JP2021193848A - Imaging apparatus and camera - Google Patents

Abstract

To prevent heat generated in a processing circuit from concentrating in an imaging region of an imaging chip, and thereby prevent a dark current from increasing in the imaging region due to the heat generated by the processing circuit, thereby suppressing degradation of image quality.SOLUTION: An imaging apparatus includes: an imaging chip having an imaging region for imaging a subject; a first signal processing chip having a first processing circuit configured to perform signal processing on a first signal of the subject imaged in a first region of the imaging region; and a second signal processing chip having a second processing circuit configured to perform signal processing on a second signal of the subject imaged in a second region of the imaging region. The first signal processing chip and the second signal processing chip are disposed inside an outer edge of the imaging chip, so as to be separated with each other.SELECTED DRAWING: Figure 1

Description

The present invention relates to an image pickup apparatus and a camera.

A semiconductor module in which a MOS image sensor chip and a signal processing chip are laminated is known.
[Prior Art Document]
[Patent Document]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2006-49361

The signal processing chip has a processing circuit that processes the pixel signal output from the image pickup chip. This processing circuit generates heat during operation. The heat generated in the processing circuit may be concentrated in the imaging region of the imaging chip. Then, in the imaging region, the dark current increases due to the heat generated in the processing circuit. As a result, the image quality is deteriorated.

The image pickup apparatus according to the first aspect of the present invention is a first processing circuit that performs signal processing on an image pickup chip having an image pickup region for imaging a subject and a first signal of the subject imaged in the first region of the image pickup region. The first signal processing chip is provided with a first signal processing chip having a second signal processing chip and a second signal processing chip having a second processing circuit that performs signal processing on the second signal of the subject imaged in the second region of the imaging region. The processing chip and the second signal processing chip are arranged inside the outer edge of the image pickup chip and separated from each other.

The camera according to the second aspect of the present invention includes the above-mentioned imaging device.

The outline of the above invention does not list all the necessary features of the present invention. A subcombination of these feature groups can also be an invention.

It is a schematic perspective view of the image pickup apparatus of this embodiment. It is a schematic cross-sectional view of an image pickup apparatus. It is a block diagram which shows the structure of the camera of this embodiment. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus. It is a schematic cross-sectional view of an image pickup apparatus.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention in the scope of claims. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 is a schematic perspective view of the image pickup apparatus of the present embodiment. The image pickup apparatus 100 includes an image pickup chip 101, a cover glass 111 as an optical element, a signal processing chip 121, and a flexible substrate 141. In FIG. 1, for the purpose of simplifying the drawing, bumps between the image pickup chip 101 and the signal processing chip 121, bumps between the signal processing chip 121 and the flexible substrate 141, and the like are omitted. Further, in order to make the adhesive layer 131 described later easy to see, the same hatching as in FIG. 2 is applied. In FIG. 1, the direction in which the subject luminous flux is incident on the image pickup chip 101 is defined as the z-axis direction. The longitudinal direction of the image pickup chip 101 is the x-axis direction, and the lateral direction is the y-axis direction. The plus direction of the x-axis is the right direction of the paper surface, and the minus direction of the x-axis is the left direction of the paper surface.

The image pickup chip 101 has an image pickup region on the first surface side, which is the surface on which the subject luminous flux is incident. In the present specification, the region facing the imaging region on the second surface, which is the surface opposite to the light receiving surface of the imaging chip 101, is referred to as the facing region 110.

The signal processing chip 121 is laminated on the second surface side of the image pickup chip 101. The signal processing chip 121 has a processing circuit for processing the pixel signal output from the image pickup chip 101. The sizes of the image pickup chip 101 and the signal processing chip 121 are different from each other. Here, the width of the signal processing chip 121 in the y-axis direction is substantially the same as the width of the image pickup chip 101 in the y-axis direction. On the other hand, the width of the signal processing chip 121 in the x-axis direction is about 1/3 of the width of the image pickup chip 101 in the x-axis direction.

