JP7302396B2 - image display device - Google Patents

Description

An embodiment of the present disclosure relates to an image display device.

Currently, mobile terminal devices such as smartphones and tablets are becoming more sophisticated, smaller, thinner and lighter. Since these mobile terminal devices use a plurality of communication bands, they require a plurality of antennas corresponding to the communication bands. For example, mobile terminal devices include telephone antennas, WiFi (Wireless Fidelity) antennas, 3G (Generation) antennas, 4G (Generation) antennas, LTE (Long Term Evolution) antennas, and Bluetooth (registered trademark) antennas. , an NFC (Near Field Communication) antenna, and the like. However, with the miniaturization of mobile terminal devices, the mounting space for antennas is limited, and the degree of freedom in antenna design is narrowing. Also, since the antenna is built in a limited space, the radio sensitivity is not always satisfactory.

JP 2011-66610 A Patent No. 5636735 Patent No. 5695947

Further, in recent years, the development of mobile terminal equipment for fifth-generation communication, ie, 5G (Generation), is underway. Antennas for 5G (especially millimeter waves) have high directivity, and it is necessary to incorporate multiple antennas into mobile terminal devices.

Therefore, it has been considered to arrange a parasitic mesh antenna with wires too thin to be visible to the naked eye on the side of the light emitting surface of the mobile terminal device, and to arrange a communication antenna module on the opposite side of the light emitting surface of the mobile terminal device. ing. As a result, it is considered that double resonance occurs between the mesh antenna and the communication antenna module, and broadband characteristics are obtained. However, if a display device such as an organic EL display device exists inside the mobile terminal device, the metal present in the display device inhibits the double resonance, and the resonance between the communication antenna module and the mesh antenna is not performed smoothly. may not

The present embodiment provides an image display device capable of smoothly generating double resonance between a parasitic mesh wiring layer and a communication antenna module.

An image display device according to this embodiment includes a self-luminous display device having a light-emitting surface, a transparent substrate positioned on the light-emitting surface side of the self-luminous display device, and a transparent substrate disposed on the substrate. a wiring board having a parasitic mesh wiring layer; and a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device, wherein the self-luminous display device includes a light emitter, and a metal layer located on the opposite side of the light emitting surface than the light emitter, and an opening or a notch is provided in the metal layer in an antenna region corresponding to the communication antenna module.

In the image display device according to this embodiment, the communication antenna module may be accommodated inside the opening or the notch.

In the image display device according to this embodiment, an insulator may be embedded in the opening or the notch, and the communication antenna module may be arranged on the insulator.

An image display device according to this embodiment includes a self-luminous display device having a light-emitting surface, a transparent substrate positioned on the light-emitting surface side of the self-luminous display device, and a transparent substrate disposed on the substrate. a wiring board having a parasitic mesh wiring layer; and a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device, the self-luminous display device having a light emitter. In the self-luminous display device, the pixel density of the light emitters located in the antenna area corresponding to the communication antenna module is lower than the pixel density of the light emitters located in areas other than the antenna area. ing.

In the image display device according to this embodiment, the pixel density (ppi) of the light emitter in the antenna area is 20% or more and 50% or less of the pixel density (ppi) of the light emitter in the area other than the antenna area. can be

An image display device according to this embodiment includes a self-luminous display device having a light-emitting surface, a transparent substrate positioned on the light-emitting surface side of the self-luminous display device, and a transparent substrate disposed on the substrate. and a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device, wherein the self-luminous display device includes a plurality of light emitters. and a transparent electrode positioned closer to the light-emitting surface than the light emitter, wherein at least the transparent electrode positioned in an antenna area corresponding to the communication antenna module in the self-luminous display device is patterned. there is

In the image display device according to this embodiment, the transparent electrode has a pixel corresponding portion corresponding to each light emitter and a connecting portion connecting the pixel corresponding portions. An electrode opening may be formed in the periphery.

In the image display device according to this embodiment, at least in the antenna region, a ratio of the electrode openings per unit area may be 50% or more and 80% or less.

In the image display device according to this embodiment, an array type mesh wiring layer may be arranged on the substrate of the wiring board and around the parasitic mesh wiring layer.

In the image display device according to this embodiment, the parasitic mesh wiring layer of the wiring substrate includes a plurality of first wirings, and the first wirings have a line width of 0.1 μm or more and 5.0 μm or less. Also good.

According to the embodiments of the present disclosure, double resonance can be smoothly generated between the parasitic mesh wiring layer and the communication antenna module.

1 is a plan view showing an image display device according to an embodiment; FIG. FIG. 2 is a cross-sectional view (cross-sectional view taken along the line II-II in FIG. 1) showing the image display device according to the embodiment; FIG. 3 is a diagram showing a cross-sectional configuration of the image display device according to the embodiment; 4A and 4B are bottom views showing a self-luminous display device and a communication antenna module; FIG. FIG. 5 is a cross-sectional view showing a modification of the self-luminous display device and the communication antenna module; FIG. 6 is a plan view showing a comparison of the arrangement of organic light-emitting layers in the antenna area and other areas; FIG. 7 is a plan view showing a comparison of the arrangement of the first electrodes in the antenna area and other areas; FIG. 8 is a plan view showing a second electrode (transparent electrode); FIG. 9 is a plan view showing a wiring board; FIG. 10 is an enlarged plan view showing a parasitic mesh wiring layer of the wiring board; FIG. 11 is a cross-sectional view showing the wiring board (a cross-sectional view taken along line XI-XI in FIG. 10); FIG. 12 is a cross-sectional view showing the wiring substrate (a cross-sectional view taken along line XII-XII in FIG. 10); 13A to 13I are cross-sectional views showing a method of manufacturing a wiring board according to an embodiment; FIG. FIG. 14 is a plan view showing an image display device according to a modification; FIG. 15 is an enlarged plan view showing an array-type mesh wiring layer of a wiring board of an image display device according to a modification;

First, an embodiment will be described with reference to FIGS. 1 to 13. FIG. 1 to 13 are diagrams showing this embodiment.

Each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In addition, it is possible to modify and implement as appropriate without departing from the technical idea. In addition, in each figure shown below, the same code|symbol is attached|subjected to the same part and detailed description may be partially abbreviate|omitted. In addition, numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, perpendicular, etc., not only have strict meanings but also include substantially the same states.

