JP7451126B2 - Substrate processing equipment and substrate processing method - Google Patents

Description

Embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method.

In recent years, there has been a demand for further thinning and cost reduction of semiconductor devices. Therefore, semiconductor devices have been manufactured all at once on a substrate that supports the semiconductor devices. For example, a semiconductor wafer or a glass substrate for liquid crystal panels is used as a substrate (supporting substrate) that supports a semiconductor device, and various processes such as wiring formation, chip mounting, and mold sealing are performed on the adhesive layer of the supporting substrate. Then, a semiconductor device is formed on the adhesive layer. Thereafter, the supporting substrate is peeled off from the formed semiconductor device. In the step of peeling off the support substrate, for example, the adhesive layer between the semiconductor device and the support substrate is deteriorated by laser irradiation, and the support substrate is peeled off from the semiconductor device.

Prior to the peeling process, a dicing tape, which is an adhesive tape, is applied to the surface of the semiconductor device opposite to the support substrate in order to finally separate the semiconductor device into individual chips. A ring for carrying and supporting the dicing tape is attached to the dicing tape so as to surround the support substrate and semiconductor device on the dicing tape. Therefore, the central region of the adhesive surface (surface with adhesive properties) of the dicing tape is covered by the support substrate and the semiconductor device, and the outer edge region of the adhesive surface of the dicing tape is covered by the annular ring. An annular region between the central region and the outer edge region of the adhesive surface of the dicing tape (the adhesive surface of the dicing tape between the semiconductor device and the ring) is exposed.

After the supporting substrate is peeled off from the semiconductor device in the peeling process, only the semiconductor device remains stuck on the dicing tape. Furthermore, since the semiconductor devices are formed on the support substrate, the semiconductor devices formed all at once have the same external shape as the support substrate. That is, when a semiconductor wafer is used as a support substrate, the external shape of the semiconductor device becomes a disk shape similar to the semiconductor wafer. Hereinafter, a semiconductor device formed in a disk shape will be described as an example. Further, a semiconductor device is simply referred to as a device (or substrate).

When the supporting substrate is peeled off from the device, the adhesive layer (eg, carbon) remains on the device. Therefore, it becomes necessary to remove the remaining adhesive from the device. In the adhesive removal step, for example, the ring is held down from above using a plurality of chuck pins (fixing members) to fix the device together with the ring and dicing tape on a table. Then, the device is rotated together with the dicing tape and ring in a horizontal plane with the center of the device as the center of rotation, and a cleaning liquid such as a solvent (an example of a processing liquid) is supplied near the center of the device. It is spread over the entire surface of the device (circumferential direction) and discharged from the device to remove the adhesive from the device.

The adhesive removed from the device is discharged from the device together with the cleaning liquid, but the discharged adhesive may adhere to the chuck pin or the adhesive surface of the dicing tape between the device and the ring. When the adhesive adheres, it separates from the chuck pin or dicing tape and adheres to the device (substrate) during the transportation process, dicing process, etc., contaminating the device, thereby degrading the device quality, that is, the substrate quality.

Patent No. 6004100

The problem to be solved by the present invention is to provide a substrate processing apparatus and a substrate processing method that can improve substrate quality.

The substrate processing apparatus according to the embodiment of the present invention includes:
a table that supports a processing object, the table having a substrate, a ring surrounding the substrate, and a dicing tape that adheres to a lower surface of the substrate and a lower surface of the ring;
a plurality of chuck pins that fix the object to be processed supported by the table to the table;
a processing liquid supply unit that supplies a processing liquid for processing the substrate to the processing object fixed to the table by the plurality of chuck pins;
a vibration unit that vibrates all of the plurality of chuck pins while the processing liquid is being supplied to the object to be processed by the processing liquid supply unit ;
a rotation mechanism that rotates the table within a plane;
Equipped with
The vibrating section changes the number of chuck pins to be vibrated among the plurality of chuck pins according to the rotation speed of the table rotated by the rotation mechanism .

The substrate processing method according to the embodiment of the present invention includes:
supporting on a table a processing object including a substrate, a ring surrounding the substrate, and a dicing tape that adheres to the lower surface of the substrate and the lower surface of the ring;
fixing the object to be processed supported by the table to the table with a plurality of chuck pins;
a step of rotating the table, on which the object to be processed is fixed by the plurality of chuck pins, by a rotation mechanism;
supplying a processing liquid for processing the substrate to the processing target fixed to the table by the plurality of chuck pins, by a processing liquid supply unit;
vibrating all of the plurality of chuck pins by a vibrator while the treatment liquid is being supplied to the object to be processed by the treatment liquid supply unit;
has
The vibration section changes the number of chuck pins to be vibrated among the plurality of chuck pins according to the rotation speed of the table rotated by the rotation mechanism.

According to embodiments of the present invention, substrate quality can be improved.

FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to a first embodiment. FIG. 1 is a plan view showing a part of the substrate processing apparatus according to the first embodiment. FIG. 3 is a diagram for explaining a substrate processing step according to the first embodiment. FIG. 3 is a first diagram for explaining liquid supply according to the first embodiment. FIG. 3 is a first diagram for explaining vibration of the chuck pin according to the first embodiment. FIG. 3 is a second diagram for explaining liquid supply according to the first embodiment. FIG. 7 is a third diagram for explaining liquid supply according to the first embodiment. FIG. 7 is a second diagram for explaining vibration of the chuck pin according to the first embodiment. FIG. 2 is a diagram showing a schematic configuration of a substrate processing apparatus according to a second embodiment.

<First embodiment>
A first embodiment will be described with reference to FIGS. 1 to 8.

(Basic configuration)
As shown in FIG. 1, the substrate processing apparatus 10 according to the first embodiment includes a table 20, a vibration section 30, a rotation mechanism (rotation drive section) 40, a processing liquid supply section 50, and a liquid supply section 60. and a control section 70.

As shown in FIGS. 1 and 2, the processing object W includes a substrate (for example, a device) W1, a ring W2, and a dicing tape W3. The substrate W1 is attached to the center of the dicing tape W3. The ring W2 is formed in an annular shape and is attached to the dicing tape W3 so as to surround the periphery of the substrate W1 on the dicing tape W3. Therefore, the central region of the adhesive surface of the dicing tape W3 is covered by the substrate W1, and the outer edge region of the adhesive surface of the dicing tape W3 is covered by the annular ring W2. Therefore, the annular region between the central region and the outer edge region of the adhesive surface of the dicing tape W3, that is, the upper surface of the dicing tape W3 between the substrate W1 and the ring W2 is exposed.

