JP7362355B2 - Ceramic parts for magnetron - Google Patents

Description

Embodiments generally relate to ceramic components for magnetrons used in microwave heating equipment such as microwave ovens.

As a ceramic sealing part for magnetrons, power tubes, and electron tubes, a metallized layer mainly composed of molybdenum (Mo)-manganese (Mn), etc. is used as a ceramic part body (stem ceramics) made of alumina (aluminum oxide: Al2O3), etc. Ceramic parts formed on the surface are used. As a ceramic component for a magnetron of this type, for example, Japanese Patent No. 5450059 (Patent Document 1) discloses that the ceramic main body is an alumina sintered body having a grain boundary phase containing Mn, and the ceramic body is an alumina sintered body having a grain boundary phase containing Mn. There is a ceramic component for a magnetron characterized by having a Mn-rich phase between the metallized layer and the metallized layer. In addition, as a manufacturing method, for example, Japanese Patent No. 5285868 (Patent Document 2) discloses that after coating and drying a Mo-Mn paste on a stem body made of an alumina sintered body containing Mn, There is a method for manufacturing a magnetron stem, which is characterized by the steps of forming a metallized layer by firing, inserting a lead portion into the stem body, and plating with nickel (Ni).

In recent years, microwave ovens have become more general-purpose, and there is a need to reduce the cost of materials and parts.At the same time, however, modules have become smaller and more sophisticated, and ceramic parts used in the magnetron, which is the core of microwave ovens, are becoming smaller. There is also a demand for higher quality and lower prices.
One of the important processes that affects the quality and cost of ceramic parts for magnetrons is the plating process.
In the magnetron ceramic part, a metallized layer mainly composed of Mo-Mn is formed on the terminal part and ring part formed on the upper end surface of the columnar ceramic part body made of alumina sintered body. A Ni plating layer of a predetermined thickness is formed on the upper surface in order to improve the bonding strength with other metal parts and perform sealing.

Methods for forming a Ni plating layer on a ceramic component body having a complex shape such as those described above include electroless Ni plating, in which the ceramic component body is immersed in a plating solution to form a Ni plating layer of a predetermined thickness; One method is to electrolytically plate the parts by fixing them on a jig one by one, or to anneal the parts after plating once, and if the thickness is insufficient, to perform plating twice to obtain a plating layer of a predetermined thickness. Although various methods are commonly used, each method has its disadvantages. As a method to compensate for this, for example, Japanese Patent Laid-Open No. 11-92255 (Patent Document 3) cites an example in which barrel plating is performed with a pin electrode inserted into a metallized portion formed in the center. Furthermore, in Japanese Patent No. 4250397 (Patent Document 4), a pin electrode is inserted, and the thickness of the terminal nickel layer and the ring part nickel layer is each 1.5 μm or more, and the terminal part nickel layer thickness is There is a ceramic component for a magnetron characterized in that the ratio of the ring portion to the nickel layer thickness is 1.1 or more.

However, the above-mentioned plating method has the problem that the process is more complicated and the cost is higher than that of a normal plating method. In other words, in the method of fixing the lead made of a high-melting point metal such as Mo with a silver (Ag)-based brazing material after the metallization process is completed, and then applying Ni plating, in order to braze directly to the metallized layer, There was a problem in that the bonding by brazing became unstable and sufficient brazing strength could not be obtained.

In addition, when barrel plating is performed with pin electrodes inserted into each of the pin insertion holes formed on the surface side of a metallized ceramic component, the pin electrodes can be easily removed from the holes, and the pins can be inserted into each pin insertion hole. There was a problem in that the process of inserting and removing occurred, which increased the number of man-hours.

Patent No. 5450059 Patent No. 5285868 Japanese Patent Application Publication No. 11-92255 Patent No. 4250397

Microwave ovens are becoming more versatile and highly functional, and ceramic parts for magnetrons are also required to be of higher quality and lower in price.
The embodiment solves such a problem and relates to a ceramic component used in a magnetron that suppresses the occurrence of leakage defects at the terminal portion and has high productivity.

