JP7283511B2 - Imaging device and camera - Google Patents

Description

The present invention relates to imaging devices and cameras.

A semiconductor module in which a MOS image sensor chip and a signal processing chip are stacked is known.
[Prior art documents]
[Patent Literature]
[Patent Document 1] JP-A-2006-49361

The signal processing chip has a processing circuit that processes pixel signals output from the imaging chip. The processing circuitry generates heat during operation. Heat generated by the processing circuitry may be concentrated in the imaging area of the imaging chip. Then, in the imaging region, dark current increases due to heat generated in the processing circuit. As a result, image quality is degraded.

An imaging device according to a first aspect of the present invention includes an imaging chip having an imaging area for imaging an object, and a first processing circuit for performing signal processing on a first signal of the object imaged in the first area of the imaging area. and a second signal processing chip having a second processing circuit for performing signal processing on a second signal of an object imaged in a second area of the imaging area, the first signal The processing chip and the second signal processing chip are arranged apart from each other inside the outer edge of the imaging chip.

A camera according to a second aspect of the present invention includes the imaging device described above.

It should be noted that the above summary of the invention does not list all the necessary features of the invention. Subcombinations of these feature groups can also be inventions.

1 is a schematic perspective view of an imaging device according to an embodiment; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. It is a block diagram showing the configuration of the camera of the present embodiment. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG. 1 is a schematic cross-sectional view of an imaging device; FIG.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Also, not all combinations of features described in the embodiments are essential for the solution of the invention.

FIG. 1 is a schematic perspective view of the imaging device of this embodiment. The imaging device 100 includes an imaging chip 101 , a cover glass 111 as an optical element, a signal processing chip 121 and a flexible substrate 141 . In FIG. 1, bumps between the imaging chip 101 and the signal processing chip 121, bumps between the signal processing chip 121 and the flexible substrate 141, and the like are omitted for the purpose of simplifying the drawing. In addition, the same hatching as in FIG. 2 is used to make the adhesive layer 131, which will be described later, easier to see. In FIG. 1, the direction in which the subject light flux enters the imaging chip 101 is the z-axis direction. The longitudinal direction of the imaging chip 101 is defined as the x-axis direction, and the lateral direction thereof is defined as the y-axis direction. The x-axis plus direction is the right direction on the page, and the x-axis minus direction is the left direction on the page.

The imaging chip 101 has an imaging area on the first surface side, which is the surface on which subject light flux is incident. In this specification, a region facing the imaging region on the second surface opposite to the light receiving surface of the imaging chip 101 is referred to as a facing region 110 .

The signal processing chip 121 is stacked on the second surface side of the imaging chip 101 . The signal processing chip 121 has a processing circuit that processes pixel signals output from the imaging chip 101 . The imaging chip 101 and the signal processing chip 121 have different sizes. Here, the width of the signal processing chip 121 in the y-axis direction is substantially the same as the width of the imaging chip 101 in the y-axis direction. On the other hand, the width of the signal processing chip 121 in the x-axis direction is about ⅓ of the width of the imaging chip 101 in the x-axis direction.

The number of signal processing chips is appropriately determined according to the pixel signal readout method. In this embodiment, 2-channel readout is adopted as a readout method for pixel signals. Therefore, in this embodiment, the number of signal processing chips is two. One of the two signal processing chips 121 is arranged along the left edge of the imaging chip 101 and the other is arranged along the right edge of the imaging chip 101 . The two signal processing chips 121 are arranged without protruding from the outer edge of the second surface of the imaging chip 101 in the x-axis direction and the y-axis direction. Thereby, the imaging device 100 can be miniaturized in the x-axis direction and the y-axis direction.

The two signal processing chips 121 are spaced apart from each other in the x-axis direction. Therefore, both of the two signal processing chips 121 only cover part of the facing area 110 . In other words, the facing area 110 has a portion not covered by the signal processing chip 121 .

Here, if the entire facing area 110 is covered with the signal processing chip 121, the heat generated by the processing circuit can concentrate on the imaging area. When heat concentrates in the imaging area, dark current due to the heat increases. As a result, image quality is degraded.

