JP7321038B2 - processing equipment - Google Patents

Description

The present invention relates to processing equipment.

In general, there is known a processing apparatus that forms processing grooves along the planned division lines by a processing means while holding a workpiece having a device region formed on the surface thereof by dividing the planned division lines by a plurality of planned division lines, while holding the workpiece on a chuck table. ing. In this type of machining apparatus, there is a demand to check whether or not there is a deviation between the planned position for forming the machining groove set by the operator and the planned division line before machining. For this reason, conventionally, a laser processing apparatus has been proposed in which a planned position where a laser-processed groove is to be formed can be visually confirmed by overlapping a planned line to be irradiated with a laser and a planned dividing line (for example, , see Patent Document 1).

JP 2016-146403 A

By the way, a package substrate called a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded Package) substrate, in which a plurality of device chips are sealed with resin or the like, is sometimes used as a workpiece. In general, a package substrate is composed of a plurality of device regions each containing a plurality of device chips and surplus regions surrounding each device region.

When cutting a package substrate along a dividing line, a conventional processing apparatus performs various processing orders according to processing conditions. For example, the surplus area other than the device area is often not sucked to the holding table, and if it is processed together with the device area in that state, the surplus area may fly out and damage the device, so the surplus area other than the device area is processed first. In order to improve processing efficiency by reducing the moving distance of the holding table and the processing unit, processing is performed in order from the end without distinguishing between the surplus region and the device region. It is envisioned that it will first be processed into a cross shape.

However, the setting of the machining order in the conventional machining apparatus is performed by inputting numerical data such as the feed amount of the machining means and the number of workpieces to be machined. For this reason, there is a problem that it is not easy for the operator to confirm whether the setting is as intended.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a processing apparatus that can easily confirm whether or not the processing order has been correctly set.

In order to solve the above-described problems and achieve the object, the present invention provides a processing apparatus for processing a workpiece having a device region partitioned by a plurality of planned division lines on the surface along the planned division lines. A holding table for holding a workpiece, a processing unit for forming processing grooves in the line to be divided, and a touch panel for receiving data setting by an operator and displaying various data set in the processing device. , a data processing unit, wherein the data processing unit includes a size registration unit for registering the size of the outer shape of the workpiece, and a processing data setting unit for registering processing data including the position of the line to be divided and the number of lines to be processed. a machining order setting unit for setting the machining order of the planned division lines registered in the machining data setting unit; and an outline display unit for displaying at least the outline of the workpiece on the touch panel based on the registered size. and a simulation unit that generates a virtual line at a position to be processed superimposed on the outer shape based on the processing data and displays it on the touch panel, and the virtual line is set in the processing order setting unit in the simulation unit. According to the calculated machining order, the virtual lines are sequentially displayed on the touch panel with a predetermined time lag , and the virtual lines are displayed together with numbers indicating the machining order in the simulation unit .

Further, in the processing apparatus described above, the outer shape is formed by an image obtained by picking up the workpiece.

ADVANTAGE OF THE INVENTION According to this invention, it is effective in being able to easily confirm whether the process order is set correctly.

FIG. 1 is an external perspective view schematically showing a configuration example of a cutting device according to an embodiment. FIG. 2 is a plan view schematically showing a configuration example of a package substrate processed by the cutting device according to the embodiment. FIG. 3 is a bottom view schematically showing a configuration example of the package substrate according to the embodiment. FIG. 4 is a side view schematically showing a configuration example of the package substrate according to the embodiment. FIG. 5 is a diagram showing an example of a setting screen for processing condition data according to the embodiment. FIG. 6 is a diagram showing an example of a setting screen for processing order data according to the embodiment. FIG. 7 is a diagram illustrating an example of a simulation screen according to the embodiment; FIG. 8 is a flow chart showing the processing flow of the cutting device according to the embodiment. FIG. 9 is a diagram illustrating an example of image transition in the simulation moving image according to the embodiment. FIG. 10 is a diagram illustrating a transition example of images in the simulation moving image according to the embodiment.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

In the following description, substantially the same items may be distinguished by attaching different numerals after the same reference numerals. For example, the line to be divided 104, the line to be divided 104X, and the line to be divided 104Y, which are substantially the same, are distinguished as necessary. Also, when there is no particular need to distinguish between substantially the same items, only the same reference numerals are given, for example, as in the line to be divided 104, and the description will be made without particular distinction.

