JP7256944B2 - Moisture-curable resin composition and cured product - Google Patents

Description

The present invention relates to moisture-curable resin compositions and cured products.

Moisture-curable resin compositions have hitherto been used as sealants, adhesives, thermally conductive resins, flame-retardant resins and the like in a wide range of fields such as automobiles and electrical and electronic fields. Patent Document 1 discloses a moisture-curable resin composition containing a polymer having a hydrolyzable silyl group with excellent adhesiveness.

JP 2010-171129 A

However, in recent years, it has been demanded that the cured product of the moisture-curable resin can be easily peeled off at the time of partial repair/replacement or recycling of automobile parts, electrical and electronic parts, etc., but disclosed in Patent Document 1. The cured product of the moisture-curable resin had good adhesion but poor releasability.

Accordingly, the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a moisture-curable resin composition having excellent peelability.

The present invention has the following gists.
[1] A moisture-curable resin composition containing the following components (A) to (D).
Component (A): Organic polymer containing two or more hydrolyzable silyl groups Component (B): Filler Component (C): Condensation having a neutralization value of 10 to 200 mgKOH/g and being liquid at 25°C Fatty acid (D) component: curing catalyst [2] Moisture according to [1], wherein the amount of component (C) added is 3 to 50 parts by mass per 100 parts by mass of component (A) A curable resin composition.
[3] The moisture-curable resin composition according to [1] or [2], wherein the amount of component (B) added is 5 to 95% by mass based on the total composition.
[4] Component (B) is talc, silica, clay, aluminum hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, glass, alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, carbon, diamond, and gold. The moisture-curable resin composition according to any one of [1] to [3], wherein the filler is selected from the group consisting of , silver, copper and nickel.
[5]
The moisture-curable resin composition according to any one of [1] to [4], wherein the component (C) is a castor oil condensed fatty acid.
[6] The moisture-curable resin composition according to any one of [1] to [5], wherein the component (D) contains any one of a tin compound, a titanium compound, and a fluorine-based compound.
[7] The moisture-curable resin composition according to any one of [1] to [6], further comprising a silane compound having a hydrolyzable functional group as component (E).
[8] The component (A) has a polyether main chain structure, a polyester main chain structure, a polycarbonate main chain structure, a polyurethane main chain structure, a polyamide main chain structure, a polyurea main chain structure, a polyimide main chain structure, and a polymerizable unsaturated structure. The moisture-curable type according to any one of [1] to [7], wherein at least one structure is selected from the group consisting of a vinyl polymer main chain structure obtained by polymerizing a group. Resin composition.
[9] The moisture-curable resin composition of [1], wherein the component (B) is a thermally conductive filler.
[10] A cured product obtained by curing the moisture-curable resin composition according to any one of [1] to [8].
[11] A joined body comprising the moisture-curable resin composition according to [1] or [9] and a heating element and/or a radiator.
[12] A heat dissipation method for dissipating heat generated from an electric/electronic component to the outside by applying the moisture-curable resin composition according to [1] or [9] to the electric/electronic component.

The present invention provides a moisture-curable resin composition having excellent releasability. Here, the term "peelability" means the ease of peeling off when desired.

The details of the invention are described below. In this specification, "X to Y" is used to include the numerical values (X and Y) described before and after it as lower and upper limits, and means "X or more and Y or less".
<(A) Component>
Any organic polymer containing two or more hydrolyzable silyl groups, which is the component (A) used in the present invention, is not particularly limited. Component (A) hydrolyzes the hydrolyzable silyl groups to form siloxane bonds, thereby cross-linking the organic polymer and forming a cured product. Among them, an organic polymer having a hydrolyzable silyl group at its terminal is preferable because the cured product has a high modulus and is excellent in releasability.

The hydrolyzable silyl group is one in which 1 to 3 hydrolyzable groups are bonded to a silicon atom, and the hydrolyzable groups include, for example, a halogen atom, an alkoxy group, an acyloxide group, and a ketoximate group. , an amino group, an amido group, an aminooxy group, an alkenyl oxide group, etc. are preferred, and an alkoxy group is particularly preferred from the viewpoint of excellent moisture curability. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propyloxy group, an isopropyloxy group, a butoxy group, a tert-butoxy group, a phenoxy group, and a benzyloxy group. preferable. These alkoxy groups may be of the same type or may be a combination of different types.