According to the imaging device 100 of the present embodiment, the two signal processing chips 121 are arranged near the left and right ends of the imaging chip 101 while avoiding the central portion of the facing area 110 . That is, a space is formed between the two signal processing chips 121 . According to this configuration, part of the heat generated in the processing circuit of the signal processing chip 121 can be radiated to the space. Therefore, it is possible to reduce heat retention in the imaging area. As a result, dark current generated due to heat can be reduced in the imaging region.

The signal processing chip 121 is connected to the flexible substrate 141 as a flexible substrate. Flexible substrate 141 is connected to an external circuit. The flexible substrate 141 is connected to the surface of the signal processing chip 121 opposite to the third surface, which is the surface on the imaging chip 101 side.

The adhesive layer 131 is formed on the outer edge of the surface of the imaging chip 101 on which subject light flux is incident. The adhesive layer 131 is formed so as to surround the imaging area. The adhesive layer 131 bonds the imaging chip 101 and the cover glass 111 together.

FIG. 2 is a schematic cross-sectional view of the imaging device. Specifically, it is a schematic cross-sectional view of the xz plane passing through the center of the imaging chip 101 .

The imaging chip 101 is a surface-illuminated MOS image sensor. The imaging chip 101 has a circuit pattern 103 , through electrodes 104 , and electrode pads 105 in addition to the imaging region 102 described above.

The imaging area 102 is formed in the central portion of the imaging chip 101 . In the imaging region 102, a plurality of pixels that photoelectrically convert the received subject image are arranged.

The circuit pattern 103 , the through electrode 104 , and the electrode pad 105 are formed in a peripheral region shifted to the right and left from the outer edge of the imaging region 102 , respectively. The electrode pads 105 are formed on the second surface of the imaging chip 101 . The circuit pattern 103 and the electrode pads 105 are electrically connected via the through electrodes 104 . The circuit pattern 103 outputs pixel signals read from the pixels to the through electrodes 104 . The through electrode 104 outputs the pixel signal output from the circuit pattern 103 to the electrode pad 105 . The electrode pad 105 functions as an output section that outputs a pixel signal to an electrode pad 125, which will be described later.

The signal processing chip 121 has through electrodes 124, electrode pads 125, and electrode pads 126 in addition to the processing circuit described above. The electrode pads 125 are formed on the third surface of the signal processing chip 121 . On the other hand, the electrode pads 126 are formed on the surface of the signal processing chip 121 on the flexible substrate 141 side. The electrode pads 125 and the electrode pads 126 are electrically connected via the through electrodes 124 . The through electrode 124 outputs the pixel signal processed by the processing circuit to the flexible substrate 141 .

Electrode pads 125 of the signal processing chip 121 are electrically connected to electrode pads 105 of the imaging chip 101 via bumps 132 . The electrode pad 125 functions as an input section for inputting pixel signals output from the output section. Note that the bump 132 interposed between the electrode pad 105 and the electrode pad 125 can also be regarded as an output section or an input section. The imaging chip 101 and the signal processing chip 121 are bonded with an adhesive 133 .

The flexible substrate 141 has electrode pads 144 . Electrode pads 144 are electrically connected to electrode pads 126 of signal processing chip 121 via bumps 134 . A connection portion between the electrode pad 144 and the electrode pad 126 is adhered with an adhesive 135 . The flexible substrate 141 outputs pixel signals received through the through electrodes 124 of the signal processing chip 121 to an external circuit.

The cover glass 111 is made of borosilicate glass, quartz glass, alkali-free glass, heat-resistant glass, or the like. The cover glass 111 is arranged on the adhesive layer 131 so as to face the imaging region 102 and is adhered to the imaging chip 101 via the adhesive layer 131 . The adhesive layer 131 is interposed between the imaging chip 101 and the cover glass 111 and formed to surround the imaging region 102 . A thermosetting adhesive or the like can be used as the material of the adhesive layer 131 . The cover glass 111 seals the imaging area 102 while being separated from the imaging chip 101 by the thickness of the adhesive layer 131 .

