JP7216244B1 - Semiconductor device manufacturing method - Google Patents

Abstract

Kind Code: A1 An object of the present invention is to provide a semiconductor device that is less likely to warp even after undergoing a processing process. A semiconductor device according to the present invention includes a SiC substrate 10, and the SiC substrate is obtained by a formula obtained from a thickness, a diameter, and a stress associated with a first outer peripheral edge 10 mm inside from the outer peripheral edge in a [11-20] direction from the center of the SiC substrate. A semiconductor device having a warp factor F represented by (1) of 300 μm or less; F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(ts)) (1) (K = 1.3373, a = -11.67123, b = 1.4030953, c = 1.8050972, d = -1.585898, σ = 60 (MPa) - 2/3 × S ( MPa), S is the internal stress in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral end, with positive tensile stress and negative compressive stress, and ts is the thickness ( mm), and R is the diameter (mm).[Selection] Fig. 2

Description

The present invention relates to a method of manufacturing a semiconductor device.

Silicon carbide (SiC) has a dielectric breakdown field one order of magnitude larger and a bandgap three times larger than silicon (Si). In addition, silicon carbide (SiC) has properties such as a thermal conductivity that is about three times as high as that of silicon (Si). Therefore, silicon carbide (SiC) is expected to be applied to power devices, high-frequency devices, high-temperature operation devices, and the like. Therefore, in recent years, SiC epitaxial wafers have come to be used for such semiconductor devices.

A SiC epitaxial wafer is obtained by stacking a SiC epitaxial layer on the surface of a SiC substrate cut out from a SiC ingot. Hereinafter, the substrate before lamination of the SiC epitaxial layer is referred to as the SiC substrate, and the substrate after lamination of the SiC epitaxial layer is referred to as the SiC epitaxial wafer.

The SiC substrate before stacking the SiC epitaxial layer is flat. There are various processing processes before manufacturing a semiconductor device from a SiC substrate. A SiC substrate may warp through a processing process. Processing processes that cause warping of SiC substrates include, for example, epitaxial layer deposition, surface polishing, oxide film formation, and ion implantation. SiC substrate warpage adversely affects semiconductor device processing. For example, warpage causes defocus in photolithographic processing. Warpage also causes a decrease in wafer positional accuracy during the transfer process.

On the other hand, as described above, the SiC substrate before processing is flat, and it is difficult to predict warpage after processing. For example, Patent Literature 1 describes the use of the difference in wavenumber shift amount of Raman scattered light in order to predict the warpage value of a polished SiC single crystal product wafer before the polishing process is completed. . Patent Document 2 discloses a substrate in which the Raman spectrum is measured in the thickness direction of the substrate and the stress distribution is reduced in the thickness direction. Further, for example, Patent Literature 3 describes that the warpage of the SiC substrate is reduced by relaxing the crystallographic stress. Further, for example, Patent Literature 4 describes suppressing cracks in the ingot by increasing the compressive stress in the circumferential direction of the ingot.

JP 2015-59073 A WO2019/111507 U.S. Patent Application Publication No. 2021/0198804 JP 2007-290880 A

Patent documents 1 and 2 use the Raman shift to evaluate the internal stress of the substrate, but the Raman shift does not include directional information. Further, Patent Documents 1 to 3 describe reducing the stress, but the warpage of the SiC epitaxial wafer could not be sufficiently suppressed only by reducing the stress. Moreover, the stress defined in Patent Document 4 is the stress of the ingot, which is different from the stress associated with the SiC substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a SiC substrate and a SiC epitaxial wafer that are less likely to warp even after undergoing a processing process.

The present inventors found a new coefficient (warp factor) that correlates with the warp after processing by using the outer peripheral stress, diameter, and thickness. It has been found that by suppressing the warpage factor below a certain value, the warpage after processing can be suppressed and the obstruction to device flow can be suppressed. In order to solve the above problems, the present invention provides the following means.