The number of signal processing chips is appropriately determined according to the pixel signal reading method. In this embodiment, two-channel readout is adopted as a pixel signal readout method. Therefore, in this embodiment, the number of signal processing chips is two. One of the two signal processing chips 121 is arranged along the left end of the image pickup chip 101, and the other is arranged along the right end of the image pickup chip 101. The two signal processing chips 121 are arranged so as not to protrude in the x-axis direction and the y-axis direction from the outer edge of the second surface of the image pickup chip 101. As a result, the image pickup apparatus 100 can be miniaturized in the x-axis direction and the y-axis direction.

The two signal processing chips 121 are arranged so as to be spaced apart from each other in the x-axis direction. Therefore, both of the two signal processing chips 121 only cover a part of the facing region 110. In other words, the facing region 110 has a portion not covered by the signal processing chip 121.

Here, if the entire facing region 110 is covered with the signal processing chip 121, the heat generated in the processing circuit can be concentrated in the imaging region. When heat is concentrated in the imaging region, the dark current caused by the heat increases. As a result, the image quality is deteriorated.

According to the image pickup apparatus 100 of the present embodiment, the two signal processing chips 121 are arranged close to the left and right ends of the image pickup chip 101 while avoiding the central portion of the facing region 110. That is, a space is formed between the two signal processing chips 121. According to this configuration, a part of the heat generated in the processing circuit of the signal processing chip 121 can be dissipated to the space. Therefore, heat retention in the imaging region can be reduced. As a result, it is possible to reduce the dark current generated by heat in the imaging region.

The signal processing chip 121 is connected to the flexible substrate 141 as a flexible substrate. The flexible substrate 141 is connected to an external circuit. The flexible substrate 141 is connected to the surface of the signal processing chip 121 opposite to the third surface, which is the surface on the image pickup chip 101 side.

The adhesive layer 131 is formed on the outer edge of the surface of the image pickup chip 101 on which the subject luminous flux is incident. The adhesive layer 131 is formed so as to surround the imaging region. The adhesive layer 131 adheres the image pickup chip 101 and the cover glass 111.

FIG. 2 is a schematic cross-sectional view of the image pickup apparatus. Specifically, it is a schematic cross-sectional view of the xz plane passing through the center of the image pickup chip 101.

The image pickup chip 101 is a surface-illuminated MOS image sensor. The imaging chip 101 has a circuit pattern 103, a through silicon via 104, and an electrode pad 105 in addition to the imaging region 102 described above.

The image pickup region 102 is formed in the central portion of the image pickup chip 101. In the imaging region 102, a plurality of pixels that photoelectrically convert the received subject image are arranged.

The circuit pattern 103, the through silicon via 104, and the electrode pad 105 are formed in a peripheral region shifted to the right and a peripheral region shifted to the left from the outer edge of the imaging region 102, respectively. The electrode pad 105 is formed on the second surface of the image pickup chip 101. The circuit pattern 103 and the electrode pad 105 are electrically connected via the through electrode 104. The circuit pattern 103 outputs the pixel signal read from the pixel to the through electrode 104. The through silicon via 104 outputs the pixel signal output from the circuit pattern 103 to the electrode pad 105. The electrode pad 105 functions as an output unit that outputs a pixel signal to the electrode pad 125, which will be described later.

The signal processing chip 121 has a through electrode 124, an electrode pad 125, and an electrode pad 126 in addition to the processing circuit described above. The electrode pad 125 is formed on the third surface of the signal processing chip 121. On the other hand, the electrode pad 126 is formed on the surface of the signal processing chip 121 on the flexible substrate 141 side. The electrode pad 125 and the electrode pad 126 are electrically connected via a through electrode 124. The through silicon via 124 outputs the pixel signal processed by the processing circuit to the flexible substrate 141.

The electrode pad 125 of the signal processing chip 121 is electrically connected to the electrode pad 105 of the image pickup chip 101 via the bump 132. The electrode pad 125 functions as an input unit for inputting a pixel signal output from the output unit. The bump 132 interposed between the electrode pad 105 and the electrode pad 125 can also be regarded as an output unit or an input unit. The image pickup chip 101 and the signal processing chip 121 are adhered to each other by the adhesive 133.