The table 20 includes a main body 21, a support 22, and a plurality of chuck pins 23. This table 20 is surrounded by a cup (not shown), is positioned approximately at the center of the cup, and is provided on a rotation mechanism 40 so as to be rotatable in a horizontal plane. The table 20 is called, for example, a spin table.

The main body 21 has a convex shape with a cylindrical center. The upper surface of the convex portion of the main body 21 supports the substrate W1 while facing the lower surface of the substrate W1 of the object W to be processed with the dicing tape W3 interposed therebetween. The support body 22 is formed in an annular shape and is provided on the annular flat portion of the main body 21 so as to surround the convex portion (protrusion) of the main body 21 . This support body 22 supports the ring W2 in a state where it faces the lower surface of the ring W2 of the object W to be processed with the dicing tape W3 interposed therebetween. Each chuck pin 23 is provided on the annular flat portion of the main body 21 so as to be eccentrically rotatable. These chuck pins 23 eccentrically rotate in synchronization, thereby pushing the outer peripheral surface of the ring W2 of the processing object W inward and holding the processing object W in a horizontal state. At this time, the center of the object to be processed W is positioned on the rotation axis of the table 20.

This table 20 supports the object W to be processed by a main body 21 and a support 22, and is fixed to the main body 21 and the support 22 by each chuck pin 23. The object to be processed W is supported so that it is lower than the height of the upper surface of W1 (for example, several mm lower, about 2 mm).

The vibrating section 30 includes a plurality of vibrators 31 and a plurality of covers 32. Each vibrator 31 is provided above each chuck pin 23, respectively. As these resonators 31, for example, a MEMS (microelectromechanical system) resonator, a crystal resonator, or a piezoelectric element is used. Each cover 32 is individually positioned above each chuck pin 23 , and is individually provided on each chuck pin 23 so as to cover each vibrator 31 located above each chuck pin 23 .

The rotation mechanism 40 is provided to support the table 20, and is configured to rotate the table 20 within a horizontal plane (an example of a plane). This rotation mechanism 40 has a rotation shaft 41 and a motor 42. One end of the rotating shaft 41 is connected to the lower center of the table 20, and the other end of the rotating shaft 41 is connected to the motor 42. The motor 42 rotates its rotating shaft 41. The rotation mechanism 40 rotates the table 20 in a horizontal plane via a rotation shaft 41 by driving a motor 42 .

The processing liquid supply section 50 has a nozzle 51. The processing liquid supply unit 50 positions the nozzle 51 above the center of the substrate W1 of the object W on the table 20 (for example, directly above the center of the substrate W1), and A first processing liquid (for example, a solvent such as p-menthane or cyclopentanone) and a second processing liquid (for example, IPA: isopropyl alcohol) are supplied from a nozzle 51 near the center of the substrate W1. Note that the first processing liquid is, for example, a liquid that is incompatible with DIW (ultra-pure water), and is a liquid for peeling off the adhesive remaining on the substrate W1 from the substrate W1.

The nozzle 51 is formed so as to be movable in the horizontal direction above the table 20 along the processing target W on the table 20 by, for example, a nozzle moving mechanism (not shown). As the nozzle moving mechanism, for example, a swinging mechanism having an arm, a linear guide, or the like is used. This nozzle 51 faces near the center of the object W to be processed on the table 20 and discharges the processing liquid toward the center. Two types of processing liquids are individually supplied to the nozzle 51 from two tanks (not shown) outside the substrate processing apparatus 10 . The discharge amount of the first processing liquid discharged from the nozzle 51 is changed by adjusting the opening of the regulating valve 51a, and the discharge amount of the second processing liquid discharged from the nozzle 51 is changed by adjusting the opening of the regulating valve 51b. be done.

The liquid supply section 60 has a first nozzle 61 and a second nozzle 62. This liquid supply unit 60 positions a first nozzle 61 above the upper surface of the ring W2 of the object W to be processed on the table 20 (for example, directly above the upper surface of the ring W2), and a first A liquid (for example, DIW) is supplied from the nozzle 61. Further, the liquid supply unit 60 positions the second nozzle 62 above the outer peripheral end of the substrate W1 of the processing target W on the table 20 (for example, directly above the outer peripheral surface of the substrate W1), and A liquid (eg, DIW) is supplied to the end from a second nozzle 62 . This liquid is immiscible with the first processing liquid and has a higher specific gravity than the first processing liquid (has a higher density than the first processing liquid).

The first nozzle 61 and the second nozzle 62 are each formed to be movable in the horizontal direction above the table 20 along the processing target W on the table 20 by a nozzle moving mechanism (not shown), respectively. . As the nozzle moving mechanism, for example, a swinging mechanism having an arm, a linear guide, or the like is used. The first nozzle 61 faces the upper surface of the ring W2 of the object W to be processed on the table 20, and discharges liquid toward the upper surface. The second nozzle 62 faces the outer circumferential edge of the substrate W1 of the processing target W on the table 20, and discharges liquid toward the outer circumferential edge. The horizontal separation distance between the first nozzle 61 and the second nozzle 62 is, for example, about 200 mm. Liquid is supplied to the first nozzle 61 and the second nozzle 62 from a tank (not shown) outside the substrate processing apparatus 10. The amount of liquid discharged from the first nozzle 61 is changed by adjusting the opening of the regulating valve 61a, and the amount of liquid discharged from the second nozzle 62 is changed by adjusting the opening of the regulating valve 62a. .

The control section 70 includes a microcomputer that centrally controls each section, and a storage section (both not shown) that stores substrate processing information and various programs related to substrate processing. This control unit 70 controls the processing target object holding operation by each chuck pin 23 of the table 20, the vibration operation by the vibration unit 30, the rotation operation of the table 20 by the rotation mechanism 40, and the processing liquid supply based on the substrate processing information and various programs. The processing liquid supplying operation by the section 50 and the liquid supplying operation by the liquid supplying section 60 are controlled. For example, each vibrator 31 and motor 42 are electrically connected to a control section 70, and their driving is controlled by the control section 70. Regarding each vibrator 31, for example, by using a slip ring on the rotating shaft 41 of the table 20, electrical connection between each vibrator 31 and the control unit 70 is possible even when the table 20 is rotating. It has become. Further, each of the regulating valves 51a, 51b, 61a, and 62a is, for example, a solenoid valve, and is electrically connected to the control section 70, and its driving is controlled by the control section 70.

(Substrate processing process)
Next, the flow of the substrate processing process performed by the above-mentioned substrate processing apparatus 10 will be explained. This substrate processing step is a step of removing adhesive material remaining on the substrate W1 of the object W to be processed. Note that the various numerical values listed below are merely examples.

