JP7364407B2 - socket - Google Patents

Description

The present invention relates to a socket into which electronic components are mounted.

When large-scale electronic components are mounted on a circuit board, they are often mounted via a socket rather than being directly soldered to the circuit board. That is, a socket is often soldered to a circuit board, and an electronic component is attached to the socket. In the socket, a number of contacts are arranged so as to protrude from the first surface of the flat housing, each contacting each of the contact pads arranged on the bottom surface of the electronic component. Further, a large number of solder balls are arranged on the second surface of the housing, each corresponding to a large number of contacts on the first surface.

In recent years, large-scale electronic components such as CPUs have appeared on the bottom surface of which as many as 5,000 contact pads are arranged two-dimensionally at a pitch of 1 mm, for example. Additionally, electronic components having even more contact pads have been proposed.

If you try to maintain the contact pressure of each contact at the same level as before in a socket for mounting such large-scale electronic components, the electronic components will be pressed against the arrayed contacts with an extremely large amount of pressure as a whole. There is a need. Therefore, it is required to reduce the contact pressure per contact.

In order to reduce the contact pressure per contact, it is necessary to create a contact that can be easily bent under low pressure. However, contacts that flex easily at low pressures have a concomitant increase in resistance. Therefore, although the contact can be used for signal transmission, it is not suitable for power transmission. If you try to transmit the necessary power using contacts with a large resistance value, you will need a large number of contacts for power transmission, which will further increase the number of contacts, further increase the size, and increase the overall contact pressure. result.

Here, Patent Document 1 discloses a socket that is provided with a side terminal that allows a high current to flow at a position along the edge.

Japanese Patent Application Publication No. 2003-197336

In the case of the socket disclosed in the above-mentioned Patent Document 1, the electronic component mounted on the socket must have a special specification in which a power section is disposed on the side surface.

In view of the above circumstances, an object of the present invention is to provide a socket that can perform both signal transmission and power transmission by making contact with a contact pad on the bottom of an electronic component while suppressing the overall contact pressure.

The socket of the present invention that achieves the above object has the following features:
A flat housing having a large number of arranged through holes;
a first base having an extent corresponding to one through hole;
a first press-fit portion extending downward from the first base and inserted into the through hole;
a plurality of first sub-beams extending obliquely upward from a first base with intervals between them; a first beam connecting the plurality of first sub-beams at ends extending from the first base; a first contact beam formed with a first contact extending from the beam and contacting a contact pad formed on a lower surface of the mounted electronic component;
a first contact having a
a second base having a width corresponding to the plurality of through holes;
a plurality of second press-fit parts extending downward from a second base and inserted into the plurality of through holes;
A plurality of second sub-beams, the number of which is greater than the number of the first sub-beams, extend obliquely upward from the second base with intervals between them, and the plurality of second sub-beams extend from the second base. A second beam is connected at the tip, and a plurality of second contacts extending from the second beam and in contact with contact pads formed on the lower surface of the mounted electronic component are formed, the number of which is larger than the second press-fitting portion. a second contact beam;
It is characterized by including a second contact having a.

Compared to the first contact, the second contact constituting the socket of the present invention generally has a shape in which a plurality of first contacts adjacent to each other in a specific direction are connected. Therefore, the resistance value of the second contact can be reduced compared to a case where a plurality of separate contacts each having one press-fit portion are assembled. On the other hand, the contact pressure of the second contact remains at the contact pressure of a plurality of contacts. Therefore, this second contact becomes a contact suitable for power transmission.

Here, in the socket of the present invention, it is preferable that the contact beam of the second contact has a width dimension twice or more as compared to the contact beam of the first contact.

Two adjacent first contacts must be spaced apart from each other. Consider a second contact having a shape in which these two first contacts are connected. In the case of this second contact, it is possible to form a contact beam in the shape of filling the portions of the two first contacts that are spaced apart from each other. That is, in this case, a second contact having a width twice or more than the width of one first contact is realized. In this way, by providing the second contact with a contact beam that is twice or more wider than the contact beam of the first contact, the resistance value is further reduced and the contact becomes more suitable for power transmission.