Further, in the following embodiments, "X direction" is a direction parallel to one side of the image display device. The “Y direction” is a direction perpendicular to the X direction and parallel to the other side of the image display device. The “Z direction” is a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the image display device. Further, the “surface” refers to a surface on the positive side in the Z direction, which is on the side of the light emitting surface of the image display device, and which faces the viewer. The term “back surface” refers to the surface on the negative side in the Z direction, which is opposite to the surface facing the light-emitting surface and the viewer side of the image display device.

[Configuration of image display device]
The configuration of the image display device according to the present embodiment will be described with reference to FIGS. 1 to 8. FIG.

As shown in FIGS. 1 and 2, an image display device (display device) 60 includes a self-luminous display device (display) 61 housed in a housing 62 and a light-emitting surface 64 side of the self-luminous display device 61. and a communication antenna module 63 located on the opposite side of the light-emitting surface 64 of the self-luminous display device 61 . The wiring substrate 10 has a transparent substrate 11 and a parasitic mesh wiring layer 20 arranged on the substrate 11 .

As shown in FIG. 1, the communication antenna module 63 is located on the periphery of the self-luminous display device 61 in plan view. Further, the wiring substrate 10 is arranged inside the self-luminous display device 61 and on the side of the light emitting surface 64 . The parasitic mesh wiring layer 20 of the wiring board 10 is provided at a position where at least a portion thereof overlaps the communication antenna module 63 in plan view. In this image display device 60, radio waves of a predetermined frequency can be transmitted and received via the communication antenna module 63, and communication can be performed. The communication antenna module 63 may include any of a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, and the like. good.

In general, when the communication antenna module 63 is, for example, a 5G antenna (particularly a millimeter wave antenna), the communication antenna module 63 tends to have a narrow bandwidth and strong directivity. On the other hand, in the present embodiment, parasitic mesh wiring layer 20 is provided on substrate 11 at a position overlapping communication antenna module 63 . As a result, the substrate 11 serves as a dielectric, and the parasitic mesh wiring layer 20 causes double resonance, thereby widening the bandwidth of the communication antenna module 63 .

Examples of such an image display device 60 include mobile terminal devices such as smartphones and tablets. Details of the wiring board 10 will be described later.

Next, a cross-sectional configuration of the image display device 60 will be further described with reference to FIG.

As shown in FIG. 3, the image display device 60 includes a self-luminous display device 61, a wiring substrate 10 positioned on the side of the light-emitting surface 64 of the self-luminous display device 61 (positive side in the Z direction), and a self-luminous display device. and a communication antenna module 63 located on the opposite side (Z direction negative side) of the light emitting surface 64 of the device 61 . Note that FIG. 3 mainly shows cross sections of the wiring board 10, the self-luminous display device 61, and the communication antenna module 63, and omits the display of the housing 62 and the like.

In the present embodiment, in the self-luminous display device 61, the metal density of the antenna region _Ra , which is the region corresponding to the communication antenna module 63, is the same as that of the region other than the antenna region _Ra (also referred to as other region) R It is lower than the metal density of _x . That is, the antenna region _Ra has a smaller amount of metal per unit area than the other regions _Rx . Specifically, as will be described later, (i) in the metal layer 66 of the self-luminous display device 61, an opening 77 or a notch 78 is provided in the antenna region _Ra corresponding to the communication antenna module 63. . (ii) In the self-luminous display device 61, the pixel density of the organic light-emitting layer (light-emitting body) 86 located in the antenna region _Ra is lower than that of the organic light-emitting layer (light-emitting body) 86 located in the other region _Rx . is lower than the pixel density of (iii) Further, in the self-luminous display device 61, at least the second electrode (transparent electrode) 87 located in the antenna region _Ra is patterned.

In this way, by making the amount (density) of metal per unit area in the antenna region _Ra smaller than the amount (density) of metal per unit area in the other region _Rx , the self-luminous display device 61 It is possible to prevent the transmission of radio waves from being obstructed along the thickness direction (Z direction) of the . As a result, double resonance can be easily generated in the parasitic mesh wiring layer 20, and the bandwidth of the communication antenna module 63 can be widened.

Here, the antenna region _Ra corresponding to the communication antenna module 63 refers to a region of the self-luminous display device 61 that at least partially overlaps with the communication antenna module 63 when viewed from the plane direction (Z-direction plus side). (See FIGS. 1-3). Note that the antenna area _Ra does not necessarily have to overlap the entire area of the communication antenna module 63 when viewed in the planar direction, and may overlap with at least a portion of the communication antenna module 63 . Also, the antenna area _Ra may be an area wider than the communication antenna module 63 when viewed in the planar direction. The area of the antenna region _Ra is preferably 10% or less, more preferably 5% or less, of the total display region of the self-luminous display device 61 .

The self-luminous display device 61 is, for example, an organic EL (Electro Luminescence) display device. The self-luminous display device 61 includes a graphite layer 65 , a metal layer 66 , a support base material 67 , a resin base material 68 , and a thin film transistor (TFT) 69 in this order from the side opposite to the light emitting surface 64 (Z direction minus side). , an organic EL layer 71 , a polarizing plate 72 , a touch sensor 73 , a decorative film 74 , and a cover glass 75 .

The graphite layer 65 and the metal layer 66 are stacked together to form a heat dissipation layer 76 . The heat dissipation layer 76 is located on the opposite side of the light emitting surface 64 (minus side in the Z direction) of the organic light emitting layer (light emitter) 86 of the organic EL layer 71 . The heat dissipation layer 76 plays a role of making it difficult for heat from other electronic devices (not shown) located on the opposite side of the light-emitting surface 64 from the self-luminous display device 61 to be transferred to the organic EL layer 71 side. Note that the heat dissipation layer 76 does not necessarily have the graphite layer 65 and may be composed only of the metal layer 66 . The metal layer 66 may be made of a metal with good thermal conductivity, such as copper.

In the present embodiment, an opening 77 is provided in the antenna region _Ra corresponding to the communication antenna module 63 in the heat dissipation layer 76 (graphite layer 65 and metal layer 66). That is, as shown in FIG. 3 , an opening 77 is formed in the heat dissipation layer 76 so as to surround the communication antenna module 63 . The opening 77 penetrates the heat dissipation layer 76 in the thickness direction. Also, the communication antenna module 63 is housed inside the opening 77 . In this case, the communication antenna module 63 is glued to the support substrate 67 within the opening 77 . By providing the opening 77 in the antenna region _Ra in this way, it is possible to suppress the transmission of radio waves from being hindered by the conductor existing between the communication antenna module 63 and the parasitic mesh wiring layer 20, Double resonance can be easily generated in the mold mesh wiring layer 20 . Further, since the communication antenna module 63 is housed inside the opening 77, the self-luminous display device 61 can be made thin.

