JP7282944B2 - Display device - Google Patents

Description

Embodiments of the present invention relate to display devices.

In recent years, sensors for detecting contact or approach of an object to be detected such as a finger have been put to practical use as an interface of a display device or the like. A capacitive touch panel, which is an example of a sensor, includes electrodes for detecting a change in capacitance due to an object to be detected. In a display device equipped with such a touch panel, for example, in addition to a flexible printed circuit board connected to the display panel, a flexible printed circuit board connected to the surface on which electrodes of the touch panel are formed is required (for example, patent Reference 1).

JP 2011-65515 A

An object of the present embodiment is to provide a display device capable of narrowing the frame.

According to one embodiment,
A display device includes: a first substrate having a first region and a second region adjacent to the first region; a second substrate having a display region facing the second region; a first terminal connected to the IC chip; a first wiring connected to the first terminal and extending from the first region toward the second region; and a first wiring connected to the IC chip. a second terminal connected to the second terminal; a second wiring connected to the second terminal; and an external connection terminal connected to the second wiring; They are electrically connected to each other inside the IC chip.

FIG. 1 is an exploded perspective view showing the configuration of the display device DSP of this embodiment. FIG. 2 is a plan view showing the display panel PNL shown in FIG. FIG. 3 is a diagram showing the basic configuration and equivalent circuit of the display panel PNL shown in FIG. FIG. 4 is a cross-sectional view showing the structure of part of the display panel PNL shown in FIG. FIG. 5 is a diagram showing the configuration of the sensor SS. FIG. 6 is a plan view showing one configuration example of the sensor SS. FIG. 7 is a plan view showing another configuration example of the sensor SS. FIG. 8 is a diagram for explaining an example of the sensing method. FIG. 9 is a diagram for explaining the connection relationship in the display device DSP of this embodiment. FIG. 10 is a plan view showing one configuration example of the first substrate SUB1 shown in FIG. FIG. 11 is a cross-sectional view of the first substrate SUB1 cut along line AB shown in FIG. FIG. 12 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG. FIG. 13 is a cross-sectional view of the first substrate SUB1 cut along line CD shown in FIG. FIG. 14 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG. FIG. 15 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG. FIG. 16 is a diagram for explaining another configuration example of the display device DSP. FIG. 17 is a plan view showing one configuration example of the first substrate SUB1 shown in FIG. FIG. 18 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG. FIG. 19A is a cross-sectional view showing one configuration example of the connection member CM applicable to this embodiment. FIG. 19B is a cross-sectional view showing another configuration example of the connection member CM applicable to this embodiment. FIG. 20A is a cross-sectional view showing another configuration example of the connection member CM applicable to this embodiment. FIG. 20B is a cross-sectional view showing another configuration example of the connection member CM applicable to this embodiment. FIG. 21A is a cross-sectional view showing another configuration example of the connection member CM applicable to this embodiment. FIG. 21B is a cross-sectional view showing another configuration example of the connection member CM applicable to this embodiment. FIG. 22 is a diagram for explaining another configuration example of the display device DSP. FIG. 23 is a partially enlarged plan view of the first substrate SUB1 and the second substrate SUB2 shown in FIG.

Hereinafter, this embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive appropriate modifications while keeping the gist of the invention are, of course, included in the scope of the present invention. In addition, in order to make the description clearer, the drawings may schematically show the width, thickness, shape, etc. of each part compared to the actual embodiment, but this is only an example and does not apply to the present invention. It does not limit interpretation. In addition, in this specification and each figure, the same reference numerals are given to components that exhibit the same or similar functions as those described above with respect to the previous figures, and redundant detailed description may be omitted as appropriate. .

FIG. 1 is an exploded perspective view showing the configuration of the display device DSP of this embodiment. In the drawing, the first direction X and the second direction Y are directions crossing each other, and the third direction Z is a direction crossing the first direction X and the second direction Y. FIG. In one example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other. In this specification, the direction toward the tip of the arrow indicating the third direction Z is called upward (or simply upward), and the direction opposite from the tip of the arrow is called downward (or simply downward). Further, it is assumed that an observation position for observing the display device DSP is located on the tip side of the arrow indicating the third direction Z, and from this observation position, the XY plane defined by the first direction X and the second direction Y is observed. Looking at the plane is called planar viewing.

In this embodiment, a liquid crystal display device will be described as an example of a display device. The main configurations disclosed in the present embodiment include a self-luminous display device having an organic electroluminescence display element or the like, an electronic paper type display device having an electrophoresis element or the like, and MEMS (Micro Electro Mechanical Systems). It can also be applied to a display device to which electrochromism is applied, or a display device to which electrochromism is applied.

The display device DSP includes a display panel PNL, a driving IC chip 1 (first control section), a flexible substrate 3, and the like. The display panel PNL here is a liquid crystal display panel, and includes a first substrate SUB1, a second substrate SUB2, and a liquid crystal layer (liquid crystal layer LC described later). The first substrate SUB1 has a first area A1 and a second area A2. The first area A1 and the second area A2 are adjacent to each other in the second direction Y. As shown in FIG. The second substrate SUB2 faces the second area A2 of the first substrate SUB1. That is, the second region A2 is a region of the first substrate SUB1 facing the second substrate SUB2, and the first region A1 is the region of the first substrate SUB1 outside the edge SUBE of the second substrate SUB2. It is an area that extends to
The driving IC chip 1 and the flexible substrate 3 are connected to the first area A1. The drive IC chip 1 incorporates, for example, a display driver DD that outputs signals necessary for displaying an image on the display panel PNL. The display driver DD here includes at least part of a signal line driving circuit SD, a scanning line driving circuit GD, and a common electrode driving circuit CD, which will be described later. The flexible board 3 connects the display panel PNL and the external circuit board 5 .

