JP7208501B2 - Light-emitting device manufacturing method and light-emitting device - Google Patents

Description

The present disclosure relates to a method for manufacturing a light emitting device and a light emitting device. In particular, the present invention relates to a method for manufacturing a light-emitting device having a sealing member that covers a light source, and also to a light-emitting device obtained by such a manufacturing method.

Light emitting diodes (LEDs) are generally capable of emitting light with low power and high brightness and have a long life, so they are suitably used as light emitting elements. A light-emitting device using such a light-emitting element as a light source has been put to practical use, for example, as general lighting fixtures and backlights.

A light-emitting element used in a light-emitting device is generally covered with a sealing member. It has been proposed to achieve a so-called batwing type light distribution characteristic by means of the shape of such a sealing member (see Patent Documents 1 and 2, for example).

JP 2016-171227 A JP 2016-154204 A

It is also important that the light-emitting device can be manufactured efficiently because it is required to be thin.

In the case of manufacturing a light-emitting device having a plurality of light-emitting portions, a sealing raw material is supplied from an ejection device to form sealing members for each of the plurality of light-emitting portions. In order to form such a plurality of sealing members, the sealing raw material is sequentially supplied onto the substrate. Therefore, it is necessary to move the ejection device when forming each sealing member, and the time for this is included in the manufacturing time. In particular, along with the formation of each sealing member, it is necessary to drive the ejection device not only in the horizontal direction but also in the vertical direction, and to stop and restart the supply of the sealing raw material. The time required to perform multiple iterations is by no means negligible.

In other words, further improvement in efficiency is required in manufacturing a light-emitting device in which a plurality of sealing members are formed by sequentially supplying sealing raw materials using an ejection device.

The present disclosure has been made in view of such problems. That is, a main object of the present disclosure is to provide a method of manufacturing a light-emitting device that is more efficient in terms of forming a plurality of sealing members.

The inventors of the present application have tried to solve the above problems by taking a new approach rather than by extending the conventional technology. As a result, the present inventors have invented a production method that achieves the above-mentioned main object.

The present disclosure is a method of manufacturing a light-emitting device including a substrate, a plurality of light sources arranged on the substrate, and a sealing member covering each of the plurality of light sources, the method comprising:
a sealing member forming step of supplying a sealing raw material to the substrate from an ejection device having a plurality of nozzles to form a plurality of sealing members covering the plurality of light sources;
The sealing member forming step includes a first sealing member forming step and a subsequent second sealing member forming step,
forming the sealing member in the first sealing member forming step so that the sealing raw material remains as a thread-like suspension suspended from each of the plurality of nozzles;
In the manufacturing method, the step of forming the second sealing member is started from a state in which the thread-like suspension is suspended from the ejection device.

In the method for manufacturing a light emitting device according to the present disclosure, it is possible to efficiently form a plurality of sealing members.

Specifically, in the manufacturing method of the present disclosure, due to the filamentous suspension, subsequent formation of the sealing member of the light emitting section can be carried out more efficiently. The thread suspensions are provided prior to subsequent sealing member formation, and their presence allows the subsequent sealing member formation to begin sooner.

More specifically, due to the presence of the thread suspensions, less distance is required to vertically drive the ejection device from the previous sealing member formation for the subsequent sealing member formation, and the subsequent sealing member formation takes less time. Seal member formation can begin. This means that less time is required between the formation of one sealing member and subsequent sealing member formation, and multiple sealing members can be formed in a shorter time.

Further, in the manufacturing method of the present disclosure, since the filamentous suspension is suspended from the ejection device, the supply of the sealing raw material using the ejection device can be started more smoothly and accurately. Conventionally, due to the fact that the nozzle of the ejection device is usually a small-diameter nozzle, there is a risk that the sealing raw material will suddenly eject from the nozzle at the start of ejection. In other words, there is a possibility that the sealing raw material starts to be supplied so as to dissipate to the surroundings. In this regard, in the present disclosure, the filamentous suspension is suspended from the nozzle of the ejection device, and the ejection of the sealing raw material is started in such a suspended state, so that the sealing raw material can be supplied to the substrate more smoothly. . In addition, in the present disclosure, since the sealing raw material is discharged through the filamentous suspension already exposed from the nozzle, it is difficult for the phenomenon of "forcefully ejecting from the nozzle at one time" to occur. That is, it is also possible to start supplying the sealing raw material more accurately.

A perspective view and a partially enlarged cross-sectional view schematically showing a filamentous suspension Schematic perspective view for explaining thread-like suspensions left prior to subsequent sealing member formation Schematic cross-sectional view for explaining a mode in which the discharge device is lowered to start supplying the encapsulating raw material. Schematic cross-sectional view illustrating formation of a filamentous suspension Schematic cross-sectional view more specifically exemplifying the formation of the filamentous suspension Schematic plan view showing an example of nozzle installation of an ejection device Schematic plan view showing an example of nozzle installation of an ejection device Schematic plan view showing an example of nozzle installation of an ejection device Schematic plan view showing an example of nozzle installation of an ejection device Schematic cross-sectional view for explaining "mode of dummy supply" A schematic plan view showing a light-emitting device according to an embodiment of the present disclosure, and a schematic perspective view showing a light-emitting section provided in the device. Schematic plan view and cross-sectional view illustrating a light-emitting device (particularly its light-emitting portion) according to an embodiment of the present disclosure Schematic plan view and cross-sectional view more specifically illustrating a light-emitting device (particularly its light-emitting portion) according to an embodiment of the present disclosure Schematic cross-sectional view showing the configuration of a light-emitting element provided as a package Schematic cross-sectional view showing the configuration of a light-emitting element provided as a package FIG. 4 is a diagram illustrating light distribution characteristics of a light emitting unit provided in a light emitting device according to an embodiment of the present disclosure; Schematic cross-sectional view for explaining the installation position and size of the protrusion in the sealing member

In the following, a manufacturing method according to an embodiment of the present disclosure and a light-emitting device obtained by such a manufacturing method will be described in more detail. Although the description will be made with reference to the drawings as necessary, the various elements in the drawings are only schematically and exemplarily shown for understanding of the present disclosure, and the appearance, dimensional ratios, etc. may differ from the actual ones. .