FIG. 3 is a block diagram showing the configuration of the camera according to this embodiment. The camera 150 includes a photographing lens 420 as a photographing optical system, and the photographing lens 420 guides subject light beams incident along the optical axis OA to the image pickup apparatus 100 . The taking lens 420 may be an interchangeable lens that can be attached to and detached from the camera 150 . The camera 150 mainly includes an imaging device 100 , a system control section 401 , a work memory 404 , a recording section 405 and a display section 406 .

The photographing lens 420 is composed of a plurality of optical lens groups, and forms an image of subject light flux from a scene in the vicinity of its focal plane. In addition, in FIG. 3, one virtual lens arranged in the vicinity of the pupil is represented as a representative. A system control unit 401 executes charge accumulation control such as timing control and area control of the imaging apparatus 100 .

The imaging apparatus 100 transfers the pixel signal to the image processing section 411 of the system control section 401 . The image processing unit 411 performs various image processing using the work memory 404 as a workspace to generate image data. For example, when generating image data in the JPEG file format, compression processing is performed after performing white balance processing, gamma processing, and the like. The generated image data is recorded in the recording unit 405 , converted into a display signal, and displayed on the display unit 406 .

In the above description, the imaging apparatus 100 has the configuration including the flexible substrate 141 as a connection member with an external circuit, but may have a configuration including other connection members. FIG. 4 is a schematic cross-sectional view of an imaging device of Modification 1. FIG.

The imaging device 200 includes a wiring board 151 that is a rigid board instead of a flexible board. The imaging device 200 outputs pixel signals to an external circuit via the wiring board 151 . A ceramic substrate, a glass-epoxy substrate, or the like can be used as the wiring substrate 151 . In the imaging device 200 , the through electrodes 124 of the signal processing chip 121 output pixel signals processed by the processing circuit to the wiring board 151 . The wiring board 151 has electrode pads 152 . Electrode pads 152 are electrically connected to electrode pads 126 of signal processing chip 121 via bumps 134 . The wiring board 151 is fixed to the surface opposite to the third surface of the signal processing chip 121 with an adhesive 135 . Thus, the wiring board 151 is arranged adjacent to the signal processing chip 121 and electrically connected thereto.

The configuration using the wiring board 151 as a connection member with an external circuit is not limited to the configuration shown in FIG. FIG. 5 is a schematic cross-sectional view of an imaging device according to Modification 2. As shown in FIG. The imaging device 300 includes an enclosing member 161 having a square annular shape. The surrounding member 161 is arranged on the wiring board 151 and surrounds the imaging chip 101 . The surrounding member 161 is made of metal such as aluminum, brass, iron, or nickel alloy. A resin can be used as the material of the surrounding member 161, or a material obtained by insert-molding metal and resin can also be used. Although the details will be described later, when emphasis is placed on improving the sealing performance of the imaging device 300 , it is preferable to use metal as the material of the surrounding member 161 . The cover glass 111 is placed on the surrounding member 161 and adhered by the adhesive layer 131 .

If dust, foreign matter, or the like adheres to the cover glass 111, or if the cover glass 111 is scratched, there is a risk that they will appear in the captured image. By interposing the surrounding member 161 between the wiring board 151 and the cover glass 111 to widen the distance between the imaging chip 101 and the cover glass 111, the effect of reflection can be reduced. In addition, it becomes difficult for stray light due to reflection from the end surface of the cover glass 111 to reach the imaging region 102 . By using the surrounding member 161, the distance between the imaging chip 101 and the cover glass 111 can be widened, but the thickness of the imaging device 300 in the z-axis direction becomes thicker than when the surrounding member 161 is not used. The thickness of the surrounding member 161 is appropriately adjusted from the viewpoint of reduction of reflection and downsizing of the imaging device 100 .

A sealed space is formed by the cover glass 111 , the wiring board 151 and the surrounding member 161 . The imaging chip 101 is arranged in a sealed space. Here, if moisture and gas from the external environment enter the interior of the imaging device 300, the imaging performance of the imaging chip 101 is degraded. Specifically, when moisture in the external environment enters the sealed space, dew condensation occurs on the imaging chip 101 and the cover glass 111 due to the temperature difference between the inside and outside of the sealed space. Condensation and mold caused by condensation distort the formed optical image, thus increasing noise. On the other hand, if gas from the external environment enters the sealed space, it promotes oxidation and corrosion of the circuits inside the imaging chip 101 , causing destruction of the imaging chip 101 . By arranging the imaging chip 101 in the sealed space, the imaging chip 101 is less likely to be affected by moisture and gas in the external environment.

