JP7213691B2 - electrostatic chuck - Google Patents

Description

The technology disclosed herein relates to electrostatic chucks.

Electrostatic chucks are used, for example, to hold wafers during semiconductor manufacturing. An electrostatic chuck includes a plate-like member made of, for example, ceramics, a base member made of, for example, metal, a joint for joining the plate-like member and the base member, and a chuck electrode provided inside the plate-like member. The wafer is attracted and held on the first surface (attraction surface) of the plate-like member using electrostatic attraction generated by applying a voltage to the chuck electrode.

Each process (film formation, etching, etc.) on the wafer held by the electrostatic chuck is performed by, for example, drawing plasma ions into the wafer. The generation of plasma ions is performed, for example, by connecting a high-frequency power source for generating plasma ions to an electrode and a base member arranged outside the electrostatic chuck and applying a high-frequency voltage to convert the processing gas into plasma. will be

In the electrostatic chuck, deterioration of joints and wear of plate-like members may occur due to long-term use. In such a case, a technique is known in which the plate-shaped member and the base member that are bonded together are separated, and at least one of the plate-shaped member and the base member is reused to manufacture a new electrostatic chuck. (See Patent Document 1, for example). Conventionally, the plate-shaped member and the base member are separated by scraping off the adhesive layer using a metal blade or wire saw, or by heating an electrostatic chuck to a high temperature (for example, 200 to 400° C.). It is carried out by a method of thermally decomposing the included adhesive.

JP 2007-129142 A

In the above-described method of scraping off the joint portion using a metal blade, wire saw, or the like, for example, it is necessary to align the metal blade, wire saw, or the like with the cut portion between the plate-shaped member and the base member. There is a risk of damaging the side surfaces of the plate-shaped member and the base member during cutting. Moreover, it is difficult to cut a desired portion inside between the plate member and the base member. In addition, there is a risk of contamination due to scraps generated during scraping. For this reason, there is a possibility that the reuse of the plate-shaped member and the base member will be hindered. Moreover, in the above-described method of heating the electrostatic chuck to thermally decompose the adhesive contained in the joint portion, the plate-shaped member and the base member may be deformed by the heat, and contamination may occur due to combustion of organic substances, etc. , there is also a risk of hindering the reuse of the plate member and the base member.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) The electrostatic chuck disclosed in this specification is a plate member having a first surface substantially perpendicular to a first direction and a second surface opposite to the first surface. a base member having a third surface, the third surface being positioned on the second surface side of the plate-like member; and between the plate-like member and the base member and a bonding portion formed of a resin material, the electrostatic chuck holding an object on the first surface of the plate-like member, wherein the plate-like member and the base member an inner portion arranged between and overlapping with the joint portion when viewed in the first direction; a wire portion having an outer portion located outside the member;

In this electrostatic chuck, by applying an external force to the outer portion of the wire portion, the inner portion can be moved inside between the plate member and the base member. Thereby, the plate member and the base member can be separated at the portion where the inner portion moves. As described above, in the present electrostatic chuck, since both members can be separated at a portion between the plate-shaped member and the base member, compared to the case where the two members are not separated at that portion, after that, Both members can be completely separated with a relatively small force. Therefore, as a step for separating the plate-shaped member and the base member that constitute the electrostatic chuck, a step of heating the electrostatic chuck to the decomposition temperature of the adhesive contained in the joint is not required. It is possible to suppress deformation and the like of the shaped member and the base member due to heat. In addition, according to the present electrostatic chuck, since the inner portion is preliminarily arranged between the plate-like member and the base member, the wire portion is aligned with the desired cut portion between the plate-like member and the base member. In addition, it is possible to suppress damage to the side surfaces of the plate-shaped member and the base member during the alignment and cutting. Further, according to this electrostatic chuck, it is possible to separate the plate-like member and the base member in the interior between the plate-like member and the base member. Therefore, it is possible to suppress the scattering of debris of the joint portion generated during the separation to the outside of the electrostatic chuck, thereby suppressing the occurrence of contamination.

(2) The electrostatic chuck includes an electrode arranged on the plate-like member and at least one power supply terminal electrically connected to the electrode, wherein the at least one The one power supply terminal may be arranged only in one of two regions defined by the inner portion of the wire portion and the outer edge of the joint portion. According to this electrostatic chuck, by moving the inner portion in the other of the two regions, i.e., the region in which the power supply terminal is not arranged in the two regions, the power supply terminal is not interfered with. , can be separated between the plate member and the base member.

(3) In the electrostatic chuck, the center of the plate member may be located in the other of the two regions when viewed from the first direction. According to this electrostatic chuck, by moving the inner portion in the other of the above two regions, it is possible to move the inner portion without interfering with the power supply terminal, and furthermore, at the portion where it is difficult to separate the plate-like member and the base member. When viewed from the first direction, the plate-like member and the base member can be separated at a portion including the center of the plate-like member.

(4) In the above electrostatic chuck, the ratio of the area of the other of the two regions to the area of the region surrounded by the outer edge of the joint when viewed from the first direction is 70% or more. may be According to this electrostatic chuck, the plate member and the base member can be separated in a wider range.

(5) The electrostatic chuck may include a plurality of wire portions. In this electrostatic chuck, each of the inner portions of the plurality of wire portions can be moved inside between the plate member and the base member. Thus, according to the present electrostatic chuck, the plate-like member and the base member can be separated at a plurality of desired portions in the interior between the plate-like member and the base member.

(6) In the electrostatic chuck, the total length of the inner portion and the outer portion may be equal to or greater than the length of the outer edge of the joint portion. According to the present electrostatic chuck, when viewed from the first direction, the plate-like member and the base member can be arranged in a wider range, and thus the plate-like member and the base member can be separated in a wider range. can do.

(7) In the above electrostatic chuck, the tensile strength of the wire portion may be greater than the tensile strength of the joint portion. According to this electrostatic chuck, the wire portion can efficiently cut the joint portion existing between the plate member and the base member.