According to the above socket of the present invention, both signal transmission and power transmission can be performed by contacting the contact pad on the bottom surface of the electronic component while suppressing the overall contact pressure.

FIG. 2 is a perspective view of a signal contact among contacts constituting a socket according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a portion of the socket of the present embodiment including the signal contacts shown in FIG. 1; 3 is a side view (A), a front view (B), and a sectional view (C) taken along the arrow XX shown in FIG. 2(B) of the socket of the present embodiment, showing the same part as FIG. 2. FIG. FIG. 3 is a perspective view of a power contact as a comparative example. FIG. 2 is a perspective view (A) of a power contact constituting the socket of the present embodiment, and a perspective view showing a portion of the socket including the power contact. FIG. 7 is a diagram showing two variations of power contacts that can be used as components of the socket of the present embodiment.

Hereinafter, a socket according to an embodiment of the present invention will be described.

The socket described below has a flat housing and a large number of contacts arranged on the flat housing. These many contacts are composed of two types of contacts: signal contacts for electrical signal transmission and power contacts for power transmission.

FIG. 1 is a perspective view of a signal contact among contacts constituting a socket according to an embodiment of the present invention.

This signal contact 10 has a base 11 , a contact beam 12 and a press-fit part 13 . The contact beam 12 extends obliquely upward from the base 11 . The contact beam 12 in this embodiment is formed of two sub-beams 122 with a gap 121 between them. These two sub-beams 122 are connected to each other by a beam 123 at the tip, and one contact point 124 is formed at the tip of the beam 123. This contact 124 contacts a contact pad formed on the lower surface of an electronic component (not shown) mounted in the socket of this embodiment, and is electrically connected to the electrical component. Further, the press-fitting portion 13 extends downward from the base portion 11 . This press-fitting part 13 is inserted into a through hole 21 (see FIG. 3(C)) formed in the flat housing 20. Here, a hole 131 is formed in the press-fitting part 13. When this press-fitting part 13 is inserted into the through-hole 21, it is press-fitted into the through-hole 21 while narrowing the hole 131. This signal contact 10 corresponds to an example of a first contact according to the present invention.

FIG. 2 is a diagram showing a portion of the socket according to the present embodiment, which is provided with the signal contacts shown in FIG. Here, FIGS. 2A and 2B are a perspective view (A) and a plan view (B) of a portion thereof, respectively.

3 is a side view (A) showing the same part as FIG. 2, a front view (B), and a sectional view taken along the arrow XX shown in FIG. 2(B) ( C).

A large number of through holes 21 are arranged in the flat housing 20 as shown in FIG. 3(C). The inner wall surfaces of these through holes 21 have a conductive layer formed by plating with conductive metal.

The signal contact 10 is arranged such that its base 11 is along the first surface (upper surface) 20A of the flat housing 20. A contact beam 12 extends obliquely upward from one end of the base 11. A tear-off piece 111 that is cut off from a carrier (not shown) extends upward from the other end of the base 11 . These separation pieces 111 act as anti-overstresses that abut against the bottom surface of the electronic component and prevent excessive deflection of the contact beam 12. Further, the press-fit portion 13 extends downward from the base portion 11 and is inserted into the through hole 21 . The press-fitting portion 13 is electrically connected to the conductive layer on the inner wall surface of the through hole 21 . These signal contacts 10 contact contact pads for signal transmission among the contact pads arranged on the bottom surface of an electronic component (not shown) mounted so as to face the first surface 20A of the flat housing 20. electrically conductive.

Further, on the second surface (lower surface) 20B of the flat housing 20, solder balls 80 corresponding to each of the contacts 30 are arranged. These solder balls 80 are electrically connected to the conductive layer on the inner wall surface of the corresponding through hole 21. As a result, each contact 30 and each solder ball 80 are electrically connected to each other through the conductive layer in each through hole 21. This socket 1 is mounted on a circuit board (not shown), and is electrically connected to the circuit board by soldering with solder balls 80.

FIG. 4 is a perspective view of a power contact as a comparative example.

