JP7430480B2 - Conductive film with protective film - Google Patents

Description

The present invention relates to a conductive film with a protective film.

Conventionally, conductive films in which a conductive layer is formed on the surface of a resin film have been used for flexible circuit boards, electromagnetic shielding films, flat panel displays, touch sensors, non-contact IC cards, solar cells, and the like. The main function of the conductive film is electrical conduction, and the composition and thickness of the conductive layer provided on the surface of the resin film are appropriately selected so as to obtain electrical conductivity suitable for the purpose of use.

When handling conductive films, long conductive films are often wound up into rolls to facilitate transportation and transfer to the next process. When rolled, the conductive layer comes into close contact with the layer adjacent to it in the radial direction, so a protective film may be provided on the side of the resin film opposite to the surface on which the conductive layer is formed to protect the conductive layer. However, excessive contact between the conductive layer and the protective film may cause blocking or appearance defects. On the other hand, a technique has also been proposed in which the appearance defects are suppressed by providing predetermined protrusions on the surface of the protective film. (Patent Document 1).

Patent No. 5876892

However, although blocking and appearance defects can be suppressed by making the surface rough, the friction coefficient of the protective film decreases due to the increase in roughness, and when force is applied to the roll's own weight or the roll end surface, There is a possibility that a phenomenon in which the removal layer shifts in a direction parallel to the axial direction of the roll (hereinafter also referred to as "winding shift") may occur. If the winding misalignment occurs, the conductive layer may be damaged, resulting in increased resistance, or in some cases, the conductive layer may be disconnected after patterning. Furthermore, when the protective film is peeled off, the film runs diagonally, albeit slightly, and the peeling direction of the protective film is misaligned with the running direction of the film, which may result in poor peeling.

An object of the present invention is to provide a conductive film with a protective film that can suppress occurrence of winding misalignment when wound into a roll.

The inventors of the present invention have made extensive studies to solve the above problems, and have found that the above objects can be achieved by employing the following configuration, and have completed the present invention.

In one embodiment, the present invention provides:
resin film,
a conductive layer disposed as the outermost layer on one side of the resin film;
A conductive film with a protective film, comprising: a protective film disposed as the outermost layer on the other side of the resin film,
The surface roughness Ra of the outermost surface of the conductive layer is 0.1 nm or more and 10 nm or less,
The present invention relates to a conductive film with a protective film, in which the outermost surface of the protective film has a surface roughness Ra of 100 nm or more and 500 nm or less.

In the conductive film with a protective film, the surface roughness Ra of the outermost surface of the protective film and the surface roughness Ra of the outermost surface of the conductive layer are each within the above specific ranges, so that winding misalignment can be prevented, and It is possible to prevent an increase in resistance and poor peeling due to scratches on the conductive layer, thereby increasing the quality of the conductive film and improving the production efficiency of devices incorporating the conductive film. Although the mechanism by which winding misalignment of the conductive film with a protective film is prevented is not clear, it is presumed as follows. First, it is thought that the winding misalignment is caused by a decrease in frictional resistance due to a decrease in the contact area between the conductive layer and the protective film. It is presumed that by increasing the surface roughness of the protective film, a gap (air) enters between the protective film and the conductive layer, which reduces the contact area, reduces frictional resistance, and causes winding misalignment. On the other hand, by deliberately setting the surface roughness Ra of the protective film to a relatively large value within the above range, and at the same time slightly increasing the surface roughness Ra of the conductive layer, air escape is promoted. It is presumed that the contact area is maintained to a certain extent and winding misalignment is prevented. Note that the method for measuring the surface roughness Ra is as described in Examples.

In one embodiment, it is preferable that the ten-point average roughness Rz of the outermost surface of the protective film is 1500 nm or more and 12000 nm or less. By setting the ten-point average roughness Rz within the above range, it is possible to further promote the release of air between the protective film and the conductive layer, maintain the contact area, and effectively prevent winding misalignment. be able to. Note that the method for measuring the ten-point average roughness Rz is as described in Examples.

In one embodiment, the conductive film with a protective film may further include a conductive layer disposed between the resin film and the protective film.

In one embodiment, the thickness of the conductive film with a protective film is 50 μm or more and 200 μm or less,
It is preferable that the thickness of the protective film is 5 μm or more and 35 μm or less.

By setting the thickness of the conductive film with a protective film within the above range, handling in the roll-to-roll method can be facilitated. Further, by setting the thickness of the protective film within the above range, it is possible to promote air release and maintain the contact area more efficiently. With these, it is possible to obtain a conductive film with a protective film that has good handling properties and can prevent winding misalignment.

In one embodiment, the conductive layer is preferably a sputtered film. By employing a sputtered film obtained by sputtering as the conductive layer, it is possible to form a conductive layer with high uniformity, low surface roughness, and low resistance.

In one embodiment, it is preferable that the material forming the protective film is a polyolefin resin. Thereby, a predetermined surface roughness Ra and air release properties can be suitably imparted to the protective film.

In one embodiment, the surface of the protective film in contact with the adjacent layer has adhesiveness,
It is preferable that the peeling force between the protective film and the adjacent layer is 0.01 N/50 mm or more and 1 N/50 mm or less.

By setting the peeling force between the protective film and the adjacent layer within the above range, smooth peeling of the protective film in the peeling process can be achieved while preventing unintended peeling of the protective film.

In one embodiment, the present invention provides a conductive film with a protective film;
A protective film disposed on the outermost layer of the conductive film on the conductive layer side of the conductive film with a protective film.

As a distribution form of the conductive film, not only a form in which a protective film is disposed on one side, but also a form in which a protective film is disposed on both sides may be adopted. Since the conductive film with a protective film on both sides uses a conductive film with a protective film in which a protective film is disposed on one side in the manufacturing process, a high-quality conductive film can be manufactured with a good yield.

1 is a schematic cross-sectional view of a conductive film with a protective film according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a rolled body of a conductive film with a protective film, schematically showing a procedure for evaluating winding misalignment.

Embodiments of the conductive film with a protective film of the present invention will be described below with reference to the drawings. However, in some or all of the figures, parts unnecessary for explanation are omitted, and some parts are shown enlarged or reduced in order to facilitate explanation. Terms indicating positional relationships such as up and down are used simply to facilitate explanation, and are not intended to limit the configuration of the present invention.

