JP7430424B2 - Gas suction device and laser processing device - Google Patents

Description

The present invention relates to a gas suction device and a laser processing device.

A laser processing device that uses laser light as energy is a device that performs processing such as surface treatment, welding, and cutting by irradiating a target object with laser light. For example, in a laser welding device, a laser beam is focused by a lens and irradiated onto a joint portion of an object. As a result, the portions irradiated with the laser beam are heated and melted and bonded. At this time, in order to prevent oxidation of the welding location, an inert gas (shielding gas) is blown onto the welding location along with laser light irradiation. In addition, in the laser processing apparatus, flying objects such as dust are generated from the processing area, so it is necessary to perform the processing while sucking this up.

Patent Document 1 discloses a laser welding device that suppresses variations in the cross-sectional shape of beads. This laser welding apparatus includes a shielding gas supply means for supplying shielding gas to the welding part, a light intensity measuring means for measuring the light intensity of plasma light emitted from the welding part, and a light intensity measuring means for measuring the light intensity of plasma light emitted from the welding part. and a change rate calculation means for calculating the change rate of the light intensity, and the gas supply amount control means controls the flow rate of the shielding gas supplied to the welding portion according to the calculated change rate of the light intensity.

Patent Documents 2 and 3 disclose laser welding devices that supply inert gas in a direction across laser light. Patent Documents 4 to 7 disclose laser welding apparatuses that supply shielding gas when welding with laser light and suck material that evaporates and scatters from the welding location.

Patent Documents 8 and 9 disclose that an inert gas nozzle directed toward the welded material is installed at the focused laser irradiation port of the laser welding head in order to suppress the formation of an oxide film or the entrainment of gas in the welded portion of the welded material. Disclosed is a configuration in which the inert gas nozzle is provided coaxially, and one or more shield gas nozzles are provided on the outer peripheral side of the inert gas nozzle.

JP2016-093825A JP2018-023986A Japanese Patent Application Publication No. 2018-065154 Japanese Patent Application Publication No. 2011-194442 Japanese Patent Application Publication No. 10-305376 Japanese Patent Application Publication No. 10-309900 Japanese Patent Application Publication No. 10-309900 Japanese Patent Application Publication No. 2001-314985 Japanese Patent Application Publication No. 2001-321976

However, when processing is performed by irradiating energy such as a laser beam, if flying objects such as dust generated from the treatment area cannot be efficiently sucked, the energy will be blocked by the flying objects. In addition, when both supplying inert gas and suctioning the flying debris, it is necessary to perform completely opposite operations such as supplying and suctioning the gas. If such gas supply and suction are performed simultaneously within the same space, the respective roles may not be fully fulfilled. For example, if the suction is stronger than the supply of inert gas, the inert gas will be sucked in before a sufficient amount of inert gas reaches the treatment location, which will reduce the oxidation suppressing effect. On the other hand, if the suction is weak, the area around the processing area will be filled with dust and smoke from scattered materials, causing impurities to adhere to surrounding components and a decline in processing quality due to attenuation of the laser beam.

An object of the present invention is to provide a gas supply suction device, a suction device, and a laser processing device that can suppress deterioration in processing quality.

In order to solve the above problems, one form of the present invention is a gas supply suction device that is arranged between a target object and an irradiation device that irradiates energy to the target object, and supplies and sucks gas, A first cylindrical part extending in the energy irradiation direction, a second cylindrical part arranged to surround the outer periphery of the first cylindrical part, and a supply supplying the first gas along the inner periphery of the first cylindrical part. and a suction path for sucking gas along the inner periphery of the second cylindrical portion.

According to such a configuration, when irradiating the target object with energy, the first gas is supplied from the supply path, and the gas is sucked through the suction path. Since the first gas is supplied along the inner periphery of the first cylindrical portion, an inner rotating airflow of the first gas is formed within the first cylindrical portion. Further, by suctioning the gas in the suction path, an outer rotating airflow is formed in which the gas rotates along the inner periphery of the second cylindrical portion. Therefore, the first gas can be blown toward the object by the inner rotating airflow formed inside the first cylindrical part, and the gas can be sucked into the suction path by the outer rotating airflow formed outside the first cylinder part.

In the gas supply suction device, the wall member has a window portion through which energy passes, is provided at one end side of the first cylindrical portion and the second cylindrical portion, and closes the space between the first cylindrical portion and the second cylindrical portion. You may also have more. As a result, one end side of the first cylindrical part and the second cylindrical part is closed by the wall member, so the first gas can be efficiently injected from one end side to the other end side, and the first gas can be injected efficiently from the other end side to the one end side. This allows efficient gas suction.

In the gas supply suction device, the other end of the second cylindrical portion may be located closer to the object than the other end of the first cylindrical portion. This makes it possible to cover the periphery of the processing portion of the object with the second cylindrical portion, and to secure a space at the other end of the first cylindrical portion for supplying and suctioning gas.

The gas supply suction device further includes a third cylinder part disposed inside the first cylinder part, and when viewed in the irradiation direction, the first gap, which is the gap between the first cylinder part and the third cylinder part, is a gap between the first cylinder part and the third cylinder part. The second gap may be narrower than the second gap between the first cylinder part and the second cylinder part. Thereby, by supplying the first gas to the first gap, which is the gap between the third cylindrical part and the first cylindrical part, it is possible to increase the flow velocity of the inner rotating airflow formed in the first cylindrical part.