4A and 4B are diagrams of the self-luminous display device 61 and the communication antenna module 63 as seen from the back side. FIG. 4(a) is a view taken in the direction of arrow IV in FIG. As shown in FIG. 4A, a heat dissipation layer 76 (graphite layer 65 and metal layer 66) is formed with a rectangular opening 77 in plan view, and the communication antenna module 63 is accommodated in the opening 77. As shown in FIG. In this case, the heat dissipation layer 76 is provided so as to surround the entire periphery of the opening 77 .

FIG. 4B shows a modification of the self-luminous display device 61. As shown in FIG. As shown in FIG. 4B, a notch 78 is provided in the antenna region _Ra corresponding to the communication antenna module 63 in the heat dissipation layer 76 (graphite layer 65 and metal layer 66). This notch 78 is cut out toward the periphery of the heat dissipation layer 76 , and the heat dissipation layer 76 is provided in a U-shape so as to surround the circumference of the notch 78 . In this case, the communication antenna module 63 is accommodated inside the cutout 78 .

Further, as shown in FIG. 5, an insulator 79 such as resin is embedded in the opening 77 or the notch 78 of the heat dissipation layer 76 (the graphite layer 65 and the metal layer 66). The communication antenna module 63 may be arranged on the surface).

Referring again to FIG. 3, a support substrate 67 is positioned over metal layer 66 . The support base material 67 supports the entire self-luminous display device 61, and may be made of, for example, a flexible film. As a material of the support base material 67, for example, polyethylene terephthalate can be used.

A resin base material 68 is arranged on the support base material 67 . The resin base material 68 supports the thin film transistor 69, the organic EL layer 71, and the like, and is composed of a flexible flat layer. The resin base material 68 is formed by applying a method such as a die coating method, an inkjet method, a spray coating method, a plasma CVD method, a thermal CVD method, a capillary coating method, a slit and spin method, or a center dropping method. Also good. As the resin base material 68, for example, colored polyimide can be used.

A thin film transistor (TFT) 69 is arranged on the resin base material 68 . The thin film transistor 69 is for driving the organic EL layer 71 and controls the voltage applied to a first electrode 85 and a second electrode 87 of the organic EL layer 71, which will be described later.

The thin film transistor 69 has an insulating layer 81 and a gate electrode 82 , a source electrode 83 and a drain electrode 84 embedded in the insulating layer 81 . The insulating layer 81 is formed, for example, by laminating materials having electrical insulation properties, and either known organic materials or inorganic materials can be used. For example, the insulating layer 81 may be made of silicon oxide (SiO ₂ ), silicon nitride (SiN _x ), silicon oxynitride (SiON), silicon nitride (SiN), or aluminum oxide (AlO _x ). As the gate electrode 82, for example, a molybdenum-tungsten alloy, a laminate of titanium and aluminum, or the like can be used. As the source electrode 83 and the drain electrode 84, for example, a laminate of titanium and aluminum, a laminate of copper-manganese, copper, and molybdenum, or the like can be used.

The organic EL layer 71 is arranged on the thin film transistor 69 and electrically connected to the thin film transistor 69 . The organic EL layer 71 includes a first electrode (reflective electrode, anode electrode) 85 arranged on the resin base material 68, an organic light emitting layer (light emitter) 86 arranged on the first electrode 85, an organic light emitting layer 86 and a second electrode (transparent electrode, cathode electrode) 87 disposed thereon. A bank 88 is formed on the thin film transistor 69 so as to cover the edge of the first electrode 85 . An opening corresponding to each pixel is formed by being surrounded by the bank 88, and the above-described organic light emitting layer 86 is arranged in this opening. Furthermore, the first electrode 85 , the organic light emitting layer 86 , the second electrode 87 and the bank 88 are sealed with a sealing resin 89 . Here, the first electrode 85 constitutes an anode electrode, and the second electrode 87 constitutes a cathode electrode. However, the polarities of the first electrode 85 and the second electrode 87 are not particularly limited.

The first electrode 85 is formed on the resin base material 68 by a method such as sputtering, vapor deposition, ion plating, CVD, or the like. As the material of the first electrode 85, it is preferable to use a material that can efficiently inject holes. Examples include metal materials such as aluminum, chromium, molybdenum, tungsten, copper, silver or gold, and alloys thereof. can be done.

The organic light-emitting layer (light-emitting body) 86 has a function of emitting light by generating an excited state by injecting and recombining holes and electrons. The organic light-emitting layer 86 is formed on the first electrode 85 by a vapor deposition method, a nozzle coating method in which a coating liquid is applied from a nozzle, or a printing method such as inkjet. The organic light-emitting layer 86 preferably contains a fluorescent organic substance configured to emit light upon application of a predetermined voltage. mentioned. The plurality of organic light-emitting layers 86 are any one of a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, and the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer are repeatedly formed side by side.

In the present embodiment, as described above, in the self-luminous display device 61, the pixel density of the organic light-emitting layer (emitter) 86 located in the antenna region _Ra is the same as that of the organic light-emitting layer located in the other region _Rx . It is lower than the pixel density of layer (emitter) 86 .

For example, as shown in FIG. 6, the organic light-emitting layers 86 are arranged at a lower density in the antenna region _Ra than in the other regions _Rx . That is, the distance d _1a between the organic light-emitting layers 86 in the antenna region R _a is wider than the distance d _1x between the organic light-emitting layers 86 in the other regions R _x (d _1a >d _1x ).

