JP7346115B2 - 固体組成物 - Google Patents
固体組成物 Download PDFInfo
- Publication number
- JP7346115B2 JP7346115B2 JP2019130451A JP2019130451A JP7346115B2 JP 7346115 B2 JP7346115 B2 JP 7346115B2 JP 2019130451 A JP2019130451 A JP 2019130451A JP 2019130451 A JP2019130451 A JP 2019130451A JP 7346115 B2 JP7346115 B2 JP 7346115B2
- Authority
- JP
- Japan
- Prior art keywords
- solid composition
- powder
- metal oxide
- oxide powder
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000008247 solid mixture Substances 0.000 title claims description 81
- 239000000843 powder Substances 0.000 claims description 127
- 239000011148 porous material Substances 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 50
- 229910044991 metal oxide Inorganic materials 0.000 claims description 39
- 150000004706 metal oxides Chemical class 0.000 claims description 39
- 239000010936 titanium Substances 0.000 claims description 39
- 238000009826 distribution Methods 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 28
- 229910052719 titanium Inorganic materials 0.000 claims description 26
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 14
- 229910052753 mercury Inorganic materials 0.000 claims description 14
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000002441 X-ray diffraction Methods 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000002459 porosimetry Methods 0.000 claims description 7
- 230000001186 cumulative effect Effects 0.000 claims description 5
- 229910003087 TiOx Inorganic materials 0.000 claims description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical group CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 description 24
- 239000000203 mixture Substances 0.000 description 18
- 239000002994 raw material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000005245 sintering Methods 0.000 description 10
- -1 LaTiO 3 Chemical compound 0.000 description 9
- 239000011324 bead Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000004115 Sodium Silicate Substances 0.000 description 6
- 229910052593 corundum Inorganic materials 0.000 description 6
- 239000010431 corundum Substances 0.000 description 6
- 238000000634 powder X-ray diffraction Methods 0.000 description 6
- 229910052911 sodium silicate Inorganic materials 0.000 description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011343 solid material Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000003991 Rietveld refinement Methods 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 1
- 229910001588 amesite Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052621 halloysite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/04—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B14/02—Granular materials, e.g. microballoons
- C04B14/30—Oxides other than silica
- C04B14/305—Titanium oxide, e.g. titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