[Embodiment]
FIG. 1 is an external perspective view schematically showing a configuration example of a cutting device according to an embodiment. FIG. 2 is a plan view schematically showing a configuration example of a package substrate processed by the cutting device according to the embodiment. FIG. 3 is a bottom view schematically showing a configuration example of the package substrate according to the embodiment. FIG. 4 is a side view schematically showing a configuration example of the package substrate according to the embodiment.

A cutting device (an example of a processing device) 1 cuts a package substrate (an example of a workpiece) 100 to divide it into individual package devices.

The package substrate 100 is a package substrate such as a CSP substrate or a QFN substrate, and as shown in FIG. 2 or 3, includes a substrate 101 formed in a rectangular shape in plan view. The substrate 101 is made of metal such as 42 alloy (alloy of iron and nickel) or copper. The front surface 101a and back surface 101b sides of the substrate 101 are each divided into a plurality of (three in this embodiment) device regions 102 and surplus regions 103 surrounding each device region 102 . The device region 102 on the surface 101a side of the substrate 101 is further partitioned into a plurality of regions by a plurality of intersecting dividing lines 104, and each region contains an IC (Integrated Circuit), an LED (Light Emitting Diode), Device chips 105 including devices such as MEMS (Micro Electro Mechanical Systems) are arranged. A sealing resin layer (mold resin portion) 106 is formed in each device region 102 on the surface 101a side, and the device chip 105 arranged in the device region 102 is covered with this sealing resin layer 106. . Also, a marker 107 for indicating the position of the dividing line 104 is formed in the surplus area 103 on the surface 101a side.

A stage 108 is arranged on the rear surface side of each device chip 105 (on the rear surface 101b side of the substrate 101). A plurality of structures 109 made of a material such as metal are formed around each stage 108 so as to be superimposed on the division line 104 . This structure 109 is exposed on the back surface 101b side of the substrate 101 and is connected to electrodes of the device chip 105 via metal wires (not shown) or the like. One structure 109 is connected to electrodes of device chips 105 arranged on two adjacent stages 108 with the structure 109 interposed therebetween. For example, when the package substrate 100 is cut along the dividing line 104 to form a package device in which the device chip 105 is sealed, the structure 109 is also divided. The structure 109 after division becomes an electrode of each package device.

In this embodiment, the package substrate 100 having a sealing resin layer 106 on the front surface 101a side of the substrate 101 formed in a rectangular shape in a plan view is used. There are no restrictions. Similarly, there are no restrictions on the type, quantity, material, shape, structure, size, arrangement, etc. of device chips and structures.

As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 10, a cutting unit 20, a processing feed unit 30, an indexing feed unit 40, a cutting feed unit 50, a cassette elevator 60, a cleaning unit 70, and a control unit 80 .

The chuck table 10 functions as a holding table that holds the workpiece. The chuck table 10 holds the package substrate 100 by suction. In this embodiment, the package substrate 100 has a dicing tape 110 adhered to the rear surface thereof, and an annular frame 111 is adhered to the dicing tape 110 . The package substrate 100 is thereby supported by the annular frame 111 via the dicing tape 110 .

The chuck table 10 is arranged on the upper surface of the rectangular parallelepiped apparatus main body 2, and includes a holding surface 11 on which the package substrate 100 is placed and sucked, and a plurality of clamp portions 12 arranged on the outer peripheral side of the holding surface 11. and The chuck table 10 has a disk shape in which a portion constituting the holding surface 11 is made of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The placed package substrate 100 is held by suction. The clamp part 12 fixes an annular frame 111 that supports the package substrate 100 . The chuck table 10 is movable in the X-axis direction (processing feed direction) in the opening 2a formed in the upper surface of the apparatus main body 2 by the processing feed unit 30, and is moved in the Z-axis direction by a rotation drive source (not shown). (the vertical direction) is rotated around an axis parallel to the

The cutting unit 20 (an example of a processing unit) functions as a processing unit that forms processing grooves in the line to be divided 104 . The cutting unit 20 cuts the package substrate 100 held on the chuck table 10 . A support structure 3 is provided on the upper surface of the apparatus main body 2 so as to straddle the opening 2a in the Y-axis direction (indexing direction). The cutting unit 20 is attached to the support structure 3 via an indexing feed unit 40 and a cutting feed unit 50 . In the present embodiment, the cutting apparatus 1 has two cutting units 20 as shown in FIG. 1, but may have one cutting unit 20.

