JP7368749B2 - Manufacturing method of light emitting device - Google Patents

Description

The present disclosure relates to a method of manufacturing a light emitting device.

2. Description of the Related Art Conventionally, light-emitting devices are known that include a light-emitting element and a translucent member that covers the light-emitting element. For example, Patent Document 1 describes a light emitting element having a semiconductor layer and a transparent substrate, and a reflective member that exposes at least a part of the side surface and the top surface of the transparent substrate and covers the side surface of the semiconductor layer. , a light-emitting device including a light-transmitting member that covers a portion of a light-transmitting substrate exposed from a reflecting member, and a method for manufacturing the same are disclosed.

International Publication No. 2011/099384

In the manufacture of light emitting devices, there is room for further improvement in controlling the thickness of the resin member that is a translucent member.
An object of embodiments according to the present disclosure is to provide a method for manufacturing a light emitting device that can control the thickness of a resin member.

A method for manufacturing a light emitting device according to an embodiment of the present disclosure includes: a first surface on which a pair of positive and negative electrodes are arranged; a second surface located on the opposite side of the first surface; a step of arranging a plurality of light emitting elements having a third surface located between the surfaces on one surface of a resin member such that the second surface faces each other; The method includes a step of pushing the resin member into the resin member so as to expose the resin member, and a step of cutting the resin member so that at least one of the light emitting elements is included to obtain a plurality of light emitting devices.

According to the embodiments of the present disclosure, the thickness of the resin member can be controlled.

FIG. 1 is a schematic plan view showing a light emitting device according to a first embodiment. FIG. 1A is a schematic cross-sectional view taken along line IB-IB in FIG. 1A. It is a flow chart of the 1st manufacturing method of the light emitting device concerning a 1st embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view showing a first manufacturing method of the light emitting device according to the first embodiment. It is a flowchart of the 2nd manufacturing method of the light emitting device concerning a 1st embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7 is a schematic plan view showing a light emitting device according to a second embodiment. 6A is a schematic cross-sectional view taken along the line VIB-VIB in FIG. 6A. FIG. It is a flow chart of the 1st manufacturing method of the light emitting device concerning a 2nd embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a second embodiment. It is a flowchart of the 2nd manufacturing method of the light emitting device concerning 2nd Embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a second embodiment. FIG. 7 is a schematic plan view showing a light emitting device according to a third embodiment. FIG. 11A is a schematic cross-sectional view taken along the line XIB-XIB in FIG. 11A. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a third embodiment. FIG. 7 is a schematic plan view showing a light emitting device according to a fourth embodiment. FIG. 14A is a schematic cross-sectional view taken along the line XIVB-XIVB in FIG. 14A. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fourth embodiment. FIG. 7 is a schematic plan view showing a light emitting device according to a fifth embodiment. FIG. 17A is a schematic cross-sectional view taken along line XVIIB-XVIIB in FIG. 17A. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic cross-sectional view showing a first manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic cross-sectional view showing a second manufacturing method of a light emitting device according to a fifth embodiment. FIG. 7 is a schematic plan view showing a light emitting device according to a sixth embodiment. 20A is a schematic cross-sectional view taken along line XXB-XXB of FIG. 20A. FIG. It is a flow chart of the manufacturing method of the light emitting device concerning a 6th embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 7 is a schematic cross-sectional view showing a method of manufacturing a light emitting device according to a sixth embodiment. FIG. 3 is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the first embodiment. It is a schematic sectional view showing an example of the manufacturing method of the light emitting device concerning the modification of a 1st embodiment. FIG. 7 is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the second embodiment. It is a schematic sectional view showing an example of the manufacturing method of the light emitting device concerning the modification of a 2nd embodiment. FIG. 3 is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the first embodiment. It is a schematic sectional view showing an example of the manufacturing method of the light emitting device concerning the modification of a 1st embodiment. FIG. 1 is a schematic perspective view showing a light emitting module according to an embodiment. 26A is a schematic cross-sectional view taken along the line XXVIB-XXVIB in FIG. 26A. FIG. FIG. 1 is a schematic exploded perspective view showing a liquid crystal display device using a light emitting module according to an embodiment. FIG. 1 is a schematic perspective view showing a planar light source according to an embodiment. FIG. 28A is a schematic cross-sectional view taken along line XXVIIIB-XXVIIIB in FIG. 28A.

Embodiments will be described below with reference to the drawings. However, the forms shown below are illustrative of a light emitting device, a method of manufacturing a light emitting device, a light emitting module, a liquid crystal display device, and a planar light source for embodying the technical idea of this embodiment, and are limited to the following. It's not something you do. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, unless specifically stated, and are merely illustrative. It's nothing more than that. Note that the sizes, positional relationships, etc. of members shown in each drawing may be exaggerated for clarity of explanation. Further, the sizes, positional relationships, etc. of members shown in each drawing may be simplified. Furthermore, the number of light emitting elements shown in each figure is set as an example to make the configuration easier to understand. Further, an end view showing only a cut surface may be used as the cross-sectional view.

《First embodiment》
[Light emitting device]
FIG. 1A is a schematic plan view showing a light emitting device according to a first embodiment. FIG. 1B is a schematic cross-sectional view taken along line IB-IB in FIG. 1A.

The light emitting device 100 includes a light emitting element 20, a covering member 30 disposed to cover a part of the side surface of the light emitting element 20, an upper surface of the covering member 30, another part of the side surface of the light emitting element 20, and the light emitting element 20. It includes a resin member 40 arranged so as to cover the upper surface, and a light adjustment member (first light adjustment member) 50 arranged so as to cover the upper surface of the resin member 40.
Each configuration of the light emitting device 100 will be described below.

The light emitting element 20 has a first surface 21 on which a pair of positive and negative electrodes 2 are arranged, a second surface 22 located on the opposite side of the first surface 21, and a space between the first surface 21 and the second surface 22. It has a third surface 23. In the light emitting device 100, the first surface 21 and the pair of positive and negative electrodes 2 are the lower surface of the light emitting element 20, the second surface 22 is the upper surface of the light emitting element 20, and the third surface 23 is the side surface of the light emitting element 20. . In this embodiment, as shown in FIG. 1A, the light emitting element 20 has a rectangular shape in plan view, and the light emitting element 20 has four third surfaces 23. The thickness of the light emitting element 20, that is, the height of the third surface 23, may be any height that can contact the covering member 30 and the resin member 40 as shown in FIG. 1B, for example, 50 μm or more and 500 μm or less. The thickness is preferably 100 μm or more and 300 μm or less.

The light emitting element 20 is a known semiconductor light emitting element such as a light emitting diode. The shape, size, etc. of the light emitting element 20 can be arbitrarily selected. The emitted light color of the light emitting element 20 can be selected from any wavelength depending on the purpose. For example, the light-emitting element 20 for blue light (light with a wavelength of 430 to 500 nm) and green light (light with a wavelength of 500 to 570 nm) is a nitride-based semiconductor (In _X Al _Y Ga _1-X-Y N, 0≦X , 0≦Y, X+Y≦1), GaP, etc. can be used. As the red light emitting element 20 (light with a wavelength of 610 to 700 nm), GaAlAs, AlInGaP, etc. can be used in addition to the nitride semiconductor element.

The covering member 30 is a member having a light reflective property that reflects at least the light from the light emitting element 20 toward the resin member 40 side. The coating member 30 can have a reflectance of light from the light emitting element 20 of, for example, 60% or more, preferably 70% or more, and more preferably 90% or more. In this embodiment, the covering member 30 covers the four third surfaces 23 of the light emitting element 20, and covers at least a portion of one third surface 23. More specifically, the covering member 30 covers the first surface 21 side of at least one third surface 23 of the light emitting element 20, and preferably covers the portion below the center in the height direction. There is. The covering member 30 is formed so that a portion in contact with the third surface 23 of the light emitting element 20 creeps up toward the second surface 22 . That is, the covering member 30 in a cross-sectional view has a curved portion recessed downward near the third surface 23 of the light emitting element 20, and further has a flat portion outside the curved portion. Thereby, the light emitting device 100 can reflect light from the light emitting element 20 in different directions at the curved portion and the flat portion, and can improve light extraction efficiency. The thickness of such a covering member 30 is preferably thinner than the thickness of the light emitting element 20, for example, 5 μm or more and 50 μm or less, more preferably 10 μm or more and 45 μm or less, and even more preferably 15 μm or more and 40 μm or less.