Another configuration using the wiring board 151 as a connection member with an external circuit will be described. FIG. 6 is a schematic cross-sectional view of an imaging device according to Modification 3. As shown in FIG.

The imaging device 400 includes electrode pads 106 on the surface of the imaging chip 101 . The electrode pads 106 are electrically connected to the electrode pads 105 via the through electrodes 104 . The wiring board 151 includes electrode pads 152 . Electrode pad 152 is electrically connected to electrode pad 106 via wire bonding 171 .

According to the configuration of the imaging device 400 , pixel signals read from pixels are temporarily output to the signal processing chip 121 via the through electrodes 104 . The pixel signal is processed by the processing circuit of the signal processing chip 121 and then output to the imaging chip 101 again. After that, it is output to the wiring board 151 via the wire bonding 171 .

In the imaging device 200 shown in FIG. 4 and the imaging device 300 shown in FIG. 5, the signal processing chip 121 is electrically connected to the wiring board 151 . For this reason, the signal processing chip 121 has through electrodes 124 for outputting pixel signals to the wiring substrate 151 . On the other hand, according to the configuration of the imaging device 400, the signal processing chip 121 does not include the through electrodes 124, which is advantageous in terms of the manufacturing process and manufacturing cost.

The configuration in which the through electrodes are not formed in the signal processing chip 121 is not limited to the configuration shown in FIG. FIG. 7 is a schematic cross-sectional view of an imaging device of Modification 4. As shown in FIG.

The wiring board 151 of the imaging device 500 has a convex land portion 153 that protrudes toward the area facing the imaging area 102 (that is, the facing area) on the second surface. The land portion 153 is formed in the central portion of the wiring board 151 avoiding the area where the signal processing chip 121 is arranged. The land portion 153 functions as a heat radiation member that releases heat generated in the imaging chip 101 . In other words, the land portion 153 can be said to be a heat radiating member that abuts against the opposing area. Thus, in the imaging device 500 , a heat dissipation member is arranged in the space between the two signal processing chips 121 . When the heat radiation property is emphasized, the larger the bonding surface between the land portion 153 and the imaging chip 101, the better.

On the other hand, the coefficient of linear expansion of the imaging chip 101 and the coefficient of linear expansion of the wiring board 151 are different from each other. Therefore, when the image pickup chip 101 and the wiring board 151 are heated or cooled after they are bonded together, they are warped. This is because the imaging chip 101 and the wiring board 151 differ in expansion or contraction due to heating or cooling. When the prevention of warping is emphasized, the bonding surface between the land portion 153 and the image pickup chip 101 should be as small as possible.

The wiring board 151 is fixed to the imaging chip 101 with an adhesive 136 via the land portion 153 . An elastic adhesive may be used as the adhesive 136 . Acrylic resin, silicone resin, epoxy resin, or the like can be used as the elastic adhesive. By using an elastic adhesive as the adhesive 136, when the image pickup chip 101 and the wiring board 151 are heated or cooled after they are bonded, the difference in linear expansion coefficient between the image pickup chip 101 and the wiring board 151 causes Can absorb stress.

The wiring board 151 and the signal processing chip 121 are in contact with each other through the heat dissipation medium 137 . The heat dissipation medium 137 is, for example, silicone grease. The wiring board 151 and the signal processing chip 121 are thermally coupled by the heat dissipation medium 137 . Thereby, the heat generated in the processing circuit of the signal processing chip 121 can be dissipated to the wiring board 151 . Therefore, heat radiated from the processing circuit to the imaging chip 101 side can be reduced.

FIG. 8 is a schematic cross-sectional view of an imaging device of modification 5. As shown in FIG. A wiring board 151 of the imaging device 600 has an opening 155 corresponding to the imaging region 102 and is fixed to the light receiving surface side of the imaging chip 101 . The cover glass 111 covers the opening 155 and is adhered to the wiring board 151 by the adhesive layer 131 .

