JP7432413B2 - Vinyl chloride resin composition and molded product thereof - Google Patents
Vinyl chloride resin composition and molded product thereof Download PDFInfo
- Publication number
- JP7432413B2 JP7432413B2 JP2020048832A JP2020048832A JP7432413B2 JP 7432413 B2 JP7432413 B2 JP 7432413B2 JP 2020048832 A JP2020048832 A JP 2020048832A JP 2020048832 A JP2020048832 A JP 2020048832A JP 7432413 B2 JP7432413 B2 JP 7432413B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- chloride resin
- resin composition
- dispersant
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims description 91
- 239000011342 resin composition Substances 0.000 title claims description 46
- 239000011347 resin Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 42
- 239000002270 dispersing agent Substances 0.000 claims description 39
- 239000000945 filler Substances 0.000 claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 239000000344 soap Substances 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 23
- 239000004014 plasticizer Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 15
- 239000000696 magnetic material Substances 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 125000000129 anionic group Chemical group 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 4
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 150000004676 glycans Chemical class 0.000 claims description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 229920001282 polysaccharide Polymers 0.000 claims description 3
- 239000005017 polysaccharide Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims description 2
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 34
- 239000000203 mixture Substances 0.000 description 27
- 239000002585 base Substances 0.000 description 14
- 239000003973 paint Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 239000002612 dispersion medium Substances 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000011358 absorbing material Substances 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000004816 latex Substances 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001944 Plastisol Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- IHBCFWWEZXPPLG-UHFFFAOYSA-N [Ca].[Zn] Chemical compound [Ca].[Zn] IHBCFWWEZXPPLG-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 235000010980 cellulose Nutrition 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000004999 plastisol Substances 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- 229920000936 Agarose Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KRADHMIOFJQKEZ-UHFFFAOYSA-N Tri-2-ethylhexyl trimellitate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)=C1 KRADHMIOFJQKEZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- ZUJVZHIDQJPCHU-UHFFFAOYSA-N [Ba].[Bi] Chemical compound [Ba].[Bi] ZUJVZHIDQJPCHU-UHFFFAOYSA-N 0.000 description 1
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 1
- VNSWULZVUKFJHK-UHFFFAOYSA-N [Sr].[Bi] Chemical compound [Sr].[Bi] VNSWULZVUKFJHK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001278 adipic acid derivatives Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000002885 antiferromagnetic material Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- RZEADQZDBXGRSM-UHFFFAOYSA-N bismuth lanthanum Chemical compound [La].[Bi] RZEADQZDBXGRSM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 229920003064 carboxyethyl cellulose Polymers 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000679 carrageenan Substances 0.000 description 1
- 235000010418 carrageenan Nutrition 0.000 description 1
- 229920001525 carrageenan Polymers 0.000 description 1
- 229940113118 carrageenan Drugs 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006298 dechlorination reaction Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- UYLYBEXRJGPQSH-UHFFFAOYSA-N sodium;oxido(dioxo)niobium Chemical compound [Na+].[O-][Nb](=O)=O UYLYBEXRJGPQSH-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229940114926 stearate Drugs 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000005590 trimellitic acid group Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、塩化ビニル系樹脂に充填材を配合した塩化ビニル系樹脂組成物に関する。 The present invention relates to a vinyl chloride resin composition in which a filler is blended with a vinyl chloride resin.
塩化ビニル樹脂は、絶縁性、難燃性、耐久性などの優れた特性を有しており、電線やケーブルの被覆材、建築資材、自動車部品などの種々の製品に用いられている。例えば、布などの基材に塩化ビニル樹脂製のシート材を貼り合わせると、塩化ビニル樹脂の特性を活かした所望の機能を有する積層シートを得ることができる。また、塩化ビニル樹脂に充填材を配合して、さらなる機能の向上を図ることができる。 Vinyl chloride resin has excellent properties such as insulation, flame retardancy, and durability, and is used in a variety of products such as covering materials for electric wires and cables, construction materials, and automobile parts. For example, by laminating a sheet material made of vinyl chloride resin to a base material such as cloth, a laminated sheet having a desired function that takes advantage of the characteristics of vinyl chloride resin can be obtained. Additionally, fillers can be added to the vinyl chloride resin to further improve functionality.
例えば特許文献１には、カーテンなどの裏打ち材を形成する材料として、塩化ビニルポリマーラテックスと、遮光性を有する二酸化チタンからなる充填材と、酸化アンチモンおよびホスフェートエステルからなる遅炎剤と、可塑剤と、ステアリン酸塩などの界面活性剤と、水とを有するフォーム化ラテックスが記載されている。特許文献２には、シーリング材として用いられる塩化ビニル系プラスチゾル組成物として、塩化ビニル系樹脂と、酸化カルシウム粉末などの充填材と、可塑剤とを有する組成物が記載されている。特許文献３には、電磁波吸収材として用いられる樹脂組成物として、六方晶フェライトと樹脂とを有する組成物が記載されており、樹脂の一例として塩化ビニル樹脂が挙げられている。 For example, Patent Document 1 discloses that materials for forming a backing material such as a curtain include vinyl chloride polymer latex, a filler made of titanium dioxide having light-shielding properties, a flame retardant made of antimony oxide and phosphate ester, and a plasticizer. Foamed latexes are described that have a surfactant such as a stearate, a surfactant, and water. Patent Document 2 describes a composition containing a vinyl chloride resin, a filler such as calcium oxide powder, and a plasticizer as a vinyl chloride plastisol composition used as a sealing material. Patent Document 3 describes a composition having hexagonal ferrite and a resin as a resin composition used as an electromagnetic wave absorbing material, and cites a vinyl chloride resin as an example of the resin.
