JP7451617B2 - Imaging device - Google Patents

Description

The present invention relates to an imaging device.

In recent years, the data rate of images handled by imaging devices has increased due to higher resolution of captured images such as 4K and 8K, higher frame rates, and support for high dynamic range. The required power consumption is also increasing. Furthermore, as power consumption increases, heat generation inside imaging devices has become a problem.

As a countermeasure against such heat generation, an imaging device having a forced air cooling mechanism such as a fan or a duct as disclosed in Patent Document 1 has been developed.

JP2014-45343

In the imaging device of Patent Document 1, heat is radiated by sucking in cold air from an intake port and expelling air containing heat generated inside the device from an exhaust port of the imaging device. However, if these ports are placed on a flat surface such as the ground with the intake or exhaust ports facing downward, the intake or exhaust ports will become blocked, impeding the flow of air for forced air cooling and reducing heat exhaust efficiency. There is a risk that the imaging device may malfunction due to a decrease in internal temperature and an increase in internal temperature.

An object of the present invention is to provide an imaging device whose heat exhaust efficiency does not decrease regardless of the direction in which it is used.

The imaging device of the present invention includes a mount provided on the front surface of the device main body to which a lens device can be detachably attached, and a first protrusion and a second protrusion provided on the first side surface of the device main body. an air intake port formed in the first protrusion; an exhaust port formed in a second side surface of the device body that is different from the first side surface; The air conditioner is characterized by comprising a duct unit for discharging air from an exhaust port, and a connector for attaching a wireless LAN antenna provided on the second protrusion.
Further, a mount provided on the front surface of the device main body to which the lens device can be detachably attached, and a first protrusion provided on the first side surface of the device main body are different from the first side surface. A second protrusion provided on a second side surface of the device body, an air intake port formed on the first side surface, and a wireless LAN antenna provided on the first protrusion are attached. An exhaust port formed in the second protrusion, and a duct unit for discharging air taken in from the intake port from the exhaust port .

According to the present invention, it is possible to provide an imaging device whose heat exhaust efficiency does not decrease regardless of the direction in which it is used.

FIG. 1 is a front perspective view showing an imaging device in an embodiment of the present invention. FIG. 1 is a rear perspective view showing an imaging device according to an embodiment of the present invention. FIG. 1 is a front exploded perspective view showing the main internal components of the imaging device according to the embodiment of the present invention. FIG. 2 is an exploded rear perspective view showing the main internal components of the imaging device according to the embodiment of the present invention. FIG. 2 is a right side view showing a state in which a lens device is attached to an imaging device according to an embodiment of the present invention. FIG. 1 is a top view showing an imaging device according to an embodiment of the present invention. FIG. 7 is an enlarged top view of the electrical contact in FIG. 6; FIG. 1 is a right side view showing an imaging device in an embodiment of the present invention. AA sectional view in FIG. 8. FIG. 3 is a diagram illustrating a state in which the imaging device according to the embodiment of the present invention is placed on the lower right side. FIG. 1 is a front perspective view showing an imaging device in an embodiment of the present invention. FIG. 1 is a rear perspective view showing an imaging device according to an embodiment of the present invention. FIG. 1 is a top view showing an imaging device according to an embodiment of the present invention. FIG. 3 is a diagram illustrating a state in which the imaging device according to the embodiment of the present invention is placed on the lower right side. FIG. 1 is a block diagram showing a schematic configuration of an imaging device in an embodiment of the present invention. FIG. 2 is a schematic diagram of a mount for an imaging device and a lens device in an embodiment of the present invention. FIG. 2 is a block diagram showing a circuit configuration in a state where a lens device is connected to an imaging device according to an embodiment of the present invention. FIG. 7 is a flowchart diagram showing the flow of second communication in the embodiment of the present invention. FIG. 1 is a left side view and a rear perspective view of an imaging device according to an embodiment of the present invention. FIG. 1 is a left side view and a rear perspective view of an imaging device according to an embodiment of the present invention. FIG. 1 is a left side view and a rear perspective view of an imaging device according to an embodiment of the present invention. FIG. 1 is a left side view and a rear perspective view of an imaging device according to an embodiment of the present invention.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

<Exterior of the imaging device>
FIG. 1 is a front perspective view of an imaging device according to an embodiment of the present invention, and FIG. 2 is a rear perspective view of the imaging device. Note that here, for convenience of explanation, a coordinate system is defined as shown in FIG. 1. The Z-axis is the front-back direction of the imaging device (the front side, which is the front lens side, is the +Z direction, the back side is the -Z direction), and the Y-axis is the vertical direction of the imaging device (the top side is the +Y direction, the bottom side is the -Y direction). , the X-axis is the left-right direction of the imaging device (when viewed from the front, the right side is the +X direction, and the left side is the -X direction).

The dashed line shown in FIG. 1 is the optical axis 1706. That is, the Z direction corresponds to the optical axis direction. Further, the imaging device in this embodiment is an imaging device with interchangeable lenses, and will be hereinafter referred to as an imaging device.

As shown in FIGS. 1 and 2, the casing that constitutes the main body of the imaging device 1000 has six basic surfaces (front surface, rear surface, top surface, bottom surface, left side surface, and right side surface), and the adjacent surfaces are It has a rectangular parallelepiped shape that intersects at approximately right angles.

A front cover 1004 is provided on the front side of the main body of the imaging apparatus 1000, and the front cover 1004 has an opening 1004a centered on an optical axis 1706. A lens mount 1001 to which a lens device (lens barrel) 3000 (FIG. 5) can be detachably mounted is provided inside the opening 1004a. Furthermore, a lens contact portion 1002 for communicating with the lens device 3000 and a lens removal button 1003 for removing the lens device 3000 are provided.

Furthermore, an image sensor 1006 is provided inside an opening 1004a provided in the front cover 1004 to convert an optical image of a subject obtained by the lens device 3000 into an electrical signal.

Furthermore, an upper protrusion 1100 and a lower protrusion 1101 that protrude toward the lens device 3000 side (+Z direction) than the lens mount 1001 are provided at the upper and lower parts of the front cover 1004. Details of these protrusions will be described later.

A left side cover 1030 is provided on the left side of the imaging device 1000 when viewed from the front, and the left side cover 1030 has a left side cover protrusion 1031 that protrudes beyond the left side cover first surface 1030a, which is the main surface. A plurality of intake ports 1032 are formed in the left side cover protrusion 1031 for sucking low-temperature air into the imaging device 1000 from the outside by driving a fan 1404 (FIG. 4) arranged inside the imaging device 1000. There is. Details of the left side cover protrusion 1031 and the intake port 1032 will be described later.

In addition, tripod female screws 1700g and 1700h, into which male screws can be inserted in a direction substantially parallel to the X-axis, are provided at the front upper and lower portions of the left side surface. Details of these tripod female screws will be described later.

A right side cover 1015 is provided on the right side of the imaging device 1000 when viewed from the front, and the right side cover 1015 has a right side cover protrusion 1016 that protrudes beyond the right side cover first surface 1015a, which is the main surface. A plurality of exhaust ports 1017 are formed in the right side cover protrusion 1016 for discharging hot air generated inside the imaging device 1000 to the outside by driving a fan 1404 (FIG. 4) arranged inside the imaging device 1000. ing. Details of the right side cover protrusion 1016 and the exhaust port 1017 will be described later.

Furthermore, on the right side of the imaging apparatus 1000 when viewed from the front, there are further provided a REC button (recording start/end button) 1010 operated by the photographer, and an operation key 1011 for changing camera settings and the like. Furthermore, a microphone section 1012 for recording audio and a card storage lid 1013 that covers a storage chamber for storing a memory card as a recording medium are provided.

Tripod female screws 1700e and 1700f, into which male screws can be inserted in a direction substantially parallel to the X-axis, are provided at the front upper and lower portions of the right side surface. Details of these tripod female screws will be described later.

