JP7427382B2 - interposer - Google Patents

Description

The present invention relates to an interposer that is sandwiched between two electronic components (including a circuit board) and electrically connects the electronic components by contacting connection pads formed on each of the two electronic components.

2. Description of the Related Art Interposers that are sandwiched between two electronic components and electrically connect the electronic components have been known. This interposer includes a plate-shaped housing having a large number of arranged through holes, and a large number of contacts that are inserted into each of the large number of through holes and held by the housing.

Here, Patent Document 1 discloses an interposer that includes a contact in which an arm having a constant width extends vertically from a wide central portion in which a plastic body is overmolded except for the tip.

Special table 2016-503946 publication

The contacts constituting the interposer include a base portion that is disposed within the through hole of the housing and is held by the housing. The contact includes two contact beams extending from the base to the first and second surfaces of the housing, respectively.

The two contact beams are formed, for example, in the same shape as in Patent Document 1 listed above. In the case of this Patent Document 1, the two contact beams have a narrower width, that is, a tapered shape toward the tip end. Further, these contact beams are formed to have a narrower width than the base because it is necessary to arrange the base within the through hole. Further, the partition wall separating adjacent through holes needs to have a thickness of a predetermined value or more in order to maintain strength. Due to these circumstances, the distance between adjacent contacts is greater than the distance between the partition walls.

However, in order to improve electrical characteristics, it may be preferable to make two contacts adjacent in the width direction narrower than the thickness of the partition wall.

SUMMARY OF THE INVENTION An object of the present invention is to provide an interposer in which electrical characteristics are improved while maintaining a partition wall separating adjacent through holes of a housing to a predetermined thickness or more.

The interposer of the present invention that achieves the above object is
An interposer that is sandwiched between two electronic components and electrically connects the two electronic components by contacting connection pads formed on each of the two electronic components,
an upper surface facing upward that is a first electronic component side of the two electronic components; a lower surface facing downward that is a second electronic component side of the two electronic components; and an upper surface and a lower surface. a housing having a plurality of through-holes penetrating through the through-holes; a base having a press-fitting part protruding left and right that is responsible for press-fitting into the through-holes and spreading flat in the vertical direction and left-right direction; a first contact beam that extends outwardly and upwardly and has a first contact portion in contact with the first electric component at its tip portion, the maximum width in the left and right direction being wider than the maximum width in the left and right direction of the base; a second contact beam that is connected to the lower end and extends diagonally downward outward from the lower surface of the housing, has a second contact portion that contacts the second electrical component at the tip, and has a maximum width in the left and right sides that is narrower than the maximum width of the base; has multiple contacts with
The above-mentioned through hole is
a planar first inner wall surface that is in contact with the base after the press-fitting part is press-fitted into the through-hole ;
having a second inner wall surface and a third inner wall surface connected to the left and right edges of the first inner wall surface and facing each other;
The second inner wall surface and the third inner wall surface are
The first interval, which is the interval between the first portions of both the second inner wall surface and the third inner wall surface, which are adjacent to the first inner wall surface, is sufficient to allow the press -fit portion to bite into the wall surface. death,
The distance between the portions of both the second inner wall surface and the third inner wall surface adjacent to the first portion is such that the base portion after the press-fitting portion is press-fitted is the first portion in the thickness direction of the base portion. The gap is narrower than the first gap so as to be sandwiched between the inner wall surface and the inner wall surface.
The second inner wall surface and the third inner wall surface are provided with a second contact beam having a space between them that is wider than the maximum width of the second contact beam, and a second inner wall surface that is spaced apart from the base after the press-fitting part is press-fitted. The contact beam is characterized by having a narrower portion than the maximum width of the first contact beam.

In the case of the interposer of the present invention, the contact is inserted into the through hole from the narrow second contact beam side, and the base is press-fitted into the through hole. By doing so, an interposer with improved electrical characteristics can be realized while maintaining the partition walls between adjacent through holes to a predetermined thickness or more.

Here, in the interposer of the present invention, the first distance between the closest portions of the first contact beams of two adjacent contacts that are adjacent to each other in the width direction is the two through holes into which the bases of the two adjacent contacts are press-fitted. Preferably, the first contact beam is wide so that it is narrower than the thickness of the partition wall separating the holes.