(1) The SiC substrate according to the first aspect has a thickness, a diameter, and a stress related to the first outer peripheral edge 10 mm inside from the outer peripheral edge in the [11-20] direction from the center, and the following formula ( The warp factor F represented by 1) is 300 μm or less.
Formula (1) is expressed by F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(t _s )) (1).
In formula (1), K, a, b, c, d satisfy K = 1.3373, a = -11.67123, b = 1.4030953, c = 1.8050972, d = -1.585898 is a constant, σ satisfies σ = 60 (MPa) - 2/3 × S (MPa), and S is the same direction as the circumferential direction of the first outer peripheral end, which is the same direction as the <1-100> direction. The tensile stress is positive and the compressive stress is negative, _ts is the thickness (mm) and R is the diameter (mm).

(2) In the SiC substrate according to the aspect described above, the warpage factor F may be 200 μm or less.

(3) In the SiC substrate according to the aspect described above, the warpage factor F may be 100 μm or less.

(4) In the SiC substrate according to the aspect described above, the warpage factor F may be 50 μm or less.

(5) The SiC substrate according to the above aspect may have a diameter of 145 mm or more and a thickness of 300 μm or less.

(6) The SiC substrate according to the above aspect may have a diameter of 195 mm or more and a thickness of 600 μm or less.

(7) The SiC substrate according to the above aspect may have a thickness of 400 μm or less.

(8) The SiC substrate according to the above aspect may have a diameter of 210 mm or more and a thickness of 600 μm or less.

(9) The SiC substrate according to the above aspect may have a diameter of 290 mm or more and a thickness of 800 μm or less.

(10) The SiC substrate according to the above aspect may have a thickness of 600 μm or less.

(11) A SiC epitaxial wafer according to a second aspect includes the SiC substrate according to the aspect described above and a SiC epitaxial layer laminated on one surface of the SiC substrate.

The SiC substrate and SiC epitaxial wafer according to the above aspect are less likely to warp even through processing processes.

FIG. 4 is a schematic diagram for explaining warping of a SiC substrate; 1 is a plan view of a SiC substrate according to this embodiment; FIG. It is a schematic diagram for demonstrating the measuring method of the stress S of the circumferential direction of a 1st outer peripheral edge. FIG. 4 is a diagram showing the relationship between the predicted (simulated) value of warpage of the SiC substrate and the warpage factor. 1 is a schematic diagram for explaining a sublimation method, which is an example of a SiC ingot manufacturing apparatus; FIG. 4 shows a simulation result of the warpage of the SiC substrate in Example 1. FIG. FIG. 10 shows a simulation result of warpage of the SiC substrate in Example 2. FIG. FIG. 10 shows simulation results of warpage of the SiC substrate in Example 3. FIG. FIG. 10 shows simulation results of warpage of the SiC substrate in Example 4. FIG. FIG. 10 shows simulation results of warpage of the SiC substrate in Example 5. FIG. FIG. 10 shows simulation results of warpage of the SiC substrate in Example 6. FIG.

Hereinafter, the SiC substrate and the like according to the present embodiment will be described in detail with appropriate reference to the drawings. In the drawings used in the following description, characteristic parts may be enlarged for the sake of convenience in order to make it easier to understand the characteristics of this embodiment, and the dimensional ratios of each component may differ from the actual ones. There is The materials, dimensions, and the like exemplified in the following description are examples, and the present invention is not limited to them, and can be modified as appropriate without changing the gist of the invention.

First, the warpage of SiC substrate 10 will be described. FIG. 1 is a schematic diagram for explaining warping of a SiC substrate 10. FIG.

SiC substrate 10 before processing is substantially flat. The term “substantially flat” means that there is no portion that rises significantly when placed on a flat surface. For example, the first surface 10a and the second surface 10b of the SiC substrate 10 are substantially parallel before processing. First surface 10a and second surface 10b are surfaces of SiC substrate 10 that face each other.