In the above gas supply/suction device, it is preferable that the flow rate of the first gas in the supply path is faster than the flow rate of gas suction in the suction path. Furthermore, in this case, it is preferable that the flow rate of the first gas in the supply path is lower than the flow rate of gas suction in the suction path. This makes it possible to increase the flow velocity of the inner rotating airflow caused by the first gas and to suck a sufficient amount of gas using the outer rotating airflow.

One aspect of the present invention is a suction device that is disposed between a target object and an irradiation device that irradiates the target object with energy, and that sucks gas, the first cylindrical portion extending in the energy irradiation direction. a second cylinder part arranged to surround the outer periphery of the first cylinder part; a first suction path for sucking gas inside the first cylinder part; and a first suction path for sucking gas inside the first cylinder part; This is a suction device including a second suction path for suctioning.

According to such a configuration, when irradiating the target object with energy, gas is suctioned through the first suction path and the second suction path. By suctioning the gas in the first suction path, an inner suction airflow is formed in which gas inside the first cylindrical portion is suctioned. The inner suction airflow is an inner rotational airflow that rotates along the inner periphery of the first cylindrical portion, or an inner linear airflow that is drawn linearly inside the first cylindrical portion. Further, by suctioning the gas in the suction path, an outer rotating airflow is formed in which the gas rotates along the inner periphery of the second cylindrical portion. Therefore, gas can be sucked into the first suction path by the inner suction airflow formed inside the first cylinder part, and gas can be sucked into the second suction path by the outer rotational airflow formed outside the first cylinder part.

In the above suction device, the other end of the first cylindrical portion may be located closer to the object than the other end of the second cylindrical portion. As a result, dust and the like generated near the processing area of the object can be effectively sucked by the first cylindrical part, and dust and the like spread around the area can be suctioned by the second cylindrical part.

One aspect of the present invention is a laser processing apparatus that includes a laser emission head that emits laser light to irradiate a target object, and the gas supply and suction device that is disposed above the target object. In this laser processing apparatus, when the laser beam is irradiated onto the target object through the inside of the first cylinder part, the first gas is supplied from the supply path to form an inner rotating airflow of the first gas in the first cylinder part. At the same time, an outer rotating airflow is formed within the second cylindrical portion by gas suction in the suction path.

According to such a configuration, when the target object is irradiated with the laser beam, the first gas can be blown toward the target object by the inner rotating airflow formed inside the first cylinder part, and the first gas can be blown toward the target object by the inner rotating airflow formed inside the first cylinder part. The outer rotating airflow allows gas containing scattered substances such as dust generated from the irradiation area to be efficiently sucked into the suction path.

One aspect of the present invention is a laser processing apparatus that includes a laser emitting head that emits laser light to irradiate a target object, and the above-mentioned suction device that is disposed above the target object. In this laser processing device, when a laser beam is irradiated onto a target object through the inside of the first cylindrical part, an inner rotating airflow is formed in the first cylindrical part by gas suction in the first suction path, and a second suction An outer rotating air flow is formed in the second cylinder part by gas suction in the passage.

According to such a configuration, when a target object is irradiated with a laser beam, the gas containing scattered substances such as dust that flies up directly above the irradiation point of the laser beam is efficiently removed by the inner rotating airflow formed in the first cylinder part. Not only can suction be performed well, but also gas containing scattered substances such as dust leaked to the outside can be efficiently suctioned by the outer rotating airflow.

According to the present invention, it is possible to provide a gas supply suction device, a suction device, and a laser processing device that can suppress deterioration in processing quality.

FIG. 1 is a schematic perspective view showing a configuration example of a laser processing apparatus. 1 is a schematic cross-sectional view showing a configuration example of a laser processing apparatus. FIG. 2 is a schematic cross-sectional view (part 1) illustrating a gas supply suction device. FIG. 2 is a schematic cross-sectional view (part 2) illustrating the gas supply suction device. FIG. 2 is a schematic cross-sectional view (part 1) illustrating the flow of gas by the gas supply suction device. FIG. 3 is a schematic cross-sectional view (part 2) illustrating the flow of gas by the gas supply suction device. FIG. 7 is a schematic cross-sectional view illustrating a gas supply suction device according to a second embodiment. FIG. 7 is a schematic cross-sectional view illustrating a gas supply suction device according to a third embodiment. FIG. 7 is a schematic cross-sectional view illustrating a suction device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view illustrating a suction device according to a fifth embodiment.

Embodiments of the present invention will be described below based on the drawings. In the following description, the same members are given the same reference numerals, and the description of the members that have been described once will be omitted as appropriate.

(First embodiment)
FIG. 1 is a schematic perspective view showing a configuration example of a laser processing apparatus.
FIG. 2 is a schematic cross-sectional view showing a configuration example of a laser processing apparatus.
A laser processing apparatus 100 shown in FIG. 1 is an apparatus that performs predetermined processing on a target object W using the energy of a laser beam LS. In this embodiment, a laser welding device for welding a target object W is taken as an example.

The laser processing apparatus 100 includes a laser emission head 110 that emits a laser beam LS to be irradiated onto an object W, and a gas supply suction device 1 disposed between the object W and the laser emission head 110. The laser emission head 110 is an example of an irradiation device that irradiates the object W with energy (laser light LS). The laser emitting head 110 includes a light source 111 that generates a laser beam LS, and an optical system 112 that focuses the laser beam LS emitted from the light source 111.