On the top side of the imaging device 1000, there are provided a display unit 1040 for displaying images shot by the imaging device 1000, a shooting settings menu, etc., and operation keys 1041 for the user to change shooting settings and the like. Furthermore, tripod female screws 1700a to 1700d for fixing external accessories and the like, and electrical contacts 1043 for communicating with external accessories are provided.

External accessories include, for example, a display panel for displaying photographed images and recorded images, a handle unit with a built-in microphone terminal, and an external communication terminal such as a smartphone. When an external communication terminal such as a smartphone is connected, the user may set the shooting menu of the imaging device 1000, give shooting instructions, etc. from the external communication terminal, and display shot images and recorded images on the display screen of the external communication terminal. You can do it like this.

By connecting the electrical contacts (not shown) of the external accessory to the electrical contacts 1043 of the imaging device 1000, power can be supplied and electrical signals can be transmitted and received between the external accessory and the imaging device 1000. Note that the configuration is configured so that external accessories and the imaging device 1000 are connected not only by wired connection via electrical contacts but also by using a wireless LAN such as Wi-Fi (registered trademark), a wireless communication function installed in a smartphone, etc. You may. For example, a mobile phone line such as a fourth generation mobile communication system or a fifth generation mobile communication system may be used. Furthermore, the imaging apparatus 1000 may be configured to perform wireless communication with the outside via an external accessory.

Further, the display unit 1040 may be connected to the imaging device 1000 by a rotation hinge or the like, and configured to be able to change the viewing angle with respect to the imaging device 1000. Alternatively, a touch panel may be provided on the surface of the display unit 1040, and menu settings may be directly performed by operating the touch panel.

On the rear side of the imaging device 1000, a battery storage section 1020 that stores a battery 1070, and a group of external input/output terminals 1021 such as external connection terminals and power supply terminals are provided. By arranging the battery compartments 1020 in two locations above and below, even if one battery runs out, power can be supplied from the other battery, and the camera can be used continuously by replacing the battery without powering down. becomes possible.

A tripod screw portion 1050 for fixing the imaging device 1000 to a tripod or the like is provided on the bottom side of the imaging device 1000.

<Internal configuration of imaging device>
Next, the internal configuration of the imaging device 1000 will be described. 3 is a front exploded perspective view of the main internal components of the imaging device 1000, and FIG. 4 is a rear exploded perspective view of the main internal components of the imaging device 1000.

As shown in FIGS. 3 and 4, the interior of the imaging device 1000 is roughly divided into an imaging unit 1300, a main unit 1400, and a card unit 1500, which are arranged along the optical axis 1706 (Z-axis) in the above order from the front side. be done.

The imaging unit 1300 includes the aforementioned lens mount 1001 and an imaging element holding member 1301 that holds the imaging element 1006. The image sensor 1006 is electrically connected to the image sensor substrate 1302 by soldering.

Further, the image sensor 1006 is mechanically fixed to the image sensor holding plate 1303 with an adhesive or the like, and the image sensor holding plate 1303 is fixed to the image sensor holding member 1301 with screws. The image sensor 1006, the image sensor substrate 1302, and the image sensor holding plate 1303 are arranged perpendicular to the optical axis 1706 in the above order from the front side.

Further, the lens mount 1001 is similarly fixed to the image sensor holding member 1301 with screws. The distance from the mount surface 1001a of the lens mount 1001 to the imaging surface 1006a of the image sensor 1006 (see FIG. 9) is the flange back of the imaging device 1000. An internal adjustment washer 1304 is sandwiched between the image sensor holding plate 1303 and the image sensor holding member 1301, and its thickness is adjusted to provide a predetermined flange back during assembly.

Here, it is desirable that the flange back is set to 20 mm or less, and the inner diameter of the lens mount is set to 45 mm or more. For example, the flange back is set to 20 mm and the inner diameter of the mount is set to 54 mm. Further, the lens contact section 1002 that communicates with the lens device 3000 includes, for example, a 12-pin electronic contact.

Further, an ND unit 1305 is provided between the lens mount 1001 and the image sensor 1006, and is fixed to the image sensor holding member 1301 with a screw. The ND unit 1305 has a plurality of ND filters (not shown), which are optical components, with different densities, and by attenuating incident light with the ND filters, it is possible to lower the shutter speed or open the aperture of the lens device during shooting. It becomes possible.

Image signals output from the image sensor board 1302, lens communication signals from the lens device 3000 connected to the lens contact portion 1002, and control signals from the ND unit 1305 are transmitted to the main unit 1400 through internal wiring such as wires (not shown). It is transmitted to the board 1401.

The main unit 1400 includes a main board 1401 that controls the operation of the imaging apparatus 1000, a heat sink 1402 that is thermally connected to the main board 1401, a heat sink 1403 that covers the heat sink 1402, and a fan 1404 that blows air into the heat sink 1402. The heat sink 1403, the heat sink 1402, and the main board 1401 are arranged perpendicularly to the optical axis 1706 in the above order from the front side. That is, the main board 1401 is arranged parallel to the image sensor board 1302.

The heat sink 1402 is made of die-cast aluminum or the like, which has excellent thermal conductivity. The main board 1401 is fixed with screws such that an IC chip or the like mounted on the board and serving as a heat source is thermally connected to a heat sink 1402 via a heat transfer member such as heat dissipating rubber or grease (not shown). . In order to thermally diffuse the heat transferred from the main board 1401, which is the main heat source of the imaging device 1000, it is preferable that the heat sink 1402 has as large a surface area as possible, and in this embodiment, the main board 1401 and the heat sink 1402 are approximately the same in projection. The external shape is .

Further, the heat sink 1402 includes a plurality of radiation fins 1405 that protrude in parallel on the opposite side of the surface facing the main board 1401, and the radiation fins 1405 extend in the left-right direction of the imaging device 1000. The heat sink 1403 is fixed to the heat sink 1402 with screws so as to cover the heat sink fins 1405, thereby forming a ventilation duct unit 1406 through which air flows between the plurality of heat sink fins 1405.

The heat sink 1403 is formed in an L-shape that comes into contact with a surface perpendicular to the heat sink fins 1405 of the ventilation duct unit 1406 described above. The fan 1404 is fixed to a surface of the L-shaped heat sink 1403 that is orthogonal to the main board 1401 and the heat sink fins 1405 (in this embodiment, the left side surface of the imaging device 1000). The fan 1404 is an axial fan, which sucks in air from the surface and discharges it from the surface.

In this embodiment, two fans 1404 are arranged vertically on the left side of the imaging apparatus 1000 and blow air out to the side surface of the heat radiation fins 1405. In other words, the fan 1404 disposed at the entrance of the ventilation duct unit 1406 serves as an intake section 1407 to suck in cold air and discharge the cold air to the heat radiation fins 1405 that have transferred heat from the heat source of the main board 1401. By performing such intake and exhaust, the hot air that has undergone heat exchange with the radiation fins 1405 can be discharged to the open end on the opposite side. The open end on the opposite side becomes the exhaust section 1408.

The intake section 1407 of the ventilation duct unit 1406 is connected to the intake port 1032 of the imaging device 1000, and the exhaust section 1408 of the ventilation duct unit 1406 is connected to the exhaust port 1017 of the imaging device 1000. That is, by connecting the fan 1404 (intake unit 1407) to the intake port 1032 of the imaging device 1000, cold air can be sucked into the imaging device 1000 from outside. Furthermore, by connecting the exhaust section 1408 to the exhaust port 1017 of the imaging device 1000, hot air can be discharged from the inside of the imaging device 1000 to the outside. Details of the internal forced air cooling mechanism described above will be described later.

