JP7360642B2 - ハイブリッド弾性/非弾性電気的相互接続システム - Google Patents
ハイブリッド弾性/非弾性電気的相互接続システム Download PDFInfo
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- JP7360642B2 JP7360642B2 JP2022519424A JP2022519424A JP7360642B2 JP 7360642 B2 JP7360642 B2 JP 7360642B2 JP 2022519424 A JP2022519424 A JP 2022519424A JP 2022519424 A JP2022519424 A JP 2022519424A JP 7360642 B2 JP7360642 B2 JP 7360642B2
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0551—Spinal or peripheral nerve electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3752—Details of casing-lead connections
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/36014—External stimulators, e.g. with patch electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
- A61N1/36125—Details of circuitry or electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Neurosurgery (AREA)
- Neurology (AREA)
- Manufacturing & Machinery (AREA)
- Heart & Thoracic Surgery (AREA)
- Cardiology (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Biophysics (AREA)
- Electrotherapy Devices (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
i)本質的に非弾性の基板を含み、基板は、第1の面及び対向する第2の面を有し、基板の少なくとも一部の上及び/又は内部の少なくとも1つの導電性トラック(104)と、を備える相互接続基板と、
ii)本質的に弾性の基板を含む伸縮可能相互接続部であって、基板は、少なくとも1つの導電性要素をその中に含む少なくとも1つのウェル又は溝を含み、少なくとも1つのウェル又は溝は、相互接続基板の少なくとも1つの導電性トラックを収容するように構成され、
iii)少なくとも1つの導電性要素を少なくとも1つの導電性トラックと電気的に接続するように構成され、少なくとも1つのウェル又は溝内に配置された少なくとも1つの導電性ペーストのボーラス(塊)。
Claims (18)
- i)非弾性基板(101)を含み、前記非弾性基板(101)は、第1の面(102)及び対向する第2の面(103)を有し、前記非弾性基板(101)の少なくとも一部の上及び/又は内部の少なくとも1つの導電性トラック(104)、を備える相互接続基板(100)と、
ii)弾性基板(201)を含む伸縮可能相互接続部(200)であって、前記弾性基板(201)は、少なくとも1つの導電性要素(203)をその中に含む、前記弾性基板(201)上に設けられた2つの壁(204)の間に形成された少なくとも1つの溝(202)を含み、前記少なくとも1つの溝(202)は、前記相互接続基板(100)の前記少なくとも1つの導電性トラック(104)を収容する、伸縮可能相互接続部(200)と、
iii)前記少なくとも1つの導電性要素(203)を前記少なくとも1つの導電性トラック(104)と電気的に接続する、前記少なくとも1つの溝(202)内に配置された少なくとも1つの導電性ペーストのボーラス(300)と、
を備える電気的相互接続システムであって、
前記少なくとも1つの溝(202)は、前記少なくとも1つの導電性トラック(104)が前記少なくとも1つの導電性ペーストのボーラス(300)内に完全に埋め込まれるように、前記相互接続基板(100)の前記少なくとも1つの導電性トラック(104)を完全に収容する、
電気的相互接続システム。 - 前記少なくとも1つの導電性ペーストのボーラス(300)は、前記少なくとも1つの導電性要素(203)を前記少なくとも1つの導電性トラック(104)と機械的に接続するように構成された接着弾性ポリマーから構成される、請求項1に記載の電気的相互接続システム。
- 前記相互接続基板(100)の前記非弾性基板(101)は、可撓性材料からなる、請求項1又は請求項2に記載の電気的相互接続システム。
- 前記相互接続基板(100)は、平面である、請求項1~請求項3の何れか1項に記載の電気的相互接続システム。
- 前記相互接続基板(100)の前記少なくとも1つの導電性トラック(104)は、前記非弾性基板(101)の細長部材(1000)上に位置する、請求項1~請求項4の何れか1項に記載の電気的相互接続システム。
- 前記非弾性基板(101)の前記細長部材(1000)は、平面である、請求項5に記載の電気的相互接続システム。
- 前記相互接続基板(100)は、各々が少なくとも1つの導電性トラック(104)を備える細長部材(1000)のアレイを備える、請求項5又は請求項6に記載の電気的相互接続システム。
- 前記伸縮可能相互接続部(200)は、前記溝(202)のアレイを含み、各溝(202)は、その中に前記少なくとも1つの導電性要素(203)のうちの1つを含む、請求項7に記載の電気的相互接続システム。
- 前記少なくとも1つの溝(202)は、前記非弾性基板(101)を完全に収容する、請求項1~請求項8の何れか1項に記載の電気的相互接続システム。
- 前記伸縮可能相互接続部(200)の前記少なくとも1つの導電性要素(203)は、伸縮可能な金属薄膜を含む、請求項1~請求項9の何れか1項に記載の電気的相互接続システム。
- 前記伸縮可能相互接続部(200)の前記少なくとも1つの導電性要素(203)は、前記弾性基板(201)内に埋め込まれている、請求項1~請求項9の何れか1項に記載の電気的相互接続システム。
- 前記導電性ペーストのボーラス(300)は、軟質ポリマー材料と、複数の導電性マイクロ粒子又はナノ粒子とを含む、請求項1~請求項11の何れか1項に記載の電気的相互接続システム。
- 前記相互接続基板(100)の前記対向する第2の面(103)と、前記少なくとも1つの溝(202)の少なくとも一部を含む前記伸縮可能相互接続部(200)の少なくとも一部と、を封入する接着性及び電気絶縁性材料の封入層(400)を更に含む、請求項1~請求項12の何れか1項に記載の電気的相互接続システム。
- 前記封入層(400)は、弾性材料から構成される、請求項13に記載の電気的相互接続システム。
- 前記少なくとも1つの導電性トラック(104)、及び/又は前記少なくとも1つの導電性要素(203)は、外部装置に電気的に接続可能に構成された1つの端部を含む、請求項1~請求項14の何れか1項に記載の電気的相互接続システム。