As shown in FIG. 3, for example, steps 1 to 6 are executed continuously. A solvent (an example of a cleaning liquid) is used as the first processing liquid, IPA is used as the second processing liquid, and DIW is used as the liquid. Note that the processing object W is fixed to the table 20 by each chuck pin 23, and the table 20 is rotating during the substrate processing process. The rotation speed of the table 20 and the processing time are changed by the control unit 70. Further, the individual discharge amounts of the solvent, IPA, and DIW are changed by controlling the respective regulating valves 51a, 51b, 61a, and 62a by the control unit 70. Further, each vibrator 31 is controlled by a control section 70. For example, the individual vibration frequencies of each vibrator 31 are the same and constant.

In step 1, DIW is discharged from the first nozzle 61 and supplied to the upper surface of the ring W2 of the processing target W on the rotating table 20. In this step 1, the discharge amount of DIW discharged from the first nozzle 61 is 380 ml/min, the rotation speed (first rotation speed) of the table 20 is 20 rpm, and the processing time (discharge time) is 10 seconds. It is.

The amount of DIW to be discharged is preferably an amount that allows the upper part of the chuck pin 23 and the periphery of the chuck pin 23 to be covered with the liquid, but not an amount that is supplied onto the substrate W1. However, for example, if only the DIW is supplied from the first nozzle 61, adhesive may adhere to the chuck pin 23 even when the chuck pin 23 is coated with DIW, and the DIW coating may not be sufficient. In some cases, adhesive may adhere to the chuck pin 23. Therefore, it is necessary for each vibrator 31 to perform a vibrating operation in step 2, which will be described later. Further, the rotational speed (rotational speed) of the table 20 is set to a rotational speed that can maintain the DIW in a liquid film state. The DIW reaches the upper surface of the ring W2 of the processing target W on the rotating table 20 and spreads over the upper surface of the ring W2. At this time, the ring W2 is rotating, and the DIW supplied to the upper surface of the ring W2 spreads to the outside and inside of the ring W2. At this time, the number of rotations per unit time of the table 20, that is, the number of rotations per unit time (first number of rotations) of the ring W2 of the object to be processed W is a rotation where the centrifugal force on the upper surface of the ring W2 is weak. Therefore, the DIW ejected from the first nozzle 61 and reaching the upper surface of the ring W2 of the object W to be processed is between the substrate W1 and the ring W2 of the object W supported by the rotating table 20. It is set to flow. Further, the processing time is set to the time required to cover the space between the substrate W1 and the ring W2 using the set discharge amount of DIW. For example, the processing time is 10 seconds when the set discharge amount of DIW is 380 ml/min. The discharge amount of DIW, the rotation speed of the table 20, and the processing time are determined and set in advance through experiments and the like.

In step 1, as shown in FIG. 4, the DIW discharged from the first nozzle 61 (indicated by the cross-hatched filled area in FIG. 4) is applied to the ring W2 of the processing object W on the rotating table 20. It reaches the upper surface and spreads outside the ring W2 and inside the ring W2 (on the substrate W1 side). Therefore, the DIW that spreads inside the ring W2 flows between the substrate W1 and the ring W2 and accumulates in an annular space surrounded by the substrate W1, the ring W2, and the dicing tape W3. As a result, a DIW liquid film is formed on the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2, and a DIW liquid film is also formed on the upper surface of the ring W2.

In step 2, each vibrator 31 starts vibrating. As shown in FIG. 5, for example, four vibrators 31 among the eight chuck pins 23 vibrate (thick lines in FIG. 5 indicate vibrations). Specifically, if a pair of vibrators 31 facing each other with the center of the substrate W1 in between is defined as one set, two sets of vibrators 31 vibrate, and after a few seconds, the other two vibrate, and again after a few seconds, the other vibrator vibrate. The two sets of oscillate repeatedly. Note that ultimately all the vibrators 31 vibrate. The vibrations caused by each vibrator 31 are transmitted to each chuck pin 23 and also to the liquid film of DIW. Next, while the two sets of vibrators 31 are vibrating, in step 2 (see FIG. 3), the solvent is discharged from the nozzle 51 to the vicinity of the center of the substrate W1 of the object W to be processed on the rotating table 20. Further, DIW is discharged from the first nozzle 61 (continuing from step 1), and is supplied to the upper surface of the ring W2 of the processing target W on the rotating table 20. In this step 2, the amount of DIW discharged from the first nozzle 61 is 380 ml/min, the rotation speed (first rotation speed) of the table 20 is 20 rpm, and the processing time is 240 seconds. Note that the amount of solvent discharged from the nozzle 51 is 480 ml/min (not shown). The vibration of each vibrator 31 starts before the solvent is supplied from the nozzle 51. However, the adhesive is peeled off from the substrate W1 by the solvent that is the first processing liquid, and each vibrator 31 is driven before the peeled adhesive flows to the outer periphery of the substrate W1 (chuck pin 23). All you have to do is start it.

The rotational speed (rotational speed) of the table 20 is set at a rotational speed that can maintain the solvent in a liquid film state on the substrate W1, so that it becomes easy to cause the adhesive to react with the solvent. The processing time is set to the time required for the solvent to dissolve the laser absorption layer, which will be described later. The discharge amount of the solvent is set to a supply amount that can sufficiently dissolve the laser absorption layer within the above-described set processing time. The rotation speed of the table 20, the processing time, and the amount of solvent discharged are determined and set in advance through experiments and the like.

In step 2, as shown in FIG. 6, in a state where a DIW liquid film exists between the substrate W1 and the ring W2 and on the upper surface of the ring W2, the solvent discharged from the nozzle 51 is transferred to the rotating table 20. The object W reaches near the center of the substrate W1, and spreads over the entire upper surface of the substrate W1 due to the centrifugal force caused by the rotation of the object W. A liquid film of the solvent is formed on the upper surface of the substrate W1, and the adhesive from the substrate W1 (indicated by the thick black line on the substrate W1 in FIG. 4) is gradually melted by the solvent. Step 2 is a step for melting the adhesive on the substrate W1. The adhesive is melted and peeled off from the substrate W1. The adhesive material peeled off from the substrate W1 floats in the liquid film of the solvent on the substrate W1. Note that the adhesive on the substrate W1 will peel off first from the part where the melting progresses quickly, and will float in the liquid film of the solvent on the substrate W1.