The card unit 1500 includes a card board 1502 on which a card socket 1501 is mounted, and a card board holding member 1503 that holds the card board 1502. In this embodiment, by mounting two card sockets 1501 on the card board 1502, simultaneous recording for backup and long-term relay recording are possible.

The card board holding member 1503, the card board 1502, and the card socket 1501 are arranged perpendicular to the optical axis 1706 in the above order from the front side. That is, the card board 1502 is arranged parallel to the main board 1401 and the image sensor board 1302. The card board 1502 is connected to the main board 1401 by internal wiring (not shown) such as a wire, and video data is recorded on a memory card inserted into the card socket 1501.

In this way, by arranging the image sensor board 1302, main board 1401, and card board 1502, which require a relatively large area, in parallel along the optical axis 1706, the three boards can be efficiently arranged within the imaging device 1000. This can contribute to miniaturization of the imaging device 1000. In addition, by arranging the ventilation duct unit 1406 in parallel with the main board 1401, which is the main heat source, the heat of the main board 1401 can be diffused over a wide range, and the heat can be exhausted by the fan 1404. Further, a structure may also be used in which the heat of the image sensor substrate 1302 and the card substrate 1502 is transferred to the ventilation duct unit 1406 and radiated.

<Configuration block diagram of imaging device>
FIG. 15 is a block diagram showing a schematic configuration of the imaging device 1000. The functional configuration of the imaging device 1001 will be explained using FIG. 15.

The imaging device 1000 includes a lens communication section 1800, an imaging element 1006 mounted on a sensor board 1302, a main board 1401, a card board 1502, and a microphone section 1012. Furthermore, it includes an external input/output terminal group 1021, a detachable battery 1070, an operation section 1044, a fan 1404, and a display section 1040. Further, the CPU 2041, ROM 2042, and RAM 2043 are mounted on the main board 1401.

The ROM 2042 is a memory that can be electrically erased and stored, and for example, an EEPROM or the like is used. The ROM 2042 stores constants, programs, etc. for the operation of the CPU 2041. The CPU 2041 executes a program stored in the ROM 2043 to control the operations of each component of the imaging apparatus 1000, thereby realizing overall control of the imaging apparatus 1000.

The RAM 2043 is used as a system memory, a work memory, an image memory, an audio memory, etc., and stores constants and variables for the operation of the CPU 2041, programs read from the ROM 2042, and the like.

The image sensor 1007 is a CCD sensor or a CMOS sensor, and includes an A/D converter. A lens device 3000 attached to the imaging device 1000 forms an optical image of incident light on the imaging element 1007. The image sensor 1006 converts the formed optical image into an analog electrical signal, and further converts it into a digital signal using an A/D converter and outputs it as a video signal. The generated digital video signal is output to the video signal processing section 2146 on the main board 1401.

The video signal processing unit 2146 performs predetermined processing on the input digital video signal, and generates video data by combining it with a separately captured audio signal and various metadata. The video data generated by the video signal processing section 2146 is sent to the display section 1040 and displayed as a video. At this time, the operating status of the imaging device 1000 is displayed as on-screen display information as necessary.

Here, the image sensor 1006 includes a plurality of phase difference detection pixels. Then, the video signal processing unit 2146 performs a correlation calculation using the output signals of the plurality of phase difference detection pixels, and controls the focal position of the attached lens device 3000 based on the correlation calculation result to position the imaging surface. Autofocus using a phase difference detection method can be performed.

Further, when recording is selected by the photographer, the video data generated by the video signal processing unit 2146 is converted into various formats by applying predetermined processing, and then sent to the card board 1502. Saved as an image on recording media.

On the other hand, when a predetermined connector is connected to the external connection terminal 1021, the video signal processing section 2146 can output a video signal to the external connection terminal 1021 and transmit it to an external device.

Note that in the imaging apparatus 1000, the original video data can be regenerated by having the video signal processing unit 2146 read the recorded data stored in the recording medium. The regenerated video data can then be output to the display section 1040 and the external connection terminal 1021.

The audio signal input from the microphone unit 1012 is gain-controlled to a predetermined level, and then A/D converted to convert it into digital audio data. Video data and audio data are temporarily stored in RAM 2043.

The CPU 2041 transmits the video data and audio data temporarily stored in the RAM 2043 to the card board 1502. A recording medium can be inserted into and removed from the card board 1502, and video data and audio data are recorded on the recording medium. Note that a removable flash memory such as an SD card or a memory card compliant with standards such as CF, CFast, XQD, and CFexpress is used as the recording medium.

The fan 1404 operates based on the temperature acquired by a temperature detection unit (not shown), and performs air intake and exhaust into the imaging apparatus 1000. The rotational state of fan 1404 is controlled by CPU 2041.

The operation unit 1044 transmits instructions based on user operations to the CPU 2041. The operation unit 1044 includes a REC button 1010, a power switch, an operation key 1011 (see FIG. 1), and the like.

When the operation unit 1044 is operated by the user, various instructions from the user are transmitted to the CPU 2041.

The power supply control unit (not shown) includes a battery detection circuit, a DC-DC converter, a switch circuit for switching the blocks to be energized, and the like, and detects the presence or absence of a battery, the type of battery, and the remaining battery level. A battery 1070 that supplies power to the imaging device 1000 is, for example, removable from the imaging device 1000, and is, for example, a lithium ion battery.

The display unit 1040 is, for example, a liquid crystal display device, and displays the operating status of the imaging device 1000 as on-screen display information as necessary.

When the lens contact section 1002 provided in the lens communication section 1800 of the imaging device 1000 and the lens contact section (details will be described later) on the lens device 3000 side come into contact and conduct, the CPU 2041 of the imaging device 1000 detects that the lens device 3000 is attached. do. When detecting that the lens device 3000 is attached, the CPU 2041 reads lens information from the built-in memory of the lens device 3000 and stores it in the RAM 2043. Details will be described later.

In the imaging apparatus 1000 of this embodiment, for example, light received by the imaging element 1006 is converted into digital image data of at least about 23 frames per second (fps), and recorded on a recording medium by the card board 1502. The frame rate can be set in a range of about 1 fps to about 250 fps or more. For example, the imaging device 1000 may change the frame rate depending on the set resolution.

That is, a frame rate of about 1 fps to about 100 fps is set in the "5k" resolution mode, and a frame rate of about 1 to about 125 fps in the "4k" resolution mode. The frame rate is set at about 1 to about 125 fps in the quad HD mode, about 1 to about 160 fps in the "3K" resolution mode, and about 1 to about 250 fps in the "2K" resolution mode. For example, the frame rates may be 20, 23.976, 24, 30, 60, and 120 frames per second, or other frame rates between these frame rates, or higher frame rates.

The imaging device 1000 has "2k" (for example, 16:9 (2048 x 1152 pixels), 2:1 (2048 x 1024 pixels), etc.), "3k" (for example, 16:9 (3072 x 1728 pixels), 2 :1 (3072 x 1536 pixels), etc.). In addition, image data is output at a resolution of "4K" (for example, 4096 x 2540 pixels, 16:9 (4096 x 2304 pixels), 2:1 (4096 x 2048 pixels), etc.) or "4.5K" horizontal resolution. can.

Also, with quad HD (e.g. 3840 x 2160 pixels), "5k" (e.g. 5120 x 2700) horizontal resolution, "6k" (e.g. 6144 x 3160), "8k" (e.g. 7680 x 4320) resolution Image data can be output. Furthermore, image data can be output with higher resolution. Imaging device 1000 may be configured to record or output image data having a horizontal resolution between at least any of the resolutions listed above.

Additionally, the resolution is between at least one of the above-mentioned values (or any value between the above-mentioned values), and is approximately 6.5k, 7k, 8k, 9k, or 10k, or any value therebetween. It can be taken. In this embodiment, in terms expressed in the xk format (such as 2k and 4k mentioned above), the number "x" refers to the approximate horizontal resolution. Therefore, a resolution of "4k" corresponds to approximately 4000 or more horizontal pixels, and "2k" corresponds to approximately 2000 or more horizontal pixels.