Examples of alkoxysilyl groups in which an alkoxy group is bonded to a silicon atom include trialkoxysilyl groups such as trimethoxysilyl group, triethoxysilyl group, triisopropoxysilyl group, and triphenoxysilyl group; dialkoxysilyl groups such as ethoxysilyl groups; and monoalkoxysilyl groups such as dimethylmethoxysilyl groups and dimethylethoxysilyl groups. Among them, a dialkoxysilyl group and a trialkoxysilyl group are preferable. A plurality of these may be used in combination.

Although the main chain structure of the component (A) is not particularly limited, examples include a polyether main chain structure, a polyester main chain structure, a polycarbonate main chain structure, a polyurethane main chain structure, a polyamide main chain structure, a polyurea main chain structure, a polyimide main chain structure, and a polyimide main chain structure. Examples include a chain structure and a main chain structure of a vinyl polymer obtained by polymerizing a polymerizable unsaturated group. Component (A) may have one of these main chain structures in one molecule, or may have a main chain structure obtained by combining a plurality of them. It may also be a mixture of two or more compounds having these structures. Among the main chain structures described above, at least one of a vinyl polymer main chain structure and a polyether main chain structure is particularly preferable. Moreover, it may have both a polyether main chain structure portion and a vinyl polymer main chain structure portion.

Examples of the polyether main chain structure include polyethylene glycol, polypropylene glycol, polytrimethylene glycol, polytetramethylene glycol and the like. Commercially available polymers having a polyether main chain structure having a hydrolyzable silyl group include S-203, S-303, S-903, etc. as MS polymers manufactured by Kaneka Corporation, SAT-115 as silyl polymers, Examples include SAT-200, SAT-350, SAX770, MA-403, MA-447, etc., and Exester ESS-2410, ESS-2420, ESS-3630 manufactured by Asahi Glass Co., Ltd., and the like.

As the polyester main chain structure, glycols such as ethylene glycol, propylene glycol, neopentyl glycol and tetramethylene glycol are condensed with dicarboxylic acids such as terephthalic acid, isophthalic acid, sebacic acid, succinic acid, phthalic acid and adipic acid. and a polyester main chain structure obtained by

The polyurethane main chain structure includes polyols such as polyether polyol, polyester polyol, polycarbonate polyol, polybutadiene polyol, polyisoprene polyol, and hydrogenated polyisoprene polyol, xylylene diisocyanate, isophorone diisocyanate, methylene diphenyl diisocyanate, toluylene diisocyanate, and the like. and a polyurethane main chain structure obtained by reacting with diisocyanate.

Examples of the polyamide main chain structure include a polyamide main chain structure obtained by condensing a diamine and a dicarboxylic acid or by ring-opening polymerization of caprolactam. Examples of the polyurea main chain structure include a polyurea main chain structure obtained by polyaddition of diamine and diisocyanate. The polyimide main chain structure includes a polyimide main chain structure obtained by imidization of a diamine and a compound having two cyclic acid anhydride structures in one molecule.

Further, the vinyl-based polymer obtained by polymerizing the polymerizable unsaturated group may be any polymer obtained by polymerizing a vinyl monomer. Examples thereof include polyethylene, polypropylene, polyisobutylene, and poly(meth)acrylate. , polystyrene, polyvinyl chloride, polyvinylidene chloride, polybutadiene, polyisoprene, polyvinyl acetate, polyvinyl alcohol, polyvinyl butyral, polyvinyl ether, and the like. Copolymers having these vinyl polymer portions may also be used.

By using together an organic polymer containing two or more hydrolyzable silyl groups as the component (A) and an organic polymer having one crosslinkable hydrolyzable silyl group in one molecule, the viscosity can be reduced. It is preferable from the viewpoint that the modulus of the cured product can be maintained while decreasing.