Here, for example, the adhesive is configured such that a laser absorption layer is laminated on the substrate W1, and a laser reaction layer is laminated on the laser absorption layer on the substrate W1. The laser absorption layer on the substrate W1 side is dissolved by the solvent, and the adhesive is peeled off and removed from the substrate W1. Before the step of peeling off the support substrate, the device (substrate W1) is supported by the support substrate via the adhesive layer. This adhesive layer has a two-layer structure (laser reaction layer and laser absorption layer). At the time of separation from the supporting substrate, when laser is irradiated from the supporting substrate side, the reaction layer is destroyed by the laser beam. The laser light is absorbed by the laser absorption layer so as not to affect the device side. Once the laser-reactive layer is destroyed, the support substrate can be peeled off. The destroyed laser reaction layer and laser absorption layer, that is, the adhesive layer remains on the device side. The device is supported by the dicing tape W3 with the broken upper part of the adhesive layer (laser reaction layer) exposed on the upper surface. The solvent, which is the first treatment liquid, dissolves the laser absorption layer among these two adhesive layers and removes the laser reaction layer formed on the laser absorption layer together.

In addition, in step 2, the DIW discharged from the first nozzle 61 advances toward the upper surface of the ring W2 of the processing target W on the rotating table 20, but the DIW flows toward the upper surface of the ring W2 of the processing object W on the rotating table 20, but the DIW is It reaches the upper surface of the ring W2 and spreads outside and inside the ring W2 without being mixed. DIW is a liquid that is immiscible with solvents and has a higher specific gravity than the solvent. The DIW that spreads inside the processing object W flows between the substrate W1 and the ring W2, and accumulates in a space surrounded by the substrate W1, the ring W2, and the dicing tape W3. As a result, a DIW liquid film is maintained between the substrate W1 and the ring W2, and a DIW liquid film is also maintained around the ring W2. At this time, each set of vibrators 31 vibrates, and the vibrations caused by these vibrators 31 are transmitted to each chuck pin 23 and also to the DIW liquid film and the solvent liquid film. Note that, as described above, DIW is immiscible with the solvent and has a higher specific gravity than the solvent. Therefore, when the solvent discharged from the upper surface of the substrate W1 flows from the upper surface of the substrate W1 into the DIW formed between the substrate W1 and the ring W2, the liquid of the DIW formed between the substrate W1 and the ring W2 It will not mix with the membrane and will flow over the DIW liquid membrane (see Figure 6).

Normally, in step 2, the adhesive removed from the substrate W1 remains suspended in the liquid film of the solvent on the substrate W1. Some are emitted from In other words, a part of the adhesive floating in the solvent liquid film on the substrate W1 flows together with the solvent flowing on the DIW liquid film existing between the substrate W1 and the ring W2 and on the upper surface of the ring W2, and vibrates. The object to be processed W is discharged while avoiding the two sets of chuck pins 23 . At this time, the adhesive is discharged from the processing object W together with the solvent while the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 is covered with the DIW liquid film, so that the adhesive is removed from the substrate W1. It is possible to suppress adhesion to the adhesive surface of the dicing tape W3 between the ring W2 and the ring W2. Since the DIW covers the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2, and because the DIW is immiscible with the solvent and has a large specific gravity, the adhesive flowing together with the solvent is attached to the substrate W1 and the ring W2. The liquid flows over the DIW film during this period. Therefore, it is possible to prevent the adhesive from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2. Furthermore, by forming a DIW liquid film around the chuck pin 23, the adhesive flowing together with the solvent flows on the DIW liquid film around the chuck pin 23, thereby preventing the adhesive from adhering to the chuck pin 23. It can be suppressed.

The adhesive removed from the substrate W1 flows together with the solvent, but the waves generated by the two sets of vibrating chuck pins 23 keep it away from the two sets of vibrating chuck pins 23, and the adhesive is forced to avoid these chuck pins 23. Since the adhesive is discharged from the object W together with the solvent, it is possible to prevent the adhesive from adhering to the chuck pin 23. Note that even if the adhesive removed from the substrate W1 adheres to the chuck pin 23 that is not vibrating, when the chuck pin 23 vibrates, the adhered substance separates from the chuck pin 23 and is removed from the processing object W together with the solvent. Since the adhesive is discharged from the chuck pin 23, it is possible to prevent the adhesive from continuing to adhere to the chuck pin 23.

Further, the table 20 supports the object W to be processed at a position where the height of the top surface of the ring W2 is lower than the height of the top surface of the substrate W1. This prevents the adhesive removed from the substrate W1 from being caught and remaining on the ring W2, so that the efficiency of discharging the adhesive can be improved. Note that when the table 20 supports the object W to be processed at a position where the height of the top surface of the ring W2 is equal to or higher than the height of the top surface of the substrate W1, the adhesive removed from the substrate W1 gets caught on the ring W2 and remains. Sometimes.

In step 3, as shown in FIG. 7, each vibrator 31 sequentially vibrates one by one (bold lines in FIG. 7 indicate vibrations). Specifically, one vibrator 31 vibrates, a few seconds later, another vibrator 31 vibrates, and a few seconds later, the other vibrator 31 repeats the vibration. For example, each vibrator 31 sequentially vibrates one by one in the circumferential direction of the substrate W1 at predetermined intervals of several seconds (the reason why the vibrating operation of each vibrator 31 changes from step 2 to step S3 will be described later). ). Note that ultimately all the vibrators 31 vibrate. Next, while one vibrator 31 is vibrating, in step 3 (see FIG. 3), the solvent is discharged from the nozzle 51 (continued from step 2), and the substrate of the processing target W on the rotating table 20 is DIW is supplied to the vicinity of the center of W1, is discharged from the first nozzle 61 (continuing from step 2), is supplied to the upper surface of the ring W2 of the processing target W on the rotating table 20, and further DIW is is discharged from the nozzle 62 and supplied to the outer peripheral edge of the substrate W1 of the processing target W on the rotating table 20. In this step 3, the discharge amount of DIW discharged from the first nozzle 61 is 380 ml/min, the discharge amount of DIW discharged from the second nozzle 62 is 200 ml/min, and the rotation speed of the table 20 is (Second rotation speed) is 400 rpm, and processing time (discharge time) is 60 seconds. Note that the amount of solvent discharged from the nozzle 51 is 480 ml/min (not shown).

The discharge amount of DIW is set to a discharge amount that can cover the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 when the rotation speed of the table 20 is changed to the second rotation speed. The number of rotations (rotational speed) of the table 20 is set to a speed that allows adhesive material floating on the substrate W1 to be discharged to the outside of the substrate W1. The processing time is set to the set rotation speed of the table 20 and to the time required for all adhesive material to be discharged from the substrate W1. The discharge amount of DIW, the rotation speed of the table 20, and the processing time are determined and set in advance through experiments and the like.