The imager 1006 can range from about 0.5 inch (8 mm) to 2/3 inch, S35 for movie, 35 mm full frame still, and 645, and at least about 1.0 inch, 6 cm x It can be 17 cm or more. It can also have a size of at least about 10.1 x 5.35 mm, 24.4 x 13.7 mm, 30 x 15 mm, 36 x 24 mm, 56 x 42 mm, and 186 x 56 mm.

In addition, the imaging device 1006 can be configured to provide variable resolution by selectively outputting only predetermined portions of the pixel area. The image sensor 1006 can include, for example, a Bayer array color filter. Therefore, data representing the amount of red light, green light, or blue light detected by each photoelectric conversion element of the image sensor 1006 is output.

<Detailed configuration of mount>
Next, detailed configurations of the mounts of the imaging device 1000 and the lens device 3000 will be described using FIG. 16. FIG. 16(a) is a schematic diagram of the lens mount 1001 of the imaging device 1000 seen from the subject side, and FIG. 16(b) is a schematic diagram of the mount 250 of the lens device 3000 seen from the image plane side.

Lens mount 1001 is provided on the front side (subject side) of imaging device 1000. The lens mount 1001 includes a ring-shaped mount reference surface 151 for ensuring a predetermined flange back. Inside the mount reference surface 151, bayonet claws 152a to 152c are provided at three locations in the circumferential direction.

Further, the lens mount 1001 is provided with a lock pin 153 that can be protruded from and retracted from the mount reference surface 151 for positioning when the mount of the lens device 3000 is bayonet coupled to the lens mount 1001. When the lens mount 1001 and the mount of the lens device 3000 rotate relative to each other until the mounting is completed, the lock pin 153 engages with a fitting hole provided in the mount of the lens device 3000.

Furthermore, a camera-side contact holder 154 is provided in an area inside the bayonet claws 152a to 152c. The camera-side contact holding section 154 holds electrical contacts (camera-side electrical contacts) 3001 to 3012.

The mount 250 is fixed to the rear end (image surface side) of the lens device 3000. The mount 250 includes a ring-shaped mount reference surface 251 that is a flange back reference surface. Inside the mount reference surface 251, bayonet claws 252a to 252c are provided at three locations in the circumferential direction. Further, the mount 250 is provided with a fitting hole 253. The fitting hole 253 engages with the lock pin 153 when the lens device 3000 is completely attached to the imaging device 1000.

Further, an accessory-side contact holder 254 is provided in a region inside the bayonet claws 252a to 252c. The accessory-side contact holder 254 holds electrical contacts (lens-side electrical contacts) 4001 to 4012.

Next, FIG. 17 is a block diagram showing a circuit configuration in a state where the lens device 3000 is connected to the imaging device 1000. The lens device 3000 and the imaging device 1000 can communicate via a communication path formed by some of the plurality of electrical contacts provided on the lens mount 1001 and the mount 250. The lens device 3000 and the imaging device 1000 can perform first communication, second communication, and third communication, which will be described later.

The camera control unit 101 controls the output of the electrical contacts provided on the lens mount 1001 and processes signals input to the electrical contacts, thereby communicating with the lens device 3000 attached to the imaging device 1000. Control communications.

The camera power supply unit 103 is a power supply used to operate each part of the imaging device 1000 and the lens device 3000 attached to the imaging device 1000. The camera power supply unit 103 generates a plurality of different voltages, and supplies power of each voltage to each part of the imaging device 1000 or the lens device 3000 attached to the imaging device 1000.

The power switching unit 104 supplies power to the first communication I/F (interface) unit 102a. Two power supplies having different voltage values are supplied from the power supply unit 103 to the power supply switching unit 104, and under the control of the camera control unit 101, the power supply to the first communication I/F (interface) unit 102a is switched. It is possible.

The lens control unit 201 controls the communication between the imaging device 1000 and the lens device 3000 by controlling the output of the electrical contacts provided on the mount 250 and processing signals input to the electrical contacts. Control.

The lens power supply section 203 generates a power supply of a predetermined voltage from the power supply supplied from the imaging apparatus 1000, and supplies it to the lens control section 201 and the lens side communication I/F section 202.

The electrical contacts 3001 and 4001 supply power (communication power) used mainly for controlling communication between the imaging device 1000 and the lens device 3000 from the power supply unit 103 of the imaging device 1000 to the lens device 3000. This is a terminal used for

Hereinafter, the electrical contact 3001 and the electrical contact 4001 are also referred to as the VDD terminal 3001 and the VDD terminal 4001. In this embodiment, the voltage of power supplied to the lens device 3000 by the VDD terminal 3001 (hereinafter referred to as VDD voltage) is 5.0V.

An electrical contact (a first camera-side electrical contact; also referred to as a first electrical contact) 3002 and an electrical contact 4002 transmit power (driving power) mainly used for operating a drive system such as a motor from the imaging device 1000 to the lens device 3000. This is the terminal used to supply the Hereinafter, the electrical contact 3002 and the electrical contact 4002 are also referred to as the VBAT terminal 3002 and the VBAT terminal 4002.

In this embodiment, the voltage of the power supplied to the lens device 3000 by the VBAT terminal 3002 (hereinafter referred to as the VBAT voltage) is 4.5V. The VBAT voltage corresponds to the third voltage. Further, the VDD terminal and the VBAT terminal are collectively referred to as power supply system terminals.

The electrical contact 3012 and the electrical contact 4012 are terminals that connect the communication control system circuits of the imaging device 1000 and the lens device 3000 to the ground (ground level). In other words, it is a ground terminal corresponding to the VDD terminal. Hereinafter, the electrical contact 3012 and the electrical contact 4012 are also referred to as the DGND terminal 3012 and the DGND terminal 4012.

The electrical contact (second camera side electrical contact; also referred to as second electrical contact) 3004 and the electrical contact 4004 ground (ground level) the drive system circuit including the motor etc. provided in the imaging device 1000 and the lens device 3000. This is a terminal for connecting to. In other words, it is a ground terminal corresponding to the VBAT terminal. Hereinafter, the electrical contact 3004 and the electrical contact 4004 are also referred to as the PGND terminal 3004 and the PGND terminal 4004. Further, the DGND terminal and the PGND terminal are also collectively referred to as a ground terminal.

The electrical contact 3005 and the electrical contact 4005 are terminals for detecting that the lens device 3000 is attached to the imaging device 1000. Camera control unit 101 detects attachment/detachment of lens device 3000 to imaging device 1000 according to the voltage level of electrical contact 3005 . When the camera control unit 101 detects that the lens device 3000 is attached, it starts supplying power to the lens device 3000 via the VDD terminal 3001 and the VBAT terminal 3002. Hereinafter, the electrical contact 3005 and the electrical contact 4005 are also referred to as the MIF terminal 3005 and the MIF terminal 4005.

An electrical contact (a third camera-side electrical contact; also referred to as a third electrical contact) 3003 and an electrical contact (a first lens-side electrical contact; also referred to as a fourth electrical contact) 4003 are attached to the imaging device 1000. This is a terminal for determining the type of lens device 3000. The electrical contact 3003 is pulled up to the same voltage as the power supply supplied to the camera control unit 101 in the imaging apparatus 1000 via a resistor (first resistor) 125 .

Furthermore, the electrical contact 4003 is pulled down to ground (DGND) via the resistor 222 within the lens device 3000. The resistor 222 has a resistance value commonly determined for lens devices 3000 of the same type as the lens device 3000. Therefore, by connecting the electrical contact 4003 to the electrical contact 3003, the voltage of the electrical contact 3003 can be changed to a voltage corresponding to the type of the lens device 3000.

