JP7288834B2 - Film forming apparatus, film forming method, and electronic device manufacturing method - Google Patents

Description

The present invention relates to a film forming apparatus, a film forming method, and an electronic device manufacturing method.

2. Description of the Related Art In recent years, as a type of display, an organic EL device having an organic EL element using electroluminescence of an organic material has been attracting attention. When manufacturing such an organic EL device, there is a step of depositing a film forming material such as a metal electrode material or an organic material on a substrate in a film forming apparatus having a film forming chamber.

In the film forming chamber of the film forming apparatus, the vapor deposition material contained in the container is heated and the target is sputtered to cause the film forming material to fly and adhere to the substrate, thereby forming a film on the substrate. Form. At that time, for the purpose of forming a uniform film, etc., the film formation may be performed while rotating the substrate in the film formation chamber. In addition, when the inside of the film formation chamber becomes hot, a space is provided inside the member that supports the substrate in the film formation chamber to receive the cooling liquid, and the cooling liquid is circulated between the space and the outside of the film formation chamber. Thus, the substrate may be cooled to prevent quality deterioration of the deposition material.

Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2006-336034) discloses an apparatus for forming a film while rotating a substrate in a vacuum film forming chamber. In this apparatus, a rotating body is arranged so as to pass through the interior and exterior of the film forming chamber. A substrate holder having a fluid path formed therein is provided at the end of the rotating body on the inside of the film formation chamber, so that the substrate can be rotated as the rotating body rotates. The rotating body is arranged outside the film forming chamber and supported by an outer frame member (housing) fixed to the film forming chamber. The outer frame member is provided with a cooling liquid supply port and a cooling liquid discharge port, and is connected to a constant temperature bath arranged outside the film forming chamber. Annular fluid passages are provided between the outer frame member and the rotor at positions corresponding to the supply port and the discharge port, respectively.

In Patent Document 1, such a rotary joint configuration enables the circulation of the cooling liquid between the constant temperature bath outside the film formation chamber and the fluid passage inside the substrate holder even while the rotor rotates. That is, the coolant supplied from the constant temperature bath to the supply port of the outer frame member passes through the annular fluid path, flows into the supply path inside the rotating body, and reaches the fluid path in the substrate holder. Subsequently, the cooling liquid flows from the fluid path in the substrate holder into the discharge path inside the rotating body, passes through the annular fluid path, is discharged from the discharge port of the outer frame member, and then reaches the constant temperature bath again. In this way, the temperature-controlled cooling liquid is always circulating in the fluid path in the substrate holder, so that the substrate temperature suitable for film formation can be maintained.

JP 2006-336034 A

However, in such a film forming apparatus, it is basically necessary to constantly circulate the cooling liquid during film formation. As a result, there is a problem that the cooling liquid leaks from the connection portion of each member in the rotary joint (especially from between the rotating body and the housing where the rotational force acts). Even if a sealing member such as a magnetic seal or an O-ring is arranged between the rotating body and the housing, such leakage of the coolant will occur to some extent. When a relatively expensive material such as a fluorine-based inert liquid is used as the coolant, loss due to leakage has a large impact on cost.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide a technique for effectively using a liquid used in a rotary joint of a film forming apparatus.

The present invention employs the following configurations. i.e.
A film forming apparatus for forming a film on a film to be formed in a film forming chamber,
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating part includes a supply channel for supplying the liquid supplied from the supply port to the film formation object support part, and a discharge channel for discharging the liquid discharged from the film formation object support part to the discharge port. having a road and
In a film forming apparatus in which a liquid channel through which a liquid flows in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a drain port provided in the fixed part;
a removal mechanism for removing impurities from the drain liquid discharged from the drain port;
a path for supplying the drain liquid delivered from the removal mechanism to the supply port;
It is a film forming apparatus characterized by having

The present invention also employs the following configurations. i.e.
A film forming method for forming a film on a film to be formed in a film forming chamber of a film forming apparatus,
The film deposition apparatus includes a film formation target supporter that supports a film formation target, a rotating part that is connected to the deposition target supporter and rotates, and the deposition device that is provided around the rotation part. Equipped with a rotary joint having a fixed part fixed to the membrane chamber,
The fixed portion has a supply port through which liquid is supplied and a discharge port through which liquid is discharged, and the rotating portion is a supply flow that supplies the liquid supplied from the supply port to the film-forming object supporting portion. and a discharge channel for discharging the liquid discharged from the film-forming object supporting portion to the discharge port, wherein the supply port, the supply channel, the film-forming object supporting portion, and the discharge flow A liquid channel is formed in which the liquid flows in the order of the channel and the outlet,
The film forming apparatus further includes a circulation path for supplying the liquid discharged from the discharge port to the supply port, and a drain port provided in the fixed part,
The film forming method is characterized by including the step of supplying the drain liquid sent from a removal mechanism for removing impurities from the drain liquid discharged from the drain port to the supply port.