In step 3, as shown in FIG. 8, a DIW liquid film continues to be formed between the substrate W1 and the ring W2 of the processing object W, and a solvent liquid film continues to be formed on the upper surface of the substrate W1. . As the rotation speed of the table 20 increases (from 20 to 400 rpm), the adhesive floating in the solvent liquid film on the processing object W is removed from the DIW liquid film existing between the substrate W1 and the ring W2 and on the upper surface of the ring W2. It flows together with the solvent flowing above, and flows down from the object W to be processed, avoiding the vibrating single chuck pin 23. Step 3 is a step for discharging from the processing object W the adhesive that was melted in Step 2 and floated in the solvent on the substrate W1.

Note that in step 3, the supply of solvent by the nozzle 51 and the supply of DIW by the first nozzle 61 are the same as in step 2 described above, but in addition, DIW is supplied by the second nozzle 62. . The DIW discharged from the second nozzle 62 reaches the outer peripheral edge of the substrate W1 of the processing target W1 on the table 20 without being mixed with the solvent flowing from the upper surface of the substrate W1, and the DIW reaches the outer peripheral edge of the substrate W1 of the processing target W1 on the table 20, and the DIW is attached to the substrate W1 and the ring. W2, and accumulates in the space surrounded by the substrate W1, ring W2, and dicing tape W3. When the rotation speed of the table 20 increases (from 20 to 400 rpm), centrifugal force acts, making it difficult for the DIW discharged from the first nozzle 61 to flow between the substrate W1 and the ring W2, and the exposed surface of the dicing tape W3 ( The liquid film formed on the adhesive surface becomes thinner. In addition, a part of the exposed surface is completely free of liquid film. However, the DIW discharged from the second nozzle 62 is supplied between the substrate W1 and the ring W2, and the thickness of the DIW liquid film (film thickness) between the substrate W1 and the ring W2 is maintained. During the supply of DIW, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 is reliably covered with a liquid film of DIW. As a result, even if the rotation speed of the table 20 is increased, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 remains covered with the DIW liquid film. As a result, the adhesive floating in the liquid film of the solvent on the substrate W1 flows together with the solvent flowing on the liquid film of DIW existing between the substrate W1 and the ring W2 and on the upper surface of the ring W2, and the object to be processed is The adhesive is discharged from the W together with the solvent. Therefore, it is possible to prevent the adhesive removed from the substrate W1 from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2.

As mentioned above, if only the first nozzle 61 supplies the liquid, the DIW liquid film becomes thin or disappears, so the second nozzle 62 further assists the liquid volume to increase the DIW. Try to maintain the formation of a liquid film. Further, the second nozzle 62 discharges DIW toward the outer peripheral edge of the substrate W1 of the processing target W, thereby creating a DIW liquid film between the substrate W1 and the ring W2, taking into consideration the influence of centrifugal force. This allows for the formation of Even if DIW is supplied from the second nozzle 62 to the upper surface of the ring W2, centrifugal force increases as the rotational speed reaches the second rotational speed, so the DIW does not flow inside the ring W2 but is discharged to the outside. Put it away. Therefore, the second nozzle 62 supplies DIW to the outer peripheral edge of the substrate W1, and the DIW flows onto the adhesive surface of the dicing tape between the substrate W1 and the ring W2, which is located outside the outer peripheral edge. A liquid film of DIW is formed there. Note that the solvent (first processing liquid) is also supplied in step 3, and the supply of the solvent is stopped in step 4.

Furthermore, in order to discharge the adhesive from the object W to be processed, the rotation speed of the table 20 is increased from step 2 (from 20 to 400 rpm). This strengthens the centrifugal force on the object W to be processed and promotes the discharge of the adhesive from the object W, improving the discharge performance for discharging the adhesive flowing together with the solvent (adhesive discharge performance). can be done. That is, in step 2, a liquid film of solvent is formed on the substrate W1, the adhesive on the substrate W1 is melted and suspended in the liquid film of solvent, and in step 3, the rotation speed of the table 20 is increased, and the adhesive material floating in the solvent is The object is discharged from above the object W to be treated together with the solvent. By increasing the rotation speed of the table 20, it is possible to improve the adhesive discharge performance. Since the adhesive discharge performance is improved in this way, it is possible to prevent the adhesive removed from the substrate W1 from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 or to each chuck pin 23. . That is, by increasing the number of rotations (rotational speed) of the substrate W1, centrifugal force is generated, and the adhesive material floating on the surface of the substrate W1 is discharged to the outside of the substrate W1 by the centrifugal force. Thereby, the adhesive can be removed from the surface of the substrate W1. Note that even when the rotational speed of the substrate W1 is increased, the supply of the solvent to the center of the substrate W1 is continued. This is to prevent the liquid film on the surface of the substrate W1 from becoming thinner due to centrifugal force and the adhesive material peeled off from the surface of the substrate W1 from adhering to the surface of the substrate W1 again. Furthermore, it also assists in the discharge performance of discharging the adhesive material from the substrate W1.

Furthermore, when the rotation speed of the table 20 increases (from 20 to 400 rpm), compared to when the rotation speed of the table 20 is low, the workpiece W on the table 20 is fixed by the chuck pins 23 to a greater degree. Force (holding force) is required. Therefore, if there is a possibility that the fixing force of each chuck pin 23 is insufficient, the number of chuck pins 23 to be vibrated out of all the chuck pins 23 is reduced as the rotation speed of the table 20 increases ( 4 → 1 piece). As a result, even if the rotation speed of the table 20 is increased, the fixing force for fixing the object W to be processed can be maintained, and the adhesive removed from the substrate W1 can be prevented from adhering to the chuck pins 23.

In step 4, each vibrator 31 stops vibrating, and only IPA is supplied from the nozzle 51 to the vicinity of the center of the substrate W1 of the processing target W on the rotating table 20. In step 4, the rotation speed of the table 20 is 400 rpm, and the processing time (discharge time) is 60 seconds. Note that the amount of IPA supplied from the nozzle 51 is 200 ml/min (not shown).

In step 4, IPA is supplied to remove the solvent remaining on the substrate W1. Note that in order to discharge the solvent, it is preferable to use a liquid that is miscible with the solvent and has high volatility. The number of rotations (rotational speed) of the table 20 is set to a speed that allows the processing liquid remaining on the substrate W1 to be discharged to the outside of the substrate W1. The processing time is set at the set rotation speed of the table 20 and at a time at which all residual solvent is removed from the substrate W1. The rotation speed of the table 20 and the processing time are determined and set in advance through experiments and the like.