The wiring board 151 has electrode pads 154 . The electrode pads 154 are electrically connected to the electrode pads 106 of the imaging chip 101 via bumps 138 . A connection portion between the electrode pad 154 and the electrode pad 106 is adhered with an adhesive 139 . Adhesive 139 is formed to surround imaging region 102 .

In the configuration of the imaging device shown in FIGS. 4 to 7, the wiring substrate 151 was arranged on the surface opposite to the third surface of the signal processing chip 121. FIG. In contrast, according to the configuration of the imaging device 600 , the wiring board 151 is arranged on the light receiving surface side of the imaging chip 101 . Therefore, the distance between the imaging chip 101 and the cover glass 111 can be increased compared to the case where the cover glass 111 is arranged on the imaging chip 101 without using the surrounding member.

In the above description, the two signal processing chips 121 are arranged without protruding from the outer edge of the imaging chip 101 in the x-axis direction and the y-axis direction. FIG. 9 is a schematic cross-sectional view of an imaging device of Modification 6. As shown in FIG.

The signal processing chip 121 of the imaging device 700 has electrode pads 127 on the third surface. The electrode pad 127 is formed on a portion of the signal processing chip 121 protruding from the outer edge of the imaging chip 101 in the x-axis direction. According to this configuration, the electrode pads 127 can be formed on the third surface. Therefore, it is not necessary to form electrode pads on the surface opposite to the third surface and form through electrodes for electrically connecting the electrode pads to each other. Electrode pads 127 are electrically connected to electrode pads 145 of flexible substrate 141 via bumps 140 . A connection portion between the electrode pad 127 and the electrode pad 145 is adhered with an adhesive 135 .

By arranging the signal processing chip 121 protruding from the outer edge of the imaging chip 101 in the x-axis direction, it is possible to stack the imaging chip 101 while completely avoiding the opposing area. As a result, the heat generated in the processing circuit is more difficult to dissipate to the imaging area 102 .

Even when the two signal processing chips 121 are arranged so as to protrude from the outer edge of the imaging chip 101 in the x-axis direction, the various configurations described above are possible. FIG. 10 is a schematic cross-sectional view of an imaging device of modification 7. FIG. The imaging device 800 includes an imaging chip 101 , a signal processing chip 121 , a cover glass 111 , a wiring substrate 151 as a connection member, and a surrounding member 161 . Electrode pads 127 of the signal processing chip 121 are electrically connected to electrode pads 152 of the wiring board 151 via wire bonding 171 . Therefore, according to this configuration, the pixel signal output to the signal processing chip 121 can be output to the wiring board 151 without being output to the imaging chip 101 again. In addition, as described above, the surrounding member 161 makes the imaging chip 101 less susceptible to moisture and gases in the external environment, thereby suppressing an increase in noise and avoiding destruction of the imaging chip 101 .

FIG. 11 is a schematic cross-sectional view of an imaging device according to Modification 8. As shown in FIG. A wiring board 151 of the imaging device 900 includes a convex land portion 153 that protrudes toward the opposing area. The wiring board 151 is fixed to the imaging chip 101 with an adhesive 136 via the land portion 153 . Thereby, the heat generated in the imaging chip 101 can be released. Thus, in the imaging device 900 , a heat dissipation member is arranged in the space between the two signal processing chips 121 . In addition, by using an elastic adhesive as the adhesive 136, the stress caused by the difference in linear expansion coefficient between the imaging chip 101 and the wiring board 151 can be absorbed. The wiring board 151 and the signal processing chip 121 are in contact with each other through the heat dissipation medium 137 . Thereby, the heat generated in the processing circuit of the signal processing chip 121 can be dissipated to the wiring board 151 .

FIG. 12 is a schematic cross-sectional view of an imaging device. A wiring board 151 of the imaging device 1000 has an opening 155 corresponding to the imaging chip 101 . The imaging chip 101 is accommodated in the opening 155 of the wiring board 151 . The wiring board 151 is fixed to the third surface of the signal processing chip 121 . Electrode pads 127 of the signal processing chip 121 are electrically connected to electrode pads 156 of the wiring substrate 151 via bumps 140 . A connection portion between the electrode pad 127 and the electrode pad 156 is adhered with an adhesive 135 .

FIG. 13 is a schematic cross-sectional view of an imaging device. The signal processing chip 121 on the left side of the imaging device 1100 is arranged in the positive x-axis direction from the left end of the imaging chip 101 . On the other hand, the signal processing chip 121 on the right side is arranged in the negative direction of the x-axis from the right end of the imaging chip 101 . The flexible substrate 141 is arranged in a space created by displacing the signal processing chip 121 from the edge of the imaging chip 101 . Thus, the flexible substrate 141 may be electrically connected to the imaging chip 101 instead of the signal processing chip 121 . According to the configuration of the imaging device 1100, it can be made smaller in the x-axis direction than the imaging device 700 shown in FIG.

FIG. 14 is a schematic cross-sectional view of an imaging device. The land portion 153 of the wiring board 151 of the imaging device 1200 is formed on the outer edge portion of the wiring board 151 . The wiring board 151 has electrode pads 157 on the land portions 153 . The electrode pads 157 are electrically connected to the electrode pads 107 of the imaging chip 101 via bumps 140 . In this manner, the land portion 153 of the wiring board 151 may be formed in a portion other than the central portion of the wiring board 151 .

FIG. 15 is a schematic cross-sectional view of an imaging device. A wiring board 151 of the imaging device 1300 has an opening 155 corresponding to the signal processing chip 121 . The signal processing chip 121 is accommodated in the opening 155 of the wiring board 151 . The electrode pads 157 of the wiring board 151 are electrically connected to the electrode pads 107 of the imaging chip 101 via bumps 140 . In this way, when the wiring substrate 151 and the imaging chip 101 are electrically connected by bump bonding, the wiring substrate 151 can be arranged on the surface opposite to the light receiving surface of the imaging chip 101 .

In the above description, the land portion 153 of the wiring board 151 functioning as a heat dissipation member is adhered to the imaging chip 101 . The heat dissipation member may be adhered to the signal processing chip 121 . FIG. 16 is a schematic cross-sectional view of an imaging device. The imaging device 1400 has a heat dissipation member 181 . The heat dissipation member 181 is in contact with the signal processing chip 121 via the heat dissipation medium 137 . Thereby, heat generated in the signal processing chip 121 is radiated through the heat radiation member 181 . Therefore, the heat radiated to the imaging chip 101 side can be reduced. As a result, dark current generated by heat generated in the signal processing chip 121 can be reduced. The heat radiation member 181 is preferably fin-shaped. As a result, the heat dissipation area of the heat dissipation member 181 is increased, so that the heat dissipation characteristics can be further enhanced.

FIG. 17 is a schematic cross-sectional view of an imaging device. The flexible substrate 141 of the imaging device 1500 has a structure sandwiched between the imaging chip 101 and the signal processing chip 121 . The thicknesses of bumps 134 and 132 are different from each other. Specifically, the thickness of the bumps 132 is thicker than the thickness of the bumps 134 by the thickness of the flexible substrate 141 . By devising the thickness of the bumps in this manner, a structure in which the flexible substrate 141 is sandwiched between the imaging chip 101 and the signal processing chip 121 can be realized.

The imaging chip 101 may be a back-illuminated MOS image sensor. In this case, in the imaging chip 101, a plurality of pixels are arranged on the incident side of the subject image from the wiring layer including the wiring for outputting the pixel signals to the through electrodes. In the case of the back-illuminated imaging chip 101, since the imaging chip is polished, it is thinner than the front-illuminated imaging chip. Therefore, in some cases, a signal processing chip is arranged on the support substrate after the support substrate is attached to the surface of the imaging chip opposite to the light receiving surface. In this case, it is preferable to form through electrodes in the support substrate. Thereby, the imaging chip and the signal processing chip can be electrically connected through the through electrodes of the support substrate.

Pixel signals of the imaging chip 101 may be transmitted to the signal processing chip 121 by wireless communication using electromagnetic coupling. In this case, the imaging chip 101 and the signal processing chip 121 each have coils formed to face each other.