(8) In the electrostatic chuck, the wire portion may be made of a resin material. According to this electrostatic chuck, it is possible to suppress damage to the plate-like member and the base member when cutting between them, compared to the case where the chuck is made of a metal material. In addition, in this electrostatic chuck, the wire portion is made of a resin material like the joint portion, so that the wire portion has a thermal conductivity close to that of the joint portion. Therefore, according to the present electrostatic chuck, by providing the wire portion, it is possible to suppress the occurrence of variations in thermal conductivity in the joint portion. Moreover, according to the present electrostatic chuck, it is possible to ensure good plasma resistance during use of the electrostatic chuck, as compared with the case where the wire portion is made of a metal material.

(9) The electrostatic chuck may include a protective member that covers the outer portion. According to this electrostatic chuck, when the electrostatic chuck is used, the outer portion is fixed to the electrostatic chuck and is not exposed to the outside of the electrostatic chuck, so good handleability can be ensured.

The technology disclosed in this specification can be implemented in various forms, for example, in the form of an electrostatic chuck and its manufacturing method.

1 is a perspective view schematically showing an appearance configuration of an electrostatic chuck 100 according to a first embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of electrostatic zipper 100 in a 1st embodiment. It is an explanatory view showing roughly XY section composition of electrostatic chuck 100 in a 1st embodiment. FIG. 4 is an explanatory view schematically showing the XZ cross-sectional configuration of a portion (X1 section in FIGS. 2 and 3) of the electrostatic chuck 100 in the first embodiment; It is explanatory drawing which shows roughly the XY cross-sectional structure of the electrostatic chuck 100a in 2nd Embodiment.

A. This embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 100 according to the present embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100 according to the present embodiment. 3 is an explanatory view schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 in this embodiment. FIG. 2 shows the XZ cross-sectional configuration of the electrostatic chuck 100 at the position II-II in FIG. FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position III-III in FIG. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a semiconductor wafer W) by electrostatic attraction. used to The electrostatic chuck 100 includes a plate-like member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (vertical direction (Z-axis direction) in this embodiment). The plate-like member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the plate-like member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction with a joint portion 30 to be described later interposed therebetween. be done. That is, the base member 20 is arranged such that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the plate-like member 10 .

The plate-shaped member 10 is a member having a substantially circular planar upper surface (hereinafter referred to as “adsorption surface”) S1 substantially orthogonal to the arrangement direction (Z-axis direction) described above. etc.). The plate member 10 has a diameter of, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and a thickness of, for example, about 1 mm to 10 mm. The adsorption surface S1 of the plate member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the Z-axis direction is It corresponds to the first direction in the claims. Further, in this specification, the direction orthogonal to the Z-axis direction is also referred to as the "plane direction".

As shown in FIG. 2, a chuck electrode 40 made of a conductive material (eg, tungsten, molybdenum, platinum, etc.) is arranged inside the plate member 10 . The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power supply (not shown), electrostatic attraction is generated, and the wafer W is attracted and fixed to the attraction surface S1 of the plate member 10 by this electrostatic attraction.

Inside the plate-like member 10, a heater electrode 50 is arranged which is composed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, platinum, etc.). When a voltage is applied to the heater electrode 50 from a power supply (not shown), the heater electrode 50 generates heat, thereby warming the plate-like member 10, thereby warming the wafer W held on the suction surface S1 of the plate-like member 10. be done. Thereby, control of the temperature distribution of the wafer W is realized.

The base member 20 is, for example, a circular planar plate-like member having the same diameter as the plate-like member 10 or a larger diameter than the plate-like member 10, and is made of metal (aluminum, aluminum alloy, etc.), for example. The diameter of the base member 20 is, for example, approximately 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, approximately 20 mm to 40 mm. The top surface S3 of the base member 20 corresponds to the third surface in the claims.

The base member 20 is joined to the plate member 10 by a joining portion 30 arranged between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. As shown in FIG. The thickness of the joint portion 30 is, for example, about 0.1 mm to 1.5 mm. The joint portion 30 is made of a resin material (adhesive material). In this specification, "made of a resin material" means that the joint portion 30 contains a resin material as a main component. Further, in this specification, the term "main component" means a component with a volume content of greater than 50 vol%. Various resin materials such as silicone resin, fluororesin, acrylic resin, and epoxy resin can be used as the resin material for forming the joint 30. However, from the viewpoint of high heat resistance and good flexibility, , a silicone resin or an acrylic resin is preferably used. In addition to the resin material, the joint portion 30 may contain a filler such as ceramic powder. Moreover, in the present embodiment, the tensile strength of the joint portion 30 is, for example, 0.5 MPa or more. In addition, the value of the tensile strength can be calculated using the evaluation method described later. Further, from the viewpoint of good heat transfer (heat dissipation) between the plate member 10 and the base member 20 via the joint 30, the thermal conductivity of the resin material forming the joint 30 is 0.3 W. /m·K or more. The electrostatic chuck 100 also includes a wire portion 60 between the plate member 10 and the base member 20 . In this embodiment, the wire portion 60 is arranged inside the joint portion 30 (see FIG. 3). The configuration around the joint portion 30 including the wire portion 60 will be described in detail later.

A coolant channel 21 is formed inside the base member 20 . When a coolant (for example, a fluorine-based inert liquid, water, or the like) is caused to flow through the coolant channel 21 , the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-like member 10 via the joint portion 30 . The plate-like member 10 is cooled by (thermal drawing), and the wafer W held on the adsorption surface S1 of the plate-like member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Configuration for power supply to chuck electrode 40 and heater electrode 50:
Next, a configuration for supplying power to the chuck electrode 40 and the heater electrode 50 will be described with reference to FIG. The electrostatic chuck 100 has a configuration for supplying power to the heater electrode 50 . That is, as shown in FIG. 2, the electrostatic chuck 100 is formed with a heater electrode terminal hole 150 extending from the lower surface S4 of the base member 20 to the inside of the plate-like member 10 . The heater electrode terminal hole 150 includes a through hole 25 vertically penetrating the base member 20 , a through hole 35 vertically penetrating the joint portion 30 , and a concave portion formed on the lower surface S<b>2 side of the plate member 10 . 15 is an integrated hole formed by communicating with each other. In the present embodiment, the through holes 25 and 35 forming the heater electrode terminal hole 150 are circular holes in cross section (parallel to the surface direction).

