JP7415911B2 - Positioning structure of micro-vibrator, manufacturing method of inertial sensor - Google Patents

Description

The present invention relates to a positioning structure used for manufacturing an inertial sensor including a micro-vibrator, and a method for manufacturing an inertial sensor.

In recent years, the development of autonomous vehicle driving systems has been progressing, and this type of system requires highly accurate self-position estimation technology. For example, development of a self-position estimation system including GNSS (abbreviation for Global Navigation Satellite System) and IMU (abbreviation for Inertial Measurement Unit) for so-called Level 3 autonomous driving is underway. The IMU is, for example, a 6-axis inertial force sensor composed of a 3-axis gyro sensor and a 3-axis acceleration sensor. In order to achieve so-called Level 4 or higher automated driving in the future, an IMU with even higher sensitivity than the current one will be required.

BRG (abbreviation for Bird-bath Resonator Gyroscope) is considered to be a promising gyro sensor for realizing such a highly sensitive IMU. The BRG includes a micro-vibrator having a three-dimensional curved surface that vibrates in a wine glass mode and is mounted on a mounting board (for example, Patent Document 1). This micro-vibrator has a Q value of 10 ⁶ or more, which indicates the state of vibration, so it is expected to have higher sensitivity than conventional ones.

US Patent Application Publication No. 2019/0094024A1

Since this micro vibrator is made of quartz or the like with a thickness of several tens of micrometers, it is required to handle it without damaging it when mounting it on a mounting board. If the base material (such as quartz) that forms the base of the microvibrator or the electrode film formed on its surface is scratched or peeled off, the Q value will decrease and the sensitivity of the gyro sensor will decrease. Put it away. Furthermore, when mounting this micro-vibrator on a mounting board, positioning accuracy of the micro-vibrator with respect to the mounting board is required. Therefore, when manufacturing a BRG, it is necessary to handle the microvibrator without damaging it and position it accurately on the mounting board.

In the BRG described in Patent Document 1, a movable jig for positioning the micro-vibrator is formed as a part of the mounting board, and the micro-vibrator is placed on the mounting board, and the movable jig is used to position the micro-vibrator. After performing the position adjustment, the micro vibrator is bonded to the mounting board. Thereafter, the movable jig portion of the mounting board is released from the mounting board by a process such as etching and removed.

However, although this method can ensure positioning accuracy of the microvibrator on the mounting board, it involves many processes and may increase manufacturing costs. Therefore, it is required to simplify positioning on the mounting board without damaging the micro-vibrator.

In view of the above-mentioned points, the present invention provides an inertial sensor equipped with this type of micro-vibrator, which prevents damage to the micro-vibrator when mounting the micro-vibrator on a mounting board, and provides a simple and convenient method that achieves accuracy exceeding a predetermined level. The purpose is to achieve both positioning and positioning.

In order to achieve the above object, the micro-vibrating body positioning structure according to claim 1 includes: a micro-vibrating body (2) having a curved surface portion (21) having an annular curved surface and a recessed portion (22) recessed from the curved surface portion; an inertial sensor (1) comprising a mounting board (3), a concave portion of a micro vibrator being mounted on an inner region of a frame-shaped mounting portion (51) of the mounting board, and a curved surface portion being hollow; A positioning structure (100) used in the manufacture of a device, comprising a mounting board and a guide plate material (6) that is removable from the mounting board and used for positioning the micro-vibrator and the mounting board. . In such a configuration, the mounting board includes a plurality of electrode parts (53) arranged to surround the mounting part while being spaced apart from each other, and a plurality of electrode parts (53) arranged to surround the plurality of electrode parts while being spaced apart from each other. an outer frame portion (54), and a fitting groove (543, 56) provided in a portion located closer to the plurality of outer frame portions than the plurality of electrode portions and into which a part of the guide plate material is fitted. ing. The guide plate material includes a contact part (61) that comes into contact with the micro-vibrator when the micro-vibrator is mounted on the mounting part, and a frame-shaped frame part (62) that is connected to the contact part and surrounds the contact part. , has a plurality of gripping parts (64) disposed on the outer circumferential side of the frame body part, and a plurality of support parts (63) connecting the plurality of gripping parts and the frame body part, respectively, and The guide plate material has a smaller dimension in the height direction than the micro vibrator, with the height direction being the direction along the thickness direction of the mounting board when the body is mounted on the mounting board.

According to this, a positioning structure is obtained in which the guide plate material having a contact portion that contacts the micro-vibrator and is used for positioning the micro-vibrator with respect to the mounting board is detachably attached to the mounting board. In addition, in this positioning structure, the height of the guide plate material is smaller than that of the micro-vibrator, and when the micro-vibrator is mounted on the mounting board via the guide plate material, it is possible to suppress the micro-vibrator from tilting, and Easy to remove from the board. Therefore, in manufacturing an inertial sensor in which a micro-vibrating body is mounted on a mounting board, it is possible to easily position the micro-vibrating body with respect to the mounting board with higher accuracy while suppressing damage to the micro-vibrator. .

The method for manufacturing an inertial sensor according to claim 14 provides a micro vibrating body (2) having a curved surface portion (21) having an annular curved surface and a recessed portion (22) recessed from the curved surface portion, and a frame-shaped mounting portion (51). ), a plurality of electrode parts (53) arranged to surround the mounting part while being separated from each other, and a plurality of outer frame parts (54) arranged to surround the plurality of electrode parts while being separated from each other. and a mounting board (3) to which the recess of the micro-vibrator is connected to the inner region of the mounting section via a bonding member (52), and the micro-vibrator is mounted on the mounting section. A method for manufacturing an inertial sensor (1) in which the curved surface part becomes hollow when the micro-vibrating body is mounted on the mounting board, and is used for positioning when mounting the micro-vibrating body on the mounting board. A contact part (61) that comes into contact with the micro-vibrator, a frame-like frame part (62) that is connected to the contact part and surrounds the contact part, and a plurality of grip parts ( 64), a plurality of support parts (63) that respectively connect the plurality of grip parts and the frame part, a micro vibrator, and a plurality of electrode parts. Also, a mounting board having fitting grooves (543, 56) provided on the side of the plurality of outer frame parts and into which a part of the guide plate material is fitted is prepared, and a bonding material is applied to the inner area of the mounting part. coating, mounting a part of the guide plate material in the fitting groove to form a positioning structure (100) for the micro-vibrator, and after forming the positioning structure, contacting the micro-vibrator to the contact portion of the guide plate material. Insert the micro-vibrator at a position inside the contact area while aligning it with the mounting board, and after inserting the micro-vibrator, insert the Bonding the micro-vibrator to the inner area of the mounting section via the bonding member while pressing the suction surface (22a); and removing the guide plate material from the mounting board after bonding the micro-vibrator and the mounting board. and, including.

According to this, after configuring the positioning structure by attaching the detachable guide plate to the mounting board, the micro-vibrator is mounted on the mounting board while contacting the positioning contact portion of the guide plate. By bringing the micro-vibrator into contact with the guide plate material constituting the positioning structure, the positioning accuracy of the micro-vibrator with respect to the mounting board becomes higher than a predetermined level, and after the micro-vibrator is mounted on the mounting board, the guide plate material is able to move away from the mounting board. Since it can be removed, the process is simpler than before. Therefore, it is possible to easily manufacture an inertial sensor in which a micro-vibrator is mounted on a mounting board, and the micro-vibrator is positioned with a predetermined precision or higher, while suppressing damage to the micro-vibrator.

Note that the reference numerals in parentheses attached to each component etc. indicate an example of the correspondence between the component etc. and specific components etc. described in the embodiments to be described later.

FIG. 3 is a top layout diagram showing an inertial sensor including a micro vibrator. It is a perspective view showing an example of a micro vibrator. FIG. 3 is a cross-sectional view showing a cross-sectional configuration taken along line III-III in FIG. 2; It is a figure which shows the preparation process of a member in the formation process of a microvibrator. 4A is a diagram showing a step subsequent to FIG. 4A. FIG. It is a figure which shows the process following FIG. 4B. FIG. 3 is a top layout diagram showing a mounting board before a micro vibrator is mounted thereon. FIG. 2 is a cross-sectional view showing a cross-sectional configuration taken along VI-VI in FIG. 1. FIG. FIG. 2 is a cross-sectional view showing the cross-sectional configuration between VII and VII in FIG. 1. FIG. FIG. 2 is a top layout diagram showing a positioning structure for a micro-vibrator according to a first embodiment. 9 is a cross-sectional view showing a cross-sectional configuration taken along line IX-IX in FIG. 8. FIG. 9 is a cross-sectional view showing a cross-sectional configuration taken along line XX in FIG. 8. FIG. 9 is a cross-sectional view showing the cross-sectional configuration taken along line XI-XI in FIG. 8. FIG. It is a figure which shows the mounting process of the micro vibrator in manufacture of an inertial sensor, Comprising: It is a figure which shows the preparation process of a member. FIG. 12A is a diagram showing a step subsequent to FIG. 12A. FIG. 12B is a diagram showing a step following FIG. 12B. FIG. 12C is a diagram showing a step following FIG. 12C. FIG. 12D is a diagram showing a step following FIG. 12D. FIG. 12E is a top layout diagram showing the state after the step of FIG. 12E. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a second embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro vibrator according to a third embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro vibrator according to a fourth embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a fifth embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a sixth embodiment. It is a figure which shows the mounting process of the micro-vibrator in manufacturing the inertial sensor based on 6th Embodiment, Comprising: It is a figure which shows the insertion process of a micro-vibrator. FIG. 18A is a diagram showing a step following FIG. 18A. It is a figure which shows the process following FIG. 18B. FIG. 18C is a diagram showing a step following FIG. 18C. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a seventh embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to an eighth embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a ninth embodiment. FIG. 7 is a top layout diagram showing a positioning structure for a micro-vibrator according to a tenth embodiment. 23 is an enlarged view of a part of the positioning structure of FIG. 22, and is an explanatory diagram for explaining attachment and detachment of the mounting board and the guide plate material in the structure. FIG. FIG. 7 is a cross-sectional view showing a positioning structure for a micro-vibrator according to an eleventh embodiment. It is a figure which shows the mounting process of the microvibrator in manufacturing the inertial sensor based on 11th Embodiment, Comprising: It is a figure which shows the insertion process of a microvibrator. It is a figure which shows the process subsequent to FIG. 25A. It is a figure which shows the process following FIG. 25B. FIG. 25C is a diagram showing a step following FIG. 25C. FIG. 7 is a cross-sectional view showing a positioning structure for a micro-vibrator according to a twelfth embodiment. It is a figure which shows the mounting process of the micro-vibrator in manufacturing the inertial sensor based on 12th Embodiment, Comprising: It is a figure which shows the insertion process of a micro-vibrator. FIG. 27A is a diagram showing a step following FIG. 27A. FIG. 27B is a diagram showing a step following FIG. 27B. FIG. 27C is a diagram showing a step following FIG. 27C.