The present invention also employs the following configurations. i.e.
A method for manufacturing an electronic device, in which a film of a film-forming material is formed on a film-forming object in a film-forming chamber of a film-forming apparatus,
The film deposition apparatus includes a film formation target supporter that supports a film formation target, a rotating part that is connected to the deposition target supporter and rotates, and the deposition device that is provided around the rotation part. Equipped with a rotary joint having a fixed part fixed to the membrane chamber,
The fixed portion has a supply port through which liquid is supplied and a discharge port through which liquid is discharged, and the rotating portion is a supply flow that supplies the liquid supplied from the supply port to the film-forming object supporting portion. and a discharge channel for discharging the liquid discharged from the film-forming object supporting portion to the discharge port, wherein the supply port, the supply channel, the film-forming object supporting portion, and the discharge flow A liquid channel is formed in which the liquid flows in the order of the channel and the outlet,
The film forming apparatus further includes a circulation path for supplying the liquid discharged from the discharge port to the supply port, and a drain port provided in the fixed part,
A method of manufacturing an electronic device, comprising the step of supplying the drain liquid sent from a removal mechanism for removing impurities from the drain liquid discharged from the drain port to the supply port.

According to the present invention, it is possible to provide a technique for effectively using the liquid used in the rotary joint of the film forming apparatus.

1 is a block diagram showing a schematic configuration of a film forming apparatus according to Embodiment 1; FIG. Schematic cross-sectional view showing the configuration of a rotary joint used in a film forming apparatus FIG. 2 is a block diagram showing a schematic configuration of a film forming apparatus according to Embodiment 2; 3 is a block diagram showing a schematic configuration of a film forming apparatus according to Embodiment 3; FIG. Block diagram showing a schematic configuration of a film forming apparatus according to the background technology A diagram showing a manufacturing system for an organic electronic device, including a film forming apparatus. A diagram for explaining a method for manufacturing an organic electronic device

Preferred embodiments and examples of the present invention will be described below with reference to the drawings. However, the following embodiments and examples merely exemplify preferred configurations of the present invention, and do not limit the scope of the present invention to those configurations. In addition, unless otherwise specified, the scope of the present invention is limited only to the hardware configuration and software configuration of the apparatus, process flow, manufacturing conditions, dimensions, materials, shapes, etc., in the following description. It's not intended.

INDUSTRIAL APPLICABILITY The present invention is preferably applied to a film-forming apparatus and a film-forming method, a vapor-depositing apparatus and a vapor-depositing method, an electronic device manufacturing method, etc. for forming a film of a vapor-depositing material on a film-forming object by vapor deposition or sputtering. be done. The present invention can also be regarded as a film forming method, a vapor deposition method, a film forming apparatus or a vapor deposition apparatus control method, a program for causing a computer to execute these methods, and a storage medium storing the program. The storage medium may be a non-transitory computer-readable storage medium.

The present invention can be preferably applied to an apparatus for forming a thin film (material layer) with a desired pattern on the surface of a substrate, which is an object to be deposited, or a film of another material formed on the substrate surface. Any material such as glass, resin, or metal can be selected as the material of the substrate. Note that the object to be deposited is not limited to a flat substrate. For example, a film may be formed on a machine part having irregularities or openings. Also, any material such as an organic material or an inorganic material (metal, metal oxide, etc.) can be selected as a film forming material. It is possible to form not only an organic film but also a metal film. The technology of the present invention is applicable to, for example, manufacturing apparatuses for organic electronic devices (eg, organic EL devices using organic EL elements, thin-film solar cells), optical members, and the like.

In the following embodiments, as an example of a film forming apparatus, a vapor deposition apparatus using an organic material stored in a container of an evaporation source as a film forming material will be described.

[Conventional treatment of leaked liquid]
First, with reference to the block diagram of FIG. 5, the configuration of the film forming apparatus that serves as the background of the present invention and the conventional leaked liquid treatment method will be described.
A film forming apparatus 100 generally includes a film forming chamber 1 , a rotary joint 11 connected thereto, a pump 50 for circulating a cooling liquid 80 , a drain liquid container 70 , and a controller 110 .
Although the details will be described later, the pump 50 sends the coolant 80 to the circulation path 51 (51a),
It is supplied to the supply port 31 of the rotary joint 11 . The supplied cooling liquid 80 reaches the inside of the substrate holder arranged inside the film formation chamber via the supply channel inside the rotating body, and cools the substrate while passing through the channel inside the substrate holder. The coolant 80 is then discharged from the discharge port 33 of the rotary joint 11 via the discharge channel inside the rotating body. Then, it returns to the pump 50 via the circulation path 51 (51b).

On the other hand, the cooling liquid 80 leaking from the connection portion of each member of the rotary joint 11, especially the connection portion between the rotating body and the housing, is discharged from the drain port 37 provided in the housing, and flows into the drain path 71 as the drain liquid 81. leak. The drain liquid 81 is stored in the drain liquid container 70 and collected at an appropriate timing. As described above, conventionally, in a film forming apparatus using a rotary joint, the cooling liquid circulation path and the drain liquid discharge path are separate, and the drain liquid stored in the tank is collected separately.

[Embodiment 1]
<Configuration of deposition apparatus>
The configuration of the film forming apparatus according to this embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a block diagram showing a schematic configuration of a film forming apparatus. FIG. 2 is a schematic cross-sectional view showing the structure of a rotary joint used in the film forming apparatus and the internal structure of the film forming chamber.

A film forming apparatus 100 generally includes a film forming chamber 1 , a rotary joint 11 connected thereto, a pump 50 for circulating a cooling liquid 80 , a drain liquid container 70 , and a controller 110 . The drain liquid container 70 is a tank that collects and stores the drain liquid 81 .

