structural components having different physical properties in at least one of chemical composition, thickness, weight, elastic modulus, surface hardness, cross-sectional hardness, tensile strength, tensile yield strength, compressive strength, bulk density, cross-sectional area, cross-sectional shape, projected area, projected contour shape, surface roughness, flatness, parallelism, thermal conductivity, specific heat capacity, electrical conductivity, dielectric constant, magnetic susceptibility, water absorption rate, reflectance, and glossiness.
The laminate molding manufacturing system according to claim 1 . The structural construct is configured by combining at least two of the components including the same type of component from a set of components including a plurality of different types of elastic bodies, a plurality of different types of rigid bodies, a plurality of different types of fibrous bodies, a plurality of different types of particulate bodies, and voids.
The laminate molding manufacturing system according to claim 2 . The combination of the components includes a predetermined pattern structure in which a plurality of different components are formed in two or three dimensions.
The laminate molding manufacturing system according to claim 3 . Further comprising a selector for selecting at least one of the pressing bodies according to the state of the substrate to which at least a portion of the laminated film has been newly temporarily bonded or laminated,
The laminated molded product manufacturing system according to any one of claims 1 to 4. The selector makes the selection based on a combination of the components constituting the structural structure to press the substrate so that the temporarily bonded laminated film conforms to the unevenness of the substrate.
A laminate molding manufacturing system according to claim 5 when claim 3 is dependent thereon. The selector performs the selection based on a combination of the components constituting the structural structure to press the substrate so that the surface of the substrate after the lamination film is laminated and before pressing has a preset flatness.
A laminate molding manufacturing system according to claim 5 when claim 3 is dependent thereon. The state of the substrate referred to by the selector includes the number of layers of the substrate after at least a portion of the laminate film has been newly temporarily bonded or laminated and before being pressed;
The laminated molded product manufacturing system according to any one of claims 5 to 7. The state of the substrate referred to by the selector includes the material and thickness of the substrate after at least a portion of the laminate film is newly temporarily bonded or laminated and before being pressed;
The laminated molded product manufacturing system according to any one of claims 5 to 8. The state of the substrate referred to by the selector includes a state of processing applied to the substrate, including the laminate film pre-laminated on the substrate to which at least a portion of the laminate film is newly temporarily bonded or laminated,
The laminated molded product manufacturing system according to any one of claims 5 to 9. The pressing body may be selected from among the pressing bodies accommodated in the container, and the pressing body attached to the clamping portion may be replaced with an exchange device.
The laminated molded product manufacturing system according to any one of claims 1 to 10. The replacement device includes a preheating device that preheats the pressing body before attaching it to the clamping part.
The laminate molding manufacturing system according to claim 11. The pressing body includes a buffer layer as a structural component for dispersing pressure when the pressing body contacts the laminated molded product.
The laminated molded product manufacturing system according to any one of claims 1 to 12. The pressing body has an elastic body as the structural component on a surface that presses the base material so that the temporarily bonded or laminated laminated film conforms to the unevenness of the base material.
The laminated molded product manufacturing system according to any one of claims 1 to 13.

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