The flexible substrate 141 has an electrode pad 144. The electrode pad 144 is electrically connected to the electrode pad 126 of the signal processing chip 121 via the bump 134. The connection portion between the electrode pad 144 and the electrode pad 126 is adhered by the adhesive 135. The flexible substrate 141 outputs the pixel signal received via the through electrode 124 of the signal processing chip 121 to an external circuit.

The cover glass 111 is made of borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass and the like. The cover glass 111 is arranged on the adhesive layer 131 facing the image pickup region 102, and is adhered to the image pickup chip 101 via the adhesive layer 131. The adhesive layer 131 is interposed between the image pickup chip 101 and the cover glass 111, and is formed so as to surround the image pickup region 102. As the material of the adhesive layer 131, a thermosetting adhesive or the like can be used. The cover glass 111 seals the image pickup region 102 while being separated from the image pickup chip 101 by the thickness of the adhesive layer 131.

FIG. 3 is a block diagram showing a configuration of a camera according to the present embodiment. The camera 150 includes a photographing lens 420 as a photographing optical system, and the photographing lens 420 guides a subject light beam incident along the optical axis OA to the image pickup apparatus 100. The photographing lens 420 may be an interchangeable lens that can be attached to and detached from the camera 150. The camera 150 mainly includes an image pickup device 100, a system control unit 401, a work memory 404, a recording unit 405, and a display unit 406.

The photographing lens 420 is composed of a plurality of optical lens groups, and forms a subject light flux from the scene in the vicinity of the focal plane thereof. In addition, in FIG. 3, it is represented by one virtual lens arranged in the vicinity of the pupil. The system control unit 401 executes charge accumulation control such as timing control and area control of the image pickup apparatus 100.

The image pickup apparatus 100 passes the pixel signal to the image processing unit 411 of the system control unit 401. The image processing unit 411 performs various image processing using the work memory 404 as a workspace to generate image data. For example, when generating image data in JPEG file format, a compression process is executed after performing a white balance process, a gamma process, or the like. The generated image data is recorded in the recording unit 405, converted into a display signal, and displayed on the display unit 406.

In the above description, the image pickup apparatus 100 is configured to include the flexible substrate 141 as a connecting member to the external circuit, but may be configured to include other connecting members. FIG. 4 is a schematic cross-sectional view of the image pickup apparatus of Modification 1.

The image pickup apparatus 200 includes a wiring board 151 which is a rigid board instead of the flexible board. The image pickup apparatus 200 outputs a pixel signal to an external circuit via the wiring board 151. As the wiring board 151, a ceramic board, a glass epoxy board, or the like can be used. In the image pickup apparatus 200, the through electrode 124 of the signal processing chip 121 outputs the pixel signal processed by the processing circuit to the wiring board 151. The wiring board 151 has an electrode pad 152. The electrode pad 152 is electrically connected to the electrode pad 126 of the signal processing chip 121 via the bump 134. The wiring board 151 is fixed to the surface of the signal processing chip 121 opposite to the third surface via the adhesive 135. In this way, the wiring board 151 is arranged adjacent to the signal processing chip 121 and electrically connected.

The configuration in which the wiring board 151 is used as the connection member with the external circuit is not limited to the configuration shown in FIG. FIG. 5 is a schematic cross-sectional view of the image pickup apparatus of Modification 2. The image pickup apparatus 300 includes a ring member 161 having a square annular shape. The surrounding member 161 is arranged on the wiring board 151 and surrounds the image pickup chip 101. The surrounding member 161 is made of a metal such as aluminum, brass, iron, and nickel alloy. A resin can be used as the material of the surrounding member 161 or a material in which a metal and a resin are insert-molded can be used. As will be described in detail later, when it is important to improve the sealing performance of the image pickup apparatus 300, it is preferable to use metal as the material of the surrounding member 161. The cover glass 111 is arranged on the surrounding member 161 and is adhered by the adhesive layer 131.