The cutting unit 20 includes a cutting blade 21 mounted on a rotationally driven spindle (not shown). The cutting unit 20 cuts the package substrate 100 along the X-axis direction by feeding the chuck table 10 (package substrate 100) in the X-axis direction while rotating the cutting blade 21 . After that, the cutting unit 20 is sequentially indexed and fed, for example, at a predetermined pitch in the Y-axis direction by the indexing and feeding unit 40, and repeatedly cuts the package substrate 100 along the X-axis direction at this pitch interval.

An imaging unit 22 for imaging the package substrate 100 is fixed to the cutting unit 20 so as to move integrally. The imaging unit 22 includes a CCD camera for imaging the upper surface of the package substrate 100 held on the chuck table 10. For example, an image for aligning the planned division line 104 of the package substrate 100 and the cutting blade 21 is captured. or a partial image of the package substrate 100 is acquired. This partial image of the package substrate 100 is used by the control unit 80 to generate the entire image of the package substrate 100 .

The processing feed unit 30 relatively moves the chuck table 10 and the cutting unit 20 in the X-axis direction. The processing feed unit 30 has a drive source such as a ball screw or a motor (not shown) extending in the X-axis direction, and moves a movable base 31 supporting the chuck table 10 in the X-axis direction. The processing feed unit 30 also includes a bellows member 32 that is arranged in the opening 2a, connected to the front and rear of the movable base 31, and extends in the X-axis direction.

The indexing feed unit 40 relatively moves the chuck table 10 and the cutting unit 20 in the Y-axis direction. The indexing feed unit 40 is fixed to a pair of guide rails 41 extending in the Y-axis direction, a ball screw 42 arranged parallel to the guide rails 41, and a nut (not shown) screwed onto the ball screw 42. , a Y-axis movable base 43 slidably disposed on a guide rail 41 and a motor 44 for rotating a ball screw 42 . The indexing feed unit 40 rotates the ball screw 42 with the motor 44 to move the Y-axis movable base 43 supporting the cutting unit 20 and the cutting feed unit 50 in the Y-axis direction.

The cutting feed unit 50 moves the cutting unit 20 in the Z-axis direction orthogonal to the holding surface 11 of the chuck table 10 . The cutting feed unit 50 extends in the Z-axis direction and includes a pair of guide rails 51 fixed to the Y-axis moving base 43, a ball screw 52 arranged parallel to the guide rails 51, and a ball screw 52. It is provided with a Z-axis moving base 53 fixed to a screwed nut (not shown) and slidably arranged on a guide rail 51 and a motor 54 for rotating a ball screw 52 . The cutting feed unit 50 rotates the ball screw 52 with the motor 54 to move the Z-axis movable base 53 that supports the cutting unit 20 in the Z-axis direction.

The cassette elevator 60 supports a cassette 61 accommodating a plurality of package substrates 100 so as to be vertically movable with respect to the apparatus main body 2 . The cleaning unit 70 holds and cleans the package substrate 100 cut by the cutting unit 20 with a spinner table 71 .

The control unit 80 controls the above-described components of the cutting device 1 to cause the cutting device 1 to perform machining operations on the workpiece 200 . The control unit 80 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having ROM (read only memory), RAM (random access memory), HDD (Hard Disk Drive), etc. and an input/output interface device. The arithmetic processing device of the control unit 80 performs arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to the above-described control signal of the cutting device 1 via the input/output interface device. output to the configured element.

As shown in FIG. 1, the control unit 80 includes a data processing section 81, which includes a size registration section 811, a processing data setting section 812, a processing order setting section 813, and an outline display section 814. , a simulation unit 815 , and a data storage unit 816 .

The size registration unit 811 is a functional unit that provides a function for registering the outer size of the workpiece. The processing data setting unit 812 is a functional unit that provides a function for registering processing data including the position of the planned division line 104 and the number of lines to be processed. FIG. 5 is a diagram showing an example of a setting screen for processing condition data according to the embodiment.