The first contact beam does not need to be able to be inserted into the through hole. Therefore, by making the first contact beam wide so that the first interval is narrower than the thickness of the partition wall separating the two through holes, the electrical characteristics can be improved.

Further, in the interposer of the present invention, a portion of the first contact beam excluding the tip portion having the first contact portion has a uniform first width, and a portion of the second contact beam excluding the tip portion having the first contact portion has a uniform first width. Preferably, the portion excluding the tip portion having the contact portion has a uniform second width that is narrower than the first width.

When the first contact beam and the second contact beam are formed to have a uniform width, the contact beam is superior in high-speed signal transmission compared to the tapered contact beam as in Patent Document 1 mentioned above. Therefore, by employing this contact, an interposer excellent in high-speed signal transmission can be realized.

Furthermore, in the interposer of the present invention, it is preferable that the contacts have a structure that is symmetrical in the width direction.

The contact beam is pushed by the electronic component and deforms elastically. Here, if the contact has a structure that is symmetrical in the width direction, the force when pressed by an electric component is evenly distributed in the left and right directions in the width direction, so that buckling and the like are less likely to occur and high reliability can be ensured.

According to the present invention described above, an interposer is realized in which the partition wall separating adjacent through holes of the housing is maintained at a predetermined thickness or more and the electrical characteristics are improved.

FIG. 1 is a perspective view of an interposer according to an embodiment of the present invention. 2 is a diagram showing one contact forming the interposer shown in FIG. 1. FIG. 2 is a diagram showing a housing that constitutes the interposer shown in FIG. 1. FIG. It is a figure which showed the modification of a through-hole.

Embodiments of the present invention will be described below.

FIG. 1 is a perspective view of an interposer according to an embodiment of the present invention. Here, FIG. 1(A) is a perspective view of the housing with the first surface facing upward, and FIG. 1(B) is a perspective view of the housing with the second surface facing upward. For example, as many as 4,000 contacts are arranged in the interposer, but the same structure is repeated, and only a portion of them are shown here.

Interposer 10 includes a plate-shaped housing 20 and a plurality of contacts 30. The housing 20 is formed with a plurality of through holes 21 arranged in a grid pattern (see also FIG. 3), which penetrate through the first surface 20A and the second surface 20B. One contact 30 is press-fitted into each through hole 21.

FIG. 2 is a diagram showing one contact making up the interposer shown in FIG. 1. Here, FIG. 2(A) is a perspective view, and FIG. 2(B) is a front view.

Moreover, FIG. 3 is a diagram showing a housing that constitutes the interposer shown in FIG. 1. Here, FIG. 3(A) is a perspective view, and FIG. 3(B) is a plan view.

The contact 30 has a flat base 31 and a first contact beam 32 and a second contact beam 33 extending from the upper and lower ends of the base 31, respectively.

The base portion 31 is provided with a press-fit portion 311 that protrudes in the width direction. The press-fitting portion 311 is a portion that bites into the inner wall surface of the through-hole 21 when the contact 30 is press-fitted into the through-hole 21 and holds the contact 30 within the through-hole 21 .

This contact 30 is press-fitted into the through hole 21 from the first surface 20A side of the housing 20 so that the base portion 31 is along one inner wall surface 211 of the through hole 21.

Further, the first contact beam 32 extends from the base 31 outward from the first surface 20A of the housing 20 and diagonally with respect to the first surface 20A. A first contact portion 321 is provided at the extended tip of the first contact beam 32 . An IC (Integrated Circuit), not shown, which is an example of the first electronic component of the present invention, is mounted at a position facing the first surface 20A. Connection pads arranged in the same arrangement and pitch as the contacts 20 are provided on the surface facing the first surface 20A of this IC. Then, when the IC is mounted, each first contact portion 321 provided at the tip of each first contact beam 32 of each contact 30 comes into electrical contact with the connection pad. The surface of the contact portion 321 that contacts the contact pad is rounded so that it can slide over the connection pad.