Embodiments of the present invention will be described below based on the drawings. Note that in each of the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
An inertial sensor 1 according to a first embodiment and a positioning structure 100 used therein will be described with reference to the drawings.

For convenience of explanation, as shown in FIG. 1, hereinafter, the direction along the left-right direction on the page is referred to as the "x direction", the direction perpendicular to the x direction on the page is referred to as the "y direction", and the normal to the xy plane Each direction is referred to as a "z direction". The x, y, and z directions in the figures after FIG. 3 correspond to the x, y, and z directions in FIG. 1, respectively. Moreover, in this specification, "upper" means a direction along the z direction in the figure, and means the arrow side, and "lower" means the opposite side to the upper side. Furthermore, in this specification, a state in which the inertial sensor 1 or a portion thereof or the positioning structure 100 is viewed from above in the z direction may be referred to as a "top view", as shown in FIG. 1, for example.

[Inertial sensor]
The inertial sensor 1 of this embodiment includes, for example, a micro-vibrating body 2 and a mounting board 3, as shown in FIG. 1, and a part of the micro-vibrating body 2 is bonded to the mounting board 3. The inertial sensor 1 receives a voltage applied to the inertial sensor 1 based on a change in capacitance between a micro vibrator 2 that can vibrate in a wine glass mode and a plurality of electrode parts 53 of the mounting board 3, which will be described later. It is configured to detect the angular velocity. The inertial sensor 1 is, for example, a gyro sensor having a BRG structure, and is suitable for use in being mounted on a vehicle such as an automobile, but may of course be applied to other uses as well.

For example, as shown in FIG. 2, the micro-vibrating body 2 includes a curved surface portion 21 having a substantially hemispherical three-dimensional curved outer shape, and a curved surface portion 21 having an annular curved surface shape extending from the apex side toward the center of the sphere. A recessed portion 22 is provided. For example, as shown in FIG. 3, the micro vibrator 2 is a suction surface 22a used for suction transportation when the outer surface of the recess 22 is connected to the mounting board 3; The opposite side is a mounting surface 22b connected to the mounting board 3. The diameter of the mounting surface 22b of the micro vibrator 2 is smaller than the diameter of the inner area of the frame-like mounting portion 51, which will be described later, of the mounting board 3, and when mounted on the mounting board 3, the mounting portion 51 The shape is such that it does not come into contact with the For example, the rim 211 of the micro-vibrating body 2 has a substantially cylindrical shape so that the intervals between the rim 211 and the plurality of electrode parts 53 are equal when the inertial sensor 1 is not driven. When the mounting surface 22b side of the recess 22 of the micro vibrator 2 is mounted on the mounting board 3, the three-dimensional curved portion including the rim 211 becomes hollow, making it possible to vibrate in a wine glass mode. There is. The micro vibrating body 2 has a curved surface portion 21 having a bowl-shaped three-dimensional curved surface, and the Q value of the vibration is, for example, 10 ⁶ or more.

The micro vibrator 2 is made of a material such as quartz, glass, silicon, or ceramic, and can have a three-dimensional curved surface 21 and a recess 22, and can vibrate in a wine glass mode. Any material may be used, and the material is not limited to these materials. The micro vibrating body 2 has a thin structure with a thickness of several tens of μm, for example, 20 μm to 80 μm. The micro vibrator 2 has a millimeter-sized shape, for example, with a height dimension of 2.5 mm and a diameter of 5 mm, with the height direction being along the thickness direction of the mounting board 3. The surface of the micro vibrator 2 is covered with a conductive layer 23. The conductive layer 23 is composed of, for example, but not limited to, a laminated film of Cr (chromium) or Ti (titanium) from the base side and any conductive material such as Au (gold) or Pt (platinum). and functions as an electrode film.

The micro vibrator 2 is formed, for example, by the following steps.

First, as shown in FIG. 4A, for example, a quartz plate 20, a mold M for forming a three-dimensional curved surface shape, and a cooling body C for cooling the mold M are prepared. For example, the mold M extends along the depth direction of the recess M1 at the center of the recess M1, which becomes a space when forming a three-dimensional curved shape on the quartz plate 20, and the quartz plate 20 during processing. A through hole M11 is formed in the bottom surface of the recess M1. The cooling body C includes a fitting part C1 into which the mold M is fitted, and an exhaust port C11 for exhaust on the bottom surface of the fitting part C1, and serves to cool the mold M when processing the quartz plate 20. The quartz plate 20 is arranged so as to cover the entire area of the recess M1 of the mold M.

Continuously, as shown in FIG. 4B, for example, flame F is sprayed from the torch T toward the quartz plate 20, and the quartz plate 20 is melted. At this time, the recess M1 of the mold M is evacuated through the exhaust port C11 of the cooling body C by a vacuum mechanism (not shown). As a result, the melted portion of the quartz plate 20 is stretched toward the bottom of the recess M1, and its central peripheral region is supported by the support column M2. After that, heating of the quartz plate 20 is stopped and the quartz plate 20 is cooled, so that the quartz plate 20 has a curved surface portion 201 having a substantially hemispherical three-dimensional curved surface shape, a recessed portion 202 concave near the center of the curved surface portion 201, and a curved surface portion. 201 and has a flat end 203.

Next, the recess M1 of the mold M is returned to normal pressure, the processed quartz plate 20 is removed, and the quartz plate 20 is sealed with a sealing material E made of any curable resin material, for example, as shown in FIG. 4C. . Thereafter, for example, the sealing material E is polished and CMP (abbreviation for chemical mechanical polishing) is performed from the surface on the end portion 203 side, and the end portion 203 is removed together with the sealing material E, leaving the recessed portion 202. Then, all of the sealing material E is removed by an arbitrary method such as heating or dissolving using a chemical solution, and the quartz plate 20 is taken out. Finally, conductive layers 23 are formed on both surfaces of the processed quartz plate 20 by any film forming process such as sputtering, vapor deposition, atomic layer deposition (ALD), or chemical vapor deposition (CVD).

Note that the micro vibrator 2 is manufactured by, for example, the manufacturing process described above, and has a substantially half-toroidal shape that is rotationally symmetrical with the Z direction as the rotation axis; however, the method is not limited to the above method, and other methods may be used. Any known method may be used.

The micro-vibrating body 2 is mounted on the mounting board 3 with a positioning accuracy higher than a predetermined level by using a positioning structure 100 formed by attaching a guide plate 6 to the mounting board 3, which will be described later with reference to FIG. 8, for example. Ru. The details will be described later.

For example, as shown in FIG. 5, the mounting board 3 includes a lower board 4 and an upper board 5, which are bonded together. For example, the mounting board 3 is obtained by anodically bonding an upper substrate 5 made of Si (silicon), a semiconductor material, to a lower substrate 4 made of borosilicate glass, an insulating material. The mounting board 3 includes a mounting section 51 on which the micro vibrator 2 is mounted, a plurality of electrode sections 53 arranged at a distance from each other so as to surround the mounting section 51, and a plurality of electrode sections 53 arranged at a distance from each other so as to surround the electrode section 53. A plurality of outer frame portions 54 are arranged.

In the mounting board 3, as shown in FIGS. 5 and 6, for example, an annular etching groove 41 surrounding the annular mounting portion 51 is formed at a position on the outer peripheral side of the annular mounting portion 51. As a result, when the micro-vibrator 2 is mounted on the mounting board 3, the curved surface portion 21 including the rim 211 of the micro-vibrator 2 becomes hollow, as shown in FIGS. 6 and 7. The mounting board 3 includes a bridge wiring 42 spanning the etching groove 41 of the lower board 4, and the mounting part 51 and the four outer frame parts 54 are electrically connected and have the same potential. The bridge wiring 42 is made of a conductive material such as Al (aluminum), and is arranged to pass between the plurality of electrode parts 53 and is electrically independent from the plurality of electrode parts 53. Note that in FIGS. 6 and 7, the conductive layer 23 of the micro vibrator 2 is omitted for clarity.

In the mounting board 3, for example, a bonding member 52 such as Au paste is applied to the inner region of an annular mounting portion 51, and the micro vibrator 2 is bonded via the bonding member 52. Furthermore, in the mounting board 3, one end of the bridge wiring 42 is covered by a mounting portion 51, and the other end is covered by an outer frame portion 54. As a result, when the micro-vibrator 2 is mounted on the mounting board 3, the mounting portion 51, the bridge wiring 42, and the outer frame portion 54 are electrically connected to the micro-vibrator 2.

As shown in FIGS. 5 and 7, for example, the mounting board 3 includes a plurality of electrode parts 53 arranged at a position on the outer peripheral side of the etching groove 41 and spaced apart from each other so as to surround the mounting part 51. When the micro-vibrating body 2 is mounted, the plurality of electrode parts 53 are separated from the rim 211 of the micro-vibrating body 2 by a predetermined distance, and each of them forms a capacitor with the micro-vibrating body 2. The plurality of electrode parts 53 have an electrode film 531 formed on their upper surface, and, for example, a wire (not shown) is connected to the electrode film 531 to be electrically connected to an external circuit board (not shown) or the like. As a result, the mounting board 3 detects capacitance with the micro-vibrating body 2 via the plurality of electrode parts 53, generates electrostatic attraction between the micro-vibrating body 2, and generates micro-vibration. It is possible to vibrate the body 2 in wine glass mode. For example, as shown in FIG. 1, the plurality of electrode parts 53 have inner and outer sides each having an arc shape when viewed from above, and when the inner and outer sides are connected, It is in a state where it draws intermittent circles with different diameters. In other words, the plurality of electrode sections 53 are configured by equally dividing an annular frame surrounding the mounting section 51 at predetermined intervals.

