JP7411169B2 - Piezoelectric vibrator and piezoelectric vibrator manufacturing method - Google Patents

Description

The present invention relates to a piezoelectric vibrator and a method for manufacturing a piezoelectric vibrator.

Conventionally, in piezoelectric vibrators, in order to reduce the occurrence of misalignment of the crystal vibrating element due to physical shock such as dropping, conductive adhesive is provided at four diagonal points of the piezoelectric vibrating element. A four-point holding structure was used to hold the However, with the progress of miniaturization of piezoelectric vibrators, the four-point holding structure impedes the vibration of the piezoelectric vibrating plate, so by providing conductive adhesive at two locations on one end of the piezoelectric vibrating element, piezoelectric vibration A two-point holding structure for holding the element has become mainstream. On the other hand, the joint area of the two-point holding structure is smaller than that of the four-point holding structure, making it difficult to ensure impact resistance. For this reason, piezoelectric vibrators employing a two-point holding structure are required to have improved impact resistance.

For example, in Patent Document 1, in order to fix the crystal piece to the substrate, a conductive holding member is provided closer to the longitudinal end of the crystal piece than the through hole of the crystal piece and between the crystal piece and the substrate. A crystal resonator employing a two-point holding structure is disclosed.

For example, Patent Document 2 discloses that in order to fix the crystal piece to the substrate, a conductive holding member is placed closer to the longitudinal end of the crystal piece than the through hole of the crystal piece and between the mount part and the substrate. A crystal resonator employing a two-point holding structure is disclosed.

Japanese Patent Application Publication No. 09-326667 Japanese Patent Application Publication No. 2012-195652

However, the conductive holding members disclosed in Patent Documents 1 and 2 can absorb the impact on the crystal piece from the thickness direction, but the impact can be absorbed in the direction intersecting the thickness direction, for example, the longitudinal direction or the transverse direction of the crystal piece. It may not be possible to absorb the impact from the crystal piece. Therefore, the crystal pieces held by the conductive holding members disclosed in Patent Documents 1 and 2 may not have sufficient impact resistance in the longitudinal direction and the transverse direction of the crystal pieces. As a result, the impact from the longitudinal direction or the lateral direction may cause the crystal piece to be misaligned with respect to the substrate, which may change the electrical characteristics of the crystal resonator.

The present invention was invented in view of the above circumstances, and an object of the present invention is to provide a piezoelectric vibrator that can achieve good impact resistance and electrical characteristics while realizing miniaturization. It is.

A piezoelectric vibrator according to one aspect of the present invention includes a piezoelectric piece having a main surface, an excitation electrode formed on the main surface of the piezoelectric piece, a first direction in a plan view of the main surface of the piezoelectric piece, and the first direction. a piezoelectric vibrating element, a substrate, and a piezoelectric vibrating element, the piezoelectric vibrating element having a connecting electrode that is provided on a peripheral edge located on the end side of the first direction in a second direction that intersects with the excitation electrode, and a connecting electrode electrically connected to the excitation electrode; a conductive holding member provided between the connection electrode of the element and the substrate to hold the piezoelectric vibrating element on the substrate; , a through hole passing through the piezoelectric piece is provided, and the conductive holding member is provided so as to straddle the peripheral edge along the first direction, and the conductive holding member is provided on both sides of the peripheral edge in the first direction. A fillet is formed on each of the first side surface and the first wall surface of the through hole.

According to the present invention, it is possible to provide a piezoelectric vibrator that can achieve good impact resistance and electrical characteristics while realizing miniaturization.

FIG. 1 is a perspective view showing the appearance of a crystal resonator according to a first embodiment. 2 is a sectional view taken along the line II-II in FIG. 1. FIG. FIG. 1 is a plan view for explaining the configuration of a crystal resonator according to a first embodiment. FIG. 3 is a flowchart diagram for explaining a method for manufacturing a crystal resonator according to the first embodiment. FIG. 7 is a plan view for explaining the configuration of a crystal resonator according to a second embodiment. FIG. 7 is a diagram for explaining the configuration of a conductive holding member according to a modification. FIG. 7 is a diagram for explaining the configuration of a conductive holding member according to a modification. FIG. 7 is a diagram for explaining the configuration of a conductive holding member according to a modification.

Embodiments of the present invention will be described below. In the description of the drawings below, the same or similar components are represented by the same or similar symbols. The drawings are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiments described above.

[First embodiment]
<Overview of crystal oscillator 1>
First, the configuration of a quartz crystal resonator unit 1 according to a first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view showing the appearance of a crystal resonator 1 according to the first embodiment. FIG. 2 is a sectional view taken along line II-II in FIG. In the following description, the state of the crystal resonator 1 shown in FIG. 2 may be referred to as an "assembled state".

The crystal resonator 1 according to the first embodiment is an example of a piezoelectric resonator that employs a two-point holding structure. The crystal resonator 1 includes a quartz crystal resonator 10, a lid member 20, and a substrate 30. Further, the crystal resonator 1 includes a conductive holding member 50, a sealing frame 37, and a joining member 40.