As the covering member 30, for example, a light-transmitting resin material containing a light diffusing material can be used. Examples of the resin material include silicone resin, epoxy resin, and urea resin. In particular, it is preferable to use a silicone resin that has excellent light resistance and heat resistance. Examples of the light diffusing material include titanium oxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, silicon nitride, and boron nitride. Among these, from the viewpoint of light reflection, it is preferable to use titanium oxide, which has a relatively high refractive index. Further, as the covering member 30, it is preferable to use a material whose viscosity when heated is higher than that of the resin member 40. For example, a material whose viscosity when heated is 10 Pa.s or more and 70 Pa.s or less can be used, and 30 Pa. - It is preferable to use a pressure of not less than s and not more than 50 Pa·s.

The resin member 40 is a member having a translucent property that transmits at least the light from the light emitting element 20, for example, transmits 60% or more of the light emitted from the light emitting element 20, preferably transmits 90% or more. . The resin member 40 is arranged to cover the other part of the third surface 23 of the light emitting element 20 and the second surface 22 of the light emitting element 20. That is, the resin member 40 is arranged on the second surface 22 of the light emitting element 20 and on the covering member 30. As for the thickness of such a resin member 40, for example, the thickness on the second surface 22 of the light emitting element 20 is preferably 10 μm or more and 300 μm or less, more preferably 10 μm or more and 200 μm or less, and the thickness on the covering member 30 is 100 μm or more. The thickness is preferably 500 μm or less, more preferably 200 μm or more and 400 μm or less, and even more preferably 200 μm or more and 300 μm or less. Further, examples of the resin material used for the resin member 40 include thermosetting resins such as epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin.

Preferably, the resin member 40 includes one or more of a wavelength conversion member and a light diffusing material. By including the wavelength conversion member, the resin member 40 can convert the wavelength of light emitted from the light emitting element 20 into light of a different wavelength. Examples of the wavelength conversion member include phosphor. Examples of the phosphor include yttrium-aluminum-garnet-based phosphor (e.g., Y ₃ (Al, Ga) ₅ O ₁₂ :Ce), lutetium-aluminum-garnet-based phosphor (e.g., Lu ₃ (Al, Ga)). ₅ O ₁₂ :Ce), terbium-aluminum-garnet-based phosphor (e.g., Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce), CCA-based phosphor (e.g., Ca ₁₀ (PO ₄ ) ₆ Cl ₂ :Eu) ), SAE-based phosphors (e.g., Sr ₄ Al ₁₄ O ₂₅ :Eu), chlorosilicate-based phosphors (e.g., Ca ₈ MgSi ₄ O ₁₆ Cl ₂ :Eu), β-sialon-based phosphors (e.g., (Si, Al) ₃ (O,N) ₄ :Eu), α-sialon-based phosphor (e.g., Ca(Si,Al) ₁₂ (O,N) ₁₆ :Eu), SLA-based phosphor (e.g., SrLiAl ₃ N ₄ : Eu), nitride-based phosphors such as CASN-based phosphors (e.g., CaAlSiN ₃ :Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN ₃ :Eu), KSF-based phosphors (e.g., K ₂ SiF ₆ :Mn), KSAF phosphor (e.g. K ₂ Si _0.99 Al _0.01 F _5.99 :Mn) or MGF phosphor (e.g. 3.5MgO・0.5MgF ₂・GeO ₂ : Fluoride-based phosphors such as Mn), phosphors with a perovskite structure (e.g., CsPb(F,Cl,Br,I) ₃ ), or quantum dot phosphors (e.g., CdSe, InP, AgInS ₂ or AgInSe ₂ ) etc.

The KSAF-based phosphor may have a composition represented by the following formula (I).
M ₂ [Si _p Al _q Mn _r F _s ] (I)

In formula (I), M represents an alkali metal and may contain at least K. Mn may be a tetravalent Mn ion. p, q, r, and s may satisfy 0.9≦p+q+r≦1.1, 0<q≦0.1, 0<r≦0.2, and 5.9≦s≦6.1. Preferably, 0.95≦p+q+r≦1.05 or 0.97≦p+q+r≦1.03, 0<q≦0.03, 0.002≦q≦0.02 or 0.003≦q≦0.015. , 0.005≦r≦0.15, 0.01≦r≦0.12 or 0.015≦r≦0.1, 5.92≦s≦6.05 or 5.95≦s≦6.025 It may be. For example, K ₂ [Si _0.946 Al _0.005 Mn _0.049 F _5.995 ], K ₂ [Si _0.942 Al _0.008 Mn _0.050 F _5.992 ], K ₂ [Si _{0. 939} Al _0.014 Mn _0.047 F _5.986 ]. According to such a KSAF-based phosphor, it is possible to obtain red light emission with high brightness and a narrow half-width of the emission peak wavelength.

The resin member 40 can diffuse the light from the light emitting element 20 by including a light diffusing material. As the light diffusing material, those known in the art can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, etc. can be used.

It is preferable that the light adjustment member 50 is a member that reflects part of the light from the light emitting element 20. For example, the light emitting element 20 has a reflectance of 70% to 90%, preferably 80% to 85%. Note that the light adjusting member 50 in this embodiment is arranged so as to cover the entire upper surface of the resin member 40, and can easily extract light from the sides of the light emitting device 100. The thickness of such a light adjustment member 50 is, for example, preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 50 μm or less, and still more preferably 20 μm or more and 50 μm or less. As the light adjustment member 50, for example, a light-transmitting resin material containing a light diffusing material can be used. As the resin material and the light diffusing material, the same materials as those for the covering member 30 can be used. Further, the light adjustment member 50 can be made of the above-mentioned resin material containing a black pigment such as carbon black, or glass.

[Operation of light emitting device]
When the light emitting device 100 is driven, a current is supplied from the external power source to the light emitting element 20, and the light emitting element 20 emits light. A part of the light from the light emitting element 20 is extracted to the outside of the light emitting device 100 via the resin member 40 and the light adjustment member 50. Further, some of the other light is reflected by the covering member 30 and the light adjusting member 50 and then taken out to the outside of the light emitting device 100 .

<<Manufacturing method of the first embodiment>>
[First manufacturing method]
FIG. 2 is a flowchart of the first manufacturing method of the light emitting device according to the first embodiment. 3A to 3G are schematic cross-sectional views showing a first manufacturing method of the light emitting device according to the first embodiment.

The first manufacturing method of the light emitting device 100 is a step of arranging the light adjusting member 50 on the other surface of the resin member 40 located on the opposite side to the one surface on which the light emitting element 20 of the resin member 40 is arranged. a light adjustment member arrangement step S101, a first surface 21 on which a pair of positive and negative electrodes 2 are arranged, a second surface 22 located on the opposite side of the first surface 21, and a first surface 21 and a second surface 22. A light emitting element arrangement step S102, which is a step of arranging a plurality of light emitting elements 20 having a third surface 23 located between them, on one surface of the resin member 40 so that the second surface 22 faces each other; A covering member arrangement step S103 is a step of arranging the covering member 30 on one surface of the member 40 so as to cover a part of the side surface of the light emitting element 20, and a plurality of light emitting elements 20 are arranged so that the electrode 2 is exposed. A pushing step S104 is a step of pushing into the resin member 40, and a light emitting device singulation step S105 is a step of cutting the resin member 40 so that at least one light emitting element 20 is included to obtain a plurality of light emitting devices 100. ,including. Note that the material, arrangement, etc. of each member are as described in the description of the light emitting device 100, so the description will be omitted here as appropriate.

(Light adjustment member placement process)
The light adjustment member arrangement step S101 is a step of arranging the light adjustment member 50 on the other surface of the resin member 40 that is located on the opposite side to the one surface on which the light emitting element 20 is arranged. In this step S101, first, the light adjustment member 50 is placed on the support body 80 via the heat-resistant double-sided adhesive tape 71. Next, the resin member 40 is placed on one surface of the light adjustment member 50. The resin member 40 and the light adjustment member 50 are each formed by a method such as potting, transfer, printing, or spraying, for example. Alternatively, the resin member 40 on which the light adjustment member 50 is placed in advance may be placed on the support body 80 with a heat-resistant double-sided adhesive tape 71 interposed therebetween. Further, the resin member 40 may be bonded to the upper surface of the light adjustment member 50, for example, via an adhesive member.