"Up-down direction" and "left-right direction" used directly or indirectly in this specification correspond to the up-down direction and left-right direction in the drawings, respectively. Unless otherwise specified, identical symbols or symbols shall indicate identical items or identical meanings. In a preferred embodiment, the downward vertical direction (that is, the direction in which gravity acts) corresponds to the "downward direction", and the opposite direction corresponds to the "upward direction". A direction perpendicular to the "vertical direction" can be considered to correspond to the horizontal direction, that is, the "horizontal direction".

In this specification, a "cross-sectional view" is based on a virtual cross section cut along the thickness direction of the light-emitting portion or light-emitting device. In other words, a schematic diagram of a cross section taken along a direction perpendicular to the main surface of the substrate on which the light-emitting portion is provided corresponds to the "cross-sectional view". Further, the term "planar view" used in this specification corresponds to a sketch of the object when viewed from above or below along the thickness direction.

[Method for manufacturing light-emitting device]
A manufacturing method according to the present disclosure is a method of manufacturing a light-emitting device having a plurality of light-emitting portions on a substrate. The manufacturing method of the present disclosure is characterized in that a sealing member for a plurality of light emitting portions is formed using an ejection device. In particular, the handling of the sealing raw material between the formation of the sealing member for a certain light-emitting portion and the subsequent formation of the sealing member for another light-emitting portion is characteristic.

Specifically, a sealing material is supplied to a substrate from an ejection device having a plurality of nozzles to form a sealing member that covers the light source of the light emitting unit. formation" (first sealing member forming step) and "subsequent sealing member formation for another light emitting portion" (second sealing member forming step), and in the first sealing member forming step , so that later the sealing material remains as a thread-like suspension hanging from each of the plurality of nozzles.

The terms "first sealing member forming step" and "second sealing member forming step" used in this specification refer to steps for forming sealing members for different light-emitting portions, respectively. That is, the light-emitting portion obtained through the first sealing member forming step and the light-emitting portion obtained through the second sealing member forming step constitute separate light-emitting portions. In short, these sealing member forming processes can be said to be sealing processes performed not for the same light source but for different light sources.

As used herein, the term "substrate" refers to a light-emitting device member on which the light-emitting portion is placed. The substrate used in the manufacturing method of the present disclosure is preferably a substrate provided with the light source of the light emitting section. In other words, the substrate used for forming the sealing member by the ejection device is preferably a substrate on which the light sources of the light emitting units (preferably, a plurality of light sources for a plurality of light emitting units) are provided in advance. In a preferred aspect, the substrate used in the manufacturing method of the present disclosure has a plurality of light sources arranged in an array on its main surface. For example, in such a substrate, multiple light sources are aligned along at least one direction and/or multiple light sources are provided at substantially constant pitch intervals. In addition to the light source, the substrate used in the manufacturing method of the present disclosure may be provided with conductive wiring for supplying power to the light source.

As used herein, the term "light source" refers to a member that emits light. The light source in the present disclosure is not particularly limited in shape and/or structure as long as it emits light. For example, the light source may be a light-emitting element typified by an LED, or may be a combination of a light-emitting element and a wavelength conversion member (for example, a light-emitting diode package). The term "wavelength conversion member" as used herein refers to a member that converts part or all of the light emitted by the light emitting element into light of a different wavelength, and examples thereof include phosphor members.

The filamentous suspension provided in the manufacturing method of the present disclosure is formed by suspending the sealing raw material from the ejection device. ) is provided prior to This allows subsequent sealing member formation to begin sooner. In this specification, the term "sealing raw material" refers to the raw material of the sealing member that covers the light source of the light emitting part, and particularly refers to the fluid (preferably paste) raw material. The encapsulating raw material has electrical insulation, can transmit light emitted from a light source (e.g., transmittance of 70% or more), and has fluidity before solidification (e.g., before completion of curing). It can be material. By way of example, the sealing material may comprise a resinous material (eg, a curable resinous material), in which case the filamentous suspension may be referred to as a "filamentous resin body" or "resin suspension" or the like. Examples of such resin materials include silicone resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, modified resins and hybrid resins thereof. Among them, silicone resins are preferable because they are excellent in heat resistance and/or light resistance ("silicone resin" as used in this specification comprehensively includes modified resins or resins having at least a silicone skeleton. It refers to “based resin”). Such a sealing raw material may additionally contain a filler and/or a phosphor, etc., if necessary.

As used herein, the term "filamentary suspension" broadly refers to the encapsulating material hanging from the dispensing device, and narrowly refers to the encapsulating material hanging down from the nozzle of the dispensing device in an elongated fashion. . Thus, as shown in FIG. 1, the string suspension 10 formed in the present disclosure has at least a vertical dimension L _a larger than a horizontal dimension L _b (if the horizontal dimension is not constant, its maximum dimension). It's getting bigger. For example, the vertical dimension _La is 1.5 times or more, 2 times or more, or 3 times or more the horizontal dimension _Lb. Preferably, the filamentous suspension 10 has a shape that gradually tapers toward the tip as shown in the figure and hangs down (although this is only an example, the tip 10A located vertically below has a pointed shape). It may be in a hanging form).

As shown in FIG. 2, in the first sealing member forming step 30, the sealing raw material is left as thread-like suspensions 10 hanging from each of the plurality of nozzles. In this way, the thread-like suspension 10 hanging down from the ejection device 20 can be subjected to the subsequent second sealing member formation step 35 . Preferably, while maintaining the state in which the thread-shaped suspension body 10 is suspended from the nozzle 25 of the ejection device 20, the subsequent formation of the sealing member for another light-emitting portion is started. This means that the thread-like suspension formed so as to hang from the discharge device after forming the preceding sealing member is maintained as it is, while supplying the sealing raw material for the subsequently provided sealing member. there is In the manufacturing method of the present disclosure, due to the presence of the filamentous suspension, the supply of the sealing raw material, which has been temporarily stopped, can be resumed sooner for the subsequent formation of the sealing member, and desirably more smoothly and accurately. supply can be resumed.

The dispensing device is moved to the desired position for the subsequent second sealing member forming step 35, but the dispensing device 20 can be lowered once to start supplying the sealing material as shown in FIG. preferable. For example, in forming the preceding sealing member, the ejection device is gradually moved upward while supplying the sealing raw material. is preferably lowered. In other words, it is preferable to start supplying the next sealing raw material after the ejection device is lowered to a position closer to the substrate. This is because starting the supply of the sealing raw material closer to the substrate on which the sealing member is to be formed allows the raw material to be more accurately discharged onto the substrate, and thus the desired sealing member can be formed more accurately. be.