塩化ビニル樹脂に配合する充填材には、付与したい機能に応じて種々の材料が知られている。例えば、フェライトなどの磁性材料を配合すると、電気製品や電子機器などから発生する電磁波ノイズを吸収する機能を付与することができる。このため、塩化ビニル樹脂に磁性材料を配合した材料は、電磁波吸収材として有用である。この場合、塩化ビニル樹脂に磁性材料を配合した材料を、フェライトコアのような部品形状に成形してもよいが、シート状またはフィルム状に成形したり、部品などの構造物の表面を被覆したり隙間に充填するように成形することができれば、微細な構造にも適用することができ、材料の用途が広がる。 Various materials are known as fillers to be added to vinyl chloride resins, depending on the desired function. For example, by blending a magnetic material such as ferrite, it is possible to impart a function of absorbing electromagnetic noise generated from electrical products, electronic devices, and the like. Therefore, a material in which a magnetic material is blended with a vinyl chloride resin is useful as an electromagnetic wave absorbing material. In this case, a material made of vinyl chloride resin mixed with a magnetic material may be molded into a component shape such as a ferrite core, but it may also be molded into a sheet or film shape, or it may be used to coat the surface of a structure such as a component. If it can be molded to fill gaps or gaps, it can be applied to fine structures, expanding the range of uses for the material.
成形時の形状自由度を高めるためには、塩化ビニル樹脂に充填材を配合した材料を塗料化することが望ましい。しかし、従来より塩化ビニル樹脂を軟化するために使用される可塑剤を用いるだけでは、粘度が高くなり塗料化することは難しい。可塑剤の添加量を増やすことにより低粘度化することも可能であるが、ブリードアウトや成形後の物性などを考慮して、添加量が制約される場合がある。仮に塗料化できたとしても、機械的物性が低下するため、薄膜成形品の強度は期待できない。また、可塑剤がブリードアウトして、接触する他の部品に移行するおそれもある。温度を上げて塗料化することも考えられるが、温度を上げすぎると塗料が途中で固化するおそれがある。また、有機溶剤を添加して希釈すれば、粘度の上昇を抑制することができるが、環境への負荷が大きくなり、揮発性有機化合物（ＶＯＣ）の排出抑制の要求に反することになる。他方、有機溶剤を用いずに、水を分散媒にして塗料化しようとすると、疎水性を有する塩化ビニル樹脂粉末や磁性材料などの充填材は水に分散しにくいため、凝集したり沈殿したりしてしまう。 In order to increase the degree of freedom of shape during molding, it is desirable to use a material made of vinyl chloride resin mixed with a filler as a paint. However, simply using a plasticizer, which has conventionally been used to soften vinyl chloride resin, increases the viscosity and makes it difficult to form into a paint. Although it is possible to lower the viscosity by increasing the amount of plasticizer added, the amount added may be restricted in consideration of bleed-out, physical properties after molding, etc. Even if it could be made into a paint, the strength of thin film molded products cannot be expected because the mechanical properties would deteriorate. There is also a risk that the plasticizer may bleed out and transfer to other parts that come into contact with it. It is possible to raise the temperature and turn it into a paint, but if the temperature is raised too high, the paint may solidify midway through. Furthermore, if an organic solvent is added to dilute the solution, the increase in viscosity can be suppressed, but this increases the burden on the environment and goes against the requirement to suppress the emission of volatile organic compounds (VOC). On the other hand, if you try to make a paint using water as a dispersion medium without using an organic solvent, fillers such as hydrophobic vinyl chloride resin powder and magnetic materials are difficult to disperse in water, so they may aggregate or precipitate. Resulting in.
本発明は、このような実情に鑑みてなされたものであり、充填材を有し水を分散媒とする塩化ビニル系樹脂組成物を提供することを課題とする。また、当該塩化ビニル系樹脂組成物を用いて用途に応じた機能を有する成形体を提供することを課題とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a vinyl chloride resin composition containing a filler and using water as a dispersion medium. Another object of the present invention is to use the vinyl chloride resin composition to provide a molded article having functions appropriate to the intended use.
上記課題を解決するため、本発明の塩化ビニル系樹脂組成物は、塩化ビニル系樹脂粉末と、充填材と、可塑剤と、非石けん系分散剤と、水とを有することを特徴とする。また、本発明の成形体は、当該塩化ビニル系樹脂組成物を固化してなることを特徴とする。 In order to solve the above problems, the vinyl chloride resin composition of the present invention is characterized by having a vinyl chloride resin powder, a filler, a plasticizer, a non-soap dispersant, and water. Moreover, the molded article of the present invention is characterized in that it is formed by solidifying the vinyl chloride resin composition.
本発明の塩化ビニル系樹脂組成物においては、分散媒（構成成分を溶解または分散させる媒体）として水を用いる。すなわち、本発明の塩化ビニル系樹脂組成物は、水に塩化ビニル系樹脂粉末、充填材、可塑剤、非石けん系分散剤などが分散または溶解した組成物である。有機溶剤を使用しないため、環境への負荷が小さく、ＶＯＣ排出抑制の要求にも沿う。また、塩化ビニル系樹脂粉末に加えて、充填材として、水に分散しにくい誘電性材料、磁性材料などの粉末を含む場合でも、非石けん系分散剤を用いることにより、粉末の凝集、沈殿が抑制され、分散性の問題を解消することができる。さらに、粘度も上昇しにくいため、取り扱いやすい。例えば、バーコーター、ロールコーター、ディスペンサーなどを用いて塗布することができ、薄いシート状やフィルム状に成形することが容易である。このように、本発明の塩化ビニル系樹脂組成物によると、充填材による機能性と加工性との両立を実現することができる。 In the vinyl chloride resin composition of the present invention, water is used as a dispersion medium (a medium in which constituent components are dissolved or dispersed). That is, the vinyl chloride resin composition of the present invention is a composition in which vinyl chloride resin powder, a filler, a plasticizer, a non-soap dispersant, etc. are dispersed or dissolved in water. Since it does not use organic solvents, it has a small impact on the environment and meets the requirements for reducing VOC emissions. In addition to vinyl chloride resin powder, even if the filler contains powders such as dielectric materials or magnetic materials that are difficult to disperse in water, using a non-soap dispersant will prevent powder agglomeration and precipitation. suppressed, and the problem of dispersibility can be solved. Furthermore, since the viscosity does not easily increase, it is easy to handle. For example, it can be applied using a bar coater, roll coater, dispenser, etc., and can be easily formed into a thin sheet or film. As described above, according to the vinyl chloride resin composition of the present invention, it is possible to achieve both functionality and processability due to the filler.