For example, a YAG laser (solid-state laser) is used as the light source 111 in the laser welding device. An optical fiber may be provided between the light source 111 and the optical system 112. Further, the light source 111 may be other than a YAG laser (solid-state laser), such as a fiber laser, a CO ₂ laser (gas laser), or a semiconductor laser. The laser beam LS emitted from the light source 111 passes through the optical system 112 and is focused on the processing location P of the object W. In the laser welding device, a joining location, which is a processing location P, is irradiated with a laser beam LS to melt and join. Continuous processing may be performed by changing the relative position between the object W and the irradiation position of the laser beam LS.

(Configuration of gas supply suction device)
The gas supply suction device 1 used in the laser processing apparatus 100 is arranged between the laser emission head 110 and the object W. That is, the gas supply suction device 1 is attached to the side of the target object W of the laser emission head 110, and is arranged so as to surround the processing location P when processing with the laser beam LS.

In the laser welding equipment, inert gas (nitrogen (N ₂ ), argon (Ar), helium (He), etc.) is supplied toward the processing area P where the laser beam LS is irradiated to suppress oxidation of the welding area. be done. The gas supply/suction device 1 supplies the first gas A1, which is, for example, an inert gas, toward the processing location P, and sucks the gas in and around the processing location P. For convenience of explanation, the gas to be sucked is also referred to as second gas A2. The second gas A2 includes the air around the processing location P, materials scattered from the object W during welding, smoke, dust, and the like. The second gas A2 also includes the first gas A1 that is injected toward the processing location P and bounces off the object W.

The gas supply suction device 1 includes a first cylindrical portion 10 extending in the irradiation direction of the laser beam LS, a second cylindrical portion 20 arranged to surround the outer periphery 10b of the first cylindrical portion 10, and a first cylindrical portion. A supply path 50 that supplies the first gas A1 along the inner periphery 10a of the second cylindrical portion 20, and a suction path 60 that suctions the gas along the inner periphery 20a of the second cylindrical portion 20.

The first cylindrical portion 10 is preferably cylindrical or conical, and the second cylindrical portion 20 is preferably cylindrical, and are arranged concentrically around the optical axis of the laser beam LS. One end side of the first cylindrical part 10 and the second cylindrical part 20 (the side far from the object W) is connected to the wall member 40, and the other ends 10c and 20c (the side close to the object W) are open. Thereby, on one end side of the first cylindrical part 10 and the second cylindrical part 20, the space between the first cylindrical part 10 and the second cylindrical part 20 is closed by the wall member 40.

A window portion 45 is provided in the central portion of the wall member 40. The window portion 45 may be an opening or may be sealed with a material that transmits the laser beam LS. The laser beam LS enters into the gas supply/suction device 1 through this window portion 45, and is irradiated onto the processing location P of the object W from the open end side. The first cylindrical portion 10 is provided in a cylindrical shape extending in the irradiation direction of the laser beam LS with the window portion 45 as the center. Further, the second cylindrical portion 20 has an inner diameter larger than the outer diameter of the first cylindrical portion 10, and, like the first cylindrical portion 10, is provided in a cylindrical shape extending in the irradiation direction of the laser beam LS. As a result, a multiple cylinder structure is formed by the first cylinder part 10 and the second cylinder part 20, and a donut-shaped space is created between the outer circumference 10b of the first cylinder part 10 and the inner circumference 20a of the second cylinder part 20. configured.

The first gas A1 is supplied into the cylinder of the first cylinder part 10 from the supply path 50. The supply path 50 has a pipe shape, for example, and serves to feed the first gas A1 into the cylinder of the first cylinder portion 10 from the outside. The first cylindrical portion 10 is provided with a first port 10p, and a supply path 50 is connected to the first port 10p. The supply path 50 passes through the second cylindrical portion 20, for example, and is connected to the first port 10p of the first cylindrical portion 10. The supply path 50 is connected to the first port 10p so as to extend in the tangential direction of the inner circumference 10a of the first cylindrical portion 10.

The second cylindrical portion 20 is provided with a second port 20p. A suction path 60 is connected to the second port 20p of the second cylindrical portion 20. The suction path 60 is connected to the second port 20p so as to extend in the tangential direction of the inner circumference 20a of the second cylinder portion 20. The opening diameter of the second port 20p is larger than the opening diameter of the first port 10p. The second gas A2 in the second cylinder portion 20 is sucked into the suction path 60 from the second port 20p and discharged to the outside.

Both the first port 10p and the second port 20p are provided at one end side of the first cylindrical part 10 and the second cylindrical part 20 (the side far from the object W, the side where the wall member 40 is provided). Preferably.

The third cylindrical portion 30 may be provided inside the first cylindrical portion 10 as in the gas supply suction device 1 according to the present embodiment. One end side of the third cylindrical portion 30 is connected to the wall member 40 . The length of the third cylindrical portion 30 from the wall member 40 is shorter than the length of the second cylindrical portion 20 from the wall member 40. The third cylindrical portion 30 is provided at a position facing the first port 10p. Thereby, the first gas A1 supplied from the first port 10p is sent between the inner periphery 10a of the first cylindrical portion 10 and the outer periphery 30b of the third cylindrical portion 30. The shape of the third cylinder portion 30 is preferably cylindrical or conical.