(Light emitting element placement process)
The light emitting element arrangement step S102 is a step of arranging the plurality of light emitting elements 20 on one surface of the resin member 40 so that the second surface 22 of the plurality of light emitting elements 20 faces the resin member 40. In this step S102, a plurality of light emitting elements 20 are arranged at predetermined intervals.

(Covering member placement process)
The covering member arranging step S103 is a step of arranging the covering member 30 so as to cover one surface of the resin member 40 and a part of the third surface 23 of the light emitting element 20. In this step S103, the covering member 30 covers a part of the third surface 23 of the light emitting element 20 so that the part of the third surface 23 of the light emitting element 20 creeps up toward the first surface 21 of the light emitting element 20. Cover with member 30.

Further, in this step S103, a liquid resin material is placed on the resin member 40 and between the light emitting elements 20 by, for example, potting, spraying, or the like. Thereafter, the liquid resin material is cured to form the covering member 30. The liquid resin material wets and spreads over the third surface 23 of the light emitting element 20, and coats the third surface 23 on the second surface 22 side of the light emitting element 20 with a predetermined thickness. At this time, as shown in FIG. 3D, the portion of the liquid resin material that is in contact with the third surface 23 of the light emitting element 20 creeps upward toward the first surface 21 . Due to this creeping up, the covering member 30 is formed in the vicinity of the third surface 23 of the light emitting element 20 in a curved manner so as to be recessed downward, that is, toward the second surface 22 side.

(pushing process)
The pushing step S104 is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed from the resin member 40. In this step S104, the plurality of light emitting elements 20 are arranged such that the second surface 22 of the light emitting elements 20 faces one surface of the resin member 40, and at least a portion of the third surface 23 of the light emitting elements 20 is made of a resin member. Push it in so that it touches 40. Moreover, in this step S104, the resin member 40 is pushed in so that it remains above the second surface 22 of the light emitting element 20. Note that the term "above the second surface 22" as used herein means a vertical direction facing the second surface 22.

Moreover, in this step S104, first, one sheet of heat-resistant adhesive tape 72 is applied to the electrodes 2 of the plurality of light emitting elements 20 to cover the plurality of light emitting elements 20. Next, after heating (softening) or while heating (while softening) the resin member 40, a pushing device such as a plate made of stainless steel or the like is placed above the heat-resistant adhesive tape 72. The light emitting elements 20 are pushed into the resin member 40 by pushing the plurality of light emitting elements 20 toward the resin member 40 using the LED light emitting device. The heating temperature of the resin member 40 is preferably 40°C or more and 100°C or less. If the heating temperature of the resin member 40 is 40° C. or more and 100° C. or less, the resin member 40 becomes appropriately soft and the light emitting element 20 can be easily pushed into the resin member 40. The heating temperature of the resin member 40 is more preferably 60°C or more and 80°C or less. In this step S104, since the light emitting element 20 is pushed into the resin member 40, the resin member 40 expands in the thickness direction by the amount of pushing. Therefore, the thickness of the resin member 40 after being pushed in becomes thicker as a whole than before being pushed in.

Further, in this step S104, it is preferable that the viscosity of the covering member 30 is higher than the viscosity of the resin member 40. By heating the resin member 40, the covering member 30 is also heated, and the covering member 30 becomes soft. Therefore, it is preferable that the coating member 30 has a higher viscosity during heating than the resin member 40. This prevents the covering member 30 from becoming too soft and flowing.

Further, in this step S104, the light emitting element 20 is arranged such that a part of the third surface 23 of the light emitting element 20 is in contact with the resin member 40 and another part of the third surface 23 of the light emitting element 20 is in contact with the covering member 30. Push in. That is, the light emitting element 20 is pushed in such that the position in contact with the light emitting element 20 changes between the upper and lower positions of the third surface 23 so that the covering member 30 changes from the state shown in FIG. 3E to the state shown in FIG. 3F. In addition, in this step S104, the covering member 30 extends over the other part of the third surface 23 of the light emitting element 20 toward the second surface 22 of the light emitting element 20. The other part of the three surfaces 23 is covered with a covering member 30. Before the light emitting element 20 is pushed into the resin member 40, the portion of the covering member 30 in contact with the third surface 23 of the light emitting element 20 is on the second surface 22 side and creeps up toward the first surface 21 of the light emitting element 20. The covering member 30 becomes soft due to heating when the light emitting element 20 is pushed into the resin member 40. Therefore, when the light emitting element 20 is pushed in, the portion of the covering member 30 in contact with the third surface 23 of the light emitting element 20 is dragged along with the movement of the third surface 23 of the light emitting element 20, and is moved to the first surface 21 side. The covering member 30 is pushed into the resin member 40 so that it has a shape that extends toward the second surface 22 . Thereby, the covering member 30 is pushed into the resin member 40 together with the light emitting element 20, and can be curved so as to be recessed toward the first surface 21 in the vicinity of the third surface 23 of the light emitting element 20. Note that the light emitting element 20 pushed into the resin member 40 is in a state where the electrode 2 is exposed from the resin member 40. Thereafter, the heat-resistant adhesive tape 72 is peeled off from the electrode 2.

In the manufacturing method of the light emitting device 100 according to the present embodiment, as described above, in order to push the light emitting element 20 into the resin member 40, it is preferable to cover the light emitting element 20 with the resin member 40 by a method such as potting or spraying. The thickness of 40 can be made constant. In other words, since the resin member 40 is formed in advance to have a constant thickness, sink marks due to hardening are less likely to occur, and variations in thickness can be reduced. Therefore, the flatness of the upper surface of the resin member 40 can be improved.

Furthermore, since the light emitting element 20 is pushed into the resin member 40, when the resin member 40 includes a wavelength converting member or a light diffusing material, uneven distribution of the wavelength converting member or the light diffusing material can be suppressed. That is, the resin member 40 can be used in a state where the wavelength conversion member and the light diffusing material are more evenly dispersed.

(Light-emitting device singulation process)
The light emitting device singulation step S105 is a step of cutting the resin member 40 so as to include at least one light emitting element 20 to obtain a plurality of light emitting devices 100. In step S105, the structure 5 obtained through steps S101 to S104 is cut at predetermined positions, thereby dividing the light emitting device 100 into pieces into a plurality of light emitting devices 100. The structure 5 includes a light emitting element 20, a covering member 30, a resin member 40, and a light adjusting member 50. The structure 5 is cut by cutting the coating member 30, the resin member 40, and the light adjustment member 50 using a known blade, for example, a rotary blade such as a dicing saw or a cutter such as a Thomson blade. be able to. Thereafter, the heat-resistant double-sided adhesive tape 71 is peeled off from the light emitting device 100.

[Second manufacturing method]
FIG. 4 is a flowchart of the second manufacturing method of the light emitting device according to the first embodiment. 5A to 5E are schematic cross-sectional views showing a second method of manufacturing the light emitting device according to the first embodiment.

The second manufacturing method of the light emitting device 100 is a step of arranging the light adjustment member 50 on the other surface of the resin member 40 located on the opposite side to the one surface on which the light emitting element 20 of the resin member 40 is arranged. A light adjusting member arrangement step S201, a light emitting element arrangement step S202, which is a step of arranging a plurality of light emitting elements 20 on the support 80 so that the first surface 21 of the light emitting element 20 faces the support 80, and a support A covering member arrangement step S203, which is a step of arranging a covering member 30 that covers a part of the side surface of the light emitting element 20 on the body 80, a first surface 21 on which a pair of positive and negative electrodes 2 are arranged, and a first surface 21 A plurality of light emitting elements 20 having a second surface 22 located on the opposite side of A resin member arranging step S204, which is a step of arranging on one surface of the member 40, a pushing step S205, which is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed, and a resin member 40 includes a light-emitting device singulation step S206, which is a step of obtaining a plurality of light-emitting devices 100 by cutting the light-emitting device into pieces so that at least one light-emitting element 20 is included. Note that the material, arrangement, etc. of each member are as described in the description of the light emitting device 100, so the description will be omitted here as appropriate.