As shown in FIG. 5, the size registration unit 811 has an area A1 for registering the shape and size of the workpiece in the cutting device 1 on the processing condition data setting screen G1. The area A1 is provided with an input box for selecting either a circular workpiece or a rectangular workpiece as the shape of the workpiece and setting the size for each shape. The operator can perform an input operation on the area A1 to select the shape of the workpiece and set the size. For example, when the workpiece is the package substrate 100, the operator selects a "rectangular workpiece" as the shape of the workpiece and sets the sizes of the channels "Ch1" and "Ch2." By registering the shape and size of the workpiece by the size registration unit 811, an outline representing the outline of the workpiece is displayed in a simulation described later.

In addition, as shown in FIG. 5, the processing data setting unit 812 has areas A2 and A3 for registering processing data including the positions of the lines to be divided 104 and the number of lines to be processed as processing condition data.

The area A2 is provided with an input box corresponding to the item "θ angle" for each of the channels "Ch1" and "Ch2". The angle for cutting is set in the item "θ angle". The area A3 is provided with input boxes corresponding to the items of "index" and "number of repeated lines" for each of the channels "Ch1" and "Ch2". The index item sets the indexing feed amount of the processing unit (cutting unit 20), that is, the interval (position) when cutting the workpiece. The number of lines to be cut along the corresponding channel (θ angle) is set in the number of repeated lines item.

The setting screen G1 for processing condition data shown in FIG. 5 is provided with a button B1 for displaying a screen for setting processing order data. Note that FIG. 5 illustrates one of the setting screens G1 for processing condition data, and may include setting items such as the number of revolutions of the spindle.

The processing order setting unit 813 is a functional unit that provides a function for setting the processing order of the lines to be divided 104 registered in the processing data setting unit 812 . FIG. 6 is a diagram showing an example of a setting screen for processing order data according to the embodiment.

As shown in FIG. 6, the processing order setting unit 813 includes an area A4 for setting the processing order of the lines to be divided on the processing order setting screen G2. The area A4 is provided with input boxes for setting the channel, start line, end line, etc. for each sequence number. The sequence number indicates the order of machining the workpiece (the order of cutting the planned dividing line 104). The start line indicates the planned division line 104 where the machining starts, and the end line shows the planned division line 104 where the machining ends. The numbers displayed for the start line and the end line indicate the number of planned division lines in each channel based on the processing data stored in the processing data setting unit. FIG. 6 shows an example of a processing procedure for a total of 20 lines to be divided, including 15 lines to be divided in channel 1 and 5 lines to be divided in channel 2. In the columns of line and end line, numbers assigned according to the number of lines to be divided in each channel are set. For example, the number "1" is assigned to the scheduled division line corresponding to the first line in channel 1, and the number "15" is assigned to the scheduled division line corresponding to the fifteenth line. Similarly, the number "1" is assigned to the planned division line corresponding to the first line in channel 2, and the number "5" is assigned to the planned division line corresponding to the fifth line. In this way, the processing order of the planned division lines is set by setting the numbers assigned to the planned division lines for each channel in the respective items of the start line and the end line in the area A4 of the setting screen G2. can. For example, when it is desired to cut the planned division line corresponding to the first line of channel 2 first, the sequence number shown in FIG. "1" may be set in the item and "1" may be set in the item of the end line. Further, if it is desired to cut the planned division line corresponding to the fifth line of channel 2 following the planned division line corresponding to the first line of channel 2, the channel corresponding to the sequence number shown in FIG. The item (Ch) should be set to "2", the start line item to "5", and the end line item to "5". Ninthly, if it is desired to cut the lines to be divided corresponding to the 2nd to 4th lines of channel 1, the sequence number shown in FIG. , "2" and "4" should be set in the item of the start line and the item of the end line, respectively. By repeating such a procedure, the processing order of the lines to be divided can be set. In the example shown in FIG. 6, the sequence numbers "Seq.1" to "Seq.20" indicating the processing order are displayed in the area A4. And as a processing procedure for a total of 20 lines to be divided, including the five lines to be divided in channel 2, for each sequence with sequence numbers: "Seq.1" to "Seq.12", channel, A start line and an end line are set.

In addition, on the machining order data setting screen G2 shown in FIG. 6, a simulation screen is displayed as a virtual moving image showing how cutting grooves are formed along the scheduled dividing line 104 in accordance with the machining order. A button B2 is provided.

The outline display unit 814 is a functional unit that provides a function for displaying the outline (shape) of the workpiece on the touch panel 90 based on the size of the workpiece registered by the processing data setting unit 812 .