FIG. 3 is a schematic cross-sectional view (part 1) illustrating the gas supply suction device.
FIG. 3 shows a cross-sectional view of the first cylindrical portion 10 and the second cylindrical portion 20 viewed from the other end side (open end side).
The position of the first port 10p of the first cylindrical part 10 and the position of the second port 20p of the second cylindrical part 20 are defined by the center (the center of the cylinder, the center of the window part 45, and the optical axis of the laser beam LS). ) are provided on opposite sides of each other. That is, the first port 10p is provided offset to one side with respect to the center, and the second port 20p is provided offset to the other side with respect to the center.

When the first gas A1 is supplied from the supply path 50 and sent into the first cylindrical part 10 from the first port 10p, the first gas A1 rotates along the inner periphery 10a of the first cylindrical part 10 while moving toward the other end. (open end side). That is, the first gas A1 is fed into the first cylindrical portion 10 from a tangential extension of the inner periphery 10a of the first cylindrical portion 10, hits the inner periphery 10a, and is supplied while rotating in a swirling manner.

On the other hand, when gas is suctioned through the suction path 60, the second gas A2 is sucked in from the other end side (open end side) of the second cylinder part 20, and while rotating along the inner circumference 20a of the second cylinder part 20, It is sucked up toward the second port 20p. That is, by suctioning the second gas A2 in the tangential direction of the inner periphery 20a of the second cylindrical portion 20 through the suction path 60, the second gas A2 swirls along the inner periphery 20a within the second cylindrical portion 20. It will be sucked up as it rotates. Then, it is discharged to the outside from the second port 20p via the suction path 60.

FIG. 4 is a schematic cross-sectional view (part 2) illustrating the gas supply suction device.
FIG. 4 shows a cross-sectional view of the gas supply suction device 1 viewed from the side.
In the gas supply suction device 1, the other end 20c of the second cylindrical portion 20 is arranged at a position closer to the object W than the other end 10c of the first cylindrical portion 10. That is, the extended length of the second cylindrical portion 20 is shorter than the extended length of the first cylindrical portion 10. Thereby, the distance h1 between the other end 20c of the second cylindrical portion 20 and the object W becomes narrower than the distance h2 between the other end 10c of the first cylindrical portion 10 and the object W. As a result, the periphery of the processing point P of the object W can be covered with the second cylindrical part 20, and a space can be secured in the cylinder on the other end 10c side of the first cylindrical part 10 for supplying and suctioning gas. .

Further, the first gap d1, which is the gap between the first cylindrical part 10 and the third cylindrical part 30, is narrower than the second gap d2, which is the gap between the first cylindrical part 10 and the second cylindrical part 20. You can. As a result, by supplying the first gas A1 to the first gap d1, which is the gap between the third cylindrical part 30 and the first cylindrical part 10, it is possible to increase the speed of the airflow rotating within the first cylindrical part 10. can.

(Gas flow by gas supply suction device)
Next, the flow of gas by the gas supply suction device 1 will be explained in detail.
FIG. 5 is a schematic cross-sectional view (Part 1) illustrating the flow of gas by the gas supply suction device. FIG. 5 illustrates the flow of gas in a cross-sectional view of the gas supply/suction device 1 viewed from the side.
FIG. 6 is a schematic cross-sectional view (part 2) illustrating the flow of gas by the gas supply suction device. FIG. 6 illustrates the gas flow in a cross-sectional view seen from the other end side (open end side) of the first cylindrical part 10 and the second cylindrical part 20.

First, the flow when gas is supplied will be explained.
When the first gas A1 is supplied from the supply path 50, the first gas A1 is sent into the first cylindrical portion 10 from the first port 10p. Here, since the first port 10p is offset with respect to the center of the first cylindrical portion 10, the first gas A1 is supplied while rotating along the inner circumference 10a of the first cylindrical portion 10. In the example shown in FIG. 6, the first gas A1 rotates counterclockwise within the first cylindrical portion 10, forming an inner rotating airflow RA1.

Note that when the third cylinder part 30 is provided inside the first cylinder part 10, the supply flow path of the first gas A1 becomes narrower, and the flow rate of the first gas A1 supplied into the first cylinder part 10 decreases. can be increased. Thereby, compared to the case where the third cylinder part 30 is not provided, the flow velocity (rotational speed) of the inner rotating airflow RA1 formed in the first cylinder part 10 can be increased.

Since the space between the first cylindrical part 10 and the third cylindrical part 30 on one end side is closed by the wall member 40, by supplying the first gas A1 from the supply path 50, the inner rotation by the first gas A1 is prevented. The airflow RA1 advances toward the other end (target W side) that is the open end of the first cylindrical portion 10. That is, the first gas A1 turns into a spiral inner rotating airflow RA1 and blows out toward the other end.

Next, the flow when gas is sucked will be explained.
When gas is suctioned through the suction path 60, the second gas A2 is drawn into the suction path 60 from the second port 20p. Here, since the second port 20p is offset from the center of the second cylindrical portion 20, the second gas A2 is sucked while rotating along the inner circumference 20a of the second cylindrical portion 20. Since the second port 20p is offset from the center to the side opposite to the first port 10p, the direction of rotation due to the suction of the second gas A2 is counterclockwise, which is the same as the direction of rotation due to the supply of the first gas A1. The airflow rotates in the opposite direction, forming an outer rotating airflow RA2.

