JP7466080B2 - レーザアニール装置及びレーザアニール方法 - Google Patents

レーザアニール装置及びレーザアニール方法 Download PDF

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Publication number
JP7466080B2
JP7466080B2 JP2023545118A JP2023545118A JP7466080B2 JP 7466080 B2 JP7466080 B2 JP 7466080B2 JP 2023545118 A JP2023545118 A JP 2023545118A JP 2023545118 A JP2023545118 A JP 2023545118A JP 7466080 B2 JP7466080 B2 JP 7466080B2
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Japan
Prior art keywords
laser light
laser
amorphous silicon
silicon film
wavelength
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JP2023545118A
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Japanese (ja)
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JPWO2023032450A1 (https=
Inventor
光起 菱田
優顕 鈴木
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
JP2023545118A 2021-09-02 2022-06-30 レーザアニール装置及びレーザアニール方法 Active JP7466080B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021143326 2021-09-02
JP2021143326 2021-09-02
PCT/JP2022/026186 WO2023032450A1 (ja) 2021-09-02 2022-06-30 レーザアニール装置及びレーザアニール方法

Publications (2)

Publication Number Publication Date
JPWO2023032450A1 JPWO2023032450A1 (https=) 2023-03-09
JP7466080B2 true JP7466080B2 (ja) 2024-04-12

Family

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JP2023545118A Active JP7466080B2 (ja) 2021-09-02 2022-06-30 レーザアニール装置及びレーザアニール方法

Country Status (5)

Country Link
US (1) US20240157471A1 (https=)
JP (1) JP7466080B2 (https=)
KR (1) KR20240046868A (https=)
DE (1) DE112022004267T5 (https=)
WO (1) WO2023032450A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308009A (ja) 2000-02-15 2001-11-02 Matsushita Electric Ind Co Ltd 非単結晶膜、非単結晶膜付き基板、その製造方法及びその製造装置並びにその検査方法及びその検査装置並びにそれを用いた薄膜トランジスタ、薄膜トランジスタアレイ及び画像表示装置
JP2004064066A (ja) 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd レーザアニール装置
JP2004103794A (ja) 2002-09-09 2004-04-02 Sumitomo Heavy Ind Ltd シリコン結晶化方法及びレーザアニール装置
JP2004349643A (ja) 2003-05-26 2004-12-09 Fuji Photo Film Co Ltd レーザアニール装置
JP2005072183A (ja) 2003-08-22 2005-03-17 Mitsubishi Electric Corp 薄膜半導体の製造方法および製造装置
JP2005079497A (ja) 2003-09-03 2005-03-24 Toshiba Corp レーザ加工方法と加工装置および表示装置の製造方法と表示装置
JP2007027612A (ja) 2005-07-21 2007-02-01 Sony Corp 照射装置および照射方法
JP2007158372A (ja) 2007-02-06 2007-06-21 Advanced Display Inc 半導体装置の製造方法および製造装置
WO2008129719A1 (ja) 2007-04-18 2008-10-30 Mitsubishi Electric Corporation 半導体薄膜の製造方法および半導体装置
JP2008288608A (ja) 2008-07-14 2008-11-27 Advanced Lcd Technologies Development Center Co Ltd 半導体結晶化装置
JP2009188378A (ja) 2007-11-08 2009-08-20 Applied Materials Inc パルス列アニーリング方法および装置
JP2010034366A (ja) 2008-07-30 2010-02-12 Sony Corp 半導体処理装置および半導体処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2856533B2 (ja) * 1990-10-05 1999-02-10 株式会社東芝 多結晶シリコン薄膜の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308009A (ja) 2000-02-15 2001-11-02 Matsushita Electric Ind Co Ltd 非単結晶膜、非単結晶膜付き基板、その製造方法及びその製造装置並びにその検査方法及びその検査装置並びにそれを用いた薄膜トランジスタ、薄膜トランジスタアレイ及び画像表示装置
JP2004064066A (ja) 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd レーザアニール装置
JP2004103794A (ja) 2002-09-09 2004-04-02 Sumitomo Heavy Ind Ltd シリコン結晶化方法及びレーザアニール装置
JP2004349643A (ja) 2003-05-26 2004-12-09 Fuji Photo Film Co Ltd レーザアニール装置
JP2005072183A (ja) 2003-08-22 2005-03-17 Mitsubishi Electric Corp 薄膜半導体の製造方法および製造装置
JP2005079497A (ja) 2003-09-03 2005-03-24 Toshiba Corp レーザ加工方法と加工装置および表示装置の製造方法と表示装置
JP2007027612A (ja) 2005-07-21 2007-02-01 Sony Corp 照射装置および照射方法
JP2007158372A (ja) 2007-02-06 2007-06-21 Advanced Display Inc 半導体装置の製造方法および製造装置
WO2008129719A1 (ja) 2007-04-18 2008-10-30 Mitsubishi Electric Corporation 半導体薄膜の製造方法および半導体装置
JP2009188378A (ja) 2007-11-08 2009-08-20 Applied Materials Inc パルス列アニーリング方法および装置
JP2008288608A (ja) 2008-07-14 2008-11-27 Advanced Lcd Technologies Development Center Co Ltd 半導体結晶化装置
JP2010034366A (ja) 2008-07-30 2010-02-12 Sony Corp 半導体処理装置および半導体処理方法

Also Published As

Publication number Publication date
US20240157471A1 (en) 2024-05-16
JPWO2023032450A1 (https=) 2023-03-09
KR20240046868A (ko) 2024-04-11
DE112022004267T5 (de) 2024-06-20
WO2023032450A1 (ja) 2023-03-09

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