本発明の塩化ビニル系樹脂組成物は、所望の充填材を有し塗料化されている。したがって、シート状またはフィルム状に成形したり、部品などの構造物の表面を被覆したり隙間に充填するように成形することが容易である。本発明の塩化ビニル系樹脂組成物は、成形時の形状自由度が高いため、微細な構造にも適用することができ、充填材の機能に応じた幅広い用途に用いることができる。 The vinyl chloride resin composition of the present invention contains a desired filler and is made into a paint. Therefore, it is easy to form it into a sheet or film, to coat the surface of a structure such as a part, or to fill a gap. Since the vinyl chloride resin composition of the present invention has a high degree of freedom in shape during molding, it can be applied to fine structures and can be used in a wide range of applications depending on the function of the filler.
ちなみに、特許文献１に記載されているフォーム化ラテックスにおいては、塩化ビニル樹脂は粉末ではなくラテックスであり、非石けん系分散剤は配合されていない。ステアリン酸カリウムなどの石けん系の界面活性剤は、金属などのイオン成分の影響により溶解度が小さいため分散安定化作用は弱く、充填材として誘電性材料、磁性材料などの粉末を配合した場合に、凝集および沈殿を抑制することは難しい。特許文献２に記載されている塩化ビニル系プラスチゾル組成物、特許文献３に記載されている樹脂組成物においては、いずれも水を分散媒としておらず、非石けん系分散剤も配合されてない。 Incidentally, in the foamed latex described in Patent Document 1, the vinyl chloride resin is not a powder but a latex, and a non-soap dispersant is not blended. Soap-based surfactants such as potassium stearate have low solubility due to the influence of ionic components such as metals, so their dispersion stabilizing effect is weak. It is difficult to suppress flocculation and precipitation. The vinyl chloride plastisol composition described in Patent Document 2 and the resin composition described in Patent Document 3 do not use water as a dispersion medium, nor do they contain a non-soap dispersant.
本発明の成形体は、上述した本発明の塩化ビニル系樹脂組成物を固化して形成される。本発明の成形体は、シート状、フィルム状、種々の部品形状でもよく、布、不織布などの基材に積層されたり含浸したりする形態や、構造物の表面を被覆したり隙間を埋めるように充填されたりする形態など、他の部材と複合化されていてもよい。本発明の成形体は、形状や充填材の種類などを適宜選択することにより、様々な用途や形態で使用することができる。例えば、充填材として磁性材料、誘電性材料を用いれば電磁波吸収材として有用であり、充填材として熱伝導性材料を用いれば放熱部材として有用であり、充填材として導電性材料を用いれば導電部材として有用である。本発明の成形体を積層するなどして、複数の機能を組み合わせることもできる。本発明の成形体によると、ある種の電気回路を形成したり、その一部を構成することができる。 The molded article of the present invention is formed by solidifying the vinyl chloride resin composition of the present invention described above. The molded product of the present invention may be in the form of a sheet, film, or various parts, and may be laminated or impregnated on a base material such as cloth or nonwoven fabric, or may be used to cover the surface of a structure or fill in gaps. It may also be composited with other members, such as in a form in which it is filled with other materials. The molded article of the present invention can be used in various applications and forms by appropriately selecting the shape, type of filler, etc. For example, if a magnetic material or dielectric material is used as a filler, it is useful as an electromagnetic wave absorbing material, if a thermally conductive material is used as a filler, it is useful as a heat dissipation member, and if a conductive material is used as a filler, it is useful as a conductive member. It is useful as A plurality of functions can also be combined by laminating the molded bodies of the present invention. According to the molded article of the present invention, it is possible to form a certain type of electric circuit or constitute a part thereof.
以下、本発明の塩化ビニル系樹脂組成物および成形体の実施の形態について説明する。なお、本発明の塩化ビニル系樹脂組成物および成形体は、以下の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において、当業者が行い得る変更、改良などを施した種々の形態にて実施することができる。 Hereinafter, embodiments of the vinyl chloride resin composition and molded article of the present invention will be described. The vinyl chloride resin composition and molded article of the present invention are not limited to the following forms, but may be modified in various ways by those skilled in the art without departing from the gist of the present invention. It can be implemented in the following form.
＜塩化ビニル系樹脂組成物＞
本発明の塩化ビニル系樹脂組成物は、塩化ビニル系樹脂粉末と、充填材と、可塑剤と、非石けん系分散剤と、水とを有する。
<Vinyl chloride resin composition>
The vinyl chloride resin composition of the present invention includes vinyl chloride resin powder, a filler, a plasticizer, a non-soap dispersant, and water.
［塩化ビニル系樹脂粉末］
塩化ビニル系樹脂粉末は、粉末状の塩化ビニル系樹脂であり、塩化ビニル系樹脂には、塩化ビニル単独重合体の他、塩化ビニルモノマーと他のモノマーとの共重合体、およびポリエチレンなどのポリマーの塩素化物が含まれる。塩化ビニルモノマーと共重合可能な他のモノマーとしては、エチレン、プロピレンなどのオレフィン類、酢酸ビニル、プロピオン酸ビニル、ステアリン酸ビニルなどのビニルエステル類、メチル（メタ）アクリレート、ブチル（メタ）アクリレートなどの（メタ）アクリル酸エステル類、スチレンなどが挙げられる。他のモノマーは一種類でも二種類以上でもよい。なかでも、電気絶縁性、低吸水性、耐熱性の観点から、塩化ビニル単独重合体が望ましく、共重合体においては、塩化ビニルモノマーが５０質量％以上含有されていることが望ましい。
[Vinyl chloride resin powder]
Vinyl chloride resin powder is a powdered vinyl chloride resin, and vinyl chloride resins include vinyl chloride homopolymers, copolymers of vinyl chloride monomers with other monomers, and polymers such as polyethylene. Contains chlorinated substances. Other monomers that can be copolymerized with vinyl chloride monomers include olefins such as ethylene and propylene, vinyl esters such as vinyl acetate, vinyl propionate, and vinyl stearate, methyl (meth)acrylate, butyl (meth)acrylate, etc. (meth)acrylic acid esters, styrene, etc. The other monomers may be one type or two or more types. Among these, from the viewpoints of electrical insulation, low water absorption, and heat resistance, vinyl chloride homopolymers are desirable, and in copolymers, it is desirable that the vinyl chloride monomer is contained in an amount of 50% by mass or more.