Since one end side of the second cylindrical portion 20 is closed by the wall member 40, the second gas A2 is sucked from the other end 20c side which is an open end, and becomes an outer rotating airflow RA2 within the second cylindrical portion 20. The second cylindrical portion 20 then moves from the other end 20c side (object W side) to the one end side. That is, the second gas A2 becomes a spiral outer rotating airflow RA2 and is sucked up toward one end.

In the gas supply suction device 1, the supply of the first gas A1 and the suction of the second gas A2 are controlled by the control unit 80. At this time, it is preferable that the control unit 80 performs control to make the flow rate of the first gas A1 from the supply path 50 faster than the flow rate of the suction of the second gas A2 in the suction path 60. Thereby, the flow velocity of the inner rotating airflow RA1 caused by the first gas A1 can be made higher than the flow velocity of the outer rotating airflow RA2 caused by the second gas A2.

In addition to controlling the flow rates of the first gas A1 and the second gas A2 described above, the control unit 80 also controls the flow rate of the first gas A1 in the supply path 50 and the suction of the second gas A2 in the suction path 60. It is preferable to control the flow rate to be lower than the flow rate. Thereby, the flow velocity of the inner rotating airflow caused by the first gas A1 can be made higher than the flow velocity of the outer rotating airflow caused by the second gas A2, and a sufficient amount of the second gas A2 can be sucked by the outer rotating airflow.

By controlling the balance between the supply of the first gas A1 and the suction of the second gas A2 by the control unit 80, the air pressure inside the first cylindrical section 10 becomes relatively high with respect to the air pressure inside the second cylindrical section 20. . Further, the air pressure inside the second cylinder portion 20 is negative with respect to the air pressure outside the gas supply/suction device 1 (for example, atmospheric pressure). As a result, the first gas A1 supplied into the first cylindrical portion 10 becomes a swirling inner rotating airflow RA1 and is blown out from the other end 10c side toward the processing location P. That is, the first gas A1 blown out from the other end 10c of the first cylindrical portion 10 is not drawn into the outer rotating airflow RA2 before reaching the processing location P, and reaches the processing location P reliably.

Further, the second gas A2 in the cylinder on the other end 20c side of the second cylinder portion 20 becomes an outer rotating airflow RA2 and is sucked up. At this time, the first gas A1 that comes out from the other end 10c of the first cylindrical part 10 and is blown onto the processing area P spreads outward after hitting the object W (the processing area P), and the second cylindrical part 20 It gets caught up in the outer rotating airflow RA2. The outer rotating airflow RA2 caused by the second gas A2 is sucked up in a spiral along the inner periphery 20a of the second cylindrical portion 20, and is discharged from the suction path 60 to the outside.

(Laser welding operation)
Next, a laser welding operation (laser processing method) by the laser processing apparatus 100 will be explained.
First, as described above, the gas supply/suction device 1 supplies the first gas A1 and sucks the second gas A2. Next, the gas supply suction device 1 is arranged so that the processing location P is located below the center position. As a result, the first gas A1 is blown onto the processing location P by the inner rotating airflow RA1, and the second gas A2 around the processing location P is sucked up by the outer rotating airflow RA2.

Next, in this state, the laser beam LS is emitted from the laser emitting head 110. The laser beam LS passes through the window portion 45, travels through the center of the first cylindrical portion 10 (third cylindrical portion 30), and is irradiated onto the processing location P. As a result, the object W at the processing location P is welded by the energy of the laser beam LS.

Welding generates scattered substances such as scattered materials of the object W, smoke, and dust from the processing location P. These scattered substances generated from the processing location P are caught in the outer rotating air current as the second gas A2, and are sucked up while swirling inside the second cylindrical part 20. Then, it is sucked into the suction path 60 from the second port 20p and discharged to the outside.

Further, continuous welding is performed while moving the relative position between the irradiation position of the laser beam LS and the processing location P as necessary.

In such processing, the laser beam LS passes through the center of the inner rotating airflow RA1 caused by the first gas A1 and reaches the processing location P. At this time, since the flow velocity of the inner rotating airflow RA1 is faster than that of the outer rotating airflow RA2, the first gas A1 reaches the processing location P before being sucked into the outer rotating airflow RA2. In other words, the space between the first cylindrical portion 10 and the processing location P is predominantly filled with the first gas A1, which is an inert gas. Thereby, oxidation and the like during welding by the laser beam LS can be suppressed.

In addition, since the inside of the second cylindrical part 20 has a negative pressure than the inside of the first cylindrical part 10, the scattered substances generated from the processing part P are quickly sucked into the outer rotating airflow RA2 from the processing part P. It will continue to grow. Thereby, the scattered substances generated from the processing location P do not remain in the optical path of the laser beam LS or in the processing location P.

Therefore, according to this laser welding operation (laser processing method), the first gas A1 such as an inert gas can be reliably supplied to the processing location P, and the scattered substances generated from the processing location can be effectively sucked out from the outside. can be discharged to. Thereby, it is possible to suppress the laser beam LS from being attenuated by the scattered substances and the scattering substances from adhering to peripheral members such as the optical system 112, and it is possible to suppress deterioration in processing quality.

(Second embodiment)
FIG. 7 is a schematic cross-sectional view illustrating the gas supply suction device according to the second embodiment.
FIG. 7 shows a cross-sectional view of the gas supply/suction device 1B according to the second embodiment, viewed from the side.
The gas supply suction device 1B according to the second embodiment has a configuration in which the length of the first cylindrical portion 10 can be changed. For example, the first cylindrical portion 10 has a first portion 11 on one end side (wall member 40 side) and a second portion 12 on the other end 10c side (open end side). The second portion 12 can be expanded and contracted by sliding it. Thereby, the length of the first cylindrical portion 10 in the extending direction can be adjusted.