For this reason, as shown in FIG. 7, the first electrodes 85 arranged corresponding to the organic light-emitting layers 86 are similarly arranged with a lower density in the antenna region _Ra than in the other regions _Rx . be. That is, the spacing _d2a between the first electrodes 85 in the antenna region R _a is wider than the spacing _d2x between the first electrodes 85 in the other region R _x (d _2a >d _2x ). The electrodes of the thin film transistor 69 (the gate electrode 82, the capacitor electrode (not shown), and the data wiring (not shown)) are also arranged at a lower density in the antenna region _Ra than in the other region _Rx . may be

Here, the pixel density is also referred to as resolution, and is the fineness of the lattice that expresses the image displayed by the self-luminous display device 61 . Pixel density is commonly expressed in pixels per inch (ppi). When expressed by the number of pixels (ppi), the pixel density of the organic light-emitting layer 86 in the antenna region _Ra is preferably 20% or more and 50% or less of the pixel density of the organic light-emitting layer 86 in the other regions _Rx . . By setting the pixel density of the organic light-emitting layer 86 in the antenna region _Ra to 20% or more of the pixel density in the other region _Rx , the roughness of the image between the antenna region _Ra and the other region _Rx is reduced. You can make the difference invisible. Further, by setting the pixel density of the organic light-emitting layer 86 in the antenna region _Ra to 50% or less of the pixel density in the other region _Rx , It is possible to prevent the transmission of radio waves from being hindered by the conductor.

In this way, by making the pixel density of the organic light-emitting layer 86 in the antenna region _Ra lower than that in the other regions _Rx , the density of the conductors (the first electrode 85 and the like) in the antenna region _Ra is reduced to that of the other regions Rx. can be lower than _Rx . This prevents the transmission of radio waves from being hindered by the conductor existing between the communication antenna module 63 and the parasitic mesh wiring layer 20, and facilitates the generation of double resonance in the parasitic mesh wiring layer 20. be able to.

Referring to FIG. 3, a second electrode (transparent electrode) 87 is formed on the organic light emitting layer 86 . The second electrode 87 may be formed by, for example, a sputtering method, a vapor deposition method, an ion plating method, a CVD method, or the like. As a material for the second electrode 87, it is preferable to use a material that is easy to inject electrons and has good light transmittance. Specific examples include indium tin oxide (ITO), indium zinc oxide (IZO), lithium oxide, and cesium carbonate.

In this embodiment, as described above, at least the second electrode 87 (transparent electrode) located in the antenna region _Ra is patterned. That is, as shown in FIG. 8, the second electrode 87 has a pixel corresponding portion 91 corresponding to each organic light emitting layer 86 (pixel portion) and a connecting portion 92 connecting the pixel corresponding portions 91 to each other. there is An electrode opening 93 is formed around the pixel corresponding portion 91 and the connecting portion 92 . The electrode opening 93 is a portion where the conductor constituting the second electrode 87 does not exist, and penetrates through the second electrode 87 in the thickness direction (Z direction). In addition, in FIG. 8, the organic light-emitting layer 86 is indicated by a chain double-dashed line. Although the method for patterning the second electrode 87 is not limited, for example, a vapor deposition method using a metal mask, a photolithography method, a lift-off method, and the like can be used.

By patterning at least the second electrode 87 in the antenna region _Ra in this manner, the density of the conductors (the second electrode 87) in the antenna region _Ra is reduced compared to when the second electrode 87 is not patterned. can do. This prevents the transmission of radio waves from being hindered by the conductor existing between the communication antenna module 63 and the parasitic mesh wiring layer 20, and facilitates the generation of double resonance in the parasitic mesh wiring layer 20. be able to.

In addition, at least in the antenna region _Ra , the ratio of the electrode openings 93 per unit area is preferably 50% or more and 80% or less. Here, the "proportion of the electrode openings 93 per unit area" is {(total area of the electrode openings 93 existing at least in a predetermined region within the antenna region _Ra )/(area of the predetermined region)}×100. (%) can be calculated. By setting the ratio of the electrode openings 93 per unit area to 50% or more, it is possible to prevent the transmission of radio waves from being hindered by the conductor existing between the communication antenna module 63 and the parasitic mesh wiring layer 20. can be done. By setting the ratio of the electrode openings 93 per unit area to 80% or less, electricity can be reliably supplied from the second electrode 87 to each organic light-emitting layer 86 .

The region where the second electrode 87 (transparent electrode) is patterned is not limited to the antenna region _Ra . In addition to the antenna region _Ra , the second electrode 87 located in another region _Rx may be patterned. Further, the second electrode 87 may be patterned over the entire area of the self-luminous display device 61 (entire antenna area _Ra and other areas _Rx ).

Referring to FIG. 3, the bank 88 is formed using an insulating organic material such as resin. Examples of the organic material used for forming the bank 88 include acrylic resin, polyimide resin, novolak phenol resin, and the like.

A sealing resin 89 is arranged on the bank 88 and the second electrode 87 . This sealing resin 89 protects the organic light emitting layer 86 . As the sealing resin 89, for example, silicone resin or acrylic resin can be used.

Light emitted from the organic EL layer 71 is extracted from the light emitting surface 64 . That is, light from the organic EL layer 71 is extracted from above the sealing resin 89 . Thus, the self-luminous display device 61 in this embodiment is a so-called top emission display device.

A polarizing plate 72 is arranged on the organic EL layer 71 . This polarizing plate 72 filters the light from the organic EL layer 71 . The polarizing plate 72 may have a polarizer and a pair of translucent protective films attached to both sides of the polarizer.

The touch sensor 73 is arranged on the polarizing plate 72 . The touch sensor 73 detects and outputs contact position data when a finger or the like is brought into contact with the self-luminous display device 61 .

As shown in FIG. 3, the wiring substrate 10 is arranged in the self-luminous display device 61 and closer to the light emitting surface 64 than the organic light emitting layer (light emitter) 86, as described above. In this case, the wiring board 10 is arranged between the touch sensor 73 and the decorative film 74 of the self-luminous display device 61 . Details of the wiring board 10 will be described later.

The decorative film 74 is arranged on the wiring board 10 . The decorative film 74 has an opening, for example, in a portion overlapping the display area of the self-luminous display device 61 when viewed from the observer side, and shields portions other than the display area from light. That is, the decorative film 74 is arranged so as to cover the end portion of the self-luminous display device 61 when viewed from the observer side.

A cover glass 75 is arranged on the decorative film 74 . This cover glass 75 is a member made of glass that transmits light. The cover glass 75 is plate-shaped and may be rectangular in plan view.

Note that the self-luminous display device 61 described above may be any display device having a function of emitting light itself, and is not limited to an organic EL display device. For example, it may be a micro LED display device including micro LED elements (emitters).

[Configuration of Wiring Board]
Next, the configuration of the wiring board will be described with reference to FIGS. 9 to 12. FIG. 9 to 12 are diagrams showing the wiring board according to this embodiment.