In the assembled state, the crystal vibrating element 10 is mounted on the substrate 30 via a conductive holding member 50 provided at one end of the crystal vibrating element 10 in the longitudinal direction. The lid member 20 is joined to the substrate 30 via the sealing frame 37 and the joining member 40 so as to cover the crystal vibrating element 10 . In this way, the crystal vibrating element 10 is sealed in the internal space of the sealed container constituted by the lid member 20 and the substrate 30.

In addition, in the assembled state, the thickness direction, longitudinal direction, and lateral direction of each of the crystal resonator 1, the crystal resonator element 10, and the crystal piece 11 of the crystal resonator element 10, which will be described later, are Z as shown in FIG. It coincides with the '-axis direction, the X-axis direction, and the Y'-axis direction.

<Details of crystal oscillator 1>
Next, each structure of the crystal resonator 1 will be explained in detail with reference to FIGS. 1 to 3. FIG. 3 is a plan view for explaining the configuration of the crystal resonator 1 according to the first embodiment. Note that in FIG. 3, illustration of the lid member 20 and some of the electrodes is omitted.

(Crystal resonator 10)
The crystal vibrating element 10 is an example of a piezoelectric vibrating element, and has a plate shape. Further, the crystal vibrating element 10 includes a crystal piece 11 and a plurality of electrodes provided on the crystal piece 11. The plurality of electrodes of the crystal vibrating element 10 include excitation electrodes 14a, 14b, connection electrodes 16a, 16b, and extraction electrodes 15a, 15b.

The crystal piece 11 is an example of a piezoelectric piece, and is, for example, an AT-cut crystal substrate. AT-cut crystal substrates are designed to rotate the Y-axis and Z-axis around the X-axis by 35 degrees 15 minutes ± 1 minute in the direction from the Y-axis to the Z-axis. If the axes rotated for 30 seconds are the Y' axis and Z' axis, respectively, a plane parallel to the plane specified by the X axis and Y' axis (hereinafter referred to as "XY' plane". The same applies to the surface to be used.) The main surface is cut out from synthetic quartz crystal. The crystal vibrating element 10 employing an AT-cut crystal piece 11 mainly vibrates in the thickness shear vibration mode. Note that the cutting angle of the crystal piece 11 is not limited, and for example, a BT cut, a GT cut, or an SC cut can be applied.

Further, the crystal piece 11 is a plate-like member. In the example shown in FIG. 2, the crystal piece 11 has a rectangular parallelepiped shape. Note that the shape of the crystal piece 11 is not limited to a rectangular parallelepiped, and may have a mesa structure, for example, which is thick at the center and thin at the periphery. Further, the crystal piece 11 has two main surfaces 12a and 12b on both sides in the thickness direction. The main surfaces 12a and 12b have a rectangular shape in plan view. A pair of excitation electrodes 14a, 14b are provided at the center of the main surfaces 12a, 12b. Note that, in a plan view of the main surfaces 12a and 12b, the longitudinal direction is an example of a "first direction", and the transversal direction is an example of a "second direction".

Further, the crystal piece 11 has a peripheral portion 110 located on the end side in the longitudinal direction. The peripheral portion 110 has a first side surface 111, a second side surface 112, and a third side surface 113. In the assembled state, the peripheral portion 110 is provided with a conductive holding member 50 for holding the crystal vibrating element 10 on the substrate 30.

Further, in the crystal blank 11 , a through hole 120 that penetrates the crystal blank 11 is provided in a region between the longitudinal edge portion 110 and the excitation electrode 14 . The through hole 120 allows the peripheral portion 110 to support the vibrating portion of the crystal piece 11 and to reduce the restraining force exerted by the peripheral portion 110 on the vibration of the vibrating portion of the crystal piece 11 . Furthermore, the through hole 120 has a first wall surface 121 , a second wall surface 122 , a third wall surface 123 , and a fourth wall surface 124 . The first wall surface 121 of the through hole 120 and the first side surface 111 of the peripheral edge portion 110 constitute both side surfaces of the peripheral edge portion 110 in the longitudinal direction of the crystal piece 11 .

The excitation electrodes 14a and 14b are electrodes that cause the crystal blank 11 to undergo thickness shear vibration when a voltage is applied thereto. Further, the excitation electrodes 14a and 14b are metal films made of the same material. For example, the excitation electrodes 14a and 14b are made of a chromium (Cr) layer and a gold (Au) layer on the surface of the chromium layer. Further, other electrodes of the crystal resonator 1 (excluding via electrodes 34a and 34b), which will be described later, are also made of the same material as the excitation electrodes 14a and 14b.

The connection electrodes 16a and 16b are terminals for electrically connecting the crystal vibrating element 10 to the substrate 30. Further, the connection electrodes 16a and 16b are provided on the main surface 12b side of the peripheral portion 110. The extraction electrodes 15a, 15b are electrodes for electrically connecting the excitation electrodes 14a, 14b to the connection electrodes 16a, 16b. The extraction electrodes 15a and 15b are provided on the peripheral portion 110.

(Substrate 30)
The substrate 30 is an example of a substrate on which the crystal resonator 10 is mounted, and has a plate shape. The substrate 30 includes a base 31 and a plurality of electrodes provided on the base 31. The plurality of electrodes on the substrate 30 include connection electrodes 33a, 33b, via electrodes 34a, 34b, and external electrodes 35a, 35b, 35c, 35d.

The base 31 is made of a light-transmitting material, such as glass. Further, the base body 31 has two main surfaces 32a and 32b on both sides in the thickness direction, and two via holes 32c that penetrate the base body 31 in the thickness direction.

The main surface 32a is a surface on which the crystal resonator 10 is mounted. Connection electrodes 33a and 33b are provided on the main surface 32a. The connection electrodes 33a and 33b are terminals for electrically connecting to the connection electrodes 16a and 16b of the crystal resonating element 10.

The main surface 32b is a surface facing an external mounting board (not shown). External electrodes 35a, 35b, 35c, and 35d are provided at four corners of the main surface 32b. The external electrodes 35a to 35d are terminals for electrical connection to an external mounting board. Specifically, the external electrodes 35a and 35b are input/output electrodes to which input/output signals of the crystal resonator 10 are supplied, and the external electrodes 35c, 35d are electrodes to which input/output signals of the crystal resonator 10 are not supplied. be.

Via electrodes 34a and 34b are provided in the two via holes 32c. Via electrodes 34a, 34b are electrodes for connecting connection electrodes 33a, 33b and external electrodes 35a, 35b. Further, the via electrodes 34a and 34b are formed, for example, by filling a via hole 32c with a metal material such as molybdenum.

(Conductive holding member 50)
The conductive holding member 50 is an adhesive for electrically connecting the connection electrodes 16a, 16b of the crystal vibrating element 10 and the connection electrodes 33a, 33b of the substrate 30. Further, the conductive holding member 50 is formed by, for example, thermally curing a conductive adhesive.

In the assembled state, the conductive holding member 50 is provided between the crystal vibrating element 10 and the substrate 30 in the Z′-axis direction, and is provided at two locations along the lateral direction of the crystal piece 11 in the Y′-axis direction. It is provided. Furthermore, the fillets 55 of the conductive holding member 50 are formed on the first side surface 111 of the peripheral portion 110 and the first wall surface 121 of the through hole 120, which are both side surfaces of the peripheral portion 110 in the X-axis direction in the X-axis direction. has been done.

The conductive holding member 50 formed in this manner holds the crystal vibrating element 10 on the substrate 30 so as to be able to vibrate. In other words, the conductive holding member 50 allows the crystal vibrating element 10 to obtain impact resistance in the Z'-axis direction, the X-axis direction, and the Y'-axis direction. The posture with respect to the X-axis direction and the Y'-axis direction can be maintained. Note that the holding and effect of the conductive holding member 50 on the crystal resonator element 10 will be described in detail after explaining the formation of the conductive holding member 50 in manufacturing the crystal resonator 1.

(Lid member 20)
The lid member 20 has a box shape with an opening formed on the side to be bonded to the substrate 30. The material of the lid member 20 is, for example, a conductive material such as metal. In the assembled state, the inner surface of the lid member 20 and the main surface 32a of the substrate 30 constitute an internal space that accommodates the crystal vibrating element 10.

(Sealing frame 37 and joining member 40)
The sealing frame 37 and the joining member 40 are configured to metallically join the lid member 20 and the substrate 30. The sealing frame 37 is provided at the periphery of the main surface 32a. The material of the sealing frame 37 is a conductive metal. The joining member 40 is provided on the sealing frame 37. The joining member 40 is a brazing member made of, for example, a gold (Au)-tin (Sn) eutectic alloy.

<Manufacture of crystal resonator 1>
Next, manufacturing of the crystal resonator 1 will be explained with reference to FIGS. 1 to 4. FIG. 4 is a flowchart for explaining the method for manufacturing the crystal resonator 1 according to the first embodiment.

First, the crystal resonator 10 is prepared (S10).

Step S10 is an example of a preparation process. Specifically, as described above, the crystal vibrating element 10 in which the excitation electrodes 14a, 14b, the connection electrodes 16a, 16b, the extraction electrodes 15a, 15b, and the through hole 120 are formed is prepared.

Next, the crystal vibrating element 10 is mounted on the substrate 30 via the conductive holding member 50 (S20).

Step S20 is a step of providing a conductive adhesive between the connection electrodes 16a, 16b of the crystal vibrating element 10 and the substrate 30, and a conductive holding member 50 obtained by curing the conductive adhesive. This is an example of a bonding process for bonding 10 to a substrate 30. Specifically, a conductive adhesive, that is, a conductive holding member 50 before being thermoset is provided on the connection electrodes 33a and 33b provided on the main surface 32a of the substrate 30. Next, the crystal vibrating element 10 is placed on the conductive adhesive so that each of the connection electrodes 16a and 16b of the crystal vibrating element 10 is in contact with the conductive adhesive. Subsequently, the conductive adhesive is thermally cured. In this way, the crystal vibrating element 10 is bonded to the substrate 30 by the conductive holding member 50 obtained by thermosetting the conductive adhesive, specifically, the first conductive holding member 50a and the second conductive holding member 50b. do.

Here, placing the crystal vibrating element 10 on the conductive adhesive means that the conductive adhesive is attached to the first side surface 111 and the first wall surface 121, which are both side surfaces of the peripheral portion 110 in the X-axis direction. This includes pressing the peripheral edge 110 of the crystal vibrating element 10 into the conductive adhesive along the thickness direction of the crystal piece 11. In addition, the depth of pushing, in other words, the height of adhesion of the conductive adhesive on the first side surface 111 and the first wall surface 121 in the positive direction of the Z′ axis is determined by using the main surface 12b of the crystal piece 11 as a reference plane. It is 1/3 or more of the thickness of the crystal piece 11.

In this way, the conductive holding member 50 obtained by thermosetting the conductive adhesive has fillets 55 formed on each of the first side surface 111 and the first wall surface 121. In addition, in the thickness direction of the crystal blank 11 , the height of the fillet 55 , that is, in the positive direction of the Z′ axis, the height of the attachment of the fillet 55 on the first side surface 111 and the first wall surface 121 is the same as that of the main surface of the crystal blank 11 . The thickness is 1/3 or more of the thickness of the crystal piece 11 with 12b as a reference plane.

Thereafter, the crystal vibrating element 10 is sealed by bonding the lid member 20 to the substrate 30 (S30).

Specifically, the joining member 40 is provided on the sealing frame 37 of the substrate 30, and the sealing frame 37 and the joining member 40 are interposed between the upper surface of the opening of the lid member 20 and the main surface 32a of the substrate 30. . Then, by heating the joining member 40, the lid member 20 is joined to the substrate 30. In this way, the crystal vibrating element 10 is sealed in the internal space by the lid member 20 and the substrate 30.

In this way, the manufacture of the crystal resonator 1 is completed.

<Holding and effects by the conductive holding member 50>
Next, with reference to FIGS. 1 to 3, the holding and effect of the conductive holding member 50 on the crystal resonating element 10 in the Z′-axis direction, the X-axis direction, and the Y′-axis direction in the assembled state will be explained in detail. explain.

(Z' axis direction)
In the Z'-axis direction, the conductive holding member 50 connects the connecting electrodes 16a, 16b and the connecting electrodes so as to electrically connect the connecting electrodes 16a, 16b of the crystal vibrating element 10 and the connecting electrodes 33a, 33b of the substrate 30. 33a and 33b.

In this way, the crystal vibrating element 10 and the substrate 30 are electrically connected by the conductive holding member 50 provided between the crystal vibrating element 10 and the substrate 30, and the Z' axis of the crystal vibrating element 10 is The orientation with respect to the direction is maintained. In other words, the conductive holding member 50 allows the crystal vibrating element 10 to withstand shocks from both the positive and negative directions of the Z' axis, so that the position of the crystal vibrating element 10 in both the positive and negative directions of the Z' axis is The occurrence of misalignment is suppressed. As a result, the crystal resonator 1 employing such a crystal resonator element 10 can also withstand impacts from both positive and negative directions in the Z'-axis direction, and has good impact resistance in the Z'-axis direction.

(X-axis direction)
In the X-axis direction, the conductive holding member 50 has fillets 55 formed on each of the first side surface 111 of the peripheral portion 110 and the first wall surface 121 of the through hole 120, which are both side surfaces of the peripheral portion 110 in the X-axis direction. has. Further, in order to improve the holding force of the fillet 55 of the conductive holding member 50, the height of the fillet 55 in the thickness direction of the crystal blank 11 is set such that the height of the fillet 55 is set such that the main surface 12b of the crystal blank 11 is the reference plane. It is 1/3 or more of the thickness.

In this way, the attitude of the crystal vibrating element 10 in the X-axis direction is maintained by the fillets 55 of the conductive holding member 50, which are formed on both side surfaces of the peripheral portion 110 in the X-axis direction and have a constant height. In other words, the fillet 55 formed on the first side surface 111 of the peripheral portion 110 and the fillet 55 formed on the first wall surface 121 of the through hole 120 allow the crystal vibrating element 10 to be Designed to withstand shock. Therefore, the occurrence of positional deviation of the crystal vibrating element 10 is suppressed in both the positive and negative directions of the X-axis direction. As a result, the crystal resonator 1 employing such a crystal resonator element 10 can also withstand impacts from both positive and negative directions in the X-axis direction, and has good impact resistance in the X-axis direction.

(Y' axis direction)
In the Y'-axis direction, the conductive holding member 50 includes a first conductive holding member 50a and a second conductive holding member 50a, which are provided on the peripheral edge 110 so as to be spaced apart from each other along the lateral direction of the crystal blank 11. and a sex-retaining member 50b. In both the first conductive holding member 50a and the second conductive holding member 50b, in the Y'-axis direction, the crystal piece 11 is located inside. Specifically, the distance between the outer edges of the first conductive holding member 50a and the second conductive holding member 50b in the Y' direction is the width of the crystal piece 11 in the Y' direction, and the width of the excitation electrodes 14a, 14b in the Y' direction. or the width of the through hole 120 in the Y' direction.