FIG. 2 is a plan view showing the display panel PNL shown in FIG.
The first substrate SUB1 and the second substrate SUB2 are adhered to each other at the seal portion SE. The display panel PNL includes a display area DA for displaying an image and a frame-shaped non-display area NDA surrounding the display area DA. The display area DA is located inside surrounded by the seal portion SE. The display area DA and the non-display area NDA are areas corresponding to the second area A2 of the first substrate SUB1 shown in FIG.
The display panel PNL of the present embodiment is, for example, a transmissive type having a transmissive display function of displaying an image by selectively transmitting light from the lower surface side of the first substrate SUB1, but is limited to this. not a thing For example, the display panel PNL may be of a reflective type having a reflective display function of displaying an image by selectively reflecting light from the upper surface side of the second substrate SUB2, or may be of a transmissive display function and a reflective display. It may be of a transflective type with a function.

FIG. 3 is a diagram showing the basic configuration and equivalent circuit of the display panel PNL shown in FIG.
The display panel PNL includes a plurality of pixels PX in the display area DA. A plurality of pixels PX are arranged in a matrix in the first direction X and the second direction Y. As shown in FIG. The display panel PNL also includes a plurality of scanning lines G (G1 to Gn), a plurality of signal lines S (S1 to Sm), a common electrode CE, and the like in the display area DA. The scanning lines G extend in the first direction X and are arranged in the second direction Y. As shown in FIG. The signal lines S each extend in the second direction Y and are arranged in the first direction X. As shown in FIG. It should be noted that the scanning lines G and signal lines S do not necessarily have to extend linearly, and part of them may be curved. The common electrode CE is arranged over a plurality of pixels PX.
The scanning lines G are connected to a scanning line driving circuit GD. The signal line S is connected to the signal line driving circuit SD. The common electrode CE is connected to a common electrode driving circuit CD. The signal line driving circuit SD, the scanning line driving circuit GD, and the common electrode driving circuit CD may be formed on the first substrate SUB1, and some or all of them may be formed on the driving IC chip 1 shown in FIG. may be built in. Also, the layout of these drive circuits is not limited to the illustrated example. For example, the scanning line drive circuits GD may be arranged on both sides of the display area DA.
Each pixel PX includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like. The switching element SW is composed of, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S. The pixel electrode PE is electrically connected to the switching element SW. The pixel electrode PE faces the common electrode CE, and the electric field generated between the pixel electrode PE and the common electrode CE drives the liquid crystal layer LC. The storage capacitor CS is formed, for example, between the common electrode CE and the pixel electrode PE.

FIG. 4 is a cross-sectional view showing the structure of part of the display panel PNL shown in FIG.
The illustrated display panel PNL mainly has a configuration corresponding to a display mode that utilizes a horizontal electric field substantially parallel to the main surface of the substrate. It may have a configuration corresponding to an electric field, an electric field oblique to the main surface of the substrate, or a display mode using a combination thereof. In a display mode using a horizontal electric field, for example, a configuration in which both the pixel electrode PE and the common electrode CE are provided on the first substrate SUB1 is applicable. In a display mode using a vertical electric field or an oblique electric field, for example, a configuration in which the first substrate SUB1 is provided with the pixel electrode PE and the second substrate SUB2 is provided with the common electrode CE can be applied. The main surface of the substrate here is a surface parallel to the XY plane.

The first substrate SUB1 includes a first insulating substrate 10, signal lines S1 and S2, a common electrode CE, a pixel electrode PE, a first insulating film 11, a second insulating film 12, a third insulating film 13, a first alignment film AL1, and the like. It has In one example, the first insulating film 11 and the third insulating film 13 are made of an inorganic material such as silicon oxide or silicon nitride, and the second insulating film 12 is made of an organic material such as acrylic resin. Here, illustration of switching elements, scanning lines, and various insulating films interposed therebetween is omitted.
The first insulating substrate 10 is a substrate having optical transparency such as a glass substrate or a resin substrate. The first insulating film 11 is located on the first insulating substrate 10 . The signal lines S1 and S2 are located on the first insulating film 11 . The second insulating film 12 is located on the signal lines S1 and S2 and the first insulating film 11 . A common electrode CE is located on the second insulating film 12 . The third insulating film 13 is positioned on the common electrode CE and the second insulating film 12 . The pixel electrode PE is located on the third insulating film 13 . The pixel electrode PE faces the common electrode CE via the third insulating film. Also, the pixel electrode PE has a slit SL at a position facing the common electrode CE. The common electrode CE and pixel electrode PE are made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first alignment film AL1 covers the pixel electrode PE and the third insulating film 13 .
The pixel electrode PE may be positioned between the second insulating film 12 and the third insulating film 13, and the common electrode CE may be positioned between the third insulating film 13 and the first alignment film AL1. In such a case, the pixel electrode PE is formed in a flat plate shape without a slit for each pixel, and the common electrode CE has a slit facing the pixel electrode PE. Moreover, both the pixel electrode PE and the common electrode CE may be positioned on the same layer. For example, both the pixel electrode PE and the common electrode CE are positioned between the third insulating film 13 and the first alignment film AL1. may be located.