In the present disclosure, a filamentous suspension body made of the encapsulating raw material is formed, and the encapsulating raw material can be supplied from the tip thereof. ). In other words, due to the presence of the filamentous suspension, the distance by which the ejection device is driven vertically downward for subsequent sealing member formation is the length of the filamentous suspension (the "vertical dimension L _a " in FIG. 1). minutes) and subsequent sealing member formation can be initiated in less time. Therefore, the time required to start forming the subsequent sealing member can be shortened, and the formation of a plurality of sealing members can be completed in a shorter time. From this point of view, it can be said that the longer the length of the filamentous suspension, the better.

Further, in the manufacturing method of the present disclosure, the sealing raw material can be indirectly supplied from the tip of the filamentous suspension, so that the supply of the sealing raw material can be started more smoothly and accurately. Assuming that the filamentous suspension is not provided, the sealing raw material will be directly discharged from the nozzle of the discharging device, but in that case, there is a risk that the raw material will be violently ejected from the nozzle at one time. Although not bound by any particular theory, this is because in the nozzle to which the supply of the sealing raw material is temporarily stopped, the sealing raw material itself that is stored inside and is not exposed to the outside is like a "plug". This is because it can act as a resistance to resupply. Such resupply resistance can be significant, such as when the nozzle diameter of the ejection device is smaller and/or when the viscosity of the sealing material is higher.

In the present disclosure, the filamentous suspension consists of a sealing raw material, and such a sealing raw material is continuously connected to the sealing raw material in the nozzle and is exposed from the nozzle. resistance” is reduced. Therefore, it is possible to start supplying the sealing raw material more smoothly and accurately. In other words, in the present disclosure, the risk of "the raw material being violently ejected from the nozzle at one time" is avoided, and the supply of the sealing raw material can be resumed more smoothly and accurately for the subsequent formation of the sealing member. .

In one preferred embodiment, the filamentous suspension is formed by interrupting the continuous supply of encapsulant material. For example, as shown in FIGS. 4 and 5, the sealing raw material is supplied such that the supply flow 15' of the sealing raw material is continuously connected between the previously supplied sealing raw material 12 once supplied to the substrate 40 and the discharge device 20. is supplied, and the continuous connection 15 of such supply flow is broken to form the filamentous suspension 10 . In such a mode, since the thread-like suspension 10 is left along with the preceding formation of the sealing member, it is possible to form the thread-like suspension more efficiently. It should be noted that FIG. 4 is a schematic diagram showing the preferred filamentous suspension formation in the present disclosure in a more conceptual manner, and FIG. 5 is a more specific illustration of the preferred filamentous suspension formation in the same disclosure. It is a schematic diagram shown in the aspect.

To break the continuous feed flow, the separation distance between the previously dispensed sealing ingredient and the dispensing device may be increased. This may drive the ejection device 20 upward more distally from the substrate 40 (see FIGS. 4 and 5), or it may drive the substrate 40 downward more distally from the ejection device 20 . You can move it to As the separation distance between the already supplied sealing raw material 12 and the discharge device 20 (particularly its nozzle 25) is gradually increased in this way, the continuously connected portion 15 of the supplied flow becomes gradually narrower, and finally , the connecting portion 15 is cut to form the thread-like suspension 10. - 特許庁It should be noted that in addition to or instead of increasing the separation distance between the previously supplied sealing material and the dispensing device, the supply of sealing material from the dispensing device may be stopped, thereby also maintaining a continuous supply flow. can be disconnected. In particular, when the supply of the sealing raw material from the discharging device is stopped while increasing the separation distance between the previously supplied sealing raw material and the discharging device, the filamentous suspension can be formed more efficiently.

In the manufacturing method of the present disclosure, a protrusion 55 is formed on the sealing member 50 due to breaking the continuous link 15 of the supply flow (see FIGS. 4 and 5). That is, the protrusions 55 can be provided on the sealing member 50 as the thread-like suspension 10 is formed. In a more specific aspect, when the connection of the continuous supply flow is broken, "a filamentous suspension based on the continuous supply flow" is provided above the cut point, while " Protrusion based on continuous feed flow is provided. Such "protrusions" are unique to the manufacturing method of the present disclosure, and it can be said that the projections are formed on the surface of the sealing member precisely because the thread-like suspensions are left intentionally.

As shown in FIGS. 4 and 5, the ejection device 20 used in the manufacturing method of the present disclosure has multiple nozzles 25 . In the present disclosure, it is preferred to leave the thread suspension 10 with the sealing material suspended from the dispensing device at each of the plurality of nozzles 25 . In other words, it is preferable to form the sealing raw material elongated down from each of the plurality of nozzles. Note that the ejection device 20 has at least three nozzles 25 , preferably three or more and ten or less nozzles 25 . Although it is merely an example, the sealing raw material may be supplied using a discharge device 20 having 6 or more and 8 or less nozzles (8 nozzles as an example) (see FIG. 6).

Each of the thread-like suspensions 10 hanging from the plurality of nozzles 25 can have a form that gradually tapers toward the tip as shown in FIG. may have a tapering and drooping form such that the most vertically downwardly positioned tip has a pointed shape). Moreover, as shown in FIGS. 4 and 5, a plurality of sealing raw materials are separated between "the previously supplied sealing raw material 12 once supplied to the substrate 40" and "each of the plurality of nozzles 25 of the discharge device 20." It is preferable to supply the raw material in parallel so that the supply flow 15 ′ is continuously connected, and the plurality of continuous connections 15 provided in parallel are cut off, respectively, to form a plurality of thread-like suspensions 10 . is preferred.

In such a manufacturing method of the present disclosure, since a plurality of thread-like suspension bodies are provided, a plurality of projections are formed on the sealing member. That is, a plurality of protrusions are formed on the sealing member due to each of the plurality of thread-like suspension bodies. As shown in FIGS. 4 and 5, multiple continuous links 15 of feed flow are broken to form the thread suspension 10, each continuous link resulting in a plurality of protrusions 55 being sealed. It is formed in the stop member 50 . Since the sealing raw material is supplied from each of the plurality of nozzles 25 of the discharge device 20, each sealing member 50 can have a shape of a plurality of protrusions 57, and each of the plurality of protrusions 57 has a protrusion 55. can be formed (that is, each sealing member 50 is formed with a plurality of ridges 57 and each of the plurality of ridges 57 is provided with one protrusion 55, as shown in FIGS. 8 and 9, to which reference will be made later) preferably).

The manufacturing method of the present disclosure may be embodied in various ways.