- C04B28/26—Silicates of the alkali metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/6261—Milling
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/007—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof characterised by the pore distribution, e.g. inhomogeneous distribution of pores
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/36—Compounds of titanium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/04—Physical treatment, e.g. grinding, treatment with ultrasonic vibrations
- C09C3/041—Grinding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/14—Pore volume
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/16—Pore diameter
- C01P2006/17—Pore diameter distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00482—Coating or impregnation materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5427—Particle size related information expressed by the size of the particles or aggregates thereof millimeter or submillimeter sized, i.e. larger than 0,1 mm
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Metallurgy (AREA)
- Civil Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biochemistry (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Composite Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Powder Metallurgy (AREA)
Description
要件1:-200℃~1200℃における少なくとも一つの温度T1で|dA(T)/dT|が10ppm/℃以上を満たす。
Aは(前記粉体中の結晶のa軸(短軸)の格子定数)/(前記粉体中の結晶のc軸(長軸)の格子定数)であり、各前記格子定数は前記粉体のX線回折測定から得られる。
要件2:Cが0.04以上である。
C=(前記固体組成物の細孔分布曲線において細孔径がBであるときのLog微分細孔容積)/(前記固体組成物の細孔分布曲線において最大ピーク強度に相当するLog微分細孔容積)
B=(前記固体組成物の細孔分布曲線において最大ピーク強度を与える細孔径)/2
前記固体組成物の細孔分布曲線は、水銀圧入法により測定され、前記固体組成物の細孔径とLog微分細孔容積との関係を示す。
要件1:-200℃~1200℃における少なくとも一つの温度T1で|dA(T)/dT|が10ppm/℃以上を満たす。
Aは(前記粉体中の結晶のa軸(短軸)の格子定数)/(前記粉体中の結晶のc軸(長軸)の格子定数)であり、各前記格子定数は前記粉体のX線回折測定から得られる。
要件3:水銀圧入法により測定される前記固体組成物中の0.3~1.5μmの細孔径の累積細孔容積が0.005(mL/g)以上である。
第1実施形態にかかる固体組成物は、第一の材料と、粉体と、を含み、以下の要件1及び2を満たす。
Aは(前記粉体中の結晶のa軸(短軸)の格子定数)/(前記粉体中の結晶のc軸(長軸)の格子定数)であり、各前記格子定数は前記粉体のX線回折測定から得られる。
C=(前記固体組成物の細孔分布曲線において細孔径がBであるときのLog微分細孔容積)/(前記固体組成物の細孔分布曲線において最大ピーク強度に相当するLog微分細孔容積)
B=(前記固体組成物の細孔分布曲線において最大ピーク強度を与える細孔径)/2
前記固体組成物の細孔分布曲線は、水銀圧入法により測定され、前記固体組成物の細孔径とLog微分細孔容積との関係を示す。なお、Log微分細孔容積の単位は、例えばmL/gであることができる。
本実施形態の粉体は、上記の要件1を満たす。
ここで、本明細書においては、|dA(T)/dT|は、以下の式により定義される。
|dA(T)/dT|=|A(T+50)-A(T)|/50 …(D)
第一の材料としては、特に限定はされないが、樹脂、アルカリ金属珪酸塩、セラミックス、金属などを挙げることができる。第一の材料は、上記の粉体同士を結合させるバインダ材料、又は、上記の粉体を分散状態で保持するマトリクス材料であることができる。
セラミックスは、耐熱性を高くできるので好ましい。放電プラズマ焼結などによって焼結体を作ることができる。
本実施形態の組成物は、第一の材料及び粉体以外のその他の成分を含んでいてもよい。例えば、触媒が挙げられる。触媒としては、特に限定はされないが、酸性化合物、アルカリ性化合物、有機金属化合物などが挙げられる。酸性化合物としては、塩酸、硫酸、硝酸、燐酸、燐酸、蟻酸、酢酸、蓚酸等の酸を用いることができる。アルカリ性化合物としては、水酸化アンモニウム、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム等を用いることができる。有機金属化合物触媒としては、アルミニウム、ジルコニウム、スズ、チタン、亜鉛を含むもの等が挙げられる。
固体組成物中の粉体の含有量は、熱線膨張係数の低減効果を十分に得る観点から1重量%以上でよく、3重量%以上でもよく、5重量%以上でもよく、10重量%以上でもよく、20重量%以上でもよく、40重量%以上でもよく、70重量%以上でもよい。また、固体組成物中の粉体の含有量は99重量%以下でもよく、95重量%以下でもよく、90重量%以下でもよい。
本実施形態にかかる固体組成物の細孔構造は、上記の要件2を満たす。