If dust, foreign matter, or the like adheres to the cover glass 111, or if the cover glass 111 is scratched, they may be reflected in the captured image. By interposing the surrounding member 161 between the wiring board 151 and the cover glass 111 and widening the distance between the image pickup chip 101 and the cover glass 111, the influence of reflection can be reduced. In addition, it becomes difficult for stray light due to reflection from the end face of the cover glass 111 to reach the imaging region 102. While the distance between the image pickup chip 101 and the cover glass 111 can be widened by using the surrounding member 161, the thickness of the image pickup device 300 in the z-axis direction is thicker than that when the surrounding member 161 is not used. The thickness of the surrounding member 161 is appropriately adjusted from the viewpoint of reducing the reflection and reducing the size of the image pickup apparatus 100.

A sealed space is formed by the cover glass 111, the wiring board 151, and the surrounding member 161. The image pickup chip 101 is arranged in the sealed space. Here, if moisture and gas in the external environment enter the inside of the image pickup apparatus 300, the image pickup performance of the image pickup chip 101 deteriorates. Specifically, when moisture in the external environment enters the sealed space, dew condensation occurs on the image pickup chip 101 and the cover glass 111 due to the temperature difference between the inside and outside of the sealed space. When mold is formed due to dew condensation and dew condensation, the optical image to be imaged is distorted, so that noise increases. On the other hand, when the gas in the external environment enters the sealed space, the circuit inside the image pickup chip 101 is oxidized and corroded, and the image pickup chip 101 is destroyed. By arranging the image pickup chip 101 in the sealed space, the image pickup chip 101 is less likely to be affected by the moisture and gas in the external environment, so that it is possible to suppress an increase in noise and avoid destruction of the image pickup chip 101.

Another configuration in which the wiring board 151 is used as a connecting member with an external circuit will be described. FIG. 6 is a schematic cross-sectional view of the image pickup apparatus of Modification 3.

The image pickup apparatus 400 includes an electrode pad 106 on the surface of the image pickup chip 101. The electrode pad 106 is electrically connected to the electrode pad 105 via the through electrode 104. The wiring board 151 includes an electrode pad 152. The electrode pad 152 is electrically connected to the electrode pad 106 via wire bonding 171.

According to the configuration of the image pickup apparatus 400, the pixel signal read from the pixels is once output to the signal processing chip 121 via the through electrode 104. The pixel signal is processed by the processing circuit of the signal processing chip 121, and then output to the image pickup chip 101 again. After that, it is output to the wiring board 151 via the wire bonding 171.

In the image pickup apparatus 200 shown in FIG. 4 and the image pickup apparatus 300 shown in FIG. 5, the signal processing chip 121 is electrically connected to the wiring board 151. Therefore, the signal processing chip 121 is provided with a through electrode 124 for outputting a pixel signal to the wiring board 151. On the other hand, according to the configuration of the image pickup apparatus 400, since the signal processing chip 121 does not include the through electrode 124, it is advantageous from the viewpoint of the manufacturing process and the manufacturing cost.

The configuration in which the through electrode is not formed on the signal processing chip 121 is not limited to the configuration shown in FIG. FIG. 7 is a schematic cross-sectional view of the image pickup apparatus of Modification 4.

The wiring board 151 of the image pickup apparatus 500 has a convex land portion 153 that projects toward a region facing the image pickup region 102 (that is, the facing region) on the second surface. The land portion 153 is formed in the central portion of the wiring board 151 so as to avoid the region where the signal processing chip 121 is arranged. The land portion 153 functions as a heat radiating member that dissipates heat generated by the image pickup chip 101. That is, it can be said that the land portion 153 is a heat radiating member that abuts on the facing region. In this way, in the image pickup apparatus 500, the heat dissipation member is arranged in the space between the two signal processing chips 121. When the heat dissipation characteristic is important, the larger the adhesive surface between the land portion 153 and the image pickup chip 101 is, the better.

On the other hand, the coefficient of linear expansion of the image pickup chip 101 and the coefficient of linear expansion of the wiring board 151 are different from each other. Therefore, when the image pickup chip 101 and the wiring board 151 are joined and then heated or cooled, warpage occurs in these. This is because the amount of expansion or contraction due to heating or cooling differs between the image pickup chip 101 and the wiring board 151. When the prevention of warpage is important, the smaller the adhesive surface between the land portion 153 and the image pickup chip 101 is, the better.

