CN111386157B - 用于清洗半导体晶圆的方法 - Google Patents

用于清洗半导体晶圆的方法 Download PDF

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Publication number
CN111386157B
CN111386157B CN201780096846.1A CN201780096846A CN111386157B CN 111386157 B CN111386157 B CN 111386157B CN 201780096846 A CN201780096846 A CN 201780096846A CN 111386157 B CN111386157 B CN 111386157B
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China
Prior art keywords
time
frequency
predetermined period
wafer
cleaning
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Active
Application number
CN201780096846.1A
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English (en)
Chinese (zh)
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CN111386157A (zh
Inventor
王晖
陈福发
陈福平
王坚
王希
张晓燕
金一诺
贾照伟
谢良智
王俊
李学军
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ACM Research Shanghai Inc
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ACM Research Shanghai Inc
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Publication of CN111386157A publication Critical patent/CN111386157A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201780096846.1A 2017-11-15 2017-11-15 用于清洗半导体晶圆的方法 Active CN111386157B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/111015 WO2019095126A1 (en) 2017-11-15 2017-11-15 Method for cleaning semiconductor wafers

Publications (2)

Publication Number Publication Date
CN111386157A CN111386157A (zh) 2020-07-07
CN111386157B true CN111386157B (zh) 2022-12-27

Family

ID=66539289

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780096846.1A Active CN111386157B (zh) 2017-11-15 2017-11-15 用于清洗半导体晶圆的方法

Country Status (5)

Country Link
JP (1) JP7455743B2 (ko)
KR (1) KR102517663B1 (ko)
CN (1) CN111386157B (ko)
SG (1) SG11202004432SA (ko)
WO (1) WO2019095126A1 (ko)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
US5800626A (en) * 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US6557564B1 (en) * 1999-10-30 2003-05-06 Applied Materials, Inc. Method and apparatus for cleaning a thin disk
JP2002289565A (ja) * 2001-03-26 2002-10-04 Toshiba Corp 洗浄方法、半導体装置の製造方法及びアクティブマトリクス型表示装置の製造方法
US6848455B1 (en) * 2002-04-22 2005-02-01 Novellus Systems, Inc. Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species
JP4733012B2 (ja) * 2003-02-20 2011-07-27 ラム リサーチ コーポレーション 処理方法及び処理装置
JP3925512B2 (ja) * 2004-06-18 2007-06-06 セイコーエプソン株式会社 超音波トランスデューサ、超音波スピーカ、及び超音波トランスデューサの駆動制御方法
US20060260639A1 (en) * 2005-03-08 2006-11-23 Pejman Fani Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
US8585825B2 (en) * 2008-10-30 2013-11-19 Lam Research Corporation Acoustic assisted single wafer wet clean for semiconductor wafer process
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
CN101879511B (zh) * 2009-05-08 2013-01-02 盛美半导体设备（上海）有限公司 半导体衬底的清洗方法和装置
CN201868386U (zh) * 2010-08-26 2011-06-15 中芯国际集成电路制造(上海)有限公司 晶圆清洗设备
JP2012081430A (ja) * 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
JP6605044B2 (ja) * 2015-05-20 2019-11-13 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウエハの洗浄方法および洗浄装置
CN105080821B (zh) * 2015-08-19 2018-01-26 杭州成功超声设备有限公司 一种具有定量振幅反馈系统的超声波换能器
TWI731851B (zh) * 2016-03-01 2021-07-01 大陸商盛美半導體設備（上海）股份有限公司 清洗半導體襯底的方法和裝置
SG11201808637XA (en) * 2016-04-06 2018-10-30 Acm Res Shanghai Inc Methods and apparatus for cleaning semiconductor wafers
JP7032816B2 (ja) * 2016-09-19 2022-03-09 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板の洗浄方法及び洗浄装置
CN109791899B (zh) * 2016-09-20 2023-06-16 盛美半导体设备(上海)股份有限公司 衬底清洗方法及清洗装置

Also Published As

Publication number Publication date
SG11202004432SA (en) 2020-06-29
WO2019095126A1 (en) 2019-05-23
JP7455743B2 (ja) 2024-03-26
CN111386157A (zh) 2020-07-07
KR20200078656A (ko) 2020-07-01
JP2022180654A (ja) 2022-12-06
JP2021510008A (ja) 2021-04-08
KR102517663B1 (ko) 2023-04-05

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