<Conductive film with protective film>
FIG. 1 is a schematic cross-sectional view of a conductive film with a protective film according to an embodiment of the present invention. The conductive film 100 with a protective film shown in FIG. A protective film 3 is provided.

Further, the conductive film with protective film 100 of this embodiment includes a conductive layer 2a disposed between the resin film 1 and the protective film 3. Furthermore, base layers 4a and 4b are provided between the resin film 1 and the conductive layer 2, and between the resin film 1 and the conductive layer 2a, respectively. The conductive layer 2a and the base layers 4a and 4b have arbitrary configurations. Note that although the conductive layers 2, 2a and the base layers 41, 42 each have a single layer structure, they may each have a multilayer structure of two or more layers. As long as the conductive layer 2 and the protective film 3 are each arranged as the outermost layer, the layer arranged below them is not particularly limited. Note that even in the case where the conductive layer 2 is arranged on one side of the resin film 1 and the protective film 3 is arranged on the other side without the conductive layer 2a and the base layers 4a and 4b being arranged. , the conductive layer 2 and the protective film 3 are referred to as outermost layers.

The thickness of the conductive film 100 with a protective film is preferably 50 μm or more and 200 μm or less, preferably 60 μm or more and 180 μm or less, and preferably 80 μm or more and 150 μm or less. By setting the thickness of the protective film-attached conductive film 100 within the above range, handling in the roll-to-roll method can be facilitated.

(resin film)
The resin film 1 is not particularly limited as long as it can ensure insulation, and various plastic films can be used. Materials for the resin film include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), polyimide resins such as polyimide (PI), polyethylene (PE), and polypropylene (PP). ), etc., polyolefin resins, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, cycloolefin resins, (meth)acrylic resins, polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene Examples include polyvinyl alcohol-based resins, polyarylate-based resins, polyphenylene sulfide-based resins, and the like. Among these, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyimide resins such as polyimide (PI) are preferred from the viewpoint of heat resistance, durability, flexibility, production efficiency, cost, etc. preferable. In particular, from the viewpoint of cost performance, polyethylene terephthalate (PET) is preferred.

The surface of the resin film is subjected to etching treatments such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, etc., and undercoating treatments in advance to improve adhesion with the conductive layer formed on the resin film. It may also be guaranteed. Furthermore, before forming the conductive layer, the surface of the resin film may be cleaned and cleaned by solvent cleaning, ultrasonic cleaning, or the like, if necessary.

The thickness of the resin film is preferably within the range of 50 to 250 μm, more preferably within the range of 80 to 200 μm, and even more preferably within the range of 100 to 180 μm. Generally, it is desirable that the resin film be thicker because it is less susceptible to effects such as thermal shrinkage during heating. However, as electronic components and the like become more compact, it is desirable to reduce the thickness of the resin film to some extent. On the other hand, if the thickness of the resin film is too thin, the moisture permeability and permeability of the resin film will increase, allowing moisture, gas, etc. to pass through, and the conductive layer will be easily oxidized. Therefore, in this embodiment, by reducing the thickness of the resin film while maintaining a certain level of thickness, the conductive film itself can be made thinner, making it possible to reduce the thickness when used in electromagnetic shielding sheets, sensors, etc. becomes. Therefore, it is possible to reduce the thickness of electromagnetic shielding sheets, sensors, etc. Furthermore, when the thickness of the resin film is within the above range, the flexibility of the resin film can be ensured while the mechanical strength is sufficient, and the film can be rolled into a roll to form a base layer and a conductive layer continuously. Operation is possible.

(conductive layer)
The conductive layer 2 disposed as the outermost layer on one side of the resin film 1 and the conductive layer 2a disposed between the resin film 1 and the protective film 3 are used in order to obtain sufficient electromagnetic shielding effect, sensor function, etc. , the electrical resistivity is preferably 100 μΩcm or less. The material constituting the conductive layers 2 and 2a is not particularly limited as long as it satisfies the electrical resistivity and has conductivity, but examples include Cu, Al, Fe, Cr, Ti, Si, Nb, and In. , Zn, Sn, Au, Ag, Co, Cr, Ni, Pb, Pd, Pt, W, Zr, Ta, Hf, Mo, Mn, Mg, V, and other metals are preferably used. Further, materials containing two or more of these metals, alloys and oxides containing these metals as main components, etc. can also be used. When transparency is required, indium-tin composite oxide (ITO) is also preferably used. Among these conductive compounds, it is preferable to contain Cu and Al from the viewpoints of high conductivity contributing to electromagnetic shielding properties and sensor functions and relatively low cost. In particular, from the viewpoint of cost performance and production efficiency, it is preferable to include Cu, but elements other than Cu may be included to the extent of impurities. As a result, the electrical resistivity is sufficiently low and the conductivity is high, so that electromagnetic shielding characteristics and sensor functions can be improved.

The method of forming the conductive layers 2, 2a is not particularly limited, and conventionally known methods can be employed. Specifically, from the viewpoint of film thickness uniformity and film-forming efficiency, vacuum film-forming methods such as sputtering, chemical vapor deposition (CVD), and physical vapor deposition (PVD), and ion spray It is preferable that the film be formed by a coating method, a plating method (electrolytic plating, electroless plating), a hot stamping method, a coating method, or the like. Further, a plurality of these film forming methods may be combined, or an appropriate method may be adopted depending on the required film thickness. Among these, sputtering method and vacuum film forming method are preferable, and a sputtered film obtained by sputtering method is particularly preferable. This allows continuous production using the roll-to-roll manufacturing method, increasing production efficiency, and controlling the film thickness and surface roughness during film formation, thereby suppressing an increase in the surface resistance value of the conductive film. In addition, a thin conductive layer with uniform thickness and density can be formed.

Although the thickness of the conductive layers 2 and 2a is not particularly limited, it is preferably independently 10 nm or more and 250 nm or less. The lower limit of the thickness of the conductive layers 2 and 2a is preferably 20 nm, more preferably 50 nm. On the other hand, the upper limit of the thickness of the conductive layers 2 and 2a is preferably 200 nm. If the thickness of the conductive layers 2, 2a exceeds the above upper limit, curling of the conductive film after heating is likely to occur, and it becomes difficult to reduce the thickness of the device. If the thickness is smaller than the above lower limit, the surface resistance of the conductive film tends to become high under humid heat conditions, and the target humid heat reliability may not be achieved, or pattern wiring may deteriorate due to a decrease in the strength of the conductive layer. Peeling may occur.