The power contact 30A shown in FIG. 4A has a base portion 31, a contact beam 32, and a press-fit portion 33, similar to the signal contact 10 shown in FIG. The contact beam 32 extends obliquely upward from one end of the base 31 . The contact beam 32 of the power contact 30A shown in FIG. 4A is formed of two sub-beams 322 with a gap 321 between them. These two sub-beams 322 are connected to each other by a beam 323 at the tip, and one contact point 324 is formed at the tip of the beam 323. If the power contact 30A of this comparative example is adopted as a socket, the contact 324 is a contact for power transmission among the contact pads formed on the bottom surface of an electronic component (not shown) mounted in the socket of this embodiment. Contact a pad to provide power to that electrical component. The press-fit portion 33 of the power contact 30A shown in FIG. 4(A) extends downward from the base 31. This press-fitting part 33, like the press-fitting part 13 of the signal contact 10, is inserted into the through hole 21 (see FIG. 3(C)) formed in the flat housing 20. Here, a hole 331 is formed in this press-fitting part 33. When this press-fitting part 33 is inserted into the through-hole 21, it is press-fitted into the through-hole 21 while narrowing the hole 331.

Here, in the power contact 30A as a comparative example, when compared with the signal contact 10 of FIG. . Therefore, the resistance value is correspondingly lower than that of the signal contact 10, and the power contact 30A is a contact that is more advantageous than the signal contact 10 for power transmission.

Moreover, FIG. 4(B) shows a power contact 30B as a modification of the power contact 30A of FIG. 4(A). This power contact 30B is also one of the comparative examples.

The difference between the power contact 30B in FIG. 4B and the power contact 30A in FIG. 4A is that two contacts 325 are formed.

Since the power contact 30B shown in FIG. 4B has two contacts 325 formed therein, the contact resistance with the contact pad on the bottom surface of the electronic component is lower than that of the power contact 30A shown in FIG. 4A. Therefore, the power contact 30B of FIG. 4(B) is a contact that is more advantageous for power transmission than the power contact 30A of FIG. 4(A).

The power contact of this embodiment, which is more advantageous for power transmission, will be described below.

FIG. 5 is a perspective view (A) of a power contact constituting the socket of this embodiment, and a perspective view showing a portion of the socket including the power contact.

The power contact 40A shown in FIG. 5 has a shape similar to that of the signal contact 10 shown in FIG. 1 or the two power contacts 30A shown in FIG. 4A connected together. For this reason, the amount of metal material used in the two connecting parts increases, and the shape is more advantageous for power transmission than two separate contacts.

The power contact 40A shown in FIG. 5 has a base portion 41, a contact beam 42, and a press-fit portion 43. The power contact 40A shown in FIG. The contact beam 42 extends obliquely upward from one end of the base 41 . The contact beam 42 of the power contact 40A shown in FIG. 5(A) is formed of four sub-beams 422 having gaps 421 between them. These four sub-beams 422 are connected to each other by a beam 423 at the tip, and four contact points 424 are formed at the tip of the beam 423. These contacts 424 contact power transmission contact pads formed on the bottom surface of an electronic component (not shown) mounted on the socket of this embodiment, and supply power to the electrical component. do. From the other end of the base 41, a separation piece 411 separated from a carrier (not shown) extends upward. These cut-off pieces 411 also function as anti-overstress for the contact beam 42. Further, two press-fit portions 43 are formed in the power contact 40A shown in FIG. 5(A). These press-fit portions 43 extend downward from the base portion 31 . These two press-fit portions 43 are respectively inserted into two mutually adjacent through holes 21 (see FIG. 3(C)) formed in the flat housing 20. A hole 431 is formed in each press-fit portion 43 . When these press-fitting parts 43 are inserted into the through-hole 21, they are press-fitted into the through-hole 21 while narrowing the hole 431.

The second surface of the flat housing 20 is provided with two solder balls 80 electrically connected to the power contact 40A, corresponding to the two press-fit portions 43 of the power contact 40A. .

Although not shown, each contact 424 may be divided into two contacts, for a total of eight contacts, as shown in FIG. 4(B).

The power contact 40A shown in FIG. 5 has a lower resistance value than the power contact 30A of the comparative example shown in FIG. 4, and is a contact that is advantageous for power transmission.