Camera control unit 101 detects the voltage value of electrical contact 3003, and determines the type of lens device 3000 attached to imaging device 1000 based on the detected voltage value. The camera control unit 101 also controls the power switching unit 104 to supply power to the first communication I/F unit 102a by the power switching unit 104 according to the type of the lens device 3000 attached to the imaging device 1000. Switch. Thereby, the imaging device 1000 and the lens device 3000 attached to the imaging device 1000 can communicate with each other at an appropriate communication voltage. Hereinafter, the electrical contact 3003 and the electrical contact 4003 are also referred to as the TYPE terminal 3003 and the TYPE terminal 4003.

Electrical contacts 3006 to 3008 and electrical contacts 4006 to 4008 are terminals used for first communication, which will be described later. Input and output of the electrical contacts 3006 to 3008 are controlled by the camera control unit 101 via the first communication I/F unit 102a. Input and output of the electrical contacts 4006 to 4008 are controlled by the lens control unit 201 via the lens side communication I/F unit 202.

The electrical contact 3008 and the electrical contact 4008 are terminals that can output a clock signal used for first communication from the imaging device 1000 to the lens device 3000. Furthermore, the electrical contacts 3008 and 4008 are also used by the lens device 3000 to notify the imaging device 1000 of a communication standby request. Hereinafter, the electrical contact 3008 and the electrical contact 4008 are also referred to as the LCLK terminal 3008 and the LCLK terminal 4008.

The LCLK terminal 3008 is pulled up to the same potential as the interface voltage of the first communication I/F section 102a through the resistor 120 in the imaging apparatus 1000. Further, the LCLK terminal 4008 is pulled up to the same potential as the interface voltage of the lens-side communication I/F unit 202 within the lens device 3000 via a resistor 220.

The electrical contact 3006 and the electrical contact 4006 are terminals that can transmit data from the imaging device 1000 to the lens device 3000 through first communication. Hereinafter, the electrical contact 3006 and the electrical contact 4006 are also referred to as the DCL terminal 3006 and the DCL terminal 4006. The DCL terminal 4006 is pulled up to the same potential as the interface voltage of the lens-side communication I/F unit 202 through the resistor 221 within the lens device 3000.

Electrical contact 3007 and electrical contact 4007 are terminals that can transmit data from lens device 3000 to imaging device 1000 through first communication. Hereinafter, the electrical contact 3007 and the electrical contact 4007 are also referred to as the DLC terminal 3007 and the DLC terminal 4007. The DLC terminal 3007 is pulled up to the same potential as the interface voltage of the first communication I/F unit 102a through the resistor 121 in the imaging device 1000.

Below, the LCLK terminal 3008, DCL terminal 3006, and DLC terminal 3007 used for first communication are also referred to as a first camera-side electrical contact group. Further, the LCLK terminal 4008, the DCL terminal 4006, and the DLC terminal 4007 are also referred to as a first lens-side electrical contact group.

Electrical contact 3009 and electric contact 4009 are used for second communication described later. Electrical contact 3009 and electrical contact 4009 are terminals that can transmit data from lens device 3000 to imaging device 1000 through second communication. Hereinafter, the electrical contact 3009 and the electrical contact 4009 are also referred to as the DLC2 terminal 3009 and the DLC2 terminal 4009. The DLC2 terminal 3009 is pulled down to the same potential as the DGND terminal via the resistor 122 within the imaging device 1000.

Electrical contacts 3010, 3011 and electrical contacts 4010, 4011 are terminals used for third communication, which will be described later.

The electrical contact 3010 and the electrical contact 4010 are terminals that can bidirectionally transmit and receive data between the imaging device 1000 and the lens device 3000 through third communication. Hereinafter, the electrical contacts 3010 and 4010 are also referred to as DCA terminals 3010 and DCA terminals 4010. The DCA terminal 3010 is pulled up to the same potential as the interface voltage of the second and third communication I/F sections 102b within the imaging apparatus 1000 via the resistor 124.

Further, the DCA terminal 3010 is connected to the camera control unit 101 via a CMOS type input/output interface. Similarly, the DCA terminal 4010 is connected to the lens control section 201 via a CMOS type input/output interface. Thereby, the camera control unit 101 and the lens control unit 201 can transmit and receive data at high speed using the DCA terminals 3010 and 4010.

The electrical contact 3011 and the electrical contact 4011 are terminals used to notify a predetermined timing related to third communication between the imaging device 1000 and the lens device 3000, which will be described later. Hereinafter, the electrical contact 3011 and the electrical contact 4011 are also referred to as the CS terminal 3011 and the CS terminal 4011. The CS terminal 3011 is pulled up to the same potential as the interface voltage of the second and third communication I/F sections 102b within the imaging apparatus 1000 via a resistor 123. Further, the CS terminal 4011 is pulled up to the same potential as the interface voltage of the lens side communication I/F unit 202 within the lens device 3000 via the resistor 224.

Further, the CS terminal 3011 is connected to the camera control unit 101 via an open type output interface. Similarly, the CS terminal 4011 is connected to the lens control unit 201 via an open type output interface. Here, the open type output interface refers to an open drain or open collector output interface.

In this embodiment, when the lens device 3000 is attached to the imaging device 1000, the interface voltage of the first communication I/F section 102a and the second and third communication I/F sections 102b is 3.0V (the first voltage). Further, the interface voltage of the lens-side communication I/F section 202 is set to 3.0V (first voltage). Hereinafter, the LCLK terminal, DCL terminal, DLC terminal, DLC2 terminal, CS terminal, and DCA terminal will be collectively referred to as communication terminals.

Next, communication performed between the lens device 3000 attached to the imaging device 1000 and the imaging device 1000 will be described.

First, the first communication will be explained. The first communication is one type of communication performed between the imaging device 1000 and the lens device 3000 attached to the imaging device 1000. The first communication is performed using the LCLK terminal, DCL terminal, and DLC terminal. Further, the first communication is performed using a clock synchronous communication method. Note that the first communication may be performed using an asynchronous communication method. In that case, the LCLK terminal is used as a terminal for notifying the lens device 3000 from the imaging device 1000 of a data transmission request.

The imaging device 1000 transmits a control command for controlling the lens device 3000 to the lens device 3000 through the first communication. The control command includes a command for driving a driving section (not shown) of the lens device 3000. Note that the drive unit of the lens device 3000 can be exemplified by a focus lens, a zoom lens, and an aperture blade.

Lens device 3000, which has received the control command transmitted through the first communication, performs an operation according to the command. Further, in response to the control command, the lens device 3000 transmits information regarding its own state (state information) to the imaging device 1000 through the first communication. The information regarding the state mentioned here includes information regarding the position, focal length, and aperture value of the focus lens.

As described above, the first communication is communication mainly used to control the lens device 3000.

Next, the second communication will be explained. The second communication is one type of communication performed between the imaging device 1000 and the lens device 3000 attached to the imaging device 1000, and is asynchronous communication performed using the DLC2 terminals 3009 and 4009. .

In the second communication, the lens device 3000 serves as a communication master and transmits optical data such as the position of the focus lens, the position of the zoom lens, the aperture value, and the state of the anti-shake lens in the lens device 3000 to the imaging device 1000. The type and order of data that the lens device 3000 transmits to the imaging device 1000 in the second communication is specified by the imaging device 1000 in the first communication.

Here, the flow of the second communication will be explained using FIG. 18. The flowchart in FIG. 18 starts from the timing when imaging control is started. Note that S in the flowchart represents a step.

In S1401, the imaging apparatus 1000 transmits a start request requesting to start the second communication to the lens apparatus 3000 using the first communication. The start request transmitted in S1401 includes a registration communication command in which the type of data that the imaging apparatus 1000 wants to receive from the lens device 3000 in the second communication and the order of data reception are registered in advance.