The surface roughness Ra of the outermost surface _SC of the conductive layer 2 disposed as the outermost layer is 1 nm or more and 10 nm or less. The lower limit of the surface roughness Ra is preferably 1.5 nm, more preferably 2 nm, and even more preferably more than 2 nm. The upper limit of the surface roughness Ra is preferably 8 nm, more preferably 5 nm. By setting the surface roughness Ra of the outermost surface _SC of the conductive layer 2 disposed as the outermost layer within the above range, it is possible to reduce the resistance of the conductive layer. At the same time, by setting the surface roughness Ra of the protective film within a predetermined range, winding misalignment can be efficiently prevented. Although the surface roughness Ra of the surface of the conductive layer 2a opposite to the resin film 1 is not particularly limited, it is preferably within the same range as the surface roughness Ra of the outermost surface _SC of the conductive layer 2.

(protective layer)
The protective layer can be formed on the outermost surface _SC side of the conductive layer 2 (not shown), for example, in order to prevent the conductive layer 2 from being naturally oxidized under the influence of oxygen in the atmosphere. The protective layer is not particularly limited as long as it exhibits a rust-preventing effect on the conductive layer 2, but metals that can be sputtered are preferred, such as Ni, Cu, Ti, Si, Zn, Sn, Cr, Fe, indium, gallium, antimony, One or more metals selected from zirconium, magnesium, aluminum, gold, silver, palladium, and tungsten or oxides thereof are used. Ni, Cu, and Ti are metals that are difficult to corrode because they form a passive layer, Si is hard to corrode because they have improved corrosion resistance, and Zn and Cr are metals that are hard to corrode because they form a dense oxide film on the surface. preferable.

As the material for the protective layer, from the viewpoint of ensuring adhesion with the conductive layer 2 and reliably preventing the conductive layer 2 from rusting, an alloy consisting of two types of metals can be used, but an alloy consisting of three or more types of metals can be used. An alloy consisting of is preferred. Alloys consisting of three or more metals include Ni-Cu-Ti, Ni-Cu-Fe, Ni-Cu-Cr, etc. From the viewpoint of rust prevention function and production efficiency, Ni-Cu-Ti is preferred. preferable. Note that from the viewpoint of ensuring adhesion with the conductive layer 2, an alloy containing the material for forming the conductive layer 2 is preferable. Thereby, oxidation of the conductive layer 2 can be reliably prevented.

In addition, examples of materials for the protective layer include indium-doped tin oxide (ITO), antimony-containing tin oxide (ATO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), and indium-doped zinc oxide ( IZO) may be included. This is preferable because it not only suppresses an increase in the initial surface resistance value of the conductive film, but also suppresses an increase in the surface resistance value under humidified heat conditions, thereby optimizing the stabilization of the surface resistance value.

The metal oxide is preferably an oxide such as SiO _x (x=1.0 to 2.0), copper oxide, silver oxide, titanium oxide, or the like. Note that instead of the metal, alloy, oxide, etc. described above, a resin layer such as an acrylic resin or an epoxy resin may be formed on the conductive layer 2 to provide a rust prevention effect.

The thickness of the protective layer is preferably 1 to 50 nm, more preferably 2 to 30 nm, and preferably 3 to 20 nm. This improves durability and prevents oxidation from the surface layer, thereby suppressing an increase in surface resistance under humid heat conditions.

A similar protective layer may also be provided on the surface of the conductive layer 2a disposed between the resin film 1 and the protective film 3 on the protective film 3 side.

(Protective film)
Although the material and structure of the protective film 3 are not particularly limited, it is desirable to have a base layer containing a polyolefin resin and an adhesive layer containing a thermoplastic elastomer. The protective film 3 is arranged such that the adhesive layer faces the adjacent layer (resin film 1, base layer 4a, conductive layer 2a, etc.) side. As a material for forming the adhesive layer, a known adhesive such as a removable acrylic adhesive can also be used.

The polyolefin resin forming the base layer is not particularly limited, and includes, for example, polypropylene or block-based or random-based propylene polymers consisting of a propylene component and an ethylene component; low-density, high-density, linear low-density polyethylene, etc. Ethylene-based polymers; examples include olefin-based polymers such as ethylene-α-olefin copolymers, olefin-based polymers of ethylene components and other monomers such as ethylene-vinyl acetate copolymers, and ethylene-methyl methacrylate copolymers. These polyolefin resins can be used alone or in combination of two or more. Films containing these materials may be uniaxially or biaxially stretched.

The base material layer contains an olefin resin as a main component, but for the purpose of preventing deterioration, it may also contain antioxidants, ultraviolet absorbers, light stabilizers such as hindered amine light stabilizers, antistatic agents, and others. For example, additives such as fillers such as calcium oxide, magnesium oxide, silica, zinc oxide, and titanium oxide, pigments, eye stain preventive agents, lubricants, and antiblocking agents may be appropriately blended.

The thickness of the base material layer is not particularly limited, but is preferably 18 μm or more, more preferably 20 μm or more. On the other hand, the thickness of the base material layer is preferably 30 μm or less, more preferably 25 μm or less. Further, the base material layer 1 may be a single layer or may be composed of two or more layers.

The surface of the base material layer opposite to the adhesive layer may be subjected to surface treatment, such as corona discharge treatment, flame treatment, plasma treatment, patter etching treatment, or undercoating treatment such as primer, as necessary. You can also do it.

As the thermoplastic elastomer forming the adhesive layer, those used as base polymers for adhesives, such as styrene elastomers, urethane elastomers, ester elastomers, and olefin elastomers, can be used without particular limitation. More specifically, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-ethylene-butylene copolymer-styrene (SEBS), styrene-ethylene-propylene copolymer-styrene (SEPS) ), etc.; styrene-butadiene (SB), styrene-isoprene (SI), styrene-ethylene-butylene copolymer (SEB), styrene-ethylene-propylene copolymer (SEP), etc. AB type block polymer; Styrenic random copolymer such as styrene-butadiene rubber (SBR); ABC type styrene/olefin such as styrene/ethylene-butylene copolymer/olefin crystal (SEBC) Crystalline block polymer; C-B-C type olefin crystalline block polymer such as olefin crystal, ethylene-butylene copolymer, olefin crystal (CEBC); ethylene-α olefin, ethylene-propylene-α olefin, propylene-α Examples include olefin elastomers such as olefins, and hydrogenated products thereof. These thermoplastic elastomers can be used alone or in combination of two or more.