The longer the length of the first cylindrical portion 10 in the extending direction, the closer the position of the other end 10c is to the processing location P, making it easier to supply the first gas A1 to the processing location P. On the other hand, the shorter the length of the first cylindrical portion 10, the farther the other end 10c is from the processing location P, and the easier it is to suck in the scattered substances. By adjusting the length of the first cylindrical portion 10 in the extending direction, the balance between the supply of the first gas A1 and the suction of the second gas A2 can be changed.

In this embodiment, a configuration in which the length of the first cylindrical portion 10 in the extending direction is adjustable is illustrated, but a configuration in which the length in the extending direction of the second cylindrical portion 20 is adjustable may also be used. , the length of both the first cylindrical portion 10 and the second cylindrical portion 20 may be adjustable. Further, the length of the third cylindrical portion 30 in the extending direction may be configured to be adjustable.

(Third embodiment)
FIG. 8 is a schematic cross-sectional view illustrating a gas supply suction device according to the third embodiment.
FIG. 8 shows a cross-sectional view of the gas supply/suction device 1C according to the third embodiment, viewed from the side.
The gas supply suction device 1C according to the third embodiment has a configuration in which the shape of the other end 20c of the second cylinder portion 20 corresponds to the shape of the object W. For example, when the object W is curved or has a curved surface, the other end 20c of the second cylindrical portion 20 is configured to have a curved surface in accordance with this shape. As a result, the distance G1 between the other end 20c of the second cylindrical portion 20 and the surface of the object W becomes substantially constant, and variations in the suction of the second gas A2 from this distance G1 into the second cylindrical portion 20 can be suppressed. I can do it. When variations in suction are suppressed, it is possible to stably form an outer rotating airflow by the second gas A2.

In addition to making the other end 20c of the second cylindrical portion 20 correspond to the shape of the object W, the other end 10c of the first cylindrical portion 10 may also be made to correspond to the shape of the object W. Further, the other end 30c of the third cylindrical portion 30 may be made to correspond to the shape of the object W in the same manner.

As explained above, according to the first to third embodiments, it is possible to achieve both sufficient supply of the first gas A1 to the processing location P and efficient suction of the second gas A2 containing scattered substances. It becomes possible to provide the gas supply/suction device 1 and the laser processing device 100 that can suppress deterioration in processing quality.

(Fourth embodiment)
FIG. 9 is a schematic cross-sectional view illustrating a suction device according to a fourth embodiment.
The suction device 2 shown in FIG. 9 is a device that suctions gas using both the first cylindrical portion 10 and the second cylindrical portion 20. The suction device 2 is used, for example, in the laser processing device 100. In this case, the suction device 2 is arranged between the object W and the laser emission head 110.
The configuration of the suction device 2 is similar to the gas supply suction devices 1, 1B, and 1C described above, but a suction path 65 is connected to the first port 10p of the first cylindrical portion 10 instead of the supply path 50. Ru. Here, the suction path 65 connected to the first port 10p of the first cylindrical portion 10 is a first suction path, and the suction path 60 connected to the second port 20p of the second cylindrical portion 20 is a second suction path. It is.

Thereby, the gas in the first cylindrical portion 10 is sucked into the suction path 65 from the first port 10p and is discharged to the outside. At the same time, the gas in the second cylindrical portion 20 is sucked into the suction path 60 from the second port 20p and discharged to the outside.

In the suction device 2, when gas is suctioned through the suction path 65, the gas is drawn into the suction path 65 from the first port 10p. Here, since the first port 10p is offset with respect to the center of the first cylindrical portion 10, the gas is sucked while rotating along the inner circumference 10a of the first cylindrical portion 10. In the example shown in FIG. 9, the gas rotates counterclockwise within the first cylindrical portion 10, forming an inner rotating airflow RA1.

Note that if the third cylinder part 30 is provided inside the first cylinder part 10, the gas suction flow path becomes narrower, and the flow rate of the gas sucked by the first cylinder part 10 can be increased. Thereby, compared to the case where the third cylinder part 30 is not provided, the flow velocity (rotational speed) of the inner rotating airflow RA1 formed in the first cylinder part 10 can be increased. In addition, in the case of processing where a large amount of spatter is generated from the processing location P, such as laser welding or laser cutting, it is better to make the extension length of the first cylindrical part 10 longer than the extension length of the second cylindrical part 20. Sometimes it is advantageous. That is, the first cylindrical section 10 can effectively suck up spatter generated from the processing location P, and the second cylindrical section 20 can effectively suck up dust containing smoke spreading from the processing location P to the surrounding area.

When the suction path 65 performs gas suction and the suction path 60 performs gas suction, the gas in the second cylinder portion 20 is drawn into the suction path 60 from the second port 20p. Here, since the second port 20p is offset with respect to the center of the second cylindrical portion 20, the gas is sucked while rotating along the inner circumference 20a of the second cylindrical portion 20. Since the second port 20p is offset from the center to the side opposite to the first port 10p, the rotation direction of the gas in the second cylindrical portion 20 is the same as the rotation direction of the gas in the first cylindrical portion 10. The airflow rotates clockwise in the opposite direction to that of the airflow, resulting in an outer rotating airflow RA2.