The second substrate SUB2 includes a second insulating substrate 20, a light blocking layer BM, color filters CF, an overcoat layer OC, a second alignment film AL2, and the like.
The second insulating substrate 20 is a substrate having optical transparency such as a glass substrate or a resin substrate. The light shielding layer BM and the color filters CF are located on the side of the second insulating substrate 20 facing the first substrate SUB1. The light shielding layer BM partitions each pixel and is arranged at a position facing the signal line S in the figure. The color filter CF is arranged at a position facing the pixel electrode PE and partly overlaps the light shielding layer BM. The color filters CF include red color filters, green color filters, blue color filters, and the like. An overcoat layer OC covers the color filters CF. The second alignment film AL2 covers the overcoat layer OC.
Note that the color filters CF may be arranged on the first substrate SUB1. Further, instead of arranging the light shielding layer BM, two or more layers of color filters of different colors may be laminated to reduce the transmittance and function as a light shielding layer. Pixels displaying white may be provided with a white color filter, may be provided with an uncolored resin material, or may be provided with an overcoat layer OC without providing a color filter. .

A sensor mounted on the display device DSP of the present embodiment includes a detection electrode Rx. In the illustrated example, the detection electrodes Rx are located on the outer surface SBA of the second substrate SUB2. The detection electrodes Rx are made of, for example, metal materials such as aluminum (Al), titanium (Ti), silver (Ag), molybdenum (Mo), tungsten (W), copper (Cu), chromium (Cr), or the like. It is formed of an alloy that combines materials, a transparent oxide material such as ITO or IZO, a conductive organic material, a dispersion of fine conductive substances, or the like.
Although not described in detail, the detection electrode Rx may have a single-layer structure, or may have a laminated structure in which a plurality of thin films are laminated. When the sensing electrode Rx has a laminated structure, for example, a multi-layered structure having an oxide conductive layer on a metal layer can be applied. When the detection electrodes Rx are formed of an oxide conductive layer, the shape of the detection electrodes Rx is, for example, strip-shaped. When the detection electrode Rx is formed of a metal layer, it is formed of fine metal wires, and the shape of the detection electrode Rx is, for example, wave-like, grid-like, or mesh-like. If necessary, the detection electrodes Rx may be covered with a protective film.

A first optical element OD1 including a first polarizing plate PL1 is positioned between the first insulating substrate 10 and the illumination device BL. A second optical element OD2 including a second polarizer PL2 is positioned above the detection electrode Rx. The first optical element OD1 and the second optical element OD2 may contain retardation plates as necessary. The first polarizing plate PL1 and the second polarizing plate PL2 are arranged, for example, in a crossed Nicols positional relationship in which their respective absorption axes are orthogonal to each other.

Next, a configuration example of the sensor SS mounted on the display device DSP of the present embodiment will be described. The sensor SS described below is, for example, a capacitance type, and detects contact or approach of an object to be detected based on a change in capacitance between a pair of electrodes facing each other via a dielectric. .

FIG. 5 is a diagram showing the configuration of the sensor SS.
In this embodiment, the sensor SS includes a sensor drive electrode (first electrode) Tx and a detection electrode (second electrode) Rx. The sensor drive electrode Tx includes the common electrode CE shown in FIG. 4 and is located between the second insulating film 12 and the third insulating film 13 on the first substrate SUB1. The detection electrodes Rx are located on the outer surface SBA of the second substrate SUB2, as shown in FIG.
The sensor drive electrodes Tx and detection electrodes Rx are located in the display area DA. In the illustrated example, the sensor drive electrodes Tx and the detection electrodes Rx each have a strip shape. The direction in which the sensor drive electrode Tx extends may be the first direction X shown in FIG. 3 or the second direction Y. As shown in FIG. The detection electrodes Rx extend in a direction intersecting with the sensor drive electrodes Tx. For example, if the sensor drive electrodes Tx extend in the first direction X and are spaced apart in the second direction Y, the detection electrodes Rx extend in the second direction Y and are spaced apart in the first direction X. lined up. On the other hand, when the detection electrodes Rx extend in the first direction X and are spaced apart in the second direction Y, the sensor drive electrodes Tx extend in the second direction Y and are spaced apart in the first direction X. lined up.
The sensor drive electrodes Tx are electrically connected to the common electrode drive circuit CD. The detection electrodes Rx are electrically connected to the detection circuit DC.

The common electrode drive circuit CD supplies a common drive signal to the sensor drive electrodes Tx including the common electrode CE during display drive for displaying an image. As a result, the sensor drive electrode Tx generates an electric field with the pixel electrode PE to drive the liquid crystal layer LC.
Further, the common electrode drive circuit CD supplies a sensor drive signal to the sensor drive electrode Tx during sensing drive for sensing for detecting contact or approach of the object to be detected. As a result, the sensor drive electrodes Tx generate capacitance with the detection electrodes Rx. As the sensor drive signal is supplied to the sensor drive electrode Tx, the detection electrode Rx generates a sensor signal necessary for sensing (that is, a signal based on a change in inter-electrode capacitance between the sensor drive electrode Tx and the detection electrode Rx). ). The detection circuit DC reads a sensor signal from the detection electrode Rx, detects the presence or absence of contact or approach of an object to be detected, and also detects the position coordinates of the object to be detected.

The number, size, and shape of the sensor drive electrodes Tx and the detection electrodes Rx are not particularly limited and can be changed in various ways. For example, the sensor drive electrode Tx may be formed in the shape of a single flat plate extending continuously over the entire display area DA. Also, the detection electrodes Rx may be formed in an island shape and arranged in the first direction X and the second direction Y in a matrix.