Through the processing process, a treated layer 11 is formed on the first surface 10 a of the SiC substrate 10 . The treated layer 11 is formed by, for example, surface treatment, film formation, device formation, or the like. When the treated layer 11 is formed on one surface of the SiC substrate 10, the SiC substrate 10 may warp.

For example, the treated layer 11 formed by surface treatment is a work-affected layer. For example, when the first surface 10a is a mirror-ground surface and the second surface 10b is a CMP-processed surface, a work-affected layer is formed on the first surface 10a. The Twyman effect occurs in SiC substrate 10 due to the difference in surface state between first surface 10a and second surface 10b. The Twyman effect is a phenomenon in which, when there is a difference in residual stress on both sides of a substrate, a force acts to compensate for the difference in stress on both sides. The Twyman effect can cause the SiC epitaxial wafer 20 to warp.

Further, for example, the processing layer 11 formed by film formation is an epitaxial layer. The epitaxial layer is deposited on the first surface 10a of the SiC substrate 10, for example. SiC substrate 10 may warp due to the difference in state between first surface 10a and second surface 10b on which an epitaxial layer is formed.

Further, for example, the processing layer 11 formed by device formation is a device layer. For example, diodes and transistors are formed in the device layer. For example, when ion implantation or the like is performed to form a device in an epitaxial layer, the SiC substrate 10 may warp. This is because the state is different between the ion-implanted surface and the non-ion-implanted surface.

Here, an example of the cause of the warp of the SiC substrate 10 due to the processing process has been presented, but the cause of the warp is not limited to these, and these factors may affect each other in a complex manner. Therefore, it has been difficult to predict the degree of warpage in the state of the SiC substrate 10 after the processing process. In the SiC substrate according to the present embodiment, the degree of warpage after the processing process is defined by a warpage factor F newly defined.

FIG. 2 is a plan view of the SiC substrate 10 according to this embodiment. SiC substrate 10 is made of SiC. The polytype of SiC substrate 10 is not particularly limited and may be any of 2H, 3C, 4H and 6H. The SiC substrate 10 is, for example, 4H-SiC. The planar view shape of SiC substrate 10 is substantially circular. SiC substrate 10 may have an orientation flat OF or a notch for determining the direction of the crystal axis.

The warp factor F is a parameter obtained from the thickness t _s (see FIG. 1) of the SiC substrate 10, the diameter R, and the stress S at the first outer peripheral edge 1. FIG.

The warp factor F is represented by the following formula (1).
F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(t _s )) (1)
In formula (1), K, a, b, c, and d are constants. It satisfies K=1.3373, a=-11.67123, b=1.4030953, c=1.8050972, and d=-1.585898. σ satisfies σ=60 (MPa)−2/3×S (MPa). S is the stress at the first outer peripheral edge 1; _ts is the thickness (mm) of SiC substrate 10 and R is the diameter (mm) of SiC substrate 10 .

The first outer peripheral edge 1 is located at the outer peripheral portion 2 10 mm inside from the outer peripheral edge, and is a point in the direction [11-20] from the center C. The stress S is an internal stress in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral end 1 . In the present invention, when the stress S is tensile stress, it is treated as positive, and when it is compressive stress, it is treated as negative. When discussing the magnitude of the stress S, the absolute value defines the magnitude.

The stress S is calculated as the product of the strain ε and Young's modulus. The strain ε is obtained by (a ₀ -a)/a ₀ . a ₀ is the reference lattice constant. a ₀ is about 3.08 Å for 4H—SiC. a is a lattice constant determined by an X-ray diffraction method (XRD). The direction of stress S is obtained from the direction of incident X-rays in X-ray diffraction. As the lattice constant a becomes smaller than the reference lattice constant _a0 , the strain ε increases and the tensile stress increases. The larger the lattice constant a than the reference lattice constant _a0 , the larger the strain ε and the greater the compressive stress.