The wiring board 151 is fixed to the image pickup chip 101 by the adhesive 136 via the land portion 153. An elastic adhesive may be used as the adhesive 136. As the elastic adhesive, an acrylic resin, a silicone resin, an epoxy resin, or the like can be used. By using an elastic adhesive as the adhesive 136, it occurs due to the difference in linear expansion coefficient between the image pickup chip 101 and the wiring board 151 when the image pickup chip 101 and the wiring board 151 are bonded and then heated or cooled. Can absorb stress.

The wiring board 151 and the signal processing chip 121 are in contact with each other via the heat radiating medium 137. The heat radiating medium 137 is, for example, silicon grease. The wiring board 151 and the signal processing chip 121 are thermally connected by the heat radiating medium 137. As a result, the heat generated in the processing circuit of the signal processing chip 121 can be dissipated to the wiring board 151. Therefore, the heat radiated from the processing circuit to the image pickup chip 101 side can be reduced.

FIG. 8 is a schematic cross-sectional view of the image pickup apparatus of Modification 5. The wiring board 151 of the image pickup apparatus 600 has an opening 155 corresponding to the image pickup region 102, and is fixed to the light receiving surface side of the image pickup chip 101. The cover glass 111 covers the opening 155 and is adhered to the wiring board 151 by the adhesive layer 131.

The wiring board 151 has an electrode pad 154. The electrode pad 154 is electrically connected to the electrode pad 106 of the image pickup chip 101 via the bump 138. The connection portion between the electrode pad 154 and the electrode pad 106 is adhered by the adhesive 139. The adhesive 139 is formed so as to surround the imaging region 102.

In the configuration of the image pickup apparatus shown in FIGS. 4 to 7, the wiring board 151 is arranged on the surface opposite to the third surface of the signal processing chip 121. On the other hand, according to the configuration of the image pickup apparatus 600, the wiring board 151 is arranged on the light receiving surface side of the image pickup chip 101. Therefore, the distance between the image pickup chip 101 and the cover glass 111 can be increased as compared with the case where the cover glass 111 is arranged on the image pickup chip 101 without using the above-mentioned surrounding member.

In the above description, the two signal processing chips 121 are arranged so as not to protrude from the outer edge of the image pickup chip 101 in the x-axis direction and the y-axis direction, but may be arranged so as to protrude from the outer edge of the image pickup chip 101. FIG. 9 is a schematic cross-sectional view of the image pickup apparatus of Modification 6.

The signal processing chip 121 of the image pickup apparatus 700 includes an electrode pad 127 on the third surface. The electrode pad 127 is formed in a portion of the signal processing chip 121 that protrudes from the outer edge of the image pickup chip 101 in the x-axis direction. According to this configuration, the electrode pad 127 can be formed on the third surface. Therefore, it is not necessary to form an electrode pad on the surface opposite to the third surface and to bother to form a through electrode for electrically connecting the electrode pad and the electrode pad. The electrode pad 127 is electrically connected to the electrode pad 145 of the flexible substrate 141 via the bump 140. The connection portion between the electrode pad 127 and the electrode pad 145 is adhered by the adhesive 135.

By arranging the signal processing chip 121 protruding from the outer edge of the image pickup chip 101 in the x-axis direction, the signal processing chip 121 can be laminated on the image pickup chip 101 while completely avoiding the facing region. As a result, the heat generated in the processing circuit is less likely to be dissipated to the imaging region 102.

Even when the two signal processing chips 121 are arranged so as to protrude from the outer edge of the image pickup chip 101 in the x-axis direction, the various configurations described above can be obtained. FIG. 10 is a schematic cross-sectional view of the image pickup apparatus of Modification 7. The image pickup apparatus 800 includes a wiring board 151 as a connection member and a ring member 161 in addition to the image pickup chip 101, the signal processing chip 121, and the cover glass 111. The electrode pad 127 of the signal processing chip 121 is electrically connected to the electrode pad 152 of the wiring board 151 via wire bonding 171. Therefore, according to this configuration, the pixel signal output to the signal processing chip 121 can be output to the wiring board 151 without being output to the image pickup chip 101 again. Further, as described above, since the image pickup chip 101 is less susceptible to the influence of moisture and gas in the external environment due to the surrounding member 161, it is possible to suppress an increase in noise and avoid destruction of the image pickup chip 101.