The inside of the film forming chamber 1 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. A substrate holder 3 (substrate supporting portion) and an evaporation source 2 are arranged inside the film forming chamber 1 . The substrate holder 3 supports, together with the mask 6 , the substrate 5 (object to be film-formed) carried into the film-forming chamber by the transfer robot. The substrate holder 3 horizontally holds the loaded substrate 5 and mask 6 . The substrate holder 3 preferably has a clamping mechanism for clamping the substrate 5 and the mask 6 and supports such as receiving claws for mounting. Furthermore, the film forming apparatus 100 may be provided with an alignment mechanism for aligning the substrate 5 and the mask 6 and supporting them on the substrate holder 3 . As the alignment mechanism, it is preferable to use a clamp mechanism or a support mechanism provided inside the film formation chamber, and a drive mechanism such as an XYθ actuator provided outside the film formation chamber.

As described above, the substrate 5 can be made of any material such as glass, resin, and metal. The mask 6 is a mask having an opening pattern corresponding to a predetermined thin film pattern to be formed on the substrate (or on the film previously formed on the substrate 5). However, depending on the type of film to be formed, the mask 6 is not necessarily required. In addition, a deposition monitor may be provided inside the film formation chamber for checking the state of film formation.

In this embodiment, an evaporation source 2 is used as a film forming source. The evaporation source 2 includes a container such as a crucible for containing an evaporation material and a heating device such as a heater. The vapor deposition material heated by the heater flies, reaches the substrate 5 through the mask 6 and deposits thereon, thereby forming a layer according to a predetermined pattern. The evaporation source 2 can be selected according to the contents of film formation. For example, the presence or absence of a nozzle, the type of evaporation source such as point-like or linear, and the presence or absence of a movement mechanism for moving the evaporation source within a plane parallel to the substrate 5 may be used.

When the film is formed by the sputtering method, a magnet unit may be used as the film forming source, which includes a target and a magnet and causes the film forming material to fly from the target in response to voltage application.
In the illustrated example, the substrate 5 is arranged in the upper part of the film forming chamber 1 so that the surface on which the film is to be formed is perpendicular to the direction of gravity. Then, the vapor deposition material flies upward from the evaporation source 2, which is a so-called deposit-up configuration. However, a deposition-down configuration in which the substrate 5 is placed downward, or a configuration in which the film formation surface of the substrate 5 is parallel to the direction of gravity may be employed.

The cooling liquid 80 is liquid for cooling the substrate 5 . Although referred to as a cooling liquid here, the configuration of the present invention is not limited to cooling, and can be applied to temperature control of liquids in general, such as temperature maintenance and heating. Although it depends on the type of vapor deposition material, since the inside of the film forming chamber becomes extremely hot, a chemically inert material with low reactivity is preferable as the cooling liquid 80 . For example, an organic fluorine compound having a carbon-fluorine bond, also called fluorocarbon, can be preferably used. Examples of organic fluorine compounds include Fluorinert (trademark) from 3M and Galden (trademark) from Solvay. However, it is not limited to these liquids.

The control unit 110 controls the film forming apparatus 100, for example, controls the loading/unloading and alignment of the substrate 5 and the mask 6, controls the timing of starting and ending the film formation, and controls the temperature. The control unit 110 of the present embodiment may control the flow rate, flow velocity, route, etc. of the cooling liquid by controlling the pumps and valves in the flow path. Note that the control unit 110 may be configured by combining a plurality of control means. The plurality of control means includes a heating control means for the evaporation source, an alignment control means, a loading/unloading control means, and the like. The control unit 110 is connected to other blocks by control lines (not shown) to enable information communication.

The control unit 110 is configured by, for example, a computer having a processor, memory, input/output means (I/O), UI, and the like. In this case, the functions of the control unit 110 are implemented by the processor executing the program stored in the memory. As a computer, a general-purpose computer may be used, or a built-in computer or PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit 110 may be configured with a circuit such as ASIC or FPGA.
When the film deposition apparatus 100 of the present embodiment is one of a plurality of film deposition apparatuses included in a film deposition system, a control unit may be provided for each film deposition apparatus, or a single control unit may It may control the entire system.

<Configuration of Rotary Joint>
As shown in FIG. 2, the rotary joint 11 generally includes a housing 30, a rotating body 20 (rotating portion) whose outer periphery is supported by the housing 30, and a substrate holder 3 that supports the substrate 5 inside the deposition chamber. The rotating body 20 is inserted through a through hole provided in the upper wall of the film forming chamber 1, and its lower end is connected to the substrate holder 3 inside the film forming chamber. The rotating body 20 is rotatable about its axis with respect to the housing 30 . As the rotor 20 rotates during film formation, the substrate holder 3 also rotates, enabling uniform film formation on the substrate 5 .

On the other hand, since the housing 30 (fixed part) has a fixed positional relationship with respect to the film forming chamber 1, by providing the bearing 40 between the rotating body 20 and the surrounding housing 30, the rotating body 20 can be Makes it rotate smoothly. A lubricant (grease) is usually used in the bearing 40 to improve lubricity and prevent friction. Although the details will be described later, it is preferable that the material of the grease has low reactivity with the cooling liquid 80 . This is because the cooling liquid 80 leaked from the sliding portion is mixed with the thickener and the separated base oil of the grease to form a drain liquid 81, and the component derived from the grease can be easily removed from the drain liquid 81. This is to make it removable. That is, as the base oil of the grease, an insoluble one that does not cause a contact reaction with the cooling liquid 80 and does not mix with it is used. For example, when the cooling liquid 80 is an organic fluorine compound, when selecting grease, it is preferable to use a mineral oil-based grease instead of a fluorine-based base oil. Further, when the coolant and the base oil are separated based on the difference in specific gravity, the specific gravities of the two are made different.