In this way, the suction device 2 performs gas suction using both the first cylindrical portion 10 and the second cylindrical portion 20. At this time, since the inner diameter of the first cylindrical portion 10 is smaller than the inner diameter of the second cylindrical portion 20, the suction pressure due to the inner rotating airflow RA1 is higher than the suction pressure due to the outer rotating airflow RA2.
Therefore, the suction by the inner rotating airflow RA1 generated above the processing point P becomes the main suction, and the suction by the outer rotating airflow RA2 generated around this becomes secondary, so that efficient suction can be performed as a whole.

For example, when performing ablation processing or film removal processing using the laser beam LS, dust suction by the suction device 2 is effective in order to prevent fine dust generated from the processing location P from adhering to the surface of the object W. In the suction device 2, the scattered substances such as dust that are kicked up during laser processing are strongly pulled up by the inner rotating airflow RA1 generated directly above the processing point P, and the scattered substances that cannot be removed are transferred to the outer rotating airflow RA2. It can be raised by

In manufacturing processes for electronic components, displays, etc., coatings on materials may be removed using laser light LS. A problem is that dust generated during laser processing falls onto the surface of the material and remains on the surface. By using the suction device 2 according to this embodiment, dust and the like that fly up during laser processing can be sucked directly upward, and it is possible to prevent the dust and the like from adhering to the material.

According to the fourth embodiment described above, the suction device 2 and the laser processing device 100 can efficiently suck up scattered substances such as dust generated from the processing location P, and can suppress deterioration in processing quality. It becomes possible to provide

Note that in the suction device 2 according to the fourth embodiment, when it is desired to increase the amount of gas suction by the first cylindrical portion 10, the inner diameters of the first port 10p and the suction path 65 are made to be approximately equal to the inner diameter of the first cylindrical portion 10. You can make it bigger. In this case, the other end 30c of the third cylindrical portion 30 is extended to the side closer to the object W than the first port 10p and the suction path 65. In this configuration, in the inner suction airflow of the first cylindrical portion 10, the component (inner linear airflow) that is directly drawn into the suction path 65 is more dominant than the rotational component (inner rotational airflow RA1).

Further, in the suction device 2, at least one of the other end 10c of the first cylindrical portion 10 and the other end 30c of the third cylindrical portion 30 is arranged at a position closer to the object W than the other end 20c of the second cylindrical portion 20. You can leave it there. Thereby, dust such as spatter generated from the processing location P can be effectively sucked by the first cylindrical portion 10, and diffusion to the surrounding area can be suppressed.

(Fifth embodiment)
FIG. 10 is a schematic cross-sectional view illustrating a suction device according to a fifth embodiment.
The suction device 2B shown in FIG. 10 is a device that suctions gas using both the first cylindrical portion 10 and the second cylindrical portion 20, similar to the suction device 2 shown in FIG. The suction device 2B is used, for example, in the laser processing device 100.
In the suction device 2B, the inner diameter of the suction path 65 connected to the first cylindrical portion 10 is set larger than the inner diameter of the suction path 65 in the suction device 2. The maximum inner diameter of the suction path 65 in the suction device 2B is the inner diameter of the first cylindrical portion 10.

As a result, the gas inside the first cylindrical portion 10 is sucked linearly along the inside of the cylinder, and is discharged to the outside from the suction path 65 via the first port 10p. At the same time, the gas in the second cylindrical portion 20 is sucked into the suction path 60 from the second port 20p and discharged to the outside.

In the suction device 2B, the inner diameter of the suction path 65 is the same as the inner diameter of the first cylindrical portion 10, and the first port 10p is not offset with respect to the center of the first cylindrical portion 10. Therefore, the inner suction airflow of the first cylindrical portion 10 becomes an inner linear airflow RA3 that is linearly sucked inside. Therefore, the gas within the first cylindrical portion 10 can be sucked straight and efficiently discharged from the suction path 65 to the outside.

In the example shown in FIG. 10, it is preferable that the other end 10c of the first cylindrical portion 10 is located closer to the object W than the other end 20c of the second cylindrical portion 20. Thereby, dust such as spatter generated from the processing location P can be effectively sucked by the first cylindrical portion 10, and diffusion to the surrounding area can be suppressed. Further, the position of the other end 30c of the third cylindrical portion 30 is preferably between the other end 10c of the first cylindrical portion 10 and the end of the first port 10p on the object W side. Thereby, while guiding dust and the like generated from the processing location P to the suction path 65, it is possible to suppress air intake from the window portion 45 to a minimum.

According to the fifth embodiment described above, gas is linearly sucked in a portion close to the processing location P, and scattered substances such as dust generated from the processing location P can be efficiently sucked. In addition, dust and the like spread around the processing location P can be efficiently sucked by the outer rotating airflow RA2 of the second cylindrical portion 20. This makes it possible to provide the suction device 2B and the laser processing device 100 that can suppress deterioration in processing quality.

Although the present embodiment and its specific examples have been described above, the present invention is not limited to these examples. For example, the shapes of the first cylindrical portion 10, the second cylindrical portion 20, and the third cylindrical portion 30 may be other than a cylindrical shape, such as a polygonal cylindrical shape or an elliptical cylindrical shape. Moreover, the first cylindrical part 10, the second cylindrical part 20, and the third cylindrical part 30 do not necessarily have to be arranged concentrically. Moreover, although the rotation directions of the inner rotating airflow RA1 and the outer rotating airflow RA2 have been described as being counterclockwise, they may be clockwise, or the rotational directions of the inner rotating airflow RA1 and the outer rotating airflow RA2 may be opposite to each other. Further, a plurality of supply paths 50 may be connected to the first cylindrical portion 10, and a plurality of suction paths 60 may be connected to the second cylindrical portion 20.

Further, in the embodiments of the gas supply suction devices 1, 1B, and 1C, an example was shown in which the first gas A1 is supplied from the first cylinder part 10 and the second gas A2 is sucked in the second cylinder part 20, but the opposite is true. Alternatively, the first gas A1 may be supplied from the second cylindrical portion 20, and the second gas A2 may be sucked by the first cylindrical portion 10. In this case, the suction path 60 is connected to the first port 10p of the first cylindrical portion 10, and the supply path 50 is connected to the second port 20p of the second cylindrical portion 20. Furthermore, the first gas A1 and the second gas A2 may contain a substance other than gas, such as a liquid.

Further, in the suction devices 2 and 2B, the length in the extending direction of at least one of the first cylindrical portion 10, the second cylindrical portion 20, and the third cylindrical portion 30 may be configured to be adjustable.

Furthermore, the present invention may include additions, deletions, and design changes to the above-mentioned embodiments or specific examples thereof by those skilled in the art as appropriate, or combinations of features of each embodiment as appropriate. As long as it has the gist, it is included within the scope of the present invention.

This application includes the configuration of the invention described in the following supplementary notes.
(Additional note)
a first cylindrical portion;
a second cylindrical portion arranged to surround the outer periphery of the first cylindrical portion;
a first flow path that supplies or sucks a first medium along the inner periphery of the first cylindrical portion;
a second channel for sucking or supplying a second medium along the inner periphery of the second cylindrical portion;
Media supply suction device with.
Here, the medium includes substances in various states such as gas, liquid, and gel. When the medium is supplied through the first flow path, the medium is sucked through the second flow path, and when the medium is sucked through the first flow path, the medium is supplied through the second flow path. The second medium includes the medium in the second cylindrical portion and the first medium.

The gas supply/suction device 1 according to the present embodiment is capable of processing devices other than the laser processing device 100, such as processing devices (heating devices, etc.) that use energy other than lasers, three-dimensional modeling devices (3D printers), etc. It can be suitably used in a processing device that supplies and suctions gas during the process.

1, 1B, 1C... Gas supply suction device 2, 2B... Suction device 10... First cylindrical portion 10a... Inner periphery 10b... Outer periphery 10c... Other end 10p... First port 11... First part 12... Second part 20... Second cylindrical part 20a...Inner periphery 20c...Other end 20p...Second port 30...Third cylindrical part 30b...Outer periphery 30c...Other end 40...Wall member 45...Window part 50...Supply paths 60, 65...Suction path 80... Control unit 100... Laser processing device 110... Laser emission head 111... Light source 112... Optical system A1... First gas A2... Second gas G1... Interval LS... Laser beam P... Processing location RA1... Inner rotating airflow RA2... Outer rotating airflow W...Object d1...First gap d2...Second gap h1, h2...Interval

Claims (5)

A gas suction device that is arranged between a target object and an irradiation device that irradiates energy to the target object, and that sucks gas,
a first cylindrical portion extending in the energy irradiation direction;
a second cylindrical portion arranged to surround the outer periphery of the first cylindrical portion;
a first suction path that suctions gas inside the first cylindrical portion;
a second suction path that suctions gas along the inner periphery of the second cylindrical portion;
Equipped with
The first suction path is connected to a first port provided in the first cylinder part,
The second suction path is connected to a second port provided in the second cylinder part,
The position of the first port is offset with respect to the center of the cylinder in the first cylinder part,
The position of the second port is offset with respect to the center of the cylinder in the second cylinder part,
A gas suction device that forms an inner rotating airflow in the first cylindrical part by suctioning gas in the first suction path, and forms an outer rotating airflow in the second cylindrical part by suctioning gas in the second suction path. . The gas suction device according to claim 1, wherein the other end of the second cylindrical portion is located closer to the object than the other end of the first cylindrical portion. a third cylindrical part disposed inside the first cylindrical part and through which the energy passes;
It has a window portion through which the energy passes, and is provided at one end side of the first cylindrical portion, the second cylindrical portion, and the third cylindrical portion, between the first cylindrical portion and the second cylindrical portion, and further comprising a wall member closing between the first cylindrical part and the third cylindrical part,
The third cylindrical portion is provided at a position facing the first port,
The gas is swirled between the third cylindrical part and the first cylindrical part by suctioning the gas in the first suction passage to form an inner rotating airflow in the first cylindrical part, and the second suction passage 2. The gas suction device according to claim 1, wherein the gas is swirled between the first cylindrical portion and the second cylindrical portion by suctioning the gas at the second cylindrical portion, thereby forming an outer rotating airflow within the second cylindrical portion. The position of the first port and the position of the second port are offset to opposite sides with respect to the centers of the cylinders in the first cylinder part and the second cylinder part, and 4. The gas suction device according to claim 3, wherein the rotational directions of the outer rotating airflows are opposite to each other. a laser emitting head that emits a laser beam to irradiate a target object;
The gas suction device according to any one of claims 1 to 4, disposed between the target object and the laser emitting head;
Laser processing equipment equipped with

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