FIG. 6 is a plan view showing one configuration example of the sensor SS.
Each of the detection electrodes Rx extends in the first direction X and is arranged in the second direction Y at intervals. Each of the sensor drive electrodes Tx extends in the second direction Y and is arranged in the first direction X at intervals. Here, focusing on the detection electrodes Rx and the lead lines L, a specific layout thereof will be described.
The lead wires L are located on the same surface as the detection electrodes Rx (for example, the outer surface SBA shown in FIG. 4) on the second substrate SUB2. Such lead wires L are preferably made of a low-resistance metal material. In one example, the lead wire L is made of metal material such as aluminum (Al), titanium (Ti), silver (Ag), molybdenum (Mo), tungsten (W), copper (Cu), chromium (Cr). . One end of each of the lead wires L is electrically connected to each of the detection electrodes Rx. The other end side of each of the lead wires L is electrically connected to each of the terminals T2 in the terminal group TG2.
In the illustrated example, of the plurality of lead wires L, the lead wires L connected to the odd-numbered detection electrodes Rx are positioned in one non-display area NDA1 (that is, the non-display area on the right side of the display area DA). The lead lines L connected to the even-numbered detection electrodes Rx are located in the other non-display area NDA2 (for example, the non-display area on the left side of the display area DA).

FIG. 7 is a plan view showing another configuration example of the sensor SS.
The illustrated example differs from the configuration example shown in FIG. 6 in the layout of the lead lines L. As shown in FIG. In the illustrated example, among the plurality of lead lines L, the lead lines L connected to the detection electrodes Rx located in the upper half of the display area DA are located in one non-display area NDA1 and are located in the lower side of the display area DA. The lead lines L connected to the detection electrodes Rx located in the other half are located in the other non-display area NDA2.

Next, the principle of one example of a sensing method for detecting contact or approach of an object to be detected in the display device DSP described above will be described with reference to FIG.
A capacitance Cc exists between the sensor drive electrode Tx and the detection electrode Rx. A pulsed write signal (sensor drive signal) Vw is sequentially supplied to the sensor drive electrodes Tx at a predetermined cycle. In this example, it is assumed that a user's finger, which is an object to be detected, is present close to a position where a specific detection electrode Rx and a sensor drive electrode Tx intersect. A capacitance Cx is generated by an object to be detected that is close to the detection electrode Rx. When a write signal Vw is supplied to the sensor drive electrode Tx, a pulse-like read signal (sensor signal) Vr whose level is lower than pulses obtained from other detection electrodes is obtained from a specific detection electrode Rx. .
In the detection circuit DC shown in FIG. 5, based on the timing at which the write signal Vw is supplied to the sensor drive electrode Tx and the read signal Vr from each detection electrode Rx, the sensor SS is detected within the XY plane. Two-dimensional position information of the object to be detected can be detected. Further, the capacitance Cx described above differs depending on whether the object to be detected is close to the detection electrode Rx or far from it. Therefore, the level of the read signal Vr also differs depending on whether the object to be detected is close to the detection electrode Rx or far from it. Therefore, the detection circuit DC can detect the proximity of the object to the sensor SS based on the level of the read signal Vr.
Note that the sensor SS described above is a mutual capacitance sensor that detects an object based on a change in the capacitance between a pair of electrodes (the capacitance between the sensor drive electrode Tx and the detection electrode Rx in the above example). The method is not limited to the method, and a self-capacitance method that detects an object to be detected based on a change in the capacitance of the detection electrode Rx may be used.

FIG. 9 is a diagram for explaining the connection relationship in the display device DSP of this embodiment.
As shown, the first substrate SUB1 has a terminal T11 in the first area A1. The second substrate SUB2 has a terminal T2. These terminals T11 and T2 are electrically connected by a connecting member CM. The connection member CM does not protrude outside the display panel PNL in a plan view, and is located inside the edge of the first substrate SUB1 in the illustrated example. A connection structure using such a connection member CM will be described in detail later.
The terminal T2 is electrically connected to the detection electrode Rx via a lead wire L, as shown in FIG. The terminal T1 is connected to the wiring W1. The wiring W1 is electrically connected to the detection circuit DC, which will be described in detail later.

The display device DSP in the illustrated example includes a driving IC chip 1 containing a display driver DD, an IC chip 2 (second control section) containing a detection circuit DC, and a flexible substrate 3 . The driving IC chip 1 is connected to the first area A1. IC chip 2 is connected to flexible substrate 3 . An external circuit board 5 includes an application processor APP (third control unit) and is connected to the flexible board 3 . Transmission paths are formed between the application processor APP and the driving IC chip 1, between the application processor APP and the IC chip 2, and between the driving IC chip 1 and the IC chip 2, respectively. As a result, various signals can be exchanged between the application processor APP and the display driver DD, between the application processor APP and the detection circuit DC, and between the display driver DD and the detection circuit DC. It is configured.
For example, when driving the display, the application processor APP transmits various signals corresponding to graphic data and the like to the display driver DD. The display driver DD supplies a scanning signal to the scanning line G at a predetermined timing based on a signal received from the application processor APP, supplies a video signal to the signal line S, and functions as a common electrode CE. A common drive signal is supplied to the sensor drive electrode Tx.
During sensing driving, either one of the display driver DD and the detection circuit DC can generate a timing signal that informs when to drive the sensor SS, and this timing signal can be given to the other. Alternatively, the application processor APP can provide timing signals to the display driver DD and the detection circuit DC. The above timing signals allow the display driver DD and the detection circuit DC to be synchronized. The display driver DD supplies sensor drive signals to the sensor drive electrodes Tx based on control signals received from the application processor APP. The detection circuit DC reads sensor signals output from the detection electrodes Rx, generates signals corresponding to sensing results, and transmits the signals to the application processor APP. The application processor APP can perform various processing using signals received from the display driver DD.