A heater electrode electrode pad 52 electrically connected to the heater electrode 50 via a heater electrode via 51 is arranged on the bottom surface of the recess 15 forming the heater electrode terminal hole 150 in the plate member 10 . there is The heater electrode pad 52 and the heater electrode via 51 are made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). The heater electrode pad 52 is entirely exposed from the plate member 10 in the thickness direction (Z-axis direction). However, as long as the lower surface of the heater electrode electrode pad 52 is exposed from the plate-like member 10 , a part or the whole of the heater electrode electrode pad 52 in the thickness direction may be embedded in the plate-like member 10 . .

A columnar heater electrode power supply terminal 54 extending in the Z-axis direction is arranged in the heater electrode terminal hole 150 . In this embodiment, the XY cross section (the cross section parallel to the surface direction) of the heater electrode power supply terminal 54 is circular. The upper end of the heater electrode power supply terminal 54 faces the heater electrode electrode pad 52 with a gap therebetween. It is joined to the electrode pad 52 for the power supply.

The configuration for powering the heater electrode 50 is as described above. When the electrostatic chuck 100 is used, a power supply (not shown) is connected to the heater electrode 50 through the heater electrode power supply terminal 54 , the heater electrode electrode pad 52 , and the heater electrode via 51 . A voltage is applied to the electrode 50 . Thereby, the heater electrode 50 generates heat.

The configuration for supplying power to the chuck electrode 40 is the same as the configuration for supplying power to the heater electrode 50 . That is, as shown in FIG. 2, the electrostatic chuck 100 is formed with a chuck electrode terminal hole 140 extending from the lower surface S4 of the base member 20 to the inside of the plate-shaped member 10 . The chuck electrode terminal hole 140 includes a through hole 24 vertically penetrating the base member 20 , a through hole 34 vertically penetrating the joint portion 30 , and a concave portion formed on the lower surface S<b>2 side of the plate member 10 . 14 is an integrated hole formed by communicating with each other. Further, a chuck electrode electrode pad 42 electrically connected to the chuck electrode 40 via a chuck electrode via 41 is arranged on the bottom surface of the concave portion 14 forming the chuck electrode terminal hole 140 in the plate member 10 . It is The configurations of the chuck electrode pad 42 and the chuck electrode via 41 are the same as those of the heater electrode pad 52 and the heater electrode via 51, and thus description thereof is omitted. In the chuck electrode terminal hole 140 , a columnar chuck electrode power supply terminal 44 extending in the Z-axis direction and made of metal is arranged.

When the electrostatic chuck 100 is used, a power source (not shown) is connected to the chuck electrode 40 through the chuck electrode power supply terminal 44 , the chuck electrode electrode pad 42 and the chuck electrode via 41 . A voltage is applied to the electrode 40 . As a result, an electrostatic attractive force is generated for attracting and fixing the wafer W to the attracting surface S1.

The chuck electrode electrode pad 42 and the heater electrode electrode pad 52 correspond to the electrodes in the claims, and the chuck electrode power supply terminal 44 and the heater electrode power supply terminal 54 correspond to the power supply terminals in the claims. . Hereinafter, the chuck electrode electrode pad 42 and the heater electrode electrode pad 52 may be collectively referred to as the electrode pads 42 and 52, and the chuck electrode power supply terminal 44 and the heater electrode power supply terminal 54 may be collectively referred to as the power supply terminals 44 and 54, respectively. 54, and the chuck electrode terminal hole 140 and the heater electrode terminal hole 150 are collectively called terminal holes 140 and 150 in some cases.

As shown in FIG. 3, in the present embodiment, the electrostatic chuck 100 includes one chuck electrode power supply terminal 44 (chuck electrode terminal hole 140) and seven heater electrode power supply terminals 54 (heater electrode terminal hole 140). A total of eight power supply terminals 44, 54 (terminal holes 140, 150) are provided. Further, in this embodiment, these eight power supply terminals 44 and 54 (terminal holes 140 and 150) are arranged in the circumferential direction near the outer circumference of the joint portion 30 as viewed in the Z-axis direction. More specifically, in the power supply terminals 44 and 54, the distance Lr between the center PO of the joint portion 30 and the center of the power supply terminals 44 and 54 is half the radius R of the joint portion 30 when viewed in the Z-axis direction. It is arranged at a position where the length is longer than Also, the difference between the radius R of the joint portion 30 and the distance Lr (that is, “radius R of the attraction surface S1−distance Lr”) is preferably 75 mm or less, for example.

A-3. Detailed configuration around joint 30:
Next, a detailed configuration around the joint 30 will be described. FIG. 4 is an explanatory view showing an enlarged XZ cross-sectional configuration of the peripheral portion (X1 portion in FIGS. 2 and 3) of the joint portion 30 of the electrostatic chuck 100 of this embodiment.

As described above, the electrostatic chuck 100 of this embodiment includes one wire portion 60 inside the bonding portion 30 . As shown in FIG. 3 , in this embodiment, the wire portion 60 has one inner portion 601 and two outer portions 603 that are continuous with the inner portion 601 . The inner portion 601 is a portion arranged so as to overlap the joint portion 30 when viewed in the Z-axis direction, and the outer portion 603 is a portion located outside the plate member 10 when viewed in the Z-axis direction. Thus, the wire portion 60 is a single linear member composed of the inner portion 601 and the two outer portions 603 .