In step 5, drying is performed by high speed rotation without any liquid being supplied. In this step 5, the rotation speed of the table 20 is 1000 rpm, and the processing time is 50 seconds. The number of revolutions and processing time necessary for drying the top of the substrate W1 are determined and set in advance through experiments and the like.

In step 6, in order to stop drying by high-speed rotation, the rotation speed is slowed down without any liquid being supplied. In step 6, the rotation speed of the table 20 is 50 rpm, and the processing time is 10 seconds.

In the above-described substrate processing process, in steps 2 and 3, each vibrator 31 vibrates while the solvent is being supplied to the upper surface of the substrate W1 of the processing target W on the table 20 rotated by the rotation mechanism 40. . In other words, all the vibrators 31 vibrate while the solvent is being supplied, so all the chuck pins 23 vibrate. The adhesive removed from the substrate W1 flows together with the solvent, but the waves generated by the vibrating chuck pin 23 prevent it from coming close to the vibrating chuck pin 23, and the adhesive flows away from the object W together with the solvent to avoid the vibrating chuck pin 23. It is discharged. This prevents the adhesive from adhering to the chuck pin 23. Further, even if the adhesive removed from the substrate W1 adheres to the chuck pin 23 that is not vibrating, when the chuck pin 23 vibrates, the adhered substance separates from the chuck pin 23 and the object to be processed W together with the solvent. is discharged from. This prevents the adhesive from continuing to adhere to the chuck pin 23. Therefore, the adhesive material attached to the chuck pin 23 is prevented from being separated from the chuck pin 23 and attached to the substrate W1 during the transportation process, etc., and contaminating the substrate W1, so that the quality of the substrate can be improved. Note that, for example, if the adhesive adheres to the chuck pin 23, the unprocessed object W that is transported next will be held by the contaminated chuck pin 23. As a result, the adhesive adheres to the ring W2, and if the process continues as it is, it may affect the substrate W1 during the transportation process, dicing process, etc.

Further, in step 2, the first nozzle 61 discharges DIW toward the upper surface of the ring W2 of the object to be processed W on the table 20 rotated by the rotation mechanism 40, and the substrate W1 and the ring W2 of the object to be processed W are DIW is supplied between the As a result, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 and the upper surface of the ring W2 are covered with the DIW liquid film. In this state, the nozzle 51 discharges the solvent toward the vicinity of the center of the substrate W1 of the processing target W on the table 20 rotated by the rotation mechanism 40. Further, in step 3, when the rotation speed of the table 20 increases, the second nozzle 62 discharges DIW toward the outer peripheral edge of the substrate W1 of the processing target W on the table 20 rotated by the rotation mechanism 40. , DIW is supplied between the substrate W1 and the ring W2 of the object W to be processed. As a result, even if the rotational speed of the table 20 increases to, for example, 100 rpm or more (high-speed rotation) and the thickness of the DIW liquid film between the substrate W1 and the ring W2 becomes thin, there is a gap between the substrate W1 and the ring W2. DIW is supplied and the thickness of the DIW liquid film between the substrate W1 and the ring W2 is maintained. Therefore, the state in which the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 is covered with the DIW liquid film is reliably maintained.

In this manner, while the solvent is being supplied, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 and the upper surface of the ring W2 are reliably covered with the DIW liquid film. Thereby, even if the adhesive removed from the substrate W1 is discharged from the substrate W1 together with the solvent, it is prevented from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 or the upper surface of the ring W2. Therefore, the adhesive adhered to the adhesive surface of the dicing tape W3 and the upper surface of the ring W2 separates from the dicing tape W3 and the ring W2 during the conveyance process and the dicing process (for example, post-process), and adheres to the substrate W1, causing the substrate W1 to Since contamination is suppressed, substrate quality can be improved.

Here, for example, if the first nozzle 61 supplies the DIW to the outer peripheral edge of the substrate W1, the DIW will spread from the end surface side of the substrate W1 toward the center. In other words, at the first rotation speed, the centrifugal force is weak, so the performance of discharging to the outer periphery of the substrate W1 cannot be achieved. Therefore, when the DIW spreads toward the center of the substrate W1, the solvent supplied to the center of the substrate W1 in step 2 is inhibited from spreading to the outer periphery of the substrate W1, and the solvent reacts with the adhesive on the outer periphery of the substrate W1. become unable to do so. As described above, DIW and the first processing liquid, which is the solvent, are immiscible, and DIW has a higher specific gravity than the first processing liquid, which is the solvent. Therefore, when the DIW spreads from the outer edge of the substrate W1 toward the center, the solvent supplied from the center of the substrate W1 flows over the DIW without being mixed with the DIW near the outer circumference of the substrate W1. . That is, near the outer periphery of the substrate W1, it becomes difficult for the solvent to come into contact with the adhesive on the substrate W1, and the solvent cannot be supplied to the adhesive on the substrate W1. In other words, the reason why the DIW supply position is changed according to the rotation speed of the table 20 is that, as described above, the solvent, which is the first processing liquid, is supplied onto the substrate W1 without being inhibited by the DIW. This is to ensure that the adhesive material spreads to the outer periphery of the substrate W1 and is removed from the substrate W1, and to suppress adhesion of the adhesive material to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2.

As described above, according to the first embodiment, while the first processing liquid (for example, a solvent) is being supplied to the processing object W by the processing liquid supply section 50, the vibrating section 30 moves each chuck All pins 23 are vibrated. The adhesive removed from the substrate W1 flows together with the first processing liquid, but due to the waves generated by the vibrating chuck pin 23, it is discharged from the processing object W together with the first processing liquid so as to avoid the vibrating chuck pin 23. Therefore, adhesion of the adhesive to the chuck pin 23 is suppressed. Therefore, the adhesive material attached to the chuck pin 23 is prevented from being separated from the chuck pin 23 and attached to the substrate W1 during the transportation process, etc., and contaminating the substrate W1, so that the quality of the substrate can be improved.

Further, the vibrating section 30 changes the number of chuck pins 23 to be vibrated among the chuck pins 23 according to the rotation speed of the table 20. This makes it possible to adjust the fixing force for fixing the processing object W to the table 20 by each chuck pin 23 in accordance with the rise or fall of the rotation speed of the table 20. For example, when increasing the rotation speed of the table 20, the number of vibrating chuck pins 23 is reduced in order to ensure the fixing force for fixing the processing target W to the table 20. On the other hand, when lowering the rotation speed of the table 20, the number of chuck pins 23 to be vibrated is increased within a range that can secure the required fixing force. In this way, it is possible to prevent the adhesive removed from the substrate W1 from adhering to the chuck pins 23 while ensuring the fixing force for fixing the processing target W to the table 20.