Suitable viscosity at 25° C. of component (A) of the present invention is not particularly limited, but is, for example, 0.1 to 500 Pa·s, more preferably 1 to 100 Pa·s, particularly preferably 3 to 50 Pa. • the range of s. Within the above range, it is preferable because a moisture-curable resin composition having low viscosity and peelability can be obtained. Unless otherwise specified, viscosity was measured using a cone-plate viscometer at 25° C. in accordance with JISK6833.

<(B) Component>
The filler of component (B) of the present invention can have bulk strength to such an extent that the cured product of the moisture-curable resin composition is not torn off when peeled from the interface. The component (B) is not particularly limited, but examples include talc, silica, clay, calcium carbonate, magnesium carbonate, calcium silicate, glass, alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, carbon, diamond, gold, silver, copper, nickel and the like. Moreover, the (B) component may be surface-treated. Also, these may be used alone or in combination.

Talc, silica, clay, calcium carbonate, magnesium carbonate, calcium silicate and glass are preferable for imparting high modulus to the moisture-curable resin composition. For the purpose of imparting, thermally conductive fillers such as alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, carbon, diamond are preferable, and for the purpose of imparting flame retardancy to the moisture-curable resin composition, hydroxylation Aluminum is preferred, and conductive fillers such as gold, silver, copper and nickel are preferred for the purpose of imparting conductivity to the moisture-curable resin composition.

The average particle diameter (50% average particle diameter) of the component (B) is preferably 0.01 μm or more and 150 μm or less from the viewpoint of obtaining a moisture-curable resin composition having low viscosity and peelability, and 0.1 μm It is more preferably 100 μm or less, and most preferably 0.5 μm or more and 70 μm or less. In the present invention, the average particle size is, for example, the particle size at cumulative 50% in the particle size distribution determined by the laser diffraction/scattering method. (Also called D50)

Although the content of the component (B) is not particularly limited, for example, it is preferably 5 to 95% by mass, more preferably 10 to 90% by mass, more preferably 20 to 85% by mass, based on the entire moisture-curable resin composition of the present invention. % by weight is particularly preferred. It is preferable that the content of the component (B) is within the above range because a moisture-curable resin composition having low viscosity and peelability can be obtained.

When the moisture-curable resin composition of the present invention is used as a thermally conductive resin composition, the content of the component (B) is 55 to 95% by mass with respect to the entire moisture-curable resin composition of the present invention. Preferably, 60 to 90% by mass is more preferable, and 70 to 85% by mass is particularly preferable.

When the moisture-curable resin composition of the present invention is used as a thermally conductive resin composition, two or more fillers having different average particle diameters are used in combination as the component (B) to reduce viscosity and improve thermal conductivity. It is preferable because a moisture-curable resin composition having good properties and releasability can be obtained. Specifically, the filler having a small average particle size is preferably 0.01 μm or more and 2.0 μm or less, more preferably 0.1 μm or more and 1.8 μm or less. The average particle diameter of the filler having a large average particle diameter is preferably 2.0 μm or more and 150 μm or less, and 2.5 μm or more and 100 μm, because a moisture-curable resin composition having low viscosity before curing and excellent thermal conductivity can be obtained. The following are more preferable, and 2.7 μm or more and 70 μm or less are most preferable. Further, the filler with a large average particle size is 10 to 500 parts by mass, more preferably 20 to 400 parts by mass, and particularly preferably 30 to 400 parts by mass with respect to 100 parts by mass of the filler with a small average particle size. Department. When the amount of the filler with a small average particle size and the filler with a large average particle size is within the above range, the moisture-curable resin composition has even lower viscosity, thermal conductivity, and releasability. is obtained.

<(C) Component>
The component (C) of the present invention has a neutralization value of 10 to 200 mgKOH/g, and the condensed fatty acid, which is liquid at 25°C, is combined with the other components of the present invention to provide a moisture-curable resin composition with excellent peelability. can provide things. The component (C) has a neutralization value of preferably 40 mgKOH/g or more, more preferably 50 mgKOH/g or more, and is preferably 180 mgKOH/g or less, more preferably 150 mgKOH/g or less. desirable. When the neutralization value of the component (C) is within the above range, it is possible to provide a moisture-curable resin composition with even better peelability. As the neutralization value of component (C), the value measured by the neutralization value test method defined in JIS K 3331 can be used. (C) component may be used individually by 1 type, and may use 2 or more types together.