FIG. 3 is a schematic diagram for explaining a method of measuring the stress S in the circumferential direction of the first outer peripheral edge 1. As shown in FIG. The circumferential direction at the first outer peripheral edge 1 is a direction orthogonal to a line segment connecting the center C of the SiC substrate 10 and the first outer peripheral edge 1 (hereinafter referred to as the first direction). The first direction is the <1-100> direction. When measuring the stress in the circumferential direction of the first outer peripheral end 1, X-rays are applied from the first direction. By making X-rays incident on the SiC substrate 10 from this circumferential direction, the lattice constant a in the circumferential direction at the first outer peripheral end 1 can be obtained. Then, using this lattice constant a, the stress S in the circumferential direction at the first outer peripheral end 1 is obtained from the above equation. When the actually measured lattice constant a is smaller than the standard lattice constant _a0 , it is assumed that tensile stress is acting, and when the actually measured lattice constant a is greater than the standard lattice constant _a0 , compressive stress is acting. assume there is.

The warp factor F is, for example, 300 μm or less, preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less.

The value of the warp factor F is preferably satisfied when the diameter of the SiC substrate 10 is 145 mm or more, more preferably when the diameter is 195 mm or more, and even more preferably when the diameter is 210 mm or more. , with a diameter of 290 mm or more.

The warp factor F is preferably satisfied when the thickness _ts of the SiC substrate 10 is 800 μm or less, more preferably when the thickness _ts is 600 μm or less, and when the thickness _ts is 400 μm or less. It is more preferable that the thickness t _s is 300 μm or less.

For example, when the SiC substrate 10 has a diameter of 290 mm or more and a thickness of 800 μm or less, the warpage factor F is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. , 50 μm or less. When the SiC substrate 10 has a diameter of 290 mm or more and a thickness of 600 μm or less, the warpage factor F is preferably 300 μm or less, more preferably 200 μm or less, and further preferably 100 μm or less. 50 μm or less is particularly preferred.

For example, when the SiC substrate 10 has a diameter of 210 mm or more and a thickness of 600 μm or less, the warpage factor F is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. , 50 μm or less.

For example, when SiC substrate 10 has a diameter of 195 mm or more and a thickness of 600 μm or less, warpage factor F is preferably 100 μm or less, more preferably 50 μm or less. When SiC substrate 10 has a diameter of 195 mm or more and a thickness of 400 μm or less, warpage factor F is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less.

For example, when SiC substrate 10 has a diameter of 145 mm or more and a thickness of 300 μm or less, warpage factor F is preferably 100 μm or less, more preferably 50 μm or less.

FIG. 4 is a diagram showing the relationship between the predicted value of warpage of the SiC substrate and the warpage factor F. In FIG. The warpage factor F was obtained based on the above formula (1).

A predicted value of the warpage of the SiC substrate was obtained by simulation. The simulation was performed using the finite element method simulator ANSYS. It was separately confirmed that the simulation using the finite element method simulator ANSYS matched the results of the actually manufactured product. The predicted value of warpage is the distance in the thickness direction between the highest point and the lowest point of the first surface 10a, and corresponds to Warp.

The simulation was performed in the following procedure. First, the physical property values of the SiC substrate and the surface layer with different stresses were set. The physical property values to be set are the thickness of the SiC substrate, the thickness of the surface layer, Young's modulus, and Poisson's ratio. Various thicknesses and diameters of the SiC substrates were set as shown in Examples described later. The SiC substrate had a Young's modulus of 480 GPa and a Poisson's ratio of 0.20. The film thickness of the surface layer was 10 μm. Here, considering the case where stress is generated in the surface layer by ion implantation, the same values as those of the SiC substrate were used for the Young's modulus and Poisson's ratio of the surface layer.

Next, the stress distribution of the SiC substrate and the stress of the surface layer were set. First, the stress distribution of the SiC substrate was set. The stress applied to the SiC substrate was either +60 MPa, +30 MPa, 0 MPa, or -30 MPa. A stress of 60 MPa was applied to the entire surface layer. A simulation was performed under the above conditions to obtain the warpage of the SiC substrate with the surface layer.