塩化ビニル系樹脂のＫ値は、塩化ビニル系樹脂組成物から製造される成形体の耐久性、耐熱性などに影響する場合がある。このため、成形体の用途に応じて、好適なＫ値の塩化ビニル系樹脂を選択すればよい。例えば、成形体に応力がそれほど加わらない用途の場合には、Ｋ値が５０～８０の塩化ビニル系樹脂を選択すればよい。Ｋ値の算出方法は、ＪＩＳ Ｋ７３６７－２：１９９９に規定されている。 The K value of the vinyl chloride resin may affect the durability, heat resistance, etc. of a molded article produced from the vinyl chloride resin composition. Therefore, a vinyl chloride resin having a suitable K value may be selected depending on the purpose of the molded article. For example, in applications where the molded article is not subject to much stress, a vinyl chloride resin having a K value of 50 to 80 may be selected. The method for calculating the K value is specified in JIS K7367-2:1999.
塩化ビニル系樹脂粉末の粒子形状は、球状でも粉砕後の不定形状でもよく、特に限定されない。塩化ビニル系樹脂粉末の粒子径は、特に限定されない。例えば、組成物の粘度、分散性を考慮すると、塩化ビニル系樹脂粉末の平均粒子径は、０．１μｍ以上１００μｍ以下であることが望ましい。平均粒子径としては、レーザ回折散乱式粒子径分布測定装置（マイクロトラック・ベル（株）製「マイクロトラックＭＴ３３００ＥＸＩＩ」）により測定されたメジアン径ｄ５０を採用する。粒子径分布の測定試料には、測定対象の粉末をアセトンに分散した分散液を用いる。 The particle shape of the vinyl chloride resin powder may be spherical or irregular after pulverization, and is not particularly limited. The particle size of the vinyl chloride resin powder is not particularly limited. For example, considering the viscosity and dispersibility of the composition, it is desirable that the average particle diameter of the vinyl chloride resin powder is 0.1 μm or more and 100 μm or less. As the average particle diameter, the median diameter d50 measured by a laser diffraction scattering particle size distribution measuring device ("Microtrac MT3300EXII" manufactured by Microtrac Bell Co., Ltd.) is used. A dispersion liquid in which the powder to be measured is dispersed in acetone is used as a measurement sample for particle size distribution.
［充填材］
充填材は、成形体の用途に応じて適宜選択すればよい。例えば、磁性材料、誘電性材料を配合すると、電磁波ノイズを吸収、遮蔽する機能を付与することができる。磁性材料としては、鉄、ニッケル、コバルト、ステンレス鋼、マグネタイト、マンガン亜鉛フェライト、ニッケル亜鉛フェライト、バリウムフェライト、ストロンチウムフェライトなどの強磁性体、ＭｎＯ、Ｃｒ２Ｏ３、ＦｅＣｌ２、ＭｎＡｓの他、Ｆｅ、Ｓｉ、Ａｌを含む組成物などの反強磁性体、およびこれらを用いた合金類の粒子が挙げられる。誘電性材料としては、比誘電率が比較的大きい材料が望ましく、チタン酸バリウム、チタン酸ジルコン酸鉛（ＰＺＴ）、ランタンドープチタン酸ジルコン酸鉛、チタン酸ストロンチウム、チタン酸ビスマス、チタン酸ビスマスバリウム、ニオブ酸カリウム、ニオブ酸ナトリウム、ニオブ酸リチウム、ニオブ酸カリウムナトリウム、チタン酸バリウムストロンチウム（ＢＳＴ）、チタン酸ビスマスランタン（ＢＬＴ）、タンタル酸ビスマスストロンチウム（ＳＢＴ）などが挙げられる。また、カーボンブラック、黒鉛、炭素繊維などの炭素材料、酸化アルミニウム、窒化アルミニウム、酸化マグネシウム、酸化亜鉛、窒化ホウ素などの導電率や熱伝導率が大きい材料を配合すると、導電性や熱伝導性を高めることができる。また、タングステン、ジルコニアなどの比重の大きい材料、ガラス繊維、セラミック繊維などを配合または併用すると、防音機能を付与することができる。充填材の形状、大きさ、配合量などは、特に限定されない。充填材を配合することにより得られる効果、分散性などを考慮して適宜選択、調整すればよい。
[Filling material]
The filler may be appropriately selected depending on the use of the molded article. For example, by blending a magnetic material or a dielectric material, a function of absorbing and shielding electromagnetic noise can be imparted. Examples of magnetic materials include ferromagnetic materials such as iron, nickel, cobalt, stainless steel, magnetite, manganese zinc ferrite, nickel zinc ferrite, barium ferrite, and strontium ferrite, MnO, Cr 2 O 3 , FeCl 2 , MnAs, and Fe. Examples include antiferromagnetic materials such as compositions containing , Si, and Al, and particles of alloys using these materials. The dielectric material is preferably a material with a relatively high dielectric constant, such as barium titanate, lead zirconate titanate (PZT), lanthanum-doped lead zirconate titanate, strontium titanate, bismuth titanate, bismuth barium titanate. , potassium niobate, sodium niobate, lithium niobate, potassium sodium niobate, barium strontium titanate (BST), bismuth lanthanum titanate (BLT), bismuth strontium tantalate (SBT), and the like. In addition, if carbon materials such as carbon black, graphite, and carbon fiber, and materials with high electrical conductivity and thermal conductivity such as aluminum oxide, aluminum nitride, magnesium oxide, zinc oxide, and boron nitride are mixed, the electrical conductivity and thermal conductivity will increase. can be increased. Moreover, when materials with high specific gravity such as tungsten and zirconia, glass fibers, ceramic fibers, etc. are blended or used in combination, a soundproofing function can be imparted. The shape, size, amount, etc. of the filler are not particularly limited. The filler may be appropriately selected and adjusted in consideration of the effect obtained by blending the filler, dispersibility, etc.