In the present embodiment, the wire portion 60 ensures good thermal conductivity and good plasma resistance, and when fragments of the wire portion 60 are generated, the wafer W, semiconductor manufacturing equipment, plasma, etc. are not affected. From a small point of view, it is made of a resin material. Moreover, in the present embodiment, the tensile strength of the wire portion 60 is preferably greater than the tensile strength of the joint portion 30, and more specifically, it is preferably greater than the tensile strength of the joint portion 30 by 20% or more. The tensile strength of the wire portion 60 is more preferably 0.6 MPa or more, particularly preferably 1 MPa or more. Moreover, in the present embodiment, the cross-sectional shape of the wire portion 60 (the cross-sectional shape in the direction perpendicular to the longitudinal direction of the wire portion 60) is substantially circular. In the present embodiment, the cross-sectional diameter of the wire portion 60 is, for example, one-third or less of the thickness of the joint portion 30 from the viewpoint of ensuring the adhesiveness between the plate-like member 10 and the base member 20. is preferred. Moreover, from the viewpoint of ensuring the strength of the wire portion 60, the cross-sectional diameter of the wire portion 60 is preferably 100 μm or more. More specifically, the cross-sectional diameter of the wire portion 60 is preferably 10 μm or more and 150 μm or less.

As shown in FIG. 3, in the present embodiment, the inner portion 601 of the wire portion 60 is arranged in a substantially circular shape in a portion other than the portion connected to the outer portion 603 as viewed in the Z-axis direction. In this embodiment, the inner portion 601 is arranged closer to the center PO than the terminal holes 140 and 150 and close to the terminal holes 140 and 150 in the joint portion 30 as viewed in the Z-axis direction. More specifically, when viewed in the Z-axis direction, the shortest distance W1 (see FIG. 4) between the inner portion 601 and the outer edges of the terminal holes 140 and 150 is 3 mm or more and 15 mm or less. In this embodiment, the XY cross section of the joint portion 30 includes an outer region R1 that is an outer region partitioned by the inner portion 601 and an inner region R2 that is an inner region. In this embodiment, the outer region R1 is a region surrounded by the outer edge of the joint portion 30 and the inner portion 601, and is a region where all the power supply terminals 44 and 54 are located. On the other hand, the inner region R2 is a region surrounded by the outer edge of the joint portion 30 and the inner portion 601, where the center PO of the joint portion 30 is located and neither of the power supply terminals 44, 54 is located. area. That is, when viewed in the Z-axis direction, all the power supply terminals 44 and 54 are located within two regions (outer region R1 and inner region R2) defined by the inner portion 601 of the wire portion 60 and the outer edge of the joint portion 30. is arranged only in the outer region R1, which is one of the . In addition, when viewed in the Z-axis direction, the center PO of the plate member 10 is located in the inner region R2, which is the other of the two regions (the outer region R1 and the inner region R2). In this embodiment, when viewed in the Z-axis direction, the ratio of the area of the inner region R2, which is the region where the power supply terminals 44 and 54 are not located, to the area of the entire joint portion 30 composed of the outer region R1 and the inner region R2. The ratio is preferably 70% or more. The outer region R1 corresponds to "one of the two regions" in the claims, and the inner region R2 corresponds to "the other of the two regions" in the claims.

In the present embodiment, the length of the wire portion 60, that is, the sum of the length Li of the inner portion 601 and the length Lo of the outer portion 603 (Li+Lo×2) is the length Lb of the outer edge of the joint portion 30. That's it. Good operability when separating the plate-like member 10 and the base member 20, which will be described later, and enables separation of the joint 30 (that is, between the plate-like member 10 and the base member 20) in a wide range. From a viewpoint, the length (Li+Lo×2) of the wire portion 60 is preferably longer than the length Lb of the outer edge of the joint portion 30 by 50 mm or more. In addition, the length Lo of the outer portion 603 is preferably 25 mm or more from the viewpoint of operability during the separation. Also, the distance D0 between the two outer portions 603 and along the outer edge of the joint portion 30 is 450 mm or less from the viewpoint of workability.

In addition, as shown in FIG. 4, in the present embodiment, the inner portion 601 of the wire portion 60 is arranged at the center of the joint portion 30 in the Z-axis direction. That is, in the Z-axis direction, the distance D1 between the lower surface S2 of the plate member 10 and the inner portion 601 and the distance D2 between the upper surface S3 of the base member 20 and the inner portion 601 are the same.

A-4. Separation method of electrostatic chuck 100:
Next, a method for separating the electrostatic chuck 100 according to this embodiment will be described. The separation method of the electrostatic chuck 100 is a method of separating the plate-like member 10 and the base member 20 that are bonded together in the electrostatic chuck 100 . First, the electrostatic chuck 100 is fixed. Next, the two outer portions 603 of the wire portion 60 are gripped, and the gripped two outer portions 603 are pulled in the direction of the arrow shown in FIG. That is, by pulling the two outer parts 603 in the same direction, the inner part 601 is pulled in a direction in which it can be taken out of the electrostatic chuck 100 without interfering with the power supply terminals 44 and 54 . As a result, the joint 30 can be destroyed at a portion of the inside of the joint 30 through which the inner portion 601 has passed (that is, the inner region R2). Thereafter, the plate-like member 10 and the base member 20 of the electrostatic chuck 100 are respectively fixed, and, for example, by vibrating them or rotating them in opposite directions, the plate-like member 10 and the base member are separated. 20.

A-5. Manufacturing method of electrostatic chuck 100:
A method for manufacturing the electrostatic chuck 100 of the present embodiment is, for example, as follows. First, the plate member 10 is produced by a known method. For example, a plurality of ceramic green sheets are produced, and predetermined processing is performed on predetermined ceramic green sheets. The predetermined processing includes, for example, printing of metallized paste for forming the chuck electrode 40 and the heater electrode 50, drilling and filling of the metallized paste for forming various vias, and formation of the terminal holes 140 and 150. Holes such as recesses 14 and 15 may be formed. These ceramic green sheets are laminated, thermocompressed, and processed such as cutting to produce a ceramic green sheet laminate. By sintering the produced laminate of ceramic green sheets, the plate member 10, which is a ceramic sintered body, is produced. Also, the base member 20 is produced by a known method.