As shown in FIG. 9, the wiring board 10 according to the present embodiment is used in an image display device 60. It is arranged closer to the light emitting surface 64 than the layer (light emitter) 86 is. Such a wiring board 10 includes a transparent substrate 11 and a parasitic mesh wiring layer 20 arranged on the substrate 11 .

Among them, the substrate 11 has a substantially rectangular shape in plan view, with its longitudinal direction parallel to the Y direction and its short direction parallel to the X direction. The substrate 11 is transparent, has a substantially flat plate shape, and has a substantially uniform thickness as a whole. The length _L1 of the substrate 11 in the longitudinal direction (Y direction) can be selected in the range of, for example, 100 mm or more and 200 mm or less, and the length _L2 of the substrate 11 in the lateral direction (X direction) is, for example, 50 mm or more. It can be selected within a range of 100 mm or less.

The material of the substrate 11 may be any material that has transparency in the visible light region and electrical insulation. Although the material of the substrate 11 is polyethylene terephthalate in this embodiment, the material is not limited to this. Examples of materials for the substrate 11 include polyester resins such as polyethylene terephthalate, acrylic resins such as polymethyl methacrylate, polycarbonate resins, polyimide resins, polyolefin resins such as cycloolefin polymers, and triacetyl cellulose. It is preferable to use an organic insulating material such as a cellulose resin material. Further, as the material of the substrate 11, glass, ceramics, or the like can be appropriately selected depending on the application. Although the substrate 11 is illustrated as being composed of a single layer, it is not limited to this, and may have a structure in which a plurality of base materials or layers are laminated. Further, the substrate 11 may be film-like or plate-like. Therefore, the thickness of the substrate ₁₁ is not particularly limited and can be appropriately selected according to the application. can be

In FIG. 9, the parasitic mesh wiring layer 20 is formed on the substrate 11 . The parasitic mesh wiring layer 20 serves to widen the bandwidth of the communication antenna module 63 (see FIGS. 1 and 2) of the image display device 60 described above. The parasitic mesh wiring layer 20 is provided at a position where at least a portion thereof overlaps the communication antenna module 63 of the image display device 60 in plan view (see FIG. 1). Therefore, the parasitic mesh wiring layer 20 is provided near the outer edge of the substrate 11 . The parasitic mesh wiring layer 20 is located at a distance _Pa from the outer edge of the substrate 11, and the distance _Pa may be, for example, 1 mm or more and 10 mm or less.

The size of the parasitic mesh wiring layer 20 corresponds to the frequency used for the communication antenna module 63 of the image display device 60 . That is, the parasitic mesh wiring layer 20 has a substantially square shape in plan view, one side of which is parallel to the X direction and the other side of which is parallel to the Y direction. The length of one side of the parasitic mesh wiring layer 20 (the length in the X direction and the Y direction) L _a corresponds to half the wavelength of the frequency used in the communication antenna module 63 (L _a =λ/ 2). Specifically, the length _{L a} of one side of the parasitic mesh wiring layer 20 can be selected within a range of, for example, 4 mm or more and 50 mm or less. Also, a plurality of parasitic mesh wiring layers 20 may be arranged on the substrate 11 .

As shown in FIG. 10, each parasitic mesh wiring layer 20 has metal wires formed in a lattice shape or mesh shape, and has a pattern repeated in the X direction and the Y direction. That is, the parasitic mesh wiring layer 20 is composed of a portion extending in the X direction (a portion of the first connecting wiring 22 to be described later) and a portion extending in the Y direction (a portion of the first wiring 21 to be described later). It is composed of repetition of character-like unit pattern shapes 20a.

As shown in FIG. 10, the parasitic mesh wiring layer 20 includes a plurality of first wirings 21 arranged parallel to each other and a plurality of first connecting wirings 22 connecting the plurality of first wirings 21. there is Specifically, the plurality of first wirings 21 and the plurality of first connecting wirings 22 are integrated as a whole to form a lattice shape or a mesh shape. Each first wiring 21 extends in a direction (Y direction) parallel to one side of the parasitic mesh wiring layer 20, and each first connecting wiring 22 extends in a direction (X direction) perpendicular to the first wiring 21. extended. The first wiring 21 and the first connecting wiring 22 each have a length L _a corresponding to half the wavelength (λ/2) of a predetermined frequency (the side length of the parasitic mesh wiring layer 20 described above, FIG. 9). reference). Thereby, the parasitic mesh wiring layer 20 exhibits a function of widening the bandwidth of the communication antenna module 63 as a parasitic element. In addition, the first wiring 21 and the first connection wiring 22 are connected to each other, thereby playing a role of suppressing disconnection of the first wiring 21 and the first connection wiring 22 .

The plurality of first wirings 21 are arranged at regular intervals in the X direction. The pitch _P1 of the first wirings 21 can be, for example, in the range of 0.05 mm or more and 1 mm or less. Also, the plurality of first connecting wires 22 are arranged at equal intervals in the Y direction. The pitch _P2 of the plurality of first connecting wires 22 can be, for example, in the range of 0.01 mm or more and 1 mm or less.

In the parasitic mesh wiring layer 20, a plurality of openings 23 are formed by being surrounded by the first wirings 21 adjacent to each other and the first connecting wirings 22 adjacent to each other. Each opening 23 has a substantially square shape in plan view. Further, the transparent substrate 11 is exposed from each opening 23 . Therefore, by increasing the area of each opening 23, the transparency of the wiring board 10 as a whole can be improved. Although the first wirings 21 and the first connecting wirings 22 are orthogonal to each other, they may cross each other at an acute angle or an obtuse angle. In addition, the pitch _P1 of the first wiring 21 and the pitch _P2 of the first connecting wiring 22 are uniform within the parasitic mesh wiring layer 20. It may be uniform.

As shown in FIG. 11, each first wiring 21 has a substantially rectangular or square cross section perpendicular to its longitudinal direction (X direction cross section). In this case, the cross-sectional shape of the first wiring 21 is substantially uniform along the longitudinal direction (Y direction) of the first wiring 21 . Further, as shown in FIG. 12, the shape of the cross section (Y direction cross section) perpendicular to the longitudinal direction of each first connecting wiring 22 is substantially rectangular or substantially square. X-direction cross section) is substantially the same as the shape. In this case, the cross-sectional shape of the first connecting wiring 22 is substantially uniform along the longitudinal direction (X direction) of the first connecting wiring 22 . The cross-sectional shape of the first wiring 21 and the first connecting wiring 22 does not necessarily have to be substantially rectangular or substantially square. It may have a substantially trapezoidal shape, or a shape in which the side surfaces located on both sides in the longitudinal direction are curved.