Note that the "inner circumferential side" of the mounting board 3 means the center side of the inner region of the mounting section 51 when viewed from above as shown in FIG. means the side located at Further, although FIG. 1 and the like show an example in which the 16 electrode parts 53 are evenly arranged in a ring at a distance from each other on the mounting board 3, the electrode parts 53 are not limited to this. The number and arrangement of the micro-vibrators 2 can be changed as appropriate depending on the shape, size, etc. of the micro-vibrator 2.

In the mounting board 3, as shown in FIG. 5, for example, four outer frame parts 54 are arranged apart from each other so as to surround the plurality of electrode parts 53 on the outer peripheral side of the plurality of electrode parts 53. The outer frame portion 54 is arranged at a predetermined distance from other outer frame portions 54 in the x direction and the y direction, and these gaps function as positioning grooves 55 for the guide plate material 6, which will be described later. ing. In addition, the plurality of outer frame parts 54 have an arcuate inner side when viewed from above, and when these sides are connected, they form a shape that draws an intermittent circle surrounding the plurality of electrode parts 53. It has become. The inner circular arc portion of the plurality of outer frame portions 54 constitutes a substantially annular groove separated by a predetermined distance from the outer circumference side circular arc portion of the plurality of electrode portions 53, and this groove will be described later. It functions as a fitting groove 56 into which the frame portion 62 of the guide plate material 6 is fitted. The positioning groove 55 and the fitting groove 56 will be described in the description of the positioning structure 100 for the micro vibrator 2, which will be described later.

As shown in FIGS. 5 and 6, each of the plurality of outer frame parts 54 is provided with an electrode film 541 made of Al or the like on the upper surface, and a wire (not shown) is connected to the electrode film 541, and an external circuit (not shown) is connected to the electrode film 541. It is electrically connected to the board, etc. This allows the mounting board 3 to control the potential of the micro-vibrator 2 to a desired value via the plurality of outer frame parts 54 using an external power source (not shown) connected to the electrode film 541. ing.

The mounting board 3 can be manufactured, for example, by the following steps.

First, a lower substrate 4 made of, for example, borosilicate glass is prepared, and an annular etching groove 41 is formed by wet etching using buffered hydrofluoric acid. Thereafter, a bridge wiring 42 spanning the etching groove 41 is formed by a lift-off method using Al sputtering. Note that the thickness of the bridge wiring 42 is, for example, approximately 0.1 μm.

Subsequently, a Si substrate (later upper substrate 5) made of Si, for example, is prepared and anodically bonded to the lower substrate 4 of borosilicate glass. Next, grooves are formed in the Si substrate to define regions that will later become the mounting section 51, electrode section 53, and outer frame section 54 by a known etching method.

For example, trench etching is performed using DRIE (abbreviation for Deep Reactive Ion Etching) to expose the lower substrate 4 and separate the mounting portion 51, electrode portion 53, and outer frame portion 54 from each other. Thereby, the Si substrate becomes the upper substrate 5 including the mounting portion 51, the plurality of electrode portions 53, and the plurality of outer frame portions 54 which are spaced apart from each other.

Finally, for example, after forming the electrode films 531 and 541 on the upper surfaces of the plurality of electrode parts 53 and the outer frame part 54 by sputtering or the like, the bonding member 52 is applied to the inner region of the mounting part 51 using a dispenser or the like.

Note that one mounting board 3 shown in FIG. 5 and the like can be obtained, for example, by forming regions on a wafer that will become a plurality of mounting boards 3 having the above structure, and dividing the region into individual pieces by dicing or the like. In other words, the mounting substrate 3 and the positioning structure 100 using the same can be manufactured at the wafer level.

The above is the basic configuration of the inertial sensor 1. When driven, the inertial sensor 1 causes the micro-vibrator 2 to vibrate in a wine glass mode by generating electrostatic attraction between some of the plurality of electrode sections 53 and the micro-vibrator 2 . In the inertial sensor 1, when a Coriolis force is applied from the outside while the micro-vibrator 2 is in a vibrating state, the micro-vibrator 2 is displaced and the position of the node of its vibration mode changes. The inertial sensor 1 is capable of detecting the angular velocity acting on the inertial sensor 1 by detecting changes in nodes of this vibration mode using the capacitance between the micro vibrator 2 and the plurality of electrode parts 53.

In manufacturing the inertial sensor 1, by using the positioning structure 100 described below, it is possible to easily mount the micro vibrator 2 while maintaining the positioning accuracy with respect to the mounting board 3 at a predetermined level or higher.

[Positioning structure of minute vibrator]
Next, the positioning structure 100 used when mounting the micro vibrator 2 on the mounting board 3 will be described with reference to FIGS. 8 to 11.

For example, as shown in FIG. 8, the positioning structure 100 is made up of a mounting board 3 and a guide plate 6 attached thereto. The guide plate material 6 is fitted onto the mounting board 3 when positioning and mounting the micro-vibrating body 2, and is removed from the mounting board 3 after the micro-vibrating body 2 is bonded to the mounting board 3. That is, the guide plate material 6 can be attached to and detached from the mounting board 3.

Note that "fitting" and "fitting" in this specification mean that the guide plate material 6 is provided with a clearance of less than a predetermined value (for example, 5 μm, etc.) so that the guide plate material 6 can be removed from the mounting board 3 later. This means that it is temporarily attached to the mounting board 3 in a state where it is held.

The guide plate material 6 includes a contact portion 61 that is arranged on the outer peripheral side of the mounting portion 51 and contacts the micro-vibrator 2 when the micro-vibrator 2 is mounted, and a frame body that is connected to the contact portion 61 and surrounds the contact portion 61. portion 62 , and a plurality of support portions 63 and grip portions 64 connected to the outer peripheral surface of the frame portion 62 . The guide plate material 6 is made of an arbitrary material such as silicon or a metal material, but the structure of the micro-vibrator 2 is adjusted so as not to damage the micro-vibrator 2 when it comes into contact with the micro-vibrator 2. It can be changed as appropriate depending on the material. The guide plate material 6 may be formed by a method such as press punching or etching.

As shown in FIGS. 9 to 11, for example, the guide plate material 6 has a dimension in the thickness direction of the mounting board 3, that is, a dimension in the z direction, which is larger than the thickness dimension of the mounting board 3, and a height equal to the height of the micro vibrator 2 in the z direction. It is smaller than the dimensions. Further, the height of the guide plate material 6 in the z direction is set higher than, for example, the rim 211 of the micro vibrator 2. This prevents the micro-vibrator 2 from being tilted when inserting the micro-vibrator 2 into the inner region of the contact portion 61, and prevents the micro-vibrator 2 from being placed in an unintended position. This is to prevent excessive contact.

For example, as shown in FIGS. 9 and 10, the contact portion 61 is a portion disposed on the outer circumference side of the mounting portion 51 and on the inner circumference side of the plurality of electrode portions 53 in the fitted state with the mounting board 3. It is. The contact portion 61 plays the role of positioning the micro-vibrator 2 with respect to the mounting board 3 by coming into contact with the rim 211 of the micro-vibrator 2 when the micro-vibrator 2 is mounted on the mounting board 3 . In this embodiment, the contact portion 61 has an annular frame shape when viewed from above, as shown in FIG. It may be changed accordingly.

The frame portion 62 is a frame-shaped portion that is connected to the outer peripheral surface side of the contact portion 61 and surrounds the contact portion 61 when viewed from above. The frame portion 62 is thicker than the contact portion 61, as shown in FIGS. 9 and 10, for example. In this embodiment, the frame portion 62 has an annular shape when viewed from above, and is fitted into the fitting groove 56 formed by gaps between the plurality of electrode portions 53 and the outer frame portion 54 of the mounting board 3. .

As shown in FIG. 8, for example, the support part 63 is a member located on the outer peripheral surface of the frame part 62, connects the frame part 62 and a grip part 64, which will be described later, and extends along the first direction. It consists of one that is installed and one that extends in a second direction that intersects the first direction. Specifically, the support portion 63 includes, for example, two support portions 63 extending along the x direction and two support portions 63 extending along the y direction. That is, the guide plate material 6 has one support part 63 arranged at each of both ends in the x direction and both ends in the y direction with the frame part 62 sandwiched therebetween, and has a total of four support parts 63. In this embodiment, the support portion 63 is fitted into a positioning groove 55 formed by a gap between two adjacent outer frame portions 54 of the mounting board 3, as shown in FIGS. 8 and 11, for example. It is used for positioning the guide plate material 6 against.

The grip part 64 is, for example, a part that is gripped by a transport device (not shown) when transporting the guide plate material 6, and has one end on the frame part 62 side of the support part 63 and the other end on the opposite side. Placed. The grip portion 64 is, for example, provided on the other end side of each support portion 63 and has a wider shape than the support portion 63. The grip portion 64 is disposed outside the outer contour of the mounting board 3 when viewed from above when the guide plate member 6 is fitted to the mounting board 3 .

The above is the basic configuration of the positioning structure 100 of this embodiment. In the positioning structure 100, the mounting board 3 and the guide plate 6 are in a fitted state, and by inserting the micro vibrator 2 inside the contact part 61 of the guide plate 6 by the method described later, it can be easily set to a predetermined position. It is possible to position the micro vibrator 2 with the above accuracy.

[Manufacturing method of inertial sensor]
Next, a method for manufacturing the inertial sensor 1 of this embodiment will be described with reference to FIGS. 12A to 12F. However, since the manufacturing of the micro vibrator 2, the mounting board 3, and the guide plate material 6 themselves have been described above, here, The mounting of the micro vibrator 2 using the guide plate material 6 will be mainly explained.

Note that FIGS. 12A to 12E correspond to the cross-sectional view shown in FIG. 9. Further, in FIGS. 12C to 12E, in order to make it easier to see, only a part of the pickup mechanism 300, which will be described later, is simply shown, and the inside of the collet 302 is shown with broken lines.

First, as shown in FIG. 12A, for example, the micro vibrator 2, the mounting board 3, and the guide plate material 6 manufactured by the above method are prepared. Thereafter, for example, as shown in FIG. 12B, a bonding member 52 made of Au paste is applied to the inner region of the mounting portion 51 using a dispenser device (not shown) or the like. Then, for example, the mounting board 3 is placed on a suction surface of a mounter (not shown), and the mounting board 3 is fixed by vacuum suction. Note that this mounter device (not shown) is configured to include a heating mechanism that can heat the suction surface.