要件2:Cが0.04以上である。
C=(固体組成物の細孔分布曲線において細孔径がBであるときのLog微分細孔容積)/(固体組成物の細孔分布曲線において最大ピーク強度に相当するLog微分細孔容積)
B=(固体組成物の細孔分布曲線において最大ピーク強度を与える細孔径)/2
固体組成物の細孔分布曲線は水銀圧入法により測定され、固体組成物の細孔径とLog微分細孔容積との関係を示す。
Bの範囲は特に限定されないが、0.1~10μmであることができる。
細孔分布曲線におけるピークのLog微分細孔容積の値にも特に限定はないが、0.02~2mL/gとすることができる。
つづいて、第2実施形態にかかる固体組成物について説明する。本実施形態では、第1実施形態と異なる点についてのみ説明し、第1実施形態と同じ点の説明は省略する。
要件3:水銀圧入法により測定される固体組成物中の0.3~1.5μmの細孔径の累積細孔容積が0.005(mL/g)以上である。
固体組成物の製造方法は特に制限されない。
また、細孔分布の大きさや分布の調整の一つの方法は、粉体の粒径分布を変えることである。
結晶構造の解析として、粉末X線回折測定装置SmartLab(リガク社製)を用いて、下記の条件で温度を変えて粉体を粉末X線回折測定し、粉末X線回折図形を得た。得られた図形に基づいて、PDXL2(リガク社製)ソフトウェアを用い、最小二乗法による格子定数の精密化を行い、2つの格子定数、すなわち、a軸長、及び、c軸長を求めた。
測定装置: 粉末X線回折測定装置SmartLab(Rigaku製) X線発生器: CuKα線源 電圧45kV、電流200mA
スリット: スリット幅2mm
スキャンステップ:0.02deg
スキャン範囲:5-80deg
スキャンスピード:10deg/min
X線検出器: 一次元半導体検出器
測定雰囲気: Ar 100mL/min
試料台 : 専用のガラス基板SiO2製
以下の方法により固体組成物の細孔分布について測定した。
前処理:固体組成物を120℃で4時間真空乾燥した。
測定:水銀圧入法により、細孔径を以下のWashburnの式を用いて算出した。
Washburnの式:PD=-4σCOSθ
P;圧力、σ;水銀の表面張力、D;細孔直径、θ;水銀と試料との接触角
測定条件:水銀の表面張力:480dynes/cm
水銀と試料との接触角:140degrees
測定装置:オートポアIV9520(micrometrics社製)
固体組成物の熱線膨張係数は以下の装置を用いて測定した。
測定装置:Thermo plus EVO2 TMAシリーズ Thermo plus 8310
温度領域:25℃-320℃とし、代表値として190―210℃における熱線膨張係数の値を算出した。
リファレンス固体:アルミナ
固体組成物の測定試料の典型的な大きさとしては、15mm×4mm×4mmとした。
15mm×4mm×4mmの固体組成物について、最長辺を試料長Lとして温度Tにおける試料長L(T)を測定した。30℃の試料長(L(30℃)に対する寸法変化率ΔL(T)/L(30℃)を下記式により算出した。
ΔL(T)/L(30℃)=(L(T)-L(30℃))/L(30℃)
本実施例では、190℃及び210℃の各温度で寸法変化率ΔL(T)/L(30℃)を求め、190℃~210℃における熱線膨張係数α(1/℃)を下記式により算出した。
α(1/℃)=(ΔL(210℃)-ΔL(190℃))/(L(30℃)×20℃)
(固体組成物の製造)
実施例1
粉体として、Ti2O3粉(高純度化学社製、150μmPass、純度99.9%)を用いた。
第一の材料の原料として、富士化学社製の一号珪酸ソーダ(珪酸ナトリウム水溶液)を用いた。富士化学社製の一号珪酸ソーダ中の固形分は約55重量%である。
追加の溶媒として、水を用いた。
上記の粉体を1.00g、第一の材料の原料を0.25g、溶媒を0.06g添加し、混合することで混合物を得た。
得られた混合物をポリテトラフルオロエチレン製の鋳型に入れ、以下の硬化プロファイルで硬化させた。
80℃まで15分で昇温、80℃で20分保持、その後、150℃まで20分で昇温、150℃で60分保持する。
さらに、その後320℃まで昇温させ10分保持し、降温する処理を行い、以上の工程から実施例1の固体組成物を得た。
Ti2O3粉(高純度化学社製、150μmPass、純度99.9%)を以下の条件でビーズミルにより粉砕して、粉体を得た。
粉砕条件:ビーズミルとして、アイメックス株式会社製のバッチ式レディーミル(RM B-08)を用いた。800cm3のベッセルを用い、1348rpm、周速5m/sの条件で粉砕をした。1mmの粒子径のZrO2ビーズを用い、水217g、ZrO2を613g、Ti2O3(高純度化学社製、150μmPass、24.9g)の割合で混合し、10分間粉砕した。
上記の粉体を用いた以外は実施例1と同様の方法で、実施例2の固体組成物を作製した。
Ti2O3粉(高純度化学社製、150μmPass、純度99.9%)を以下の条件でビーズミルにより粉砕して、粉体を得た。
粉砕条件:ビーズミルとして、アイメックス株式会社製、バッチ式レディーミル(RM B-08)を用いた。800cm3ベッセルを用い、1348rpm、周速5m/sの条件で実施した。1mmの粒子径のZrO2ビーズを用い、水217g、ZrO2を613g、Ti2O3(高純度化学社製、150μmPass、24.9g)の割合で混合し、20分間粉砕した。
上記の粉体を用いた以外は実施例1と同様の方法で、実施例3の固体組成物を作製した。
Ti2O3粉(高純度化学社製、150μmPass、純度99.9%)を以下の条件でビーズミルにより粉砕して、粉体を得た。
粉砕条件:ビーズミルとして、アイメックス株式会社 製、バッチ式レディーミル(RM B-08)を用いた。800cm3のベッセルを用い、1348rpm、周速5m/sの条件で実施した。1mmの粒子径のZrO2ビーズを用い、水217.0g、ZrO2を707.9g、Ti2O3(高純度化学社製、150μmPass、49.9g)の割合で混合し、60分間粉砕した。
上記の粉体を用いた以外は実施例1と同様の方法で、比較例1の固体組成物を作製した。
実施例1の粉体について、25℃、100℃、150℃、200℃、250℃、300℃、350℃、及び、400℃でそれぞれX線回折測定を行った。その結果、実施例1の粉体はコランダム構造のTi2O3に帰属され、空間群はR-3cであった。実施例1の粉体の上記各温度におけるa軸長、c軸長、及び、a軸長/c軸長を表1にまとめた。また、実施例1のa軸長/c軸長と温度Tとの関係、すなわち、A(T)を図1に示す。また、T1=150℃でのdA(T)/dT=(A(T+50)-A(T))/50は、-49ppm/℃であり、|dA(T)/dT|は49ppm/℃であった。