In the magnetron ceramic component according to the embodiment, a terminal portion metallized layer and a ring portion metallized layer are respectively formed on the terminal portion and the ring portion formed on the surface of the ceramic component body, and the terminal portion metallized layer and the ring portion metallized layer In a magnetron ceramic component in which a terminal portion Ni plating layer and a ring portion Ni plating layer are respectively formed on the surface of the terminal portion, the thickness of the terminal portion Ni plating layer and the ring portion Ni plating layer is 1.0 μm or more, and the terminal portion The thickness of the Ni plating layer at a location corresponding to 1/2 of the distance from the hole to the end of the terminal in the direction of the other terminal hole is 2.4 μm or less , and the end of the terminal in the opposite direction to the direction of the other terminal hole. The ratio of the thickness of the Ni plating layer to the thickness of the Ni plating layer is 0.95 or more.

FIG. 1 is a diagram showing a cross section of a ceramic component for a magnetron according to an embodiment. FIG. 2 is a diagram showing a surface (plane) of a ceramic component for a magnetron according to an embodiment. FIG. 1 is a diagram showing a cross section of a ceramic component into which an electrode pin according to an embodiment is inserted. The figure which shows the cross section of the ceramic component in which the electrode pin was inserted from the back side.

The magnetron ceramic component according to the embodiment includes a terminal portion metallized layer and a ring portion metallized layer made of a high melting point metal such as Mo or tungsten (W) on the terminal portion and ring portion formed on the surface of the ceramic component body, respectively. In a magnetron ceramic component in which a terminal portion Ni plating layer and a ring portion Ni plating layer are formed on the surfaces of the terminal portion metallized layer and ring portion metallized layer, respectively, the terminal portion Ni plating layer and the ring portion Ni plating layer are formed. The thickness of the Ni plating layer is 1.0 μm or more, and the thickness of the Ni plating layer at a location corresponding to 1/2 of the distance from the terminal hole to the end of the terminal in the direction of the other terminal hole is 2.4 μm or less , and The ratio of the thickness of the Ni plating layer to the thickness of the Ni plating layer at a location corresponding to 1/2 of the distance to the end of the terminal in the direction opposite to the terminal hole direction is 0.95 or more.
FIG. 1 shows an example of a cross-sectional view of a ceramic component for a magnetron. 1 is a ceramic part for magnetron, 2 is a ceramic part main body, 3 is a ceramic terminal part, 4 is a ceramic ring part, 5 is a metallized terminal part, 6 is a metallized ring part, 7 is a ceramic groove part, 8 is a ceramic hole part be. FIG. 2 shows the surface (plan view) of a magnetron ceramic component including a terminal portion and a ring portion. The embodiment is not limited to such a shape, and the ring portion 4 may be formed on the back surface.

The ceramic component 2 is preferably made of one of alumina (aluminum oxide) and zirconia-added alumina (algyl: a sintered body of a mixture of aluminum oxide and zirconium oxide). Further, when using a Mo--Mn paste for metallization, it is preferable that the ceramic contains Mn. The Mn content is preferably 1 to 5% by weight. This is because the inclusion of Mn can improve the bonding strength with the Mo--Mn metallized layer. In addition to Mn, a sintering aid may be added to the alumina sintered body. Examples of the sintering aid include silicon oxide (SiO2), magnesium oxide (MgO), calcium oxide (CaO), etc., and at least one of Si, Mg, and Ca in a total of 1 to 1 in terms of a single metal element. It is preferable to add 10% by weight. This is because the added sintering aid forms a grain boundary phase consisting of a glass phase and densifies the alumina sintered body. Further, since the glass phase enters into the voids of the Mo--Mn metallized layer, the metallized layer can be strengthened, and the bonding strength can be improved.