In S1411, the lens device 3000 receives a start request from the imaging device 1000. In S1412, the lens device 3000 generates data of the type specified by the registration communication command included in the start request in the specified order.

In S1413, the lens device 3000 transmits the data generated in S1412 to the imaging device 1000 through second communication. That is, the lens device 3000 transmits the data generated in S1412 to the imaging device 1000 using the DLC2 terminal 4009.

The imaging device 1000 receives data transmitted from the lens device 3000 through the second communication in S1402.

When the imaging control is started again after S1402 or S1413, the control shown in FIG. 18 is started again.

In this way, a request to start the second communication is made by the first communication, and data transmission from the lens device 3000 to the imaging device 1000 by the second communication is carried out using the DLC2 terminal 4009. Therefore, by providing the DLC2 terminal 4009 separately from the electrical contact used for the first communication and performing the second communication, the communication from the lens device 3000 can be performed without interfering with other communications that need to be performed in the first communication. Optical data can be transmitted to the imaging device 1000.

Note that since the request to start the second communication is made by the first communication, the second communication cannot be performed if the first communication is not established.

<Configuration of front protrusion>
The upper protrusion 1100 and lower protrusion 1101 provided on the front surface of the imaging device 1000 will be described using FIGS. 1, 2, and 5 to 7. FIG. 5 is a right side view of the imaging device 1000 with the lens device attached. Further, FIG. 6 is a top view of the imaging device 1000. Further, FIG. 7 is an enlarged view of the electrical contact 1043 in FIG. 6.

As shown in FIGS. 1 and 5, an upper protrusion 1100 and a lower protrusion 1101 are provided to sandwich the lens mount 1001 in the vertical direction of the imaging device 1000. Further, the upper protrusion 1100 and the lower protrusion 1101 protrude from the mount surface 1001a in the optical axis 1706 direction (+Z direction).

As shown in FIG. 5, the upper protrusion 1100 is provided continuously from the upper surface (upper plane) of the imaging device 1000, and has an upper surface (upper plane) 1707 that is substantially parallel to the optical axis 1706. There is. Similarly, the lower protrusion 1101 is provided continuously from the lower surface (lower plane) of the imaging device 1000 and has a lower surface (lower plane) 1708 that is substantially parallel to the optical axis 1706 .

In this way, the upper surface 1707 of the upper protrusion 1100 and the lower surface 1708 of the lower protrusion 1101 are each substantially parallel to the optical axis 1706. This makes it possible to improve balance by making contact with the ground over a wider area for each protrusion. Moreover, it is possible to stably perform not only stationary shooting in which the imaging device 1000 is placed on the ground, etc. with its top surface facing down, but also stationary shooting in which the imaging device 1000 is placed on the ground, etc. with its top surface facing down. can.

Further, by providing the upper protrusion 1100 and the lower protrusion 1101, it is possible to place the imaging apparatus 1000 on the ground or the like with the mount surface 1001a facing down while the lens device 3000 is removed from the imaging apparatus 1000. Also, the mounting surface 1001a can be protected. That is, it is possible to prevent the mount surface 1001a from coming into contact with the ground or the like.

Further, the amount of protrusion D1 of the upper protrusion 1100 in the Z direction and the amount of protrusion D2 of the lower protrusion 1101 in the Z direction are approximately the same. By making the protrusion amounts approximately the same in this way, when the lens device 3000 is attached to the imaging device 1000 and placed on the ground etc. with the bottom surface of the imaging device 1000 facing down, the weight of the lens device 3000 is reduced. The imaging device 1000 can be prevented from falling forward. Furthermore, even when the imaging device 1000 is placed on the ground or the like with its top surface facing down, the imaging device 1000 can be prevented from falling forward due to the weight of the lens device 3000.

Further, as shown in FIG. 5, the upper protrusion 1100 has an inclined part 1704, and the inclined part 1704 is such that the thickness of the upper protrusion 1100 in the vertical direction (±Y direction) is greater than the thickness in the front direction (+Z direction) of the imaging device 1000. It is formed so that it becomes thinner in the direction of That is, the inclined portion 1704 is inclined in a direction (+Y direction) away from the optical axis 1706 toward the front direction (+Z direction) of the imaging device 1000.

Similarly, the lower protrusion 1101 has an inclined part 1705, and the inclined part 1705 has a thickness such that the thickness of the lower protrusion 1101 in the vertical direction (±Y direction) is toward the front direction (+Z direction) of the imaging device 1000. It is formed to be thinner and thinner. That is, the inclined portion 1705 is inclined in a direction (-Y direction) away from the optical axis 1706 toward the front direction (+Z direction) of the imaging device 1000.

As described above, by setting the vertical thickness of the upper protruding part 1100 and the lower protruding part 1101, the mechanical strength of the upper protruding part 1100 and the lower protruding part 1101 is increased within the area that does not interfere with the lens device 3000. can be increased.

As shown in FIGS. 1 and 2, on the upper surface 1707 of the upper protrusion 1100, female tripod screws 1700a to 1700d and electrical contacts are provided, respectively, so that male screws of external accessories can be inserted in a direction approximately parallel to the Y axis. 1043 is provided. Further, on the side surfaces of the upper protrusion 1100 (the first right side cover surface 1015a and the first left side cover surface 1030a), a tripod is provided so that a male screw of an external accessory can be inserted in a direction substantially parallel to the X axis. It has female threads 1700e and 1700g.

Further, male screws of external accessories are provided on the side surfaces of the lower protrusion 1101 (the first surface of the right side cover 1015a and the first surface of the left side cover 1030a) so that they can be inserted in a direction substantially parallel to the X axis. It has tripod female screws 1700f and 1700h. Various external accessories as described above can be attached to these tripod female screws 1700a to 1700h.

In other words, the tripod female screws 1700a to 1700h and the electrical contact 1043 are installed in the image pickup device 1000 without increasing the outermost dimensions when the lens device 3000 is attached to the image pickup device 1000 as shown in FIG. can do. Here, the outermost dimensions include the outermost dimension L in the front-back direction (length direction), the outermost dimension H in the vertical direction (height direction), and the outermost dimension H in the left-right direction (width direction) of the imaging device 1000 as shown in FIG. The outermost dimension W of is included.

Furthermore, when the male screw provided on the first external accessory (not shown) is attached by engaging with the female tripod screw 1700a, 1700b, the electrical contact portion of the first external accessory is It is electrically connected to contact group 1701 and contact group 1702.

On the other hand, when the male screw of a second external accessory (not shown) is attached by engaging with the female tripod screw 1700c, 1700d, the electric contact part of the second external accessory is connected to the contact group 1702 of the electric contacts 1043. and electrically connected to the contact group 1703.

In this way, the contact group 1702 is used as a common contact when attaching the first external accessory and when attaching the second external accessory. That is, compared to the case where a dedicated contact group is provided for each of the first external accessory and the second external accessory, the area for providing the tripod female screws 1700a to 1700d and the electrical contact 1043 is made smaller in the optical axis direction. can do.

Note that the present invention is not limited to the configuration described above. That is, the present invention is not limited to a configuration in which an upper protrusion extends from the upper surface of the imaging device to the front side in the optical axis direction, and a lower protrusion extends from the lower surface of the imaging device to the front side in the optical axis direction.

For example, in addition to the upper protrusion 1100 and the lower protrusion 1101, there is also a left protrusion extending from the left side of the imaging device 1000 toward the front in the optical axis direction, and a left protrusion extending from the right side of the imaging device 100 toward the front in the optical axis direction. An extending right side protrusion may also be provided. In that case, the length of the upper protrusion 1100 and the lower protrusion 1101 in the X direction (the left-right direction of the imaging device 1000) may be shorter than that of this embodiment described above. Further, a configuration may be adopted in which only the right side protrusion and the left side protrusion are provided without providing the upper side protrusion or the lower side protrusion. Furthermore, a configuration may be adopted in which two or more protrusions are provided among the upper protrusion, the lower protrusion, the left protrusion, and the right protrusion.