An opening 322 is formed in the center of the first contact beam 32, excluding the tip. This first contact beam 32 is divided into two sub-beams 323 by this opening 322 . By configuring the first contact beam 32 with two sub-beams 323 with an opening 322 in between, the spring force of elastic deformation when an IC is mounted is adjusted. That is, the width of the first contact beam 32, that is, the distance between the side edges of the two sub-beams 323 on the side away from the opening 322 is a constant width d1. On the other hand, the opening 322 is formed wider toward the tip. These configurations form tapered sub-beams that are less prone to stress concentrations.

A high-speed signal of, for example, 100 GHz is transmitted between the contact 30 and the IC. The width of the entire contact beam is important for the transmission of this high-speed signal. That is, it does not matter whether the contact beam is composed of two sub-beams with a slit in between, or whether it is composed of a single beam without a slit. Therefore, in this embodiment, the first contact beam 32 is configured with two sub-beams 323 with an aperture 322 in between, thereby ensuring high-speed signal transmission performance by forming the first contact beam 32 to have a constant width d1, and ensuring high-speed signal transmission performance. The springiness of the beam has been adjusted appropriately.

Further, the second contact beam 33 extends from the base 31 outward from the second surface 20B of the housing 20 and diagonally with respect to the second surface 20B. A second contact portion 331 is provided at the extended tip of the second contact beam 33 . Here, the interposer 10 is mounted on a circuit board (not shown) with its second surface 20B facing the circuit board (not shown), which is an example of the second electronic component of the present invention. Connection pads arranged in the same arrangement and at the same pitch as the contacts 20 are provided on the surface of this circuit board facing the second surface 20B. When this interposer 10 is mounted on a circuit board, each second contact portion 331 provided at the tip of each second contact beam 33 of each contact 30 electrically connects to a connection pad on the circuit board. Contact. That is, this interposer 10 is, for example, an interposer that mediates signal transmission between a circuit board on which this interposer 10 is mounted and an IC mounted on this interposer 10.

An opening 332 is formed in the second contact beam 33 except for its tip. The second contact beam 33 is divided into two sub-beams 333 by this opening 332. By configuring the second contact beam 33 with two sub-beams 333 with an opening 332 in between, the spring force of deformation when an IC is mounted is adjusted. Each sub-beam 333 has a tapered shape, similar to the sub-beam 323. That is, the width of the second contact beam 33, ie, the distance between the side edges of the two sub-beams 333 on the side away from the opening 332, is a constant width d2. On the other hand, the opening 332 is formed to become wider toward the tip.

High-speed signals are transmitted between the IC and the circuit board via contacts 30. For transmission of this high-speed signal, it is preferable that the width of the contact beam be constant. Therefore, in the present embodiment, like the first contact beam 32, the second contact beam 33 is also composed of two sub-beams 333 with an opening 332 in between. As a result, the second contact beam is formed to have a constant width to ensure high-speed signal transmission performance, and the springiness of the second contact beam is appropriately adjusted.

Here, when the maximum width of the base 31 is d3,
d1>d3>d2
It becomes.

In this contact 30, the second contact beam 33 is inserted into the through hole 21 of the housing 20 and passes through the through hole 21, and the base portion 31 is press-fitted into the through hole 21. Therefore, the width d2 of the second contact beam 33 needs to be such that it can pass through the through hole 21. Further, the width d3 of the base portion 31 needs to be press-fitted into the through-hole 21, and is wider than the through-hole 21 by the amount by which the press-fit portion 311 protrudes.

Here, as shown in FIG. 3(B), the width w1 of the through hole 21 along the inner wall surface 211 on the side where the press-fitted base 31 contacts It is wider than the width w2 of 21. This is because the second contact beam 33 has a size that allows it to pass through a portion of width w2, and the portion where the base portion 31 is press-fitted is widened to width w1, so that the base portion within the through hole 21 This is to stabilize the position of 31.

On the other hand, the first contact beam 32 has a width d1 that cannot be inserted into the through hole 21. A second contact beam 33 is inserted into the through hole 21 . Therefore, it is not necessary to insert the first contact beam 32 into the through hole 21. Therefore, the distance x1 between the first contact beams 32 of two adjacent contacts 30 (see FIG. 1(A)) is different from the distance x2 between the two adjacent second contact beams 33 (see FIG. 1(B)). (see). Further, if the thickness of the partition wall 22 separating two adjacent through holes 21 is x3 (see FIG. 3),
x2≧x3>x1
meets the relationship.