［可塑剤］
可塑材としては、通常、塩化ビニル系樹脂と共に用いられる公知のものから選択すればよい。例えば、ビス（２－エチルヘキシル）フタレート（ＤＥＨＰ、ＤＯＰ）、ジイソノニルフタレート（ＤＩＮＰ）などのフタル酸エステル、ビス（２－エチルヘキシル）アジペート（ＤＯＡ）などのアジピン酸エステル、トリクレジルホスフェート（ＴＣＰ）などのリン酸エステル、トリス（２－エチルヘキシル）トリメリテートなどのトリメリット酸エステル、ビス（２－エチルヘキシル）セバケート（ＤＯＳ）などが挙げられる。可塑剤の配合量は、塩化ビニル系樹脂組成物の粘度、成形体の用途などに応じて適宜調整すればよい。可塑剤の配合量を多くすると、塩化ビニル系樹脂組成物の粘度は低くなり成形体は軟らかくなる。例えば、可塑剤の配合量は、塩化ビニル系樹脂の１００質量部に対して１０質量部以上１２０質量部以下にするとよい。
[Plasticizer]
The plasticizer may be selected from known plasticizers that are usually used together with vinyl chloride resins. For example, phthalic acid esters such as bis(2-ethylhexyl) phthalate (DEHP, DOP) and diisononyl phthalate (DINP), adipic acid esters such as bis(2-ethylhexyl) adipate (DOA), tricresyl phosphate (TCP), etc. phosphoric acid esters, trimellitic acid esters such as tris(2-ethylhexyl) trimellitate, bis(2-ethylhexyl) sebacate (DOS), and the like. The amount of plasticizer to be blended may be adjusted as appropriate depending on the viscosity of the vinyl chloride resin composition, the intended use of the molded article, and the like. When the amount of plasticizer is increased, the viscosity of the vinyl chloride resin composition becomes lower and the molded product becomes softer. For example, the blending amount of the plasticizer is preferably 10 parts by mass or more and 120 parts by mass or less based on 100 parts by mass of the vinyl chloride resin.
［非石けん系分散剤］
非石けん系分散剤は、主に充填材の粒子をばらばらにほぐし、凝集を抑制して安定化させる役割を果たす。非石けん系分散剤に、アルカリ金属、アルカリ土類金属などのイオン化しやすい金属が含まれていない場合には、塩化ビニル系樹脂からの脱塩素を助長しにくく、周辺から発せられる熱などに対しても安定になるため、成形体の耐熱性向上が期待できる。また、アルカリ金属、アルカリ土類金属などのイオン成分が移行しないため、それによる周辺樹脂部品のクラック発生などの劣化を抑制することができる。非石けん系分散剤としては、例えば、ポリカルボン酸系、ナフタレンスルホン酸ホルマリン縮合系などの高分子系のアニオン性分散剤、ポリエチレングリコールなどの高分子系の非イオン性分散剤、ポリエーテル系などの低分子系の非イオン性分散剤、カルボキシルメチルセルロース、カルボキシエチルセルロース、カルボキシプロピルセルロース、ヒドロキシエチルセルロース、ヒドロキシプロピルセルロース、キサンタンガム、アガロース、カラギナン、セルロースナノファイバーなどの多糖類が挙げられる。なかでも塩化ビニル系樹脂および水との相溶性が良好であるという観点から、高分子系のアニオン性分散剤、低分子系の非イオン性分散剤、多糖類が好適である。
[Non-soap dispersant]
The non-soap dispersant mainly plays the role of breaking up filler particles and suppressing agglomeration and stabilizing them. If the non-soap dispersant does not contain metals that easily ionize, such as alkali metals and alkaline earth metals, it will be difficult to promote dechlorination from vinyl chloride resin, and it will not be effective against heat emitted from the surrounding area. Since the heat resistance of the molded product is expected to be improved even when the molded product is Furthermore, since ionic components such as alkali metals and alkaline earth metals do not migrate, deterioration such as cracking of surrounding resin parts due to this can be suppressed. Examples of non-soap dispersants include polymeric anionic dispersants such as polycarboxylic acid and naphthalene sulfonic acid formalin condensation systems, polymeric nonionic dispersants such as polyethylene glycol, and polyether-based dispersants. Examples include low-molecular nonionic dispersants such as carboxymethyl cellulose, carboxyethyl cellulose, carboxypropyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, xanthan gum, agarose, carrageenan, and polysaccharides such as cellulose nanofibers. Among these, polymeric anionic dispersants, low molecular weight nonionic dispersants, and polysaccharides are preferred from the viewpoint of good compatibility with vinyl chloride resins and water.
分子鎖による絡み合いを多くして分散安定化作用を高めるという観点から、非石けん系分散剤の質量平均分子量は１５，０００以上であることが望ましい。２０，０００以上であるとより好適である。非石けん系分散剤の配合量は、塩化ビニル系樹脂組成物の粘度、充填材の種類、配合量などに応じて適宜調整すればよい。例えば、非石けん系分散剤の配合量は、塩化ビニル系樹脂の１００質量部に対して１質量部以上１０質量部以下にするとよい。 From the viewpoint of increasing the entanglement of molecular chains and enhancing the dispersion stabilizing effect, it is desirable that the mass average molecular weight of the non-soap dispersant is 15,000 or more. More preferably, it is 20,000 or more. The blending amount of the non-soap dispersant may be adjusted as appropriate depending on the viscosity of the vinyl chloride resin composition, the type of filler, the blending amount, etc. For example, the amount of the non-soap dispersant to be blended is preferably 1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the vinyl chloride resin.
［他の成分］
本発明の塩化ビニル系樹脂組成物の分散媒は水である。水には、純水、水道水などが含まれる。水の配合量は、塩化ビニル系樹脂組成物の加工性を考慮して、適宜調整すればよい。すなわち、成形体を製造する方法に応じて適切な粘度になるよう、水の配合量を調整するとよい。例えば、基材などに塗布する場合には、塩化ビニル系樹脂組成物の粘度を１Ｐａ・ｓ以上４０Ｐａ・ｓ以下に調整するとよい。３Ｐａ・ｓ以上２５Ｐａ・ｓ以下がより好適である。
[Other ingredients]
The dispersion medium of the vinyl chloride resin composition of the present invention is water. Water includes pure water, tap water, and the like. The amount of water to be added may be appropriately adjusted in consideration of the processability of the vinyl chloride resin composition. That is, it is preferable to adjust the amount of water blended so that the viscosity is appropriate depending on the method of manufacturing the molded body. For example, when applying it to a base material, the viscosity of the vinyl chloride resin composition may be adjusted to 1 Pa·s or more and 40 Pa·s or less. More suitable is 3 Pa·s or more and 25 Pa·s or less.