<Configuration of side protrusion>
The detailed configuration of the left side cover protrusion 1031 and the right side cover protrusion 1016 will be described using FIGS. 8 to 10. FIG. 8 is a right side view of the imaging device 1000. FIG. 9 is a cross-sectional view of the imaging device 1000, and is a cross-sectional view taken along the line AA in FIG. Further, FIG. 10 is a diagram showing a state in which the imaging device 1000 is placed with its right side facing downward.

As shown in FIG. 9, inside the imaging device 1000, an imaging device board 1302 to which the imaging device 1006 is soldered, a main board 1401, and a card board 1502 are arranged in this order perpendicular to the optical axis. A ventilation duct unit 1406 formed by a heat sink 1402 and a heat sink 1403 is arranged between the main board 1401 and an image sensor holding plate 1303 that is arranged on the rear side of the image sensor board 1302 and holds the image sensor 1006. Ru.

An intake section 1407 of the ventilation duct unit 1406 in which the fan 1404 is arranged is connected to the intake port 1032 of the imaging device 1000, and an exhaust section 1408 of the ventilation duct unit 1406 is connected to the exhaust port 1017 of the imaging device 1000. Cold air is sucked in from the intake port 1032 by the rotation of the fan 1404, and the air flows in the direction of arrow B along the radiation fins 1405 (see FIG. 3) in the ventilation duct unit 1406, and the hot air is heat-exchanged inside. is discharged from the exhaust port 1017.

The left side cover protrusion 1031 is arranged at a position that projects from the left side cover first surface 1030a, which is the main surface of the left side cover 1030, by a height H1. Further, the right side cover protruding portion 1016 is arranged at a position that projects from the right side cover first surface 1015a, which is the main surface of the right side cover 1015, by a height H2.

An intake port 1032 is formed in the left side cover protrusion 1031, and an exhaust port 1017 is formed in the right side cover protrusion 1016. In other words, the intake port 1032 is located at a position that projects from the first surface 1030a of the left side cover by a height H1, and the exhaust port 1017 is located at a position where it projects from the first surface 1015a of the right side cover by a height H2. be done.

With this arrangement, when the imaging device 1000 is placed on the ground, etc. with the left side face down, the ridgeline of the left side cover protrusion 1031 and the ridgeline of the left side cover first surface 1030a will touch the ground etc. come into contact with Further, when the imaging device 1000 is placed on the ground or the like with the right side facing downward, the ridgeline of the right side cover protrusion 1016 and the ridgeline of the surface of the right side cover first surface 1015a come into contact with the ground or the like. Therefore, the intake port 1032 and the exhaust port 1017 are not blocked by the ground or the like, making it possible to prevent breakdowns due to an increase in internal temperature due to a decrease in the heat exhaust efficiency of the imaging device 1000.

Further, a dashed-dotted line C shown in FIG. 9 indicates the center position of the intake port 1032 and the exhaust port 1017 in the front-back direction, and a dash-double-dotted line G shows the center of gravity of the imaging device 1000 in the front-back direction. The center positions of the intake port and the exhaust port in the front-rear direction (optical axis direction) of the imaging device 1000 are located a distance L1 from the center of gravity of the imaging device 1000 in the front-rear direction.

Note that the dashed line C and the dashed double dotted line G are perpendicular to the optical axis. That is, in the front-rear direction of the imaging device 1000, the intake port 1032 and the exhaust port 1017 are arranged at the same position on the left and right sides. Therefore, the air flow in the ventilation duct unit 1406 is in a straight line, and there is no decrease in ventilation resistance, so that the heat exhaust efficiency is not lowered.

As described above, by shifting the center positions of the intake port and the exhaust port in the front-rear direction of the imaging device 1000 from the center of gravity in the front-rear direction of the imaging device 1000, the intake port 1032 and the exhaust port 1017 are You can definitely prevent it from getting blocked.

As shown in FIG. 9, a first internal space 1033 is formed inside the left side cover protrusion 1031, and a fan 1404 is installed in the first internal space 1033 on the outside of the left side cover first surface 1030a. placed prominently.

Similarly, a second internal space 1018 is formed inside the right side cover protrusion 1016, and in the second internal space 1018, the heat sink 1402 and the heat sink 1403 of the ventilation duct unit 1406 are placed on the first surface of the right side cover. It is arranged to protrude outward from 1015a.

In this way, by arranging the heat dissipation structural components in the first internal space 1033 and the second internal space 1018 formed by the protrusions of the left side cover protrusion 1031 and the right side cover protrusion 1016, the area of the heat dissipation part can be reduced. It becomes possible to expand the heat dissipation efficiency and improve the heat dissipation efficiency.

Further, by making only the left side cover protrusion 1031 and the right side cover protrusion 1016 the areas that protrude outside the main body, the protruding external shape of the imaging device 1000 can be minimized, which contributes to miniaturization of the imaging device 1000. can contribute.

Note that the first internal space 1033 and the second internal space 1018 formed by the protrusions of the left side cover protrusion 1031 and the right side cover protrusion 1016 are provided in order to seal the ventilation duct unit 1406 and the exterior with more gaps. A sealing member may be provided. Alternatively, a dust filter or the like may be provided to prevent dust from being sucked into the ventilation duct unit 1406.

Further, as shown in FIGS. 1 and 8, a REC button 1010 and a microphone section 1012 are arranged near the exhaust port 1017 of the right side cover protrusion 1016 of the imaging device 1000. Since the exhaust port 1017 protrudes from the right side cover first surface 1015a by a height H2, the REC button 1010 and the microphone section 1012 are arranged at a position lower than the exhaust port 1017 by a height H2.

Therefore, even when the imaging device 1000 is placed on the ground or the like with its right side facing down as shown in FIG. 10, it is possible to reliably record audio without blocking the microphone section 1012. Further, even when the imaging device 1000 is placed on the ground or the like with the right side facing down, it is possible to prevent erroneous operation during installation due to the REC button 1010 coming into contact with the ground. Note that a speaker may be provided in place of the microphone section 1012, and other various operation switches may be provided in place of the REC button 1010.

(Second embodiment)
A second embodiment of the present invention will be described below with reference to FIGS. 11 to 14. FIG. 11 is a front perspective view of an imaging device according to a second embodiment of the present invention, and FIG. 12 is a rear perspective view of the imaging device. Further, FIG. 14 is a diagram showing a state in which the imaging device 2000 is placed with its right side facing downward. The difference between the imaging device 2000 in this embodiment and the imaging device 1000 described in FIGS. 1 and 2 is that the imaging device has second protrusions on the left and right sides, and other than that, they have the same configuration. Detailed explanation will be omitted.

As shown in FIGS. 11 and 12, the left side cover 2030 of the imaging device 2000 includes a left side cover protrusion 2031 that protrudes beyond the left side cover first surface 2030a, which is a main surface, and a second left side cover protrusion. 2033. A plurality of intake ports 2032 are formed in the left side cover protrusion 2031 for sucking low-temperature air into the imaging device 2000 from the outside by driving a fan 1404 (FIG. 4) arranged inside the imaging device 2000. There is.

The right side cover 2015 of the imaging device 2000 has a right side cover protrusion 2016 that protrudes beyond the right side cover first surface 2015a, which is a main surface, and a second right side cover protrusion 2019. A plurality of exhaust ports 2017 are formed in the right side cover protrusion 2016 for discharging hot air generated inside the imaging device 2000 to the outside by driving a fan 1404 (FIG. 4) arranged inside the imaging device 2000. ing.