Subsequently, the guide plate material 6 is attached to the temporarily fixed mounting board 3. Specifically, as shown in FIG. 8, for example, in the guide plate material 6, the frame part 62 is fitted into the fitting groove 56 of the mounting board 3, and the support part 63 is fitted into the positioning groove 55 of the mounting board 3, so that the mounting It is mounted in a state where it is aligned with the board 3 and is in a state where it does not move.

Next, as shown in FIG. 12C, for example, a part of the pickup mechanism 300 is inserted into the suction surface 22a of the recess 22 of the micro-vibrator 2, and the micro-vibrator 2 is gripped by vacuum suction. The pickup mechanism 300 includes, for example, a pedestal 301 and a collet 302 having a substantially cylindrical shape. The structure allows for transportation. In the pickup mechanism 300, for example, as shown in FIG. 12C, the maximum diameter of the collet 302 is smaller than the inner diameter of the recess 22, and the outer diameter of the tip of the collet 302 is smaller than other parts. In addition, in the pickup mechanism 300, the length of the collet 302 is larger than the depth of the recess 22 of the micro-vibrator 2, and when the collet 302 is inserted into the recess 22 of the micro-vibrator 2, the collet 302 generates a micro-vibration. It is configured so that it does not come into contact with anything other than the suction surface 22a of the body 2.

Using such a pickup mechanism 300, the micro-vibrating body 2 is inserted into the inner region of the annular contact portion 61 of the guide plate member 6 while holding the suction surface 22a of the micro-vibrating body 2 by vacuum suction. At this time, by inserting the approximately cylindrical rim 211 of the micro-vibrating body 2 into the cylindrical contact portion 61 while making contact with the minimum necessary amount so as not to cause unnecessary scratches on the surface, the micro-vibrating body 2 is Positioning with the mounting board 3 can be easily performed while suppressing tilting.

Hereinafter, for convenience of explanation, when inserting the micro-vibrating body 2 into the guide plate material 6, positioning (positioning) with respect to the mounting board 3 by bringing the micro-vibrating body 2 into contact with the contact portion 61 will be referred to as "passive". This is sometimes called "alignment."

Then, as shown in FIG. 12D, for example, the micro vibrator 2 is further inserted by the pickup mechanism 300, and its mounting surface 22b is brought into contact with the joining member 52. Thereafter, the mounting board 3 is heated while being attracted by a mounting device (not shown) to melt the bonding member 52, and then the temperature of the suction surface is lowered and the melted bonding member 52 is solidified, thereby mounting the micro vibrator 2 and the mounting board 3. The substrate 3 is bonded.

After the micro-vibrator 2 and the mounting board 3 are bonded, for example, as shown in FIG. 12E, the inside of the collet 302 is returned to normal pressure to release the vacuum suction of the micro-vibrator 2, the pickup mechanism 300 is retracted, and the collet 302 is pulled out from the recess 22 of the micro vibrator 2. As a result, as shown in FIG. 12F, for example, the micro vibrator 2 is placed in the inner region of the contact portion 61 of the guide plate 6 when viewed from above, and is bonded to the mounting board 3 via the bonding member 52. becomes. Thereafter, the guide plate 6 is removed from the mounting board 3 by lifting the grip portion 64 of the guide plate 6 using, for example, a transport device (not shown).

Subsequently, suction by a mounter (not shown) is released, and the mounting board 3 to which the micro vibrator 2 is bonded is removed from the suction surface. Then, the mounting board 3 is mounted on a circuit board (not shown), wire bonding is performed to the electrode films 531 and 541 of the mounting board 3, and the circuit board, etc. and the electrode part 53 and outer frame part 54 of the mounting board 3 are electrically connected. The inertial sensor 1 can be manufactured by connecting it to the inertial sensor 1 and performing vacuum-tight sealing.

The above is the basic manufacturing method of the inertial sensor 1 of this embodiment.

Here, the effects of the above manufacturing method will be explained.

When manufacturing the inertial sensor 1 with the BRG structure, the distance between the rim 211 of the micro-vibrating body 2 and the plurality of electrode parts 53 is the same, and the micro-vibrating body 2 is composed of one electrode part 53 and the opposing micro-vibrating body 2. It is necessary to keep the initial capacitance in the capacitor constant. This is because if the gap between the electrode parts 53 and the micro-vibrator 2 is different, the change in capacitance of the capacitor due to the displacement of the micro-vibrator 2 when an external force is applied to the inertial sensor 1 is This is because the sensor accuracy will be different depending on the case, resulting in a decrease in sensor accuracy. Therefore, when the micro-vibrating body 2 is mounted on the mounting board 3, a high precision higher than a predetermined level is required for its positioning.

As a positioning implementation that requires such high accuracy, there is a method of performing edge detection using image processing and extracting feature points of each member. Specifically, after imaging the micro-vibrating body 2 and the mounting board 3, the edges of the micro-vibrating body 2 and the mounting board 3 are detected by known image processing, feature points are extracted, and their positional relationships are estimated. It is assumed that the micro vibrator 2 is mounted on the mounting board 3 while being aligned.

However, when the curved surface part 21 or rim 211 of the three-dimensional curved micro-vibrator 2 is grasped, a part of the micro-vibrator 2 is hidden by the gripping mechanism, making it difficult to extract feature points of the micro-vibrator 2 by edge detection. It becomes difficult. Therefore, the method of mounting the micro-vibrating body 2 using only image processing requires a complicated process, and there is a risk that the micro-vibrating body 2 or its electrode film may be damaged due to positional deviation, and manufacturing costs may increase.

Further, in the case of a method in which a positioning mechanism for the micro-vibrating body 2 is provided in a part of the mounting board 3, the positioning accuracy of the micro-vibrating body 2 can be ensured, but the process becomes complicated and the manufacturing cost increases.

Therefore, while gripping the micro-vibrator 2 without interfering with edge detection, the micro-vibrator 2 can be more easily attached to the mounting board 3 than when only image processing is used or when a positioning mechanism is provided on the mounting board 3. A method of mounting is required.

By using the positioning structure 100 described above, it becomes possible to position the micro vibrator 2 and the mounting board 3 more easily than a method using only image processing. Furthermore, when mounting the micro-vibrating body 2, by inserting the collet 302 into the suction surface 22a of the recess 22 and gripping it by vacuum suction, the portion of the micro-vibrating body 2 that is hidden by the transport mechanism is reduced, and the edge Does not interfere with detection. Therefore, even when performing alignment using image processing, it is possible to prevent the process of mounting the micro vibrator 2 onto the mounting board 3 from becoming complicated.

According to the above method, the positioning structure 100 is configured in which the removable guide plate 6 is attached to the mounting board 3, and the micro-vibrator 2 is mounted while being in contact with the contact portion 61 of the guide plate 6, making it easy to use. In addition, the micro-vibrating body 2 can be aligned with a precision higher than a predetermined level. As a result, it is possible to suppress unintended scratches on the micro vibrator 2 and peeling of the conductive layer 23 (electrode film), and it is possible to easily manufacture the highly reliable inertial sensor 1.

According to this embodiment, damage to the micro-vibrating body 2 and its electrode film is suppressed, and the inertial sensor 1 becomes highly reliable and sensitive. Further, by configuring the above-described positioning structure 100, it is possible to easily perform positioning with a predetermined accuracy or higher while suppressing scratches and the like on the micro-vibrating body 2, thereby suppressing an increase in manufacturing costs.

(Second embodiment)
A positioning structure 100 according to a second embodiment will be described with reference to FIG. 13. In FIG. 13, the outline of the micro-vibrator 2 mounted on the mounting board 3 is shown by a broken line in order to make it easier to understand the contact state between the contact portion 61 of the guide plate material 6 and the micro-vibrator 2, which will be described later.

The positioning structure 100 used when manufacturing the inertial sensor 1 of this embodiment is different from the first embodiment in that the contact portion 61 of the guide plate 6 is approximately rod-shaped when viewed from above, as shown in FIG. 13, for example. It differs from the form. In this embodiment, this difference will be mainly explained.

In this embodiment, the plurality of contact portions 61 are substantially rod-shaped when viewed from above, and the contact area with the micro-vibrator 2 during passive alignment of the micro-vibrator 2 is smaller than in the first embodiment. ing. Specifically, as shown in FIG. 13, for example, the contact portions 61 are located on extension lines of adjacent support portions 63, and their tips become thinner toward the mounting portion 51. It has a shape that makes contact with the micro vibrator 2. In other words, when the contact state between the contact part 61 of the guide plate material 6 and the micro-vibrator 2 in the first embodiment is defined as "surface contact", the contact part 61 is the so-called micro-vibrator 2 in this embodiment. The shape is such that it makes "line contact".

Note that the structure of the inertial sensor 1 manufactured using the positioning structure 100 of this embodiment is the same as that of the first embodiment.

According to this embodiment, as in the first embodiment, a highly reliable and highly sensitive inertial sensor 1 can be easily manufactured. Furthermore, since the contact portion 61 is approximately rod-shaped when viewed from above, the contact area with the micro-vibrator 2 during positioning of the micro-vibrator 2 is smaller than that in the first embodiment, and the micro-vibrator 2 and its The effect of suppressing damage to the electrode film is further enhanced.

(Third embodiment)
A positioning structure 100 according to a third embodiment will be described with reference to FIG. 14. In FIG. 14, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line.

As shown in FIG. 14, for example, the positioning structure 100 of this embodiment is different from the first embodiment in that the shape of the contact portion 61 of the guide plate 6 is changed to a substantially T-shape when viewed from above. Equivalent to. In this embodiment, this difference will be mainly explained.

When viewed from above, each of the plurality of contact portions 61 has a tip portion on the side of the mounting portion 51 having an arc shape corresponding to the outer shape of the rim 211 of the micro vibrator 2 . The plurality of contact parts 61 come into contact with the micro-vibrator 2 at their arc-shaped tips during passive alignment of the micro-vibrator 2 .

Note that the structure of the inertial sensor 1 manufactured using the positioning structure 100 of this embodiment is the same as that of the first embodiment.

This embodiment also provides the same effects as the first embodiment. In addition, similar to the second embodiment, the contact area with the micro-vibrating body 2 during passive alignment is smaller compared to the first embodiment, so the positioning structure 100 is less likely to damage the micro-vibrating body 2. becomes. Furthermore, since the contact area with the micro-vibrator 2 during passive alignment is larger than in the second embodiment, positional deviation such as rotation of the micro-vibrator 2 around the z-direction is suppressed, and the micro-vibrator A good balance can be achieved between the prevention of scratches and the prevention of misalignment described in 2.