In addition, by covering each vibrator 31 with each cover 32, it is possible to prevent each vibrator 31 from being exposed, and it is possible to prevent each vibrator 31 from being contaminated by processing liquid or the like. . This suppresses contamination of the substrate W1 due to contamination of the vibrator 31, so that the quality of the substrate can be reliably improved.

Further, according to the first embodiment, the processing target W is supported by the table 20, the table 20 is rotated by the rotation mechanism 40, and the processing target W supported by the table 20 is rotated according to the rotation speed of the table 20. A first processing liquid that is not mixed with the first processing liquid (for example, a solvent) is applied toward the upper surface of the ring W2 of the object W or the outer peripheral edge of the substrate W1 of the processing object W supported by the table 20. A liquid having a specific gravity (for example, DIW) is discharged, and the liquid is supplied between the substrate W1 and the ring W2 of the object to be processed W, and the liquid is supplied between the substrate W1 and the ring W2 of the object to be processed W. While being supplied, the processing liquid is supplied to the upper surface of the substrate W1 of the processing object W supported by the rotating table 20.

In other words, a liquid that is not miscible with the first processing liquid and has a higher specific gravity than the first processing liquid flows between the substrate W1 and the ring W2, and the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 becomes DIW. Covered by a liquid film. Therefore, the adhesive removed from the substrate W1 is discharged from the processing object W together with the first processing liquid flowing on the DIW liquid film existing between the substrate W1 and the ring W2 and on the upper surface of the ring W2. Therefore, at that time, adhesion to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 is suppressed. Therefore, the adhesive material attached to the adhesive surface of the dicing tape W3 is prevented from separating from the dicing tape W3 and adhering to the substrate W1 during the transportation process, dicing process, etc., and contaminating the substrate W1, thereby improving the substrate quality. It can definitely be improved.

Furthermore, by having the table 20 support the object W to be processed at a position where the height of the top surface of the ring W2 is lower than the height of the top surface of the substrate W1, it becomes possible to improve the performance of discharging the adhesive material, and It becomes possible to cover the upper surface of the ring W2 with a liquid film. This reliably prevents the adhesive removed from the substrate W1 from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 or to the upper surface of the ring W2. Therefore, the adhesive adhered to the adhesive surface of the dicing tape W3 and the upper surface of the ring W2 separates from the dicing tape W3 and the ring W2 and adheres to the substrate W1 during transportation and in subsequent processes such as the dicing process, thereby contaminating the substrate W1. Since it is reliably suppressed, the quality of the substrate can be improved more reliably.

Further, DIW is supplied by the second nozzle 62. If only the first nozzle 61 supplies the liquid, the DIW liquid film becomes thin or disappears, so the second nozzle 62 further assists the liquid amount to maintain the DIW liquid film. . Further, the second nozzle 62 discharges DIW toward the outer peripheral edge of the substrate W1 of the processing target W, so that the DIW liquid is disposed between the substrate W1 and the ring W2 in consideration of the influence of centrifugal force. Forms a film. As a result, the thickness of the DIW liquid film between the substrate W1 and the ring W2 is maintained, so during the supply of the solvent, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 is Reliably covered by a liquid film. As a result, even if the rotation speed of the table 20 is increased, the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2 remains covered with the DIW liquid film. As a result, the adhesive floating in the liquid film of the solvent on the substrate W1 flows together with the solvent flowing on the liquid film of DIW existing between the substrate W1 and the ring W2 and on the upper surface of the ring W2, and the object to be processed is The adhesive is discharged from the W together with the solvent. Therefore, the adhesive removed from the substrate W1 can be prevented from adhering to the adhesive surface of the dicing tape W3 between the substrate W1 and the ring W2.

<Second embodiment>
A second embodiment will be described with reference to FIG. 9. Note that, in the second embodiment, differences from the first embodiment (vibrator arrangement) will be explained, and other explanations will be omitted.

As shown in FIG. 9, each vibrator 31 according to the second embodiment is built in the upper part of each chuck pin 23, respectively. As a result, each vibrator 31 is not exposed, and each cover 32 according to the first embodiment is not required.

As explained above, according to the second embodiment, the same effects as the first embodiment can be obtained. In addition, by providing each vibrator 31 inside each chuck pin 23, it is possible to prevent each vibrator 31 from being exposed even without providing each cover 32 according to the first embodiment. This makes it possible to prevent each vibrator 31 from being contaminated. This suppresses contamination of the substrate W1 due to contamination of the vibrator 31, so that the quality of the substrate can be improved while simplifying the device configuration.

<Other embodiments>
In the above description, each vibrator 31 is provided as an exposed upper part of each chuck pin 23, or is provided built-in in each upper part of each chuck pin 23. For example, the chuck pins 23 may be provided exposed at the lower or intermediate portions of each chuck pin 23, or may be provided internally.

Further, in the above description, although the example of providing the vibrator 31 on the chuck pin 23 has been described, the present invention is not limited to this. The liquid may be vibrated to prevent the adhesive from adhering to each chuck pin 23. It is also possible to incorporate the vibrator 31 into the table 20 and transmit the vibration from the vibrator 31 to the chuck pin 23 via the table 20.

Further, in the above description, the example is shown in which each vibrator 31 is vibrated in the circumferential direction of the substrate W1 every several seconds, but the vibration pattern of each vibrator 31 is not limited to this. There are various types of vibrators 31, and each vibrator 31 may be vibrated in a predetermined pattern order or may be vibrated irregularly. Note that each vibrator 31 is selectively vibrated to vibrate one of the chuck pins 23, but all the chuck pins 23 are selectively vibrated and eventually all the chuck pins 23 are vibrated. make it vibrate. In other words, all the chuck pins 23 are vibrated while the processing liquid is being supplied. It is also possible to vibrate all the chuck pins 23 at the same time.

Furthermore, in the above description, an example was given in which the supply of the processing liquid to the processing object W on the table 20 is started after vibrating one of the chuck pins 23 by the vibration of each vibrator 31. However, the present invention is not limited to this, and for example, after the supply of the processing liquid to the object W on the table 20 is started, any one of the chuck pins 23 may be caused to vibrate by the vibration of each vibrator 31. That is, the vibration of each chuck pin 23 may be started before the supply of the processing liquid is started, or the vibration of each chuck pin 23 may be started after the supply of the processing liquid is started. Even in this case, one of the chuck pins 23 is vibrated while the processing liquid is being supplied to the object W to be processed.