(A more suitable form of filamentous suspension formation)
Such an aspect is an aspect for forming the filamentous suspension more favorably. In the manufacturing method of the present disclosure, the suspension is formed prior to the subsequent formation of the sealing member, and the sealing member may be formed under conditions particularly conducive to the formation of this suspension.

The nozzle provided in the ejection device used in the manufacturing method of the present disclosure is preferably a small diameter nozzle. In other words, especially for the formation of thread suspensions, the nozzles of the ejection device are preferably narrower. For example, the nozzle of the ejection device preferably has an inner diameter of 0.1 mm to 0.9 mm, more preferably an inner diameter of 0.2 mm to 0.7 mm, even more preferably an inner diameter of 0.2 mm to 0.5 mm. . Although it is only an example, considering the outer diameter of the nozzle, the nozzle of the discharge device has an outer diameter of 0.6 mm or more and 0.7 mm or less and an inner diameter of 0.3 mm or more and 0.4 mm or less. good.

In addition to or instead of a finer nozzle, a higher viscosity sealing material is preferred for the formation of thread suspensions. That is, the sealing raw material discharged from the nozzle is preferably a highly viscous fluid. For example, the sealing stock may have such a viscosity that upon breaking the supply flow continuity 15 (see FIGS. 4 and 5), the material suspension from the nozzle is "stringy". preferable. More specifically, the sealing raw material preferably has a viscosity of 180 Pa·s or more and 260 Pa·s or less, more preferably 200 Pa·s or more and 240 Pa·s or less, and still more preferably 210 Pa·s or more and 230 Pa·s or less. has a viscosity of The viscosity here refers to the measurement of the sealing raw material used for the ejection device by a rotational viscometer method. In particular, the above viscosity values refer to the average (arithmetic average) values measured six times with a VISCOMATER TVE-35H (Toki Sangyo Co., Ltd.) at room temperature (20° C.). Also, the viscosity can be adjusted by the density of the filler in the resin.

(Aspect of dummy supply)
This mode is a mode in which the sealing raw material is supplied in a simulated manner to form the filamentous suspension. That is, prior to the formation of the sealing member for the light-emitting portion, a sealing raw material not used for forming such a sealing member was supplied, and the filamentous suspension was suspended from the discharge device. From this state, the formation of the sealing member for the light emitting portion (first sealing member forming step) is started.

For example, as shown in FIG. 7, the filamentous suspension may be suspended by supplying the sealing raw material from the ejection device 20 to the non-light-emitting region 44 on the substrate 40 where the light-emitting element is not provided. That is, sealing is performed so that the supply flow 15' of the sealing raw material is continuously connected between the previously supplied sealing raw material 12 supplied to the non-light-emitting region 44 of the substrate and the ejection device 20 (especially the nozzle 25 thereof). The raw material may be supplied and the continuous connection 15 of such a supply flow may be broken to cause the thread-like suspension 10 to be in a suspended state.

In this aspect, the sealing member can be efficiently formed for the first light emitting portion among the plurality of light emitting portions of the substrate. That is, in the "dummy supply" mode, the supply of the sealing raw material can be started more smoothly and accurately with respect to the formation of the first sealing member.

In addition, in the manufacturing method of the present disclosure, it is preferable that the sealing raw material is sequentially supplied in the formation of the sealing member for a certain light-emitting portion and the subsequent formation of the sealing member for another light-emitting portion. In the case where the supply of the encapsulating raw material is stopped for a long time (that is, when the time until the supply of the encapsulating raw material is resumed is longer), the dummy supply mode may be used. That is, at any point in the period from the formation of the sealing member for one light-emitting portion to the formation of the sealing member for another light-emitting portion, the filamentous suspension body is formed by supplying the sealing raw material to the non-light-emitting region of the substrate. can also be in a suspended state. Even in such a case, the thread-like suspension can be suitably used for the subsequent formation of the sealing member.

(Aspect of circumferential arrangement of nozzles)
Such a mode is a mode in which a plurality of nozzles 25 are circumferentially arranged as the ejection device 20 . For example, as shown in FIGS. 6A-D, an ejection device 20 with a plurality of nozzles 25 arranged circumferentially in plan view from the ejection side of the ejection device 20 may be used in the present disclosure. The plurality of nozzles 25 are preferably arranged in a ring. 6A, four nozzles 25, FIG. 6C, six nozzles 25, and FIG. 6D, eight nozzles 25 are arranged circumferentially, for example only. As can be seen from the illustrated aspect, it is preferable that the plurality of nozzles 25 arranged in a circumferential shape are arranged point-symmetrically in a plan view of the ejection device 20 . It is also preferred, particularly for ejection devices 20 having more nozzles 25, such as "six nozzles" or "eight nozzles," that the respective nozzles 25 are arranged in a ring next to each other.

In such a mode, the sealing raw material can be supplied from each of the plurality of nozzles arranged in a circumferential manner, and the filamentous suspension can be suspended from each of the plurality of nozzles. Thus, the ridges formed on each of the sealing members are circumferentially aligned and preferably adjacent to each other. In other words, as shown in FIGS. 8 and 9, the sealing member 50 formed using such a plurality of nozzles has a configuration in which a plurality of protuberances 57 are provided around the perimeter such that the recessed portion is positioned in the middle. can have A protrusion 55 is preferably formed on each of the plurality of protrusions 57 as described above.

(Aspect of singulation)
This aspect is an aspect in which a light-emitting device having only one light-emitting portion is obtained by singulation. Specifically, the substrate provided with a plurality of light sources and sealing members obtained by the above-described manufacturing method is subjected to a cutting process to obtain a light-emitting device provided with one light-emitting portion. For cutting the substrate, a mechanical method such as dicing may be used, or a physical method such as cutting by laser irradiation may be used.

When separating into individual pieces, the substrate may be cut so that the sealing members respectively obtained in the first sealing member forming step and the second sealing member forming step are separated from each other. That is, the light emitting portion provided with the sealing member obtained in the first sealing member forming step and the light emitting portion provided with the sealing member obtained in the second sealing member forming step were separated from each other. The substrate may be cut.

Such an aspect corresponds to a method of manufacturing a light-emitting device having a single light-emitting portion. It corresponds to a manufacturing method in which singulation processing is performed.