Also, a sheet-like adhesive for forming the joint portion 30 is prepared. Specifically, a paste prepared by adding a filler to a liquid resin material is applied, for example, as a film on a release sheet, and then semi-cured by a predetermined curing treatment to prepare a sheet-like adhesive. do. The produced sheet-like adhesive is punched, for example, so that the sheet-like adhesive is formed into a desired shape (for example, substantially circular), and holes such as recesses 14 and 15 are formed. Two such sheet adhesives are prepared. A commercially available wire portion 60 (for example, Kevlar thread (Kevlar (registered trademark) thread) manufactured by Matsuken Co., Ltd.) is placed on the upper surface of one of the two sheets of the prepared adhesive sheet. More specifically, as shown in FIG. 3, the sheet-like adhesive is applied so that the inner portion 601 in the joint portion 30 is located inside the power supply terminals 44 and 54 (terminal holes 140 and 150) in the Z-axis direction. The inner part 601 is arranged against. After that, the sheet-like adhesive on which the wire portion 60 is arranged is applied so as to sandwich the wire portion 60 and to match the positions of the recesses 14 and 15 in the Z-axis direction. Laminate the other of the Thus, a sheet adhesive is produced.

After that, the plate-like member 10 and the base member 20 are joined using a sheet-like adhesive. Specifically, a sheet-like adhesive is placed on one surface (joint surface) of the plate-like member 10 and the base member 20, and the plate-like member 10 and the base member 20 are bonded via the sheet-like adhesive. , a bonding portion 30 is formed by performing a curing process for curing the sheet adhesive. The electrostatic chuck 100 of the present embodiment is manufactured mainly through the above steps.

A-6. Tensile strength evaluation method:
In the present embodiment, the above tensile strength value was calculated by the following method. A known tensile tester (for example, Shimadzu Autograph (AG-IS)) was used to measure the tensile strength of the joint portion 30 and the wire portion 60 in a tensile test (performed at 50 mm/min). Each test piece for measurement of the joint portion 30 and the wire portion 60 was produced as follows. The test piece of the joint portion 30 was obtained by curing the adhesive sheet prepared as described above at 100° C. for 10 hours and then at 150° C. for 50 hours to obtain a test piece of 10 mm width×70 mm length×0.35 mm thickness. A test piece was produced by cutting it into strips. A test piece of the wire portion 60 was prepared by cutting the wire portion 60 into a length of 100 mm. Tensile strength is obtained by pulling the test piece (joint portion 30 and wire portion 60) until it breaks, and dividing the maximum point test force at that time by the cross-sectional area of the test piece (width 10 mm × thickness 0.35 mm). Calculated.

A-7. Effect of the first embodiment:
As described above, the electrostatic chuck 100 of the present embodiment includes the plate-like member 10 having the attraction surface S1 substantially perpendicular to the Z-axis direction, the lower surface S2 opposite to the attraction surface S1, and the upper surface S3. a base member 20 arranged such that the upper surface S3 is located on the lower surface S2 side of the plate member 10; The electrostatic chuck 100 includes a bonding portion 30 and holds an object (wafer W) on the attraction surface S<b>1 of the plate member 10 . The electrostatic chuck 100 of this embodiment also includes a wire portion 60 having an inner portion 601 and an outer portion 603 . The inner portion 601 is a portion of the wire portion 60 that is arranged between the plate-like member 10 and the base member 20 and is arranged so as to overlap the joint portion 30 as viewed in the Z-axis direction. The outer portion 603 is a portion of the wire portion 60 that is continuous with the inner portion 601 and positioned outside the plate member 10 as viewed in the Z-axis direction.

Since the electrostatic chuck 100 of the present embodiment employs the above configuration, by applying an external force to the outer portion 603 of the wire portion 60, the inside between the plate member 10 and the base member 20 (this embodiment , inside the joint 30), the inner part 601 can be moved. Thereby, the plate-like member 10 and the base member 20 can be separated from each other at the portion where the inner portion 601 moves (in this embodiment, the inner region R2 of the joint portion 30). As described above, in the electrostatic chuck 100 of the present embodiment, the plate-like member 10 and the base member 20 can be separated at a portion between them, so the two members are not separated at that portion. The two parts can then be completely separated with relatively little force compared to the case. Therefore, as a process for separating the plate-like member 10 and the base member 20 that constitute the electrostatic chuck 100, a process of heating the electrostatic chuck 100 to the decomposition temperature of the adhesive contained in the joint portion 30, or the like is performed. Therefore, it is possible to suppress deformation of the plate member 10 and the base member 20 due to heat. Further, according to the electrostatic chuck 100 of the present embodiment, since the inner portion 601 is arranged in advance between the plate-like member 10 and the base member 20, a desired amount of space between the plate-like member 10 and the base member 20 can be obtained. It is not necessary to align the wire portion 60 with the cut portion, and it is possible to suppress damage to the side surfaces of the plate-like member 10 and the base member 20 during the alignment and cutting. Further, according to the electrostatic chuck 100 of the present embodiment, the plate-like member 10 and the base member 20 can be separated inside between the plate-like member 10 and the base member 20 . Therefore, it is possible to suppress the scattering of dust of the joint portion 30 generated during the separation to the outside of the electrostatic chuck 100, thereby suppressing the occurrence of contamination.

In addition, the electrostatic chuck 100 of the present embodiment includes electrode pads 42 and 52 arranged on the plate-like member 10, eight power supply terminals 44 and 54 electrically connected to the electrode pads 42 and 52, These eight power supply terminals 44 and 54 are located within two regions (outer region R1 and inner region R2) defined by the inner portion 601 of the wire portion 60 and the outer edge of the joint portion 30 when viewed in the Z-axis direction. It is arranged only in one outer region R1. Therefore, according to the electrostatic chuck 100 of the present embodiment, the inner region R2 of the two regions (the outer region R1 and the inner region R2), that is, the region where the power supply terminals 44 and 54 are not arranged, By moving the portion 601, the plate member 10 and the base member 20 can be separated without interfering with the power supply terminals 44 and 54. FIG.