(Fourth embodiment)
A positioning structure 100 according to a fourth embodiment will be described with reference to FIG. 15. In FIG. 15, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line.

In the positioning structure 100 of this embodiment, for example, as shown in FIG. 15, the frame portion 62 of the guide plate material 6 has a rectangular frame shape, and the outer frame portion 54 of the mounting board 3 has a shape of a rectangular frame when viewed from above. The shape has been changed to correspond to the frame body part 62. Further, in the positioning structure 100, the contact portion 61 has a substantially rod shape when viewed from above, as in the second embodiment.

The positioning structure 100 differs from the first embodiment described above in these points. Since the latter difference has already been described in the second embodiment, in this embodiment, the former difference will be mainly explained.

In the present embodiment, the plurality of outer frame parts 54 do not have curved outer contours on the inner peripheral side when viewed from above, but have two planar-shaped parts along the opposing frame parts 62 of the guide plate material 6. The planar shapes intersect with each other. In addition, the plurality of outer frame portions 54 have groove-like relief grooves 542 that are recessed toward the outer circumference at locations where the planar portions on the inner circumference side intersect. This is because when the guide plate material 6 is attached to the mounting board 3 to form the positioning structure 100, the four corners of the frame body part 62 come into contact with the outer frame part 54, and the guide plate material 6 is fitted onto the mounting board 3. This is to prevent it from becoming impossible to match. In other words, the plurality of outer frame parts 54 have a shape obtained by equally dividing one substantially rectangular frame body into four parts, each of which has relief grooves 542 at the four corners of the inner shell. Furthermore, the bridge wiring 42 on the lower board 4 is longer than that in the first embodiment because the distance between the mounting section 51 and the outer frame section 54 is increased, but its function is different from that in the first embodiment. It is the same as the form.

In addition, although FIG. 15 shows the outer frame portion 54 in which the electrode film 541 is formed in a position close to the positioning groove 55 and each has two electrode films 541 as a representative example, the present invention is not limited to this. However, the position and number of the electrode films 541 may be changed as appropriate.

In this embodiment, the frame portion 62 of the guide plate material 6 includes a first beam portion 621 extending along one direction and a first beam portion 621 extending along another direction different from the one direction when viewed from above. It has a rectangular frame shape including a second beam portion 622 which is shaped like a cylindrical frame. Specifically, the frame portion 62 includes, for example, two first beam portions 621 extending in the x direction and arranged in parallel, and two first beam portions 621 extending in the y direction and arranged in parallel. The second beam portion 622 is connected to the second beam portion 622. The frame portion 62 is smaller in size by a predetermined amount (for example, but not limited to, 10 μm or less) than the dimension of a virtual rectangle formed by the inner peripheral surfaces of the four outer frame portions 54. As a result, the mounting board 3 is configured such that the inner circumferential surfaces of the four outer frame sections 54 function as the fitting grooves 56 of the frame section 62.

Note that the inertial sensor 1 manufactured using the positioning structure 100 of this embodiment has a structure in which the shapes of the outer frame portion 54 of the mounting board 3 and the bridge wiring 42, etc. are changed from the first embodiment. However, the configuration of the angular velocity detection part is the same.

According to this embodiment, the same effects as the first embodiment and the second embodiment can be obtained.

(Fifth embodiment)
A positioning structure 100 according to a fifth embodiment will be described with reference to FIG. 16. In FIG. 16, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line.

As shown in FIG. 16, for example, the positioning structure 100 of this embodiment corresponds to the fourth embodiment described above, in which the shape of the contact portion 61 is changed to a substantially T-shape when viewed from above. Further, the structure of the inertial sensor 1 that can be manufactured using this positioning structure 100 is the same as that of the fourth embodiment.

According to this embodiment, in addition to the same effects as the fourth embodiment, it is possible to suppress the positional deviation caused by rotating around the z direction during passive alignment of the micro-vibrator 2, and to suppress damage to the micro-vibrator 2. The effect of achieving a balance with positional shift suppression can also be obtained.

(Sixth embodiment)
A positioning structure 100 according to a sixth embodiment will be described with reference to FIGS. 17 to 18D.

In FIG. 17, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line. 18A to 18D show a cross section corresponding to the cross section between XVIIIA and XVIIIA in FIG. It is shown in In addition, in FIGS. 17 and 18C, the movable direction of the gripping part 64 and the accompanying support part 63 and the like in active alignment, which will be described later, is indicated by an outline arrow.

In the positioning structure 100 of the present embodiment, as shown in FIG. 17, for example, the frame portion 62 of the guide plate material 6 has a substantially rectangular frame shape when viewed from above, and circular positioning fittings are provided at the four corners of the frame portion 62. 65. The positioning structure 100 differs from the fourth embodiment in that the relief groove 542 of the outer frame portion 54 of the mounting board 3 is changed to a fitting groove 543 corresponding to the positioning fitting portion 65, and the adjacent outer frame portion 54 It corresponds to a larger gap. Further, in the positioning structure 100, the contact portion 61 has a substantially rod shape when viewed from above, as in the second embodiment.

The positioning structure 100 differs from the first embodiment described above in these points. Since the shape of the contact portion 61 and its effects have already been described in the second embodiment, other differences will be mainly described in this embodiment.

[Positioning structure]
The plurality of outer frame portions 54 correspond to the outer frame portion 54 of the fourth embodiment in which the escape groove 542 is replaced with a fitting groove 543 into which the positioning fitting portion 65 of the frame body portion 62 is fitted. That is, the fitting grooves 543 of the plurality of outer frame parts 54 function as positioning grooves 55 when mounting the guide plate material 6 on the mounting board 3. Further, the distance between the opposing inner peripheral surfaces of the plurality of outer frame parts 54 is adjusted to have a predetermined clearance with respect to the outer diameter of the substantially rectangular frame formed by the beam parts 621 and 622 of the frame part 62. Ru. Thereby, the inner circumferential surfaces of the plurality of outer frame portions 54 function as fitting grooves 56.

In order to prevent the plurality of outer frame parts 54 from restraining the support part 63 of the guide plate material 6, the dimensions in the x direction and the y direction are made small, and the intervals between adjacent outer frame parts 54 are made smaller than those in the first to fourth embodiments. It is wider than its shape. Thereby, even when the guide plate material 6 is fitted to the mounting board 3, the plurality of gripping parts 64 can be displaced in the directions shown by the outline arrows in FIG. 17, respectively.

The plurality of gripping parts 64 are arranged along the x direction for those disposed at both ends of the frame body part 62 in the x direction, and along the y direction for those disposed at both ends of the frame body part 62 for the y direction. It is movable. Specifically, in the present embodiment, when an external force is applied to the grip portion 64 of the guide plate 6, the beam portion 621 of the frame portion 62 connected to the grip portion 64 via the support portion 63 moves. The grip part 64 is elastically deformed along the connection direction of the support part 63 and is displaced by applying an external force. As a result, the guide plate material 6 is configured such that when the grip portion 64 is displaced, the contact portion 61 is displaced in conjunction with the displacement direction of the grip portion 64. In other words, even after the micro-vibrator 2 is placed on the mounting board 3, the guide plate material 6 moves the micro-vibrator 2 in the x and y directions by pressing the micro-vibrator 2 with the contact portion 61. It is configured so that it can be used.

Hereinafter, for convenience of explanation, it will be explained that the position of the micro-vibrator 2 with respect to the mounting board 3 is finely adjusted by displacing the contact part 61 of the guide plate material 6 and pressing the micro-vibrator 2 through the contact part 61. This is sometimes called "active alignment."

In this embodiment, as shown in FIG. 17, for example, the frame portion 62 has a rectangular frame shape when viewed from above, and has a first beam portion 621 extending in the x direction and a first beam portion 621 extending in the y direction. It includes a second beam part 622 extending along the second beam part 622 and a positioning fitting part 65 provided at the intersection of these parts. The frame portion 62 has a configuration in which the positioning fitting portion 65 is fixed by the fitting groove 543 of the outer frame portion 54 while the beam portions 621 and 622 are flexible when viewed from above. Therefore, in the frame portion 62, when the grip portion 64 is displaced toward the center of the guide plate 6, the beam portion 621 or 622 connected to the grip portion 64 is elastically deformed, and the contact portion 61 is Displaces in conjunction with. In other words, the contact part 61 is movable along the connection direction along with the grip part 64, with the connection direction being the direction in which one end of the connected support part 63 on the frame body part 62 side and the other end on the grip part 64 side are connected. It becomes.

The above is the basic configuration of the positioning structure 100 of this embodiment. In this positioning structure 100, whereas in the first to fifth embodiments the guide plate member 6 was immovable in the fitted state with the mounting board 3, even in the fitted state, the guide plate member 6 is It has a feature that the contact portion 61 is movable.

[Manufacturing method of inertial sensor 1]
Next, a method for manufacturing the inertial sensor 1 using the positioning structure 100 of this embodiment will be described, but since it includes some of the same steps as in the first embodiment, here, FIGS. 18A to 18D will be referred to. At the same time, the steps that are different from the first embodiment will be mainly explained.

First, as in the first embodiment, after preparing the micro vibrator 2, the mounting board 3, and the guide plate material 6, the mounting board 3 is suctioned and fixed to a mounter device (not shown), and the bonding member 52 is applied. Then, the guide plate material 6 is attached to the mounting board 3, and a positioning structure 100 shown in FIG. 17 is constructed.

Subsequently, as shown in FIG. 18A, for example, the collet 302 of the pickup mechanism 300 is inserted into the recess 22 of the micro-vibrating body 2, and the micro-vibrating body 2 is gripped by vacuum suction on the suction surface 22a. Thereafter, the gripped micro vibrator 2 is inserted into the inner region of the contact portion 61 of the guide plate material 6, and the mounting surface 22b is brought into contact with the joining member 52. In this insertion process, the micro vibrator 2 comes into contact with the contact portion 61, thereby performing passive alignment. At this time, if it is desired to further improve the alignment accuracy between the micro vibrator 2 and the mounting board 3, an active alignment process is performed as necessary.

When performing the active alignment process, for example, as shown in FIG. 18B, after placing the micro-vibrating body 2 on the mounting board 3, the collet 302 releases the suction grip of the micro-vibrating body 2, and the pickup mechanism 300 is moved. Evacuate temporarily. Thereby, the micro vibrator 2 is in a state where it moves when an external force is applied.

