JP7273636B2 - Adhesive holding jig and its manufacturing method - Google Patents

Description

TECHNICAL FIELD The present invention relates to an adhesive holding jig and a manufacturing method thereof.

As an adhesive holding jig used for transporting electronic components such as ceramic capacitors, chip resistors, coils, and semiconductor wafers, for example, Patent Document 1 describes an energy ray-curable adhesive layer formed on the surface of a base material. An adhesive sheet is disclosed. This pressure-sensitive adhesive sheet uses the adhesive strength of the pressure-sensitive adhesive layer to hold electronic components on the surface of the pressure-sensitive adhesive sheet, and can be conveyed while holding the electronic components. The adhesive sheet can be peeled off from the electronic component by irradiating the adhesive layer with energy rays such as ultraviolet rays to cure the adhesive layer and weaken the adhesive strength of the adhesive layer.

JP 2009-245989 A

However, in the adhesive sheet of Patent Document 1, the polymerization reaction occurs not only with energy rays but also with heating, so that the adhesive layer hardens and loses its adhesive strength. Therefore, it is difficult to carry out a thermal inspection while holding the electronic component on the adhesive sheet.
Moreover, the adhesive sheet of Patent Document 1 has a problem that the adhesive sheet cannot be used repeatedly because the polymerization reaction for causing a decrease in adhesive strength is irreversible.

The present invention has been made in view of the above circumstances, and provides a heat-resistant adhesive holding jig that can be used repeatedly, and a method for manufacturing the same.

The adhesive holding jig of the present invention comprises a substrate and a fluorine-containing elastomer layer formed on the substrate, and the fluorine-containing elastomer layer has a surface roughness Ra of 0.1 μm or more and 1.2 μm or less.

The fluorine-containing elastomer layer may contain filler.

The average particle size of the filler is preferably 25% or more and 400% or less of the thickness of the elastomer layer.

The thickness of the fluorine-containing elastomer layer is preferably 5 μm or more and 80 μm or less.

The substrate is preferably a glass substrate, a metal substrate or a resin substrate.

A primer layer is disposed between the substrate and the fluorine-containing elastomer layer, and the thickness of the primer layer is preferably 1 μm or less.

The method for producing an adhesive holding jig according to the present invention is a method for producing an adhesive holding jig having a substrate and a fluorine-containing elastomer layer in this order. A method for manufacturing an adhesive holding jig that forms an elastomer-containing layer.

In the method for manufacturing an adhesive holding jig of the present invention, the thickness of the fluorine-containing elastomer layer is preferably 5 μm or more and 80 μm or less.

Moreover, in the method for manufacturing an adhesive holding jig of the present invention, the viscosity of the fluorine-containing elastomer composition is preferably 1 Pa·s or more and 20 Pa·s or less.

According to the adhesive holding jig of the present invention, it has heat resistance and can be used repeatedly.
Moreover, according to the adhesive holding jig manufacturing method of the present invention, it is possible to obtain an adhesive holding jig that has heat resistance and can be used repeatedly.

1 is a cross-sectional view showing an embodiment of an adhesive holding jig of the present invention; FIG. 1 is an enlarged photograph of an adhesive surface when an elastomer layer is formed at 750 rpm using the composition of Formulation A. FIG. 1 is an enlarged photograph of an adhesive surface when an elastomer layer is formed at 750 rpm using the composition of Formulation B. FIG. 1 is an enlarged photograph of an adhesive surface when an elastomer layer is formed at 750 rpm using the composition of Formulation C. FIG. 1 is an enlarged photograph of an adhesive surface when an elastomer layer is formed at 750 rpm using the composition of Formulation D. FIG.

[Adhesive holding jig]
An adhesive holding jig according to one embodiment of the present invention is a flat adhesive holding jig 10 having a fluorine-containing elastomer layer 13 on a substrate 11, as shown in FIG. Primer layer 12 is arranged for the purpose of improving adhesion between substrate 11 and fluorine-containing elastomer layer 13 (hereinafter, the fluorine-containing elastomer layer may be simply referred to as "elastomer layer").

(substrate)
The material of the substrate 1 is not particularly limited, and is appropriately selected according to the desired heat resistance. Examples thereof include glass, semiconductors, ceramics, heat-resistant resins, metals, and resins. Among these, glass and low-thermal-expansion metals are preferred because they expand less when heated.
The thickness of the substrate 1 is not particularly limited, and is appropriately selected according to the application. The thickness of the substrate 1 is, for example, 0.1 mm or more and 5 mm or less.
The shape of the substrate 1 and the adhesive holding jig 10 in a plan view is not particularly limited, and examples thereof include a tape shape with a width of 10 mm or more and 100 mm or less, a flat plate shape with an area of 50 cm ² or more and 500 cm ² or less, or a disk shape with a diameter of 10 cm or more and 30 cm or less. is mentioned.

(elastomer layer)
-Surface roughness-
The surface roughness Ra of the elastomer layer 3 is 0.1 μm or more and 1.2 μm or less.
When the surface roughness Ra is 0.1 μm or more, the adhesive strength of the elastomer layer 3 to electronic parts is moderately weakened. Therefore, an appropriate adhesive force can be obtained, and the electronic component can be adhered to the adhesive layer at a desired stage and easily picked up. A surface roughness of 1.2 μm or less can prevent the adhesion of the elastomer layer 3 to the electronic component from being excessively weakened. Therefore, an appropriate adhesive strength can be obtained, and the electronic component can be reliably held.
The adhesive surface of the elastomer layer 3 is preferably a flat surface rather than a curved surface from the viewpoint of reflecting the surface roughness on the adhesive force.

In the present invention, the surface roughness Ra of the elastomer layer 3 is the arithmetic mean roughness Ra described in JIS B 0601:2001.

-Adhesive force-
The adhesive strength (unit: N/25 mm width) of the adhesive surface of the elastomer layer 3 is measured according to the 90 degree peeling adhesive strength measurement method of the adhesive tape/adhesive sheet test method of JIS Z0237.
Specifically, the adhesive force is measured by the following method with reference to JIS Z0237. First, the adhesive surface to be measured is horizontally fixed, and the measurement environment is set to 23±1° C. and 50±5% humidity. Next, after cutting a polyimide film having a thickness of 25 μm into a width of 25 mm, it is attached to the adhesive surface using a 2 kg rubber roller. A 90 degree peel test is then performed within 1 minute.
After chucking the polyimide film in the tensile tester, the tensile tester is operated at a speed of 5±0.2 mm/sec. Adhesion is measured at a peeling speed (pulling speed) of 300 mm/min.
The adhesive strength measured in this manner is preferably 0.10 N/25 mm or more and 0.70 N/25 mm or less, more preferably 0.20 N/25 mm or more and 0.60 N/25 mm or less, and 0.30 N/25 mm or more and 0.30 N/25 mm or more. 50 N/25 mm or less is more preferable.
When the adhesive strength is 0.10 N/25 mm or more, the electronic component can be attached to the adhesive layer at a desired stage and easily lifted. Moreover, since the adhesive strength is 0.70 N/25 mm or less, the electronic component can be reliably peeled off.

-Thickness-
The thickness of the elastomer layer 3 is preferably 5 μm or more and 80 μm or less, more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 25 μm or less.
When the thickness of the elastomer layer 3 is 5 μm or more, the adhesive strength of the elastomer layer 3 can be stably exhibited. Moreover, since the thickness of the elastomer layer 3 is 80 μm or less, it becomes possible to peel off the part to be adhered and held. Variation in thickness due to heating is reduced, and the accuracy of dimensional measurement can be improved in the heat test of the electronic component held on the adhesive surface.

－Filler－
The surface roughness and adhesion of the elastomer layer 3 can be easily adjusted by including a filler in the elastomer layer 3 .
Examples of fillers include organic fillers such as urethane, acrylic and melamine; inorganic fillers such as calcium carbonate, silica and mica; and metal fillers such as iron and lead.
Examples of silica include silica synthesized by a dry method such as fumed silica and pyrogenic silica, and silica synthesized by a wet method such as precipitated silica and silica gel. Examples of organic fillers include polyethersulfone (PES), polyimide (PI), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkyl A vinyl ether copolymer (PFA) may be mentioned.

Further, the surface of the filler is preferably coated with an organic substance from the viewpoint of suppressing aggregation of the fillers and facilitating uniform dispersion of the fillers in the elastomer layer 3 . The organic substance may be a low-molecular-weight organic compound, but is preferably an organic polymer from the viewpoint of enhancing dispersibility. Examples of organic polymers include polyethylene, polypropylene, polystyrene, polyester, fluororesin (eg, polytetrafluoroethylene), polyimide, polyphenylene sulfide, polyamide, and polycarbonate.

The average particle size of the filler is preferably 25% or more and 400% or less, more preferably 50% or more and 200% or less, and 80% or more and 120% or less of the thickness (100%) of the elastomer layer 3. is more preferable. Specifically, for example, it is preferably 5 μm or more and 80 μm or less, more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 25 μm or less.
When the average particle size of the filler is within the above range, the desired adhesive strength can be easily adjusted.

The content of the filler in the elastomer layer 3 is preferably 0.1 parts by mass or more and 10 parts by mass or less, and 0.5 parts by mass or more and 8 parts by mass with respect to 100 parts by mass of the solid content of the elastomer resin constituting the elastomer layer 3. Part or less is more preferable, and 1 part by mass or more and less than 5 parts by mass is even more preferable. When the content of the filler in the elastomer layer 3 is within the above range, it is possible to easily obtain an appropriate adhesive force.

- Fluorine-containing elastomer -
As the fluorine-containing elastomer forming the elastomer layer 3, for example, a thermosetting fluorine-containing elastomer having heat resistance capable of withstanding a heating test at 50°C or higher and 150°C or lower is preferable. Such elastomers include, for example, fluorosilicone rubber and liquid fluoroelastomer manufactured by Shin-Etsu Chemical Co., Ltd., fluorosilicone rubber and liquid fluorosilicone rubber manufactured by Dow Toray Industries, Inc., and Momentive Performance Materials Japan Co., Ltd. and fluorosilicone rubber.

-Other ingredients-
In addition to the filler, the elastomer layer 3 may contain additives such as diluents, colorants such as pigments and dyes, tackifiers and leveling agents. In addition, general-purpose pressure-sensitive adhesives such as rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based adhesives other than elastomers containing fluorine may also be included.
However, compared with fluorine-containing elastomers, rubber-based, acrylic-based, and polyvinyl ether-based materials are inferior in heat resistance, and silicone-based materials have the problem of contamination with low-molecular-weight siloxane components that adhere to electronic parts. Therefore, even if these general-purpose pressure-sensitive adhesives are included, they are preferably contained in a small amount, preferably 5 parts by mass or less with respect to 100 parts by mass of the fluorine-containing elastomer.

(primer layer)
A primer layer 2 between elastomer layer 3 and substrate 1 improves the adhesion of elastomer layer 3 to substrate 1 . The primer layer 2 may be a single layer or multiple layers.
In this embodiment, the primer layer 2 of the adhesive holding jig 10 consists of a first primer layer in contact with the substrate 1 and a second primer layer in contact with the elastomer layer 3 .
The constituent material of each primer layer is appropriately selected from known primer layer materials according to the constituent materials of the substrate 1 and the elastomer layer 3 .
The thickness of the primer layer 2 is preferably thinner than the thickness of the elastomer layer 3, and is preferably 1 μm or less from the viewpoint of improving the thickness accuracy of the adhesive holding jig 10, for example.

In the adhesive holding jig 10, the elastomer layer 3 may be provided only on one side of the substrate 1, or may be provided on both sides.

(Object to be held)
The adhesive holding jig 10 of the present invention is capable of holding and peeling off parts whose surfaces are at least made of metal, semiconductor, or resin.

[Method for manufacturing adhesive holding jig]
The method for producing an adhesive holding jig of the present invention is a method for producing an adhesive holding jig having a substrate 11 and a fluorine-containing elastomer layer 13 in this order. is a method of forming an elastomer layer by spin coating using

First, after forming the primer layer 12 on the substrate 11 by a known method as necessary, an elastomer composition is applied by spin coating to form a coating film.

The fluorine-containing elastomer composition contains the elastomer or its precursor before curing and a solvent for diluting it. The elastomer composition may contain fillers, pigments, pressure-sensitive adhesives, etc., as required.
The viscosity of the fluorine-containing elastomer composition is preferably 1 Pa·s or more and 20 Pa·s or less. When the viscosity of the fluorine-containing elastomer composition is within the above range, the fluorine-containing elastomer layer 3 having a thickness of 3 μm or more and 20 μm or less can be formed with excellent thickness accuracy by spin coating.
Here, the viscosity is measured according to JIS K7117-1.

When a fluorine-containing elastomer is used, it is preferable to mix 1 part by mass or more and 2 parts by mass or less of a solvent with 1 part by mass of the elastomer to dilute the mixture to 2 times or more and 3 times or less. By diluting the amount of the solvent to the above range, the viscosity becomes suitable for forming the elastomer layer 3 having a thickness of 5 μm or more and 80 μm or less by spin coating.

By drying or heating the coating film formed on the substrate 1, the desired adhesive holding jig 10 having the elastomer layer 3 can be obtained.

An example of the present invention will be described in detail below with reference to examples.
[Examples and Comparative Examples]
(Formation of primer layer)
An appropriate amount of primer solution (manufactured by Shin-Etsu Chemical Co., Ltd.) is placed on a stainless steel substrate (thickness 0.8 mm, length 110 mm x width 110 mm) installed in a spin coater (trade name “Spin Coater MS-B300”, manufactured by Mikasa Co., Ltd.). was dropped and spin-coated at 1000 rpm for 20 seconds to form a primer layer. Further, baking treatment was performed at 150° C. for 10 minutes in a dryer.

(Preparation of elastomer composition)
Next, elastomer compositions (compounds A to D) were prepared at the compounding ratios (by mass) shown in Table 1. Details are shown in Table 1.

The materials in Table 1 are as follows.
Elastomer: Fluorine elastomer manufactured by Shin-Etsu Chemical Co., Ltd. Diluent: Hydrofluoroether manufactured by 3M Co., Ltd. Filler: Polymethyl methacrylate manufactured by Sekisui Plastics Co., Ltd. Monodisperse filler particle size 20 μm type

(Formation of elastomer layer)
Appropriate amounts of each of the elastomer compositions of Formulation A to Formulation D were dropped onto the primer layer and spin-coated for 20 seconds at different rotation speeds (200, 350, 500, 750, 1000 and 1500). , to form an elastomer layer.
After that, a curing treatment was performed in a dryer at 150° C. for 60 minutes to prepare an adhesive holding jig.

The following evaluations were performed on the adhesive holding jigs produced as described above. Evaluation results are shown in Tables 2 to 5.
2 to 5 show enlarged photographs of the adhesive surfaces of the elastomer layers prepared at 750 rpm using the compositions of formulations A to D. FIG. As shown in these figures, the elastomer layer in the present invention contains monodisperse filler uniformly on the surface.

[evaluation]
(thickness measurement)
The thickness of the adhesive holding jig was measured using a non-contact laser displacement meter (manufactured by Keyence Corporation, model number: LT-9030). The thickness of the adhesive film composed of the elastomer layer and the primer layer was calculated by subtracting the thickness of the substrate from the total thickness of the adhesive holding jig.

(Adhesive force)
The adhesive strength of the surface of the adhesive holding jig was based on the 90 degree peeling adhesive strength measurement method of the adhesive tape/adhesive sheet test method of JIS Z0237. Specifically, a polyimide film having a thickness of 25 μm and a width of 25 mm is attached to the adhesive surface of the adhesive holding jig, and after 1 minute, the polyimide film is pulled upward at an angle of 90 degrees to the adhesive surface at a peeling speed of 300 mm/min. rice field. The adhesive strength at the time of pulling up was measured using a 90-degree peel adhesive strength measuring device (push-pull gauge; manufactured by IMADA Co., Ltd.).