FIG. 11 is a schematic cross-sectional view of the image pickup apparatus of Modification 8. The wiring board 151 of the image pickup apparatus 900 includes a convex land portion 153 projecting toward the facing region. The wiring board 151 is fixed to the image pickup chip 101 by the adhesive 136 via the land portion 153. As a result, the heat generated by the image pickup chip 101 can be dissipated. In this way, in the image pickup apparatus 900, the heat dissipation member is arranged in the space between the two signal processing chips 121. Further, by using the elastic adhesive as the adhesive 136, it is possible to absorb the stress caused by the difference in the linear expansion coefficient between the image pickup chip 101 and the wiring substrate 151. The wiring board 151 and the signal processing chip 121 are in contact with each other via the heat radiating medium 137. As a result, the heat generated in the processing circuit of the signal processing chip 121 can be dissipated to the wiring board 151.

FIG. 12 is a schematic cross-sectional view of the image pickup apparatus. The wiring board 151 of the image pickup apparatus 1000 has an opening 155 corresponding to the image pickup chip 101. The image pickup chip 101 is housed in the opening 155 of the wiring board 151. The wiring board 151 is fixed to the third surface of the signal processing chip 121. The electrode pad 127 of the signal processing chip 121 is electrically connected to the electrode pad 156 of the wiring board 151 via the bump 140. The connection portion between the electrode pad 127 and the electrode pad 156 is adhered by the adhesive 135.

FIG. 13 is a schematic cross-sectional view of the image pickup apparatus. The signal processing chip 121 on the left side of the image pickup apparatus 1100 is arranged so as to enter the x-axis plus direction from the left end of the image pickup chip 101. On the other hand, the signal processing chip 121 on the right side is arranged so as to enter the x-axis minus direction from the right end of the image pickup chip 101. The flexible substrate 141 is arranged in a space created by arranging the signal processing chip 121 so as to be displaced from the end portion of the image pickup chip 101. As described above, the flexible substrate 141 may be electrically connected to the image pickup chip 101 instead of the signal processing chip 121. According to the configuration of the image pickup apparatus 1100, the size can be reduced in the x-axis direction as compared with the image pickup apparatus 700 shown in FIG.

FIG. 14 is a schematic cross-sectional view of the image pickup apparatus. The land portion 153 of the wiring board 151 of the image pickup apparatus 1200 is formed on the outer edge portion of the wiring board 151. The wiring board 151 has an electrode pad 157 on the land portion 153. The electrode pad 157 is electrically connected to the electrode pad 107 of the image pickup chip 101 via the bump 140. As described above, the land portion 153 of the wiring board 151 may be formed other than the central portion of the wiring board 151.

FIG. 15 is a schematic cross-sectional view of the image pickup apparatus. The wiring board 151 of the image pickup apparatus 1300 has an opening 155 corresponding to the signal processing chip 121. The signal processing chip 121 is housed in the opening 155 of the wiring board 151. The electrode pad 157 of the wiring board 151 is electrically connected to the electrode pad 107 of the image pickup chip 101 via the bump 140. In this way, when the wiring board 151 and the image pickup chip 101 are electrically connected by bump bonding, the wiring board 151 can be arranged on the surface opposite to the light receiving surface of the image pickup chip 101.

In the above description, the land portion 153 of the wiring board 151 that functions as a heat dissipation member is adhered to the image pickup chip 101. The heat radiating member may be adhered to the signal processing chip 121. FIG. 16 is a schematic cross-sectional view of the image pickup apparatus. The image pickup apparatus 1400 has a heat dissipation member 181. The heat radiating member 181 is in contact with the signal processing chip 121 via the heat radiating medium 137. As a result, the heat generated by the signal processing chip 121 is dissipated through the heat radiating member 181. Therefore, the heat radiated to the image pickup chip 101 side can be reduced. As a result, the dark current generated by the heat generated by the signal processing chip 121 can be reduced. The heat radiating member 181 is preferably fin-shaped. As a result, the heat dissipation area of the heat dissipation member 181 becomes large, so that the heat dissipation characteristics can be further improved.