(Light adjustment member placement process)
The light adjustment member arrangement step S201 is a step of arranging the light adjustment member 50 on the other surface of the resin member 40 that is located on the opposite side to the one surface on which the light emitting element 20 is arranged. For example, first, the light adjustment member 50 is placed on the heat-resistant adhesive tape 72. Next, by placing the resin member 40 on the upper surface of the light adjustment member 50, the resin member 40 is placed on the heat-resistant adhesive tape 72 via the light adjustment member 50 (see FIG. 5C). The resin member 40 and the light adjustment member 50 are each formed by a method such as potting, transfer, printing, or spraying, for example. Alternatively, the resin member 40 on which the light adjustment member 50 is placed in advance may be placed on the heat-resistant adhesive tape 72. Further, the resin member 40 may be bonded to the upper surface of the light adjustment member 50, for example, via an adhesive member.

(Light emitting element placement process)
The light emitting element arrangement step S202 is a step of arranging a plurality of light emitting elements 20 on the support 80 so that the first surface 21 of the light emitting elements 20 faces the support 80. In this step S202, a plurality of light emitting elements 20 are placed on a support 80 via a heat-resistant double-sided adhesive tape 71. In addition, in this step S202, the electrodes 2 are pushed into the heat-resistant double-sided adhesive tape 71, and a plurality of light emitting elements 20 are placed on the support 80 at predetermined intervals with the electrodes 2 embedded in the heat-resistant double-sided adhesive tape 71. Deploy.

(Covering member placement process)
The covering member arranging step S203 is a step of arranging the covering member 30 that covers a part of the third surface 23 of the light emitting element 20 on the support body 80. In this step S203, the covering member 30 is placed on the support 80 via the heat-resistant double-sided adhesive tape 71. Specifically, the covering member 30 is placed on the heat-resistant double-sided adhesive tape 71 located between the light emitting elements 20 . Further, in this step S203, the covering member 30 covers the third surface 23 on the first surface 21 side of the light emitting element 20 to a predetermined thickness. Further, the covering member 30 creeps up toward the second surface 22 of the light emitting element 20 and is in a curved state near the third surface 23 of the light emitting element 20 so as to be recessed toward the first surface 21 side. Other matters are the same as those in the covering member arrangement step S103 described above.

(Resin member placement process)
The resin member arranging step S204 is a step of arranging the resin member 40 so that the second surfaces 22 of the plurality of light emitting elements 20 face the resin member 40. That is, the plurality of light emitting elements 20 are arranged on one surface of the resin member 40 such that the second surface 22 of the plurality of light emitting elements 20 faces the resin member 40 . In this step S204, the resin member 40 is arranged on the second surface 22 of the plurality of light emitting elements 20 so that the second surface 22 of the light emitting element 20 faces one surface of the resin member 40.

(pushing process)
The pushing step S205 is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed from the resin member 40. In this step S205, the plurality of light emitting elements 20 are arranged such that the second surface 22 of the light emitting elements 20 faces one surface of the resin member 40, so that at least a portion of the third surface 23 of the light emitting elements 20 is connected to the resin member 40. Push it in so that it touches the In this step S205, first, as a pre-step, the resin member 40 provided with the light adjustment member 50 is arranged on the plurality of light emitting elements 20 in the resin member arrangement step S204. Next, after heating (softening) or while heating (while softening) the resin member 40, a pushing device such as a plate made of stainless steel or the like is placed above the heat-resistant adhesive tape 72. The light emitting element 20 is pushed into the resin member 40 by pressing the resin member 40 using the resin member 40. Thereafter, the heat-resistant adhesive tape 72 is peeled off from the light adjustment member 50.

Further, in this step S205, the light emitting element 20 is arranged such that a part of the third surface 23 of the light emitting element 20 is in contact with the resin member 40 and another part of the third surface 23 of the light emitting element 20 is in contact with the covering member 30. Push in. Specifically, after cutting the resin member 40, the light emitting element 20 is pushed so that the resin member 40 is formed on the second surface 22 of the light emitting element 20 and on the covering member 30. Here, by making the viscosity of the covering member 30 higher than the viscosity of the resin member 40, the part of the covering member 30 that has climbed up toward the second surface 22 of the light emitting element 20 can be prevented from being crushed by the resin member 40. do not have. Therefore, it is possible to maintain a state in which the covering member 30 creeps up toward the second surface 22 at the portion in contact with the third surface 23 of the light emitting element 20 . Other matters are the same as those in the above-mentioned pushing step S104.

(Light-emitting device singulation process)
The light emitting device singulation step S206 is similar to the light emitting device singulation step S105 described above. Note that before performing the light emitting device singulation step S206, the structure 5 obtained through steps S201 to S205 is attached to the heat-resistant double-sided adhesive tape 71 so that the light adjustment member 50 is attached to the heat-resistant double-sided adhesive tape. It is placed on a support 80 so as to be joined to 71. After cutting the structure 5, the heat-resistant double-sided adhesive tape 71 is peeled off from the light emitting device 100.

《Second embodiment》
[Light emitting device]
FIG. 6A is a schematic plan view showing a light emitting device according to the second embodiment. FIG. 6B is a schematic cross-sectional view taken along line VIB-VIB in FIG. 6A.

In the light emitting device 100A, a covering member 30b is arranged on the second surface 22 of the light emitting element 20. The resin member 40 is arranged on the upper surface of the covering member 30b. Other matters are the same as those of the light emitting device 100 of the first embodiment, and description thereof will be omitted as appropriate.

The covering member 30 includes a covering member 30a arranged to cover a part of the third surface 23 of the light emitting element 20, and a covering member 30b arranged on the second surface 22 of the light emitting element 20. The covering member 30a has a portion that contacts the third surface 23 of the light emitting element 20 that does not rise toward the second surface 22, and is formed substantially flat from the third surface 23 of the light emitting element 20 to the side surface of the light emitting device 100A. has been done. The covering member 30b is disposed over the entire second surface 22 of the light emitting element 20. The resin member 40 is arranged on the upper surface of the covering member 30a and the upper surface of the covering member 30b. By providing the covering member 30b on the second surface 22 of the light emitting element 20, the light emitting device 100A makes it easier to extract light from the sides of the light emitting device 100A. Further, as the covering member 30, it is preferable to use a material whose hardness is higher than that of the resin member 40.

[Operation of light emitting device]
When the light emitting device 100A is driven, a current is supplied from the external power source to the light emitting element 20, and the light emitting element 20 emits light. A part of the light from the light emitting element 20 is extracted to the outside of the light emitting device 100 via the resin member 40 and the light adjustment member 50. In addition, another part of the light is reflected by the covering member 30a, the covering member 30b, and the light adjusting member 50, and then taken out to the outside of the light emitting device 100A.

<<Manufacturing method of second embodiment>>
[First manufacturing method]
FIG. 7 is a flowchart of the first manufacturing method of the light emitting device according to the second embodiment. 8A to 8D are schematic cross-sectional views showing a first manufacturing method of a light emitting device according to a second embodiment.

The first manufacturing method of the light emitting device 100A is a step of arranging the light adjusting member 50 on the other surface of the resin member 40 located on the opposite side to the one surface of the resin member 40 on which the light emitting element 20 is arranged. A light adjustment member arrangement step S301, which is a step of arranging the covering member 30 on one surface of the resin member 40, a covering member arrangement step S302, which is a step of arranging the covering member 30 on one surface of the resin member 40, and a first surface 21 on which a pair of positive and negative electrodes 2 are arranged, A plurality of light emitting elements 20 having a second surface 22 located on the opposite side of the first surface 21 and a third surface 23 located between the first surface 21 and the second surface 22 are arranged so that the second surface 22 faces each other. A light emitting element arrangement step S303 is a step of arranging the light emitting elements 20 on one surface of the resin member 40 so as to , includes a light emitting device singulation step S305, which is a step of cutting the resin member 40 so as to include at least one light emitting element 20 to obtain a plurality of light emitting devices 100A. Note that the material, arrangement, etc. of each member are as described in the description of the light emitting device 100A, so the description will be omitted here as appropriate.

(Light adjustment member placement process)
The light adjustment member placement step S301 is similar to the light adjustment member placement step S101 described above.