The second ceramic portion has a substantially cylindrical shape. For example, it is 15 mm in diameter x 15 mm in height. In the circular portion of the surface of the cylinder, three ceramic terminal portions are formed at the center and four ceramic ring portions are formed at the periphery. Five metalized terminal portions and six metalized ring portions are formed in each portion. This is because the metallized part is plated and the washer parts and lead parts are joined to the metallized terminal part 5 and the metal envelope part is joined to the metalized ring part 6 by brazing. Note that the four ceramic ring parts can also be formed on the back surface of the terminal part. When the 3 ceramic terminal parts and the 4 ceramic ring parts are on the same surface, 7 ceramic groove parts are formed. The purpose of the ceramic groove is to electrically insulate the 5 metallized terminal portion and the 6 metallized ring portion. 8 is a ceramic hole portion into which a lead component is inserted.

FIG. 2 shows a surface view (plan view) of the ceramic component for magnetron shown in FIG. 1. FIG. 1 is a cross-sectional view taken along line A-A' in FIG. 5. The shape of the metalized terminal portion is an example.

The metallized terminal portion 5 and the metalized ring portion 6 are formed by applying a Mo--Mn based paste to the ceramic portion 2 by screen printing or the like, drying it in an air atmosphere, and then firing it in a reducing atmosphere or the like.
Mo--Mn paste is a mixture of Mo powder and Mn powder with an organic binder.
The organic binder is not particularly limited as long as it can be burned out during the drying process or baking process. A preferred example is ethylcellulose.
The Mo-Mn paste was prepared using Mo powder with an average particle size of 0.5 to 10 μm and an average particle size of 0.5 to 10 μm.
It is preferable that Mn powder of 5 to 10 μm be crushed for 40 hours or more and then mixed with a binder. Further, the ratio of Mo and Mn is 4 to 12 weight %, preferably 6 to 8 weight %, when the total of Mo and Mn is 100 weight %.
The coating thickness is preferably 10 to 40 μm. If the coating thickness is less than 10 μm, after the metallized layer is formed, the thickness of the metallized layer will vary, reducing the bonding strength. On the other hand, if the thickness exceeds 40 μm, no further effect can be obtained.
Further, the drying step is carried out in the air at a temperature of 50 to 100°C, preferably 50 to 80°C. Further, the drying time is 5 to 30 minutes, preferably 10 to 20 minutes.
After the drying process, a firing process is performed. The firing temperature is 1350-1550°C, preferably 1400-1480°C. Further, the firing time is preferably in the range of 30 minutes to 5 hours. Further, the atmosphere is preferably a reducing atmosphere. The firing time is preferably 1 hour or more. When fired for one hour or more, the glass phase in the ceramic sintered body tends to form a precipitated layer uniformly deposited on the surface. The precipitated layer deposited on the surface of the ceramic sintered body is deposited between the ceramic sintered body and the Mo--Mn metallized layer, and enters into the voids of the metalized layer. Therefore, the metallized layer becomes denser and the bonding strength improves.

FIG. 4 shows a cross-sectional view of the case where the pin electrode is changed from the inserted pin electrode shown in FIG. 5 of JP-A-11-92255 to a substantially U-shaped pin electrode (hereinafter referred to as U-shaped pin electrode). Compared to inserting separate electrode pins into each hole and removing them after plating, the process can be simplified and the number of man-hours can be reduced because the electrode pins can be inserted and removed all at once. However, in the metallized portion from the centermost point of the hole to the center of the ceramic, a thinly plated portion occurs due to the shadow of the U-shaped pin electrode. Since the brazing distance in this part is shorter than in other parts, any brazing failure due to thin plating will cause leakage failure.