Then, as shown by the white arrow in FIG. 18C, for example, the micro vibrator 2 is pressed via the contact portion 61 by displacing the grip portion 64 toward the mounting portion 51 using a transport device (not shown) or the like. Thereby, the positioning accuracy of the micro-vibrator 2 can be further improved by active alignment in which the micro-vibrator 2 is moved in an intended predetermined direction.

In addition, in FIG. 18C, the state before the grip part 64 is displaced is shown by a broken line for convenience. Further, the direction in which the micro-vibrating body 2 is to be moved can be determined based on the estimated position of the micro-vibrating body 2 using edge detection through image processing, for example.

After the active alignment is completed, for example, as shown in FIG. 18D, the pickup mechanism 300 is operated again, the collet 302 is inserted into the recess 22, and the micro-vibrator 2 is pressed against the mounting board 3 side. is not moved by external force.

Thereafter, the micro vibrator 2 is bonded to the mounting board 3 via the bonding member 52, and the guide plate material 6 is removed from the mounting board 3 through the same steps as in the first embodiment. Finally, the inertial sensor 1 can be manufactured by mounting it on a circuit board or the like, wire bonding, and vacuum sealing.

In the inertial sensor 1 that can be manufactured using the positioning structure 100 of this embodiment, the portions of the outer frame portion 54 other than the fitting groove 543 and the spacing between adjacent outer frame portions 54 are as described in the fifth embodiment. The structure is the same as that of the inertial sensor 1 of the present invention.

The present embodiment also provides a positioning structure 100 that can easily position the micro-vibrating body 2 with a predetermined accuracy or higher while suppressing damage to the micro-vibrating body 2 and its electrode film, resulting in a highly reliable and high-performance positioning structure 100. A sensitive inertial sensor 1 can be manufactured. Furthermore, in addition to passive alignment, the position of the micro-vibrator 2 can be readjusted by active alignment if necessary, so that the positioning accuracy can be improved more than in the first to fifth embodiments. .

(Seventh embodiment)
A positioning structure 100 according to a seventh embodiment will be described with reference to FIG. 19.

In FIG. 19, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line. Further, in FIG. 19, as in FIG. 17, the movable direction of the grip portion 64 and the associated supporting portion 63, etc. in active alignment is indicated by a white arrow.

As shown in FIG. 19, for example, the positioning structure 100 of this embodiment corresponds to the sixth embodiment described above, in which the shape of the contact portion 61 is changed to a substantially T-shape when viewed from above. Furthermore, the structure of the inertial sensor 1 that can be manufactured using this positioning structure 100 is the same as that of the sixth embodiment.

According to this embodiment, in addition to the same effects as in the sixth embodiment, it is possible to suppress the positional deviation caused by rotating around the z direction during passive alignment of the micro-vibrator 2, and to suppress damage to the micro-vibrator 2. The effect of achieving a balance with positional shift suppression can also be achieved.

(Eighth embodiment)
A positioning structure 100 according to the eighth embodiment will be described with reference to FIG. 20.

In FIG. 20, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line. Further, in FIG. 20, as in FIG. 17, the movable direction of the gripping portion 64 and the accompanying supporting portion 63, etc. in active alignment is indicated by a white arrow.

For example, as shown in FIG. 20, the positioning structure 100 of this embodiment is different from the seventh embodiment in that a spring portion 66 is further formed at the intersection of the beam portions 621 and 622 in the frame portion 62. Equivalent to. In this embodiment, this difference will be mainly explained.

In this embodiment, the frame portion 62 includes a spring portion 66 at the intersection of the first beam portion 621 and the second beam portion 622 in order to more easily deform the beam portions 621 and 622 during active alignment. It is formed. In other words, in the frame portion 62, each of the beam portions 621 and 622 has spring portions 66 at both ends. As a result, the beam parts 621 and 622 have reduced rigidity due to the provision of the spring part 66, and are easily deformed when the grip part 64 is displaced. Specifically, the first beam portion 621 has spring portions 66 at both ends in the x direction, making it easy to deform along the y direction. The second beam portion 622 has spring portions 66 at both ends in the y direction, so that it can be easily deformed along the x direction.

The spring portion 66 only needs to reduce the rigidity of the beam portions 621 and 622 so that they can be easily elastically deformed, and is not limited to a substantially S-shaped shape as shown in FIG. 20, but may have any shape or size. etc. may be changed as appropriate.

According to this embodiment, in addition to the effects of the seventh embodiment, it is also possible to obtain the effect of making active alignment easier to perform.

(Ninth embodiment)
A positioning structure 100 according to a ninth embodiment will be described with reference to FIG. 21.

In FIG. 21, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line. In addition, in FIG. 21, as in FIG. 17, the movable direction of the grip portion 64 and the accompanying support portion 63, etc. in active alignment is indicated by a white arrow.

As shown in FIG. 21, for example, the positioning structure 100 of this embodiment corresponds to the structure of the eighth embodiment in which an elastic deformation section 67 is further formed in the support section 63. In this embodiment, this difference will be mainly explained.

In this embodiment, the support part 63 of the guide plate material 6 has an elastic deformation part 67 so that when the grip part 64 is displaced, the contact part 61 connected thereto is displaced smaller than the grip part 64. It has a configuration with. In addition, when the spring part 66 of the guide plate material 6 arranged inside the outer frame part 54 is defined as an "inner spring", the elastic deformation part 67 is arranged outside the outer frame part 54, so it is called an "outer spring". ” can also be called.

The elastically deformable portion 67 has, for example, a rectangular frame shape that extends perpendicularly to the support portion 63 when viewed from above and is provided with a through groove along the extending direction. There is. Thereby, the elastic deformation part 67 deforms following the displacement of the grip part 64, thereby serving as a damping mechanism that reduces the amount of displacement propagated to the contact part 61. Therefore, the guide plate material 6 has a configuration in which the minimum amount of displacement of the contact portion 61 when the grip portion 64 is displaced becomes smaller, thereby allowing active alignment to be performed with higher accuracy.

According to this embodiment, in addition to the effects of the seventh embodiment, it is also possible to achieve higher positioning accuracy by reducing the minimum displacement amount of the micro vibrator 2 in active alignment.

(10th embodiment)
A positioning structure 100 according to a tenth embodiment will be described with reference to FIG. 22.

In FIG. 22, similarly to FIG. 13, the outline of the micro-vibrator 2 to be mounted is shown by a broken line. Further, in FIG. 22, as in FIG. 17, the movable direction of the grip portion 64 and the associated support portion 63, etc. in active alignment is indicated by a white arrow.

As shown in FIG. 22, for example, in the positioning structure 100 of this embodiment, the positioning fitting portion 65 is substantially trapezoidal in top view compared to the ninth embodiment, and the fitting groove 543 corresponds to this. This corresponds to the one whose shape has been changed. In this embodiment, this difference will be mainly explained.

In this embodiment, as shown in FIG. 22, for example, the positioning fitting portion 65 of the guide plate material 6 is arranged in a radial direction (hereinafter simply referred to as "radial direction") with the center position of the guide plate material 6 as an axis when viewed from above. ) It has a roughly trapezoidal shape that becomes wider as it approaches. Specifically, as shown in FIG. 23, for example, the positioning fitting portion 65 is arranged in the inner direction, with the direction from the outer side to the inner side in the radial direction being the "inner direction DR1", and the opposite direction being the "outer direction DR2". The width in the outer direction DR2 is larger than the width in DR1.

In this embodiment, when the guide plate material 6 is fitted to the mounting board 3, the positioning fitting part 65 is pulled in the outward direction DR2 and the frame part 62 is elastically deformed. As a result, when the positioning fitting part 65 of the guide plate material 6 is fitted to the mounting board 3, a restoring force acts on the positioning fitting part 65 in the inward direction DR1, and the guide plate material 6 It is firmly fitted into the fitting groove 543. Therefore, the positioning accuracy of the guide plate material 6 with respect to the mounting board 3 is improved.

On the other hand, when the guide plate material 6 is to be attached or detached from the mounting board 3, by pulling the positioning fitting part 65 again toward the outer direction DR2, the guide plate material 6 is placed in a state separated from the mounting board 3, that is, the mounting board 3 This makes it easy to remove from.

In other words, the guide plate material 6 has a structure in which the mounting board 3 can be easily attached and detached because the positioning fitting portion 65 has a substantially trapezoidal shape when viewed from above.

According to this embodiment, in addition to the effects of the eighth embodiment, the guide plate material 6 can be easily attached and detached from the mounting board 3.

(Eleventh embodiment)
A positioning structure 100 according to the eleventh embodiment will be described with reference to FIGS. 24 to 25D.

24 to 25D show a cross section corresponding to the cross section shown in FIG. 18A, and the boundaries between the contact portion 61, the frame portion 62, the support portion 63, and the grip portion 64 are shown with two-dot chain lines for convenience. Furthermore, in FIG. 24, the micro vibrator 2 mounted on the positioning structure 100 is shown by a broken line. Furthermore, in FIGS. 25A to 25C, the direction of the force acting on the guide plate member 6 is indicated by an outline arrow. Additionally, in FIGS. 25A and 25D, the inside of the collet 302 is shown with broken lines.

In contrast to the sixth to tenth embodiments described above, the positioning structure 100 of this embodiment protrudes toward the upper end side of the inner peripheral surface of the contact portion 61 opposite to the mounting board 3, as shown in FIG. 24, for example. A convex portion 611 is formed. In this embodiment, this convex portion 611 will be mainly explained.

[Positioning structure]
In the positioning structure 100 of this embodiment, the contact portion 61 of the guide plate 6 has a convex portion 611, and in the initial state of the guide plate 6, the outer diameter of the inner region of the convex portion 611 of the contact portion 61 is is smaller than the outer diameter of the rim 211 of the micro vibrator 2. Further, this positioning structure 100 is configured such that the contact portion 61 can be moved via the grip portion 64 in a state where the guide plate member 6 is fitted to the mounting board 3.

Note that the "initial state" herein refers to a state in which no external force is applied to the guide plate 6 by a transport device (not shown) or the like, and no restoring force is generated in the guide plate 6 due to the external force.