When forming the adhesive layer, for example, a softener, an olefin resin, a silicone polymer, a liquid acrylic copolymer, a phosphate ester, etc. may be added to the thermoplastic elastomer as necessary for the purpose of controlling adhesive properties. additives such as fillers and pigments such as calcium oxide, magnesium oxide, silica, zinc oxide, titanium oxide, etc. They can be blended as appropriate.

The thickness of the adhesive layer is not particularly limited and may be appropriately determined depending on the required adhesion strength, etc., but it is usually about 0.1 μm, preferably 0.2 μm or more, and more preferably 0.1 μm or more. It is 3 μm or more. The thickness of the adhesive layer is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less.

In addition, the surface of the adhesive layer may be subjected to surface treatments, such as corona discharge treatment, ultraviolet irradiation treatment, flame treatment, plasma treatment, or sputter etching treatment, as necessary for the purpose of controlling adhesion and pasting workability. It can also be applied. Furthermore, if necessary, a separator or the like can be temporarily attached to the adhesive layer to protect it until it is put into practical use.

Furthermore, if necessary, a release layer may be formed on the surface of the base material layer opposite to the surface on which the adhesive layer is attached (i.e., the outermost surface _SP of the protective film 3) to impart release properties. can. The release layer may be formed by coextrusion together with the base material layer and the adhesive layer, or may be formed by coating.

When forming the release layer by coextrusion, it is preferable to use a mixture of two or more types of polyolefin resins. By using a mixture of two or more polyolefin resins, the compatibility of the two polyolefin resins can be controlled to form an appropriate surface roughness and provide appropriate mold releasability. be. When the release layer is formed by coextrusion, its thickness is usually about 1 to 30 μm, preferably 2 to 20 μm, and more preferably 3 to 10 μm.

As a mold release agent when forming a mold release layer by coating, any agent capable of imparting mold release properties can be used without particular limitation. For example, the mold release agent may be one made of silicone polymer or long chain alkyl polymer. The mold release agent may be of a non-solvent type, a solvent type dissolved in an organic solvent, or an emulsion type that is emulsified in water, but solvent type or emulsion type mold release agents can stably form the mold release layer 3. It can be attached to the base material layer 1. In addition, as the mold release agent, there may be mentioned an ultraviolet curing type. As specific examples of the mold release agent, Pearoyl (manufactured by Ippo Sha Yushi Co., Ltd.), Shin-Etsu Silicone (manufactured by Shin-Etsu Chemical Co., Ltd.), and the like are available.

The thickness of the release layer is not particularly limited, but as mentioned above, since the contamination reduction effect is greater when formed into a thin film, it is usually about 1 to 1000 nm, more preferably 5 to 500 nm, particularly 10 to 100 nm. is preferred.

The thickness of the protective film 3 (including the thickness of an adhesive layer or a release layer, if any) is preferably 5 μm or more and 35 μm or less. The lower limit of the thickness of the protective film 3 is more preferably 8 μm, even more preferably 10 μm, and particularly preferably 15 μm. The upper limit of the thickness of the protective film 3 is more preferably 32 μm, even more preferably 30 μm, and particularly preferably 25 μm. By setting the thickness of the protective film 3 within the above range, it is possible to promote air release and maintain the contact area more efficiently.

The surface roughness Ra of the outermost surface _SP of the protective film 3 is 100 nm or more and 500 nm or less. The lower limit of the surface roughness Ra is preferably 150 nm, more preferably 200 nm, and even more preferably 250 nm. The upper limit of the surface roughness Ra is preferably 450 nm, more preferably 420 nm, and even more preferably 400 nm. In the conductive film with a protective film 100 according to the present embodiment, the surface roughness Ra of the outermost surface _SP of the protective film 3 and the surface roughness Ra of the outermost surface _SC of the conductive layer 2 are each set within the above specific ranges. , it is possible to prevent winding misalignment, and in turn prevent increased resistance and peeling defects due to scratches on the conductive layer, thereby improving the quality of conductive films and the production efficiency of devices incorporating conductive films. .

It is preferable that the ten-point average roughness Rz of the outermost surface _SP of the protective film 3 is 1500 nm or more and 12000 nm or less. The average value of the peak-trough distance is more preferably 1,800 nm or more, even more preferably 2,000 nm or more, while it is more preferably 10,000 nm or less, and even more preferably 8,000 nm or less. By setting the ten-point average roughness Rz within the above range, it is possible to further promote the release of air between the protective film and the conductive layer, maintain the contact area, and effectively prevent winding misalignment. be able to.

As mentioned above, it is preferable that the surface of the protective film in contact with the adjacent layer has adhesive properties. Specifically, the peeling force between the protective film 3 and the adjacent layer is preferably 0.01 N/50 mm or more and 1 N/50 mm or less, and preferably 0.02 N/50 mm or more and 0.8 N/50 mm or less. More preferably, it is 0.04 N/50 mm or more and 0.6 N/50 mm or less. By setting the peeling force between the protective film and the adjacent layer within the above range, smooth peeling of the protective film in the peeling process can be achieved while preventing unintended peeling of the protective film.

(base layer)
In the conductive film of this embodiment, base layers 4a and 4b are provided between the resin film 1 and the conductive layer 2, and between the resin film 1 and the conductive layer 2a, respectively. The conductive film 100 with a protective film can be improved by providing a base layer according to the purpose, such as adhesion of the conductive layers 2 and 2a to the resin film 1, imparting strength to the conductive film 100 with a protective film, and controlling electrical characteristics. It is possible to improve the functionality of. The base layers 4a and 4b are not particularly limited, and examples thereof include an easy-adhesion layer, a hard coat layer (including one that functions as an anti-blocking layer, etc.), a dielectric layer, and the like.

