JP7336626B2 - セラミック焼結体、セラミック基板、実装用基板、電子装置及びセラミック焼結体の製造方法 - Google Patents

セラミック焼結体、セラミック基板、実装用基板、電子装置及びセラミック焼結体の製造方法 Download PDF

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JP7336626B2
JP7336626B2 JP2023534915A JP2023534915A JP7336626B2 JP 7336626 B2 JP7336626 B2 JP 7336626B2 JP 2023534915 A JP2023534915 A JP 2023534915A JP 2023534915 A JP2023534915 A JP 2023534915A JP 7336626 B2 JP7336626 B2 JP 7336626B2
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sintered body
ceramic sintered
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ceramic
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淑人 谷
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Kyocera Corp
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C04B35/117—Composites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Chemical & Material Sciences (AREA)
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  • Ceramic Engineering (AREA)
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  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP2023534915A 2021-08-03 2022-08-03 セラミック焼結体、セラミック基板、実装用基板、電子装置及びセラミック焼結体の製造方法 Active JP7336626B2 (ja)

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JP2021127812 2021-08-03
JP2021127812 2021-08-03
JP2021177914 2021-10-29
JP2021177914 2021-10-29
PCT/JP2022/029822 WO2023013684A1 (ja) 2021-08-03 2022-08-03 セラミック焼結体、セラミック基板、実装用基板、電子装置及びセラミック焼結体の製造方法

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JPWO2023013684A5 JPWO2023013684A5 (https=) 2023-08-10
JP7336626B2 true JP7336626B2 (ja) 2023-08-31

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016112576A (ja) 2014-12-12 2016-06-23 品川リフラクトリーズ株式会社 スライドプレート及びその製造方法
JP2016176988A (ja) 2015-03-18 2016-10-06 京セラ株式会社 低反射部材
JP2016532623A (ja) 2013-07-26 2016-10-20 サン−ゴバン サントル ド レシェルシュ エ デテュド ユーロペアン 高アルミナ含量を有する製品
JP2016188170A (ja) 2012-01-11 2016-11-04 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 耐火物及び耐火物を使用したガラス板の形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2565964A1 (fr) * 1984-06-13 1985-12-20 Lafarge Refractaires Nouveaux refractaires a haute teneur en alumine et leur procede d'obtention
JPS63166774A (ja) 1986-12-27 1988-07-09 同和鉱業株式会社 銅板とアルミナ基板との接合体の製造方法
JPH05243725A (ja) 1992-03-03 1993-09-21 Toshiba Corp セラミック基板と銅の直接接合法
SI2636656T1 (sl) * 2010-11-01 2016-11-30 Showa Denko K.K. Sintrano telo iz aluminijevega oksida, abrazivna zrna in brus
KR20170138221A (ko) 2016-06-07 2017-12-15 삼성전기주식회사 절연체 조성물 및 이를 이용한 전자 부품의 제조 방법
JP2020145335A (ja) 2019-03-07 2020-09-10 株式会社Ｆｊコンポジット 回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016188170A (ja) 2012-01-11 2016-11-04 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 耐火物及び耐火物を使用したガラス板の形成方法
JP2016532623A (ja) 2013-07-26 2016-10-20 サン−ゴバン サントル ド レシェルシュ エ デテュド ユーロペアン 高アルミナ含量を有する製品
JP2016112576A (ja) 2014-12-12 2016-06-23 品川リフラクトリーズ株式会社 スライドプレート及びその製造方法
JP2016176988A (ja) 2015-03-18 2016-10-06 京セラ株式会社 低反射部材

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WO2023013684A1 (ja) 2023-02-09
EP4382503A4 (en) 2025-07-30
JPWO2023013684A1 (https=) 2023-02-09
US20240336532A1 (en) 2024-10-10

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