In this manner, the first conductive holding member 50a and the second conductive holding member 50b ensure the bonding length between the crystal vibrating element 10 and the substrate 30 in the Y'-axis direction. In other words, a sufficient bonding area between the crystal vibrating element 10 and the substrate 30 is ensured. Therefore, the attitude of the crystal vibrating element 10 with respect to the Y'-axis direction is maintained. In other words, the first conductive holding member 50a and the second conductive holding member 50b allow the crystal vibrating element 10 to withstand impacts from both positive and negative directions in the Y'-axis direction. In both the positive and negative directions, the occurrence of positional deviation of the crystal vibrating element 10 is suppressed. As a result, the crystal resonator 1 employing such a crystal resonator element 10 can also withstand impacts from both positive and negative directions in the Y'-axis direction, and has achieved impact resistance in the Y'-axis direction.

Further, both the first conductive holding member 50a and the second conductive holding member 50b do not protrude from the periphery of the crystal piece 11, but are formed inside the crystal piece 11. Therefore, there is no need to make the lid member 20 of the crystal resonator 1 large in order to avoid interference with the first conductive holding member 50a and the second conductive holding member 50b. As a result, the crystal resonator 1 can be made smaller.

As described above, according to the conductive holding member 50 according to the first embodiment, it is possible to provide the crystal vibrating element 10 and the crystal resonator 1 that can achieve good impact resistance while realizing miniaturization. It is now possible. Moreover, since the positional shift of the crystal resonator 10 can be suppressed, electrical conductivity between the crystal resonator 10 and the substrate 30 can be ensured. As a result, good electrical characteristics of the crystal resonator 1 can be obtained.

[Second embodiment]
Next, the configuration of the crystal resonator 1 according to the second embodiment will be described with reference to FIG. 5. FIG. 5 is a plan view for explaining the configuration of the crystal resonator 1 according to the second embodiment. Note that in FIG. 5, illustration of the lid member 20 and some of the electrodes is omitted.

The difference between the crystal resonator 1 according to the second embodiment and the crystal resonator 1 according to the first embodiment is the position where the fillet 55 of the conductive holding member 50 is formed, and the other configurations are the same. . In the following description, the description of the common features of the second embodiment and the first embodiment will be omitted, and the content related to the differences will be explained. In particular, similar effects due to similar configurations are not mentioned.

As shown in FIG. 5, the conductive holding member 50 according to the second embodiment has a first side surface 111 and a first wall surface 121, which are both side surfaces of the peripheral portion 110 in the X-axis direction, and a Y'-axis of the through hole 120. It has a fillet 55 formed on each of the second wall surface 122 and the third wall surface 123, which are both wall surfaces in the direction. In other words, the conductive holding member 50 according to the second embodiment has more fillets 55 formed on both wall surfaces of the through hole 120 in the Y'-axis direction than the conductive holding member 50 according to the first embodiment. have

In this manner, in the assembled state, in addition to the first conductive holding member 50a and the second conductive holding member 50b, conductive holding members formed on both wall surfaces of the through hole 120 in the Y' direction The fillet 55 of 50 maintains the attitude of the crystal resonating element 10 with respect to the Y'-axis direction. Therefore, compared to the first embodiment, the conductive holding member 50 according to the second embodiment can further improve the impact resistance of the crystal vibrating element 10 in the Y'-axis direction, and In both directions, the occurrence of positional deviation of the crystal vibrating element 10 can be more reliably suppressed. As a result, the impact resistance of the crystal resonator 1 employing the crystal resonator 10 in the Y'-axis direction is further improved.

Therefore, according to the conductive holding member 50 according to the second embodiment, it is possible to exhibit the same effects as in the first embodiment, and also to obtain better impact resistance in the Y'-axis direction.

[Other modifications of the configuration of the conductive holding member 50]
Next, some of various modifications of the configuration of the conductive holding member 50 and the fillet 55 of the conductive holding member 50 will be described with reference to FIGS. 6A to 6C. 6A to 6C are diagrams for explaining the configuration of a conductive holding member 50 according to a modification. Note that illustration of the lid member 20 and some of the electrodes is omitted in FIGS. 6A to 6C.

The configuration of the conductive holding member 50 and the fillet 55 of the conductive holding member 50 is not limited to the above embodiment, and may ensure impact resistance in the Z'-axis direction, the X-axis direction, and the Y'-axis direction. It is possible to apply various modifications as long as possible.

For example, with respect to the formation position of the fillet 55 of the conductive holding member 50 according to the second embodiment, as shown in FIG. 6A, the fillet 55 of the conductive holding member 50 is It may be formed on the first side surface 111 and the first wall surface 121 which are , and the second side surface 112 and third side surface 113 which are both side surfaces of the peripheral edge part 110 in the Y'-axis direction. According to such a conductive holding member 50, the same effects as those of the second embodiment can be exhibited, and the bonding area by the conductive holding member 50 can be expanded. Therefore, the electrical characteristics can be further improved.

Furthermore, for example, with respect to the formation position of the fillet 55 of the conductive holding member 50 according to the example shown in FIG. 6A, as shown in FIG. 6B, the fillet 55 of the conductive holding member 50 is , the second wall surface 122 and the third wall surface 123 which are both wall surfaces of the through hole 120 in the Y'-axis direction, and both sides of the peripheral portion 110 in the Y'-axis direction. It may be formed on each of the second side surface 112 and the third side surface 113, which are surfaces. According to such a conductive holding member 50, the same effect as the example shown in FIG. 6A can be exhibited, and the impact resistance of the crystal resonator 1 in the Y'-axis direction can be further improved.