The reason why the U-shaped pin electrode is inserted from the top is to avoid damage to the metallized layer during insertion. When the Mo--Mn paste is applied, the application range of the paste expands inside the hole due to its own weight, and the paste is applied to the edge of the hole. When a pin is inserted after metallization, electrical conduction occurs when the pin touches this edge portion. Plating is performed on the metallized portion by electrical conduction.
When inserting a U-shaped pin electrode from the back side (non-metallized side), if the spring properties of the pin are weak, there is a possibility that sufficient contact on the metallized surface will not be made, leading to a decrease in yield. In addition, if the spring property is strong, the metallized layer at the edge portion will be damaged when the tip emerges from the hole, resulting in insufficient conduction, resulting in plating defects and a decrease in yield.

In order to solve the problem of plating shadows that occur when a U-shaped pin electrode is inserted from the front side, the U-shaped pin electrode is inserted from the back side for plating. Further, in order to avoid metallization loss at the edge portion of the hole when the U-shaped pin electrode is inserted from the back side, the material and shape of the U-shaped pin electrode are as follows.
The material of the U-shaped pin electrode is stainless steel for springs.
U-shaped pin electrode protrusion length on the back side (B) = Ceramic height (H) x 0.3 to 0.8
U-type pin electrode terminal surface protrusion length (C) = ceramic height (H) x 0.1 to 0.5
U-type pin electrode terminal surface bent end length (D)
= U-type pin electrode terminal surface protrusion length (C) x 0.2 to 0.7
U-shaped pin electrode opening width (F) = Ceramic hole outermost circumference length (W) x 1.0 to 1.5
U-type pin electrode diameter (φE) = Ceramic hole diameter (φR) x 0.1 to 0.4

By inserting the U-shaped pin electrode from the back surface, the shadow of the U-shaped pin electrode that would occur if inserted from the terminal surface is eliminated, and plating can be performed normally. Furthermore, the terminal part is more easily plated, which helps eliminate the difference in plating thickness between the terminal part and the ring part. This is useful for both a shape in which the terminal surface and the ring surface are on the same side (single-sided metallization) and a shape in which the terminal surface and the ring surface are on opposite sides (double-sided metallization).

The metal used for the U-shaped pin electrode may be any metal that has spring properties and is an electrical conductor, and examples thereof include iron, rolled steel, carbon steel, high-tensile steel, and spring steel. Stainless steel materials for springs are particularly suitable for this purpose, are easy to process and are inexpensive, and can be recovered and reused by acid treatment if plating adheres to them. Stainless steel materials for springs include SUS-302-WPA, SUS-302-WPB, SUS-304-WPA, SUS-304-WPB, SUS-316-WPA, and SUS-631J1-WPC, especially SUS- 304-WPB is suitable.