(Covering member placement process)
The covering member arranging step S302 is a step of arranging the covering member 30 on one surface of the resin member 40, that is, on the surface on which the light emitting element 20 is arranged. The covering member 30 is formed by a method such as potting, transfer, printing, or spraying. Further, the covering member 30 may be bonded to the upper surface of the resin member 40 via an adhesive member, for example. The thickness of the covering member 30 in this embodiment is preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 30 μm or less.

(Light emitting element placement process)
The light emitting element arrangement step S303 is a step of arranging the plurality of light emitting elements 20 on one surface of the resin member 40 so that the second surface 22 of the plurality of light emitting elements 20 faces the resin member 40. In this step S303, a plurality of light emitting elements 20 are arranged on one surface of the resin member 40 with the covering member 30 interposed therebetween. That is, the plurality of light emitting elements 20 are arranged at predetermined intervals so that the second surface 22 of the light emitting elements 20 is in contact with the covering member 30 arranged on one surface of the resin member 40.

(pushing process)
The pushing step S304 is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed from the resin member 40. In this step S304, the plurality of light emitting elements 20 are arranged such that the second surface 22 of the light emitting elements 20 faces one surface of the resin member 40, so that at least a portion of the third surface 23 of the light emitting elements 20 is connected to the resin member 40. Push it in so that it touches the In this step S304, the covering member 30 is attached so that a part of the third surface 23 of the light emitting element 20 is in contact with the resin member 40 and another part of the third surface 23 of the light emitting element 20 is in contact with the covering member 30. The part of the light emitting element 20 that the second surface 22 faces is separated from the part that the second surface 22 does not face, and is pushed together with the light emitting element 20 into the resin member 40 .

Further, in this step S304, first, one sheet of heat-resistant adhesive tape 72 is applied to the electrodes 2 of the plurality of light emitting elements 20 to cover the plurality of light emitting elements 20. Next, after heating (softening) or while heating (while softening) the resin member 40, a pushing device such as a plate made of stainless steel or the like is placed above the heat-resistant adhesive tape 72. The light-emitting elements 20 are embedded in the resin member 40 by pushing the plurality of light-emitting elements 20 toward the resin member 40 using the LED. Although the covering member 30 is solidified, it will break when pressure is applied. Therefore, when embedding the light emitting element 20, the covering member 30 located on the second surface 22 of the light emitting element 20 is separated from the covering member 30 and pushed into the resin member 40 together with the light emitting element 20. Thereby, the covering member 30a is arranged so as to partially cover the third surface 23 of the light emitting element 20, and the covering member 30b is arranged so as to cover the second surface 22 of the light emitting element 20. Thereafter, the heat-resistant adhesive tape 72 is peeled off from the electrode 2.

Further, in this step S304, the hardness of the covering member 30 is preferably higher than the hardness of the resin member 40. The hardness of the covering member 30 is higher than the hardness of the resin member 40, so that the covering member 30 is easily broken when the light emitting element 20 is embedded in the resin member 40, and it is also easier to push the light emitting element 20 into the resin member 40. . Other matters are the same as those in the above-mentioned pushing step S104.

(Light-emitting device singulation process)
The light emitting device singulation step S305 is similar to the light emitting device singulation step S105 described above.

[Second manufacturing method]
FIG. 9 is a flowchart of the second manufacturing method of the light emitting device according to the second embodiment. 10A to 10D are schematic cross-sectional views showing a second method of manufacturing a light emitting device according to a second embodiment.

The second manufacturing method of the light emitting device 100A is a step of arranging the light adjustment member 50 on the other surface of the resin member 40 located on the opposite side to the one surface on which the light emitting element 20 of the resin member 40 is arranged. A certain light adjusting member arrangement step S401, a covering member arrangement step S402 which is a step of arranging the covering member 30 on one surface of the resin member 40, and a covering member arrangement step S402 in which the first surface 21 of the light emitting element 20 faces the support body 80. A light emitting element arrangement step S403 is a step of arranging a plurality of light emitting elements 20 on a support body 80, a first surface 21 on which a pair of positive and negative electrodes 2 is arranged, and a first surface 21 located on the opposite side of the first surface 21. A plurality of light emitting elements 20 having two surfaces 22 and a third surface 23 located between the first surface 21 and the second surface 22 are placed on one surface of the resin member 40 so that the second surface 22 faces each other. a resin member arrangement step S404, which is a step of arranging the plurality of light emitting elements 20 into the resin member 40 such that the electrodes 2 are exposed; 20 to obtain a plurality of light emitting devices 100A. Note that the material, arrangement, etc. of each member are as described in the description of the light emitting device 100A, so the description will be omitted here as appropriate.

(Light adjustment member placement process)
The light adjustment member placement step S401 is similar to the light adjustment member placement step S201 described above.

(Covering member placement process)
The covering member arranging step S402 is a step of arranging the covering member 30 on one surface of the resin member 40, that is, the upper surface on which the light emitting element 20 is arranged (see FIG. 10B). The covering member 30 is formed by a method such as potting, printing, or spraying. Further, the covering member 30 may be bonded to the upper surface of the resin member 40 via an adhesive member, for example.

(Light emitting element placement process)
The light emitting element arrangement step S403 is similar to the light emitting element arrangement step S202 described above.

(Resin member placement process)
The resin member arranging step S404 is a step of arranging the resin member 40 so that the second surfaces 22 of the plurality of light emitting elements 20 face the resin member 40. That is, the plurality of light emitting elements 20 are arranged on one surface of the resin member 40 such that the second surface 22 of the plurality of light emitting elements 20 faces the resin member 40 . In this step S404, a plurality of light emitting elements 20 are arranged on one surface of the resin member 40 with the covering member 30 interposed therebetween. In this step S404, the resin member 40 is placed on the plurality of light emitting elements 20 such that the covering member 30 placed on one surface of the resin member 40 contacts the second surface 22 of the light emitting element 20.

(pushing process)
The pushing step S405 is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed from the resin member 40. In this step S405, the covering member 30 is attached such that a part of the third surface 23 of the light emitting element 20 is in contact with the resin member 40 and another part of the third surface 23 of the light emitting element 20 is in contact with the covering member 30. The part of the light emitting element 20 that the second surface 22 faces is separated from the part that the second surface 22 does not face and is pushed into the resin member 40 together with the light emitting element 20 . In this step S405, after heating (after softening) or while heating (while softening) the resin member 40, a pushing device made of, for example, stainless steel, is placed above the heat-resistant adhesive tape 72. The light emitting element 20 is embedded in the resin member 40 by pressing the resin member 40 using a plate. Thereafter, the heat-resistant adhesive tape 72 is peeled off from the light adjustment member 50. Other matters are the same as those in the above-mentioned pushing step S304.

(Light-emitting device singulation process)
The light emitting device singulation step S406 is similar to the light emitting device singulation step S206 described above.

《Third embodiment》
[Light emitting device]
FIG. 11A is a schematic plan view showing a light emitting device according to a third embodiment. FIG. 11B is a schematic cross-sectional view taken along the line XIB-XIB in FIG. 11A.

In the light emitting device 100B, a columnar electrode 3 (hereinafter referred to as a second electrode 3) is further arranged on the electrode 2 of the light emitting element 20 (hereinafter referred to as a first electrode 2). The second electrode 3 is formed in the same shape as the first electrode 2 in plan view on the entire surface of each of the pair of positive and negative first electrodes 2, and for example, heat generated when the light emitting element 20 is made to emit light is transferred to the outside. Heat can be dissipated easily. The thickness of the second electrode 3 is, for example, preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 30 μm or less. Further, the covering member 30 covers the side surface of the first electrode 2, the side surface of the second electrode 3, and the first surface 21 of the light emitting element 20. Other matters are the same as those of the light emitting device 100 of the first embodiment.

<<Manufacturing method of third embodiment>>
[First manufacturing method]
12A to 12C are schematic cross-sectional views showing a first method of manufacturing a light emitting device according to a third embodiment.

The first method for manufacturing the light emitting device 100B includes steps S101 to S105 described in the method for manufacturing the light emitting device 100. Hereinafter, regarding the first manufacturing method of the light emitting device 100B, differences from the first manufacturing method of the light emitting device 100 will be explained.