Claims (8)
- 第一の材料と、チタンを含有する金属酸化物粉と、を含む固体組成物であって、以下の要件1及び要件2を満たす、固体組成物。
要件1:-200℃~1200℃における少なくとも一つの温度T1で|dA(T)/dT|が10ppm/℃以上を満たす。
Aは(前記チタンを含有する金属酸化物粉中の結晶のa軸(短軸)の格子定数)/(前記チタンを含有する金属酸化物粉中の結晶のc軸(長軸)の格子定数)であり、各前記格子定数は前記チタンを含有する金属酸化物粉のX線回折測定から得られる。
要件2:Cが0.04以上である。
C=(前記固体組成物の細孔分布曲線において細孔径がBであるときのLog微分細孔容積)/(前記固体組成物の細孔分布曲線において最大ピーク強度に相当するLog微分細孔容積)
B=(前記固体組成物の細孔分布曲線において最大ピーク強度を与える細孔径)/2
前記固体組成物の細孔分布曲線は、水銀圧入法により測定され、前記固体組成物の細孔径とLog微分細孔容積との関係を示す。 - 前記チタンを含有する金属酸化物粉が、TiOx(x=1.30~1.66)粉である請求項1に記載の固体組成物。
- 前記チタンを含有する金属酸化物粉の含有量が、5重量%以上、95重量%以下である請求項1又は2に記載の固体組成物。
- 前記第一の材料が、樹脂、アルカリ金属珪酸塩、セラミックス、及び、金属からなる群より選ばれる少なくとも1つである請求項1~3のいずれか一項に記載の固体組成物。
- 第一の材料と、チタンを含有する金属酸化物粉と、を含む固体組成物であって、以下の要件1及び要件3を満たす、固体組成物。
要件1:-200℃~1200℃における少なくとも一つの温度T1で|dA(T)/dT|が10ppm/℃以上を満たす。
Aは(前記チタンを含有する金属酸化物粉中の結晶のa軸(短軸)の格子定数)/(前記チタンを含有する金属酸化物粉中の結晶のc軸(長軸)の格子定数)であり、各前記格子定数は前記チタンを含有する金属酸化物粉のX線回折測定から得られる。
要件3:水銀圧入法により測定される前記固体組成物中の0.3~1.5μmの細孔径の累積細孔容積が0.005(mL/g)以上である。 - 前記チタンを含有する金属酸化物粉が、TiOx(x=1.30~1.66)粉である請求項5に記載の固体組成物。
- 前記チタンを含有する金属酸化物粉の含有量が、5重量%以上、95重量%以下である請求項5又は6に記載の固体組成物。
- 前記第一の材料が、樹脂、アルカリ金属珪酸塩、セラミックス、および、金属からなる群より選ばれる少なくとも1つである請求項5~7のいずれか一項に記載の固体組成物。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019130451A JP7346115B2 (ja) | 2019-07-12 | 2019-07-12 | 固体組成物 |
PCT/JP2020/024355 WO2021010095A1 (ja) | 2019-07-12 | 2020-06-22 | 固体組成物 |
US17/625,230 US20220267210A1 (en) | 2019-07-12 | 2020-06-22 | Solid composition |
TW109123365A TW202112948A (zh) | 2019-07-12 | 2020-07-10 | 固體組合物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019130451A JP7346115B2 (ja) | 2019-07-12 | 2019-07-12 | 固体組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021014387A JP2021014387A (ja) | 2021-02-12 |
JP7346115B2 true JP7346115B2 (ja) | 2023-09-19 |
Family
ID=74210625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019130451A Active JP7346115B2 (ja) | 2019-07-12 | 2019-07-12 | 固体組成物 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220267210A1 (ja) |
JP (1) | JP7346115B2 (ja) |
TW (1) | TW202112948A (ja) |
WO (1) | WO2021010095A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019009366A1 (ja) * | 2017-07-06 | 2019-01-10 | 日本電気株式会社 | 特徴量生成装置、システム、特徴量生成方法及びプログラム |
JP2022180056A (ja) * | 2021-05-24 | 2022-12-06 | 住友化学株式会社 | 粒子群、組成物、成形体、及び、粒子群の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000095541A (ja) | 1998-07-23 | 2000-04-04 | Carl Zeiss:Fa | 低溶融温度複合ソルダ―ガラス、同用添加物及び同使用方法 |
JP2012056835A (ja) | 2010-09-06 | 2012-03-22 | Jeongkwan Co Ltd | 負の熱膨張係数を有する結晶化ガラス及びその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6066585A (en) * | 1998-05-18 | 2000-05-23 | Emerson Electric Co. | Ceramics having negative coefficient of thermal expansion, method of making such ceramics, and parts made from such ceramics |
-
2019
- 2019-07-12 JP JP2019130451A patent/JP7346115B2/ja active Active
-
2020
- 2020-06-22 WO PCT/JP2020/024355 patent/WO2021010095A1/ja active Application Filing