By making the U-shaped pin electrode have the above dimensions, it will come into contact with the metallized layer of the terminal portion and serve as an electrode, and will not come off from the ceramic component during plating rocking of the barrel or the like.
By adjusting the length of the U-shaped pin electrode protruding from the back surface, the protruding portion can serve as an electrode during plating and supply the electricity necessary for plating to the metallization. If the length of the pin electrode protruding from the back surface is too short, it will not function as an electrode, and if it is too long, the electrodes will become entangled with each other, reducing workability. For this reason, it is preferable that the protruding length (B) of the U-shaped pin electrode from the back surface is ceramic height (H) x 0.3 to 0.8, more preferably ceramic height (H) x 0.4 to 0.7.
By adjusting the length of the U-shaped pin electrode that protrudes from the terminal surface, the protruding part becomes the electrode during plating and can supply the electricity necessary for plating to the metallization, similar to adjusting the length of the U-shaped pin electrode that protrudes from the back surface. be. If the length of the U-shaped pin electrode protruding from the terminal surface is too short, it will not function as an electrode, and if it is too long, the electrodes will become entangled with each other, reducing workability. For this reason, it is preferable that the protruding length (C) of the U-shaped pin electrode terminal surface be ceramic height (H) x 0.1 to 0.5, and more preferably ceramic height (H) x 0.2 to 0.4. .
By adjusting the length of the bent end of the U-shaped pin electrode terminal surface, it is possible to prevent the U-shaped pin electrode from falling off after insertion, and to make it easier to insert the tip of the U-shaped electrode pin. If the bent end length of the U-shaped pin electrode terminal surface is long, it will be difficult to insert it into the hole depending on the bending angle, and if it is short, the pin electrode will easily fall off after insertion. Therefore, the length of the bent end of the U-shaped pin electrode terminal surface (D) is the protruding length of the U-shaped pin electrode terminal surface (C) x 0.2 to 0.7, and further the protruding length of the U-shaped pin electrode terminal surface (C). )x0.3 to 0.6.
The bending angle of the bent end of the terminal surface of the U-shaped pin electrode is arbitrary, but it is preferably 3 to 60 degrees from the extension line of the pin toward the direction in which it spreads (outside).
By adjusting the opening width of the U-shaped pin electrode, it is possible to easily insert the U-shaped pin electrode, to prevent the U-shaped pin electrode from falling off after insertion, and to provide electrical conduction to the metallized portion. If the opening width of the U-shaped pin electrode is too large, it becomes difficult to insert the U-shaped pin electrode, resulting in reduced workability. Furthermore, if the opening width of the U-shaped pin electrode is small, it becomes difficult to insert the U-shaped pin electrode, and there is a risk that the U-shaped pin electrode may not come into contact with the metallization, and may fall off. Therefore, the U-shaped pin electrode opening width (F) is the terminal hole outermost circumference length (W) x 1.0 to 1.5, and furthermore, the terminal hole outermost circumference length (W) x 1.0 to 1.3. It is preferable.
Good spring properties can be obtained by adjusting the diameter of the U-shaped pin electrode. By obtaining good spring properties, the U-shaped pin electrode can be easily inserted and removed, and can be brought into contact with the metallized surface with appropriate strength. If the diameter of the U-shaped pin electrode is too small, sufficient strength as a pin cannot be obtained, and if it is too large, force is required when inserting and removing it, reducing workability. Therefore, it is preferable that the U-shaped pin electrode diameter (φE) is the terminal hole diameter (φR) x 0.1 to 0.4, more preferably the terminal hole diameter (φR) x 0.2 to 0.3.

Ni plating is performed on the metallized layer of the ceramic component into which the U-shaped pin electrode is inserted. In order to improve mass productivity, it is preferable to perform the Ni plating step by barrel electrolytic plating. If the barrel type is used, the electrolyte and the ceramic parts with the U-shaped pin electrode inserted can be mixed uniformly in the rotating container, so a large amount can be plated at once.
In barrel electrolytic plating, it is preferable to mix a dummy member made of metal such as iron or stainless steel in the barrel. Mixing a metal dummy member improves the electrical conductivity of the electrolytic solution, which increases plating efficiency. Further, if there is a metal dummy member, it can act as a cushion and prevent ceramic parts from colliding with each other and being damaged.
Furthermore, the temperature of the electrolytic bath should be approximately 40 to 70°C, and the plating time should be approximately 30 to 60 minutes.

The plating conditions are adjusted so that the thicknesses of the terminal Ni plating layer and the ring Ni plating layer are each 1.0 μm or more, preferably 1.2 μm or more, and more preferably 1.5 μm or more. In addition, the thickness of the Ni plating layer at a location corresponding to 1/2 of the distance from the terminal hole to the terminal end in the direction of the other terminal hole is 2.4 μm or less , and the thickness of the Ni plating layer in the opposite direction to the other terminal hole direction is The ratio of the thickness of the Ni plating layer at a location corresponding to 1/2 of the distance to the end of the terminal portion is adjusted to be 0.95 or more, preferably 1.0 or more, and more preferably 1.3 or more. .

According to the method for manufacturing ceramic parts for magnetrons described above, the yield can be significantly improved by improving the quality of plating. Furthermore, since the quality of the brazing is also improved due to the improved quality of the plating, it is possible to manufacture a highly reliable magnetron with good sealing properties when assembled into a magnetron.