(Surface roughness)
The surface roughness Ra of the adhesive surface of the adhesive holding jig was measured in a non-contact manner using a shape measuring laser microscope (manufactured by Keyence Corporation, model number: VK8700).

(Wafer chip holding evaluation)
At room temperature in a constant temperature bath of 150° C., a silicon wafer having a length of 5 mm, a width of 5 mm, and a thickness of 0.5 mm was held at N=5 on the upward-facing adhesive surface of a horizontal adhesive holding jig. A test was conducted in which the jig was turned upside down and the adhesive surface faced downward. It was evaluated based on the following evaluation criteria.
The surface roughness of the surface of the wafer chip in contact with the adhesive surface was Ra=0.01 μm.
-Evaluation criteria-
A: All wafers were held even after reversing C: Some or all of the wafers fell after reversing

(Wafer chip peeling evaluation)
At room temperature in a constant temperature bath of 150° C., a silicon wafer of 5 mm in length×5 mm in width×0.5 mm in thickness was held at N=5 on the upward-facing adhesive surface of a horizontal adhesive holding jig, followed by vacuum tweezers. was used to peel off the wafer. Evaluation was performed based on the following evaluation criteria. -Evaluation criteria-
A: All wafers could be peeled off. C: Some wafers could not be peeled off, or wafers were damaged during peeling.

(Resin part retention evaluation)
The same evaluation as the wafer chip holding evaluation was performed for the parts sealed with the epoxy resin.
The epoxy resin had a length of 5 mm, a width of 5 mm, and a thickness of 0.5 mm, and the surface roughness of the epoxy resin in contact with the adhesive surface was Ra=0.20 μm.

(Peeling evaluation of resin parts)
The same evaluation as the wafer chip peeling evaluation was performed for the parts sealed with the epoxy resin.

REFERENCE SIGNS LIST 10 adhesive holding jig 11 substrate 12 primer layer 13 fluorine-containing elastomer layer

Claims (7)

comprising a substrate and a fluorine-containing elastomer layer formed on the substrate;
The fluorine-containing elastomer layer has a surface roughness Ra of 0.1 μm or more and 1.2 μm or less, the fluorine-containing elastomer layer contains a filler, and the average particle diameter of the filler is equal to the thickness of the fluorine-containing elastomer layer. 25% or more and 400% or less of the adhesive holding jig. 2. The adhesive holding jig according to claim 1 , wherein the fluorine-containing elastomer layer has a thickness of 5 [mu]m or more and 80 [mu]m or less. 3. The adhesive holding jig according to claim 1, wherein said substrate is a glass substrate, a metal substrate or a resin substrate. 4. The adhesive holding jig according to any one of claims 1 to 3 , wherein a primer layer is disposed between said substrate and said fluorine-containing elastomer layer, and said primer layer has a thickness of 1 [mu]m or less. A method for manufacturing an adhesive holding jig having a substrate and a fluorine-containing elastomer layer in this order,
The fluorine-containing elastomer layer is formed by spin-coating a fluorine-containing elastomer composition on the substrate,
The fluorine-containing elastomer layer contains a filler, and the average particle size of the filler is 25% or more and 400% or less of the thickness of the fluorine-containing elastomer layer,
A method for producing an adhesive holding jig , wherein the fluorine-containing elastomer layer has a surface roughness Ra of 0.1 μm or more and 1.2 μm or less . 6. The method for manufacturing an adhesive holding jig according to claim 5 , wherein the fluorine-containing elastomer layer has a thickness of 5 [mu]m or more and 80 [mu]m or less. 7. The method for manufacturing an adhesive holding jig according to claim 5, wherein the fluorine-containing elastomer composition has a viscosity of 1 Pa.s or more and 20 Pa.s or less.

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