JP7280498B2 - 光源装置 - Google Patents
光源装置 Download PDFInfo
- Publication number
- JP7280498B2 JP7280498B2 JP2019107918A JP2019107918A JP7280498B2 JP 7280498 B2 JP7280498 B2 JP 7280498B2 JP 2019107918 A JP2019107918 A JP 2019107918A JP 2019107918 A JP2019107918 A JP 2019107918A JP 7280498 B2 JP7280498 B2 JP 7280498B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- light source
- wavelength
- modules
- source device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4056—Edge-emitting structures emitting light in more than one direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019107918A JP7280498B2 (ja) | 2019-06-10 | 2019-06-10 | 光源装置 |
| EP20178670.4A EP3754800B1 (en) | 2019-06-10 | 2020-06-08 | Light source device |
| US16/895,565 US11394177B2 (en) | 2019-06-10 | 2020-06-08 | Light source device |
| CN202010521727.XA CN112072464B (zh) | 2019-06-10 | 2020-06-10 | 光源装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019107918A JP7280498B2 (ja) | 2019-06-10 | 2019-06-10 | 光源装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020202281A JP2020202281A (ja) | 2020-12-17 |
| JP2020202281A5 JP2020202281A5 (https=) | 2022-05-19 |
| JP7280498B2 true JP7280498B2 (ja) | 2023-05-24 |
Family
ID=71069723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019107918A Active JP7280498B2 (ja) | 2019-06-10 | 2019-06-10 | 光源装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11394177B2 (https=) |
| EP (1) | EP3754800B1 (https=) |
| JP (1) | JP7280498B2 (https=) |
| CN (1) | CN112072464B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208753726U (zh) * | 2018-09-13 | 2019-04-16 | 上海高意激光技术有限公司 | 非稳腔光谱合束装置 |
| JP2021118271A (ja) * | 2020-01-27 | 2021-08-10 | パナソニックIpマネジメント株式会社 | レーザ発振器及びレーザ加工方法 |
| CN114994934B (zh) * | 2022-07-19 | 2022-10-21 | 中国科学院长春光学精密机械与物理研究所 | 光谱合束装置及方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183426A (ja) | 2003-12-16 | 2005-07-07 | Sony Corp | 外部共振器型半導体レーザおよび半導体レーザ |
| JP2006324561A (ja) | 2005-05-20 | 2006-11-30 | Sony Corp | レーザ装置および回折格子の駆動方法 |
| US20070030865A1 (en) | 2005-08-05 | 2007-02-08 | Daylight Solutions | External cavity tunable compact mid-IR laser |
| WO2015145608A1 (ja) | 2014-03-26 | 2015-10-01 | 株式会社島津製作所 | レーザ装置 |
| CN105428996A (zh) | 2015-12-09 | 2016-03-23 | 中国科学院长春光学精密机械与物理研究所 | 基于多光栅结构的半导体激光器合束装置及合束方法 |
| JP2016054295A (ja) | 2014-09-01 | 2016-04-14 | 三菱電機株式会社 | 波長結合外部共振器型レーザ装置 |
| WO2018173109A1 (ja) | 2017-03-21 | 2018-09-27 | 三菱電機株式会社 | レーザ発振器及びレーザ加工装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6192062B1 (en) * | 1998-09-08 | 2001-02-20 | Massachusetts Institute Of Technology | Beam combining of diode laser array elements for high brightness and power |
| JP2008153379A (ja) * | 2006-12-15 | 2008-07-03 | Sharp Corp | 波長検出装置および波長検出方法 |
| US8179594B1 (en) * | 2007-06-29 | 2012-05-15 | Lockheed Martin Corporation | Method and apparatus for spectral-beam combining of fanned-in laser beams with chromatic-dispersion compensation using a plurality of diffractive gratings |
| US9093822B1 (en) * | 2010-12-20 | 2015-07-28 | TeraDiode, Inc. | Multi-band co-bore-sighted scalable output power laser system |
| US9823480B2 (en) * | 2012-02-22 | 2017-11-21 | TeraDiode, Inc. | Wavelength beam combining laser systems with micro-optics |
| US9335551B2 (en) * | 2012-11-28 | 2016-05-10 | TeraDiode, Inc. | Welding techniques using multi-wavelength beam combining systems |
| US20140268352A1 (en) * | 2013-03-15 | 2014-09-18 | Trumpf Photonics, Inc. | Devices for interleaving laser beams |
| US9690107B2 (en) * | 2013-03-15 | 2017-06-27 | Trumpf Laser Gmbh | Device for wavelength combining of laser beams |
| JPWO2017022142A1 (ja) * | 2015-08-04 | 2017-11-30 | 三菱電機株式会社 | 半導体レーザ装置 |
| WO2017127526A1 (en) * | 2016-01-20 | 2017-07-27 | TeraDiode, Inc. | Wavelength beam combining laser systems utilizing prisms for beam quality improvement and bandwidth reduction |
| GB2556197B (en) * | 2016-09-30 | 2021-11-24 | Nichia Corp | Light source device |
-
2019
- 2019-06-10 JP JP2019107918A patent/JP7280498B2/ja active Active
-
2020
- 2020-06-08 EP EP20178670.4A patent/EP3754800B1/en active Active
- 2020-06-08 US US16/895,565 patent/US11394177B2/en active Active
- 2020-06-10 CN CN202010521727.XA patent/CN112072464B/zh active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183426A (ja) | 2003-12-16 | 2005-07-07 | Sony Corp | 外部共振器型半導体レーザおよび半導体レーザ |
| JP2006324561A (ja) | 2005-05-20 | 2006-11-30 | Sony Corp | レーザ装置および回折格子の駆動方法 |
| US20070030865A1 (en) | 2005-08-05 | 2007-02-08 | Daylight Solutions | External cavity tunable compact mid-IR laser |
| WO2015145608A1 (ja) | 2014-03-26 | 2015-10-01 | 株式会社島津製作所 | レーザ装置 |
| JP2016054295A (ja) | 2014-09-01 | 2016-04-14 | 三菱電機株式会社 | 波長結合外部共振器型レーザ装置 |
| CN105428996A (zh) | 2015-12-09 | 2016-03-23 | 中国科学院长春光学精密机械与物理研究所 | 基于多光栅结构的半导体激光器合束装置及合束方法 |
| WO2018173109A1 (ja) | 2017-03-21 | 2018-09-27 | 三菱電機株式会社 | レーザ発振器及びレーザ加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20200388990A1 (en) | 2020-12-10 |
| EP3754800A1 (en) | 2020-12-23 |
| JP2020202281A (ja) | 2020-12-17 |
| US11394177B2 (en) | 2022-07-19 |
| CN112072464A (zh) | 2020-12-11 |
| EP3754800B1 (en) | 2023-02-22 |
| CN112072464B (zh) | 2024-01-05 |
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