- 2020-06-22 US US17/625,230 patent/US20220267210A1/en active Pending
- 2020-07-10 TW TW109123365A patent/TW202112948A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000095541A (ja) | 1998-07-23 | 2000-04-04 | Carl Zeiss:Fa | 低溶融温度複合ソルダ―ガラス、同用添加物及び同使用方法 |
JP2012056835A (ja) | 2010-09-06 | 2012-03-22 | Jeongkwan Co Ltd | 負の熱膨張係数を有する結晶化ガラス及びその製造方法 |
Non-Patent Citations (4)
Title |
---|
CHEN, J. et al.,Applied Physics Letters,2006年,89,101914,10.1063/1.2347279 |
ISOBE, Toshihiro et al.,Preparation and properties of negative thermal expansion Zr2WP2O12 ceramics,Materials Research Bulletin,2009年11月 |
SHANG, Rui et al.,Effect of MgO and PVA on the Synthesis and Properties of Negative Thermal Expansion Ceramics of Zr2(WO2)(PO4)2,International Journal of Applied Ceramic Technology,2013年09月,Vol.10, No.5,p.849-856 |
VIOLINI, M. A. et al.,Ceramics International,44(17),2018年,pp.21470-21477 |
Also Published As
Publication number | Publication date |
---|---|
WO2021010095A1 (ja) | 2021-01-21 |
TW202112948A (zh) | 2021-04-01 |
JP2021014387A (ja) | 2021-02-12 |
US20220267210A1 (en) | 2022-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7397590B2 (ja) | 粉体の成形体、及び、フィラー粉体 | |
JP7346115B2 (ja) | 固体組成物 | |
KR102391368B1 (ko) | 복합 소결체, 정전 척 부재 및 정전 척 장치 | |
KR20190127731A (ko) | 복합 소결체, 정전 척 부재, 정전 척 장치 및 복합 소결체의 제조 방법 | |
EP3613718B1 (en) | Sintered body, substrate, circuit board, and method of manufacturing a sintered body | |
JP4999091B2 (ja) | タングステン酸ジルコニウム−酸化ケイ素複合焼結体の製造方法 | |
US20230174429A1 (en) | Sintered material, semiconductor manufacturing apparatus including the same, and method of manufacturing the sintered material | |
JP7346116B2 (ja) | 粉体及び固体組成物 | |
KR101766970B1 (ko) | 기능성 코팅막 제조방법 및 기능성 코팅막 | |
WO2022249967A1 (ja) | 粒子群、組成物、成形体、及び、粒子群の製造方法 | |
CN115335328B (zh) | 粒子、粉体组合物、固体组合物、液体组合物及成形体 | |
WO2021200507A1 (ja) | チタン酸化物、粉体、粉体組成物、固体組成物、液体組成物、及び成形体 | |
KR20210052250A (ko) | 복합 소결체 및 복합 소결체의 제조 방법 | |
US20220285164A1 (en) | Plasma Etching Apparatus Component for Manufacturing Semiconductor Comprising Composite Sintered Body and Manufacturing Method Therefor | |
US20230128381A1 (en) | Particle group, powder composition, solid composition, liquid composition, and compact | |
JP2023035557A (ja) | 焼結体及び半導体製造装置用部材 | |
KR20210011321A (ko) | 복합 소결체를 포함하는 반도체 제조용 플라즈마 식각 장치 부품 및 그 제조방법 | |
Kong et al. | Fabrication of ultrathin free-standing ceramic chips based on printing technology | |
Silicate | Journal Name RSCPublishing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220617 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230404 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230605 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230815 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230906 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7346115 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |