JP7428331B2 - パウチセルの内圧測定用の軟性印刷回路基板及びパウチセルの内圧測定方法 - Google Patents
パウチセルの内圧測定用の軟性印刷回路基板及びパウチセルの内圧測定方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 25
- 239000000463 material Substances 0.000 claims description 26
- 230000001681 protective effect Effects 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000009530 blood pressure measurement Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007405 data analysis Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 28
- 239000007789 gas Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 10
- 239000003792 electrolyte Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-VENIDDJXSA-N lead-201 Chemical compound [201Pb] WABPQHHGFIMREM-VENIDDJXSA-N 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910018095 Ni-MH Inorganic materials 0.000 description 1
- 229910018477 Ni—MH Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/4285—Testing apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/30—Arrangements for facilitating escape of gases
- H01M50/342—Non-re-sealable arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/105—Pouches or flexible bags
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
- Secondary Cells (AREA)
- Battery Mounting, Suspending (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (12)
- 複数の導体線と、絶縁性及び屈曲性を有し、前記導体線を囲む絶縁フィルムと、を備えるパウチセルの内圧測定用の軟性印刷回路基板であって、
前記軟性印刷回路基板は、
圧力センサーが実装されているセンシング部と、
各前記導体線と接続されたコネクターピンが設けられたボード部と、
前記センシング部から前記ボード部まで延びて形成される延長部と、を含み、
前記延長部は、予め決められた区間に前記絶縁フィルムの表面を囲む金属材質の保護膜を備える、軟性印刷回路基板。 - 前記保護膜が金または銅めっき膜である、請求項1に記載の軟性印刷回路基板。
- 前記センシング部が、内圧測定対象であるパウチセルに形成されるガスポケット部の幅と同一またはそれより小さい幅に形成され、
前記保護膜が、前記パウチセルに形成されるシーリング部の幅と同一またはそれより長く延びて形成される、請求項1または2に記載の軟性印刷回路基板。 - 前記センシング部がパリレンコーティングされる、請求項1から3のいずれか一項に記載の軟性印刷回路基板。
- 前記センシング部において前記圧力センサーと前記導体線がはんだ付けされる部分は、アンダーフィルまたはコンフォーマルコーティングが加えられる、請求項1から4のいずれか一項に記載の軟性印刷回路基板。
- 前記圧力センサーが防水MEMS圧力センサーである、請求項1から5のいずれか一項に記載の軟性印刷回路基板。
- 前記センシング部が温度センサーをさらに備える、請求項1から6のいずれか一項に記載の軟性印刷回路基板。
- 前記センシング部は複数個であり、前記ボード部は一つである、請求項1から7のいずれか一項に記載の軟性印刷回路基板。
- 請求項1から8のいずれか一項に記載の軟性印刷回路基板を用いてパウチセルの内圧を測定するパウチセルの内圧測定方法であって、
前記パウチセルは、電極組立体の上部及び下部を各々覆う上部パウチシート及び下部パウチシートから構成されたパウチ外装材を含み、
前記センシング部を前記パウチセルの内部のガスポケット部に配置した状態で、前記保護膜を、前記上部パウチシート、前記下部パウチシートと共に熱溶着して前記パウチ外装材を密封する圧力センサー設置段階と、
前記ボード部にデータ分析装置を接続し、前記パウチセルに充電と放電を反復しながら前記パウチセルの内圧を測定する内圧測定段階と、を含む、パウチセルの内圧測定方法。 - 前記圧力センサー設置段階で、
前記センシング部を前記ガスポケット部に配置する前、前記パウチセルは前記上部パウチシートと前記下部パウチシートの周縁を熱溶着してシーリングするに際し、前記センシング部を挿入できるようにシーリングしなかった状態の未シーリング区間を備え、
前記センシング部を前記未シーリング区間から前記パウチ外装材の内部に入れた後、前記未シーリング区間を熱溶着して前記パウチ外装材を密封する、請求項9に記載のパウチセルの内圧測定方法。 - 前記未シーリング区間を熱溶着するに際し、前記延長部の保護膜の形状に対応する溝を備えた熱加圧ジグを用いて、前記上部パウチシートと前記保護膜と前記下部パウチシートとを一体で熱溶着する、請求項10に記載のパウチセルの内圧測定方法。
- 前記センシング部が二つであり、前記ボード部が一つである軟性印刷回路基板を用いて、
前記圧力センサーの設置段階で、前記パウチセルで正極リードが位置する側のガスポケット部に一つのセンシング部を配置し、負極リードが位置する側のガスポケット部に他の一つのセンシング部を配置する、請求項9から11のいずれか一項に記載のパウチセルの内圧測定方法。
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KR1020200184945A KR20220093841A (ko) | 2020-12-28 | 2020-12-28 | 파우치 셀 내압 측정용 연성인쇄회로기판 및 파우치 셀의 내부 압력 측정 방법 |
KR10-2020-0184945 | 2020-12-28 | ||
PCT/KR2021/019009 WO2022145816A1 (ko) | 2020-12-28 | 2021-12-14 | 파우치 셀 내압 측정용 연성인쇄회로기판 및 파우치 셀의 내부 압력 측정 방법 |
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JP4518591B2 (ja) * | 1999-05-31 | 2010-08-04 | 三洋電機株式会社 | 薄型電池を内蔵するパック電池 |
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CN102496750B (zh) * | 2011-12-20 | 2014-10-08 | 华为技术有限公司 | 电池 |
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- 2020-12-28 KR KR1020200184945A patent/KR20220093841A/ko active Search and Examination
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EP4181271A1 (en) | 2023-05-17 |
CN115917832A (zh) | 2023-04-04 |
WO2022145816A1 (ko) | 2022-07-07 |
US20230291017A1 (en) | 2023-09-14 |
JP2023529694A (ja) | 2023-07-11 |
EP4181271A4 (en) | 2024-10-23 |
KR20220093841A (ko) | 2022-07-05 |
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