Furthermore, for example, with respect to the formation position of the fillet 55 of the conductive holding member 50 according to the first embodiment, as shown in FIG. 6C, at least the first conductive holding member 50a of the conductive holding member 50 is , a first side surface 111 and a first wall surface 121 which are both side surfaces of the peripheral edge part 110 in the X-axis direction, and a third side surface 113 and a third wall surface 123 which are both side surfaces of the peripheral edge part 110 in the Y'-axis negative direction. They may be formed separately. According to such a conductive holding member 50, it is possible to exhibit the same effects as in the first embodiment, and also to obtain better impact resistance of the crystal resonator 1 in the Y'-axis direction.

Further, although the conductive holding member 50 according to the first embodiment, the second embodiment, and the examples shown in FIGS. 6A to 6C have been described as holding at two points, the conductive holding member 50 is not limited to holding at two points. For example, it may be four-point holding including the two-point holding according to the first embodiment, the second embodiment, and the examples shown in FIGS. 6A to 6C. According to such a conductive holding member 50 with four-point holding, effects similar to those of the first embodiment, the second embodiment, and the examples shown in FIGS. 6A to 6C can be exhibited.

Exemplary embodiments of the invention have been described above.
In a crystal resonator 1 according to an embodiment of the present invention, a crystal blank 11 having main surfaces 12a and 12b, excitation electrodes 14a and 14b formed on the main surfaces 12a and 12b of the crystal blank 11, and Provided on the peripheral edge 110 located on the end side in the longitudinal direction of the longitudinal direction, which is the first direction, and the lateral direction, which is the second direction, which intersects the first direction, in a plan view of the main surfaces 12a, 12b, A crystal vibrating element 10 having connecting electrodes 16a, 16b electrically connected to excitation electrodes 14a, 14b, a substrate 30, and a crystal vibrating element 10 provided between the connecting electrodes 16a, 16b of the crystal vibrating element 10 and the substrate 30. , a conductive holding member 50 that holds the crystal vibrating element 10 on the substrate 30, and a region of the crystal piece 11 between the longitudinal peripheral edge 110 and the excitation electrode 14a has a conductive holding member 50 that penetrates the crystal piece 11. The conductive holding member 50 is provided so as to straddle the peripheral edge part 110 along the longitudinal direction, and the peripheral edge which is both sides of the peripheral edge part 110 in the longitudinal direction of the crystal piece 11 is provided. A fillet 55 is formed on each of the first side surface 111 of the portion 110 and the first wall surface 121 of the through hole 120.
According to the above configuration, it is possible to provide a crystal resonator having good impact resistance and electrical characteristics while realizing miniaturization.

Further, in the above configuration, the height of the fillet 55 of the conductive holding member 50 in the thickness direction of the crystal piece 11 may be 1/3 or more of the thickness of the crystal piece 11.
According to the above configuration, the holding force of the conductive holding member by the fillet can be improved, so that the fillet can securely hold the crystal blank.

Further, in the above configuration, the conductive holding member 50 includes a first conductive holding member 50a and a second conductive holding member 50b, and the first conductive holding member 50a and the second conductive holding member 50b are They may be provided in the peripheral portion 110 so as to be spaced apart from each other along the second direction, that is, the transverse direction.
According to the above configuration, it is possible to increase the bonding area by the conductive holding member, and it is possible to improve the stability of the bond and the impact resistance in the lateral direction.

Further, in the above configuration, the through hole 120 has a second wall surface 122 on one side in the transverse direction, which is the second direction, and a third wall surface 123 on the other side in the transverse direction. The conductive holding member 50a may further have a fillet 55 formed on the second wall surface 122, and the second conductive holding member 50b may further have a fillet 55 formed on the third wall surface 123.
According to the above configuration, it is possible to improve the impact resistance of the crystal resonator in the lateral direction and to reduce the size of the crystal resonator, compared to a case where fillets are not formed on the second wall surface and the third wall surface. can be realized.

Further, in the above configuration, the first conductive holding member 50a has a second side surface 112 on one side in the lateral direction, which is the second direction, and a third side surface 113 on the other side in the lateral direction. may further have a fillet 55 formed on the second side surface 112, and the second conductive holding member 50b may further have a fillet 55 formed on the third side surface 113.
According to the above configuration, it is possible to obtain better impact resistance in the transverse direction of the crystal resonator than in the case where fillets are not formed on the second side surface and the third side surface, and also to obtain better impact resistance of the crystal resonator in the transverse direction. Electrical properties can be improved.

Further, in the above configuration, of the first conductive holding member 50a and the second conductive holding member 50b, at least the first conductive holding member 50a is located on one side in the lateral direction which is the second direction of the through hole 120. It may further include a fillet 55 formed on a certain second wall surface 122 and a fillet formed on the second side surface 112 on one side of the peripheral edge 110 in the lateral direction.
According to the above configuration, compared to a case where fillets are not formed on the second wall surface and the second side surface, it is possible to improve the impact resistance of the crystal resonator in the transverse direction, and also to freely install the conductive holding member. You can increase the degree.