FIG. 10 is a plan view showing one configuration example of the first substrate SUB1 shown in FIG.
The first substrate SUB1 includes a terminal T11 and a terminal T12 located in the first area A1, and a wiring W1 connecting between the terminal T11 and the terminal T12. The terminal T12 is located closer to the substrate end SUBA of the first substrate SUB1 than the drive IC chip 1 is.
The wiring W1 has one end portion W11, the other end portion W12, and a middle portion W13. One end portion W11 is located in the first region A, is connected to the terminal T11, and extends from the terminal T11 toward the second region A2 without going toward the substrate end portion SUBA. The other end W12 is located in the first region A, is connected to the terminal T12, and extends from the terminal T12 toward the second region A2 without going toward the substrate end SUBA. In the illustrated example, the middle portion W13 is located in the second area A2 and connects the one end portion W11 and the other end portion W12. In the illustrated example, the middle portions of all the wirings W1 connected to each of the terminals T11 are located in the second region A2, but only the middle portions of some of the wirings W1 are located in the second region A2. It is possible that you are.
In the illustrated example, the other end W12 of the wiring W1 is partially located below the driving IC chip 1. As shown in FIG. The flexible board 3 is connected to the terminal T12. The flexible substrate 3 has a wiring W3 that connects the terminal T12 and the IC chip 2 .

FIG. 11 is a cross-sectional view of the first substrate SUB1 cut along line AB shown in FIG.
On the first substrate SUB1, the other end W12 of the wiring W1 is positioned, for example, between the first insulating film 11 and the third insulating film 13, passes directly under the drive IC chip 1, and reaches the substrate edge of the first substrate SUB1. It extends to a position close to the part SUBA. The wiring W1 is made of the same metal material as the signal line S1 and the like described with reference to FIG. 4, but may be made of the same metal material as the scanning line and the like. The terminal T12 is located on the third insulating film 13 and is in contact with the other end W12 through a contact hole penetrating the third insulating film 13 . Such a terminal T12 is made of the same transparent conductive material as the pixel electrode PE described with reference to FIG. 4, for example. Instead of providing the terminal T12 separately from the wiring W1 as in the illustrated example, the exposed portion of the wiring W1 exposed at the position penetrating the third insulating film may be used as the terminal T12.
The driving IC chip 1 and the flexible substrate 3 are connected to the first substrate SUB1 by conductive adhesive layers 4A and 4B, respectively. The conductive adhesive layers 4A and 4B are, for example, anisotropic conductive films in which conductive particles are dispersed in an adhesive. The flexible substrate 3 includes a base layer 30, wiring W3, a cover layer 32, and the like. The wiring W3 is located on the side of the base layer 30 facing the first substrate SUB1. The cover layer 32 covers the wiring W3. The wiring W3 is exposed from the cover layer 32 at a position facing the terminal T12, and is electrically connected to the terminal T12 via the conductive particles 41B of the conductive adhesive layer 4B. The driving IC chip 1 is adhered to the first substrate SUB1 at a position overlapping the other end W12 of the wiring 1, but is not electrically connected to the wiring W1 in the illustrated cross section.

According to the present embodiment, in the first substrate SUB1, the terminals T11 electrically connected to the detection electrodes Rx of the second substrate SUB2 via the connection member CM and the detection circuit DC are electrically connected to each other. The wiring W1 extends from the terminal T11 toward the second region A2 without going toward the substrate end SUBA. Therefore, compared to the case where the wiring W1 extends from the terminal T11 toward the substrate end SUBA, the width of the first region A1 along the second direction Y can be reduced, and the frame can be narrowed. becomes.
Further, in the configuration in which the middle portion W13 of the wiring W1 is located in the second area A2, the installation area of the wiring W1 in the first area A1 can be reduced, and the area of the first area A1 can be reduced. . Therefore, it is possible to make the frame narrower.
In addition, in the configuration in which the detection circuit DC is built in the IC chip 2 connected to the flexible substrate 3, the wiring W1 passes directly under the driving IC chip 1 and extends to the terminal T12 to which the flexible substrate 3 is connected. . Therefore, the wiring length of each wiring W1 can be shortened and the installation area of the wiring W1 can be further reduced as compared with the case where the wiring W1 is arranged along a path that bypasses the driving IC chip 1. At the same time, the wiring resistance of the wiring W1 can be reduced.
Further, the connection member CM for connecting the first substrate SUB1 and the second substrate SUB2 does not protrude from the display panel PNL, and only the flexible substrate 3 connected to the first substrate SUB1 protrudes from the display panel PNL. It is connected to an external circuit board 5 . Therefore, compared with the case where each of the first substrate SUB1 and the second substrate SUB2 is connected to the circuit board 5 via separate flexible substrates, the number of flexible substrates can be reduced, simplifying the structure. It becomes possible to reduce the cost.
Further, since the flexible substrate 3 is unified, a connector for electrically connecting a plurality of flexible substrates to each other becomes unnecessary, and the size and thickness of the display device can be reduced.
Further, when the display device DSP to which the flexible substrate 3 is connected is set in the electronic device, contact between the structure inside the electronic device and the flexible substrate 3 can be suppressed, and the structure can be installed at a desired position. becomes possible.

Next, another configuration example will be described.