In the present embodiment, the line width W ₁ (length in the X direction, see FIG. 11) of the first wiring 21 and the line width W ₂ (length in the Y direction, see FIG. 12) of the first connecting wiring 22 are It is not particularly limited, and can be appropriately selected depending on the application. For example, the line width _W1 of the first wiring 21 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and the line width _W2 of the first connection wiring 22 can be selected in the range of 0.1 μm or more and 5.0 μm or less. A range can be selected. Further, the height H ₁ (length in the Z direction, see FIG. 11) of the first wiring 21 and the height H ₂ (length in the Z direction, see FIG. 12) of the first connecting wiring 22 are not particularly limited. It can be appropriately selected according to the application, for example, it can be selected in the range of 0.1 μm or more and 5.0 μm or less.

The material of the first wiring 21 and the first connecting wiring 22 may be a metal material having conductivity. Although the material of the first wiring 21 and the first connecting wiring 22 is copper in the present embodiment, the material is not limited to this. Metal materials (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, and nickel can be used as the material of the first wiring 21 and the first connecting wiring 22, for example.

In the present embodiment, the aperture ratio At of the parasitic mesh wiring layer 20 can be, for example, in the range of 87% or more and less than 100%. By setting the aperture ratio At of the parasitic mesh wiring layer 20 within this range, the conductivity and transparency of the wiring board 10 can be ensured. In addition, the opening ratio is defined as the opening area (the first wiring 21, the first connecting wiring 22, etc.) in the unit area of a predetermined area (for example, the parasitic mesh wiring layer 20), and the substrate 11 is the area ratio (%) of the exposed area).

In the present embodiment, the parasitic mesh wiring layer 20 is of a parasitic type and is not electrically connected to a power supply section. That is, the outer periphery of parasitic mesh wiring layer 20 is not connected to other metal parts over the entire periphery, and is surrounded by substrate 11 over the entire periphery in plan view.

Furthermore, as shown in FIGS. 11 and 12, a protective layer 17 is formed on the surface of the substrate 11 so as to cover the parasitic mesh wiring layer 20 . The protective layer 17 protects the parasitic mesh wiring layer 20 and is formed over substantially the entire surface of the substrate 11 . Examples of materials for the protective layer 17 include acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate, modified resins and copolymers thereof, and polyvinyls such as polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, and polyvinyl butyral. Colorless and transparent insulating resins such as resins and their copolymers, polyurethanes, epoxy resins, polyamides, and chlorinated polyolefins can be used. Also, the thickness _T2 of the protective layer 17 can be selected in the range of 0.3 μm or more and 100 μm or less. The protective layer 17 may be formed so as to cover at least the parasitic mesh wiring layer 20 of the substrate 11 .

[Method for manufacturing wiring board]
Next, with reference to FIGS. 13(a) to 13(i), a method for manufacturing a wiring board according to this embodiment will be described. 13A to 13I are cross-sectional views showing the method of manufacturing the wiring board according to this embodiment.

First, as shown in FIG. 13A, a substrate 11 is prepared, and a conductive layer 51 is formed over substantially the entire surface of the substrate 11 . In this embodiment, the thickness of the conductive layer 51 is 200 nm. However, the thickness is not limited to this, and the thickness of the conductive layer 51 can be appropriately selected within the range of 10 nm or more and 1000 nm or less. In this embodiment, the conductive layer 51 is formed by sputtering using copper. As a method for forming the conductive layer 51, a plasma CVD method may be used.

Next, as shown in FIG. 13B, a photocurable insulating resist 52 is supplied over substantially the entire surface of the substrate 11 . As the photocurable insulating resist 52, for example, an organic resin such as an epoxy resin can be used.

Subsequently, a transparent imprint mold 53 having convex portions 53a is prepared (FIG. 13(c)), the mold 53 and the substrate 11 are brought close to each other, and photocuring is performed between the mold 53 and the substrate 11. Then, the insulating resist 52 is developed. Next, the insulating layer 54 is formed by curing the photocurable insulating resist 52 by light irradiation from the mold 53 side. As a result, a trench 54a is formed on the surface of the insulating layer 54 to have a shape to which the projection 53a is transferred. The trench 54 a has a planar shape pattern corresponding to the first wiring 21 , the first connecting wiring 22 , the second wiring 31 and the second connecting wiring 32 .

Thereafter, the mold 53 is separated from the insulating layer 54 to obtain the insulating layer 54 having the cross-sectional structure shown in FIG. 13(d).

By forming the trenches 54a on the surface of the insulating layer 54 by imprinting in this manner, the shape of the trenches 54a can be made finer. Note that the insulating layer 54 may be formed by a photolithography method without being limited to this. In this case, a resist pattern is formed by photolithography so as to expose the conductive layer 51 corresponding to the first wiring 21 , the first connecting wiring 22 , the second wiring 31 and the second connecting wiring 32 .

As shown in FIG. 13D, a residue of the insulating material may remain at the bottom of the trench 54a of the insulating layer 54. As shown in FIG. Therefore, a wet treatment using a permanganate solution or N-methyl-2-pyrrolidone or a dry treatment using oxygen plasma is performed to remove the residue of the insulating material. By removing the residue of the insulating material in this manner, a trench 54a exposing the conductive layer 51 can be formed as shown in FIG. 13(e).

Next, as shown in FIG. 13( f ), the trenches 54 a of the insulating layer 54 are filled with a conductor 55 . In the present embodiment, the trenches 54a of the insulating layer 54 are filled with copper by electroplating using the conductive layer 51 as a seed layer.

Subsequently, as shown in FIG. 13(g), the insulating layer 54 is removed. In this case, the insulating layer 54 on the substrate 11 is removed by wet processing using a permanganate solution or N-methyl-2-pyrrolidone or dry processing using oxygen plasma.

Next, as shown in FIG. 13(h), the conductive layer 51 on the surface of the substrate 11 is removed. At this time, the conductive layer 51 is etched so that the surface of the substrate 11 is exposed by performing wet processing using a hydrogen peroxide solution. Thus, the wiring substrate 10 having the substrate 11 and the parasitic mesh wiring layer 20 arranged on the substrate 11 is obtained. In this case, the parasitic mesh wiring layer 20 includes first wirings 21 and first connecting wirings 22 .