In the above description, the land portion 153 of the wiring board 151 functions as a heat dissipation member that releases heat generated in the image pickup chip 101. However, the wiring board 151 and the heat dissipation member do not have to be integrally formed. . Also, a heat dissipation member may be arranged individually for each of the imaging chip 101 and the signal processing chip 121 .

Although the number of signal processing chips 121 is two in the above description, the number may be one. Also, the number of signal processing chips 121 may be three or more. Although the cover glass 111 is used as the optical element in the above description, a low-pass filter, an IR cut filter, or the like may be used instead of the cover glass 111 .

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is obvious to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the scope of claims that forms with such modifications or improvements can also be included in the technical scope of the present invention.

100 imaging device, 200 imaging device, 300 imaging device, 400 imaging device, 500 imaging device, 600 imaging device, 700 imaging device, 800 imaging device, 900 imaging device, 1000 imaging device, 1100 imaging device, 1200 imaging device, 1300 imaging device Apparatus 1400 imaging device 1500 imaging device 101 imaging chip 102 imaging region 103 circuit pattern 104 through electrode 105 electrode pad 106 electrode pad 107 electrode pad 110 opposing region 111 cover glass 121 signal processing chip , 124 through electrode, 125 electrode pad, 126 electrode pad, 127 electrode pad, 131 adhesive layer, 132 bump, 133 adhesive, 134 bump, 135 adhesive, 136 adhesive, 137 heat dissipation medium, 138 bump, 139 adhesive, 140 bump, 141 flexible substrate, 144 electrode pad, 145 electrode pad, 150 camera, 151 wiring board, 152 electrode pad, 153 land, 154 electrode pad, 155 opening, 156 electrode pad, 157 electrode pad, 161 surrounding member , 171 wire bonding, 181 heat dissipation member, 401 system control unit, 404 work memory, 405 recording unit, 406 display unit, 411 image processing unit, 420 photographing lens

Claims (25)