(Example)
(Examples 1 to 10, Comparative Examples 1 to 10)
Alumina (Al2O3) granulated powder having a composition of 92% by weight Al2O3 - 8% by weight MnO2, SiO2, MgO (total 8% by weight) was molded in a press and sintered at 1500°C in the atmosphere to form the powder shown in Figure 1. A substantially cylindrical ceramic component having a diameter of 15 mm and a height of 15 mm as shown was manufactured. On the upper surface of this ceramic component body, a protruding terminal-like part is formed at the center, and a protruding ring-like part is formed at the periphery. φR is 1.6 mm, and the terminal hole outermost circumference length (W) is 7 mm.

Next, Mo--Mn paste was printed on the terminal and ring surfaces of the upper surface of the ceramic component using a 100-mesh screen mesh to apply a paste layer with a thickness of 20 μm. Next, the component body on which the paste layers were formed was dried in air at a temperature of 100° C. to harden each paste layer.

By heat-treating the component body on which the paste layer has been formed at a temperature of 1400° C. for 1 hour in wet forming gas, metallized layers 5 and 6 are formed on the terminal portion and ring portion, respectively, as shown in FIGS. 1 and 2. Formed.

Next, the U-shaped pin electrodes shown in Table 1 were fabricated using SUS-304-WPA. Five U-shaped pin electrodes prepared as shown in FIG. 3 were inserted into each ceramic component. Furthermore, the ceramic component into which the U-shaped pin electrode is inserted is housed together with a metal dummy in a rotating container (barrel) of a barrel plating processing device, and electroplating is performed in a Watts bath at a current flow rate of 50 A and a condition of 2000 A min. As a result, Ni plating layers were formed on the surfaces of the metallized layers 5 and 6, respectively.

In order to confirm the plating state using the U-shaped pin electrode, the thickness of the Ni plating layer was measured using a fluorescent X-ray film thickness meter. The measurement results are shown in Table 2. The Ni plating thickness was measured at the inside of the terminal in Figure 2 (T1: 1/2 of the distance between the inside of the hole and the end of the central groove), the outside of the terminal (T2: 1/2 of the distance between the outside of the hole and the outside of the terminal), The center of the ring part (T3: 1/2 of the distance between the inner circumference of the ring and the outer circumference of the ring) was set. Note that the measurement result was the minimum value among five measurements.

As can be seen from Table 2, the Ni plating thicknesses measured at three locations on the alumina parts for magnetrons according to the examples were all 1.5 μm or more, which was good. On the other hand, in Comparative Examples 1, 4, 6, 8, and 10, although the Ni plating thickness was good at 1.5 μm or more, a large force was required when inserting the pin, resulting in poor workability and low mass productivity. Further, in Comparative Example 2, although the Ni plating thickness was good at 1.5 μm or more, other parts got into the U-shaped portion of the pin in the barrel, and the workability for taking out the pin after plating was poor. Furthermore, in Comparative Examples 3, 5, 7, and 9, there were products in which the U-shaped pin electrodes came off. Although the plating thickness of the product in which the U-shaped pin electrode did not come off was good, the Ni plating thickness on the terminal part of the product in which the U-shaped pin electrode did not come off was as low as less than 1 μm.

(Comparative Examples 11 to 15)
In the above example, except that the U-shaped pin electrode was inserted from the metallized surface as shown in FIG. adjusted. Table 3 shows the measurement results of Ni plating thickness.

As can be seen from Table 3, the Ni plating thickness measured in Comparative Examples 11 to 15 was good at 1.5 μm or more on the outside of the terminal and in the center of the ring portion. On the other hand, it was less than 1.0 μm inside the terminal. This is because the plating became thinner due to the shadow of the U-shaped pin electrode.