As shown in FIG. 4, the warp factor F is proportional to the predicted value of warp obtained from the simulation. Warp factor F reflects the amount of warp of SiC substrate 10 . That is, by controlling the warpage factor F, the warpage after the working process can be controlled. Further, if the warp factor F is obtained, it is possible to easily predict the amount of warp after the SiC substrate 10 has passed through the processing process without performing a simulation or the like.

Next, an example of a method for manufacturing the SiC substrate 10 according to this embodiment will be described. SiC substrate 10 is obtained by slicing a SiC ingot. A SiC ingot is obtained, for example, by a sublimation method.

FIG. 5 is a schematic diagram for explaining a sublimation method, which is an example of the SiC ingot manufacturing apparatus 30. As shown in FIG. In FIG. 5, the direction orthogonal to the surface of the base 32 is the z-direction, one direction orthogonal to the z-direction is the x-direction, and the z-direction and the direction orthogonal to the x-direction are the y-direction.

In the sublimation method, a seed crystal 33 made of SiC single crystal is placed on a pedestal 32 placed in a crucible 31 made of graphite, and the crucible 31 is heated to generate a sublimation gas sublimated from the raw material powder 34 in the crucible 31 as a seed crystal. 33 to grow the seed crystal 33 into a larger SiC ingot 35 . The heating of the crucible 31 is performed by a coil 36, for example.

The diameter R of the SiC substrate 10 used to calculate the warpage factor F is a parameter determined by product specifications. Therefore, the desired SiC substrate 10 can be manufactured by controlling the thickness ts of the SiC substrate 10 and the stress _S at the first outer peripheral edge 1 according to the prescribed diameter R of the SiC substrate 10 .

First, by controlling the crystal growth conditions in the sublimation method, the stress applied inside SiC substrate 10 obtained from SiC ingot 35 can be controlled.

For example, when the SiC ingot 35 is c-plane grown, the temperature of the central portion of the crystal growth surface and the temperature of the outer peripheral portion are controlled. The crystal growth surface is the surface during the crystal growth process. For example, when the SiC ingot 35 is c-plane grown, the temperature of the outer peripheral portion of the crystal growth surface is made lower than the temperature of the central portion. Crystal growth is performed so that the difference in growth rate between the center and the outer periphery in the xy plane is 0.001 mm/h or more and 0.05 mm/h or less. Here, the growth rate in the center in the xy plane is made slower than the growth rate in the outer periphery. By performing crystal growth in this way, when the stress S applied to the first outer peripheral edge 1 is compressive stress, its absolute value is reduced, and when the stress S applied to the first outer peripheral edge 1 is tensile stress, its absolute value is reduced. can be increased. The growth rate is changed by changing the temperature of the crystal growth surface.

The temperature of the crystal growth surface can be adjusted by controlling the z-direction position of the heating center of the crucible 31 by the coil 36 . For example, the z-direction position of the heating center of the crucible 31 can be changed by changing the z-direction position of the coil 36 . The z-direction position of the heating center of the crucible 31 and the z-direction position of the crystal growth surface are controlled so as to separate at 0.5 mm/h. Here, the position of the heating center of the crucible 31 in the z-direction is controlled to be lower (toward the raw material powder 34 side) than the position of the crystal growth surface in the z-direction.

Then, SiC ingot 35 produced under such conditions is processed into SiC substrate 10 . In a general processing method, the stress applied to the single crystal changes depending on the state of the SiC ingot 35 and the state of the SiC substrate 10 . For example, in the molding process, it is necessary to reduce the diameter when processing the SiC ingot 35 with a diameter of 180 mm into the SiC substrate 10 with a diameter of 150 mm. In addition, for example, in the multi-wire cutting process, undulations occur on the surface, and it is necessary to remove the undulations. Through such a process, for example, a portion of the SiC ingot 35 having a large stress may be removed or the shape of the crystal lattice plane may be changed. may be opened. The SiC substrate 10 is processed so that the stress applied to the single crystal in the state of the SiC ingot 35 is inherited.