FIG. 12 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG.
The illustrated configuration example differs from the configuration example shown in FIG. 10 in the configuration of the first region A1 in the first substrate SUB1. That is, in the first area A1, the first substrate SUB1 includes, in addition to the terminals T11 and T12, a terminal T13, a terminal T14, and a wiring W2 connecting between the terminals T13 and T14. . Terminals T12 and T13 are positioned directly below the driving IC chip 1 . The terminals T12 and T13 are arranged along the long side of the driving IC chip 1, respectively. The terminal T14 is located closer to the substrate end SUBA of the first substrate SUB1 than the drive IC chip 1 is. In the first substrate SUB1, the terminals T13 and T14 are electrically connected.
The driving IC chip 1 is connected to terminals T12 and T13. Although not described in detail, the driving IC chip 1 electrically connects the terminal T12 and the terminal T13 inside thereof. The flexible board 3 is connected to the terminal T14. The flexible substrate 3 has a wiring W3 that connects the terminal T14 and the IC chip 2 . Note that the wiring W1 connecting between the terminal T11 and the terminal T12 is configured in the same manner as in the configuration example shown in FIG. 10, and detailed description thereof is omitted. It extends toward the area A2, and the middle portion W13 is located in the second area A2.

FIG. 13 is a cross-sectional view of the first substrate SUB1 cut along line CD shown in FIG.
In the first substrate SUB1, the other end W12 of the wiring W1 and the wiring W2 are located between the first insulating film 11 and the third insulating film 13, for example. The other end W12 extends directly below the driving IC chip 1. As shown in FIG. The wiring W2 is separated from the other end W12, passes directly under the driving IC chip 1, and extends to a position close to the substrate end SUBA. Each of the terminals T12 to T14 is located on the third insulating film 13. As shown in FIG. The terminal T12 is in contact with the other end W12. Terminals T13 and T14 are in contact with wiring W2, respectively.
Terminals T22 and T23 of drive IC chip 1 are electrically connected to terminals T12 and T13 by conductive particles 42A and 43B of conductive adhesive layer 4A, respectively. The flexible substrate 3 is electrically connected to the terminal T14 by the conductive particles 41B of the conductive adhesive layer 4B.
The configuration examples shown in FIGS. 12 and 13 also provide the same effects as the configuration example described above.

FIG. 14 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG.
The illustrated configuration example differs from the configuration example shown in FIG. 10 in that the entire first wiring W1 is located in the first region A1. That is, in the wiring W1, the one end portion W11, the other end portion W12, and the middle portion W13 are all located in the first region A1. More specifically, the one end portion W11 extends from the terminal T11 toward the second area A2, but is connected to the middle portion W13 without reaching the second area A2. Similarly, the other end portion W12 extends from the terminal T12 toward the second area A2, but is connected to the middle portion W13 without reaching the second area A2. The middle portion W13 connects the one end portion W11 and the other end portion W12 in the first region A1.
Further, in the illustrated example, the connecting portion between the other end portion W12 and the middle portion W13 of the wiring W1 is located below the driving IC chip 1 .
Even in such a configuration example, the same effect as the above configuration example can be obtained. In addition, since the wiring W1 is entirely located in the first area A1, the scanning lines and signal lines located in the second area A2 can be easily laid out without considering the layout of the wiring W1.

FIG. 15 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG.
The illustrated configuration example differs from the configuration example shown in FIG. 14 in the configuration of the first region A1 in the first substrate SUB1. 12, in the first area A1, in addition to the terminals T11 and T12, the first substrate SUB1 has a terminal T13, a terminal T14, and a terminal T13 and a terminal T14. and a wiring W2 for connecting the . Terminals T12 and T13 are positioned directly below the driving IC chip 1 . The terminal T12 is arranged along the short side of the driving IC chip 1, and the terminal T13 is arranged along the long side of the driving IC chip 1. FIG. The terminal T14 is located closer to the substrate end SUBA of the first substrate SUB1 than the drive IC chip 1 is.
13, the driving IC chip 1 has terminals T22 and T23 at positions corresponding to the terminals T12 and T13, respectively, and the terminals T22 and T23 are electrically connected inside the driving IC chip 1. electrically connects the terminal T12 and the terminal T13. The flexible board 3 is connected to the terminal T14. The wiring W1 connecting between the terminal T11 and the terminal T12 is configured in the same manner as in the configuration example shown in FIG. are doing.
In the configuration example shown in FIG. 15 as well, the same effects as in the configuration example shown in FIG. 14 can be obtained.

FIG. 16 is a diagram for explaining another configuration example of the display device DSP.
The illustrated configuration example differs from the configuration example shown in FIG. 9 in that the drive IC chip 1 incorporates a detection circuit DC in addition to the display driver DD. A transmission line is formed between the application processor APP on the circuit board 5 and the driving IC chip 1 . As a result, various signals can be exchanged between the application processor APP and the display driver DD, and between the application processor APP and the detection circuit DC. Further, inside the driving IC chip 1, various signals can be exchanged between the display driver DD and the detection circuit DC.