[Light emitting device of the present disclosure]
A light-emitting device of the present disclosure is a light-emitting device that can be obtained by or using the above-described manufacturing method, and is a light-emitting device in which a sealing member is formed through a "filamentary suspension." Accordingly, the light-emitting device of the present disclosure includes a light-emitting portion having a sealing member that covers the light source on the substrate, and the sealing member has protrusions in the peripheral portion surrounding the recessed portion.

At least one light emitting unit 100 is provided on the substrate 40 in the light emitting device of the present disclosure. Therefore, the light-emitting device of the present disclosure may include a plurality of light-emitting units 100 or may include a single light-emitting unit 100 .

As shown in FIG. 8, in a preferred embodiment of the light-emitting device 200, a plurality of light-emitting units 100 are provided on the substrate 40. As shown in FIG. That is, a plurality of light sources 60 are provided on the substrate 40 , and the sealing member 50 covering the plurality of light sources 60 is provided on the substrate 40 . The sealing member 50 has a recessed portion 50A, which is preferably positioned above the light source 60, as shown in FIGS. In other words, the recessed portion 50A is preferably positioned substantially in the center of the sealing member 50 in plan view. In the light-emitting device of the present disclosure, the sealing member 50 of each light-emitting portion 100 has projections 55 on the peripheral portion 50B surrounding the recessed portion 50A.

A light-emitting portion provided with such a sealing member can exhibit a batwing light distribution. Therefore, in the present disclosure, even if the device thickness is thin (for example, even if the separation distance between the light emitting unit and the diffusion plate provided above the light emitting unit is small), the light emitting device has little light unevenness. In particular, a light-emitting device with little luminance unevenness can be realized.

As shown in FIGS. 8 and 9, the sealing member 50 in the light emitting device of the present disclosure has a flat shape as a whole (particularly, when viewed in cross section as shown in FIG. 9, the sealing member 50 is located above the substrate surface. Although the contour line of the sealing member is rounded or curved, the thickness of the sealing member as a whole is relatively small). Since the shape of each light emitting portion is determined by each sealing member, this means that the overall shape of the light emitting portion is flat. More specifically, in the sealing member, at least the thickness dimension (especially the maximum thickness dimension T) is smaller than the width dimension (especially the maximum width dimension W) (see FIG. 9). For example, the shape of the sealing member satisfies the relationship 2T≦W. Such a flat-shaped sealing member provides a lower height of the light-emitting portion, so that in the light-emitting device of the present disclosure, the light-emitting portion may be bent or the substrate may be bent due to accidental external force applied to the light-emitting portion. "Inconvenient events such as being taken from" are unlikely to occur.

In one preferred aspect, the protrusion is provided on the upper side of the peripheral portion of the sealing member. That is, as shown in FIGS. 9 and 10, the sealing member 50 of the light emitting section 100 is provided with the projection 55 on the upper side of the peripheral portion 50B surrounding the recessed portion 50A. This is due to the provision of the "thread-like suspension" 10 when forming the sealing member (see FIG. 10). The "upper side" here means a region on the upper half side of the thickness (height) of the sealing member in a cross-sectional view of the light emitting portion. In particular, if the height of the protrusion 57, which will be described later, is "H" (see FIG. 12), the height from the highest level of the protrusion (the level not including the height of the protrusion, the same shall apply hereinafter) to the height of H/3 below. preferably H/4 height below the top level of the ridge, more preferably H/5 height below the top level of the ridge A protrusion is provided in the region of the sealing member that extends only downwards. 9 is a schematic diagram showing the configuration of the light emitting device of the present disclosure in a more conceptual manner, and FIG. 10 is a schematic diagram showing the configuration of the light emitting device of the present disclosure in a more specific exemplary manner. is.

In the light-emitting device of the present disclosure, the "protrusion" originates from the filamentous suspension and therefore has a unique shape. Specifically, the protrusion 55 preferably protrudes upward. Also, the protrusion 55 preferably has a shape that gradually reduces its width toward its tip. In one preferred embodiment, as shown in FIG. 9, projection 55 has a pointed shape. In other words, the projections provided on the peripheral portion of the sealing member preferably have a sharp tip. As can be seen from the illustrated configuration, such protrusions 55 can be said to have upwardly "squared" tips. Moreover, the plurality of protrusions 55 are each caused by a thread-like suspension body, and are preferably arranged in a ring so as to be adjacent to each other in a plan view.

In each sealing member 50, the peripheral portion 50B surrounding the recessed portion 50A has the shape of a plurality of ridges 57. As shown in FIG. Each of the plurality of ridges 57 result from feedstock feeds from multiple nozzles of the ejection device. Therefore, the number of protrusions 57 corresponds to the number of nozzles. Specifically, the sealing member 50 may have 3 or more and 10 or less ridges 57 on the peripheral portion 50B. Although this is merely an example, when the sealing raw material is supplied using a discharge device having 6 to 8 nozzles (e.g., 8 nozzles), the number of nozzles varies depending on the number of nozzles. The peripheral portion 50B of may have 6 to 8 ridges 57 (8 ridges 57 as an example). As shown in FIGS. 8-10, the peripheral portion 50B has a generally domed shape, but preferably has the shape of a plurality of ridges 57 adjacent to each other. In other words, in a preferred embodiment, the peripheral portion 50B has a so-called continuous ridged shape. In particular, in the sealing member 50, it is preferable that the plurality of mutually adjacent protuberances 57 are arranged in a ring, and the recessed portion 50A is positioned at the center thereof. Here, as can be seen from the illustrated cross-sectional view, the recessed portion itself can have a shape that gradually increases in depth toward the center (that is, in the recessed portion 50A, the thickness of the sealing member increases toward the inside. gradually reduced).

In the light emitting device of the present disclosure, protrusions 55 are provided on each of the plurality of protrusions 57 . In other words, in the sealing member 50 of each light-emitting portion 100, the protrusions 55 are provided on each of the plurality of protrusions 57 of the peripheral portion 50B surrounding the recessed portion 50A (see FIGS. 8 to 10). Preferably, a protrusion 55 (preferably a pointed protrusion 55) is provided on each of the plurality of ridges 57 adjacent to each other in the peripheral portion 50B. Such a form results from forming the sealing member by supplying raw materials from a plurality of nozzles of the discharge device, and in particular from providing a filamentous suspension in each of the plurality of nozzles. . Due to this filamentous suspension, the protrusion 55 is preferably positioned at the highest level of each of the plurality of ridges 57 . In other words, as shown in FIG. 10, it is preferable that the protrusion 55 is provided at the highest position among each of the plurality of protrusions 57 . In the illustrated form (particularly the form shown in FIG. 9), a micro-sized projection 55 is positioned at the topmost level of each of the ridges 57, each such projection 55 preferably having a sharp tip.