In the socket of this embodiment, both the signal contacts 10 shown in FIG. 1 and the power contacts 40A shown in FIG. 5(A) are arranged in one flat housing 20. This power contact 40A corresponds to an example of a power contact according to the present invention.

FIG. 6 shows two variations of power contacts that can be used as components of the socket of this embodiment. Also in FIG. 6, elements corresponding to the respective elements of the power contact 40A shown in FIG. 5 are denoted by the same reference numerals as in FIG.

The power contact 40B shown in FIG. 6(A) has a base portion 41, a contact beam 42, and a press-fit portion 43. The contact beam 42 extends obliquely upward from one end of the base 41 . The contact beam 42 of this power contact 40B is formed of six sub-beams 422 with gaps 421 between them. These six sub-beams 422 are connected to each other by a beam 423 at the tip, and six contact points 424 are formed at the tip of the beam 423. These contacts 424 contact power transmission contact pads formed on the bottom surface of an electronic component (not shown) mounted on the socket of this embodiment, and supply power to the electrical component. do. A separation piece 411 extends upward from the other end of the base 41 . Further, three press-fit portions 43 are formed in the power contact 40B shown in FIG. 6(A). These press-fit portions 43 extend downward from the base portion 31 . These three press-fit portions 43 are respectively inserted into three sequentially adjacent through holes 21 (see FIG. 3(C)) formed in the flat housing 20. A hole 431 is formed in each press-fit portion 43 . When these press-fitting parts 43 are inserted into the through-hole 21, they are press-fitted into the through-hole 21 while narrowing the hole 431.

Although not shown, the second surface 20B of the flat housing 20 is provided with three solder balls 80 electrically connected to the power contacts 40B.

Although not shown, the power contact 40B also has a total of 12 contacts, with each contact 424 further divided into two contacts, as shown in FIG. 4(B). Good too.

A power contact 40C as another modified example shown in FIG. 6(B) has a shape in which two power contacts 40A of FIG. 5(A) are connected. Thereby, this power contact 40C includes a contact beam 42 formed by eight sub-beams 422 and eight contacts 424. Further, this power contact 40C includes four press-fit portions 43. Correspondingly, the second surface 20B of the flat housing 20 is provided with four solder balls 80 electrically connected to the power contact 40C.

Although not illustrated in the same way as above, in this power contact 40C, each contact 424 is further divided into two contacts, for a total of 16 contacts, as shown in FIG. 4(B). You may prepare.

The power contacts 40B and 40C shown in FIG. 6 have a lower resistance value than not only the power contact 30A of the comparative example shown in FIG. 4 but also the power contact 40A shown in FIG. 5, making them more advantageous contacts for power transmission. It has become.

Note that the socket of the present invention may employ a power contact having a larger number of contacts 424 and press-fit portions 43 than the power contacts 40B and 40C shown in FIG.

10 Signal contact (first contact)
11 Base 12 Contact beam 124 Contact 13 Press-fit portion 20 Flat housing 21 Through holes 40A, 40B, 40C Power contact (second contact)
41 Base 42 Contact beam 424 Contact 43 Press-fitting part

Claims (2)

A flat housing having a large number of arranged through holes;
a first base having an extent corresponding to one through hole;
a first press-fit portion extending downward from the first base and inserted into the through hole;
a plurality of first sub-beams extending diagonally upward from the first base with a space between them; a first beam connecting the plurality of first sub-beams at their ends extending from the first base; and a first contact beam formed with a first contact extending from the first beam and contacting a contact pad formed on a lower surface of the mounted electronic component;
a first contact having a
a second base having a width corresponding to the plurality of through holes;
a plurality of second press-fit parts extending downward from the second base and inserted into the plurality of through holes;
a plurality of second sub-beams, the number of which is greater than the number of the first sub-beams, extending diagonally upward from the second base with intervals between them; a second beam that extends from the base and connects at its end; a plurality of press-fit portions that extend from the second beam and come into contact with contact pads formed on the lower surface of the mounted electronic component; a second contact beam having two contact points formed therein;
A socket comprising a second contact having a second contact. 2. The socket according to claim 1, wherein the contact beam of the second contact has a width dimension that is more than twice that of the contact beam of the first contact.

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