Thereafter, as shown in FIG. 13I, a protective layer 17 is formed to cover the parasitic mesh wiring layer 20 on the substrate 11 . Methods for forming the protective layer 17 include roll coating, gravure coating, gravure reverse coating, micro gravure coating, slot die coating, die coating, knife coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, and flexographic coating. Printing may be used.

[Action of the present embodiment]
Next, the operation of this embodiment having such a configuration will be described.

As shown in FIGS. 1 to 3, the wiring board 10 is incorporated into an image display device (display device) 60 having a self-luminous display device 61. FIG. In such an image display device 60, the parasitic mesh wiring layer 20 of the wiring board 10 is provided at a position where at least a portion thereof overlaps the communication antenna module 63 in plan view. Therefore, in the image display device 60, radio waves of a predetermined frequency can be transmitted and received via the communication antenna module 63, and communication can be performed.

By the way, in general, when the communication antenna module 63 is, for example, a 5G antenna (particularly a millimeter wave antenna), the communication antenna module 63 tends to have a narrow bandwidth and strong directivity. On the other hand, in the present embodiment, parasitic mesh wiring layer 20 is provided on substrate 11 at a position overlapping communication antenna module 63 . As a result, the substrate 11 serves as a dielectric, the parasitic mesh wiring layer 20 causes double resonance, and the bandwidth of the communication antenna module 63 can be widened.

In the present embodiment, the metal density in the antenna region _Ra of the self-luminous display device 61 is lower than the metal density in the other regions _Rx (see FIG. 3). Specifically, as described above, (i) the heat dissipation layer 76 (the graphite layer 65 and the metal layer 66) has an opening 77 or a notch 78 in the antenna region _Ra . (ii) Further, the pixel density of the organic light-emitting layer (light-emitting body) 86 located in the antenna region _Ra is lower than the pixel density of the organic light-emitting layer (light-emitting body) 86 located in the other region _Rx . . (iii) Further, at least the second electrode 87 (transparent electrode) located in the antenna region _Ra is patterned.

In this way _, by making the amount (density) of metal per unit area in the antenna region _Ra smaller than the amount (density) of metal per unit area in the other regions _Rx , It is possible to prevent the transmission of radio waves from being hindered by the conductive material. As a result, double resonance can be smoothly generated between the parasitic mesh wiring layer 20 and the communication antenna module 63, and the bandwidth of the communication antenna module 63 can be widened.

In this embodiment, as a method for reducing the density of metal in the antenna region _Ra , (i) openings 77 or cutouts 78 are provided in the heat dissipation layer 76, (ii) the organic light emitting layer (light emitter) 86 and (iii) patterning the second electrode 87 are both performed. However, without being limited to this, any one or more of the above (i), (ii) and (iii) may be implemented.

Further, according to the present embodiment, the wiring substrate 10 includes the transparent substrate 11 and the parasitic mesh wiring layer 20 arranged on the substrate 11 . Since the parasitic mesh wiring layer 20 has a mesh-like pattern of conductor portions as opaque conductor layer forming portions and a large number of openings, the transparency of the wiring board 10 is ensured. there is As a result, when the wiring board 10 is placed on the self-luminous display device 61, the self-luminous display device 61 can be seen through the opening 23 of the parasitic mesh wiring layer 20. 61 visibility is not hindered.

(Modification)
Next, a modified example of the image display device will be described.

14 and 15 show a modified example of the image display device. The modifications shown in FIGS. 14 and 15 are different in that the array type mesh wiring layer 30 is arranged around the parasitic mesh wiring layer 20, and the other configurations are the same as those shown in FIGS. 1 to 13 described above. is substantially the same as the embodiment shown in FIG. In FIG. 14, the same reference numerals are assigned to the same parts as those shown in FIGS. 1 to 13, and detailed description thereof will be omitted.

In the image display device 60 shown in FIG. 14, the array type mesh wiring layer 30 is arranged on the substrate 11 of the wiring substrate 10 and around the parasitic mesh wiring layer 20 . Specifically, the array type mesh wiring layers 30 are arranged on both sides of the parasitic type mesh wiring layer 20 in the X direction. The pair of array-type mesh wiring layers 30 have the same shape and are spaced apart from the parasitic mesh wiring layer 20 .

The length _Lb of the array type mesh wiring layer 30 is the same as or slightly different from the side length _La of the parasitic type mesh wiring layer 20 described above. In addition, the length _Lc of the array-type mesh wiring layer 30 in the lateral direction (X direction) can be selected within a range of, for example, 1 mm or more and 10 mm or less. The interval _Pb between the array-type mesh wiring layer 30 and the non-feeding-type mesh wiring layer 20 can be appropriately selected according to the bandwidth of the communication antenna module 63. For example, it should be in the range of 0.3 mm or more and 5 mm or less. can be done. In this case, the interval between one array type mesh wiring layer 30 and the parasitic mesh wiring layer 20 and the interval between the other array type mesh wiring layer 30 and the parasitic mesh wiring layer 20 are the same. but can be different.

As shown in FIG. 15, the array-type mesh wiring layer 30 has metal wires formed in a lattice shape or mesh shape, and has a pattern repeated in the X direction and the Y direction. That is, the array-type mesh wiring layer 30 is an L-shaped portion composed of a portion extending in the X direction (a portion of the second connecting wiring 32 to be described later) and a portion extending in the Y direction (a portion of the second wiring 31 to be described later). It is composed of repeating unit pattern shapes 30a each having a shape.

The array-type mesh wiring layer 30 includes a plurality of second wirings 31 arranged parallel to each other and a plurality of second connecting wirings 32 connecting the plurality of second wirings 31 . Specifically, the plurality of second wirings 31 and the plurality of second connecting wirings 32 are integrated as a whole to form a lattice shape or a mesh shape. Each second wiring 31 extends in a direction (Y direction) parallel to the longitudinal direction of the array-type mesh wiring layer 30, and each second connecting wiring 32 extends in a direction parallel to the width direction of the array-type mesh wiring layer 30. (X direction).