Various elements and members constituting the light emitting device of the present disclosure will be described in detail.

The substrate 40 used in the light-emitting device of the present disclosure is for mounting the light-emitting unit 100 having the light source 60, and is preferably an insulating substrate for mounting a plurality of light-emitting units 100 (see FIG. 8). . The material of the substrate may comprise a resin material and/or a ceramic material. Examples of specific resin materials for the substrate include at least one selected from the group consisting of phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA) and polyethylene terephthalate (PET). . A substrate made of such a resin material is desirable not only from the standpoint of insulation, but also from the standpoints of low cost and ease of molding. The substrate made of a resin material may be one in which glass fibers are mixed with the resin material, and/or inorganic fillers such as SiO ₂ , TiO ₂ and/or Al ₂ O ₃ are mixed in the resin material. It may have been This is because the mechanical strength of the substrate can be improved, the coefficient of thermal expansion can be reduced, and/or the light reflectance can be improved. On the other hand, as a specific substrate ceramic material, at least one selected from the group consisting of alumina, mullite, forsterite, glass ceramics, nitrides (e.g., AlN), and carbides (e.g., SiC) can be mentioned. A substrate made of such a ceramic material is desirable in that it facilitates the realization of a light-emitting device that is particularly excellent in heat resistance and light resistance. By way of example only, the substrate made of a ceramic material may be a ceramic made of alumina or containing alumina as its main component.

The substrate 40 used in the light emitting device of the present disclosure preferably includes a light source 60 as well as conductive wiring 70 for supplying power to the light source 60 (see FIG. 10). Therefore, the conductive wiring 70 is electrically connected to the light source 60 (for example, the electrode of the light emitting element) and corresponds to a member for supplying current (power) from the outside. In other words, the conductive wiring can also be regarded as playing a role as an electrode or a part thereof for energizing from the outside, and can be provided separately as positive and negative. The conductive wiring may be provided at least on the upper surface of the substrate that serves as the mounting surface of the light emitting element. The material of such conductive wiring can be appropriately selected according to the material used as the substrate and/or the manufacturing method and the like. For example, in the case of a substrate made of a ceramic material, the material of the conductive wiring preferably has a high melting point that can withstand the firing temperature of the ceramic sheet. For example, the conductive line material may comprise a refractory metal such as tungsten and/or molybdenum. Furthermore, other metal materials such as nickel, gold and/or silver may be provided thereon as a coating material by plating, sputtering, vapor deposition, or the like. In the case of a substrate made of a resin material, it is preferable that the material of the conductive wiring be easy to process. For example, in the case of a substrate made of injection-molded resin, it is preferable that the material of the conductive wiring is easy to process such as punching, etching, or bending, and has relatively high mechanical strength. Specific examples of conductive wiring materials include metals such as copper, aluminum, gold, silver, tungsten, rhodium, iron, nickel, and molybdenum, iron-nickel alloys, phosphor bronze, and iron-containing copper. etc. can be mentioned.

The light source 60 used in the light emitting device of the present disclosure may be, for example, the light emitting element 65 as described in the manufacturing method above, or may be a combination of the light emitting element 65 and the wavelength conversion member 67. There may be (see FIG. 10). In one preferred embodiment, light source 60 may be at least one light emitting element.

The light-emitting element itself is not particularly limited in terms of composition, emission color, shape and/or size. Light emitting element 65 may be in the form of a light emitting diode (LED). As the emission color of the light-emitting element, one that emits an arbitrary wavelength can be selected according to the application. As a blue light emitting element, for example, a so-called GaN system or InGaN system can be used. In addition, ZnSe, nitride-based semiconductors (In _x Al _y Ga _1-x-y N, 0≦X, 0≦Y, X+Y≦1) and/or GaP or the like are used as blue or green light emitting elements. can use things. GaAlAs and/or AlInGaP or the like can be used as the red light emitting element. These are merely examples, and semiconductor light emitting devices other than those described above can also be used as the light emitting device.

In a preferred embodiment, the light source 60 has a wavelength converting member 67 covering the light emitting element 65 (see FIG. 10). The wavelength conversion member 67 is a member that converts part or all of the light emitted by the light emitting element 65 into light of another wavelength, and may be a phosphor member, for example. In such a case, the phosphor member may be in the form of phosphor resin (resin containing phosphor). Therefore, in the light-emitting device of the present disclosure, the light-emitting element 65 may be covered with the phosphor resin 67', and the light source 60 composed of the light-emitting element 65 and the phosphor resin 67' may be covered with the sealing member 50 (Fig. 10). Although this is only one example, the light source 60 may be a combination of a light emitting element 65 that emits blue light and a phosphor resin 67' that is excited by the blue light and emits yellow light. It is possible to extract white light (a mixture of blue and yellow) from the light source.

When the wavelength converting member is provided as the light source, the light emitting element is preferably a semiconductor light emitting element that emits a short wavelength that can efficiently excite the wavelength converting member. Although this is just one example, for example, the semiconductor light emitting device includes a nitride semiconductor (In _x Al _y Ga _1-xy N, 0≦X, 0≦Y, X+Y≦1). good. In such a light-emitting device, various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. It may have positive and negative electrodes on the same side, or may have positive and negative electrodes on different sides.

In the light-emitting device of the present disclosure, the light-emitting element 65 may have, for example, a growth substrate and a semiconductor layer laminated on the growth substrate. The semiconductor layer includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer in this order. An n-type electrode is formed on the n-type semiconductor layer, and a p-type electrode is formed on the p-type semiconductor layer. ing. The growth substrate may be a translucent sapphire substrate or the like. Although it is only an example, the electrodes of these light emitting elements may be flip-chip mounted to the conductive wiring on the surface of the substrate via a connection material, and the surface opposite to the surface on which the electrodes are formed, that is, the light-transmitting The main surface of the sapphire substrate may be used as the light extraction surface. The light-emitting element may be arranged across two electrically conductive wires that are insulated and separated into positive and negative, and may be joined with a conductive connecting material. As a method for mounting such a light-emitting element, in addition to a method using solder paste, a method using bumps, for example, can also be used.

Also, the light-emitting elements used in the light-emitting device of the present disclosure may be provided as light-emitting element packages 68 and 69 as shown in FIGS. 11A and 11B, for example. In the light emitting element packages 68 and 69 of FIGS. 11A and 11B, the light emitting elements 68A and 69A are provided with a pair of electrodes 68B and 69B on the same side, and are further provided with wavelength conversion members 68C and 69C containing phosphors, Both are offered as chip size packages. In FIG. 11A, the light emitting element 68A has a surface opposite to the surface having the pair of electrodes and part of the side surface covered with a wavelength conversion member 68C. Furthermore, a light emitting element package having a resin member 68D containing light reflecting particles such as a filler in contact with the lower side of the wavelength conversion member 68C, and electrically connected to a pair of electrodes of the light emitting element further below. It has a pair of electrodes 68E. On the other hand, in FIG. 11B, the light emitting element 69A has a surface opposite to the surface having the pair of electrodes covered with a wavelength conversion member 69C. Further, a translucent fillet portion 69F is provided so that the light emitted from the side surface of the light emitting element is incident on the wavelength conversion member 69C, and the fillet portion 69F and the lower portion of the wavelength conversion member 69C are in contact with each other. It has a resin member 69D containing organic particles, and further below it has a pair of electrodes 69E of a light emitting device package electrically connected to a pair of electrodes of the light emitting device. In both packages 68 and 69 of FIGS. 11A and 11B, light is extracted mainly from the top surface and part of the side surface of the package.

The sealing member 50 provided in the light emitting device of the present disclosure helps protect at least the light source 60 from the external environment (see FIG. 10). Further, the sealing member 50 is preferably a member that optically controls light output from the light emitting element, and contributes to so-called batwing light distribution, for example. The material of the sealing member may include, for example, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, modified resins thereof, and hybrid resins. In a preferred aspect, the sealing member contains translucent resin such as epoxy resin and/or silicone resin. Of these, silicone resins are more preferable because they are excellent in terms of heat resistance and/or light resistance. In addition, the sealing member may have a wavelength conversion material, which is a material (for example, phosphor) that absorbs light from the light emitting element and emits light with a wavelength different from that of the light emitted from the light emitting element. may contain Also, the sealing member may have a light diffusing material, and thus may include a material that diffuses the light from the light emitting element. Furthermore, it may have a coloring agent and therefore may contain suitable pigments and the like.

In the light emitting device of the present disclosure, the substrate 40 may have an insulating layer 80 as shown in FIG. Although the insulating layer 80 is provided on the conductive wiring 70, it is preferably provided so as to cover portions other than the light source and/or other electrical connection portions. For example, as shown in FIG. 10, an insulating layer 80 may be provided on the substrate 40 as a resist for insulating the conductive wiring 70 . The insulating layer is not only intended to insulate the conductive wiring, but also prevents leakage and absorption of light by containing a white filler similar to the underfill material described later, thereby improving the light extraction efficiency of the light emitting device. can be anything. The material of the insulating layer is preferably a material that absorbs less light from the light emitting element, but is not particularly limited as long as it exhibits insulating properties. Specific materials for the insulating layer include at least one selected from the group consisting of epoxy, silicone, modified silicone, urethane resin, oxetane resin, acryl, polycarbonate, polyimide, and the like.

In the light-emitting device of the present disclosure, when the light-emitting element used as the light source is flip-chip mounted, a so-called underfill 90 may be provided between the light-emitting element 65 and the substrate 40 (see FIG. 10). The material of the underfill 90 is not particularly limited as long as it absorbs little light from the light emitting element. Specific underfill materials include at least one selected from the group consisting of epoxy, silicone, modified silicone, urethane resin, oxetane resin, acryl, polycarbonate, polyimide, and the like. The underfill may contain a filler for the purpose of reflecting light from the light emitting element more efficiently and also for the purpose of bringing the coefficient of thermal expansion closer to the light emitting element. Such fillers may be, for example, white fillers. With a white filler, light is reflected more easily, and the light extraction efficiency can be improved. The term "white" as used herein also includes the case where the filler itself is transparent, but appears white due to scattering when there is a difference in refractive index from the material surrounding the filler. Moreover, as a filler, you may comprise an inorganic compound.

The light-emitting device 200 of the present disclosure preferably has a plurality of light-emitting units 100, as shown in FIG. In such a case, the light-emitting device can be used more preferably as a general lighting fixture, a backlight, and the like.

In the light-emitting device of the present disclosure, the light-emitting portion preferably exhibits batwing light distribution characteristics. In the case of having a plurality of light-emitting portions, each light-emitting portion has a batwing-shaped light distribution curve due to the shape of the sealing member, and a wider range of light distribution is possible. Although the sealing member has protrusions in each light emitting portion in the present disclosure, the desired batwing light distribution can be achieved (see FIG. 12). Although it is conceivable to remove the projection from the sealing member by scraping the projection because it affects the light distribution characteristics of the light emitting portion, there is a risk that the light distribution characteristics will be deteriorated due to the removed portion. . In this regard, in the present disclosure, even if the projection is provided on the sealing member as it is, there is no particular adverse effect on the desired batwing light distribution characteristics. Without being bound by any particular theory, this is due to the presence of protrusions in suitable positions and/or the protrusions having a suitable small size in the sealing member of each light-emitting portion. etc. Regarding the former, as shown in FIG. 13, in the cross-sectional view of the sealing member 50, the position of the protrusion 55 in the width direction is not greatly separated from the optical axis M (the normal line perpendicular to the center of the main surface of the light emitting element). It has become. More specifically, if the distance in the width direction between the optical axis M and the outermost peripheral edge P of the sealing member is "G", the protrusion 55 is provided at a position within 2G/3 from the optical axis M in the width direction. (To give an example, the protrusion is provided at a width direction position approximately G/2 from the optical axis M). On the other hand, as for the latter, as shown in FIG. For example, when the height of the protrusion 55 is "h" and the height of the protrusion 57 is "H" in a cross-sectional view of the sealing member, preferably 0<h≤H/8, more preferably 0<h≤ H/10, more preferably 0<h≦H/12. Similarly, in a cross-sectional view of the sealing member, if the maximum width of the projection 55 is "w" and the separation distance in the width direction between the optical axis M and the sealing member outermost edge P is "G", then 0<w. ≤G/7, more preferably 0<w≤G/10, more preferably 0<w≤G/12.