In the case of this embodiment, the first contact beam 32 has a wide width d1 so as to satisfy these relationships, and the distance between adjacent contacts 30 in the width direction is reduced to lower the characteristic impedance, thereby improving electrical characteristics. I'm letting you do it.

Here, the first contact beam 32 has a constant width d1 except for the first contact portion 321 at the tip, and the second contact beam 33 has a constant width d1 except for the first contact portion 331 at the tip. It has a constant width d2 except for the part. The base portion 31, the first contact beam 32, and the second contact beam 33 have widths that satisfy d1>d3>d2 and x2≧x3>x1. However, it is not necessary that the first contact beam 32 and the second contact beam 33 have constant widths d1 and d2, respectively. When the width is not constant, the maximum widths d1 and d2 of the first contact beam 32 and the second contact beam 33 are compared, and the closest distances x1 and x2 between two adjacent contact beams 32 and 33 are compared. Therefore, it is sufficient to satisfy d1>d3>d2 and x2≧x3>x1.

FIG. 4 is a diagram showing a modification of the through hole.

The shape of the through hole 21 may be set to w1=w2' as shown in FIG. Also in this case, the width d2 of the second contact beam 33 and the width d3 of the base 31 have a relationship of d3>d2.

10 Interposer 20 Housing 20A Housing first surface 20B Housing second surface 21 Through hole 22 Partition wall 30 separating adjacent through holes Contact 31 Base portion 311 Press-fit portion 32 First contact beam 321 First contact portion 33 Second Contact beam 331 Second contact portion d1 First width d2 Second width x1 First interval x2 Second interval

Claims (4)

An interposer that is sandwiched between two electronic components and electrically connects the two electronic components by contacting connection pads formed on each of the two electronic components,
an upper surface facing upward that is the first electronic component side of the two electronic components; a lower surface facing downward that is the second electronic component side of the two electronic components; a housing having a plurality of through-holes penetrating through the lower surface; a base having a press-fitting part that protrudes from side to side for press-fitting into the through-holes and extending in a flat plate shape in the vertical direction and left-right direction; a first contact portion extending diagonally upward outward from the upper surface and having a first contact portion in contact with the first electric component at the tip portion, the maximum width in the left and right direction being wider than the maximum width in the left and right direction of the base portion; a contact beam, and a second contact portion connected to the lower end of the base, extending diagonally downward outward from the lower surface, and having a tip contacting the second electrical component, the maximum width in the left and right sides being greater than the maximum width of the base. a plurality of contacts with a narrow second contact beam;
The through hole is
a planar first inner wall surface that is in contact with the base after the press-fitting part is press-fitted into the through-hole ;
having a second inner wall surface and a third inner wall surface connected to the left and right edges of the first inner wall surface and facing each other;
The second inner wall surface and the third inner wall surface are
The first interval, which is the interval between first portions of both the second inner wall surface and the third inner wall surface, adjacent to the first inner wall surface, only allows the press-fit portion to bite into the wall surface. with an interval of
The distance between the portions of both the second inner wall surface and the third inner wall surface adjacent to the first portion is such that the distance between the base portion after the press-fitting portion is press-fitted is in the thickness direction of the base portion. narrower than the first interval so as to be sandwiched between the first inner wall surface and the first inner wall surface;
A distance between the second inner wall surface and the third inner wall surface is larger than the maximum width of the second contact beam at a portion of both the second inner wall surface and the third inner wall surface that are remote from the base after the press-fitting part is press-fitted. An interposer characterized by having a wide portion and a narrower portion than the maximum width of the first contact beam. The first distance between the closest portions of the first contact beams of two adjacent contacts that are adjacent to each other in the width direction is the thickness of a partition wall that separates two through holes into which the base portions of the two adjacent contacts are press-fitted. 2. The interposer of claim 1, wherein the first contact beam is wide so that it is narrower than the first contact beam. A portion of the first contact beam other than a tip portion having the first contact portion has a uniform first width, and the second contact beam has the second contact portion. 3. The interposer according to claim 1, wherein the portion excluding the tip has a uniform second width narrower than the first width. The interposer according to claim 1, wherein the contact has a laterally symmetrical structure in the width direction.

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