Based on the processing data set as the processing conditions, the simulation unit 815 superimposes the outline displayed by the outline display unit 814, generates a virtual line at the position where the workpiece is processed, and displays it on the touch panel 90. It is a functional part that provides the function of The virtual lines generated by the simulation unit 815 are sequentially displayed on the touch panel 90 with a predetermined time difference according to the processing order of the lines to be divided set by the processing order setting unit 813, for example. FIG. 7 is a diagram illustrating an example of a simulation screen according to the embodiment;

A display area A5 for displaying a simulation image is provided on the simulation screen G3 shown in FIG. In the display area A5, a simulation image including an image of outline FL indicating the outline (shape) of the workpiece displayed by outline display unit 814 and a plurality of images of virtual lines VL generated by simulation unit 815 is displayed. Is displayed.

The data storage unit 816 stores various data used for control by the cutting device 1 . The data storage unit 816 can store data registered by the size registration unit 811 , processing data set as processing conditions by the processing data setting unit 812 , and processing order data set by the processing order setting unit 813 .

A touch panel 90 is connected to the control unit 80 . Under the control of the control unit 80, the touch panel 90 displays an image of the package substrate 100 captured by the imaging unit 22 and various information required for processing, and accepts input operations required for processing from the operator. The touch panel 90 is arranged on the housing of the cutting device 1 at a location that is easy to see and easy to operate. The touch panel 90 includes a display device and an input device. The touch panel 90 may be configured by a touch screen display including a display device such as a liquid crystal display or an organic EL display and a touch screen for designating an input position and coordinates on the display surface of the display device.

Processing of the cutting device 1 according to the embodiment will be described. FIG. 8 is a flow chart showing the processing flow of the cutting device according to the embodiment. The processing shown in FIG. 8 is executed, for example, in response to detection of an operation on a button B2 provided on the processing order data setting screen G2.

As shown in FIG. 8, the data processing unit 81 reads processing condition data (step S101) and reads processing order data (step S102).

Subsequently, the outline display unit 814 displays the workpiece (package substrate 100) in the display area A5 of the simulation screen G3 displayed on the touch panel 90 based on the shape and size of the workpiece (package substrate 100) set in the processing condition data. is displayed (step S103). The outer diameter display unit 814 stores, for example, the coordinates set in the alignment step in which the operator sets the position of the line to be divided (corresponding to the reference point P in FIG. 2) in the apparatus, and displays the coordinates on the touch panel. Reproduce the reference point P in the contour to be drawn.

Next, based on the machining condition data and the machining order data, the simulation unit 815 superimposes the image of the contour line FL indicating the contour of the workpiece, and superimposes the image of the virtual line indicating the planned position where the workpiece is actually machined. Simulation data for displaying the VL image is generated (step S104). The simulation data is, for example, video data showing how a virtual line VL is formed on an image of an outline FL representing the outline of a workpiece. Also, when the simulation data is displayed on the touch panel 90, numbers indicating the processing order are also displayed.

Specifically, the simulation unit 815 generates simulation data based on the index and number of repetitions set in the processing condition data and the processing order set in the processing order data. The simulation unit 815 generates simulation data for sequentially drawing virtual lines VL at predetermined positions, starting from the reference point P reproduced when the outline display unit 814 displays the outline FL indicating the outline of the workpiece. do. For example, the simulation unit 815 generates a moving image showing how the virtual lines VL are sequentially drawn on the outline FL at intervals set in the index, with the reference point P as a starting point. By displaying the generated moving image on the touch panel 90, the simulation unit 815 can reproduce how cutting grooves are sequentially formed on the workpiece based on the machining conditions.

Subsequently, the simulation unit 815 displays the simulation data in the display area A5 of the simulation screen G3 (step S105). 9 and 10 are diagrams showing transition examples of images in the simulation video according to the embodiment.

An example in which a virtual line VL corresponding to one sequence number is displayed will be described with reference to FIG. For example, it is assumed that the operator selects the sequence number "Seq.1" on the processing order data setting screen G2 and the simulation is started. In this case, as shown in FIG. 9, the simulation unit 815 shows how a virtual line VL corresponding to the sequence number: “Seq. View videos. This moving image displays a state in which the virtual line VL is gradually formed over a predetermined period of time: "T1" (for example, 500 milliseconds). Predetermined time: "T1" may correspond to, for example, the machining speed set in the machining condition data.