Incidentally, in the present disclosure, even if the presence of the protrusions 55 affects the batwing light distribution characteristics, the effect is usually slight, and there is no substantial problem as a light emitting device using a plurality of light emitting units. . In other words, in a light-emitting device using a plurality of light-emitting parts such as general lighting fixtures and backlights, light from one light-emitting part is provided so as to be combined/mixed with light from other adjacent light-emitting parts. However, the influence of light from such other light-emitting portions is greater, and the influence of the existence of the projection can be substantially ignored.

As a preferred modification, the protrusions of the sealing member are actively used to control the light distribution characteristics. In other words, if the presence of the projection of the sealing member significantly changes the light distribution characteristics, it may be positively utilized. For example, when the emitted light from the light source has direction dependence (for example, when the light distribution characteristics of the emitted light of the light emitting element are different in one direction and another direction), such direction dependence of the light It is also possible to positively utilize the protrusions of the sealing member (“protrusions that significantly change the light distribution characteristics”) in order to correct even a little.

The light-emitting device of the present disclosure may have additional members according to various uses. For example, the light-emitting device of the present disclosure may include a diffuser plate above a substrate having multiple light-emitting portions. This makes it easier to obtain desired light by diffusing the light emitted from the light emitting section. In such a case, a phosphor plate, phosphor sheet, or the like may be provided in front of the diffuser plate (that is, closer to the light emitting section) in order to obtain light of a desired color.

Although the embodiments of the present disclosure have been described above, they are merely examples of typical examples. Accordingly, those skilled in the art will readily understand that the present disclosure is not limited thereto and that various aspects are possible.

For example, in the above-described method for manufacturing a light-emitting device, a mode has been described in which the ejection device with the filamentous suspension left is lowered once to start supplying the sealing raw material, but the ejection device may be lowered particularly greatly at that time. . For example, the ejection device may be lowered significantly to a position where the tip of the filamentous suspension touches the substrate or is slightly separated from the substrate. In such a case, the filamentous suspension can also serve as a guide, and the supply of the sealing raw material can be started more accurately.

In addition, in the above description of the method for manufacturing a light-emitting device, singulation for obtaining a light-emitting device having one light-emitting portion was mentioned, but the present disclosure is not necessarily limited to this. For example, singulation may be performed to obtain a light-emitting device having a predetermined number of light-emitting portions. That is, it is also possible to obtain a light-emitting device having a desired number of light-emitting portions by cutting the “substrate provided with a sealing member covering each of the plurality of light sources” obtained by the above-described manufacturing method.

The light-emitting device obtained by the manufacturing method of the present disclosure can be used for various applications such as general lighting, backlight, indicator, vehicle light source, display, sensor, traffic signal, and signboard channel letter.

REFERENCE SIGNS LIST 10 filamentous suspension 12 previously supplied sealing raw material 15 continuous connection of supply flow 15' supply flow of sealing raw material 20 ejection device 25 nozzle of ejection device 30 first sealing member forming step 35 second sealing member Formation process 40 substrate 44 non-light emitting region 50 sealing member 50A recessed portion of sealing member 50B surrounding portion of sealing member 55 protrusion of sealing member 57 protrusion of sealing member 60 light source 65 light emitting element 67 wavelength converting member 67' Phosphor resin 68, 69 Light emitting element package 68A, 69A Light emitting element 68B, 69B Light emitting element electrode 68C, 69C Wavelength conversion member 68D, 69D Resin member 68E, 69E Package electrode 70 Conductive wiring 80 Insulating layer 90 Underfill 100 Light emitting part 200 light emitting device

Claims (15)

A method for manufacturing a light-emitting device comprising a substrate, a plurality of light sources arranged on the substrate, and a sealing member covering each of the plurality of light sources, the method comprising:
a sealing member forming step of supplying a sealing raw material to the substrate from an ejection device having a plurality of nozzles to form a plurality of sealing members covering the plurality of light sources;
The sealing member forming step includes a first sealing member forming step and a subsequent second sealing member forming step,
forming the sealing member in the first sealing member forming step so that the sealing raw material remains as a thread-like suspension suspended from each of the plurality of nozzles;
A method of manufacturing a light-emitting device, wherein the step of forming the second sealing member is started from a state in which the thread-like suspension is suspended from the discharge device. The supply of the sealing raw material is performed so that the supply flow of the sealing raw material is continuously connected between the previously supplied sealing raw material once supplied to the substrate and the discharge device,
2. The method of manufacturing a light emitting device according to claim 1, wherein the thread suspension is formed by breaking the continuous connection of the supply flow. 3. The method of manufacturing a light emitting device according to claim 2, wherein the separation distance between the previously supplied sealing material and the dispensing device is increased to break the continuous connection of the supply flow. 4. The method of manufacturing a light-emitting device according to claim 2, wherein a protrusion is formed on said sealing member due to breaking said continuous connection of said supply flow. Prior to forming the sealing member, the sealing raw material not used for forming the sealing member is supplied, the filamentous suspension is suspended from the discharge device, and the first liquid is removed from the suspended state. 5. The method of manufacturing a light-emitting device according to claim 1, wherein the step of forming a sealing member is started. 6. The method of manufacturing a light-emitting device according to claim 1, wherein said ejection device has a plurality of nozzles arranged in a circumferential shape. 7. The method of manufacturing a light-emitting device according to claim 1, wherein said sealing raw material has a viscosity of 180 Pa.s or more and 260 Pa.s or less. A method of manufacturing a light-emitting device with a single light-emitting portion, comprising:
8. A method for manufacturing a light-emitting device, wherein the substrate provided with the sealing member covering each of the plurality of light sources obtained by the manufacturing method according to any one of claims 1 to 7 is singulated. A light-emitting device comprising a substrate and a light-emitting portion having a sealing member that covers a light source,
the sealing member has a protrusion on a peripheral portion surrounding the recessed portion ;
A light emitting device , wherein the peripheral portion has the shape of a plurality of ridges adjacent to each other, each of the plurality of ridges being provided with the protrusion . 10. The light emitting device according to claim 9, wherein said protrusion is provided on the upper side of said peripheral portion. 10. The light emitting device of claim 9 , wherein said protrusion is positioned at the highest level of each of said plurality of ridges. The light emitting device according to any one of claims 9 to 11 , wherein said projection has a pointed shape. The light emitting device according to any one of claims 9 to 12 , wherein said light source is at least one light emitting element. 14. The light emitting device according to claim 13 , wherein said light source has a wavelength conversion member covering said light emitting element. The light emitting device according to any one of claims 9 to 14 , wherein a plurality of said light emitting parts are provided on said substrate.

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