JP7374039B2 - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP7374039B2
JP7374039B2 JP2020061150A JP2020061150A JP7374039B2 JP 7374039 B2 JP7374039 B2 JP 7374039B2 JP 2020061150 A JP2020061150 A JP 2020061150A JP 2020061150 A JP2020061150 A JP 2020061150A JP 7374039 B2 JP7374039 B2 JP 7374039B2
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manufacturing
electronic device
adhesive
resin layer
electronic component
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JP2021163785A (ja
JP2021163785A5 (https=
Inventor
崇 畦▲崎▼
喬士 甲斐
貴信 室伏
仁 木下
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Mitsui Chemicals Tohcello Inc
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Mitsui Chemicals Tohcello Inc
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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2020061150A 2020-03-30 2020-03-30 電子装置の製造方法 Active JP7374039B2 (ja)

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JP2020061150A JP7374039B2 (ja) 2020-03-30 2020-03-30 電子装置の製造方法

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JP2020061150A JP7374039B2 (ja) 2020-03-30 2020-03-30 電子装置の製造方法

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JP2021163785A JP2021163785A (ja) 2021-10-11
JP2021163785A5 JP2021163785A5 (https=) 2022-12-16
JP7374039B2 true JP7374039B2 (ja) 2023-11-06

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024038490A1 (ja) 2022-08-15 2024-02-22 株式会社レゾナック 半導体加工用保護シート及び半導体デバイスの製造方法
WO2025177868A1 (ja) * 2024-02-22 2025-08-28 リンテック株式会社 ワーク加工用粘着シート及びその製造方法、並びに電子デバイス装置の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005053998A (ja) 2003-08-08 2005-03-03 Nitto Denko Corp 再剥離型粘着シート
JP2007012755A (ja) 2005-06-29 2007-01-18 Rohm Co Ltd 半導体装置および半導体装置集合体
WO2011152045A1 (ja) 2010-06-02 2011-12-08 三井化学東セロ株式会社 半導体ウェハ表面保護用シート、およびそれを用いた半導体ウェハの保護方法と半導体装置の製造方法
JP2012244115A (ja) 2011-05-24 2012-12-10 Sekisui Chem Co Ltd バックグラインド−アンダーフィル一体型テープ、及び、半導体チップの実装方法
WO2017006549A1 (ja) 2015-07-03 2017-01-12 三井化学東セロ株式会社 半導体ウエハ表面保護フィルムおよび半導体装置の製造方法
WO2017077957A1 (ja) 2015-11-04 2017-05-11 リンテック株式会社 半導体装置の製造方法
WO2019135367A1 (ja) 2018-01-05 2019-07-11 東洋紡株式会社 スティフナー
WO2020059572A1 (ja) 2018-09-20 2020-03-26 三井化学東セロ株式会社 電子装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005053998A (ja) 2003-08-08 2005-03-03 Nitto Denko Corp 再剥離型粘着シート
JP2007012755A (ja) 2005-06-29 2007-01-18 Rohm Co Ltd 半導体装置および半導体装置集合体
WO2011152045A1 (ja) 2010-06-02 2011-12-08 三井化学東セロ株式会社 半導体ウェハ表面保護用シート、およびそれを用いた半導体ウェハの保護方法と半導体装置の製造方法
JP2012244115A (ja) 2011-05-24 2012-12-10 Sekisui Chem Co Ltd バックグラインド−アンダーフィル一体型テープ、及び、半導体チップの実装方法
WO2017006549A1 (ja) 2015-07-03 2017-01-12 三井化学東セロ株式会社 半導体ウエハ表面保護フィルムおよび半導体装置の製造方法
WO2017077957A1 (ja) 2015-11-04 2017-05-11 リンテック株式会社 半導体装置の製造方法
WO2019135367A1 (ja) 2018-01-05 2019-07-11 東洋紡株式会社 スティフナー
WO2020059572A1 (ja) 2018-09-20 2020-03-26 三井化学東セロ株式会社 電子装置の製造方法

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