(Easy adhesive layer)
The easily adhesive layer is a cured film of an adhesive resin composition. The easy adhesion layer has good adhesion to the conductive layer.

As the adhesive resin composition, those having sufficient adhesion and strength as a cured film after forming an easy-to-adhesion layer can be used without particular limitation. Examples of resins used include thermosetting resins, thermoplastic resins, ultraviolet curable resins, electron beam curable resins, two-component mixed resins, and mixtures thereof, among which curing treatment by ultraviolet irradiation is used. In this case, an ultraviolet curable resin is preferred because it can efficiently form an easy-to-adhesion layer through simple processing operations. By including the ultraviolet curable resin, an adhesive resin composition having ultraviolet curable properties can be easily obtained.

The adhesive resin composition is preferably a material that forms a crosslinked structure upon curing. When the crosslinking structure in the easy-adhesion layer is promoted, the internal structure of the membrane, which had been loose until then, becomes stronger, and the strength of the membrane is improved. This is because it is presumed that such improvement in film strength contributes to improvement in adhesion.

The adhesive resin composition preferably contains at least one of a (meth)acrylate monomer and a (meth)acrylate oligomer. This facilitates the formation of a crosslinked structure due to the C═C double bond contained in the acryloyl group, making it possible to efficiently improve the film strength. In addition, in this specification, (meth)acrylate means acrylate or methacrylate.

The (meth)acrylate monomer and/or acrylate oligomer having a (meth)acryloyl group as a main component used in this embodiment has the role of forming a coating film, and specifically, trimethylolpropane tri(meth)acrylate , ethylene oxide-modified trimethylolpropane tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, trimethylolpropane tetra(meth)acrylate, tris(acryloxyethyl)isocyanurate, caprolactone-modified tris(acryloxyethyl) ) isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, alkyl-modified dipentaerythritol tri(meth)acrylate, alkyl Examples include modified dipentaerythritol tetra(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, and mixtures of two or more of these.

Among the above-mentioned (meth)acrylates, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, or a mixture thereof is preferred in terms of wear resistance and hardenability. Particularly preferred.

Moreover, urethane acrylate oligomers can also be used. Urethane (meth)acrylate oligomers can be produced by reacting a polyol with a polyisocyanate and then reacting a (meth)acrylate having a hydroxyl group, or by reacting a polyisocyanate with a (meth)acrylate having a hydroxyl group. Examples include a method of reacting a polyol, a method of reacting a polyisocyanate, a polyol, and a (meth)acrylate having a hydroxyl group, but there is no particular limitation.

Examples of the polyol include polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, copolymers thereof, ethylene glycol, propylene glycol, 1,4-butanediol, 2,2'-thiodiethanol, and the like.

Examples of the polyisocyanate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4'- Examples include diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, and the like.

If the crosslink density is too high, the performance as a primer deteriorates and the adhesion of the conductive layer tends to decrease, so a low functional (meth)acrylate having a hydroxyl group (hereinafter referred to as a hydroxyl group-containing (meth)acrylate) may be used. Examples of hydroxyl group-containing (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. , 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-acryloyloxyprokyl (meth)acrylate, pentaerythritol tri(meth)acrylate, etc. . The above-mentioned (meth)acrylate monomer component and/or (meth)acrylate oligomer component may be used alone or in combination of two or more.

The UV-curable adhesive resin composition of this embodiment has improved anti-blocking properties by incorporating a (meth)acrylic group-containing silane coupling agent. As the (meth)acrylic group-containing silane coupling agent, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, Examples include 3-methacryloxypropyltriethoxysilane, and commercially available products include KR-513 and KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name).

The blending amount of the silane coupling agent is 0.1 to 50 parts by weight, more preferably 1 to 20 parts by weight, based on 100 parts by weight of the (meth)acrylate monomer and/or (meth)acrylate oligomer. . Within this range, the adhesion with the conductive layer is improved and the physical properties of the coating film can be maintained.

The easy adhesion layer of this embodiment may contain nano silica particles. As nanosilica particles, organosilica sol synthesized from alkylsilane or nanosilica synthesized by plasma arc can be used. Commercially available products include PL-7-PGME (manufactured by Fuso Chemical, trade name) for the former, and SIRMIBK15WT%-M36 (manufactured by CIK Nanotech, trade name) for the latter. The blending ratio of the nanosilica fine particles is preferably 5 to 30 parts by weight, and 5 to 10 parts by weight, based on 100 parts by weight of the total weight of the (meth)acrylate monomer and/or acrylate oligomer having the (meth)acryloyl group and the silane coupling agent. Parts by weight are more preferred. By setting the value above the lower limit, surface irregularities are formed and anti-blocking properties can be imparted, and roll-to-roll production becomes possible. By setting it below the upper limit, deterioration in adhesiveness with the conductive layer can be prevented.

The average particle size of nano silica particles is preferably 100 to 500 nm. If the average particle size is less than 100 nm, the amount of addition required to form irregularities on the surface will be large, making it impossible to obtain adhesion with the conductive layer, whereas if it exceeds 500 nm, the surface irregularities will become large and pinholes will be formed. A problem occurs.

The adhesive resin composition preferably contains a photopolymerization initiator to impart ultraviolet curability. Examples of photopolymerization initiators include benzoin ethers such as benzoin normal butyl ether and benzoin isobutyl ether, benzyl ketals such as benzyl dimethyl ketal and benzyl diethyl ketal, and acetophenones such as 2,2-dimethoxyacetophenone and 2,2-diethoxyacetophenone. 1-hydroxycyclohexyl phenyl ketone, [2-hydroxy-2-methyl-1-(4-ethylenephenyl)propan-1-one], 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-(4-isopropylphenyl)propan-1- α-hydroxyalkylphenones such as 2-methyl-1-[4-(methylthio)phenyl]-1-morpholinopropane, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)- α-Aminoalkylphenones such as 1-butanone, monoacylphosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylethoxyphosphine oxide, bis(2,6- Examples include monoacylphosphine oxides such as dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

From the viewpoint of resin curability, photostability, compatibility with resin, low volatility, and low odor, alkylphenone photopolymerization initiators are preferred, such as 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1 -Phenyl-propan-1-one, (2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 1 -[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one is more preferred. Commercially available products include Irgacure 127, 184, 369, 651, 500, 891, 907. , 2959, Darocure 1173, TPO (manufactured by BASF Japan Co., Ltd., trade name), etc.The photopolymerization initiator is based on 100 parts by weight of a (meth)acrylate monomer and/or acrylate oligomer having a (meth)acryloyl group, Add 3 to 10 parts by weight of solids.