In addition, in the electrostatic chuck 100 of the present embodiment, the center PO of the plate member 10 is located in the inner region R2, which is the other of the two regions (the outer region R1 and the inner region R2) when viewed in the Z-axis direction. are doing. Therefore, according to the electrostatic chuck 100 of the present embodiment, by moving the inner portion 601 in the inner region R2 of the two regions (the outer region R1 and the inner region R2), the power supply terminals 44 and 54 are In the Z-axis view, a portion including the center PO of the joint portion 30 (the plate-like member 10), which is a portion where it is difficult to separate the plate-like member 10 and the base member 20 without interfering with each other, has a plate-like shape. A separation can be provided between the member 10 and the base member 20 .

In addition, in the electrostatic chuck 100 of the present embodiment, the other of the two regions (the outer region R1 and the inner region R2) with respect to the area of the region surrounded by the outer edge of the joint portion 30 when viewed in the Z-axis direction. The area ratio of the inner region R2 is 70% or more. Therefore, according to the electrostatic chuck 100 of the present embodiment, the plate member 10 and the base member 20 can be separated in a wider range.

In addition, in the electrostatic chuck 100 of the present embodiment, the sum of the length Li of the inner portion 601 and the length (Lo×2) of the outer portion 603 is equal to or greater than the outer edge length Lb of the joint portion 30 . Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to arrange a wider range between the plate-like member 10 and the base member 20 when viewed in the Z-axis direction. A wider separation between the members 20 is possible.

Moreover, in the electrostatic chuck 100 of the present embodiment, the tensile strength of the wire portion 60 is greater than the tensile strength of the joint portion 30 . Therefore, according to the electrostatic chuck 100 of the present embodiment, the wire portion 60 can efficiently cut the joint portion 30 existing between the plate-like member 10 and the base member 20 .

Moreover, in the electrostatic chuck 100 of the present embodiment, the wire portion 60 is made of a resin material. Therefore, according to the electrostatic chuck 100 of the present embodiment, when cutting between the plate-like member 10 and the base member 20, damage to both members is suppressed compared to the case where the chuck is made of a metal material. can do. Also, in the electrostatic chuck 100 of the present embodiment, the wire portion 60 is made of a resin material like the bonding portion 30 , so the wire portion 60 has a thermal conductivity close to that of the bonding portion 30 . Therefore, according to the electrostatic chuck 100 of the present embodiment, by providing the wire portion 60 , it is possible to suppress variations in thermal conductivity in the joint portion 30 . Further, according to the electrostatic chuck 100 of the present embodiment, it is possible to ensure good plasma resistance during use of the electrostatic chuck 100 compared to the case where the wire portion 60 is made of a metal material.

B. Second embodiment:
B-1. Configuration of electrostatic chuck 100a:
FIG. 5 is an explanatory view schematically showing the XY cross-sectional configuration of the electrostatic chuck 100a of the second embodiment. FIG. 5 shows the XY cross-sectional configuration of the electrostatic chuck 100a of the second embodiment corresponding to the cross section of FIG. 3 described above. Below, among the configurations of the electrostatic chuck 100a of the second embodiment, the configurations that are the same as the configurations of the electrostatic chuck 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. .

As shown in FIG. 5, the configuration of the electrostatic chuck 100a of the second embodiment is different from the configuration of the electrostatic chuck 100 of the first embodiment described above. 150) and the number and arrangement of the wire portions 60 are different. Specifically, the electrostatic chuck 100a of the second embodiment includes one chuck electrode power supply terminal 44 (chuck electrode terminal hole 140) and three heater electrode power supply terminals 54 (heater electrode terminal holes 140). A total of four power supply terminals 44, 54 (terminal holes 140, 150) are provided. Further, in the electrostatic chuck 100a of the second embodiment, the four power supply terminals 44 and 54 are arranged near the center of the joint portion 30a as viewed in the Z-axis direction.

Further, in the electrostatic chuck 100a of the second embodiment, two wire portions 60a and 60b are arranged inside the joint portion 30a. As shown in FIG. 5, in this embodiment, the wire portions 60a and 60b each have one inner portion 601a and 601b and two outer portions 603a and 603b that are continuous with the inner portions 601a and 601b. there is As with the inner portion 601 of the first embodiment, the inner portions 601a and 601b are portions arranged so as to overlap with the joint portion 30a when viewed in the Z-axis direction, and the outer portions 603a and 603b are portions arranged in the Z-axis direction view. 2 is a portion located outside the plate-shaped member 10 in FIG. In this manner, the wire portions 60a and 60b are linear members composed of inner portions 601a and 601b and two outer portions 603a and 603b, respectively.

In this embodiment, the wire portions 60a and 60b are made of a resin material, like the wire portion 60 of the first embodiment. The tensile strength of the wire portions 60a and 60b, the thermal conductivity of the resin material forming the wire portions 60a and 60b, and the cross-sectional shape and cross-sectional diameter of the wire portions 60a and 60b are also the same as those of the wire portion 60. . That is, the tensile strength of the wire portions 60a and 60b is greater than the tensile strength of the joint portion 30a, and the thermal conductivity of the resin material forming the wire portions 60a and 60b is the same as the thermal conductivity of the resin material forming the joint portion 30a. Equivalence is preferred. Moreover, it is preferable that the wire portions 60a and 60b have a substantially circular cross-sectional shape and a diameter of, for example, 10 μm or more and 150 μm or less.

As shown in FIG. 5, in this embodiment, the wire portions 60a and 60b separate different regions from each other in the joint portion 30a as viewed in the Z-axis direction, and separate the joint portion 30a over a wider range. are placed in More specifically, inner portions 601a and 601b of wire portions 60a and 60b are portions other than the vicinity of the center of joint portion 30a (that is, portions where power supply terminals 44 and 54 (terminal holes 140 and 150) exist). , they are arranged close to each other without intersecting each other on a straight line that substantially coincides with the radial direction of the joint portion 30a. On the other hand, the inner portions 601a and 601b are arranged along the outer edges of the terminal area A surrounding the four power supply terminals 44 and 54 (the terminal holes 140 and 150) near the center of the joint portion 30a. More specifically, the inner portion 601a is arranged along a portion of the outer edge of the terminal area A, while the inner portion 601b is arranged along a portion of the outer edge of the terminal area A other than the part. .