For example, after performing damage-free processing on one side of the SiC ingot 35, it is cut with a single wire saw, and the damage-free processing is further performed on the cut surface by sucking the surface subjected to the damage-free processing. By performing damage-free processing on both surfaces of SiC substrate 10 , part of the stress generated in the state of the SiC ingot is transferred to SiC substrate 10 . Damage-free processing is, for example, CMP processing. By processing the substrate so as to leave the lattice plane shape of the SiC ingot 35 in this manner, the stress of the SiC ingot 35 is transferred to the SiC substrate 10 . After that, the stress at the first outer peripheral end 1 of the SiC substrate 10 can be adjusted by performing a molding process for adjusting the diameter.

Also, when processing the SiC ingot 35 into the SiC substrate 10, the thickness _ts of the SiC substrate 10 is determined. In order to increase the number of SiC substrates 10 obtained from SiC ingot 35, if the thickness _ts of SiC substrate 10 is reduced, production efficiency increases. Design _s . A lower limit value of the thickness _ts of the SiC substrate 10 is predicted from the stress applied to the SiC substrate 10 that can be predicted from the diameter R of the SiC substrate 10 and the state of the SiC ingot, and the thickness _ts of the SiC substrate 10 is set to be thicker than this thickness. do.

Thus, by controlling the thickness ts of the SiC substrate 10 and the stress _S at the first outer peripheral edge 1 according to the diameter R of the SiC substrate 10 defined by the specifications, the warp factor F is equal to or less than the specified value. The SiC substrate 10 according to this embodiment can be produced.

As described above, the warpage factor F obtained from the diameter R, thickness t _s and stress S of the SiC substrate 10 has a correlation with the amount of warpage obtained by simulation when the treated layer 11 is formed on the SiC substrate 10 . Moreover, the simulation result when the treatment layer 11 is formed on the SiC substrate 10 has a correlation with the actual measurement value. That is, by using the warpage factor F obtained from the diameter R, thickness t _s and stress S of SiC substrate 10, the warpage of SiC substrate 10 after the processing process can be easily predicted.

The allowable value of warpage of the SiC substrate after the processing process differs depending on the specifications of the product and the processing process. As described above, if the warpage amount of the SiC substrate after obtaining the processing process can be predicted from the values of the diameter R, thickness t _s and stress S of the SiC substrate 10 before processing, it is possible to select the SiC substrate 10 before processing. can be done and the probability of rejection in the machining process can be reduced. Further, by reducing the film thickness _ts of the SiC substrate 10 within a range in which warping does not occur in the processing process, many SiC substrates 10 can be obtained from the SiC ingot 35, and production efficiency can be improved. By increasing the number of SiC substrates 10 obtained from SiC ingot 35 and reducing defects in the processing process due to warpage, the cost per SiC substrate 10 can be reduced.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to specific embodiments, and various can be transformed or changed.

(Example 1)
A simulation was performed to determine the warpage when the treatment layer was laminated on the surface of the SiC substrate. The simulation was performed using the finite element method simulator ANSYS. It was separately confirmed that the simulation using the finite element method simulator ANSYS matched the results of the actually manufactured product.

The simulation was performed in the following procedure. First, the physical property values of the SiC substrate and the surface layer with different stresses were set. The physical property values to be set are the thickness of the SiC substrate, the thickness of the surface layer, Young's modulus, and Poisson's ratio. The plate thickness of the SiC substrate was set to 350 μm. The diameter of the SiC substrate was 75 mm. The SiC substrate had a Young's modulus of 480 GPa and a Poisson's ratio of 0.20. The film thickness of the surface layer was 0.01 mm. Considering the case where stress is generated in the treated layer by ion implantation, the same values as those of the SiC substrate were used for the Young's modulus and Poisson's ratio of the surface layer.