The condensed fatty acid means a dimer or higher compound obtained by condensing fatty acids each having a hydroxyl group or a fatty acid having a hydroxyl group and a fatty acid having no hydroxyl group. Although the fatty acid having a hydroxyl group is not particularly limited, castor oil fatty acid whose main component is ricinoleic acid, hydrogenated castor oil fatty acid whose main component is 12-hydroxystearic acid, and the like are preferably used. Examples of fatty acids having no hydroxyl group include lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, montanic acid, oleic acid, linoleic acid, and linolenic acid. Coconut oil fatty acid, palm oil fatty acid, olive oil fatty acid, beef tallow fatty acid, hydrogenated beef tallow fatty acid, etc. can also be used.

The condensed fatty acid of the component (C) can be obtained by various production methods, and the method is not particularly limited. It can be obtained by heating to a temperature of about 150 to 250° C. in a gas atmosphere. In this case, it is preferable to coexist with xylene or the like and to remove by-product water out of the system by azeotropy. A catalyst such as p-toluenesulfonic acid or sulfuric acid may also be present.

The condensed fatty acid of component (C) is preferably castor oil condensed fatty acid. The condensed castor oil fatty acid means a dimer or higher compound obtained by condensing a castor oil fatty acid whose main component is ricinoleic acid as a fatty acid having a hydroxyl group.

Commercially available products of component (C) are not particularly limited, but examples thereof include RC-17, RC-22, RC-55 and RC-89C (MINERASOL manufactured by Ito Oil Co., Ltd.).

The amount of component (C) is preferably 3 to 50 parts by weight, more preferably 5 to 30 parts by weight, and particularly preferably 7 to 20 parts by weight per 100 parts by weight of component (A). is. By being within the above range, it is possible to provide a moisture-curable resin composition that is even more excellent in releasability.

<(D) Component>
The curing catalyst for component (D) is not particularly limited as long as it is a catalyst that crosslinks the polymer (A). Specifically, dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin distearate, dibutyltin laurate oxide, dibutyltin diacetylacetonate, dibutyltin dioleyl maleate, dibutyltin octoate, dioctyltin oxide, dioctyl Tin compounds such as tin dilaurate, reaction products of dioctyltin salts and silicates; titanate compounds such as tetra-n-butoxy titanate and tetraisopropoxy titanate; carboxylic acid metal salts; metal acetylacetonate complexes; amine salts; organic phosphoric acid compounds ; also includes fluorine-based compounds such as boron trifluoride complexes. Among them, tin compounds, titanate-based compounds, and fluorine-based compounds are preferable from the viewpoint of curability and peelability, and tin compounds and titanate-based compounds are more preferable. These may be used alone, or two or more of them may be used in combination.

The amount of component (D) to be added is not particularly limited, but is, for example, 0.1 to 50 parts by mass, more preferably 0.5 to 30 parts by mass based on 100 parts by mass of component (A). , particularly preferably 0.7 to 20 parts by mass. It is preferable that it is within the above range because a moisture-curable resin composition having even more peelability can be obtained.

<(E) component>
The silane compound having a hydrolyzable silyl group (excluding component (A)), which is component (E) of the present invention, is not particularly limited, but is exemplified by methyl silicate, ethyl silicate, propyl silicate, and butyl silicate. silane coupling agents having alkyl groups such as dimethyldimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane and hexyltrimethoxysilane; vinyls such as vinyltrimethoxysilane and vinyltriethoxysilane; Group-containing silane coupling agents; phenyltrimethoxysilane, diphenyldimethoxysilane, phenyltriethoxysilane and other phenyl group-containing silane coupling agents; N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N- 2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyltriethoxysilane , 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and other amino group-containing silane coupling agents; 3-glycidoxypropylmethyldimethoxysilane, 3 - Silane coupling agents having a glycidyl group such as glycidoxypropyltrimethoxysilane, 3-glycidoxysilyltriethoxysilane; 3-(meth)acryloxypropylmethyldimethoxysilane, 3-(meth)acryloxypropyltri Silane coupling agents having a (meth)acryloyl group such as methoxysilane, 3-(meth)acryloxypropylmethyldiethoxysilane, 3-(meth)acryloxypropyltriethoxysilane and the like can be mentioned. Among these, silicate compounds, alkyl group-containing silane coupling agents, phenyl group-containing silane coupling agents, and amino group-containing silane coupling agents are preferable from the viewpoint of achieving both moisture curability and peelability. These may be used alone or in combination of two or more.