When forming an easy-to-adhesion layer, an adhesive resin composition containing (meth)acrylate and/or (meth)acrylate oligomer having a (meth)acryloyl group in the molecule as a main component is mixed with toluene, butyl acetate, and isopropyl alcohol. Prepared as a varnish with a solid content of 30-50% by diluting it with a solvent such as butanol, ethyl acetate, cyclohexane, cyclohexanone, methylcyclohexanone, hexane, acetone, methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether, diethyl ether, ethylene glycol, etc. do.

The easy adhesion layer is formed by applying the above varnish onto the resin film 1. The varnish application method can be selected as appropriate depending on the situation of the varnish and painting process, such as dip coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating, and die coating. It can be applied by a method such as a coating method or an extrusion coating method.

After applying the varnish, an easily adhesive layer can be formed by curing the coating film. As for the curing treatment of the adhesive resin composition having ultraviolet curable properties, if the varnish contains a solvent, after removing the solvent by drying (for example, at 80°C for 1 minute), using an ultraviolet irradiation machine, 500 mW/cm ² - 3000 mW/ An example of the procedure is to perform ultraviolet treatment with an irradiation intensity of cm ² and a work amount of 50 to 400 mJ/cm ² for curing. Ultraviolet lamps are generally used as sources of ultraviolet light, and specific examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, and metal halide lamps. It may be carried out in an inert gas such as nitrogen or argon.

It is preferable to perform heating during the ultraviolet curing treatment. The curing reaction of the adhesive resin composition progresses by UV irradiation, and at the same time a crosslinked structure is formed. By heating at this time, the formation of a crosslinked structure can be sufficiently promoted even with a low amount of ultraviolet rays. The heating temperature can be set depending on the degree of crosslinking, and is preferably 50°C to 80°C. The heating means is not particularly limited, and a hot air dryer, a radiant heat dryer, heating of a film transport roll, etc. can be appropriately employed.

Although the thickness of the easy adhesion layer is not particularly limited, it is preferably 0.2 μm to 2 μm, more preferably 0.4 μm to 1.5 μm, and even more preferably 0.6 μm to 1.2 μm. . By setting the thickness of the easy adhesion layer within the above range, the adhesion of the conductive layer and the flexibility of the film can be improved.

(Hard coat layer)
A hard coat layer may be provided as the base layer. Further, in order to prevent blocking between the conductive layer 2a and the protective film 3 or between the conductive layer 2 and the protective film 3 when wound into a roll, manufacturing by the roll-to-roll method is possible. Additionally, particles may be added to the hard coat layer.

For forming the hard coat layer, the same adhesive composition as that for the easy adhesion layer can be suitably used. In order to impart anti-blocking properties, it is preferable to incorporate particles into the adhesive composition. Thereby, unevenness can be formed on the surface of the hard coat layer, and anti-blocking properties can be suitably imparted to the conductive film 100 with a protective film.

As the particles, transparent materials such as various metal oxides, glass, plastics, etc. can be used without particular limitation. For example, inorganic particles such as silica, alumina, titania, zirconia, and calcium oxide, crosslinked or uncrosslinked polymers such as polymethyl methacrylate, polystyrene, polyurethane, acrylic resin, acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate. Examples include crosslinked organic particles and silicone particles. The particles may be used alone or in combination of two or more.

The average particle diameter and blending amount of the particles can be appropriately set while taking into consideration the degree of surface unevenness. The average particle size is preferably 0.5 μm to 2.0 μm, and the amount incorporated is preferably 0.2 to 5.0 parts by weight based on 100 parts by weight of resin solid content of the composition.

(dielectric layer)
One or more dielectric layers may be provided as the base layer. The dielectric layer is formed of an inorganic material, an organic material, or a mixture of an inorganic material and an organic material. Materials for forming the dielectric layer include NaF, Na ₃ AlF ₆ , LiF, MgF ₂ , CaF ₂ , SiO ₂ , LaF 3 , CeF ₃ , Al ₂ O ₃ , TiO _{2 ,} Ta ₂ O ₅ , ZrO ₂ , Examples include inorganic materials such as ZnO, ZnS, and SiO _x (x is 1.5 or more and less than 2), and organic materials such as acrylic resins, urethane resins, melamine resins, alkyd resins, and siloxane polymers. In particular, it is preferable to use a thermosetting resin made of a mixture of a melamine resin, an alkyd resin, and an organic silane condensate as the organic material. The dielectric layer can be formed using the above-mentioned materials by a coating method such as a gravure coating method or a bar coating method, a vacuum evaporation method, a sputtering method, an ion plating method, or the like.

The thickness of the dielectric layer is preferably 10 nm to 250 nm, more preferably 20 nm to 200 nm, even more preferably 20 nm to 170 nm. If the thickness of the dielectric layer is too small, it will be difficult to form a continuous film. Furthermore, if the thickness of the dielectric layer is excessively large, cracks tend to occur in the dielectric layer.

The dielectric layer may have nanoparticles with an average particle size of 1 nm to 500 nm. The content of nanoparticles in the dielectric layer is preferably 0.1% to 90% by weight. The average particle size of the nanoparticles used in the dielectric layer is preferably in the range of 1 nm to 500 nm, more preferably 5 nm to 300 nm, as described above. Further, the content of nanoparticles in the dielectric layer is more preferably 10% to 80% by weight, and even more preferably 20% to 70% by weight.

Examples of inorganic oxides forming nanoparticles include fine particles of silicon oxide (silica), hollow nanosilica, titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconium oxide, niobium oxide, and the like. Among these, fine particles of silicon oxide (silica), titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconium oxide, and niobium oxide are preferred. These may be used alone or in combination of two or more.