In this embodiment, the inner portion 601a of one wire portion 60a divides the XY cross section of the joint portion 30a into an outer region R3 and an inner region R4. The outer region R3 is a region on the side where the power supply terminals 44 and 54 are located, and the inner region R4 is the other region of the outer region R3 and is a region where none of the power supply terminals 44 and 54 are located. That is, when viewed in the Z-axis direction, all the power supply terminals 44 and 54 are located within two regions (outer region R3 and inner region R4) defined by the inner portion 601a of the wire portion 60a and the outer edge of the joint portion 30a. is arranged only in the outer region R3, which is one of the . As for the inner portion 601b of the other wire portion 60b, similarly to the inner portion 601a of the one wire portion 60a, the XY section of the joint portion 30a is divided into an outer region and an inner region (not shown). In this way, when viewed in the Z-axis direction, the inner region R2 of the inner portion 601a and the inner region of the inner portion 601b do not overlap, and the portion of the XY cross section of the joint portion 30a excluding the terminal region A is occupied by both inner regions of inner portions 601a and 601b. Thereby, the wire portions 60a and 60b can separate different regions from each other in the joint portion 30a as viewed in the Z-axis direction, and separate the joint portion 30a over a wider range. The outer region R3 corresponds to "one of the two regions" in the claims, and the inner region R4 corresponds to "the other of the two regions" in the claims.

Further, in this embodiment, the length of the wire portion 60a, that is, the sum of the length of the inner portion 601a and the outer portion 603a is equal to or greater than the length of the diameter of the joint portion 30a. From the standpoint of good operability when separating the plate-like member 10 and the base member 20, and enabling separation of the joint portion 30a (that is, between the plate-like member 10 and the base member 20) over a wide range. , The length of the wire portion 60a is preferably longer than the length of the diameter of the joint portion 30a by 50 mm or more. In addition, the length of the outer portion 603a is preferably 25 mm or more from the viewpoint of operability during separation, like the outer portion 603 in the first embodiment.

Also in this embodiment, inner portions 601a and 601b of the wire portions 60a and 60b are arranged in the center of the joint portion 30a in the Z-axis direction, similarly to the wire portion 60 of the first embodiment. .

The electrostatic chuck 100a differs from the method of manufacturing the electrostatic chuck 100 of the first embodiment in that the wire portions 60a and 60b are arranged as described above. can do.

B-2. Separation method of electrostatic chuck 100a:
Next, a method for separating the electrostatic chuck 100a in this embodiment will be described. The separation method of the electrostatic chuck 100a is a method of separating the plate-like member 10 and the base member 20 bonded together in the electrostatic chuck 100a, like the separation method of the electrostatic chuck 100 of the first embodiment. First, the electrostatic chuck 100 is fixed. Next, the two outer portions 603a of the wire portion 60a are gripped, and the gripped two outer portions 603a are pulled in the direction of the arrow X shown in FIG. As a result, the joint portion 30a can be destroyed in the portion (that is, the inner region R4) through which the inner portion 601a passes inside the joint portion 30a. Next, like the wire portion 60a, the two outer portions 603b of the wire portion 60b are gripped, and the gripped two outer portions 603b are pulled in the arrow Y direction shown in FIG. As a result, the joint 30a can be destroyed in a portion (that is, an inner region) of the inside of the joint 30a through which the inner portion 601b has passed. Thereafter, the plate-like member 10 and the base member 20 of the electrostatic chuck 100a are respectively fixed, and, for example, by vibrating them or rotating them in opposite directions, the plate-like member 10 and the base member 20 are separated. 20.

B-3. Effect of the second embodiment:
As described above, the electrostatic chuck 100a of this embodiment includes two wire portions 60a and 60b. Therefore, in the electrostatic chuck 100a of the present embodiment, the inner portions 601a and 601b are moved in the interior between the plate member 10 and the base member 20 (the interior of the joint portion 30a in the present embodiment). be able to. As a result, according to the electrostatic chuck 100a of the present embodiment, in addition to the effects of the electrostatic chuck 100 of the first embodiment, the inside between the plate member 10 and the base member 20 (in the present embodiment, The two members can be separated at any desired two points (inside the joint 30a).

C. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

In the electrostatic chuck 100 of the first embodiment, the inner portion 601 of the wire portion 60 is arranged in the center of the joint portion 30 in the Z-axis direction, but it is not limited to this. For example, it may be arranged above or below the center of the joint 30 in the Z-axis direction. In addition, the inner portion 601 is not limited to being arranged inside the joint portion 30, and is located between the lower surface S2 of the plate-like member 10 and the upper surface of the joint portion 30, or between the upper surface S3 of the base member 20 and the joint portion. 30 may be arranged between the lower surface. The inner portions 601a and 601b of the wire portions 60a and 60b in the electrostatic chuck 100a of the second embodiment can also have the same configuration as described above. In addition, the inner portions 601a and 601b of the wire portions 60a and 60b in the electrostatic chuck 100a of the second embodiment are arranged at the same position in the Z-axis direction, but are not limited to this. They may be arranged at different positions in the axial direction. In such a configuration, the inner region R4 of the wire portion 60a and the inner region of the wire portion 60b may overlap in the joint portion 30a as viewed in the Z-axis direction.