The housing 30 is provided with a supply port 31 for the coolant 80 and an annular supply channel 32 . The supply port 31 is a port for introducing the coolant 80 from the outside. The annular supply channel 32 is an annular channel provided on the inner peripheral surface of the housing 30 so as to face the rotating body 20 . The annular supply channel 32 is connected to the supply channel 22 inside the rotating body. Note that the annular supply channel 32 may be provided on the rotating body 20 side. With such a configuration, the cooling liquid 80 introduced from the supply port 31 can reach the flow path 4 in the substrate holder through the annular supply flow path 32 and the supply flow path 22 even while the rotating body 20 is rotating. can.

The housing 30 is also provided with an outlet 33 for the coolant 80 and an annular outlet channel 34 . The discharge port 33 is a port for discharging the coolant 80 to the outside. The annular discharge channel 34 is an annular channel provided on the inner peripheral surface of the housing 30 so as to face the rotating body 20 . The annular discharge channel 34 is connected to the discharge channel 23 inside the rotating body. Note that the annular discharge channel 34 may be provided on the rotating body 20 side. With this configuration, the cooling liquid 80 flowing from the flow path 4 in the substrate holder can reach the discharge port 33 through the discharge flow path 23 and the annular discharge flow path 34 even while the rotating body 20 is rotating. can. The annular supply channel 32, the supply channel 22, the channel 4 in the substrate holder, the discharge channel 23, and the annular discharge channel 34 are collectively considered to be liquid channels that lead the liquid from the supply port to the discharge port. I can say

Since the annular supply channel 32 and the annular discharge channel 34 are positioned on the sliding surfaces of the housing 30 and the rotating body 20, which are separate members, the coolant 80 may leak onto the sliding surfaces. be. A sealing member 39 such as a magnetic seal or an O-ring is provided on the contact surface between the housing 30 and the rotating body 20, but it is difficult to completely prevent the coolant 80 from leaking.
Therefore, drain ports 35 and 37 and annular drain channels 36 and 38 are provided at appropriate positions in the height direction of the rotary joint 11 . Although two drain ports are provided here, the number is not limited to this. As a result, the drain liquid 81 leaked from the sliding surfaces is discharged to the outside through the drain ports 35 and 37 .

Note that FIG. 1 shows only one drain port 37 for simplification. However, it may be considered that there is another route for transporting the drain liquid 81 from the drain port 35 to the drain liquid container 70 . Alternatively, it may be considered that the drain liquid 81 from the drain port 35 joins the drain path from the drain port 37 .

<Path of cooling liquid and drain liquid in this embodiment>
Referring to FIG. 1, movement of the cooling liquid and drain liquid, which is characteristic of this embodiment, will be described. When the operation of the film forming apparatus 100 is started, the control unit 110 carries the substrate 5 and the mask 6 into the film forming chamber 1 , aligns them, and causes the heater to heat the evaporation source 2 . Then, the pump 50 is driven to circulate the coolant 80 .

Coolant 80 ( 80 a ) delivered from pump 50 to circulation path 51 ( 51 a ) is introduced into supply port 31 . As described above, the coolant 80 is used to cool the substrate 5 inside the rotary joint 11 . Then, the coolant 80 (80b) is delivered from the outlet 33 to the circulation path 51 (51b). A temperature control mechanism or a constant temperature bath for maintaining the temperature of the coolant 80 may be provided on the circulation path. In this manner, the coolant 80 normally moves while circulating on the circulation path.

On the other hand, the cooling liquid 80 leaking from the sliding surfaces of the housing 30 and the rotating body 20 is discharged from the drain port 37 and flows into the drain path 71 (71a) to become the drain liquid 81 . The drain liquid 81 contains the components of the cooling liquid 80 and the impurity components. An example of an impurity component is base oil separated from grease used for the bearing 40 or the like. The drain liquid 81 is contained in the drain liquid container 70 .
In order to accommodate the drain liquid 81 smoothly, the inlet to the drain liquid container 70 may be provided at a position lower than the drain port 37 in the vertical direction to allow the inflow by gravity. Alternatively, a transportation mechanism such as a pump may be provided in the drain path 71 (71a). Although not shown in FIG. 1 , the drain liquid discharged from the drain port 35 also flows into the drain liquid container 70 .

<Removal of impurities from drain liquid and reuse of cooling liquid>
In this embodiment, the drain liquid container 70 also functions as a removal mechanism for removing impurities from the drain liquid 81 . The impurities 82 are, for example, base oil of grease used for the bearing 40 of the rotary joint 11 . The drain liquid container 70 of the present embodiment utilizes the difference in specific gravity between the cooling liquid 80 and the impurities 82 contained in the drain liquid 81 to vertically separate the two.
Any method can be used as long as the impurity 82 can be removed from the drain liquid 81 . Impurities 82 may be removed in a short period of time, for example by centrifugation. Alternatively, filtration separation using a filter or the like may be performed. Alternatively, a component that reacts with the impurity 82 but does not react with the cooling liquid 80 may be mixed in the drain liquid 81, and the reaction product may be removed using a specific gravity difference or a filter.

Then, the drain liquid container 70 delivers the cooling liquid 80 (80c) separated below the container from the recycling outlet 72 to the drain path 71 (71b). Also at this time, it is preferable to determine the positional relationship between the recycling delivery port 72 and the drain path 71 (71b) so that the liquid is delivered by gravity. Alternatively, a pump for liquid delivery may be provided. Further, a shutter or a flow control valve may be provided for controlling the liquid delivery state from the reuse delivery port 72 . It is also preferable for the controller 110 to control the opening/closing of the shutter and the degree of opening of the flow control valve based on the internal state of the drain liquid container 70 and the state of the liquid flow in the circulation path 51 .

The sent cooling liquid 80 (80c) joins the circulation path 51 (51a) via the three-way valve 75 from the drain path 71 (71b). The control unit 110 controls the opening and closing and opening degree of the three-way valve 75 to change the ratio between the circulating cooling liquid (80a, 80b) and the reused cooling liquid 80c, and to control the amount of liquid flowing into the rotary joint 11. Adjusting is also preferable.

As described above, according to the film forming apparatus 100 having the configuration shown in FIG. 1, the drain liquid 81 leaked from the rotary joint 11 is recovered, impurities are removed from the drain liquid 81, and the cooling liquid 80 (80c) is generated. can. Therefore, since the leaked cooling liquid 80 can be effectively reused, the operating cost of the film forming apparatus 100 can be reduced.

[Embodiment 2]
Embodiment 2 will be described with reference to FIG. This embodiment differs from the first embodiment in the configuration regarding the confluence of the circulating cooling liquid 80 and the drain liquid 81 . Additionally, the arrangement of each block of the film forming apparatus 100 and variations of the configuration for maintaining the temperature of the cooling liquid 80 will also be described. In addition, the same code|symbol is attached|subjected to the component similar to Embodiment 1, and description is simplified.

In the configuration of FIG. 3, the film forming chamber 1 and the chiller 90 are installed on separate floors. The film forming apparatus 100 has the same configuration and functions as those of the first embodiment. The film forming apparatus 100 is installed on the apparatus floor and fixed to the apparatus floor floor section 121 . Note that the drain port 35 is also omitted in this embodiment for the sake of simplification. The drain path from the drain port 35 may join the drain path from the drain port 37 or may be connected to the drain liquid container 70 .

The chiller 90 is a mechanism for circulating the coolant 80 while controlling its temperature, and includes a pump 50 and a drain liquid container 70 . The drain liquid container 70 of this embodiment has a temperature control mechanism including a temperature sensor and a heat exchange mechanism. The temperature control mechanism controls the heat exchange mechanism based on the detected value of the temperature sensor, so that the temperature of the coolant 80 is kept constant. In this embodiment, the chiller 90 is installed on the equipment floor below the equipment floor and is fixed to the equipment floor floor section 122 . With this configuration, the cooling liquid 80 (80b) and the drain liquid 81 can smoothly move to the chiller 90 below.
A constant temperature bath may be provided separately from the drain liquid container 70 . Further, in this embodiment, the cooling liquid 80 is used for the purpose of suppressing an excessive rise in the temperature of the substrate 5, so it is called a "chiller", but the purpose of the temperature control mechanism is not limited to cooling. .

<Path of cooling liquid and drain liquid in this embodiment>
The movement of each liquid in this embodiment will be described, focusing on differences from the first embodiment.
When the film forming apparatus 100 starts operating, the controller 110 drives the pump 50 of the chiller 90 to start circulation of the coolant 80 . The coolant 80 (80a) is introduced into the supply port 31 via the circulation path 51 (51a). Subsequently, after cooling the substrate 5, the cooling liquid 80 flows out from the outlet 33 to the circulation path 51 (51b). Then, it is stored in the drain liquid container 70 .

On the other hand, the drain liquid 81 mixed with the leaked cooling liquid 80 and impurities 82 is stored in the drain liquid container 70 via the drain path 71 (71a).
In FIG. 3, the drain liquid 81 is caused to flow in from above the liquid surface in the container, thereby facilitating the separation of the impurities 82 as the supernatant. On the other hand, the introduction port for the coolant 80 (80b) is provided below the container. This avoids mixing with impurities 82 of the supernatant.

<Removal of impurities>
In this embodiment, the circulating cooling liquid 80 (80b) and the drain liquid 81 merge in the container inside the chiller 90 . The cooling liquid 80 and the impurities 82 are separated based on the specific gravity in the container, flow into the circulation path 51 (51c), and become the reused cooling liquid 80 (80c). After that, it returns to the circulation route 51 .

According to the film forming apparatus 100 according to the present embodiment, the cooling liquid 80 in the drain liquid leaked from the rotary joint 11 can be reused, and the cost can be reduced, which is the same merit as in the first embodiment. Furthermore, impurities can be removed using the configuration of the chiller 90 provided in the film forming apparatus 100 .

[Embodiment 3]
Embodiment 3 will be described with reference to FIG. The same reference numerals are given to the same components as in the above embodiment, and the description is simplified. This embodiment is characterized by the step of removing impurities from the drain liquid 81 .

In the configuration of FIG. 4, the film forming chamber 1 and the drain liquid container 70 are installed on the same equipment floor, and the cooling liquid 80c for reuse from the drain liquid container 70 and the circulating cooling liquid 80b join in the middle. It is introduced into a chiller 90 located on the equipment floor below. However, the arrangement of each block is not limited to this. The chiller 90 is a device having a temperature control mechanism and an infusion mechanism as in the second embodiment.

In FIG. 4, only the drain liquid 81 is supplied to the drain liquid container 70 . The drain liquid container 70 has a level sensor 95 and a second pump 97 . The level sensor 95 detects liquid level information indicating the height of the liquid level of the drain liquid 81 in the container and transmits the information to the control section 110 . The level sensor 95 may be of any type as long as it can acquire liquid level information, and may be of a capacitance type, an optical sensor type, a float type, or the like.
As the level sensor 95, it is more preferable to use one capable of acquiring height information of the interface between the separated cooling liquid 80 and the impurities.

The second pump 97 pumps out the cooling liquid 80 (80c) separated from the impurities 82 from the bottom of the container and delivers it to the drain path 71 (71c). In this embodiment, it is assumed that the cooling liquid 80 has a higher specific gravity than the impurities 82, so the pumping-out position is set below the container. However, as long as the cooling liquid 80 (80c) can be pumped out while maintaining the separated state, the pumping position and pump system are not limited. The drain path 71 (71c) merges with the circulation path 51 (51b). Further, in this embodiment, at the confluence position, the inflow of liquid from the drain liquid container 70 side to the chiller 90 side and the inflow of liquid from the rotary joint 11 side to the chiller 90 side are allowed, and the flow in the opposite direction is restricted. , a check valve 77 is provided.

<Path of cooling liquid and drain liquid in this embodiment>
The movement of each liquid in this embodiment will be described, focusing on differences from the above-described embodiments.
The control unit 110 drives the pump inside the chiller 90 to circulate the coolant 80 . The coolant 80 (80a) is introduced into the supply port 31 via the circulation path 51 (51a). Subsequently, after cooling the substrate 5 , the cooling liquid 80 flows out from the outlet 33 to the circulation path 51 ( 51 b ) and reaches the chiller 90 .

On the other hand, the drain liquid 81 mixed with the leaked cooling liquid 80 and impurities 82 is stored in the drain liquid container 70 via the drain path 71 (71a).

<Removal of impurities>
In the drain liquid container 70, the cooling liquid 80 and impurities 82 are separated by using the difference in specific gravity, and the cooling liquid 80 stays in the lower part of the container. The second pump 97 pumps up the coolant 80 and delivers it to the drain path 71 (71c). The coolant 80 (80c) sent for reuse joins the coolant 80 (80b) in the circulation path via the check valve 77. As shown in FIG.

Here, the control unit 110 controls liquid delivery by the second pump 97 based on the liquid level information detected by the level sensor 95 . Specifically, if the cooling liquid 80 continues to be sent, the layer of impurities 82 approaches the vicinity of the suction port of the second pump 97 and may be pumped up. If so, stop pumping or reduce the flow rate.

Here, the height of the interface between the separated coolant 80 and the impurity 82 is LB. The liquid level of the impurity 82, that is, the liquid level of the entire drain liquid 81 is denoted by LA.
Also, let h0 be the height of the bottom surface of the container. Also, the height of the suction port of the second pump 97 is h1. Also, let h2 be a threshold height that is higher than the suction port height h1 by a predetermined distance. The threshold height h2 is set to a distance such that the impurities 82 do not flow into the suction port of the second pump 97 even if convection or waves occur due to the inflow of the drain liquid 81 or the like and the boundary surface LB fluctuates. .

In order to control the liquid level by the control unit 110 with higher accuracy, it is preferable to use a level sensor 95 capable of detecting the height of the boundary surface LB between the separated cooling liquid 80 and the impurities 82 . In that case, the controller drives the second pump 97 when the height of the boundary surface LB is higher than the threshold height, and stops driving the second pump 97 when the height of the boundary surface LB is equal to or lower than the threshold height. As a result, it is possible to prevent the impurities 82 from being mixed into the coolant 80 (80c) for reuse.

On the other hand, the level sensor 95 may be able to measure only the liquid level LA of the entire drain liquid. In this case, the controller 110 estimates the boundary surface height LB from the liquid level LA, compares it with the threshold height h2, and controls the pump drive. As an estimation method, for example, the amount of the drain liquid 81 that leaks in a normal use state per hour, the ratio of the grease-derived base oil in the drain liquid 81, and the start of the process of the film forming apparatus 100 are used in advance. One method is to determine the thickness of the layer of impurity 82 based on the time since.
The above description is just an example, and any method may be used as long as the pump drive can be controlled based on the detection value of the level sensor 95 .

According to the film forming apparatus 100 according to the present embodiment, the cooling liquid 80 in the drain liquid leaked from the rotary joint 11 can be reused, and the cost can be reduced, which is the same merit as in the first and second embodiments. Furthermore, with a relatively simple configuration in which the level sensor 95 and the second pump 97 are added to the conventional drain liquid recovery tank, the cooling liquid 80 can be reused without the impurities 82 entering the circulation path 51 .

[Embodiment 4]
In this embodiment, a method of applying the film forming apparatus of each of the above embodiments to an electronic device manufacturing apparatus for manufacturing an organic EL display or the like will be described. FIG. 6 is a plan view schematically showing a part of the electronic device manufacturing apparatus 500. As shown in FIG. The electronic device manufacturing apparatus 500 automatically performs processes from substrate pretreatment to film formation and sealing in electronic device manufacturing. Instead of the illustrated cluster configuration in which a plurality of processing chambers are arranged around a transfer chamber, an in-line configuration in which a plurality of processing chambers are arranged in order of steps may be adopted.

A pretreatment chamber 511 , an organic treatment chamber 512 , a metal treatment chamber 513 and a measurement chamber 514 are radially arranged around the transfer chamber 510 . Note that FIG. 6 is a simplified diagram, and the types and number of processing chambers are not limited to this. For example, processing chambers such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer may be provided. of processing chambers may be provided. A transfer robot 519 that holds and transfers the substrate 5 is provided in the transfer chamber 510 . The transport robot 519 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries the substrate into and out of each processing chamber and measurement chamber.

The outline of the manufacturing process of the electronic device is as follows. First, the substrate 5 is carried into the pretreatment chamber 511 and subjected to pretreatment such as cleaning. After that, the substrate is transported to an organic processing chamber 512 or a metal processing chamber 513 by a transport robot 519 according to the type of film forming material. In each processing chamber, a deposition material adheres to a substrate by deposition or sputtering from an evaporation source to form a film. The substrate 5 is then loaded into the measurement chamber 514 . In the measurement chamber, the film thickness and the uniformity of film formation are measured.

Each processing chamber for film formation is provided with a film formation device. A series of processes such as transfer of the substrate to and from the transfer robot, adjustment of the relative positions of the substrate and mask (alignment), fixing of the substrate on the mask, and deposition (deposition) are automatically performed by the deposition apparatus. Also, the measurement process in the measurement room can be automated. Furthermore, as a post-measurement treatment, a sealing treatment using a sealing glass coated with a desiccant or an adhesive may be performed. The completed panel is automatically unloaded from the manufacturing equipment and supplied to the next process (for example, the process of assembling the display panel). However, the above configuration is an example, and does not limit the configuration of the film forming apparatus of the present invention or the electronic device manufacturing apparatus including the same.

According to the electronic device manufacturing apparatus and the electronic device manufacturing method using the same, the temperature of the substrate is satisfactorily adjusted in the film forming apparatus, so that the film is formed satisfactorily. As a result, it is possible to manufacture high-quality electronic devices.

[Embodiment 5]
<Method for producing organic electronic device>
In this embodiment, an example of a method for manufacturing an organic electronic device using a film forming apparatus including an evaporation source device will be described. Hereinafter, as an example of the organic electronic device, the structure and manufacturing method of an organic EL display device will be illustrated. First, the organic EL display device to be manufactured will be described. FIG. 7(a) shows an overall view of the organic EL display device 60, and FIG. 7(b) shows a cross-sectional structure of one pixel.

As shown in FIG. 7A, in a display area 61 of an organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 61. FIG. In the case of the organic EL display device of this figure, the pixel 62 is configured by a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element. It is not limited.

FIG. 7(b) is a schematic partial cross-sectional view taken along line AB in FIG. 7(a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 5. and an organic EL element. Among these layers, the hole transport layer 65, the light emitting layers 66R, 66G and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue.

The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively. Also, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent short-circuiting between the first electrodes 64 and the second electrodes 68 due to foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer P is provided to protect the organic EL element from moisture and oxygen.

Next, an example of a method for manufacturing an organic EL display device as an electronic device will be specifically described. First, a substrate 5 having a circuit (not shown) for driving an organic EL display device and a first electrode 64 formed thereon is prepared.

Next, an acrylic resin is formed by spin coating on the substrate 5 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed. and an insulating layer 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

Next, the substrate 5 on which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is placed on the first electrode 64 in the display area. It is deposited as a common layer. The hole transport layer 65 is deposited by vacuum deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display area 61, a high-definition mask is not required. Here, the film deposition apparatus used in the film formation in this step and the film formation of each layer described below is the film formation apparatus described in any of the above embodiments.

Next, the substrate 5 with the hole transport layer 65 formed thereon is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the red-emitting light-emitting layer 66R is formed on the portion of the substrate 5 where the red-emitting element is to be arranged.
According to this example, the mask and the substrate can be satisfactorily overlapped, and highly accurate film formation can be performed.

Similarly to the deposition of the light emitting layer 66R, a green light emitting layer 66G is deposited by the third deposition apparatus, and a blue light emitting layer 66B is deposited by the fourth deposition apparatus. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 65 is formed as a layer common to the three color light-emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 65 has been formed is transferred to a sputtering apparatus, a second electrode 68 is formed thereon, and then transferred to a plasma CVD apparatus to form a protective layer P, whereby the organic EL display device 60 is completed. do.

If the substrate 5 on which the insulating layer 69 is patterned is carried into the film-forming apparatus and is exposed to an atmosphere containing moisture and oxygen until the film-forming of the protective layer P is completed, the light-emitting layer made of the organic EL material will be damaged. It may deteriorate due to moisture and oxygen. Therefore, in this example, substrates are carried in and out between film forming apparatuses under a vacuum atmosphere or an inert gas atmosphere.