FIG. 17 is a schematic cross-sectional view of the image pickup apparatus. The flexible substrate 141 of the image pickup apparatus 1500 has a structure sandwiched between the image pickup chip 101 and the signal processing chip 121. The thickness of the bump 134 and the bump 132 are different from each other. Specifically, the thickness of the bump 132 is thicker than that of the bump 134 by the thickness of the flexible substrate 141. By devising the thickness of the bump in this way, it is possible to realize a structure in which the flexible substrate 141 is sandwiched between the image pickup chip 101 and the signal processing chip 121.

The image pickup chip 101 may be a back-illuminated MOS image sensor. In this case, in the image pickup chip 101, a plurality of pixels are arranged on the incident side of the subject image from the wiring layer including the wiring that outputs the pixel signal to the through electrode. In the case of the back-illuminated image pickup chip 101, since the image pickup chip is polished, the thickness is thinner than that of the surface-illuminated image pickup chip 101. Therefore, the support substrate may be attached to the surface of the image pickup chip opposite to the light receiving surface, and then the signal processing chip may be arranged on the support substrate. In this case, it is advisable to form a through electrode on the support substrate. As a result, the image pickup chip and the signal processing chip can be electrically connected via the through electrodes of the support substrate.

The pixel signal of the image pickup chip 101 may be transmitted to the signal processing chip 121 by wireless communication using electromagnetic coupling. In this case, each of the image pickup chip 101 and the signal processing chip 121 has a coil formed so as to face each other.

In the above description, the land portion 153 of the wiring board 151 functions as a heat radiating member for releasing the heat generated by the image pickup chip 101, but the wiring board 151 and the heat radiating member do not have to be integrally formed. .. Further, the heat radiating member may be individually arranged on each of the image pickup chip 101 and the signal processing chip 121.

In the above description, the number of signal processing chips 121 is two, but it may be one. Further, the number of signal processing chips 121 may be three or more. In the above description, the cover glass 111 is used as the optical element, but a low-pass filter, an IR cut filter, or the like may be used instead of the cover glass 111.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

100 image pickup device, 200 image pickup device, 300 image pickup device, 400 image pickup device, 500 image pickup device, 600 image pickup device, 700 image pickup device, 800 image pickup device, 900 image pickup device, 1000 image pickup device, 1100 image pickup device, 1200 image pickup device, 1300 image pickup device. Equipment, 1400 image pickup device, 1500 image pickup device, 101 image pickup chip, 102 image pickup area, 103 circuit pattern, 104 through electrode, 105 electrode pad, 106 electrode pad, 107 electrode pad, 110 facing area, 111 cover glass, 121 signal processing chip. , 124 Penetration Electrode, 125 Electrode Pad, 126 Electrode Pad, 127 Electrode Pad, 131 Adhesive Layer, 132 Bump, 133 Adhesive, 134 Bump, 135 Adhesive, 136 Adhesive, 137 Heat Dissipation Medium, 138 Bump, 139 Adhesive, 140 bumps, 141 flexible boards, 144 electrode pads, 145 electrode pads, 150 cameras, 151 wiring boards, 152 electrode pads, 153 lands, 154 electrode pads, 155 openings, 156 electrode pads, 157 electrode pads, 161 enclosure members. , 171 wire bonding, 181 heat dissipation member, 401 system control unit, 404 work memory, 405 recording unit, 406 display unit, 411 image processing unit, 420 shooting lens

Claims (19)