本発明の塩化ビニル系樹脂組成物は、上述した成分以外に、安定剤、酸化防止剤、紫外線吸収剤、滑剤、着色剤などを有してもよい。例えば、安定剤は、加工時に塩化ビニル系樹脂から塩化水素が脱離するのを抑制し、成形体の耐熱性などの特性を向上させる役割を果たす。安定剤としては、鉛系、バリウム－亜鉛系、カルシウム－亜鉛系、錫系などが挙げられる。 The vinyl chloride resin composition of the present invention may contain stabilizers, antioxidants, ultraviolet absorbers, lubricants, colorants, etc. in addition to the above-mentioned components. For example, the stabilizer plays a role in suppressing desorption of hydrogen chloride from the vinyl chloride resin during processing and improving properties such as heat resistance of the molded article. Examples of stabilizers include lead-based, barium-zinc-based, calcium-zinc-based, and tin-based stabilizers.
＜塩化ビニル系樹脂組成物の製造方法＞
本発明の塩化ビニル系樹脂組成物は、水に塩化ビニル系樹脂粉末、充填材、可塑剤、非石けん系分散剤、その他必要に応じて添加剤を配合し、撹拌して調製すればよい。なお、充填材が水に分散しにくい場合には、非石けん系分散剤を添加してから充填材を添加するとよい。撹拌は、羽根撹拌でもよいが、積極的にせん断力を加えたり、超音波を加えたりしてもよい。自転公転撹拌装置や、メディア型撹拌装置を用いてもよい。
<Method for manufacturing vinyl chloride resin composition>
The vinyl chloride resin composition of the present invention may be prepared by adding vinyl chloride resin powder, fillers, plasticizers, non-soap dispersants, and other additives as necessary to water and stirring the mixture. Note that if the filler is difficult to disperse in water, it is preferable to add a non-soap dispersant before adding the filler. The stirring may be performed by blade stirring, or by actively applying shearing force or applying ultrasonic waves. A rotation/revolution stirring device or a media type stirring device may be used.
＜成形体＞
本発明の成形体は、上述した本発明の塩化ビニル系樹脂組成物の固化物である。例えば、本発明の塩化ビニル系樹脂組成物が、シート状、フィルム状、種々の部品形状に成形された形態が挙げられる。あるいは、基材の表面に積層されたり、基材の内部に含浸されて、基材と複合化された形態でもよい。あるいは、トロイダルコイルなどの構造物の表面を被覆していたり、構造物の隙間を埋めるように充填された形態でもよい。
<Molded object>
The molded article of the present invention is a solidified product of the vinyl chloride resin composition of the present invention described above. For example, the vinyl chloride resin composition of the present invention may be molded into a sheet shape, a film shape, or various parts shapes. Alternatively, it may be laminated on the surface of the base material or impregnated inside the base material to form a composite with the base material. Alternatively, it may be in the form of covering the surface of a structure such as a toroidal coil, or being filled to fill gaps in the structure.
基材の材質としては、布、不織布、樹脂が挙げられる。基材は、一層でもよいが、これらから選ばれる複数の層が積層された積層体でもよい。本発明の塩化ビニル系樹脂組成物を基材の表面に成形する場合、成形体と基材との接着性を向上させるという観点から、基材にコロナ処理などの表面処理を施しておくとよい。 Examples of the material of the base material include cloth, nonwoven fabric, and resin. The base material may be a single layer, or may be a laminate in which a plurality of layers selected from these are laminated. When molding the vinyl chloride resin composition of the present invention onto the surface of a base material, it is recommended that the base material be subjected to surface treatment such as corona treatment in order to improve the adhesion between the molded product and the base material. .
本発明の成形体を製造するには、本発明の塩化ビニル系樹脂組成物を、バーコーター、ロールコーター、ディスペンサーなどの塗工機やスプレーなどを使用して塗布すればよい。あるいは、本発明の塩化ビニル系樹脂組成物が収容された浸漬槽に、基材、構造物などを浸漬してもよい。この場合、基材が多孔質な材料からなる場合には、塩化ビニル系樹脂組成物の一部を基材の内部に含浸させることができる。あるいは、注入機などを用いて、本発明の塩化ビニル系樹脂組成物を構造物の隙間に充填してもよい。 In order to produce the molded article of the present invention, the vinyl chloride resin composition of the present invention may be applied using a coating machine such as a bar coater, a roll coater, a dispenser, or a sprayer. Alternatively, a substrate, a structure, etc. may be immersed in a dipping tank containing the vinyl chloride resin composition of the present invention. In this case, when the base material is made of a porous material, a portion of the vinyl chloride resin composition can be impregnated into the inside of the base material. Alternatively, the vinyl chloride resin composition of the present invention may be filled into gaps in the structure using an injection machine or the like.
本発明の成形体を製造するには、本発明の塩化ビニル系樹脂組成物から水を蒸発させて固化させればよい。固化方法は、特に限定されないが、例えば加熱したり、赤外線（ＩＲ）、紫外線（ＵＶ）などの電磁波を照射すればよい。電磁波を照射すると、固化を比較的短時間で完了させることができる。電磁波を照射する場合、塩化ビニル系樹脂組成物に紫外線吸収剤、カーボンなどの光吸収剤を配合しておくと、電磁波の吸収効率が高くなり、固化時間の短縮により効果的である。 In order to produce the molded article of the present invention, water may be evaporated from the vinyl chloride resin composition of the present invention to solidify it. The solidification method is not particularly limited, but may be, for example, heating or irradiation with electromagnetic waves such as infrared rays (IR) and ultraviolet rays (UV). When irradiated with electromagnetic waves, solidification can be completed in a relatively short time. When irradiating with electromagnetic waves, adding a light absorber such as an ultraviolet absorber or carbon to the vinyl chloride resin composition increases the absorption efficiency of electromagnetic waves and is more effective in shortening the solidification time.