FIG. 13 is a top view of the imaging device 2000. The left side cover protruding portion 2031 is arranged at a position that projects from the left side cover first surface 2030a, which is the main surface of the left side cover 2030, by a height H1. Further, the right side cover protrusion 2016 is arranged at a position that projects from the right side cover first surface 2015a, which is the main surface of the right side cover 2015, by a height H2.

An intake port 2032 is formed in the left side cover protrusion 2031, and an exhaust port 2017 is formed in the right side cover protrusion 2016. In other words, the intake port 2032 is located at a position that projects from the left side cover first surface 2030a by a height H1, and the exhaust port 2017 is located at a position where it projects from the right side cover first surface 2015a by a height H2. be done.

Further, the second left side cover protrusion 2033 is arranged at a position that projects from the left side cover first surface 2030a by a height H3. The second right side cover protrusion 2019 is arranged at a position that projects from the right side cover first surface 2015a by a height H4.

The protrusion height H3 of the second left side cover protrusion 2033 is different from the protrusion height H1 of the left side cover protrusion 2031. The protrusion height H4 of the second right side cover protrusion 2019 is different from the protrusion height H2 of the right side cover protrusion 2016. In this embodiment, the height H3 is lower than the height H1, and the height H4 is lower than the height H2. Note that the height H3 may be higher than the height H1, and the height H4 may be higher than the height H2.

As shown in FIG. 14, even when the imaging device 2000 is placed on the ground, etc. with its right side face down, the ridgeline of the right side cover protrusion 2016 and the ridgeline of the second right side cover protrusion 2019 will not touch the ground etc. come into contact with Further, even when the imaging device 2000 is placed on the ground or the like with the left side facing downward, the ridgeline of the left side cover protrusion 2031 and the ridgeline of the second left side cover protrusion 2033 contact the ground or the like. Therefore, the intake port 2032 and the exhaust port 2017 are not blocked by coming into contact with the ground or the like, making it possible to prevent failure due to an increase in internal temperature due to a decrease in the heat exhaust efficiency of the imaging device 2000.

An antenna for wireless LAN such as Wi-Fi (registered trademark) may be placed inside the second right cover protrusion 2019 shown in FIG. 11 or the second left cover protrusion 2033 shown in FIG. 12. In that case, the second right cover protrusion 2019 and the second left cover protrusion 2033 are made of a resin material (such as polycarbonate resin) that does not shield electromagnetic waves. Furthermore, the second left cover protrusion 2033 protrudes beyond the first left cover surface 2030a, and is arranged to improve communication performance because electromagnetic waves are not shielded around the antenna.

Furthermore, as another embodiment, as shown in FIG. It may also be configured to attach a wireless LAN antenna.

FIG. 20 is a diagram showing a state in which the antenna 2033b is attached to the antenna attachment connector 2033a provided on the top side of the second left cover protrusion 2033. Further, FIG. 21 is a diagram showing a state in which the antenna 2033c is attached to the antenna attachment connector 2033a provided on the bottom side of the second left cover protrusion 2033. Further, FIG. 22 is a diagram showing a state in which two antennas 2033b and 2033c are attached to antenna attachment connectors 2033a provided on the top and bottom sides of the second left cover protrusion 2033.

As shown in FIGS. 20 to 22, when the antennas 2033b and 2033c are attached to the connector 2033a, they can be bent at any angle within a maximum of 180 degrees vertically and horizontally, allowing the antennas to be oriented freely. can be changed to Further, when antennas are attached to both the top side and the bottom side, the communication performance of the antennas can be improved by changing the directions of the antennas, and communication with high reception sensitivity can be performed.

Although the present invention has been described above in detail based on its preferred embodiments, the present invention is not limited to these specific embodiments, and the present invention may take various forms without departing from the gist of the present invention. included.

1000 Imaging device 1016 Right side cover protrusion 1017 Exhaust port 1031 Left side cover protrusion 1032 Inlet port 1100 Upper protrusion 1101 Lower protrusion 1402 Heat sink 1404 Fan 2000 Imaging device

Claims (21)

A mount that is provided on the front of the device body and allows the lens device to be attached and detached;
a first protrusion and a second protrusion provided on a first side surface of the device main body;
an intake port formed in the first protrusion;
an exhaust port formed on a second side surface of the device main body, which is different from the first side surface;
a duct unit for discharging air taken in from the intake port from the exhaust port;
a connector for attaching a wireless LAN antenna provided on the second protrusion;
An imaging device comprising: The imaging device according to claim 1, wherein the second protrusion has a different height from the first protrusion. 3. The imaging device according to claim 1, wherein the connector is provided on at least one of a top surface side and a bottom surface side of the second protrusion. A mount that is provided on the front of the device body and allows the lens device to be attached and detached;
a first protrusion provided on a first side surface of the device main body ;
a second protrusion provided on a second side surface of the device main body, which is different from the first side surface;
an intake port formed on the first side surface;
a connector for attaching a wireless LAN antenna provided on the first protrusion;
an exhaust port formed in the second protrusion;
a duct unit for discharging air taken in from the intake port from the exhaust port;
An imaging device comprising: The imaging device according to claim 4, wherein the connector is provided on at least one of a top surface side and a bottom surface side of the first protrusion. The imaging device according to any one of claims 1 to 5, wherein the first side surface and the second side surface are opposing side surfaces of the device main body. The imaging device according to any one of claims 1 to 6, wherein a display section and operation keys are provided on the top surface of the device main body. 8. The imaging device according to claim 1, wherein the rear surface of the device main body is provided with a battery attachment portion to which a battery is attached and an external input/output terminal. The imaging device according to any one of claims 1 to 8, wherein a tripod screw portion for fixing the device main body to a tripod or the like is provided on a lower surface of the device main body. The imaging device according to any one of claims 1 to 9, wherein the center position of the inlet port and the exhaust port in the front-rear direction of the apparatus main body is shifted from the center of gravity position of the apparatus main body in the front-rear direction. Device. The imaging device according to any one of claims 1 to 10, wherein a fan for forced air cooling is arranged inside the intake port. 12. The apparatus according to any one of claims 1 to 11, wherein an image pickup element is provided inside the front side of the apparatus main body to convert an optical image of a subject obtained by the lens apparatus into an electrical signal. The imaging device described. The imaging device according to claim 12, wherein the imaging element includes a plurality of phase difference detection pixels. The imaging device according to claim 12 or 13, wherein a flange back, which is a distance from a mounting surface of the mount to an imaging surface of the imaging element, is 20 mm or less, and an inner diameter of the mount is 45 mm or more. The imaging device according to claim 14, wherein the mount includes a ring-shaped mount reference surface and bayonet claws provided at three locations inside the mount reference surface. 16. The imaging device according to claim 15, wherein a camera-side contact portion for communicating with the lens device is provided in a region inside the three bayonet claws. 17. The imaging device according to claim 16, wherein the camera-side contact portion includes a 12-pin electrical contact. A power supply is provided at both ends of the 12-pin electrical contact for supplying power from the power supply section of the imaging device to the lens device, which is used for communication control between the imaging device and the lens device. 18. The imaging device according to claim 17, further comprising a terminal and a grounding terminal for connecting a communication control system circuit of the imaging device and the lens device to ground. The imaging device according to claim 18, wherein the voltage of the power supplied to the lens device by the power supply terminal is set to 5.0V. The imaging device according to any one of claims 1 to 19, wherein the duct unit includes a plurality of heat radiation fins therein. Furthermore, an image sensor substrate on which an image sensor is mounted,
a main board on which a video signal processing unit for generating video data based on the video signal output from the image sensor is mounted;
The image sensor board is arranged closer to the front side of the apparatus main body than the duct unit,
21. The imaging device according to claim 20, wherein the main board is disposed closer to the rear surface of the device main body than the duct unit.

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