JP7455743B2 - 半導体ウェハの洗浄方法 - Google Patents

半導体ウェハの洗浄方法 Download PDF

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JP7455743B2
JP7455743B2 JP2020526908A JP2020526908A JP7455743B2 JP 7455743 B2 JP7455743 B2 JP 7455743B2 JP 2020526908 A JP2020526908 A JP 2020526908A JP 2020526908 A JP2020526908 A JP 2020526908A JP 7455743 B2 JP7455743 B2 JP 7455743B2
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JP2021510008A (ja
Inventor
フゥイ ワン
フーファ チェン
フーピン チェン
ジェン ワン
シー ワン
シャオイェン ヂャン
イーヌォ ジン
ヂャオウェイ ジャ
リァンヂー シェ
ジュン ワン
シュエジュン リー
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エーシーエム リサーチ （シャンハイ） インコーポレーテッド
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Publication of JP2021510008A publication Critical patent/JP2021510008A/ja
Priority to JP2022161839A priority Critical patent/JP7495461B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2020526908A 2017-11-15 2017-11-15 半導体ウェハの洗浄方法 Active JP7455743B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022161839A JP7495461B2 (ja) 2022-10-06 半導体ウェハの洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/111015 WO2019095126A1 (en) 2017-11-15 2017-11-15 Method for cleaning semiconductor wafers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022161839A Division JP7495461B2 (ja) 2022-10-06 半導体ウェハの洗浄方法

Publications (2)

Publication Number Publication Date
JP2021510008A JP2021510008A (ja) 2021-04-08
JP7455743B2 true JP7455743B2 (ja) 2024-03-26

Family

ID=66539289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020526908A Active JP7455743B2 (ja) 2017-11-15 2017-11-15 半導体ウェハの洗浄方法

Country Status (5)

Country Link
JP (1) JP7455743B2 (ko)
KR (1) KR102517663B1 (ko)
CN (1) CN111386157B (ko)
SG (1) SG11202004432SA (ko)
WO (1) WO2019095126A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006518550A (ja) 2003-02-20 2006-08-10 ラム　リサーチ　コーポレーション パターン化された基板の超音波洗浄のための方法および装置
JP2012081430A (ja) 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
JP2012524408A (ja) 2009-04-14 2012-10-11 ラム リサーチ コーポレーション 粘弾性洗浄材料を使用して基板上の粒子を除去するための装置および方法
JP2012507858A5 (ko) 2009-10-14 2012-11-29
WO2017173588A1 (en) 2016-04-06 2017-10-12 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US6557564B1 (en) * 1999-10-30 2003-05-06 Applied Materials, Inc. Method and apparatus for cleaning a thin disk
JP2002289565A (ja) * 2001-03-26 2002-10-04 Toshiba Corp 洗浄方法、半導体装置の製造方法及びアクティブマトリクス型表示装置の製造方法
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species
JP3925512B2 (ja) * 2004-06-18 2007-06-06 セイコーエプソン株式会社 超音波トランスデューサ、超音波スピーカ、及び超音波トランスデューサの駆動制御方法
WO2006096814A2 (en) * 2005-03-08 2006-09-14 Akrion, Inc. Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
US8585825B2 (en) 2008-10-30 2013-11-19 Lam Research Corporation Acoustic assisted single wafer wet clean for semiconductor wafer process
CN101879511B (zh) * 2009-05-08 2013-01-02 盛美半导体设备（上海）有限公司 半导体衬底的清洗方法和装置
CN201868386U (zh) * 2010-08-26 2011-06-15 中芯国际集成电路制造(上海)有限公司 晶圆清洗设备
KR102359795B1 (ko) * 2015-05-20 2022-02-08 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법 및 장치
CN105080821B (zh) * 2015-08-19 2018-01-26 杭州成功超声设备有限公司 一种具有定量振幅反馈系统的超声波换能器
TWI731851B (zh) * 2016-03-01 2021-07-01 大陸商盛美半導體設備（上海）股份有限公司 清洗半導體襯底的方法和裝置
EP3515611A4 (en) * 2016-09-19 2020-05-13 ACM Research (Shanghai) Inc. METHODS AND APPARATUS FOR CLEANING SUBSTRATES
KR102655533B1 (ko) * 2016-09-20 2024-04-08 에이씨엠 리서치 (상하이), 인코포레이티드 기판을 세정하는 방법 및 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006518550A (ja) 2003-02-20 2006-08-10 ラム　リサーチ　コーポレーション パターン化された基板の超音波洗浄のための方法および装置
JP2012524408A (ja) 2009-04-14 2012-10-11 ラム リサーチ コーポレーション 粘弾性洗浄材料を使用して基板上の粒子を除去するための装置および方法
JP2012507858A5 (ko) 2009-10-14 2012-11-29
JP2012081430A (ja) 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
WO2017173588A1 (en) 2016-04-06 2017-10-12 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers

Also Published As

Publication number Publication date
CN111386157A (zh) 2020-07-07
CN111386157B (zh) 2022-12-27
WO2019095126A1 (en) 2019-05-23
JP2021510008A (ja) 2021-04-08
KR20200078656A (ko) 2020-07-01
SG11202004432SA (en) 2020-06-29
JP2022180654A (ja) 2022-12-06
KR102517663B1 (ko) 2023-04-05

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