An imaging chip having an imaging region for imaging a subject,
A first signal processing chip having a first processing circuit that performs signal processing on the first signal of the subject imaged in the first region of the imaging region.
A second signal processing chip having a second processing circuit that performs signal processing on the second signal of the subject captured in the second region of the imaging region is provided.
The first signal processing chip and the second signal processing chip are image pickup devices arranged inside the outer edge of the image pickup chip and separated from each other. In the image pickup apparatus according to claim 1,
A first connection portion that electrically connects the image pickup chip and the first signal processing chip, and
A second connection portion that electrically connects the image pickup chip and the second signal processing chip,
An image pickup device equipped with. In the image pickup apparatus according to claim 2,
The first connection portion has a first through electrode that electrically connects the image pickup chip and the first signal processing chip.
The second connection portion is an image pickup apparatus having a second through electrode that electrically connects the image pickup chip and the second signal processing chip. In the image pickup apparatus according to claim 3,
The image pickup chip is an image pickup apparatus having a first wiring that outputs the first signal to the first through electrode and a second wiring that outputs the second signal to the second through electrode. In the image pickup apparatus according to claim 4,
The image pickup chip has a first surface on which light is incident and a second surface opposite to the first surface.
The imaging device is arranged on the first surface side of the first wiring and the second wiring in the direction from the second surface to the first surface. In the image pickup apparatus according to claim 2,
The first connection portion has a first electrode pad that electrically connects between the image pickup chip and the first signal processing chip.
The second connection portion is an image pickup apparatus having a second electrode pad that electrically connects the image pickup chip and the second signal processing chip. In the image pickup apparatus according to claim 6,
The image pickup chip is an image pickup apparatus having a first wiring that outputs the first signal to the first electrode pad and a second wiring that outputs the second signal to the second electrode pad. In the image pickup apparatus according to claim 7,
The image pickup chip has a first surface on which light is incident and a second surface opposite to the first surface.
The imaging device is arranged on the first surface side of the first wiring and the second wiring in the direction from the second surface to the first surface. The imaging device according to any one of claims 1 to 8.
The first signal processing chip and the second signal processing chip are image pickup devices having different chip sizes from the image pickup chip. An imaging chip in which multiple pixels are arranged, and
A first signal processing chip having a first processing circuit that performs signal processing on a first signal from at least the first pixel among the plurality of pixels.
A second signal processing chip having a second processing circuit that performs signal processing on a second signal from at least the second pixel among the plurality of pixels is provided.
The first signal processing chip and the second signal processing chip are image pickup devices arranged inside the outer edge of the image pickup chip and separated from each other. In the image pickup apparatus according to claim 10,
A first connection portion that electrically connects the image pickup chip and the first signal processing chip, and
A second connection portion that electrically connects the image pickup chip and the second signal processing chip,
An image pickup device equipped with. In the image pickup apparatus according to claim 11,
The first connection portion has a first through electrode that electrically connects the image pickup chip and the first signal processing chip.
The second connection portion is an image pickup apparatus having a second through electrode that electrically connects the image pickup chip and the second signal processing chip. In the image pickup apparatus according to claim 12,
The image pickup chip is an image pickup apparatus having a first wiring that outputs the first signal to the first through electrode and a second wiring that outputs the second signal to the second through electrode. In the image pickup apparatus according to claim 13,
The image pickup chip has a first surface on which light is incident and a second surface opposite to the first surface.
The plurality of pixels are arranged on the first surface side of the first wiring and the second wiring in the direction from the second surface to the first surface. In the image pickup apparatus according to claim 11,
The first connection portion has a first electrode pad that electrically connects between the image pickup chip and the first signal processing chip.
The second connection portion is an image pickup apparatus having a second electrode pad that electrically connects the image pickup chip and the second signal processing chip. In the image pickup apparatus according to claim 15,
The image pickup chip is an image pickup apparatus having a first wiring that outputs the first signal to the first electrode pad and a second wiring that outputs the second signal to the second electrode pad. In the image pickup apparatus according to claim 16,
The image pickup chip has a first surface on which light is incident and a second surface opposite to the first surface.
The plurality of pixels are arranged on the first surface side of the first wiring and the second wiring in the direction from the second surface to the first surface. The imaging device according to any one of claims 10 to 17.
The first signal processing chip and the second signal processing chip are image pickup devices having different chip sizes from the image pickup chip. A camera including the image pickup apparatus according to any one of claims 1 to 18.

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