Further, in the above configuration, when the main surface 12a of the crystal blank 11 is viewed from above, the crystal resonator 10 and the through hole 120 each have a rectangular shape, and the longitudinal direction of the crystal resonator 10 is aligned along the first direction. The longitudinal direction of the through hole 120 may extend along the second direction.
According to the above configuration, it is possible to obtain a crystal resonator having good impact resistance.

Furthermore, in the above configuration, the material of the crystal piece 11 may be crystal.
According to the above configuration, it is possible to provide a miniaturized crystal resonator that can improve impact resistance and electrical characteristics.

In a method for manufacturing a crystal resonator 1 according to another embodiment of the present invention, a crystal blank 11 having main surfaces 12a and 12b, excitation electrodes 14a and 14b formed on main surfaces 12a and 12b of the crystal blank 11, A peripheral edge portion located on the end side of the longitudinal direction of the longitudinal direction which is the first direction and the transverse direction which is the second direction intersecting the first direction in a plan view of the main surfaces 12a and 12b of the crystal piece 11 110 and has connection electrodes 16a, 16b electrically connected to the excitation electrodes 14a, 14b, and in a region of the crystal blank 11 between the longitudinal peripheral edge 110 and the excitation electrode 14a, A preparation process for preparing a crystal vibrating element 10 in which a through hole 120 passing through the crystal piece 11 is provided, and a process of providing a conductive adhesive between the connection electrodes 16a, 16b of the crystal vibrating element 10 and the substrate 30. and a bonding step of bonding the crystal vibrating element 10 to the substrate 30 using a conductive holding member 50 obtained by curing a conductive adhesive, and the bonding step includes bonding the fillet 55 of the conductive holding member 50, This includes forming on each of the first side surface 111 of the peripheral edge section 110 and the first wall surface 121 of the through hole 120, which are both side surfaces of the peripheral edge section 110 in the longitudinal direction.
According to the above method, it is possible to obtain a crystal resonator having good impact resistance and electrical characteristics while realizing miniaturization.

Further, in the above method, the bonding step may include forming the fillet 55 of the conductive holding member 50 to have a height of 1/3 or more of the thickness of the crystal piece 11 in the thickness direction of the crystal piece 11.
According to the above method, it is possible to form a fillet of a conductive holding member having a high holding force, and it is possible to improve the impact resistance of a crystal resonator.

Further, in the above method, the bonding step is performed between the connection electrodes 16a, 16b of the crystal vibrating element 10 and the substrate 30 along the transverse direction, which is the second direction that intersects the longitudinal direction, which is the first direction. The method may include forming a first conductive holding member 50a and a second conductive holding member 50b spaced apart from the first conductive holding member 50a.
According to the above method, it is possible to increase the bonding area by the conductive holding member, and it is possible to improve the stability of the bond and the impact resistance in the lateral direction.

Further, in the above method, the joining step further includes forming the fillet 55 of the first conductive holding member 50a on the second wall surface 122 on one side of the lateral direction, which is the second direction, of the through hole 120; The method may further include forming a fillet 55 of the second conductive holding member 50b on the third wall surface 123 on the other side of the lateral direction, which is the second direction, of the through hole 120.
According to the above method, it is possible to improve the impact resistance of the crystal resonator in the transverse direction and to reduce the size of the crystal resonator, compared to the case where fillets are not formed on the second wall surface and the third wall surface. can be realized.

Further, in the above method, the joining step further includes forming a fillet 55 of the first conductive holding member 50a on the second side surface 112 on one side of the lateral direction, which is the second direction, of the peripheral portion 110; The method may further include forming a fillet 55 of the second conductive holding member 50b on the third side surface 113 on the other side of the peripheral portion 110 in the lateral direction.
According to the above method, better impact resistance in the lateral direction of the crystal resonator can be obtained than in the case where fillets are not formed on the second and third side surfaces, and Good electrical characteristics can be obtained.

Further, in the above method, the joining step includes at least the second wall surface 122 on one side in the lateral direction, which is the second direction of the through hole 120, and the second side surface on one side in the lateral direction of the peripheral portion 110. 112 may further include forming a fillet 55 of the first conductive retaining member 50a.
According to the above method, compared to the case where fillets are not formed on the second wall surface and the second side surface, it is possible to improve the impact resistance of the crystal resonator in the transverse direction, and also to freely install the conductive holding member. You can increase the degree.

The embodiments described above are for facilitating understanding of the present invention, and are not intended to be interpreted as limiting the present invention. The present invention may be modified/improved without departing from its spirit, and the present invention also includes equivalents thereof. In other words, the scope of the present invention includes modifications to each embodiment by those skilled in the art as long as they have the characteristics of the present invention. For example, each element included in each embodiment, its arrangement, material, conditions, shape, size, etc. are not limited to those illustrated and can be changed as appropriate. Further, each embodiment is an example, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible, and these are also included in the scope of the present invention as long as they include the characteristics of the present invention. .