In the present embodiment, the contact portion 61 has a convex portion 611 formed on the inner circumferential surface at least at a position above the rim 211 in the z direction when the micro vibrator 2 is mounted on the mounting board 3. When the contact portion 61 presses the rim 211 of the micro-vibrator 2, the convex portion 611 comes into contact with a portion of the curved surface portion 21 of the micro-vibrator 2 above the rim 211, and the micro-vibrator 2 contacts the mounting board. It plays a role in suppressing the state of being tilted towards the ground.

Note that the convex portion 611 may be provided continuously or intermittently along the circumferential direction of the inner circumferential surface of the contact portion 61, as long as it can contact the micro-vibrator 2 and suppress the inclination. The number, arrangement, etc. thereof can be changed as appropriate depending on the shape of the second part. Further, the convex portion 611 may be provided on all of the plurality of contact portions 61 or may be provided on only some of the contact portions 61.

[Manufacturing method of inertial sensor]
Next, a method for manufacturing the inertial sensor 1 using the positioning structure 100 of this embodiment will be described, but since it includes the same steps as in the first embodiment, here, while referring to FIGS. 25A to 25D, The steps different from those in the first embodiment will be mainly explained.

First, the micro vibrator 2, the mounting board 3, and the guide plate material 6 are prepared, and the guide plate material 6 is attached to the mounting board 3 coated with the bonding member 52, thereby configuring the positioning structure 100 of this embodiment. Then, as shown in FIG. 25A, for example, the gripping part 64 of the guide plate material 6 is pulled outward in the x direction by a conveyance device (not shown), and the interval between the contact parts 61 is widened, and at least the outer diameter of the inner region of the convex part 611 is is larger than the outer diameter of the rim 211. While maintaining the tension of the gripping part 64, the micro-vibrating body 2 held by the pickup mechanism 300 is inserted into the inside of the contact part 61, and the mounting surface 22b is brought into contact with the joining member 52.

After bringing the micro vibrator 2 into contact with the joining member 52, the vacuum suction by the collet 302 is released while maintaining the tensioned state of the guide plate 6, and the pickup mechanism 300 is temporarily evacuated, as shown in FIG. 25B, for example. let Thereby, the micro vibrator 2 is in a state where the recess 22 is placed on the joining member 52 and moves when external force is applied.

Continuously, as shown in FIG. 25C, for example, the grip part 64 is released to release the tensioned state of the guide plate material 6, and the contact part 61 is brought into contact with the micro-vibrator 2 using the restoring force. As a result, in the micro vibrator 2, the rim 211 is pressed near the lower end on the mounting board 3 side of the inner peripheral surface of the contact portion 61, and the portion of the curved surface portion 21 above the rim 211 is pressed against the convex portion 611. It will be in a state where it is pressed. As a result, the micro vibrator 2 is pressed by other parts of the contact portion 61 while being suppressed from tilting with respect to the mounting board 3 by the convex portion 611, and passive alignment with respect to the mounting board 3 is achieved.

Next, as shown in FIG. 25D, for example, the collet 302 of the pickup mechanism 300 is inserted into the recess 22 of the micro-vibrator 2, and the pickup mechanism 300 presses the micro-vibrator 2 toward the mounting board 3.

Thereafter, the micro vibrator 2 is bonded to the mounting board 3 via the bonding member 52, and the guide plate material 6 is removed from the mounting board 3 through the same steps as in the first embodiment. Finally, the inertial sensor 1 can be manufactured by mounting it on a circuit board or the like, wire bonding, and vacuum sealing.

The inertial sensor 1 that can be manufactured using the positioning structure 100 of this embodiment has a basic structure other than the fitting groove 543 of the outer frame portion 54 and the spacing between adjacent outer frame portions 54. , is the same as the inertial sensor 1 of the fifth embodiment.

The present embodiment also provides a positioning structure 100 that can easily position the micro-vibrating body 2 with a predetermined accuracy or higher while suppressing damage to the micro-vibrating body 2 and its electrode film, resulting in a highly reliable and high-performance positioning structure 100. A sensitive inertial sensor 1 can be manufactured. Further, since the guide plate member 6 has the convex portion 611, the micro-vibrating body 2 is prevented from tilting when mounted, and the positioning accuracy is further improved.

(12th embodiment)
A positioning structure 100 according to the twelfth embodiment will be described with reference to FIGS. 26 to 27D.

26 to 27D show a cross section corresponding to the cross section shown in FIG. 18A, and the boundaries between the contact portion 61, the frame portion 62, the support portion 63, and the grip portion 64 are shown with two-dot chain lines for convenience. Furthermore, in FIG. 26, the micro vibrator 2 mounted on the positioning structure 100 is shown by a broken line. Furthermore, in FIGS. 27C and 27D, the direction of the force acting on the guide plate material 6 is shown by an outline arrow. Additionally, in FIGS. 27A to 27D, the interior of collet 302 is shown with broken lines.

In contrast to the sixth to tenth embodiments described above, the positioning structure 100 of this embodiment is different from the above-described sixth to tenth embodiments in that, as shown in FIG. It is something. In this embodiment, this claw portion 612 will be mainly explained.

[Positioning structure]
In the positioning structure 100 of this embodiment, the contact portion 61 of the guide plate 6 has a claw portion 612, and in the initial state of the guide plate 6, the outer diameter of the inner region of the claw portion 612 of the contact portion 61 is is smaller than the outer diameter of the rim 211 of the micro vibrator 2. Further, this positioning structure 100 has a configuration in which the contact portion 61 is movable via the grip portion 64, similarly to the eleventh embodiment.

The claw portion 612 is provided, for example, at the lower end of the inner circumferential surface of the contact portion 61, and serves to temporarily support the micro-vibrator 2. The claw portion 612 protrudes so as to have a width greater than the thickness of the rim 211, for example.

Note that the claw portion 612 only needs to support the rim 211 of the micro vibrator 2 in the initial state of the guide plate member 6, and may be formed continuously or intermittently along the circumferential direction of the inner peripheral surface of the contact portion 61. Alternatively, the width, arrangement, etc. can be changed as appropriate according to the shape of the micro vibrator 2, etc. Furthermore, the claw portions 612 may be provided on all of the plurality of contact portions 61 or may be provided on only some of the contact portions 61.

[Manufacturing method of inertial sensor]
Next, a method for manufacturing the inertial sensor 1 using the positioning structure 100 of this embodiment will be described, but since it includes the same steps as in the first embodiment, here, the method for manufacturing the inertial sensor 1 using the positioning structure 100 of the present embodiment will be described with reference to FIGS. 27A to 27D. The steps different from those in the first embodiment will be mainly explained.

First, the micro vibrator 2, the mounting board 3, and the guide plate material 6 are prepared, and the guide plate material 6 is attached to the mounting board 3 coated with the bonding member 52, thereby configuring the positioning structure 100 of this embodiment.
Then, as shown in FIG. 27A, for example, the micro-vibrating body 2 held by the pick-up mechanism 300 is inserted into the inner region of the contact portion 61, and the rim 211 of the micro-vibrating body 2 is brought into contact with the claw portion 612.

Subsequently, as shown in FIG. 27B, for example, the vacuum suction by the collet 302 is released, and the pickup mechanism 300 is temporarily retracted. Thereby, the micro vibrator 2 is passively aligned by contacting a portion of the contact portion 61 above the claw portion 612 in the z direction, and then placed on the claw portion 612 . Note that, as explained in the first embodiment, the micro-vibrating body 2 is placed on the claw portion 612 because the lower end surface of the rim 211 is processed by CMP to ensure a predetermined level of flatness. At this time, it is in a state where it is supported without tilting with respect to the mounting board 3.

Then, as shown in FIG. 27C, for example, the gripping part 64 is pulled outward by a transport device (not shown), and the outer diameter of at least the inner area of the claw part 612 of the contact part 61 is larger than the outer diameter of the rim 211. do. As a result, the micro vibrator 2, which has been passively aligned in the previous step, falls onto the mounting board 3, and the mounting surface 22b comes into contact with the bonding member 52.

Thereafter, while maintaining the tensioned state of the guide plate member 6, the collet 302 of the pickup mechanism 300 is inserted into the recess 22 of the micro-vibrator 2, and the micro-vibrator 2 is gripped by suction, as shown in FIG. 27D, for example. Then, in this state, the micro vibrator 2 is pressed toward the mounting board 3 by the pickup mechanism 300.

Thereafter, the micro vibrator 2 is bonded to the mounting board 3 via the bonding member 52, and the guide plate material 6 is removed from the mounting board 3 through the same steps as in the first embodiment. Finally, the inertial sensor 1 can be manufactured by mounting it on a circuit board or the like, wire bonding, and vacuum sealing.

The present embodiment also provides a positioning structure 100 that can easily position the micro-vibrating body 2 with a predetermined accuracy or higher while suppressing damage to the micro-vibrating body 2 and its electrode film, resulting in a highly reliable and high-performance positioning structure 100. A sensitive inertial sensor 1 can be manufactured.

(Other embodiments)
Although the present invention has been described based on examples, it is understood that the present invention is not limited to the examples or structures. The present invention also includes various modifications and equivalent modifications. In addition, various combinations and configurations, as well as other combinations and configurations that include only one, more, or less of these elements, fall within the scope and spirit of the present invention.

(1) For example, in the eleventh embodiment, an example has been described in which the convex portion 611 is formed on the inner circumferential surface of the contact portion 61, but the present invention is not limited to this. may be a curved shape that follows the outer shape of the curved surface portion 21 of the micro vibrator 2, or may be a tapered shape. In other words, in the eleventh embodiment, when the tension of the gripping part 64 of the guide plate 6 is released and a restoring force is generated, the contact part 61 prevents the micro vibrator 2 from tilting with respect to the mounting board 3. Any shape that can be pressed is sufficient. Therefore, the contact portion 61 may have any shape including a convex portion 611, a curved shape, a tapered shape, or the like. Note that when the inner circumferential surface of the contact portion 61 is tapered or curved along the outer shape of the micro-vibrator 2, the contact area with the micro-vibrator 2 increases compared to when it is a flat surface. , the restoring force is transmitted more reliably during passive alignment, improving positioning accuracy.

(2) For example, in the first embodiment described above, an example was described in which the contact portion 61 has a frame shape that forms one continuous ring. Even if the frame has a substantially annular shape, there is no particular problem. This also applies to the frame portion 62. That is, the frame shape of the contact portion 61 or the frame body portion 62 may include not only a continuous shape without interruption but also an intermittent shape in which a part is interrupted.