The first manufacturing method of the light emitting device 100B is such that in the pushing step S104, the covering member 30 is in contact with the side surface of the first electrode 2 and the side surface of the second electrode 3, and is also in contact with the first surface 21 of the light emitting element 20. The element 20 is pushed into the resin member 40. Further, the light emitting element 20 is pushed into the resin member 40 so that the first electrode 2 and the second electrode 3 are exposed from the resin member 40. At this time, the covering member 30 becomes soft due to heating and is placed so as to cover the first surface 21 of the light emitting element 20 .

[Second manufacturing method]
13A to 13C are schematic cross-sectional views showing a second manufacturing method of a light emitting device according to a third embodiment.

The second method for manufacturing the light emitting device 100B includes steps S201 to S206 described in the method for manufacturing the light emitting device 100. Hereinafter, the differences between the second manufacturing method of the light emitting device 100 and the second manufacturing method of the light emitting device 100 will be explained.

In the second manufacturing method of the light emitting device 100B, the covering member 30 is arranged so that the covering member 30 is in contact with the side surface of the first electrode 2 and the side surface of the second electrode 3 in the covering member arrangement step S203. Further, in the pushing step S205, the light emitting element 20 is pushed into the resin member 40 so that the first electrode 2 and the second electrode 3 are exposed from the resin member 40.

《Fourth embodiment》
[Light emitting device]
FIG. 14A is a schematic plan view showing a light emitting device according to a fourth embodiment. FIG. 14B is a schematic cross-sectional view taken along the line XIVB-XIVB in FIG. 14A.

In the light emitting device 100C, the second electrode 3 is arranged on the first electrode 2 of the light emitting element 20, similarly to the light emitting device 100B of the third embodiment. Further, the covering member 30a covers a part of the third surface 23 of the light emitting element 20, and is arranged so as to be substantially flush with the bottom surface of the second electrode 3. Note that the first surface 21, the first electrode 2, and the second electrode 3 of the light emitting element 20 are exposed from the covering member 30a, so that heat dissipation can be improved. Furthermore, in the light emitting device 100C, the covering member 30 is formed thicker than in the light emitting device 100A of the second embodiment. For example, the thickness of the covering member 30 in this embodiment is preferably 10 μm or more and 100 μm or less, and more preferably 20 μm or more and 60 μm or less for each of the covering member 30a and the covering member 30b. Other matters are the same as those of the light emitting device 100A of the second embodiment.

<<Manufacturing method of the fourth embodiment>>
[First manufacturing method]
15A to 15C are schematic cross-sectional views showing a first manufacturing method of a light emitting device according to a fourth embodiment.

The first method for manufacturing the light emitting device 100C includes steps S301 to S305 described in the method for manufacturing the light emitting device 100A. Hereinafter, the differences between the first manufacturing method of the light emitting device 100C and the first manufacturing method of the light emitting device 100A will be explained.

In the first manufacturing method of the light emitting device 100C, the covering member 30 is formed thicker than the covering member 30 of the light emitting device 100A in the covering member arrangement step S302. In addition, in the pushing step S304, the light emitting element 20 is pushed into the resin member 40 so that the covering member 30a covers a part of the third surface 23 of the light emitting element 20 and is substantially flush with the bottom surface of the second electrode 3. .

[Second manufacturing method]
16A to 16C are schematic cross-sectional views showing a second method of manufacturing a light emitting device according to the fourth embodiment.

The second method for manufacturing the light emitting device 100C includes steps S401 to S406 described in the method for manufacturing the light emitting device 100A. Hereinafter, the differences between the second manufacturing method of the light emitting device 100C and the second manufacturing method of the light emitting device 100A will be explained.

In the second manufacturing method of the light emitting device 100C, the covering member 30 is formed thicker than the covering member 30 of the light emitting device 100A in the covering member arrangement step S402. Further, in the pushing step S405, the light emitting element 20 is pushed into the resin member 40 so that the covering member 30a covers a part of the third surface 23 of the light emitting element 20 and is substantially flush with the bottom surface of the second electrode 3. .

《Fifth embodiment》
[Light emitting device]
FIG. 17A is a schematic plan view showing a light emitting device according to a fifth embodiment. FIG. 17B is a schematic cross-sectional view taken along line XVIIB-XVIIB in FIG. 17A.

In the light emitting device 100D, the second electrode 3 is arranged on the first electrode 2 of the light emitting element 20, similarly to the light emitting device 100B of the third embodiment. Further, the resin member 40 covers the entire third surface 23 of the light emitting element 20 and also partially covers the first surface 21 of the light emitting element 20. Thereby, the area in which the light emitting element 20 and the resin member 40 come into contact can be increased, so that the amount of light emitted from the light emitting element 20 to the resin member 40 can be increased. Further, the covering member 30a covers a portion of the lower surface of the resin member 40, for example, the outer peripheral portion, and is arranged so as to be substantially flush with the bottom surface of the second electrode 3. More specifically, the covering member 30a covers the lower surface of the resin member 40 located outside the third surface 23 of the light emitting element 20, and by increasing the distance from the second electrode 3, the light emitting device 100D is When mounting, it is possible to easily arrange a joining member such as solder, for example. Furthermore, in the light emitting device 100D, the second electrode 3 is formed thicker to improve heat dissipation than the light emitting device 100C of the fourth embodiment. For example, the thickness of the second electrode 3 in this embodiment is preferably 10 μm or more and 100 μm or less, more preferably 20 μm or more and 60 μm or less. Other matters are the same as those of the light emitting device 100A of the second embodiment.

<<Manufacturing method of the fifth embodiment>>
[First manufacturing method]
18A to 18C are schematic cross-sectional views showing a first method of manufacturing a light emitting device according to a fifth embodiment.

The first method for manufacturing the light emitting device 100D includes steps S301 to S305 described in the method for manufacturing the light emitting device 100A. Hereinafter, the differences between the first manufacturing method of the light emitting device 100D and the first manufacturing method of the light emitting device 100A will be explained.

In the first manufacturing method of the light emitting device 100D, in the pushing step S304, the resin member 40 covers the entire third surface 23 of the light emitting element 20, and the covering member 30a is substantially flush with the bottom surface of the second electrode 3. Push the light emitting element 20 into the resin member 40 so that the light emitting element 20 is At this time, a part of the first surface 21 of the light emitting element 20 is covered with the resin member 40.

[Second manufacturing method]
19A to 19C are schematic cross-sectional views showing a second method of manufacturing a light emitting device according to the fifth embodiment.

The second method for manufacturing the light emitting device 100D includes steps S401 to S406 described in the method for manufacturing the light emitting device 100A. Hereinafter, regarding the second manufacturing method of the light emitting device 100D, differences from the second manufacturing method of the light emitting device 100A will be explained.

In the second manufacturing method of the light emitting device 100D, in the pushing step S405, the resin member 40 covers the entire third surface 23 of the light emitting element 20, and the covering member 30a is substantially flush with the bottom surface of the second electrode 3. Push the light emitting element 20 into the resin member 40 so that the light emitting element 20 is At this time, a part of the first surface 21 of the light emitting element 20 is covered with the resin member 40.

《Sixth embodiment》
[Light emitting device]
FIG. 20A is a schematic plan view showing a light emitting device according to a sixth embodiment. FIG. 20B is a schematic cross-sectional view taken along line XXB-XXB in FIG. 20A.

In the light emitting device 100E, the covering member 30 does not cover the third surface 23 of the light emitting element 20, but covers the side surface of the electrode 2 of the light emitting element 20, the first surface 21 of the light emitting element 20, and the lower surface of the resin member 40. Covered. The covering member 30 is arranged to have a constant thickness, specifically, to have the same thickness as the electrode 2 and to be substantially flat. Further, in the light emitting device 100E, a metal layer 4 is disposed on the entire surface (lower surface) of each of the pair of positive and negative electrodes 2. The metal layer 4 covers the lower surface of each of the pair of positive and negative electrodes 2, and also covers a part of the lower surface of the covering member 30. As the metal layer 4, for example, metals such as iron, copper, nickel, aluminum, silver, gold, platinum, titanium, tungsten, and palladium, or alloys containing at least one of these can be used. By including the metal layer 4, the light-emitting device 100E can increase the area of the conductive portion connected to the wiring of the planar light source when used as a planar light source, as will be described later, and can improve mounting performance. Other matters are the same as those of the light emitting device 100 of the first embodiment.