The amount of component (E) to be added is not particularly limited, but is, for example, 0.1 to 150 parts by mass, more preferably 1 to 70 parts by mass, with respect to 100 parts by mass of component (A). It is preferably 3 to 50 parts by mass. Within the above range, it is preferable because a moisture-curable resin composition having even lower viscosity and releasability can be obtained.

<Optional component>
Further, in the present invention, optional additive components can be further contained within a range that does not impair the characteristics of the moisture-curable resin composition. Examples of the optional components include stabilizers, plasticizers, solvents, dispersants, leveling agents, wetting agents, surfactants such as antifoaming agents, antistatic agents, surface lubricants, rust inhibitors, antiseptics, and rheology modifiers. agents, colorants, anti-aging agents such as UV absorbers, and the like.

Further, in the moisture-curable resin composition of the present invention, polymers having no hydrolyzable silyl groups such as polyester resins, polycarbonate resins, polyacrylic resins, polyurethane resins and polyvinyl resins are added for the purpose of adjusting viscoelasticity. material may be included.

The moisture-curable resin composition of the present invention can be produced by a conventionally known method. For example, predetermined amounts of components (A) to (E) are blended and mixed using a mixing means such as a mixer at a temperature of preferably 10 to 70° C. for preferably 0.1 to 5 hours. can be manufactured.

<Application>
INDUSTRIAL APPLICABILITY The moisture-curable resin composition of the present invention is excellent in releasability, so it is used for applications such as sealing agents and adhesives, and is particularly used for applications such as automobile parts, electrical and electronic parts, and building materials. In addition, the thermally conductive moisture-curable composition, which is one aspect of the present invention, can be used for heat dissipation of electronic substrates, heat dissipation of electronic devices such as mobile phones and personal computers, heat dissipation of lighting such as LEDs, heat dissipation of optical pickup modules, and camera modules. heat dissipation of power semiconductors, heat dissipation of inverters for HEV, FCV, EV, heat dissipation of converters for HEV, FCV, EV, heat dissipation of battery packs, HEV, FCV, ECU parts for EV, etc. .

<Heat dissipation method>
Examples of the heat dissipation method using the present invention include a method for dissipating heat generated from an electric/electronic component to the outside by applying the thermally conductive moisture-curable composition, which is one aspect of the present invention, to the electric/electronic component. . The electrical and electronic components include electronic substrates, mobile phones, electronic devices such as personal computers, lighting devices such as LEDs, optical pickup modules, camera modules, power semiconductors, HEVs, FCVs, inverters for EVs, converters for HEVs, FCVs, and EVs. , HEV, FCV, and ECU parts for EV.

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited by the following examples.

<Preparation of moisture-curable resin composition>
Each component was sampled in parts by mass shown in Tables 1 and 2, and mixed at room temperature for 60 minutes with vacuum defoaming in a planetary mixer to prepare a moisture-curable resin composition. It was measured.

<(A) Component>
a1: Polyether having a viscosity of 6 Pa s at 25° C. and methyldimethoxysilyl groups at both ends (Kanekasilyl SAT350 manufactured by Kaneka Corporation)
a2: A mixture of a polyether having a viscosity of 25 Pa s at 25° C. and having a dimethoxysilyl group at the molecular end and an acrylic polymer having a dimethoxysilyl group in the molecule (MA440 manufactured by Kaneka Corporation)
<(B) Component>
b1: amorphous alumina powder with an average particle size of 1.0 μm (LS-710C manufactured by Showa Denko K.K.)
b2: Spherical alumina powder with an average particle size of 35.0 μm (AW35-63 manufactured by Nippon Steel & Sumikin Materials Co., Ltd.)
b3: calcium carbonate powder with an average particle size of 1.3 μm (Softon 1800 manufactured by Bihoku Funka Kogyo Co., Ltd.)
<(C) Component>
c1: Condensed castor oil fatty acid (MINERASOL RC-55 manufactured by Ito Oil Co., Ltd.) that is liquid in appearance at 25° C. and has a neutralization value of 55 mgKOH/g.
c2: Castor oil condensed fatty acid (MINERASOL RC-89C manufactured by Ito Oil Co., Ltd.) that is liquid in appearance at 25° C. and has a neutralization value of 90 mgKOH/g
<Comparison component of (C)>
c′1: Castor oil condensed fatty acid ester (MINERASOL LB-704 manufactured by Ito Oil Co., Ltd.), which has a liquid appearance at 25° C. and a neutralization value of 4 mgKOH/g.
c'2: Di-2-ethylhexyl adipate (Sanso Cizer DOA manufactured by New Japan Chemical Co., Ltd.)
c'3: diisodecyl phthalate (Sanso Cizer DIDP manufactured by Shin Nippon Rika Co., Ltd.)
c'4: Polyethylene glycol polyol (PEG-1000 manufactured by Sanyo Chemical Industries, Ltd.)
c′5: Castor oil wax that is solid in appearance at 25° C. (Disparlon 308 manufactured by Kusumoto Kasei Co., Ltd.)
<(D) Component>
d1: reaction product of dioctyltin salt and silicate (Neostan S-1 manufactured by Nitto Kasei Co., Ltd.)
d2: dibutyltin catalyst (U-303 manufactured by Nitto Kasei Co., Ltd.)
<(E) component>
e1: Phenyltriethoxysilane (KBE-103 manufactured by Shin-Etsu Chemical Co., Ltd.)
e2: 3-aminopropyltrimethoxysilane (Z-6610 manufactured by Dow Toray Industries, Inc.)

The test methods used in Examples and Comparative Examples are as follows.

<(1) Peelability Confirmation Test (Tensile Shear Adhesion Measurement)>
Using an aluminum member having a width of 25 mm, a length of 100 mm, and a thickness of 1 mm, two members were bonded and fixed with each moisture-curable resin composition with an adhesion area of 10 mm x 25 mm. The moisture-curable resin composition was cured by standing for 7 days in a 50% RH atmosphere at 23°C to obtain a test piece. It was pulled by a tensile tester at 50 mm/min under an environment of 25° C., and the “tensile shear adhesive strength (MPa)” was calculated from the maximum strength. Details conform to JIS K 6249:2003. In addition, based on the following evaluation criteria, the fracture state of the adhesive surface of the test piece after the tensile test was observed and evaluated. Tables 1 and 2 show the results. In the present invention, the tensile shear adhesive strength to aluminum is preferably 1.0 MPa or less, more preferably 0.0001 MPa or more, from the viewpoint of peelability.
[Evaluation of destruction state]
Passed: Destruction state of the adhesive surface of the test piece was interfacial failure, and no residue remained on the adherend side, so the peelability was excellent.
Failed: Destruction state of the adhesive surface of the test piece was cohesive failure, which remained on the adherend side, so the peelability was poor.

From the results of Examples 1 to 4 in Table 1, it was confirmed that the cured product of the moisture-curable resin composition of the present invention has excellent peelability. On the other hand, Comparative Example 1, which does not contain the component (C) of the present invention, resulted in poor peelability. Comparative Examples 2 to 5 containing c'1 to c'4, which are not component (C) of the present invention, resulted in poor peelability.

From the results of Examples 5 and 6 in Table 2, it was confirmed that the cured product of the moisture-curable resin composition of the present invention has excellent peelability. On the other hand, Comparative Example 6, which does not contain the component (C) of the present invention, resulted in poor peelability. Comparative Examples 7 to 10 containing c'1 to 3 and c'5, which are not component (C) of the present invention, resulted in poor peelability.