(Production method of conductive film with protective film)
A conductive film with a protective film is produced by forming a conductive layer on one side of a resin film on which a base layer is formed if necessary, then winding it up into a roll, and then rolling it out from the roll while rolling the other side of the resin film. It can be manufactured using the roll-to-roll method, in which a protective film is laminated onto the surface. Alternatively, the protective film may be attached downstream of the line for forming the conductive layer and then wound up into a roll. When forming a conductive layer on both sides, after forming the conductive layer on one side of the resin film, wind it up into a roll, then roll out the film and attach the protective film on the formed conductive layer, and then re-roll it. Roll up into a film. Next, a conductive film with a protective film can be manufactured by forming a conductive layer on the surface opposite to the surface to which the protective film is attached while unrolling the film.

For example, when forming the conductive layer 2 made of copper by sputtering, copper (preferably oxygen-free copper) is used as the target, and the degree of vacuum (ultimate vacuum) in the sputtering device is preferably set to 1. It is preferable to exhaust the atmosphere until the pressure is below ×10 ⁻³ Pa to remove impurities such as moisture in the sputtering apparatus and organic gas generated from the resin film 1.

An inert gas such as Ar is introduced into the thus evacuated sputtering apparatus, and sputtering film formation is performed under reduced pressure, preferably while conveying the resin film under tension. The temperature of the resin film during formation of the conductive layer is preferably 10°C to 100°C, more preferably 15°C to 80°C, even more preferably 20°C to 60°C. The pressure during film formation is preferably 0.05 Pa to 1.0 Pa, more preferably 0.1 Pa to 0.7 Pa. If the film-forming pressure is too high, the film-forming rate tends to decrease, while if the pressure is too low, the discharge tends to become unstable.

Although the pressure for bonding the protective film is not particularly limited, it is preferably 0.05 MPa or more and 3 MPa or less, more preferably 0.1 MPa or more and 2 MPa or less, and even more preferably 0.15 MPa or more and 1 MPa or less.

(Characteristics of conductive film with protective film)
The surface resistance value R1 of the conductive layers 2 and 2a is preferably 0.001Ω/□ to 20Ω/□, more preferably 0.01Ω/□ to 10Ω/□, and 0.1Ω/□ to 5Ω /□ is more preferable. This makes it possible to provide a practical conductive film with a protective film that is highly efficient in production.

The conductive film 100 with a protective film may be wound into a roll from the viewpoint of transportability and handling. By continuously forming a base layer and a conductive layer on a resin film using a roll-to-roll method, a conductive film can be efficiently manufactured.

(Applications of conductive film with protective film)
The conductive film with a protective film can be applied to various uses, such as electromagnetic shielding sheets, planar sensors, displays, etc. The protective film is removed before installation of these devices. The electromagnetic shielding sheet uses a conductive film with a protective film peeled off, and can be suitably used in the form of a touch panel or the like. The thickness of the electromagnetic shielding sheet is preferably 20 μm to 300 μm.

In addition, the shape of the electromagnetic shielding sheet is not particularly limited, and depending on the shape of the object to be installed, etc., the shape viewed from the stacking direction (the same direction as the thickness direction of the sheet) may be rectangular, circular, triangular, or polygonal. The shape can be selected as appropriate.

Planar sensors use conductive films, and are used as force sensors for measuring loads in user interfaces such as touch panels and controllers of mobile devices, and in sensing areas of objects, such as the outer surface of automobiles, robots, and dolls. It includes sensors that sense various physical quantities such as external forces applied to the surface. The planar sensor can be suitably used in the form of a force sensor, a shield, or the like. The thickness of the planar sensor is preferably 20 μm to 300 μm.

<Conductive film with double-sided protective film>
A conductive film with double-sided protective films can also be obtained by further disposing another protective film on the side opposite to the side on which the protective film is disposed of the conductive film with a protective film. As the protective film further disposed, a protective film that is the same as or different from the protective film of the conductive film with a protective film can be used. The preferred method for producing a conductive film with a double-sided protective film is to unwind the film from a roll of the conductive film with a protective film, attach another protective film as the outermost layer on the conductive layer side, and finally wind it up. can be adopted.

EXAMPLES Hereinafter, the present invention will be described in detail using Examples, but the present invention is not limited to the following Examples unless it exceeds the gist thereof.

<Example 1: Production of double-sided conductive film with one-sided protective film>
(Formation of conductive layer (conductive layer 2a in FIG. 1))
An annealed PET film (manufactured by Toray Film Processing Co., Ltd., "150-TT00A") having a thickness of 150 μm and a width of 1100 mm was used as the resin film, and a conductive layer was formed on one side of the film by sputtering. The sputtering conditions were as follows. The inside of the sputtering device was made into a high vacuum of 3.0×10 ⁻³ Torr or less (0.4 Pa or less), and in that state, sputter film formation was performed while feeding the long resin film from the delivery roll to the take-up roll. . In an atmosphere of 3.0 × 10 ^-3 Torr consisting of 100% by volume of Ar gas, a conductive layer was sputtered to a thickness of 150 nm on one side using a sintered body DC magnetron sputtering method using a Cu target material. . By winding up the film after film formation onto a take-up roll, a rolled body of a single-sided conductive film in which a conductive layer (corresponding to conductive layer 2a in FIG. 1) was formed on one side was produced.

(Launching of protective film (protective film 3 in Figure 1))
A protective film (manufactured by Toray Industries, Inc., "MS05 improved product 3" (commercial product "MS05" whose surface roughness was adjusted by adjusting the film-forming temperature and tension)) was pasted on the conductive layer formed by sputter film deposition. Combined. The bonding conditions were as follows. While sending the produced single-sided conductive film from the delivery roll to the take-up roll, in the meantime, a protective film was attached to the conductive layer surface (sputtered surface) with a pressure of 0.3 MPa, and the film was wound up on the take-up roll. A rolled body of a laminate was prepared by laminating a protective film as the outermost layer to the conductive surface (sputtered surface) of a single-sided conductive film.

(Formation of conductive layer (conductive layer 2 in FIG. 1))
By sputtering the conductive layer 2 to a thickness of 150 nm under the same conditions as the conductive layer 2a on the side opposite to the surface on which the conductive layer 2a is disposed in the wound body of the produced single-sided conductive film, conductive layer 2 is formed on both sides of the resin film. A rolled body of a double-sided conductive film with a protective film on one side, in which layers were formed and a protective film was pasted on one side, was produced.