FIG. 17 is a plan view showing one configuration example of the first substrate SUB1 shown in FIG.
The first substrate SUB1 includes a terminal T11 and a terminal T12 located in the first area A1, and a wiring W1 connecting between the terminal T11 and the terminal T12. The terminal T12 is positioned directly below the driving IC chip 1 and arranged along the long side of the driving IC chip 1. As shown in FIG.
In the wiring W1, one end portion W11 extends from the terminal T11 of the first area A1 toward the second area A2. The other end W12 extends from the terminal T12 in the first area A1 toward the second area A2. The middle portion W13 is located in the second region A2 and connects the one end portion W11 and the other end portion W12. The driving IC chip 1 is connected to the terminal T12. The driving IC chip 1 has a terminal T22 at a position corresponding to the terminal T12 as in FIG. 13, and the terminals T12 and T22 are electrically connected. The terminal T22 and the detection circuit DC are electrically connected inside the driving IC chip 1 to transmit and receive signals.
Even in such a configuration example, the same effect as the above configuration example can be obtained. In addition, since the IC chip 2 is omitted and the detection circuit RC is built in the driving IC chip 1, the flexible substrate 3 can be made smaller and thinner.

FIG. 18 is a plan view showing another configuration example of the first substrate SUB1 shown in FIG.
The illustrated configuration example differs from the configuration example shown in FIG. 17 in that the entire first wiring W1 connecting between the terminal T11 and the terminal T12 is located in the first region A1. there is The terminal T<b>12 is located directly below the driving IC chip 1 and arranged along the short side of the driving IC chip 1 .
The driving IC chip 1 has a terminal T22 at a position corresponding to the terminal T12 as in FIG. 13, and the terminals T12 and T22 are electrically connected. The terminal T22 and the terminal T12 are electrically connected inside the driving IC chip 1 . The terminal T22 and the detection circuit DC are electrically connected inside the driving IC chip 1 .
In the configuration example shown in FIG. 18 as well, the same effects as in the configuration example shown in FIG. 17 can be obtained.

FIG. 19A is a cross-sectional view showing one configuration example of a connecting member CM that corresponds to, for example, FIGS. 10, 12, and 17 and can be applied to the present embodiment.
The illustrated configuration example corresponds to the case where the connection member CM is the flexible wiring board 7 .
In FIG. 19A, in the first substrate SUB1, one end portion W11 of the wiring W1 is positioned, for example, between the first insulating film 11 and the third insulating film 13, extends from the terminal T11 to the second region, and extends from the terminal T11 to the second region. It is connected to the middle portion W13 within the area. The terminal T11 is located on the third insulating film 13 and is in contact with the one end portion W11 through a contact hole penetrating the third insulating film 13 .
In the second substrate SUB2, the lead wire L and the terminal T2 are located on the outer surface SBA of the second substrate SUB2.
The flexible wiring board 7 includes a base layer 70 , a conductive layer 71 and a cover layer 72 . The conductive layer 71 is located on the side of the base layer 70 facing the display panel PNL, and extends from a position facing the first substrate SUB1 to a position facing the second substrate SUB2. The cover layer 72 covers the conductive layer 71 . The conductive layer 71 is exposed from the cover layer 72 at a position facing the terminal T11, and is electrically connected to the terminal T11 via the conductive particles 44C of the conductive adhesive layer 4C. Also, the conductive layer 71 is exposed from the cover layer 72 at a position facing the terminal T2, and is electrically connected to the terminal T2 via the conductive particles 45D of the conductive adhesive layer 4D. As a result, the terminal T11 and the terminal T2 are electrically connected to each other through the conductive layer 71 of the flexible wiring board 7. As shown in FIG. The conductive adhesive layers 4C and 4D are both anisotropic conductive films, for example. The flexible wiring board 7 is connected to the first substrate SUB1 and the second substrate SUB2 by, for example, thermocompression bonding.
FIG. 19B is a cross-sectional view showing another configuration example of the connection member CM that corresponds to, for example, FIGS. 14, 15, and 18 and can be applied to this embodiment. In FIG. 19B, in the first substrate SUB1, one end portion W11 of the wiring W1 is positioned, for example, between the first insulating film 11 and the third insulating film 13, and is connected to the middle portion W13 within the first region. . Other structures are the same as in FIG. 19A.

FIG. 20A is a cross-sectional view showing another configuration example of the connecting member CM that corresponds to, for example, FIGS. 10, 12, and 17 and can be applied to the present embodiment.
The illustrated configuration example corresponds to the case where the connection member CM is the conductive paste 8 . A fillet 81 is arranged in the first region A1 of the first substrate SUB1 to reduce the difference in level with the second substrate SUB2. The conductive paste 8 is made by, for example, dispersing a conductive material such as silver in a resin material. The conductive paste 8 is placed on the terminal T11, on the slope of the fillet 81, and on the terminal T2, and connected to each other. Thereby, the terminal T11 and the terminal T2 are electrically connected to each other through the conductive paste 8. As shown in FIG. Such a conductive paste 8 is obtained, for example, by applying it using a dispenser or a screen printing plate and then subjecting it to curing treatment by ultraviolet irradiation or heating. In FIG. 20A, in the first substrate SUB1, one end W11 of the wiring W1 is positioned, for example, between the first insulating film 11 and the third insulating film 13, extends from the terminal T11 to the second region, and extends from the terminal T11 to the second region. It is connected to the middle portion W13 within the area.
FIG. 20B is a cross-sectional view showing another configuration example of the connection member CM that corresponds to, for example, FIGS. 14, 15, and 18 and can be applied to this embodiment. In FIG. 20B, in the first substrate SUB1, one end portion W11 of the wiring W1 is located, for example, between the first insulating film 11 and the third insulating film 13, and is connected to the middle portion W13 within the first region. . Other structures are the same as in FIG. 20A.