an imaging chip having a first surface in which an imaging area for imaging a subject, a first peripheral area different from the imaging area, and a second peripheral area different from the imaging area are formed;
a first signal processing chip stacked on the imaging chip , the first signal processing chip having a first processing circuit for performing signal processing on a first signal of an object imaged in the first area of the imaging area;
a second signal processing chip stacked on the imaging chip , the second signal processing chip having a second processing circuit for performing signal processing on a second signal of an object imaged in the second area of the imaging area;
a first connecting portion that electrically connects between the imaging chip and the first signal processing chip in the stacking direction of the imaging chip and the first signal processing chip in the first peripheral region;
a second connecting portion electrically connecting between the imaging chip and the second signal processing chip in the stacking direction of the imaging chip and the second signal processing chip in the second peripheral region;
with
The imaging area is arranged between the first peripheral area and the second peripheral area on the first surface,
The imaging device, wherein the first signal processing chip and the second signal processing chip are arranged apart from each other inside an outer edge of the imaging chip. The imaging device according to claim 1,
The imaging device, wherein the distance between the first signal processing chip and the second signal processing chip is shorter than the distance between the first connection portion and the second connection portion. The imaging device according to claim 1,
The imaging device, wherein the distance between the first signal processing chip and the second signal processing chip is shorter than the distance between the first connection portion and the second connection portion. In the imaging device according to any one of claims 1 to 3,
The imaging chip outputs a first wire for outputting the first signal processed by the first processing circuit and the second signal processed by the second processing circuit. an imaging device connected to a second wire for In the imaging device according to any one of claims 1 to 4 ,
the first connecting portion has a first through electrode electrically connecting between the imaging chip and the first signal processing chip;
The imaging device, wherein the second connecting portion has a second through electrode that electrically connects the imaging chip and the second signal processing chip. In the imaging device according to claim 5 ,
The imaging device, wherein the imaging chip includes first wiring for outputting the first signal to the first through electrode and second wiring for outputting the second signal to the second through electrode. In the imaging device according to claim 6 ,
The imaging chip has a second surface opposite to the first surface,
The imaging device, wherein the imaging region is arranged closer to the first surface than the first wiring and the second wiring in a direction from the second surface to the first surface. In the imaging device according to any one of claims 1 to 4 ,
the first connection section has a first electrode pad that electrically connects the imaging chip and the first signal processing chip;
The image pickup device, wherein the second connection section has a second electrode pad that electrically connects the image pickup chip and the second signal processing chip. The imaging device according to claim 8 ,
The imaging device, wherein the imaging chip includes first wiring for outputting the first signal to the first electrode pad and second wiring for outputting the second signal to the second electrode pad. In the imaging device according to claim 9 ,
The imaging chip has a second surface opposite to the first surface,
The imaging device, wherein the imaging region is arranged closer to the first surface than the first wiring and the second wiring in a direction from the second surface to the first surface. In the imaging device according to any one of claims 1 to 10 ,
The imaging device, wherein the first signal processing chip and the second signal processing chip are different in chip size from the imaging chip. The imaging device according to claim 11, wherein
The imaging device, wherein the first signal processing chip and the second signal processing chip are smaller in chip size than the imaging chip. an imaging chip having a first surface formed with an imaging area in which a plurality of pixels are arranged, a first peripheral area different from the imaging area, and a second peripheral area different from the imaging area;
a first signal processing chip having a first processing circuit for performing signal processing on a first signal from at least a first pixel among the plurality of pixels and stacked on the imaging chip ;
a second signal processing chip that has a second processing circuit that performs signal processing on a second signal from at least a second pixel among the plurality of pixels and is stacked on the imaging chip ;
a first connecting portion that electrically connects between the imaging chip and the first signal processing chip in the stacking direction of the imaging chip and the first signal processing chip in the first peripheral region;
a second connecting portion electrically connecting between the imaging chip and the second signal processing chip in the stacking direction of the imaging chip and the second signal processing chip in the second peripheral region;
with
The imaging area is arranged between the first peripheral area and the second peripheral area on the first surface,
The imaging device, wherein the first signal processing chip and the second signal processing chip are arranged apart from each other inside an outer edge of the imaging chip. The imaging device according to claim 13, wherein
The imaging device, wherein the distance between the first signal processing chip and the second signal processing chip is shorter than the distance between the first connection portion and the second connection portion. The imaging device according to claim 13, wherein
The imaging device, wherein the distance between the first signal processing chip and the second signal processing chip is shorter than the distance between the first connection portion and the second connection portion. In the imaging device according to any one of claims 13 to 15,
The imaging chip outputs a first wire for outputting the first signal processed by the first processing circuit and the second signal processed by the second processing circuit. an imaging device connected to a second wire for In the imaging device according to any one of claims 13 to 16 ,
the first connecting portion has a first through electrode electrically connecting between the imaging chip and the first signal processing chip;
The imaging device, wherein the second connecting portion has a second through electrode that electrically connects the imaging chip and the second signal processing chip. 18. The imaging device of claim 17 , wherein
The imaging device, wherein the imaging chip includes first wiring for outputting the first signal to the first through electrode and second wiring for outputting the second signal to the second through electrode. 19. The imaging device of claim 18 , wherein
The imaging chip has a second surface opposite to the first surface,
The imaging device, wherein the plurality of pixels are arranged closer to the first surface than the first wiring and the second wiring in a direction from the second surface to the first surface. In the imaging device according to any one of claims 13 to 16 ,
the first connection section has a first electrode pad that electrically connects the imaging chip and the first signal processing chip;
The image pickup device, wherein the second connection section has a second electrode pad that electrically connects the image pickup chip and the second signal processing chip. 21. The imaging device of claim 20 , wherein
The imaging device, wherein the imaging chip includes first wiring for outputting the first signal to the first electrode pad and second wiring for outputting the second signal to the second electrode pad. 22. The imaging device of claim 21 , wherein
The imaging chip has a second surface opposite to the first surface,
The imaging device, wherein the plurality of pixels are arranged closer to the first surface than the first wiring and the second wiring in a direction from the second surface to the first surface. In the imaging device according to any one of claims 13 to 22 ,
The imaging device, wherein the first signal processing chip and the second signal processing chip are different in chip size from the imaging chip. 24. The imaging device of claim 23, wherein
The imaging device, wherein the first signal processing chip and the second signal processing chip are smaller in chip size than the imaging chip. A camera comprising an imaging device according to any one of claims 1 to 24 .

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