The electrostatic chucks 100 and 100a of the first embodiment and the second embodiment have gas passage holes and lift pin insertion holes extending vertically from the lower surface S4 of the base member 20 to the adsorption surface S1 of the plate member 10, and the base member. A hole such as a temperature sensor hole extending vertically from the lower surface S4 of the plate member 10 to the lower surface S2 of the plate member 10 may be provided. For example, the gas passage hole is formed between the adsorption surface S1 of the plate-like member 10 and the wafer W in order to improve the heat transfer between the plate-like member 10 and the wafer W and further improve the controllability of the temperature distribution of the wafer W. It is a hole for supplying an inert gas (for example, helium gas) to the space existing between the surface. The lift pin insertion hole is a hole for inserting a lift pin for pushing up the wafer W held on the attraction surface S1 of the plate-like member 10 to separate it from the attraction surface S1. Also, the temperature sensor hole is a hole for accommodating a temperature sensor (for example, a thermocouple or the like) for detecting the internal temperature of the plate member 10 . Furthermore, in the electrostatic chucks 100 and 100a of the first embodiment and the second embodiment, an electrostatic Protective members (eg, O-rings) may be provided to protect the joints 30, 30a from the plasma present around the chucks 100, 100a. When adopting such a configuration, the inner regions R2 and R4 defined by the outer edges of the joint portions 30 and 30a and the inner portions 601, 601a and 601b of the wire portions 60, 60a and 60b include the protective Preferably, the inner portions 601, 601a, 601b are arranged such that they are free of members. This is to prevent the inner portions 601, 601a, 601b from interfering with the protective member when the plate member 10 and the base member 20 are separated.

The electrostatic chuck 100 of the first embodiment may include a protective member that covers the outer portion 603 of the wire portion 60 . The protective member is a member positioned outside the plate member 10 when viewed in the Z-axis direction, and is a member that is partially continuous with the joint portion 30 . As a material for forming the protective member, it is preferable to use a Teflon (registered trademark) rubber ring or the like. By adopting such a configuration, when the electrostatic chuck 100 is used, the outer portion 603 is fixed to the electrostatic chuck 100 and is not exposed to the outside of the electrostatic chuck 100, thereby ensuring good handleability. be able to. The outer portions 603a and 603b of the wire portions 60a and 60b in the electrostatic chuck 100a of the second embodiment may also be provided with protective members in the same manner as described above.

Although two wire portions 60a and 60b are provided in the electrostatic chuck 100a of the second embodiment, the present invention is not limited to this, and three or more wire portions may be provided. However, it is preferable to arrange the wire portions so as not to cross each other.

In the electrostatic chuck 100a of the second embodiment, when the plate member 10 and the base member 20 are separated, separation is performed by one wire portion 60a and then by the other wire portion 60b. However, the separation by both wire portions 60a and 60b may be performed at the same time.

Although the heater electrode 50 is arranged inside the plate member 10 in the above embodiment, the heater electrode 50 does not necessarily have to be arranged inside the plate member 10 . Further, in the above embodiment, the coolant channel 21 is formed in the base member 20 , but the coolant channel 21 does not necessarily have to be formed in the base member 20 .

In the above-described embodiment, a monopolar system in which one chuck electrode 40 is provided inside the plate member 10 is adopted, but a bipolar system in which a pair of chuck electrodes 40 are provided inside the plate member 10 is adopted. may be adopted.

10: plate member 14: recess 15: recess 20: base member 21: coolant channel 24: through hole 25: through hole 30: joint 30a: joint 34: through hole 35: through hole 40: chuck electrode 41: Chuck electrode via 42: Chuck electrode electrode pad 44: Chuck electrode power supply terminal 50: Heater electrode 51: Heater electrode via 52: Heater electrode electrode pad 54: Heater electrode power supply terminal 60: Wire part 60a: Wire part 60b: wire part 100: electrostatic chuck 100a: electrostatic chuck 140: chuck electrode terminal hole 150: heater electrode terminal hole 601: inner part 601a: inner part 601b: inner part 603: outer part 603a: outer part 603b: outer part A: terminal area D0: distance D1: distance D2: distance Lb: length Li: length Lo: length Lr: distance PO: center R1: outer area R2: inner area R3: outer area R4: inner Area R: Radius S1: Attraction surface S2: Lower surface S3: Upper surface S4: Lower surface W1: Shortest distance W: Semiconductor wafer

Claims (9)

a plate-shaped member having a first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
a base member having a third surface and arranged such that the third surface is located on the second surface side of the plate member;
a joint portion disposed between the plate member and the base member and formed of a resin material;
In an electrostatic chuck that holds an object on the first surface of the plate member,
an inner portion disposed between the plate-like member and the base member and disposed so as to overlap the joint portion when viewed in the first direction; a wire portion having an outer portion positioned outside the plate-like member when viewed in one direction,
An electrostatic chuck characterized by: The electrostatic chuck of claim 1, wherein
an electrode arranged on the plate member;
at least one power supply terminal electrically connected to the electrode;
When viewed from the first direction, the at least one power supply terminal is arranged only in one of two regions defined by the inner portion of the wire portion and the outer edge of the joint portion,
An electrostatic chuck characterized by: In the electrostatic chuck of claim 2,
When viewed from the first direction, the center of the plate-shaped member is located in the other of the two regions.
An electrostatic chuck characterized by: In the electrostatic chuck according to claim 2 or 3,
When viewed from the first direction, the ratio of the area of the other of the two regions to the area of the region surrounded by the outer edge of the joint is 70% or more.
An electrostatic chuck characterized by: In the electrostatic chuck according to any one of claims 1 to 3,
comprising a plurality of the wire portions,
An electrostatic chuck characterized by: In the electrostatic chuck according to any one of claims 1 to 5,
The sum of the length of the inner portion and the length of the outer portion is equal to or greater than the length of the outer edge of the joint.
An electrostatic chuck characterized by: In the electrostatic chuck according to any one of claims 1 to 6,
The tensile strength of the wire portion is greater than the tensile strength of the joint portion,
An electrostatic chuck characterized by: In the electrostatic chuck according to any one of claims 1 to 7,
The wire portion is made of a resin material,
An electrostatic chuck characterized by: In the electrostatic chuck according to any one of claims 1 to 8,
a protective member that covers the outer portion,
An electrostatic chuck characterized by:

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