(cutting process)
A roll of a double-sided conductive film with a single-sided protective film was unrolled and slitted in half in the MD direction. It was wound around a 6-inch core to a size of 250 m x width 500 mm to produce a semi-rolled body (thickness (radius) from the core to the outermost surface of the film: 62 mm) of a double-sided conductive film with a protective film on one side.

<Example 2>
A semi-rolled body of a double-sided conductive film with a single-sided protective film was produced in the same manner as in Example 1, except that "FSA020M" manufactured by Futamura Co., Ltd. was used as the protective film.

<Example 3>
A half-plant roll of a double-sided conductive film with a single-sided protective film was produced in the same manner as in Example 1, except that "FF2830" manufactured by Tredegar was used as the protective film.

<Comparative example 1>
The same procedure as in Example 1 was used except that "MS05 improved product 1" manufactured by Toray Industries (the surface roughness was adjusted by adjusting the film formation temperature and tension of the commercially available "MS05") was used as the protective film. A semi-rolled body of a double-sided conductive film with a protective film on one side was produced using the manufacturing method.

<Comparative example 2>
The same procedure as in Example 1 was used, except that "MS05 improved product 2" manufactured by Toray Industries (the surface roughness was adjusted by adjusting the film formation temperature and tension of the commercially available "MS05") was used as the protective film. A semi-rolled body of a double-sided conductive film with a protective film on one side was produced using the manufacturing method.

<Evaluation>
The produced conductive film with protective film was evaluated as follows. The results are shown in Table 1.

(1) Measurement of Thickness The thickness of the conductive layer was measured by observing the cross section of the conductive film with a protective film using a transmission electron microscope (manufactured by Hitachi, Ltd., "H-7650").

(2) Measurement of surface roughness Ra and ten-point average roughness Rz of conductive layer and protective film Surface roughness Ra and ten-point average roughness Rz were measured using a commercially available optical surface texture measuring device (manufactured by Canon Marketing Japan Co., Ltd., " Zygo NewView 7300'') was used to acquire images in a 2.90 μm x 2.18 μm square area in a predetermined mode, and the values of the acquired images were determined using MetroPro analysis software (manufactured by Zygo corporation). . The surface roughness Ra (also referred to as arithmetic mean roughness Ra) represents the average of the absolute values of Z(x) in the reference length. The ten-point average roughness Rz (Rzjis) is the sum of the average height of the 5th peak from the highest peak on the roughness curve and the average depth of the 5th valley from the deepest valley bottom. be.

(3) Evaluation of winding misalignment As shown in FIG. 2, the misalignment when a load was applied to the end of the produced half-cut wound body was measured. FIG. 2 is a cross-sectional view of a rolled body of a conductive film with a protective film, schematically showing a procedure for evaluating winding misalignment. A load of 10 N was applied in a direction parallel to the axis at a position 60 mm away from the axis of the half-planted rolled body in the radial direction, and the amount of displacement of the end of the rolled body when a steady state was reached was measured. When the amount of displacement from the original position was 2 mm or less, it was evaluated that there was no winding shift, and when the amount of displacement exceeded 2 mm, it was evaluated that there was winding shift.

(4) Peeling Force Measurement After the prepared conductive film with a protective film for a half-plant was left at room temperature (25°C) for 30 minutes or more, the sample was cut into a size of 50 mm x 200 mm. The opposite side of the cut sample from the protective film was fixed to an SUS plate (SUS430BA) using double-sided tape. Under this environment, the protective film was peeled from the conductive film with the protective film using a universal tensile testing machine (manufactured by NMB Minebea Co., Ltd., "TCM-1kNB") at a peeling speed of 300 mm/min and a peeling angle of 180°. The peeling force (N/50mm) at this time was measured and defined as the adhesion force.

(result)
From Table 1, no winding misalignment occurred in the conductive film with a protective film of the example. On the other hand, in the comparative example, winding misalignment occurred. From the above, in the conductive film with a protective film of the example, the surface roughness Ra of the protective film is appropriately increased to the extent that air escape can occur, and the contact area between the conductive layer and the protective film is maintained. This is thought to be due to the fact that the friction coefficient was maintained.

1 Resin film 2, 2a Conductive layer 3 Protective film 4a, 4b Base layer 100 Conductive film with protective film

Claims (8)

resin film,
a conductive layer disposed as the outermost layer on one side of the resin film;
A conductive film roll with a protective film, comprising: a protective film disposed as the outermost layer on the other side of the resin film,
The surface roughness Ra of the outermost surface of the conductive layer is 0.1 nm or more and 10 nm or less,
The thickness of the conductive layer is 10 nm or more and 250 nm or less,
A conductive film roll with a protective film, wherein the outermost surface of the protective film has a surface roughness Ra of 100 nm or more and 500 nm or less. The conductive film roll with a protective film according to claim 1, wherein the outermost surface of the protective film has a ten-point average roughness Rz of 1,500 nm or more and 12,000 nm or less. The conductive film roll with a protective film according to claim 1 or 2, further comprising a conductive layer disposed between the resin film and the protective film. The thickness of the conductive film with a protective film is 50 μm or more and 200 μm or less,
The conductive film roll with a protective film according to any one of claims 1 to 3, wherein the protective film has a thickness of 5 μm or more and 35 μm or less. The conductive film roll with a protective film according to any one of claims 1 to 4, wherein the conductive layer is a sputtered film. The conductive film roll with a protective film according to any one of claims 1 to 5, wherein the material forming the protective film is a polyolefin resin. The surface of the protective film in contact with the adjacent layer has adhesiveness,
The conductive film roll with a protective film according to any one of claims 1 to 6, wherein the peeling force between the protective film and the adjacent layer is 0.01 N/50 mm or more and 1 N/50 mm or less. resin film,
a conductive layer disposed as the outermost layer on one side of the resin film;
a protective film disposed as the outermost layer on the other side of the resin film;
A conductive film roll with a protective film, comprising:
the conductive layer is a sputtered film,
The surface roughness Ra of the outermost surface of the conductive layer is 0.1 nm or more and 10 nm or less,
A conductive film roll with a protective film, wherein the outermost surface of the protective film has a surface roughness Ra of 100 nm or more and 500 nm or less.

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