- 前記相互接続基板(100)の前記非弾性基板(101)は、一辺(101a)から反対側の辺(101b)までの所定の長さと、所定の幅と、を有し、
前記少なくとも1つの導電性トラック(104)は、前記非弾性基板(101)の側面を含まない前記非弾性基板(101)上の一部に有る、
請求項1~請求項15の何れか1項に記載の電気的相互接続システム。 - 請求項1~請求項16の何れか1項に記載の電気的相互接続システムを含む、製造物品。
- 被験者の体内に一時的又は永久的に移植されるように構成された生物医学的装置である、請求項17に記載の製造物品。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008178680A (ja) | 2006-12-28 | 2008-08-07 | Semiconductor Energy Lab Co Ltd | 人工内耳装置、および体外集音装置、ならびにそれらを有する人工内耳システム |
JP2010015164A (ja) | 1998-01-28 | 2010-01-21 | Immersion Medical Inc | 医療処置シミュレーションシステムに器械をインタフェース接続するためのインタフェース装置及び方法 |
JP2016157660A (ja) | 2015-02-26 | 2016-09-01 | 日本航空電子工業株式会社 | 電気接続構造および電気接続部材 |
WO2017203441A1 (en) | 2016-05-24 | 2017-11-30 | Wise S.R.L. | Electrical interconnection system between an intrinsically extensible conductor and a not intrinsically extensible one |
JP2018086071A (ja) | 2016-11-28 | 2018-06-07 | 株式会社リコー | 経皮吸収デバイス及び経皮吸収パッチ |
WO2018224341A1 (de) | 2017-06-09 | 2018-12-13 | Neuroloop GmbH | Implantierbare elektrische verbindungsstruktur zwischen einem elektrischen implantat und einer elektrischen zu- und ableitungsstruktur |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3999994B2 (ja) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物 |
US7211103B2 (en) * | 2002-04-11 | 2007-05-01 | Second Sight Medical Products, Inc. | Biocompatible bonding method and electronics package suitable for implantation |
US7491892B2 (en) | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
US20070123963A1 (en) * | 2005-11-29 | 2007-05-31 | Peter Krulevitch | Method for producing flexible, stretchable, and implantable high-density microelectrode arrays |
WO2016110564A1 (en) | 2015-01-08 | 2016-07-14 | Ecole Polytechnique Federale De Lausanne (Epfl) | Synthetic skin for recording and modulating physiological activities |
US11654609B2 (en) | 2016-12-01 | 2023-05-23 | Ecole Polytechnique Federale De Lausanne (Epfl) | Engineering reversible elasticity in ductile or brittle thin films and products resulting from said engineering |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010015164A (ja) | 1998-01-28 | 2010-01-21 | Immersion Medical Inc | 医療処置シミュレーションシステムに器械をインタフェース接続するためのインタフェース装置及び方法 |
JP2008178680A (ja) | 2006-12-28 | 2008-08-07 | Semiconductor Energy Lab Co Ltd | 人工内耳装置、および体外集音装置、ならびにそれらを有する人工内耳システム |
JP2016157660A (ja) | 2015-02-26 | 2016-09-01 | 日本航空電子工業株式会社 | 電気接続構造および電気接続部材 |
US20190075658A1 (en) | 2015-02-26 | 2019-03-07 | Japan Aviation Electronics Industry, Limited | Electric connection structure and electric connection member |
WO2017203441A1 (en) | 2016-05-24 | 2017-11-30 | Wise S.R.L. | Electrical interconnection system between an intrinsically extensible conductor and a not intrinsically extensible one |
JP2019516473A (ja) | 2016-05-24 | 2019-06-20 | ワイズ ソシエタ ア レスポンサビリタ リミタータ | 本質的に伸張可能な導体と本質的に伸張不可能な導体との間の電気的相互接続システム |
JP2018086071A (ja) | 2016-11-28 | 2018-06-07 | 株式会社リコー | 経皮吸収デバイス及び経皮吸収パッチ |
WO2018224341A1 (de) | 2017-06-09 | 2018-12-13 | Neuroloop GmbH | Implantierbare elektrische verbindungsstruktur zwischen einem elektrischen implantat und einer elektrischen zu- und ableitungsstruktur |
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