《Manufacturing method of the sixth embodiment》
FIG. 21 is a flowchart of a method for manufacturing a light emitting device according to the sixth embodiment. 22A to 22F are schematic cross-sectional views showing a method of manufacturing a light emitting device according to the sixth embodiment.

The method for manufacturing the light emitting device 100E includes light adjustment, which is a step of arranging the light adjustment member 50 on the other surface of the resin member 40 located on the opposite side to the one surface on which the light emitting element 20 of the resin member 40 is arranged. Component arrangement step S501, a first surface 21 on which a pair of positive and negative electrodes 2 are arranged, a second surface 22 located on the opposite side of the first surface 21, and a position between the first surface 21 and the second surface 22. A light emitting element arrangement step S502 is a step of arranging a plurality of light emitting elements 20 having a third surface 23 on one surface of the resin member 40 so that the second surface 22 faces each other, and a plurality of light emitting elements 20 is pushed into the resin member 40 so that the electrode 2 is exposed, and the covering member 30 is pushed so that the electrode 2 is exposed on one surface of the resin member 40 and the first surface 21 of the light emitting element 20. A covering member arrangement step S504 is a step of arranging the metal layer 4, a removing step S505 is a step of removing a part of the electrode 2 of the light emitting element 20, and a metal layer 4 is placed on the surface of the electrode 2 and a part of the surface of the covering member 30. a metal layer arrangement step S506 which is a step of arranging; a light emitting device singulation step S507 which is a step of cutting the resin member 40 so as to include at least one light emitting element 20 to obtain a plurality of light emitting devices 100E; including. Note that the material, arrangement, etc. of each member are as described in the description of the light emitting device 100E, so the description will be omitted here as appropriate.

The light adjustment member arrangement step S501, the light emitting element arrangement step S502, and the light emitting device singulation step S507 are the same as the light adjustment member arrangement step S101, the light emitting element arrangement step S102, and the light emitting device singulation step S105 described above.

(pushing process)
The pushing step S503 is a step of pushing the plurality of light emitting elements 20 into the resin member 40 so that the electrodes 2 are exposed from the resin member 40. In this step S503, the light emitting element 20 is pushed so that the entire third surface 23 is in contact with the resin member 40. Further, the light emitting element 20 is pushed into the resin member 40 so that the side surface of the electrode 2 is exposed from the resin member 40. Note that since a part of the electrode 2 of the light emitting element 20 is removed in a removal step S505 to be described later, the electrode 2 of the light emitting element 20 is formed thicker than the electrode 2 of the light emitting device 100E at this stage. It is also possible to increase the thickness by further arranging columnar electrodes on top. Other matters can be carried out in accordance with the above-described pushing step S104.

(Covering member placement process)
The covering member arranging step S504 is a step of arranging the covering member 30 so that the electrode 2 is exposed on one surface of the resin member 40 and the first surface 21 of the light emitting element 20. In this step S504, a liquid resin material is placed on the resin member 40 and the first surface 21 of the light emitting element 20 by, for example, potting, printing, spraying, or the like. At this time, the liquid resin material is placed so that a part of the side surface of the electrode 2 is exposed. Thereafter, the liquid resin material is cured to form the covering member 30.

(Removal process)
The removal step S505 is a step of removing a part of the electrode 2 of the light emitting element 20. In this step S505, a part of the electrode 2 is removed by polishing, grinding, cutting, etc. so that the surface of the covering member 30 and the surface (lower surface) of the electrode 2 are substantially flush with each other.

(Metal layer placement process)
The metal layer arranging step S506 is a step of arranging the metal layer 4 on a part of the surface of the electrode 2 and the surface of the covering member 30. In this step S506, the metal layer 4 having an area larger than the surface of each of the pair of positive and negative electrodes 2 is placed over the entire surface of each of the pair of positive and negative electrodes 2. Specifically, the metal layer 4 is disposed on the entire surface of each of the pair of positive and negative electrodes 2 and on a part of the surface of the covering member 30 adjacent to the surface of the electrode 2. The metal layer 4 can be formed by, for example, electrolytic plating, electroless plating, vapor deposition, sputtering, or the like, and may also be formed by using a conductive paste containing metal powder such as gold, silver, copper, platinum, or aluminum. It can also be formed by coating, printing, etc. Alternatively, a metal foil prepared in advance may be attached to the surface of the electrode 2.

Although the light-emitting device and the method for manufacturing the light-emitting device have been specifically explained above using the mode for carrying out the invention, the gist of the present invention is not limited to these descriptions, and is not limited to the description in the claims. must be broadly interpreted based on Furthermore, various changes and modifications based on these descriptions are also included within the scope of the present invention.

《Modified example》
FIG. 23A is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the first embodiment. FIG. 23B is a schematic cross-sectional view showing an example of a method for manufacturing a light emitting device according to a modification of the first embodiment. FIG. 24A is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the second embodiment. FIG. 24B is a schematic cross-sectional view showing an example of a method for manufacturing a light emitting device according to a modification of the second embodiment. FIG. 25A is a schematic cross-sectional view showing an example of a light emitting device according to a modification of the first embodiment. FIG. 25B is a schematic cross-sectional view showing an example of a method for manufacturing a light emitting device according to a modification of the first embodiment.

In the light emitting device 100F, the resin member 40 is not present above the second surface 22 of the light emitting element 20, and for example, the second surface 22 is in contact with the light adjustment member 50. Specifically, in the light emitting device 100F, the second surface 22 of the light emitting element 20 is exposed from the resin member 40 and the second surface 22 is covered with the light adjustment member 50, and the second surface 22 of the light emitting element 20 is It is not covered with the resin member 40. Other matters are the same as those of the light emitting device 100 of the first embodiment.
Further, the light emitting device 100F is manufactured by, for example, pushing the light emitting element 20 into the resin member 40 in the pushing step S104 or the pushing step S205 until the resin member 40 no longer exists above the second surface 22 of the light emitting element 20. be able to. Note that the thickness of the resin member 40 may be adjusted as appropriate.

In the light emitting device 100G, the resin member 40 is not present above the second surface 22 of the light emitting element 20. That is, the resin member 40 is not present on the upper surface of the covering member 30b disposed on the second surface 22. Specifically, in the light emitting device 100G, the second surface 22 of the light emitting element 20 is covered with a covering member 30b, the covering member 30b is exposed from the resin member 40, and the covering member 30b is covered with the light adjustment member 50. The upper surface of the covering member 30b is not covered with the resin member 40. Other matters are the same as those of the light emitting device 100A of the second embodiment.
Further, the light emitting device 100G is manufactured by, for example, pushing the light emitting element 20 into the resin member 40 in the pushing step S304 or the pushing step S405 until the resin member 40 no longer exists above the second surface 22 of the light emitting element 20. be able to. Note that the thickness of the resin member 40 may be adjusted as appropriate.

The light emitting device 100H is formed such that the upper side surface of the light emitting device 100H is curved so that the upper surface side of the light emitting device 100H is wide. Other matters are the same as those of the light emitting device 100 of the first embodiment.

The light emitting device 100H can be manufactured by cutting the resin member 40 using two types of blades having different widths in the light emitting device singulation step S105 or the light emitting device singulation step S206. Specifically, first, the structure 5 is cut halfway with a wide blade. Then cut the rest with a narrower blade. As these blades, a rotary blade such as a dicing saw or a cutter such as a Thomson blade can be used.

The light emitting device and the method of manufacturing the light emitting device according to the modified examples described above may be applied to each of the first to sixth embodiments, or may be applied to other forms. Further, the light emitting device and the method for manufacturing the light emitting device described above may not include a covering member. Moreover, it may not have a light adjustment member. Further, the light emitting element and the light emitting device may be approximately rectangular in plan view, or may have other shapes.

Furthermore, the method for manufacturing a light emitting device may include other steps between or before or after each of the steps, as long as they do not adversely affect each of the steps. For example, a foreign matter removal step for removing foreign matter mixed in during manufacturing may be included. Further, in the method for manufacturing a light emitting device, the order of each step may be changed as much as possible. For example, the light adjustment member arrangement step may be performed at any timing before the light emitting device singulation step.