次に、実施例を挙げて本発明をより具体的に説明する。 Next, the present invention will be described in more detail with reference to Examples.
＜塩化ビニル系樹脂組成物の製造＞
［実施例１］
水２７質量部に、塩化ビニル系樹脂粉末（塩化ビニル単独重合体、Ｋ値７７、平均粒子径１～２μｍ）１００質量部と、充填材としてのフェライト粉末２６質量部と、可塑剤としてのＤＯＳ６０質量部と、非石けん系分散剤としてのポリカルボン酸アンモニウム塩（高分子系アニオン性分散剤、サンノプコ（株）製「ＳＮディスパーサント５０２７」）３．５質量部と、カルシウム－亜鉛系（Ｃａ－Ｚｎ系）安定剤５質量部とを添加して撹拌し、塩化ビニル系樹脂組成物を製造した。以下これを、「実施例１の組成物」と称す。
<Manufacture of vinyl chloride resin composition>
[Example 1]
27 parts by mass of water, 100 parts by mass of vinyl chloride resin powder (vinyl chloride homopolymer, K value 77, average particle size 1-2 μm), 26 parts by mass of ferrite powder as a filler, and DOS60 as a plasticizer. parts by mass, 3.5 parts by mass of polycarboxylic acid ammonium salt as a non-soap dispersant (polymer-based anionic dispersant, "SN Dispersant 5027" manufactured by San Nopco Co., Ltd.), and calcium-zinc type (Ca -5 parts by mass of Zn-based stabilizer were added and stirred to produce a vinyl chloride-based resin composition. Hereinafter, this will be referred to as "the composition of Example 1".
［実施例２］
充填剤の配合量を５９質量部に変更した点以外は実施例１と同様にして、実施例２の組成物を製造した。
[Example 2]
A composition of Example 2 was produced in the same manner as Example 1 except that the amount of filler was changed to 59 parts by mass.
［実施例３］
水を２０質量部に変更し、充填材の配合量を５９質量部に変更し、可塑剤の配合量を５０質量部に変更した点以外は実施例１と同様にして、実施例３の組成物を製造した。
[Example 3]
The composition of Example 3 was prepared in the same manner as in Example 1 except that the amount of water was changed to 20 parts by mass, the amount of filler was changed to 59 parts by mass, and the amount of plasticizer was changed to 50 parts by mass. manufactured something.
［実施例４］
充填材の種類を誘電性材料のチタン酸バリウム粉末に変更し、その配合量を１５０質量部にした点以外は実施例１と同様にして、実施例４の組成物を製造した。
[Example 4]
A composition of Example 4 was produced in the same manner as in Example 1, except that the type of filler was changed to barium titanate powder, which is a dielectric material, and the amount added was 150 parts by mass.
［実施例５］
可塑剤の配合量を５０質量部に変更し、非石けん系分散剤を低分子系非イオン性分散剤（サンノプコ（株）製「ＳＮウエット３６６」）」に変更した点以外は実施例１と同様にして、実施例５の組成物を製造した。以上、実施例１～５の組成物は、本発明の塩化ビニル系樹脂組成物の概念に含まれる。
[Example 5]
Example 1 except that the amount of plasticizer was changed to 50 parts by mass and the non-soap dispersant was changed to a low-molecular nonionic dispersant ("SN Wet 366" manufactured by San Nopco Co., Ltd.). Similarly, the composition of Example 5 was produced. As described above, the compositions of Examples 1 to 5 are included in the concept of the vinyl chloride resin composition of the present invention.
［比較例１］
非石けん系分散剤を配合しなかった点以外は実施例１と同様にして、比較例１の組成物を製造した。
[Comparative example 1]
A composition of Comparative Example 1 was produced in the same manner as in Example 1 except that a non-soap dispersant was not blended.
［比較例２］
水の配合量を１００質量部に変更し、可塑剤の配合量を５０質量部に変更し、非石けん系分散剤に代えて界面活性剤（ポリエーテル変性シリコーンオイル：信越化学工業（株）製「ＫＦ－３５４Ｌ」、ＨＬＢ値１６）を１００質量部配合した点以外は実施例１と同様にして、比較例２の組成物を製造した。
[Comparative example 2]
The amount of water blended was changed to 100 parts by mass, the blended amount of plasticizer was changed to 50 parts by mass, and a surfactant (polyether-modified silicone oil: manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of a non-soap dispersant. A composition of Comparative Example 2 was produced in the same manner as in Example 1 except that 100 parts by mass of "KF-354L" (HLB value 16) was blended.
＜塩化ビニル系樹脂組成物の評価＞
製造した組成物の分散状態および粘度を、次の方法により評価、測定した。表１に、製造した組成物の組成および評価結果を示す。
<Evaluation of vinyl chloride resin composition>
The dispersion state and viscosity of the produced composition were evaluated and measured by the following methods. Table 1 shows the composition and evaluation results of the manufactured compositions.
［分散状態］
（１）目視観察
各組成物を透明な容器に入れた状態で側面から目視観察し、分散状態を評価した。そして、二層以上に分離していない場合を分散性良好（表１中、〇印で示す）、二層以上に分離している場合を分散性不良（同表中、×印で示す）と評価した。
[Distributed state]
(1) Visual Observation Each composition was placed in a transparent container and visually observed from the side to evaluate the dispersion state. If it is not separated into two or more layers, it is considered to have good dispersibility (indicated by a circle in Table 1), and if it is separated into two or more layers, it is considered to be poor in dispersibility (indicated by an x in the table). evaluated.
（２）粒度分布測定
各組成物の粒度分布を、レーザ回折散乱式粒子径分布測定装置（マイクロトラック・ベル（株）製「マイクロトラックＭＴ３３００ＥＸＩＩ」）により測定した。
(2) Particle Size Distribution Measurement The particle size distribution of each composition was measured using a laser diffraction scattering particle size distribution measuring device (Microtrac MT3300EXII, manufactured by Microtrac Bell Co., Ltd.).