DESCRIPTION OF SYMBOLS 1... Crystal resonator, 10... Crystal vibrating element, 11... Crystal piece, 14a, 14b... Excitation electrode, 16a, 16b... Connection electrode, 20... Lid member, 30... Substrate, 50... Conductive holding member, 110... Periphery Part, 111...first side surface, 120...through hole, 121...first wall surface

Claims (12)

A piezoelectric piece having a main surface, an excitation electrode formed on the main surface of the piezoelectric piece, a first direction in a plan view of the main surface of the piezoelectric piece, and a second direction intersecting the first direction. , a piezoelectric vibrating element having a connection electrode provided on a peripheral edge located on the end side in the first direction and electrically connected to the excitation electrode;
A substrate and
a conductive holding member provided between the connection electrode of the piezoelectric vibrating element and the substrate and holding the piezoelectric vibrating element on the substrate;
A through hole passing through the piezoelectric piece is provided in a region of the piezoelectric piece between the peripheral edge portion in the first direction and the excitation electrode,
The conductive holding member is provided along the first direction to reach both side surfaces of the peripheral edge in the first direction, and the conductive holding member is provided on both side surfaces of the peripheral edge in the first direction. a fillet formed on each of a first side surface of the portion and a first wall surface of the through hole;
In the thickness direction of the piezoelectric piece, the height of the fillet of the conductive holding member is 1/3 or more of the thickness of the piezoelectric piece;
Piezoelectric vibrator. The conductive holding member includes a first conductive holding member and a second conductive holding member,
The first conductive holding member and the second conductive holding member are provided at the peripheral portion so as to be spaced apart from each other along the second direction.
The piezoelectric vibrator according to claim 1. The through hole has a second wall surface on one side in the second direction and a third wall surface on the other side in the second direction,
The first conductive holding member further includes a fillet formed on the second wall surface,
The second conductive holding member further includes a fillet formed on the third wall surface.
The piezoelectric vibrator according to claim 2. The peripheral edge portion has a second side surface on one side in the second direction and a third side surface on the other side in the second direction,
The first conductive holding member further includes a fillet formed on the second side surface,
The second conductive holding member further includes a fillet formed on the third side surface.
The piezoelectric vibrator according to claim 2 or 3. Of the first conductive holding member and the second conductive holding member, at least the first conductive holding member has a fillet formed on a second wall surface on one side of the through hole in the second direction. The piezoelectric vibrator according to claim 2, further comprising: a fillet formed on a second side surface of the peripheral portion on the one side in the second direction. When the main surface of the piezoelectric piece is viewed from above, the piezoelectric vibrating element and the through hole each have a rectangular shape,
The longitudinal direction of the piezoelectric vibrating element extends along the first direction,
The longitudinal direction of the through hole extends along the second direction.
A piezoelectric vibrator according to any one of claims 1 to 5. The piezoelectric vibrator according to any one of claims 1 to 6, wherein the piezoelectric piece is made of quartz. A piezoelectric piece having a main surface, an excitation electrode formed on the main surface of the piezoelectric piece, a first direction in a plan view of the main surface of the piezoelectric piece, and a second direction intersecting the first direction. , a connection electrode provided on a peripheral edge located on the end side in the first direction and electrically connected to the excitation electrode, and a connection electrode between the peripheral edge in the first direction and the excitation electrode; a preparation step of preparing a piezoelectric vibrating element, in which a through hole passing through the piezoelectric piece is provided in a region of the piezoelectric piece between;
providing a conductive adhesive between the connection electrode of the piezoelectric vibrating element and the substrate;
a bonding step of bonding the piezoelectric vibrating element to the substrate with a conductive holding member obtained by curing the conductive adhesive,
The joining step includes forming a fillet of the conductive holding member on each of the first side surface of the peripheral edge portion and the first wall surface of the through hole, which are both side surfaces of the peripheral edge portion in the first direction. including,
The bonding step includes forming the fillet of the conductive holding member to have a height of 1/3 or more of the thickness of the piezoelectric piece in the thickness direction of the piezoelectric piece.
A method of manufacturing a piezoelectric vibrator. The joining step includes:
A first conductive holding member and a second conductive holding member spaced apart from the first conductive holding member are provided between the connection electrode of the piezoelectric vibrating element and the substrate along a second direction intersecting the first direction. forming a conductive holding member;
The method for manufacturing a piezoelectric vibrator according to claim 8. The joining step includes:
further forming a fillet of the first conductive holding member on a second wall surface on one side of the through hole in the second direction;
further forming a fillet of the second conductive holding member on a third wall surface on the other side of the through hole in the second direction;
The method for manufacturing a piezoelectric vibrator according to claim 9. The joining step includes:
further forming a fillet of the first conductive holding member on a second side surface of the peripheral edge on one side in the second direction;
further forming a fillet of the second conductive holding member on a third side of the peripheral edge on the other side in the second direction;
The method for manufacturing a piezoelectric vibrator according to claim 9 or 10. The joining step includes:
A fillet of the first conductive holding member is further provided at least on a second wall surface of the through hole on one side in the second direction and a second side surface of the peripheral edge on the one side in the second direction. including causing to form;
The method for manufacturing a piezoelectric vibrator according to claim 9.

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