Next, the T-peel strength was measured.
<(2) Peelability confirmation test (T-type peel strength measurement)>
Conforms to JIS K 6854-3. A moisture-curable resin composition was applied to an aluminum material (150 mm×25 mm×thickness 1.0 mm) in an adhesion area of 100 mm×25 mm, and immediately attached to another steel plate. After that, the moisture-curable resin composition was left to stand for 7 days in a 50% RH atmosphere at 23°C to obtain a test piece. bottom. Table 3 shows the results.
[Evaluation of T-type peel strength]
In the present invention, the T-peel strength is preferably 1.0 N/25 mm or less from the viewpoint of peelability from the adherend.
[Evaluation of destruction state]
Passed: Destruction state of the adhesive surface of the test piece was interfacial failure, and no residue remained on the adherend side, so the peelability was excellent.
Failed: Destruction state of the adhesive surface of the test piece was cohesive failure, which remained on the adherend side, resulting in poor releasability.

Next, the thermal conductivity was measured in order to confirm that the moisture-curable resin composition of Example 1 had thermal conductivity.
<Thermal conductivity measurement>
The moisture-curable resin composition of Example 1 was applied to a thickness of 2.0 mm, and left to stand for 7 days in an environment of 25° C. and 50% RH for curing to prepare a test piece.
Thermal conductivity (W/m·k) was measured at 25° C. using a thermal conductivity meter (QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd.). The higher the thermal conductivity, the easier it is for heat to be conducted, which is preferable. In particular, in the present invention, it is preferably 1.0 W/(m·k) or more. The measurement result of Example 1 was 2.0 W/(m·k), confirming that it had thermal conductivity.

INDUSTRIAL APPLICABILITY The moisture-curable resin composition of the present invention is extremely effective due to its excellent releasability, and can be applied to a wide range of fields such as sealants for electronic parts, adhesives, thermally conductive resins, and flame-retardant resins. It is industrially useful for the following reason.

Claims (12)

A moisture-curable resin composition containing the following components (A) to (D).
Component (A): Organic polymer containing two or more hydrolyzable silyl groups Component (B): Filler Component (C): Condensation having a neutralization value of 10 to 200 mgKOH/g and being liquid at 25°C Fatty acid (D) component: curing catalyst 2. The moisture-curable resin composition according to claim 1, wherein the component (C) is added in an amount of 3 to 50 parts by mass per 100 parts by mass of the component (A). 3. The moisture-curable resin composition according to claim 1, wherein the component (B) is added in an amount of 5 to 95% by mass based on the total composition. The component (B) is talc, silica, clay, aluminum hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, glass, alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, carbon, diamond, gold, silver, 4. The moisture-curable resin composition according to any one of claims 1 to 3, wherein the filler is at least one selected from the group consisting of copper and nickel. The moisture-curable resin composition according to any one of claims 1 to 4, wherein the component (C) is castor oil condensed fatty acid. 6. The moisture-curable resin composition according to any one of claims 1 to 5, wherein the component (D) contains any one of a tin compound, a titanium compound and a fluorine compound. 7. The moisture-curable resin composition according to any one of claims 1 to 6, further comprising a silane compound having a hydrolyzable functional group as component (E). The component (A) polymerizes a polyether main chain structure, a polyester main chain structure, a polycarbonate main chain structure, a polyurethane main chain structure, a polyamide main chain structure, a polyurea main chain structure, a polyimide main chain structure, and a polymerizable unsaturated group. 8. The moisture-curable resin composition according to any one of claims 1 to 7, wherein at least one structure is selected from the group consisting of a vinyl polymer main chain structure obtained by 2. The moisture-curable resin composition according to claim 1, wherein the component (B) is a thermally conductive filler. A cured product obtained by curing the moisture-curable resin composition according to any one of claims 1 to 8. A joined body comprising the moisture-curable resin composition according to claim 1 or 9 and a heating element and/or a radiator. A method of dissipating heat generated from an electric/electronic component to the outside by applying the moisture-curable resin composition according to claim 1 or 9 to the electric/electronic component.