DESCRIPTION OF SYMBOLS 1... Inertial sensor, 2... Minute vibrator, 21... Curved surface part, 22... Concave part,
22a... Adsorption surface, 3... Mounting board, 51... Mounting part, 52... Bonding material,
53... Electrode part, 54... Outer frame part, 543, 56... Fitting groove,
55... Positioning groove, 6... Guide plate material, 61... Contact portion, 611... Convex portion,
612...Claw part, 62...Frame body part, 621, 622...Beam part, 63...Support part,
64... Gripping part, 65... Positioning fitting part, 66... Spring part,
67...Elastic deformation part

Claims (18)

It has a micro-vibrating body (2) having a curved surface portion (21) having an annular curved surface and a recessed portion (22) recessed from the curved surface portion, and a mounting board (3), wherein the recessed portion of the micro-vibrating body is A positioning structure (100) used for manufacturing an inertial sensor (1), which is mounted on an inner region of a frame-shaped mounting part (51) of the mounting board, and in which the curved surface part is in a hollow state,
the mounting board;
A guide plate member (6) that can be attached to and detached from the mounting board and is used for positioning the micro vibrator and the mounting board,
The mounting board includes a plurality of electrode parts (53) arranged to surround the mounting part while being separated from each other, and a plurality of outer frames arranged to surround the plurality of electrode parts while being separated from each other. (54), and a fitting groove (543, 56) provided at a portion located closer to the plurality of outer frame portions than the plurality of electrode portions, into which a part of the guide plate material is fitted. and
The guide plate material includes a contact portion (61) that comes into contact with the micro-vibrator when the micro-vibrator is mounted on the mounting portion, and a frame-like frame that is connected to the contact portion and surrounds the contact portion. A body portion (62), a plurality of gripping portions (64) arranged on the outer peripheral side of the frame portion, and a plurality of support portions (63) connecting the plurality of gripping portions and the frame portion, respectively. , has
The guide plate material has a dimension smaller in the height direction than the micro-vibrator, with the height direction being a direction along the thickness direction of the mounting board when the micro-vibrator is mounted on the mounting board. structure. The contact portion has an annular frame shape,
The fitting groove is a gap between the plurality of electrode parts and the plurality of outer frame parts,
The positioning structure according to claim 1, wherein the frame portion is fitted into the fitting groove. A gap between adjacent outer frame parts among the plurality of outer frame parts serves as a positioning groove (55) between the guide plate material and the mounting board,
The positioning structure according to claim 1 or 2, wherein the support portion is fitted into the positioning groove. The frame portion includes a plurality of beam portions (621, 622) that are displaced in conjunction with the grip portion when the grip portion is displaced, and a positioning fitting that is connected to the beam portion and used for positioning with the mounting board. part (65), and
The fitting groove is formed in a plurality of the outer frame parts,
The positioning structure according to claim 1 or 2, wherein the positioning fitting part is fitted into the fitting groove. The plurality of support portions include a first support portion extending along a first direction and a second support portion extending along a second direction intersecting the first direction. The positioning structure according to any one of claims 1 to 4, wherein the positioning structure comprises a portion. The direction in which one end of the support part on the side of the grip part and the other end of the support part on the side of the frame part are connected is defined as a connection direction, and when the support part is displaced along the connection direction, The positioning structure according to claim 4, further comprising an elastic deformation part (67) for making the displacement of the contact part smaller than the displacement of the grip part. The positioning structure according to claim 1 or 2, wherein the frame portion has an annular frame shape surrounding the contact portion. Claim 4 or 4, wherein the frame portion includes a first beam portion (621) extending in one direction and a second beam portion (622) extending in a direction different from the one direction. 6. The positioning structure described in 6. The connection direction is a direction in which one end of the support part on the side of the grip part and the other end of the support part on the side of the frame body part are connected, and the contact part is arranged on an extension line of the connection direction, and The positioning structure according to any one of claims 4, 6, and 8, wherein when the positioning structure is displaced along the connection direction, the positioning structure is displaced along the connection direction in conjunction with the displacement of the grip portion. The plurality of beam portions are each connected to a different one of the gripping portions via a different one of the support portions, and one end of the connected support portions on the side of the gripping portion and the side of the beam portion. Any one of claims 4, 6, 8, and 9, wherein when the grip portion is displaced along the connection direction, the grip portion is elastically deformed along the connection direction, with the direction in which the grip portion is connected to the other end as the connection direction. The positioning structure described in one. Claims 4 and 6, wherein the frame portion further includes a spring portion (66) for facilitating the displacement of the beam portion in conjunction with the displacement of the grip portion when the grip portion is displaced. 11. The positioning structure according to any one of 8, 9, and 10. The surface of the contact portion opposite to the frame portion is an inner peripheral surface, the inner peripheral surface opposite to the mounting board side is an upper end, and the upper end is directed toward the mounting portion. The positioning structure according to any one of claims 4, 6, 9, and 10, comprising a convex portion (611) that projects. A surface of the contact portion opposite to the frame body portion is an inner peripheral surface, and a lower end of the inner peripheral surface on the mounting board side is a claw protruding toward the mounting portion on the lower end side. Positioning structure according to any one of claims 4, 6, 9, 10, comprising a section (612). a microvibrator (2) having a curved surface portion (21) having an annular curved surface and a recessed portion (22) recessed from the curved surface portion;
A frame-like mounting part (51), a plurality of electrode parts (53) arranged to surround the mounting part while being spaced apart from each other, and a plurality of electrode parts (53) arranged to surround the plurality of electrode parts while being spaced apart from each other. a mounting board (3) having a plurality of outer frame parts (54), the recessed part of the micro vibrator being connected to the inner region of the mounting part via a joining member (52); , comprising;
A method for manufacturing an inertial sensor (1) in which the curved surface section becomes hollow when the micro vibrator is mounted on the mounting section,
A contact part (61) that is used for positioning when mounting the micro-vibrator on the mounting board and comes into contact with the micro-vibrator when mounting the micro-vibrator on the mounting part; A frame-shaped frame part (62) that is connected and surrounds the contact part, a plurality of grip parts (64) arranged on the outer peripheral side of the frame part, and a plurality of grip parts and the frame part. Preparing a guide plate material having a plurality of support parts (63) respectively connecting the
preparing the minute vibrating body;
preparing the mounting board having a fitting groove (543, 56) provided in a portion located closer to the plurality of outer frame parts than the plurality of electrode parts, into which a part of the guide plate material is fitted;
applying the bonding member to the inner region of the mounting section;
mounting a part of the guide plate material in the fitting groove to form a positioning structure (100) for the micro-vibrator;
After forming the positioning structure, the micro-vibrating body is brought into contact with the contact portion of the guide plate material, and while being aligned with the mounting board, the micro-vibrating body is inserted at a position inside the contact portion. And,
After inserting the micro-vibrator, the micro-vibrator is mounted on the mounting board via the bonding member while pressing the suction surface (22a) of the recess of the micro-vibrator on the side opposite to the mounting board. joining the inner region of the portion;
A method of manufacturing an inertial sensor, the method comprising: removing the guide plate material from the mounting board after bonding the micro vibrator and the mounting board. In preparing the mounting board, one is prepared in which a gap between adjacent outer frame parts among the plurality of outer frame parts is a positioning groove (55) into which the support part of the guide plate material is fitted. ,
In forming the positioning structure, when the guide plate material is attached to the mounting board, the supporting part of the guide plate material is fitted into the positioning groove, so that the guide plate material is temporarily attached to the mounting board. The method for manufacturing an inertial sensor according to claim 14, wherein the inertial sensor is fixed and immobile. In preparing the guide plate material, a plurality of beam parts (621, 622) that are displaced in conjunction with the displacement of the grip part, and a plurality of beam parts (621, 622) that are connected to the beam parts and used for positioning with the mounting board are provided. preparing the guide plate material including the frame portion having a positioning fitting portion (65);
In forming the positioning structure, fitting the positioning fitting portion of the guide plate into the fitting groove of the mounting board;
After inserting the micro-vibrating body inside the contact portion, when the micro-vibrating body is misaligned with respect to the mounting board, one end of the supporting portion on the gripping portion side and the frame By displacing the grip part along the connection direction, with the direction in which the other end of the body part is connected as the connection direction, the contact part is displaced in conjunction with the displacement of the grip part, and the contact part 15. The method of manufacturing an inertial sensor according to claim 14, further comprising: pushing the micro-vibrating body through the micro-vibrator to adjust the position of the micro-vibrating body. In preparing the guide plate material, a plurality of beam parts (621, 622) that are displaced in conjunction with the displacement of the grip part, and a plurality of beam parts (621, 622) that are connected to the beam parts and used for positioning with the mounting board are provided. preparing the guide plate material including the frame portion having a positioning fitting portion (65);
In forming the positioning structure, fitting the positioning fitting portion of the guide plate into the fitting groove of the mounting board;
In inserting the micro-vibrating body, the micro-vibrating body is inserted while the gripping part is pulled to the opposite side of the contact part to displace the contact part, and the gap between the opposing contact parts is widened. 15. The method for manufacturing an inertial sensor according to claim 14, wherein after the insertion, the gripping section is released and the micro-vibrating body is aligned using the restoring force of the contacting section. In preparing the guide plate material, a plurality of beam parts (621, 622) that are displaced in conjunction with the displacement of the grip part, and a plurality of beam parts (621, 622) that are connected to the beam parts and used for positioning with the mounting board are provided. a positioning fitting part (65), the frame part having a positioning fitting part (65), and an inner circumferential surface of the contact part on the opposite side from the frame part; preparing the guide plate material including a claw portion (612) protruding from the lower end side on the mounting board side;
In forming the positioning structure, fitting the positioning fitting portion of the guide plate into the fitting groove of the mounting board;
In inserting the micro-vibrating body, the micro-vibrating body is supported by the claw portion, and the micro-vibrating body is positioned with respect to the mounting board without contacting the mounting board;
In bonding the micro-vibrator to the inner region of the mounting section, before pressing the suction surface of the micro-vibrator, the gripping section is pulled to the opposite side of the contact section. By displacing the micro-vibrating body and making the gap between the opposing contact parts wider than the width of the micro-vibrating body, the micro-vibrating body is dropped onto the mounting board, and the recess of the micro-vibrating body and the bonding member are connected to each other. The method for manufacturing an inertial sensor according to claim 14, wherein the inertial sensor is brought into contact.

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