JP7472852B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP7472852B2
JP7472852B2 JP2021088983A JP2021088983A JP7472852B2 JP 7472852 B2 JP7472852 B2 JP 7472852B2 JP 2021088983 A JP2021088983 A JP 2021088983A JP 2021088983 A JP2021088983 A JP 2021088983A JP 7472852 B2 JP7472852 B2 JP 7472852B2
Authority
JP
Japan
Prior art keywords
wiring
semiconductor element
substrate
metal body
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021088983A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022181812A (ja
JP2022181812A5 (https=
Inventor
敬 佐藤
良 木村
悠嗣 小嶌
善次 坂本
知巳 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021088983A priority Critical patent/JP7472852B2/ja
Priority to PCT/JP2022/018363 priority patent/WO2022249803A1/ja
Publication of JP2022181812A publication Critical patent/JP2022181812A/ja
Publication of JP2022181812A5 publication Critical patent/JP2022181812A5/ja
Application granted granted Critical
Publication of JP7472852B2 publication Critical patent/JP7472852B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Inverter Devices (AREA)
JP2021088983A 2021-05-27 2021-05-27 半導体装置 Active JP7472852B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021088983A JP7472852B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018363 WO2022249803A1 (ja) 2021-05-27 2022-04-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088983A JP7472852B2 (ja) 2021-05-27 2021-05-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181812A JP2022181812A (ja) 2022-12-08
JP2022181812A5 JP2022181812A5 (https=) 2023-03-09
JP7472852B2 true JP7472852B2 (ja) 2024-04-23

Family

ID=84228782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021088983A Active JP7472852B2 (ja) 2021-05-27 2021-05-27 半導体装置

Country Status (2)

Country Link
JP (1) JP7472852B2 (https=)
WO (1) WO2022249803A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025021309A (ja) * 2023-07-31 2025-02-13 株式会社東芝 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015222743A (ja) 2014-05-22 2015-12-10 三菱電機株式会社 半導体装置
JP2018117054A (ja) 2017-01-19 2018-07-26 株式会社 日立パワーデバイス 半導体装置および電力変換装置
WO2018173511A1 (ja) 2017-03-22 2018-09-27 株式会社デンソー 半導体装置
WO2020262097A1 (ja) 2019-06-28 2020-12-30 日立オートモティブシステムズ株式会社 半導体装置およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6264230B2 (ja) * 2014-08-28 2018-01-24 三菱電機株式会社 半導体装置
JP2018026417A (ja) * 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置
JP6997690B2 (ja) * 2018-09-26 2022-01-18 日立Astemo株式会社 パワーモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015222743A (ja) 2014-05-22 2015-12-10 三菱電機株式会社 半導体装置
JP2018117054A (ja) 2017-01-19 2018-07-26 株式会社 日立パワーデバイス 半導体装置および電力変換装置
WO2018173511A1 (ja) 2017-03-22 2018-09-27 株式会社デンソー 半導体装置
WO2020262097A1 (ja) 2019-06-28 2020-12-30 日立オートモティブシステムズ株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2022249803A1 (ja) 2022-12-01
JP2022181812A (ja) 2022-12-08

Similar Documents

Publication Publication Date Title
JP7509084B2 (ja) 半導体装置
JP7711822B2 (ja) 半導体装置
JP7689653B2 (ja) 半導体装置
JP2025169996A (ja) 半導体装置
JP7424347B2 (ja) 半導体装置
JP7528865B2 (ja) 半導体装置
JP7512954B2 (ja) 半導体装置
JP7400774B2 (ja) 半導体装置
JP7400773B2 (ja) 半導体装置
JP7772161B2 (ja) 半導体装置
JP7472852B2 (ja) 半導体装置
JP7512953B2 (ja) 半導体装置
JP7563295B2 (ja) 半導体装置
JP7585969B2 (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20211111

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230301

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230301

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240312

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240325

R150 Certificate of patent or registration of utility model

Ref document number: 7472852

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150