In addition, silver solder (BAg-8: 72% silver - 28% copper) foil was placed on the terminal and ring parts of the ceramic parts for magnetrons according to each example and comparative example prepared as described above, and the temperature was 800°C. When a wax flow test was conducted in a nitrogen-hydrogen atmosphere, both the ring parts of the example and the comparative example had good wax flow. On the other hand, in the terminal part, the solder flow was good in Examples and Comparative Examples 1, 2, 4, 6, 8, and 10, whereas the solder flow was good in Comparative Examples 3, 5, 7, 9, 11 to 15, and A defect has occurred.
When a metal terminal was brazed to the terminal part of each Example and Comparative Example and an airtightness test was conducted, leakage failure occurred in Comparative Examples 3, 5, 7, 9, and 11 to 15, and airtightness was not obtained. There wasn't.

As is clear from the results shown above, according to the ceramic parts for magnetrons according to each example in which the U-shaped pin electrode was inserted from the back surface of the terminal part and barrel-plated, the Ni plating thickness on the inside of the terminal part was reduced. Good plating properties can be obtained without any problems, and a Ni plating layer with a suitable thickness can be formed.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, as well as within the scope of the invention described in the claims and its equivalents. Further, each of the embodiments described above can be implemented in combination with each other.

1... Ceramic parts for magnetron (cross section)
2... Ceramic part body 3... Ceramic terminal part 4... Ceramic ring part 5... Metallized terminal part 6... Metallized ring part 7... Ceramic groove part 8... Ceramic hole part 9... Ceramic component surface for magnetron (plan view)
10...U-shaped pin electrode backside insertion (example)
11...U-shaped pin electrode 12...U-shaped pin electrode surface insertion (comparative example)

Claims (4)

In a magnetron ceramic part in which a terminal part and a ring part are formed, the ceramic part is an alumina sintered body, and after forming a metallized layer made of molybdenum-manganese on the terminal part and ring part, a pin electrode is attached to the terminal surface. It includes a step of inserting from the opposite direction, a step of forming a nickel layer by plating, and a step of removing the pin electrode to form a nickel plating layer on the terminal part and a nickel plating layer on the ring part,
The pin electrode has a substantially U-shape, and the material of the pin electrode is a spring stainless steel material,
The protruding length on the back surface of the pin electrode is in the range of ceramic height x 0.3 to 0.8, and the protruding length on the pin electrode terminal surface is in the range of ceramic height x 0.1 to 0.5. The length of the surface bent end is in the range of U-shaped pin electrode terminal surface protrusion length x 0.2 to 0.7, and the pin electrode opening width is in the range of ceramic hole outermost circumference length x 1.0 to 1.5 The pin electrode diameter is in the range of ceramic hole diameter x 0.1 to 0.4, the thickness of the terminal part nickel plating layer and the ring part nickel plating layer is each 1.0 μm or more, and the terminal part The thickness of the nickel plating layer at the location corresponding to 1/2 of the distance from the hole to the end of the terminal in the direction of the other terminal hole is 2.
．． 4 μm or less, and the ratio to the thickness of the nickel plating layer at a location corresponding to 1/2 of the distance to the end of the terminal in the direction opposite to the direction of the other terminal holes is 0.95 or more. Method of manufacturing ceramic parts for use. A claim characterized in that the plating attached to the pin electrode is recovered by acid treatment and reused. 1. The method for manufacturing a ceramic component for a magnetron according to 1. The process of forming a nickel layer by plating is barrel type electrolytic plating, in which a nickel layer is formed in the barrel.
Claim 1 or Claim 1 characterized in that metal dummy members such as iron and stainless steel are mixed.
A method for manufacturing a ceramic component for a magnetron according to claim 2. The temperature of the barrel electrolytic plating bath is 40°C or more and 70°C or less, and the electrolytic plating time is
The ceramic for magnetron according to claim 3, characterized in that the time is from 30 minutes to 60 minutes or less.
manufacturing method for parts.

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