According to the film forming method or the method for manufacturing an electronic device according to the present embodiment, temperature control during film formation is appropriately performed, so favorable film formation is possible.

100: film forming apparatus, 1: film forming chamber, 3: substrate holder, 5: substrate, 11: rotary joint, 20: rotary body, 30: housing, 31: supply port, 32: supply channel, 33: exhaust Outlet, 34: discharge channel, 35, 37: drain port, 80: cooling liquid, 81: drain liquid

Claims (16)

A film forming apparatus for forming a film on a film to be formed in a film forming chamber,
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating part includes a supply channel for supplying the liquid supplied from the supply port to the film formation object support part, and a discharge channel for discharging the liquid discharged from the film formation object support part to the discharge port. having a road and
In a film forming apparatus in which a liquid channel through which a liquid flows in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a drain port provided in the fixed part;
a removal mechanism for removing impurities from the drain liquid discharged from the drain port;
a path for supplying the drain liquid delivered from the removal mechanism to the supply port;
A film forming apparatus, comprising: 2. The film forming apparatus according to claim 1 , wherein the liquid discharged from the discharge port joins the path through which the drain liquid discharged from the drain port is supplied via a three-way valve. . 2. The film forming apparatus according to claim 1 , wherein the drain liquid sent from the removing mechanism joins the circulation path. 4. The apparatus according to claim 3 , further comprising a check valve for regulating reverse flow at a location where the drain liquid from which the impurities have been removed and the liquid discharged from the discharge port join. membrane device. The removal mechanism is arranged in the circulation path,
3. The liquid discharged from the discharge port and the drain liquid discharged from the drain port join together in the removal mechanism, and the impurities are removed and supplied to the supply port. 1. The film forming apparatus according to 1 . 6. The film forming apparatus according to claim 5 , wherein the removal mechanism is included in a temperature control mechanism that controls the temperature of the liquid. 6. The film forming apparatus according to claim 5 , wherein said removing mechanism is installed at a place other than a place where said film forming chamber is located. The removal mechanism has a drain liquid container that stores the drain liquid,
2. The film forming apparatus according to claim 1 , wherein in said drain liquid container, said impurities are separated from said liquid based on a difference in specific gravity between said liquid and said impurities. 9. The film formation according to claim 8 , wherein the drain liquid container is provided with a delivery port for delivering the liquid from which the impurities have been separated to the circulation path for reuse. Device. The drain liquid container is provided with a level sensor for detecting the level of the liquid contained therein, and has a pump for sending out the liquid sucked from the suction port for reuse. and
9. The removing mechanism does not deliver the liquid when the height of the liquid surface is equal to or lower than a threshold height higher than the height of the suction port by a predetermined distance. Film deposition apparatus described. The liquid is a liquid for adjusting the temperature of the film-forming object,
2. The film forming apparatus according to claim 1 , wherein said impurity is a component of grease used for said rotary joint. 12. The film forming apparatus according to claim 11 , wherein a material insoluble in the liquid is used as the base oil of the grease. 12. The film forming apparatus according to claim 11 , wherein the liquid and the grease have different specific gravities. 2. The film forming apparatus according to claim 1, wherein the liquid contains fluorocarbon. A film forming method for forming a film on a film to be formed in a film forming chamber of a film forming apparatus,
The film deposition apparatus includes a film formation target supporter that supports a film formation target, a rotating part that is connected to the deposition target supporter and rotates, and the deposition device that is provided around the rotation part. Equipped with a rotary joint having a fixed part fixed to the membrane chamber,
The fixed portion has a supply port through which liquid is supplied and a discharge port through which liquid is discharged, and the rotating portion is a supply flow that supplies the liquid supplied from the supply port to the film-forming object supporting portion. and a discharge channel for discharging the liquid discharged from the film-forming object supporting portion to the discharge port, wherein the supply port, the supply channel, the film-forming object supporting portion, and the discharge flow A liquid channel is formed in which the liquid flows in the order of the channel and the outlet,
The film forming apparatus further includes a circulation path for supplying the liquid discharged from the discharge port to the supply port, and a drain port provided in the fixed part,
A film forming method, comprising: supplying the drain liquid sent from a removal mechanism for removing impurities from the drain liquid discharged from the drain port to the supply port. A method for manufacturing an electronic device, in which a film of a film-forming material is formed on a film-forming object in a film-forming chamber of a film-forming apparatus,
The film deposition apparatus includes a film formation target supporter that supports a film formation target, a rotating part that is connected to the deposition target supporter and rotates, and the deposition device that is provided around the rotation part. Equipped with a rotary joint having a fixed part fixed to the membrane chamber,

The fixed portion has a supply port through which liquid is supplied and a discharge port through which liquid is discharged, and the rotating portion is a supply flow that supplies the liquid supplied from the supply port to the film-forming object supporting portion. and a discharge channel for discharging the liquid discharged from the film-forming object supporting portion to the discharge port, wherein the supply port, the supply channel, the film-forming object supporting portion, and the discharge flow A liquid channel is formed in which the liquid flows in the order of the channel and the outlet,
The film forming apparatus further includes a circulation path for supplying the liquid discharged from the discharge port to the supply port, and a drain port provided in the fixed part,
A method of manufacturing an electronic device, comprising the step of supplying the drain liquid sent from a removal mechanism for removing impurities from the drain liquid discharged from the drain port to the supply port.

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