［粘度］
各組成物の粘度を、東機産業（株）製のＢ型粘度計「ＴＶＢ－１０Ｒ」を用いて測定した。測定にはＨ７ローターを使用し、回転速度は５０ｒｐｍで行った。
The viscosity of each composition was measured using a B-type viscometer "TVB-10R" manufactured by Toki Sangyo Co., Ltd. An H7 rotor was used for the measurement, and the rotation speed was 50 rpm.
表１に示すように、非石けん系分散剤を配合した実施例１～５の組成物においては、水に分散しにくい磁性材料または誘電性材料の粉末を配合しても、粉末の凝集、沈殿が抑制され、分散性が良好であった。粒度分布は、メジアン径（ｄ５０）が１．３～１．６の範囲の正規分布になった。また、組成物の粘度も比較的小さかった。これに対して、非石けん系分散剤を配合しなかった比較例１の組成物においては、水が分離し、実用レベルに塗料化することはできなかった。非石けん系分散剤に代えて界面活性剤を配合した比較例２の組成物についても同様に、水が分離し、実用レベルに塗料化することはできなかった。比較例１、２の組成物については、水が分離したため、粒度分布および粘度を測定することはできなかった。 As shown in Table 1, in the compositions of Examples 1 to 5 in which non-soap dispersants were blended, even if powders of magnetic or dielectric materials that are difficult to disperse in water were blended, powder agglomeration and precipitation occurred. was suppressed, and the dispersibility was good. The particle size distribution was a normal distribution with a median diameter (d50) in the range of 1.3 to 1.6. The viscosity of the composition was also relatively low. On the other hand, in the composition of Comparative Example 1 in which no non-soap dispersant was blended, water separated and it was not possible to form it into a paint at a practical level. Similarly, in the composition of Comparative Example 2 in which a surfactant was blended in place of the non-soap dispersant, water separated and it was not possible to form it into a paint at a practical level. Regarding the compositions of Comparative Examples 1 and 2, the particle size distribution and viscosity could not be measured because water separated.
本発明の塩化ビニル系樹脂組成物から製造された成形体は、用途に応じて充填材を選択することにより、電磁波吸収材、放熱部材、防音材、絶縁材、難燃材などとして用いることができる。成形体の形態も様々であり、各種部品の他、シート材、フィルム材、布などの基材に積層、含浸される複合材、配線、トロイダルコイルなどの構造物の表面を被覆する被覆材、構造物、配線基板などの隙間を埋める充填材などが挙げられる。 The molded article produced from the vinyl chloride resin composition of the present invention can be used as an electromagnetic wave absorbing material, a heat radiating member, a soundproofing material, an insulating material, a flame retardant material, etc. by selecting a filler according to the purpose. can. The shapes of the molded bodies are various, and in addition to various parts, there are composite materials that are laminated and impregnated into base materials such as sheet materials, film materials, and cloth, coating materials that cover the surfaces of structures such as wiring, toroidal coils, etc. Examples include fillers that fill gaps in structures, wiring boards, etc.
Claims (4)
該磁性材料は、鉄、ステンレス鋼、フェライト、鉄－ニッケル合金、鉄－シリコン－アルミニウム合金、およびケイ素鉄合金から選ばれる一種以上であり、
該誘電性材料は、チタン酸バリウム、チタン酸ジルコン酸鉛、チタン酸ビスマス、ニオブ酸カリウム、およびニオブ酸カリウムナトリウムから選ばれる一種以上であり、
該非石けん系分散剤は、ポリカルボン酸系分散剤およびナフタレンスルホン酸ホルマリン縮合系分散剤を有するアニオン性分散剤と、ポリエチレングリコールおよびポリエーテル系分散剤を有する非イオン性分散剤と、多糖類と、から選ばれる一種以上であることを特徴とする塩化ビニル系樹脂組成物。 It has a vinyl chloride resin powder, a filler having one or more selected from magnetic materials and dielectric materials , a plasticizer, a non-soap dispersant, and water ,
The magnetic material is one or more selected from iron, stainless steel, ferrite, iron-nickel alloy, iron-silicon-aluminum alloy, and silicon-iron alloy,
The dielectric material is one or more selected from barium titanate, lead zirconate titanate, bismuth titanate, potassium niobate, and potassium sodium niobate,
The non-soap dispersant includes an anionic dispersant having a polycarboxylic acid dispersant and a naphthalene sulfonic acid formalin condensation dispersant, a nonionic dispersant having a polyethylene glycol and polyether dispersant, and a polysaccharide. A vinyl chloride resin composition characterized by being one or more selected from .
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008156540A (en) | 2006-12-26 | 2008-07-10 | Konishi Co Ltd | Water-based adhesive composition |
| JP2010077198A (en) | 2008-09-24 | 2010-04-08 | Asahi Kasei E-Materials Corp | Resin composition |
| WO2016010156A1 (en) | 2014-07-18 | 2016-01-21 | 住友金属鉱山株式会社 | Heat-ray-shielding microparticles, heat-ray-shielding microparticle liquid dispersion, heat-ray-shielding film, heat-ray-shielding glass, heat-ray-shielding dispersion, and heat-ray-shielding laminated transparent substrate |
| WO2017170427A1 (en) | 2016-03-31 | 2017-10-05 | パウダーテック株式会社 | Ferrite powder, resin composition, and molded article |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008156540A (en) | 2006-12-26 | 2008-07-10 | Konishi Co Ltd | Water-based adhesive composition |
| JP2010077198A (en) | 2008-09-24 | 2010-04-08 | Asahi Kasei E-Materials Corp | Resin composition |
| WO2016010156A1 (en) | 2014-07-18 | 2016-01-21 | 住友金属鉱山株式会社 | Heat-ray-shielding microparticles, heat-ray-shielding microparticle liquid dispersion, heat-ray-shielding film, heat-ray-shielding glass, heat-ray-shielding dispersion, and heat-ray-shielding laminated transparent substrate |
| WO2017170427A1 (en) | 2016-03-31 | 2017-10-05 | パウダーテック株式会社 | Ferrite powder, resin composition, and molded article |
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