Although the light emitting device described above can be used in various fields, it can be particularly suitably used as a planar light source. Examples of a light emitting module, a planar light source, and a liquid crystal display device using the light emitting device of this embodiment will be described below.
FIG. 26A is a schematic perspective view showing a light emitting module according to an embodiment. FIG. 26B is a schematic cross-sectional view taken along line XXVIB-XXVIB in FIG. 26A. FIG. 27 is a schematic exploded perspective view showing a liquid crystal display device using the light emitting module according to the embodiment. FIG. 28A is a schematic perspective view showing a planar light source according to an embodiment. FIG. 28B is a schematic cross-sectional view taken along line XXVIIIB-XXVIIIB in FIG. 28A.

[Light-emitting module]
In the light emitting module 200, one light guide plate 10 is provided with a plurality of recesses 14 that are open on the lower surface, and a light emitting device 100 is disposed in each recess 14. The light emitting device 100 is arranged on the wiring layer 16. The light emitting device 100 is fixed to the light guide plate 10 with a transparent member 41 made of adhesive resin. The light guide plate 10 is provided with a conical recess 15 that is open on the upper surface and forms a light reflecting surface on a surface opposite to the recess 14 in which the light emitting device 100 is disposed. A light adjustment member (second light adjustment member) 61 is arranged in the recess 15 . A light reflective member 62 is arranged on the lower surface of the light guide plate 10 and the lower surface of the light emitting device 100.

[Surface light source and liquid crystal display device]
The liquid crystal display device 400 is a so-called direct type liquid crystal display device in which a planar light source 300 functioning as a backlight is stacked below (on the back side) of the liquid crystal panel 210. The planar light source 300 has a light emitting module 200A arranged on a wiring board 90. The light emitting module 200A has the same configuration as the light emitting module 200 described above, although the number and size of the light emitting devices 100 are different. The liquid crystal display device 400 irradiates the liquid crystal panel 210 with light emitted from the planar light source 300 . In the liquid crystal display device 400, the upper surface, which is the light emitting surface, of the light guide plate 10 is overlapped, and uneven brightness within the light emitting surface can be suppressed. In the liquid crystal display device 400, a light diffusion sheet 220a, a first lens sheet 220b, a second lens sheet 220c, and a liquid crystal panel 210 are stacked in this order from the upper surface side of the light guide plate 10. Note that the liquid crystal display device 400 may further include members such as a polarizing film, a color filter, or DBEF (registered trademark) in addition to the above-mentioned constituent members.

[Another form of planar light source]
The planar light source 300A has a light emitting module 200B arranged on a wiring board 90A. The wiring board 90A includes, for example, an insulating base material 91, a wiring layer 92 disposed on the insulating base material 91, and an insulating base material 93 disposed on the wiring layer 92. In the light emitting module 200B, a plurality of through holes 17 are provided in one light guide plate 10A, and a light emitting device 100 is arranged in each through hole 17. The light emitting device 100 is placed on the wiring layer 92 via a bonding member 6 such as solder. The light emitting device 100 is covered with a translucent member 42 placed within the through hole 17 . The light guide plate 10A is provided with a groove 18 that partitions each light emitting device 100, and a light reflective member 63 is disposed within the groove 18. The light reflective member 63 functions as a parting member when emitting light in each section. A light reflective sheet 64 is arranged on the lower surface of the light guide plate 10A. Further, a light adjusting member (second light adjusting member) 65 is arranged on the transparent member 42 and a part of the light guide plate 10A so as to cover the transparent member 42. The light adjusting member 65 is a member that reflects part of the light from the light emitting device 100 and transmits the other part, and is a member that allows part of the light from the light emitting device 100 to propagate into the light guide plate 10A. be.

Here, the light guide plate 10A having the through hole 17 is used, but instead of the through hole 17, a light guide plate having a concave portion opened on the lower surface may be used. Further, the translucent member 42 may contain a wavelength converting member such as a fluorescent substance. Further, a light adjustment member (third light adjustment member) may be further disposed on the upper surface of the light emitting device 100. Furthermore, a light reflective member may be disposed on the wiring layer 92 around the light emitting device 100. Note that, for example, conventionally known materials can be used as materials for each member of the light emitting module, the planar light source, and the liquid crystal display device.

2 electrodes (first electrode)
3 electrode (second electrode)
4 Metal layer 5 Structure 6 Bonding member 10, 10A Light guide plate 14 Recess 15 Recess 16 Wiring layer 17 Through hole 18 Groove 20 Light emitting element 21 First surface 22 of the light emitting element 22 Second surface 23 of the light emitting element Third surface of the light emitting element 30 Covering member 30a Covering member 30b Covering member 40 Resin member 41 Transparent member 42 Transparent member 50 Light adjustment member (first light adjustment member)
61 Light adjustment member (second light adjustment member)
62 Light reflective member 63 Light reflective member 64 Light reflective sheet 65 Light adjustment member (second light adjustment member)
71 Heat-resistant double-sided adhesive tape 72 Heat-resistant adhesive tape 80 Support 90, 90A Wiring board 91 Insulating base material 92 Wiring layer 93 Insulating base material 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H Luminescence Devices 200, 200A, 200B Light emitting module 210 Liquid crystal panel 220a Light diffusion sheet 220b First lens sheet 220c Second lens sheet 300, 300A Planar light source 400 Liquid crystal display device

Claims (11)

A plurality of surfaces having a first surface on which a pair of positive and negative electrodes are arranged, a second surface located on the opposite side of the first surface, and a third surface located between the first surface and the second surface. arranging a light emitting element on one surface of the resin member so that the second surface faces each other;
pushing a plurality of the light emitting elements into the resin member so that the electrodes are exposed;
cutting the resin member so as to include at least one of the light emitting elements to obtain a plurality of light emitting devices ;
After the arranging step and before the pushing step, a step of arranging a covering member on one surface of the resin member so as to cover a part of the side surface of the light emitting element,
The pushing step is a step of pushing the light emitting element so that a part of the side surface of the light emitting element is in contact with the resin member and another part of the side face of the light emitting element is in contact with the covering member. Production method. In the step of arranging the covering member, the covering member covers a part of the side surface of the light emitting element so as to creep up toward the first surface of the light emitting element,
2. The light emitting device according to claim 1 , wherein in the pushing step, the covering member covers another part of the side surface of the light emitting element in a shape that extends toward the second surface of the light emitting element. Production method. 3. The method of manufacturing a light emitting device according to claim 1 , wherein in the pushing step, the viscosity of the covering member is higher than the viscosity of the resin member. A plurality of surfaces having a first surface on which a pair of positive and negative electrodes are arranged, a second surface located on the opposite side of the first surface, and a third surface located between the first surface and the second surface. arranging a light emitting element on one surface of the resin member so that the second surface faces each other;
pushing a plurality of the light emitting elements into the resin member so that the electrodes are exposed;
cutting the resin member so as to include at least one of the light emitting elements to obtain a plurality of light emitting devices;
Before the arranging step, a step of arranging a covering member on one surface of the resin member,
The step of arranging is a step of arranging a plurality of light emitting elements on one surface of the resin member via the covering member,
The pushing step includes pressing the first part of the light emitting element out of the covering member so that a part of the side surface of the light emitting element is in contact with the resin member, and another part of the side face of the light emitting element is in contact with the covering member. A method for manufacturing a light-emitting device, which comprises a step of separating a portion where two faces face each other and pushing the light-emitting element together with the resin member. 5. The method of manufacturing a light emitting device according to claim 4 , wherein in the pushing step, the hardness of the covering member is higher than the hardness of the resin member. The method for manufacturing a light emitting device according to any one of claims 1 to 5, including the step of arranging a light adjustment member on the other surface of the resin member. The light emitting device according to any one of claims 1 to 6 , wherein the pushing step is a step of pushing the light emitting element into the resin member after or while heating the resin member at a temperature of 40° C. or more and 100° C. or less. Method of manufacturing the device. The method for manufacturing a light emitting device according to any one of claims 1 to 7 , wherein the pushing step is a step of pushing the resin member so that it remains above the second surface of the light emitting element. The method for manufacturing a light emitting device according to any one of claims 1 to 7 , wherein the pushing step is a step of pushing the resin member until it no longer exists above the second surface of the light emitting element. 10. The method for manufacturing a light emitting device according to claim 1, wherein the step of obtaining the light emitting device is a step of cutting the resin member using two types of blades having different widths. The method for manufacturing a light emitting device according to any one of claims 1 to 10 , wherein the resin member includes one or more of a wavelength conversion member and a light diffusing material.

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