FIG. 21A is a cross-sectional view showing another configuration example of the connection member CM that corresponds to, for example, FIGS. 10, 12, and 17 and is applicable to the present embodiment.
The illustrated configuration example corresponds to the case where the connection member CM is the wire 9 . Wires 9 are connected to terminals T11 and T2, respectively. Thereby, the terminal T11 and the terminal T2 are electrically connected to each other through the wire 9. FIG. Such wires 9 are connected by a technique such as wire bonding, for example. In FIG. 21A, in the first substrate SUB1, one end portion W11 of the wiring W1 is located, for example, between the first insulating film 11 and the third insulating film 13, extends from the terminal T11 to the second region, and extends from the terminal T11 to the second region. It is connected to the middle portion W13 within the area.
FIG. 21B is a cross-sectional view showing another configuration example of the connection member CM that corresponds to, for example, FIGS. 14, 15, and 18 and can be applied to the present embodiment. In FIG. 21B, in the first substrate SUB1, one end portion W11 of the wiring W1 is located, for example, between the first insulating film 11 and the third insulating film 13, and is connected to the middle portion W13 within the first region. . Other structures are the same as in FIG. 20A.

FIG. 22 is a diagram for explaining another configuration example of the display device DSP.
The illustrated configuration example differs from each of the configuration examples described above in that it includes a single flexible substrate 100 having both the functions of the connection member CM and the flexible substrate 3 . That is, the flexible substrate 100 includes a first portion 110 for connecting the first substrate SUB1 and the second substrate SUB2, and a second portion 120 for connecting the first substrate SUB1 and the external circuit substrate 5. contains. The first portion 110 does not protrude outside the display panel PNL in a plan view, and is located inside the edge of the first substrate SUB1 in the illustrated example.

FIG. 23 is a partially enlarged plan view of the first substrate SUB1 and the second substrate SUB2 shown in FIG. In the drawing, the flexible substrate 100 is indicated by dotted lines.
The first substrate SUB1 includes, in the first region A1, a terminal group TG1 having a plurality of terminals T11, a terminal group TGD having a plurality of dummy terminals TD, and a terminal group TG3 having a plurality of terminals T30. I have. Note that the dummy terminals TD are provided as required, and the number thereof is arbitrary, and may be omitted. The terminal T11, the dummy terminal TD, and the terminal T30 are positioned on the same straight line along the substrate edge SUBA of the first substrate SUB1.
The second substrate SUB2 has a terminal group TG2 having a plurality of terminals T2. The second substrate SUB2 may have dummy terminals in addition to the terminals T2, if necessary. The terminal T2 is positioned on the same straight line along the substrate end SUBE of the second substrate SUB2.
The terminal T11 is electrically connected to the terminal T2 by the first portion 110 of the flexible substrate 100. As shown in FIG. For the connection structure of the terminals T11 and T2, for example, the configuration example described with reference to FIG. 19 can be applied. Each of the terminals T11 is connected to the wiring W1. The wiring W1 extends toward the second area A2. In the illustrated example, as described with reference to FIG. 14 and the like, the middle portion of the wiring W1 is located in the first area A1. Note that the middle portion of the wiring W1 may be positioned in the second area A2 as described with reference to FIG. 10 and the like. The end of the wiring W1 may be connected to the terminal T30 as in FIG. 10 or the like, or may be connected to the terminal connected to the drive IC chip 1 as in FIG.
The terminal T30 is mainly a terminal electrically connected to the driving IC chip 1, and may include a terminal electrically connected to the terminal T11 as described above.
In such a configuration example, the first portion 110 of the flexible substrate 100 connects the terminals T11 of the terminal group TG1 and the terminals T2 of the terminal group TG2, and the second portion 120 of the flexible substrate 100 connects the terminals It is connected to each terminal T30 of group TG3. According to such a configuration example, the first portion 110 and the second portion 120 of the flexible substrate 100 can be connected in one mounting process, compared to the case where the connection member CM and the flexible substrate 3 are provided separately. It is possible to simplify the manufacturing process.

As described above, according to the present embodiment, it is possible to provide a sensor-equipped display device capable of narrowing the frame.

It should be noted that although several embodiments of the invention have been described, these embodiments are provided by way of example and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and its equivalents.

DSP...Display device PNL...Display panel SS...Sensor SUB1...First substrate A1...First area A2...Second area SUB2...Second substrate 1...IC chip 2...Drive IC chip 3...Flexible substrate Rx...Detection electrode Tx... Sensor drive electrode CM... Connection member 7... Flexible wiring board 8... Conductive paste 9... Wire DD... Display driver DC... Detection circuit

Claims (4)

a first substrate having a first region and a second region adjacent to the first region;
a second substrate facing the second area having a display area;
an IC chip arranged in the first region;
a first terminal connected to the IC chip;
a first wiring connected to the first terminal and extending from the first region toward the second region;
a second terminal connected to the IC chip;
a second wiring arranged in the first region and connected to the second terminal;
an external connection terminal arranged in the first region and connected to the second wiring;
a flexible substrate including a detection circuit connected to the external connection terminal ;
the first terminal, the second terminal, and the external connection terminal are arranged on the same straight line parallel to the extending direction of the first wiring;
The display device, wherein the first terminal and the second terminal are electrically connected to each other inside the IC chip. 2. The display device according to claim 1, wherein part of said first wiring is located in said second region. Furthermore, comprising a detection electrode superimposed on the display area,
2. The display device according to claim 1 , wherein said detection circuit is electrically connected to said detection electrode via said first wiring. Further, a plurality of pixels arranged in a matrix in the second region;
a plurality of scanning lines extending in the row direction;
a plurality of signal lines extending in a column direction intersecting the row direction;
4. The display device according to any one of claims 1 to 3 , comprising a plurality of sensor drive electrodes.

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