In addition, in the above description, the individual vibration frequencies of each vibrator 31 are set to be the same and constant, but the invention is not limited to this, and the individual vibration frequencies of each vibrator 31 may be made to be different. Alternatively, it may be changed instead of being constant. For example, the individual vibration frequencies of each vibrator 31 may be made to be different, or may be made to be different for each set. Further, the individual frequency of each vibrator 31 is changed depending on the rotation speed of the table 20. This makes it possible to adjust the fixing force for fixing the processing object W to the table 20 by each chuck pin 23 in accordance with the rise or fall of the rotation speed of the table 20. For example, when increasing the rotation speed of the table 20, the frequency of the vibrator 31 is lowered in order to secure the fixing force for fixing the object W to the table 20. On the other hand, when lowering the rotation speed of the table 20, the frequency of the vibrator 31 is increased within a range that can secure the required fixing force. In this way, it is possible to prevent the adhesive removed from the substrate W1 from adhering to the chuck pins 23 while ensuring the fixing force for fixing the processing target W to the table 20. Note that it is also possible to combine changing the frequency of the vibrator 31 according to the rotation speed of the table 20 and changing the number of vibrators 31 (chuck pins 23) to be vibrated according to the rotation speed of the table 20. be.

In the above description, the individual vibration frequencies of each vibrator 31 are determined and set in advance through experiments or the like so that the vibration frequency can suppress the adhesion of the adhesive material to the chuck pin 23.

In addition, in the above description, it has been exemplified that a MEMS resonator, a crystal resonator, or a piezoelectric element as the resonator 31 is provided on the chuck pin 23, but the invention is not limited to this. A MEMS oscillator having a vibrator and an oscillation circuit, or a crystal oscillator having a crystal vibrator as the vibrator 31 and an oscillation circuit may be provided on the chuck pin 23.

In the above description, depending on the rotation speed of the table 20, the upper surface of the ring W2 of the processing object W supported by the table 20, or the outer periphery of the substrate W1 of the processing object W supported by the table 20. Although the liquid supply section 60 is exemplified to eject the liquid toward the end, the invention is not limited to this, and for example, the liquid may be ejected between the substrate W1 and the ring W2 of the processing target W supported by the table 20. Alternatively, the liquid may be discharged. Note that it is also possible to simultaneously supply the liquid to both the upper surface of the ring W2 of the object to be processed W supported by the table 20 and the outer peripheral end of the substrate W1, and the substrate of the object to be processed W supported by the table 20 Both at the outer peripheral edge of W1 and between the substrate W1 and the ring W2, and also at the upper surface of the ring W2 of the processing object W supported by the table 20, at the outer peripheral edge of the substrate W1, and between the substrate W1 and the ring W2. It is also possible to simultaneously supply liquid to three locations in between.

Further, in the above description, although the example of providing two nozzles, the first nozzle 61 and the second nozzle 62, is not limited to this, for example, providing only the first nozzle 61, The first nozzle 61 may be moved by a moving mechanism and used instead of the second nozzle 62. That is, when the number of rotations of the table 20 is the first number of rotations, the first nozzle 61 discharges the liquid toward the upper surface of the ring W2 of the object W to be processed on the table 20, and the number of rotations of the table 20 increases. is the second rotational speed, the liquid is discharged toward the outer peripheral edge of the substrate W1 of the object W to be processed on the table 20. Note that, before the rotation speed of the table 20 is changed from the first rotation speed to the second rotation speed, the first nozzle 61 sprays liquid toward the upper surface of the ring W2 of the processing target W on the table 20. from the position where the liquid is discharged to the position where the liquid is discharged toward the outer peripheral edge of the substrate W1 of the object W to be processed on the table 20. Further, it is also possible to provide a plurality of one or both of the first nozzle 61 and the second nozzle 62 at predetermined intervals in the circumferential direction of the ring W2 and the substrate W1.

Furthermore, in the above description, the first nozzle 61 and the second nozzle 62 may be inclined with respect to the vertical direction, or may be parallel to the vertical direction. Moreover, the inclination angle of the first nozzle 61 and the inclination angle of the second nozzle 62 may be the same or different. The individual inclination angles of the first nozzle 61 and the second nozzle 62 may be changed according to the rotation speed of the table 20, for example, an angle changing mechanism (angle changing unit) having a connecting member, a motor, etc. The rotation speed may be changed according to the rotation speed of the table 20. Further, a plurality of nozzles having different inclination angles are provided for each number of rotations of the table 20, and these nozzles are selected and used according to the number of rotations of the table 20. may be changed. In this way, the angle (discharge angle) at which the nozzles such as the first nozzle 61 and the second nozzle 62 discharge liquid onto the processing target W on the table 20 can be changed.

Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, as well as within the scope of the invention described in the claims and its equivalents.

10 Substrate processing apparatus 20 Table 23 Chuck pin 30 Vibrating section 31 Vibrator 32 Cover 50 Processing liquid supply section W Processing object W1 Substrate W2 Ring W3 Dicing tape

Claims (4)

a table that supports a processing object, the table having a substrate, a ring surrounding the substrate, and a dicing tape that adheres to a lower surface of the substrate and a lower surface of the ring;
a plurality of chuck pins that fix the object to be processed supported by the table to the table;
a processing liquid supply unit that supplies a processing liquid for processing the substrate to the processing object fixed to the table by the plurality of chuck pins;
a vibration unit that vibrates all of the plurality of chuck pins while the processing liquid is being supplied to the object to be processed by the processing liquid supply unit ;
a rotation mechanism that rotates the table within a plane;
Equipped with
The vibration unit is a substrate processing apparatus that changes the number of chuck pins to be vibrated among the plurality of chuck pins according to the rotation speed of the table rotated by the rotation mechanism . The vibrating part is
a plurality of vibrators individually provided on all of the plurality of chuck pins;
a plurality of covers that individually cover the plurality of vibrators;
The substrate processing apparatus according to claim 1, having: The substrate processing apparatus according to claim 1, wherein the vibrating section includes a plurality of vibrators individually built into all of the plurality of chuck pins. supporting on a table a processing object including a substrate, a ring surrounding the substrate, and a dicing tape that adheres to the lower surface of the substrate and the lower surface of the ring;
fixing the object to be processed supported by the table to the table with a plurality of chuck pins;
a step of rotating the table, on which the object to be processed is fixed by the plurality of chuck pins, by a rotation mechanism;
supplying a processing liquid for processing the substrate to the processing target fixed to the table by the plurality of chuck pins, by a processing liquid supply unit;
vibrating all of the plurality of chuck pins by a vibrator while the treatment liquid is being supplied to the object to be processed by the treatment liquid supply unit;
has
In the substrate processing method, the vibration section changes the number of chuck pins to be vibrated among the plurality of chuck pins according to the rotation speed of the table rotated by the rotation mechanism .

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