The length of the second wiring 31 (that is, the length of the array-type mesh wiring layer 30) L _b (see FIG. 14) is the side length L _a of the parasitic mesh wiring layer 20 (the frequency of the communication antenna module 63). (corresponding to half the wavelength of λ/2)), or have a length that is slightly different. Specifically, the length L _b of the second wiring 31 has a length of 80% or more and 120% or less of the length L _a of the side of the parasitic mesh wiring layer 20 (0.8L _a ≦L _b < 1.2 L _a ). By providing the array type mesh wiring layer 30, the bandwidth of the communication antenna module 63 can be further widened and the radiation pattern of the communication antenna module 63 can be widened. In particular, by making the length _Lb of the second wiring 31 slightly different from the length L _a of the side of the parasitic mesh wiring layer 20, the peak of the resonance frequency of the communication antenna module 63 can be adjusted. The bandwidth of module 63 can be increased. On the other hand, the second connecting wirings 32 play a role of suppressing disconnection of the second wirings 31 by connecting the second wirings 31 to each other.

The plurality of second wirings 31 are arranged at regular intervals in the width direction (X direction) of the array-type mesh wiring layer 30 . The pitch _P3 of the second wirings 31 can be the same as the pitch _P1 of the first wirings 21 described above. The plurality of second connecting wires 32 are arranged at regular intervals in the longitudinal direction (Y direction) of the array-type mesh wiring layer 30 . The pitch _P4 of the plurality of second connection wires 32 may be the same as the pitch _P2 of the first connection wires 22 described above.

In the array-type mesh wiring layer 30, a plurality of openings 33 are formed by being surrounded by the second wirings 31 adjacent to each other and the second connecting wirings 32 adjacent to each other. Each opening 33 has a substantially square shape in plan view. Further, the transparent substrate 11 is exposed from each opening 33 . Therefore, by increasing the area of each opening 33, the transparency of the wiring board 10 as a whole can be improved. Although each second wiring 31 and each second connecting wiring 32 are orthogonal to each other, they may cross each other at an acute angle or an obtuse angle. In addition, the pitch _P3 of the second wiring 31 and the pitch _P4 of the second connecting wiring 32 are uniform within the array-type mesh wiring layer 30. Also good.

The shape of the cross section (X-direction cross section) perpendicular to the longitudinal direction of each second wiring 31 can be the same as the cross-sectional shape of the first wiring 21 described above. Also, the shape of the cross section (Y-direction cross section) perpendicular to the longitudinal direction of each second connecting wire 32 can be the same as the cross-sectional shape of the first connecting wire 22 described above. Further, the line width (length in the X direction) of the second wiring 31 and the line width (length in the Y direction) of the second connecting wiring 32 are the line width _W1 of the first wiring 21 and the first connecting wiring 32, respectively. It can be made the same as the line width _W2 of the wiring 22 . Furthermore, the height (length in the Z direction) of the second wiring 31 and the height (length in the Z direction) of the second connecting wiring 32 are equal to the height _H1 of the first wiring 21 and the first connecting wiring. 22 height _H2 .

The material of the second wiring 31 and the second connecting wiring 32 can also be the same as the material of the first wiring 21 and the first connecting wiring 22 described above.

According to this modification, the array type mesh wiring layer 30 is arranged on the substrate 11 and around the parasitic type mesh wiring layer 20 . Thereby, the bandwidth of the communication antenna module 63 can be further widened, and the directivity of the communication antenna module 63 can be widened. In this case, the bandwidth of the communication antenna module 63 can be further widened by adjusting the length (Y-direction distance) of the array-type mesh wiring layer 30 .

It is also possible to appropriately combine a plurality of constituent elements disclosed in the above embodiments and modifications as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modifications.

REFERENCE SIGNS LIST 10 Wiring substrate 11 Substrate 17 Protective layer 20 Non-feeding mesh wiring layer 60 Image display device 61 Self-luminous display device 63 Communication antenna module 64 Light emitting surface 66 Metal layer 69 Thin film transistor (TFT)
71 Organic EL layer 76 Heat dissipation layer 77 Opening 78 Notch 85 First electrode (reflective electrode, anode electrode)
86 organic light-emitting layer (emitter)
87 second electrode (transparent electrode, cathode electrode)

Claims (10)

a self-luminous display device having a light-emitting surface;
a wiring substrate located on the light emitting surface side of the self-luminous display device and having a transparent substrate and a parasitic mesh wiring layer disposed on the substrate;
a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device;
The self-luminous display device has a luminous body and a metal layer located on the opposite side of the luminous surface from the luminous body,
An image display device, wherein an opening or a notch is provided in an antenna area corresponding to the communication antenna module in the metal layer. 2. The image display device according to claim 1, wherein said communication antenna module is housed inside said opening or said notch. 2. The image display device according to claim 1, wherein an insulator is embedded in said opening or said notch, and said communication antenna module is arranged on said insulator. a self-luminous display device having a light-emitting surface;
a wiring substrate located on the light emitting surface side of the self-luminous display device and having a transparent substrate and a parasitic mesh wiring layer disposed on the substrate;
a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device;
The self-luminous display device has a light emitter,
In the self-luminous display device, the pixel density of the light emitters located in an antenna area corresponding to the communication antenna module is lower than the pixel density of the light emitters located in an area other than the antenna area. , an image display device. 5. The image display device according to claim 4, wherein the pixel density (ppi) of the light emitters in the antenna area is 20% or more and 50% or less of the pixel density (ppi) of the light emitters in an area other than the antenna area. . a self-luminous display device having a light-emitting surface;
a wiring substrate located on the light emitting surface side of the self-luminous display device and having a transparent substrate and a parasitic mesh wiring layer disposed on the substrate;
a communication antenna module located on the opposite side of the light-emitting surface of the self-luminous display device;
The self-luminous display device has a plurality of light emitters and a transparent electrode positioned closer to the light emitting surface than the light emitters,
An image display device, wherein at least the transparent electrode located in an antenna region corresponding to the communication antenna module is patterned in the self-luminous display device. The transparent electrode has a pixel corresponding portion corresponding to each light emitter and a connecting portion connecting the pixel corresponding portions, and an electrode opening is formed around the pixel corresponding portion and the connecting portion. 7. The image display device according to claim 6, wherein 8. The image display device according to claim 7, wherein a ratio of said electrode openings per unit area is 50% or more and 80% or less at least in said antenna region. 9. The image display device according to claim 1, wherein an array type mesh wiring layer is arranged on said substrate of said wiring board and around said parasitic type mesh wiring layer. 10. The parasitic mesh wiring layer of the wiring board according to any one of claims 1 to 9, wherein the non-feeding mesh wiring layer includes a plurality of first wirings, and the first wirings have a line width of 0.1 μm or more and 5.0 μm or less. The image display device according to .

Images