Then, the warpage amount of the SiC substrate was obtained by changing the thickness of the SiC substrate and the stress applied to the first outer peripheral edge of the SiC substrate. The stress applied to the first outer peripheral edge was obtained in four patterns of −30 MPa (compressive stress), 0 MPa, +30 MPa (tensile stress), and +60 MPa (tensile stress).

(Example 2)
Example 2 differs from Example 1 in that the SiC substrate has a diameter of 100 mm. Other conditions were the same as in Example 1, and the amount of warpage of the SiC substrate was obtained by simulation.

(Example 3)
Example 3 differs from Example 1 in that the SiC substrate has a diameter of 150 mm. Other conditions were the same as in Example 1, and the amount of warpage of the SiC substrate was obtained by simulation.

(Example 4)
Example 4 differs from Example 1 in that the SiC substrate has a diameter of 200 mm. Other conditions were the same as in Example 1, and the amount of warpage of the SiC substrate was obtained by simulation.

(Example 5)
Example 5 differs from Example 1 in that the SiC substrate has a diameter of 250 mm. Other conditions were the same as in Example 1, and the amount of warpage of the SiC substrate was obtained by simulation.

(Example 6)
Example 6 differs from Example 1 in that the SiC substrate has a diameter of 300 mm. Other conditions were the same as in Example 1, and the amount of warpage of the SiC substrate was obtained by simulation.

FIG. 4 shows the relationship between the results of Examples 1 to 6 and the warpage parameter F. In FIG. That is, it can be confirmed that there is a correlation between the simulation result of the warpage of the SiC substrate after forming the treatment layer and the warpage parameter F of the SiC substrate before forming the treatment layer.

Further, from the results of Examples 1 to 6, it can be seen that the larger the diameter R of the SiC substrate, the larger the amount of warpage of the SiC substrate after processing. Further, from the results of Examples 1 to 6, it can be seen that the smaller the thickness _ts of the SiC substrate, the greater the amount of warpage of the SiC substrate after processing. Further, from the results of Examples 1 to 6, when the stress applied to the first outer peripheral end of the SiC substrate is compressive stress, the smaller the absolute value, and when the stress applied to the first outer peripheral end of the SiC substrate is tensile stress, the absolute value It can be seen that the larger the , the larger the amount of warpage of the SiC substrate after processing. This result agrees with the fact that the parameter that determines the warpage parameter F is obtained from the diameter R, thickness t _s and stress S of the SiC substrate.

REFERENCE SIGNS LIST 1 first outer peripheral edge 2 outer peripheral portion 10 SiC substrate 10a first surface 10b second surface 11 treated layer C center R diameter S stress

Claims (4)

A method for manufacturing a semiconductor device comprising a SiC substrate and a SiC epitaxial layer laminated on one surface of the SiC substrate,
As the SiC substrate, the warp factor represented by the following formula (1) obtained from the thickness, the diameter, and the stress related to the first outer peripheral edge 10 mm inside the outer peripheral edge in the [11-20] direction from the center. A method of manufacturing a semiconductor device using a SiC substrate having F of 300 μm or less.
F=K×exp(a+b×ln(σ)+c×ln(R)+d×ln(ts)) (1)
In formula (1),
K, a, b, c, d are constants satisfying K = 1.3373, a = -11.67123, b = 1.4030953, c = 1.8050972, d = -1.585898,
σ satisfies σ = 60 (MPa) - 2/3 × S (MPa),
S is the internal stress in the <1-100> direction, which is the same direction as the circumferential direction of the first outer peripheral end, and the tensile stress is positive and the compressive stress is negative, and _ts is the thickness ( mm), and R is the diameter (mm). 2. The method of manufacturing a semiconductor device according to claim 1, wherein said semiconductor device is a power device. 2. The method of manufacturing a semiconductor device according to claim 1, wherein said semiconductor device is a high frequency device. 2. The method of manufacturing a semiconductor device according to claim 1, wherein said semiconductor device is a high temperature operating device.

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