An example in which virtual lines VL for all sequence numbers are displayed in order according to the sequence numbers will be described with reference to FIG. For example, assume that the operator operates the button B2 on the processing order data setting screen G2 to start the simulation. In this case, as shown in FIG. 10, the simulation unit 815 draws a virtual line VL corresponding to the sequence numbers “Seq. Display an animation showing how it is formed in order. This moving image displays how the virtual lines VL corresponding to the set processing order are sequentially formed at intervals of a predetermined time: "T1" (for example, 500 milliseconds).

The data processing unit 81 is not limited to the examples shown in FIGS. 9 and 10, and can display a simulation corresponding to any sequence number specified by the operator. For example, when receiving designation of sequence numbers: “Seq.5” to “Seq.10” from the operator, the data processing unit 81 generates virtual lines corresponding to the sequence numbers: “Seq.5” to “Seq.10”. Simulation data showing how the VL is formed can be displayed on the touch panel 90 .

[Modification]
In the above embodiment, an example in which the workpiece is the package substrate 100 having a rectangular shape has been described, but the workpiece is not particularly limited to this example, and may be a semiconductor wafer having a circular shape. .

Further, in the above embodiment, when displaying the simulation data, the image of the outline FL indicating the outline (shape) of the workpiece is displayed on the touch panel based on the shape and size of the workpiece registered by the size registration unit 811. 90 has been described. There is no need to be particularly limited to this example, and instead of the image of the outline FL, an image of the workpiece may be used to generate the simulation data. By generating simulation data in which the image of the virtual line is superimposed on the actual image of the workpiece, the virtual line is displayed at the position where the cutting groove is actually formed on the actual image of the workpiece. The state of formation can be displayed on the touch panel 90 as simulation data.

〔others〕
As described above, in the cutting apparatus 1, the simulation unit 815 sequentially displays the images of the virtual line VL on the touch panel 90 with a predetermined time difference (for example, T1) according to the machining order set in the machining order data. . As a result, the cutting apparatus 1 can provide the operator with a moving image of how virtual lines are formed at positions where cutting grooves are actually formed in the order in which the workpiece is actually machined. The operator can easily confirm whether or not the machining order is correctly set.

Also, in the cutting device 1, the simulation unit 815 displays the virtual line together with the number indicating the machining order. As a result, the cutting apparatus 1 allows the operator to recognize the machining order numerically and to more easily confirm whether the machining order has been set correctly.

In addition, in the cutting device 1, the outer shape of the workpiece can be formed from an image of the workpiece. Thereby, the cutting apparatus 1 can provide the operator with more realistic simulation data.

REFERENCE SIGNS LIST 1 cutting device 10 chuck table 11 holding surface 20 cutting unit 21 cutting blade 22 imaging unit 80 control unit 81 data processing unit 90 touch panel 100 package substrate 101a front surface 101b back surface 102 device area 103 surplus area 104, 104X, 104Y planned division line 105 device Chip 106 Sealing resin layer 811 Size registration unit 812 Processing data setting unit 813 Processing order setting unit 814 Outline display unit 815 Simulation unit 816 Data storage unit FL Outline line VL Virtual line P Reference point

Claims (2)

A processing apparatus for processing a workpiece having device regions partitioned by a plurality of planned division lines on the surface thereof along the planned division lines,
a holding table that holds the workpiece;
a processing unit that forms a processing groove in the line to be divided;
a touch panel that receives data setting by an operator and displays various data set in the processing device;
a data processing unit,
The data processing unit
a size registration unit for registering the size of the outer shape of the workpiece;
a processing data setting unit for registering processing data including the position of the scheduled division line and the number of processing lines;
a machining order setting unit for setting the machining order of the lines to be divided registered in the machining data setting unit;
an outline display unit that displays at least the outline of the workpiece on the touch panel based on the registered size;
a simulation unit that generates a virtual line at a position to be processed superimposed on the outer shape based on the processing data and displays the virtual line on the touch panel;
including
In the simulation part, the virtual line is
Displayed sequentially on the touch panel with a predetermined time lag according to the processing order set in the processing order setting unit ,
In the simulation section,
A processing apparatus , wherein the virtual line is displayed together with a number indicating a processing order . The outline is
2. The processing apparatus according to claim 1 , wherein the processing device is formed from an image obtained by picking up a workpiece.

Images